Sony MDS-PC3 User Manual

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Page 1

MDS-PC3

SERVICE MANUAL

Photo: SILVER

US and foreign patents licensed form Dolby Laboratories Licensing Corporation.

SPECIFICATIONS

US Model

Canadian Model

AEP Model

UK Model

E Model

Model Name Using Similar Mechanism MDS-JE640 MD Mechanism Type MDM-7A Optical Pick-up Type KMS-260B/J1N

System MiniDisc digital audio system Disc MiniDisc Laser Semiconductor laser (λ = 780 nm)

Laser output Less than 44.6 µW*

Laser diode Material: GaAlAs Revolutions (CLV) 400 rpm to 900 rpm Error correction Advanced Cross Interleave Reed

Sampling frequency 44.1 kHz Coding Adaptive Transform Acoustic

Modulation system EFM (Eight-to-Fourteen

Number of channels 2 stereo channels Frequency response 5 to 20,000 Hz ±0.5 dB Signal-to-noise ratio Over 94 dB during playback Wow and flutter Below measurable limit

Inputs

LINE (ANALOG) IN Jack type: stereo-mini

DIGITAL (OPTICAL) IN Connector type: square optical

Outputs

LINE (ANALOG) OUT (VARIABLE)

DIGITAL (OPTICAL) OUT

PHONES Jack type: stereo-mini

Emission duration: continuous

* This output is the value

measured at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with 7 mm aperture.

Solomon Code (ACIRC)

Coding (ATRAC)

Modulation)

Impedance: 47 kilohms Rated input: 500 mVrms Minimum input: 125 mVrms

Impedance: 660 nm (optical wave length)

Jack type: stereo-mini Rated output: 1 Vrms (at

50 kilohms) Load impedance: Over 10 kilohms

Connector type: square optical Rated output: –18 dBm Impedance: 660 nm (optical wave

length)

Rated output: 5 mW

edance: 32 ohms

Load im

General

Where purchased Power requirements*

U.S.A. and Canada 120 V AC, 60 Hz

Other countries 220 – 230 V AC, 50/60 Hz

* Using an AC power adaptor (supplied)

Power consumption 7 W Dimensions (approx.) 152 × 52 × 255 mm (6 × 2

Mass (approx.) 1.0 kg (2 lb 4 oz)

Supplied accessories

• AC power adaptor (1)

• Audio connecting cord

(stereo mini-plug × 1 y stereo mini-plug × 1) (1)

• Optical cable (1)

• Remote commander (remote) RM-D52M (1)

• PC connecting kit PCLK-MN10* (1)

* Required for operation by personal computer. For

details, refer to the operating instructions supplied with the PCLK-MN10.

/8 inches) (w/h/d) incl.

projecting parts and controls

MINIDISC DECK

/8 ×

Page 2

*Note:

As this unit has only a few buttons, one button is assigned with several functions in the test mode.” Press the z button, AMS knob to switch the functions.

• Each time the z button is pressed, the display switches in the follwing order, “PGM” t “blank” t “PGM” t –.

• Rotate the AMS knob and the display switches in the following order, “blank” t “TOC” t “EDIT” t “TOC EDIT” t

“[ ]” t “[TOC ]” t “[ EDIT]” t “[TOC EDIT]” t “blank” t – –.

For simplicity, operations of z button will not be discribed here.

Example) x/Z : Lights-out “PGM” and press the x/Z button.

x/Z “PGM” : Display “PGM” and press the x/Z button.

The functions of each button change with the display.

Bottons and Corresponding Functions

“PGM” Lights-out

Buttons

@/1 @/1

“PGM”

displayed

Nothing

displayed

ENTER

(YES) MODE

TOC EDIT TOC EDIT TOC EDIT TOC EDIT

REPEAT PLAY CLEAR

x/Z EJECT (EDIT)/ STOP REC — FR SCROLL TIME —

LCD displayed

PLAY

DISPLAY —

SELF-DIAGNOSIS FUNCTION

The self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur, and error codes which show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the Self- Diagnosis Function (Error History Display Mode)”.

Self-Diagnosis Function

The deck’s self-diagnosis function automatically checks the condition of the MD deck when an error occurs, then issues a three-digit code and an error message on the display. If the code and message alternate, find them in the following table and perform the indicated countermeasure. Should the problem persist, consult your nearest Sony dealer.

Three-digit code/Message Cause/Remedy

C11/Protected The inserted MD is record-protected.

C12/Cannot Copy An attempt was made to play a disc that is not compatible with this deck

C13/Rec Error The recording was not made properly.

C13/Read Error The deck could not read the TOC on the MD properly.

, Take out the MD and close the record-protect slot (page 13).

(MD data disc, etc.).

, Replace the disc.

, Set the deck in a stable surface, and repeat the recording procedure.

The inserted MD is dirty (with smudges, fingerprints, etc.), scratched, or substandard in quality.

, Replace the disc and repeat the recording procedure.

, Take out the MD and insert it again.

Procedure for using the Self-Diagnosis Function (Error History Display Mode). Note: Perform the self-diagnosis function in the “error history display mode” in the test mode. The following describes the least required

procedure. Be careful not to enter other modes by mistake. If you set other modes accidentally, press the x/Z button to exit the mode.

C14/Toc Error The deck could not read the TOC on the MD properly.

C41/Cannot Copy The digitally dubbed material cannot be recorded digitally (page 11).

C71/Din Unlock The sporadic appearance of this message is caused by the digital signal being

E0001/MEMORY NG There is an error in the internal data that the deck needs in order to operate.

E0101/LASER NG

, Insert another disc. , If possible, erase all the tracks on the MD (page 29).

recorded. This will not affect the recording.

While recording from a digital component connected through the DIGITAL (OPTICAL) IN connector, the digital connecting cable was unplugged or the digital component turned off.

, Connect the cable or turn the digital component back on.

, Consult your nearest Sony dealer.

There is a problem with the optical pickup.

, Consult your nearest Sony dealer.

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1. While pressing the AMS knob and x/Z button, connect the power plug to the outlet, and release the AMS knob and x/Z button.

When the test mode is set, “[Check]” will be displayed.

2. Rotate the AMS knob and when “[Service]” is displayed, press the @/1 button.

3. Rotate the AMS knob and display “Err Display”.

4. Pressing the @/1 button sets the error history mode and displays “op rec tm”.

5. Select the contents to be displayed or executed using the AMS knob.

6. Pressing the AMS knob will display or execute the contents selected.

7. Pressing the AMS knob another time returns to step 4.

8. Pressing the x/Z button displays “Err Display” and exits the error history mode.

9. To exit the test mode, remove the power plug to the outlet.

ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS

Selecting the Test Mode

Display

op rec tm

op play tm

spdl rp tm

retry err

total err

err history

retry adrs

History

Displays the total recording time. When the total recording time is more than 1 minute, displays the hour and minute When less than 1 minute, displays “Under 1 min” The display time is the time the laser is set to high power, which is about 1/4 of the actual recording time.

Displays the total playback time. When the total playback time is more than 1 minute, displays the hour and minute When less than 1 minute, displays “Under 1 min”

Displays the total rotating time of the spindle motor. When the total rotating time is more than 1 minute, displays the hour and minute When less than 1 minute, displays “Under 1 min”

Displays the total number of retry errors during recording and playback Displays “r xx p yy”. xx is the number of errors during recording. yy is the number of errors during playback. This is displayed in hexadecimal from 00 to FF.

Displays the total number of errors Displays “total xx”. This is displayed in hexadecimal from 00 to FF.

Displays the past ten errors. Displays “0x ErrCd@@”. X is the history number. The younger the number, the more recent is the history (00 is the latest). @@ is the error code. Select the error history number using the AMS knob.

Displays the past five retry addresses. Displays “xx ADRS yyyy”, xx is the history number, yyyy is the cluster with the retry error. Select the error history number using the AMS knob.

er refresh

tm refresh

op change

spdl change

Mode for erasing the error and retry address histories Procedure

1. Press the AMS knob when displayed as “er refresh”.

2. Press the @/1 button when the display changes to “er refresh?”. When “complete!” is displayed, it means erasure has completed. Be sure to check the following after executing this mode. *Data has been erased. *Perform recording and playback, and check that the mechanism is normal.

Mode for erasing the total time of recording and playback Procedure

1. Press the AMS knob when displayed as “tm refresh”.

2. Press the @/1 button when the display changes to “tm refresh?”. When “complete!” is displayed, it means erasure has completed.

Mode for erasing the total time of op rec tm, op play tm. These histories are based on the time of replacement of the optical pickup. If the optical pick-up has been replaced, perform this procedure and erase the history. Procedure

1. Press the AMS knob when displayed as “op change”.

2. Press the @/1 button when the display changes to “op change?”. When “Complete!” is displayed, it means erasure has completed.

Mode for erasing the total spdl rp tm time These histories are based on the time of replacement of the spindle motor. If the spindle motor has been replaced, perform this procedure and erase the history. Procedure

1. Press the AMS knob when displayed as “spdl change”

2. Press the @/1 button when the display changes to “spdl change?” When “Complete!” is displayed, it means erasure has completed.

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Table of Error Codes

Error Code

Could not load

Loading switches combined incorrectly

Timed out without reading the top of PTOC

Could read top of PTOC, but detected error

Timed out without accessing UTOC

Timed out without reading UTOC

Error in UTOC

Could not start playback

Error in sector

Retry cause generated during normal recording

Retried in DRAM overflow

Retry occurred during TOC writing

Retry aborted during S.F editing

Other than access processing, and could not read address.

Focus NG occurred and overran.

Description

TABLE OF CONTENTS

1. SERVICING NOTES ............................................. 5

2. GENERAL ........................................................................ 11

3. DISASSEMBLY

3-1. Case (U) .............................................................................. 14

3-2. MD Mechanism Deck (MDM-74) ...................................... 14

3-3. Main Board ......................................................................... 15

3-4. Over Light Head (HR901), BD (MD) Board ...................... 15

3-5. Holder Assy ......................................................................... 16

3-6. Loading Motor Assy (M103) .............................................. 16

3-7. Sled Motor Assy (M102), Slider ......................................... 17

3-8. Optical Pick-up (MD) (KMS-260B/JIN) ............................ 17

3-9. Spindle Motor Assy (M101) ............................................... 18

4. TEST MODE ..................................................................... 19

5. ELECTRICAL ADJUSTMENTS ............................... 24

6. DIAGRAMS

6-1. Block Diagrams

• BD Section ....................................................................... 36

• Main Section .................................................................... 37

6-2. Printed Wiring Board – BD Section –................................. 38

6-3. Schematic Diagram – BD Section (1/2) – ........................... 39

6-4. Schematic Diagram – BD Section (2/2) – ........................... 40

6-5. Printed Wiring Board – Main Section – .............................. 41

6-6. Schematic Diagram – Main Section (1/2) – ........................ 42

6-7. Schematic Diagram – Main Section (2/2) – ........................ 43

6-8. Printed Wiring Board – Panel Section – ........................... 44

6-9. Schematic Diagram – Panel Section – ............................... 45

6-10. IC Block Diagrams ........................................................... 46

6-11. IC Pin Functions ............................................................... 49

7. EXPLODED VIEWS

7-1. Chassis Section ................................................................... 54

7-2. Mechanism Section-1 (MDM-7A) ...................................... 55

7-3. Mechanism Section-2 (MDM-7A) ...................................... 56

8. ELECTRICAL PARTS LIST ........................................ 57

Page 5

SECTION 1

1.5 k

Ω

0.15 µF

AC voltmeter (0.75 V)

To Exposed Metal Parts on Set

Earth Ground

SERVICE NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

Lead free soldering

MAIN and PANEL boards of this product are lead free soldered (contains no lead). Lead-free solder have the following characteristics.

• The melting point is about 40 ºC higher than conventional solder. Conventional soldering iron can be used, but must be pressed for a longer time. When using the soldering iron with a temperature adjustment function, set to about 350 ºC.

Note: Pressing the soldering iron too long may cause the board pat-

tern (copper coating) to peel off.

• Strong viscosity As it has stronger viscosity than conventional solder, make sure the IC terminal does not solder bridge.

• Can be used with conventional solder Though it is best to add lead-free solder only, conventional solder can also be added.

• Boards using lead-free solder are printed with the LF mark meaning “Lead Free”.

SAFETY CHECK-OUT

After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA

WT-540A. Follow the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245

digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a VOM

or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A)

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY .

Fig. A. Using an AC voltmeter to check AC leakage.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

Page 6

JIG FOR CHECKING BD BOARD WAVEFORM

The special jig (J-2501-196-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be performed are shown as follows.

GND : Ground I+3V : For measuring Iop (Check the deterioration of the optical pick-up laser) Iop : For measuring Iop (Check the deterioration of the optical pick-up laser) TE : TRK error signal (Traverse adjustment) VC : Reference level for checking the signal RF : RF signal (Check jitter) FE : Focus error signal

I+3V

GND

Iop

I+3V

Iop

GND

FE VC RF

CN105

I+3V Iop GND TE FE VC RF

for

MDM-7A

Page 7

Iop DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OF BD BOARD) ARE REPLACED

The Iop value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC195 of BD board), record the Iop value on the optical pick-up according to the following procedure.

Record Precedure:

1. While pressing the AMS knob and x/Z button, connect the power plug to the outlet, and release the AMS knob and x/Z button.

2. Rotate the AMS knob to display “[Service]”, and press the @/1 button.

3. Rotate the AMS knob to display “Iop Write” (C05), and press the @/1 button.

4. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.

5. Input the Iop value written on the optical pick-up. To select the number : Rotate the AMS knob. To select the digit : Press the AMS knob.

6. When the @/1 button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).

7. As the adjustment results are recorded for the 6 value. Leave it as it is and press the @/1 button.

8. “Complete! !” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write” (C05).

9. Press the x/Z button to complete, remove the power plug to the outlet.

Display Precedure:

1. While pressing the AMS knob and x/Z button, connect the power plug to the outlet, and release the AMS knob and x/Z button.

2. Rotate the AMS knob to display “[Service]”, and press the @/1 button.

3. Rotate the AMS knob to display “Iop Read” (C26), and press the @/1 button.

4. “@@.@/##.#” is displayed and the recorded contents are displayed. @@.@ : indicates the Iop value labeled on the pick-up. ##.# : indicates the Iop value after adjustment

5. To end, press the AMS button or x/Z button to display “Iop Read” (C26), remove the power plug to the outlet.

Page 8

CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS

Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent. Details of the procedures are described in “5 Electrical Adjustments”.

• 5-6-2. Laser power check (see page 27)

• 5-6-3. Iop Compare (see page 27)

• 5-6-4. Auto Check (see page 28)

Note:

The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments. When performing adjustments, use the specified values for adjustments.

FORCED RESET

The system microprocessor can be reset in the following procedure. Use these procedure when the unit cannot be operated normally due to the overrunning of the microprocessor, etc.

Procedure :

Remove the short-pin attached to CN420, and then attach it again.

[MAIN BOARD] (Component Side)

CN420

Page 9

RETRY CAUSE DISPLAY MODE

• In this test mode, the causes for retry of the unit during recording can be displayed on the indication vessel. During playback, the “track

mode” for obtaining track information will be set. This is useful for locating the faulty part of the unit.

• The following will be displayed :

During recording and stop : Retry cause, number of retries, and number of retry errors. During playback : Information such as type of disc played, part played, copyright. These are displayed in hexadecimal.

Procedure:

1. Press the @/1 button, x/Z button and u button continuously for about 10 seconds.

2. Rotate the AMS knob to display “Debug Disp”, Then press the AMS button.

3. When the mode is set, “RTs 00c 00e 00” is displayed.

4. Press the z button to start recording. Then press the X button and start recording.

5. To check the “track mode”, press the H button to start play.

6. To exit the test mode, press the @/1 button, and turn OFF the power. If the test mode cannot be exited, refer to “Forced Reset” on page 8.

Fig. 1 Reading the Test Mode Display (During recording and stop)

RTs@@c##c**

Indication vessel display

@@ : Cause of retry ## : Number of retries ** : Number of retry errors

Reading the Retry Cause Display

Higher Bits Lower Bits

Hexadecimal

Bit

Binary

84218421

b7 b6 b5 b4 b3 b2 b1 b0

00000001

00000010

00000100

00001000

00010000

00100000

01000000

10000000

Hexa-

decimal

Fig. 2 Reading the Test Mode Display (During playback)

@@###**$$

Indication vessel display

@@ : Parts No. (name of area named on TOC) ### : Cluster ** : Sector $$ : Track mode (Track information such as copyright infor-

Cause of Retry Occurring conditions

shock

ader5

Discontinuous address

DIN unlock

FCS incorrect

IVR rec error

CLV unlock

Access fault

} Address (Physical address on disc)

mation of each part)

When track jump (shock) is detected

When ADER was counted more than five times continu-

ously

When ADIP address is not continuous

When DIN unlock is detected

When not in focus

When ABCD signal level exceeds the specified range

When CLV is unlocked

When access operation is not performed normally

Reading the Display:

Convert the hexadecimal display into binary display. If more than two causes, they will be added.

Example

When 42 is displayed: Higher bit : 4 = 0100 t b6 Lower bit : 2 = 0010 t b1 In this case, the retry cause is combined of “CLV unlock” and “ader5”.

When A2 is displayed: Higher bit : A = 1010 t b7+b5 Lower bit : 2 = 0010 t b1 The retry cause in this case is combined of “Access fault”, “IVR rec error”, and “ader5”.

Page 10

Reading the Track Mode Display

Higher Bits Lower Bits

Hexadecimal

Bit

Binary

Reading the Display:

Convert the hexadecimal display into binary display. If more than two causes, they will be added.

Example When 84 is displayed:

Higher bit : 8 = 1000 t b7 Lower bit : 4 = 0100 t b2 In this case, as b2 and b7 are 1 and others are 0, it can be determined that the retry cause is combined of “Emphasis OFF”, “Monaural”, “original”, “Copyright exists”, and “Write allowed”.

Example When 07 is displayed:

Higher bit : 0 = 0000 t All 0 Lower bit : 7 = 0111 t b0+b1+b2 In this case, as b0, b1, and b2 are 1 and others are 0, it can be determined that the retry cause is combined of “Emphasis ON”, “Stereo”, “Original”, “Copyright exists”, and “Write prohibited”.

84218421

b7 b6 b5 b4 b3 b2 b1 b0

00000001

00000010

00000100

00001000

00010000

00100000

01000000

10000000

Hexa-

decimal

When 0 When 1

Emphasis OFF

Monaural

This is 2-bit display. Normally 01.

01:Normal audio. Others:Invalid

Audio (Normal)

Original

Write prohibited

Details

Emphasis ON

Stereo

Invalid

Digital copy

No copyright

Write allowed

Hexadecimal t Binary Conversion Table

Hexadecimal Binary Hexadecimal Binary

Clearing the Retry Record:

Method:

1. Press the @/1 button, x/Z button, and u button for about 10 seconds.

2. Rotate the

3. Press the [AMS] knob to clear the record and exit the clear mode.

0000

0001

0010

0011

0100

0101

0110

0111

[AMS] knob to display “Retry Clear?” and press the [AMS] knob.

1000

1001

1010

1011

1100

1101

1110

1111

Page 11

Location

and Function

of Parts

EJECT INPUT

REC MODE

PLAY MODE

MENU/NO NAME EDIT/

YES

DISPLAY

FADER

MUSIC SYNC

`/1

REPEAT AyB CLEAR

LEVEL

–

SELECT

98 7

Press to turn the deck on. When you turn the

deck on, the ?/1 switch indicator on the deck

turns off. When you press the switch again, the

deck turns off and the indicator lights up red.

Press to select Shuffle Play or Program Play.

Press to select the information to be displayed in

the window, or to select the type of characters to

be input.

Press to start Music Synchro-recording.

Press to perform Fade-in Recording/Playback or

Fade-out Recording/Playback.

Press to adjust the recording level and the output

level of the PHONES jack and ANALOG OUT

jacks.

Press to carry out the selected operation.

Press to cancel the selection.

9 AyB button (23)

Press to select Repeat A-B Play.

0 REPEAT button (23)

Press to play tracks repeatedly.

qa NAME EDIT/SELECT button (37)

Press to add the name or change the name of a

track or MD.

qs MENU/NO button (15, 25, 28)

Press to display “Edit Menu” or “Setup Menu.”

qd N button (13, 21)

Press to start play or recording.

X button (13, 21)

Press to pause play or recording. Press again to

resume play or recording.

x button (13, 21, 29)

Press to stop play, recording, or cancel the

selected operation.

./> buttons (13, 21, 22, 25, 28)

Press to locate tracks, select a menu item, or

select a character to be input.

z button (13, 17, 18)

Press to record on the MD, monitor the input

signal, or mark track numbers.

m/M buttons (22, 26, 36)

Press to locate a portion within a track, change

the contents of a program, or shift the cursor.

qf EJECT Z button (13, 21)

Press to eject the MD.

qg INPUT button (12)

Press to select the input jack (or connector) of the

program source to be recorded.

qh REC MODE button (15)

Press to select one of the following four

recording modes: Mono (monaural recording),

stereo (stereo recording), LP2 (2 times normal

recording time), and LP4 (4 times normal

recording time).

SECTION 2

GENERAL

PUSHu

This section is extracted from instruction manual.

Location and Function of Parts

Front Panel Parts Description

This chapter tells you about the location and function of the various buttons and controls on the front panel

and the supplied remote. Further details are provided on the pages indicated in the parentheses.

It also tells you about the information that appears in the display window.

23 4 5 6

?/1 z x/Z

Press to stop play, stop recording, or cancel the

selected operation.

5 x/Z button (13, 21, 29)

22, 25, 28)

Press to eject the MD while the deck is stopped.

6 ./> control, u button (13, 21,

Turn to locate tracks.

Press to start play, pause play, or pause recording.

Press to carry out the selected operation.

Point the remote towards this window ( ) for

remote operations.

7 Remote sensor

With the labeled

side up

towards the deck

With the arrow pointing

Press to turn the deck on. When you turn the

deck on, the switch indicator turns off. When

you press the switch again, the deck turns off and

the indicator lights up red.

Press to record on the MD, monitor the input

signal, or mark track numbers.

1 ?/1 (power) switch (12, 21)

2 z button (13, 17, 18)

Insert the MD as illustrated below.

3 MD insertion slot

Shows various information.

4 Display window (6, 7)

Page 12

Press

While the deck is stopped

Press DISPLAY repeatedly to change the

display.

Each press of the button changes the display as

follows:

Using the Display

The display window shows information about the

MD or track. This section describes the

information that appears for each deck status.

14Tr 44.22

Total number of tracks and total

recorded time (default display)

DISPLAY

?/1

Press

-63.51

Remaining recordable time on the

MD (recordable MDs only)*

–

Note

Press

12t 4 t 61

Order of the programmed tracks**

The type of information (e.g., total number of tracks,

recorded time, remaining time, track or disc name)

which was last displayed will continue to appear until

you change it by pressing DISPLAY, even if you

change the deck operation status. For example, if the

remaining time was displayed when you stop the

Press

3Tr 12.56

The number and total playing time of the

programmed tracks**

deck, the remaining time will continue to appear

When you insert an MD

when you begin playing the same MD again or a

different one.

SONGS

Disc name

* Not shown for the premastered discs.

** This display appears only when “PGM” appears.

Total recorded

time

Disc name

SONGS

Total number

The display automatically changes as follows:

of tracks

14Tr 44.22

Location

While the deck is playing

Press DISPLAY repeatedly to change the

display.

Each press of the button changes the display as

follows:

and Function

Press

1Tr 0.12

Track number and elapsed time of the

current track (default display)

Press

of Parts

Press

1Tr-2.51

Track number and remaining time of

the current track

Press

-45.25

Remaining recordable

time on the MD

Press

12t 4 t 61

Order of the programmed

tracks*

Press

Track2

* The display appears only when “PGM” appears.

Track name

While the deck is recording

ach press of the button changes the display as

Press DISPLAY repeatedly to change the

display.

he current track (default display)

follows:

15Tr 44.22

Track number and recorded time of

Remaining recordable time on the MD

-63.02

Level of the input signal

SONGS

Track name

Page 13

Getting

Started

DC IN

PHONES

PC LINKDIGITALANALOG

(OPTICAL)

(VARIABLE)

IN OUTIN OUT

OPTICAL

OUT

LINE

OUT

LINE

OPTICAL

Connecting the MD deck to a

personal computer

CD player or digital CS tuner,

etc. with optical digital

connection capability

For PC connecting

kit PCLK-MN10

Portable CD

player, etc.

Active

speakers,

etc.

Amplifier, etc. with

optical digital

connection capability

For AC

power

adaptor

Connecting the MD deck with

an audio component

The MD deck is capable of recording from both

analog and digital sources.

When recording from an analog

source

Required connecting cord

Audio connecting cord (supplied)

OUT

LINE

ANALOG

(VARIABLE)

IN OUT

l : Signal flow

When recording from a digital

source

Required connecting cord

Optical digital cable (supplied)

OPTICAL

DIGITAL

(OPTICAL)

IN OUT

OUT

l : Signal flow

continued

Portable CD

player, etc.MDS-PC3

CD player, etc. with optical

digital connection capability

MDS-PC3

Page 14

SECTION 3

)

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

3-1. CASE (U)

4 case (U)

claws

1 three screws (BVTP 3x10)

3-2. MD MECHANISM DECK (MDM-7A)

2 two screws (+BVTTWH M3 3x10)

3 mechanism deck

1 flat type wire (23 core)

(CN102)

1 three screws (BVTP 3x10)

2 two screws (+BVTTWH M3 3x10)

1 flat type wire (27 core (CN101)

Page 15

3-3. MAIN BOARD

(

)

2 two screws (BVTP 3x8)

1 flat type wire (13 core) (CN103)

3-4. OVER LIGHT HEAD (HR901), BD (MD) BOARD

4 MAIN board

3 three screws

(BVTP 3x8)

4 Removal the solders

2 screw

(P 1.7x6)

3 head, over light (HR901)

8 BD (MD) board

1 connector

(CN104)

4 Removal the solders

5 two screws

BTP 2x6

7 FLEXIBLE board (CN101)

Page 16

3-5. HOLDER ASSY

1 spring (holder), tension

4 boss

6 holder assy

4 boss

2 claw

3-6. LOADING MOTOR ASSY (M103)

2 two screws (PWH 1.7x2.5)

3 motor assy, loading (M103)

1 belt (loading)

Page 17

3-7. SLED MOTOR ASSY (M102), SLIDER

1 two screws (BTP 2x6)

4 slider (EJ)

2 guide (L)

6 slider

7 lever (CHG)

Remeve the claw. Shift the slider in the arrow A direction.

8 lever (head)

9 two screws

(PWH 1.7x2.5)

0 motor assy, sled (M102)

3-8. OPTICAL PICK-UP (MD) (KMS-260B/JIN)

1 FLEXBLE boaed

0 slider (SL)

9 screw

(P 1.7x6)

qa optical pick-up

(KMS-260B/J1N)

7 MAIN shaft

6 two screws

(K 2x6)

4 screw (BTP 2x6)

5 base (BU-A)

2 screw

(M 1.7), tapping

3 gear (SD)

Page 18

3-9. SPINDLE MOTOR ASSY (M101)

2 motor assy, spindle (M101)

1 screw (M 1.7), tapping

Page 19

SECTION 4

TEST MODE

*Note:

As this unit has only a few buttons, one button is assigned with several functions in the test mode.” Press the z button, AMS knob to switch the functions.

• Each time the z button is pressed, the display switches in the follwing order, “PGM” t “blank” t “PGM” t –.

• Rotate the AMS knob and the display switches in the following order, “blank” t “TOC” t “EDIT” t “TOC EDIT” t

“[ ]” t “[TOC ]” t “[ EDIT]” t “[TOC EDIT]” t “blank” t – –.

For simplicity, operations of z button will not be discribed here.

Example) x/Z : Lights-out “PGM” and press the x/Z button.

x/Z “PGM” : Display “PGM” and press the x/Z button.

The functions of each button change with the display.

Bottons and Corresponding Functions

“PGM” Lights-out

Buttons

@/1 @/1

x/Z EJECT (EDIT)/ STOP REC — FR SCROLL TIME —

“PGM”

displayed

Nothing

displayed

ENTER

(YES) MODE

TOC EDIT TOC EDIT TOC EDIT TOC EDIT

REPEAT PLAY CLEAR

LCD displayed

PLAY

DISPLAY —

4-1. PRECAUTIONS FOR USE OF TEST MODE

• As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc

is stopped before setting and removing it.

4-1-1. Recording laser emission mode and operating buttons

• Continuous recording mode (CREC 1MODE) (C35)

• Laser power check mode (LDPWR CHECK) (C13)

• Laser power adjustment mode (LDPWR ADJUS) (C04)

• Iop check (Iop Compare) (C27)

• Iop value nonvolatile writing (Iop NV Save) (C06)

• Traverse (MO) check (EF MO CHECK) (C14)

• Traverse (MO) adjustment (EF MO ADJUS) (C07)

• When pressing the z button.

4-2. SETTING THE TEST MODE

The following are two methods of entering the test mode. While pressing the AMS knob and x/Z button, connect the power plug to an outlet, and release the AMS knob and x/Z button. When the test mode is set, “[Check]” will be displayed. Rotating the AMS knob switches between the following three groups;

··· y Check y Service y Develop y ···.

NOTE: Do not use the test mode in the [Develop] group.

If used, the unit may not operate normally. If the [Develop] group is set accidentally, press the x/Z button immediately to exit the [Develop] group.

4-3. EXITING THE TEST MODE

Press the x/Z button, remove the power plug to the outlet.

4-4. BASIC OPERATIONS OF THE TEST MODE

All operations are performed using the AMS knob, @/1 button, and x/Z button. The functions of these buttons are as follows.

Function name

&/1 button x/Z button

AMS knob

Left or Right Push u

Cancel or move to top hierarchy

Set

Select

Set submenu

Function

Page 20

4-5. SELECTING THE TEST MODE

There are 26 types of test modes as shown below. The groups can be switched by rotating the AMS knob. After selecting the group to be used, press the @/1 button. After setting a certain group, rotating the AMS knob switches between these modes. Refer to “Group” in the table for details selected. All adjustments and checks during servicing can be performed in the test mode in the Service group.

NOTE: Do not use the test mode in the [Develop] group.

If used, the unit may not operate normally. If the [Develop] group is set accidentally, press the x/Z button immediately to exit the [Develop] group.

Display

AUTO CHECK

Err Display

TEMP ADJUST

LDPWR ADJUST

Iop Write

Iop NV Save

EF MO ADJUST

EF CD ADJUST

FBIAS ADJUST

AG Set (MO)

AG Set (CD)

TEMP CHECK

LDPWR CHECK

EF MO CHECK

EF CD CHECK

FBIAS CHECK

ScurveCHECK

VERIFYMODE

DETRK CHECK

0920 CHECK

Iop Read

Iop Compare

ADJ CLEAR

INFORMATION

CPLAY1MODE

CREC 1MODE

No.

Automatic self-diagnosis

C01

Error history display, clear

C02

Temperature compensation offset adjustment

C03

Laser power adjustment

C04

Iop data writing

C05

Writes current Iop value in read nonvolatile memory using microprocessor

C06

Traverse (MO) adjustment

C07

Traverse (CD) adjustment

C08

Focus bias adjustment

C09

Focus, tracking gain adjustment (MO)

C10

Focus, tracking gain adjustment (CD)

C11

Temperature compensation offset check

C12

Laser power check

C13

Traverse (MO) check

C14

Traverse (CD) check

C15

Focus bias check

C16

S-curve check

C17

Nonvolatile memory check

C18

Detrack check

C19

Most circumference check

C25

Iop data display

C26

Comparison with initial Iop value written in nonvolatile memory

C27

Initialization of nonvolatile memory for adjustment values

C28

Display of microprocessor version, etc.

C31

Continuous playback mode

C34

Continuous recording mode

C35

Details

Mark

Group

Check Service

• For details of each adjustment mode, refer to “5. Electrical Adjustments”. For details of “Err Display”, refer to “Self-Diagnosis Function” on page 2.

• If a different mode has been selected by mistake, press the x/Z button to exit that mode.

• Modes with (X) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set accidentally, press the x/Z button to exit the mode immediately.

Page 21

4-5-1. Operating the Continuous Playback Mode

1. Entering the continuous playback mode

1 Set the disc in the unit. (Whichever recordable discs or discs for playback only are available.) 2 Rotate the AMS knob and display “CPLAY1MODE”(C34). 3 Press the @/1 button to change the display to “CPLAY1 MID”. 4 When access completes, the display changes to “C = AD = )”.

Note : The numbers “ ” displayed show you error rates and ADER.

2. Changing the parts to be played back

1 Press the @/1 button during continuous playback to change the display as below.

“CPLAY1 MID” t “CPLAY1 OUT” t “CPLAY1 IN”

When pressed another time, the parts to be played back can be moved.

2 When access completes, the display changes to “C = AD = )”.

Note : The numbers “ ” displayed show you error rates and ADER.

3. Ending the continuous playback mode

1 Press the x/Z button. The display will change to “CPLAY1MODE”(C34). 2 Press the x/Z“PGM” button to remove the disc.

Note : The playback start addresses for IN, MID, and OUT are as follows.

IN 40h cluster MID 300h cluster OUT 700h cluster

4-5-2. Operating the Continuous Recording Mode (Use only when performing self-recording/palyback check.)

1. Entering the continuous recording mode

1 Set a recordable disc in the unit. 2 Rotate the AMS knob and display “CREC 1MODE” (C35). 3 Press the @/1 button to change the display to “CREC1 MID”. 4 When access completes, the display changes to “CREC1 ( )” and REC lights up.

Note : The numbers “ ” displayed shows you the recording position addresses.

2. Changing the parts to be recorded

1 When the @/1 button is pressed during continuous recording, the display changes as below.

“CREC1 MID” t “CREC1 OUT” t “CREC1 IN”

When pressed another time, the parts to be recorded can be changed. REC goes off.

2 When access completes, the display changes to “CREC1 (

Note : The numbers “ ” displayed shows you the recording position addresses.

3. Ending the continuous recording mode

1 Press the x/Z button. The display changes to “CREC 1MODE” (C35 ) and REC goes off. 2 Press the x/Z“PGM” button to remove the disc.

Note 1 : The recording start addresses for IN, MID, and OUT are as follows.

IN 40h cluster MID 300h cluster OUT 700h cluster

Note 2 : The x/Z button can be used to stop recording anytime. Note 3 : Do not perform continuous recording for long periods of time above 5 minutes. Note 4 : During continuous recording, be careful not to apply vibration.

)” and REC lights up.

Page 22

4-6. FUNCTIONS OF OTHER BUTTONS

Function

PLAY

STOP

SCROLL

PLAYMODE

DISPLAY

x/Z “PGM”

x/Z

REPEAT

REC

CLEAR

TIME

Sets continuous playback when pressed in the STOP state. When pressed during continuous

playback, the tracking servo turns ON/OFF.

Stops continuous playback and continuous recording.

The sled moves to the outer circumference only when this is pressed.

The sled moves to the inner circumference only when this is pressed.

Switches between the pit and groove modes when pressed.

Switches the spindle servo mode (CLV S y CLV A).

Switches the displayed contents each time the button is pressed.

Ejects the disc.

Exits the test mode.

Resets the software.

Switches between recording start and stop if all servos are ON

Differentiates the disc type (High reflective aluminum: CD/low reflection: MD)

Switches between the error rate and motor modes

Contents

4-7. TEST MODE DISPLAYS

Each time the DISPLAY button is pressed, the display changes in the following order. When CPLAY and CREC are started, the display will forcibly be switched to the error rate display as the initial mode.

1. Mode display

Displays “TEMP ADJUST” (C03), “CPLAY1MODE” (C34), etc.

2. Error rate display

Displays the error rate in the following way.

C = AD = C = Indicates the C1 error. AD = Indicates ADER.

3. Address display

The address is displayed as follows. (MO:recordable disc, CD:playback only disc) Pressed the SCROLL button, the display switches from groove to pit or vice versa. h = s = (MO pit and CD) h = a = (MO groove) h = Indicates the header address. s = Indicates the SUBQ address. a = Indicates the ADIP address.

Note: “–” is displayed when the address cannnot be read.

Auto gain display (Not used in servicing)

Detrack check display (Not used in servicing)

IVR display (Not used in servicing)

Mode display

Error rate display

Address display

C1 error and Jitter display

(Not used in servicing)

AD error and Jitter display

(Not used in servicing)

Page 23

4-8. MEANINGS OF OTHER DISPLAYS

Display

REC z

L.SYNC

AT T

A-

SHUF

MONO

When Lit When Off

Servo ON

Tracking servo OFF

Recording mode ON

CLV low speed mode

ABCD adjustment completed

Tracking offset cancel ON

Tracking auto gain OK

Focus auto gain OK

Pit

High reflection

CLV S

CLV LOCK

Contents

Servo OFF

Tracking servo ON

Recording mode OFF

CLV normal mode

Tracking offset cancel OFF

Groove

Low reflection

CLV A

CLV UNLOCK

4-9. AUTOMATIC SELF-DIAGNOSIS FUNCTION

This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform AUTO CHECK after the laser power check and Iop check.

Procedure

1. Press the @/1 button. If “LDPWR ” is displayed, it means that the laser power check has not been performed. In this case,

perform the laser power check and Iop compare, and then repeat from step 1.

2. If a disc is in the mechanical deck, it will be ejected forcibly. “DISC IN” will be displayed in this case. Load a test disc (MDW-74/GA-1) which can be recorded.

3. If a disk is loaded at step 2, the check will start automatically.

4. When “XX CHECK” is displayed, the item corresponding to XX will be performed. When “06 CHECK” completes, the disc loaded at step 2 will be ejected. “DISC IN” will be displayed. Load the check disc (MD) TDYS-1.

5. When the disc is loaded in step 4, the check will automatically be resumed from “07 CHECK”.

6. After completing to test item 12, check OK or NG will be displayed. If all items are OK, “CHECK ALL OK” will be displayed. If any item is NG, it will be displayed as “NG:xxxx”.

When “CHECK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of the other spindle motor, thread motor, etc. When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.

4-10. INFORMATION

Display the software version.

Procedure

1. If displayed as “INFORMATION” (C31), press the @/1 button.

2. The software version will be displayed.

3. Press the x/Z button to end this mode.

Page 24

SECTION 5

ELECTRICAL ADJUSTMENTS

5-1. PARTS REPLACEMENT AND ADJUSTMENT

If malfunctions caused by optical pick-up such as sound skipping are suspected, follow the following check.

Check before replacement

Start

5-6-2.

Laser Power Check

(See page 27)

5-6-3.

Iop Compare (See page 27)

5-6-4.

Auto Check

(See page 28)

Other faults are suspected. Check the threading mechanism, etc.

Replace optical pick-up or MDM-7A

Page 25

Adjustment flow

Start

Replace IC195

Replace OP or IO195

Replace IC101, IC195, or D101

Replace OP, IC190, or IC195

YES

• Abbreviation OP: optical pick-up

After turning off and then on the power, initialize the EEPROM For details, refer to 4-11. WHEN MEMORY NG IS DISPLAYED (See page 23)

5-7. INITIAL SETTING OF ADJUSTMENT VALUE

(See page 30)

5-9. TEMPERATURE COMPENSATION OFFSET

ADJUSTMENT (See page 30)

5-10. LASER POWER ADJUSTMENT (See page 30)

Replace OP, IC102, IC190,

or IC195

Replace OP, IC101, IC151,

or IC195

Replace OP

Replace the spindle motor

5-6-4. Auto Check (See page 28)

YES

5-11. Iop NV SAVE (See page 31)

5-12. TRAVERSE ADJUSTMENT (See page 31) 5-13. FOCUS BIAS ADJUSTMENT (See page 32) 5-16. AUTO GAIN CONTROL OUTPUT LEVEL

ADJUSTMENT (See page 33)

OP change in Err Display mode Iop write

Spdl change in Err Display mode

End adjustments

Page 26

5-2. PRECA UTIONS FOR CHECKING LASER DIODE

EMISSION

To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight.

5-3. PRECAUTIONS FOR USE OF OPTICAL PICK-

UP (KMS-260B)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Before connecting the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

laser tap

Optical pick-up flexible board

flexible board

5-4. PRECAUTIONS FOR ADJUSTMENTS

1) When replacing the following parts, perform the adjustments and checks with

2) Set the test mode when performing adjustments. After completing the adjustments, exit the test mode. Perform the adjustments and checks in “group S” of the test mode.

3) Perform the adjustments to be needed in the order shown.

4) Use the following tools and measuring devices.

• Check Disc (MD) TDYS-1

(Parts No. 4-963-646-01)

• Test Disk (MDW-74/GA-1) (Parts No. 4-229-747-01)

• Laser power meter LPM-8001 (Parts No. J-2501-046-A) or

MD Laser power meter 8010S (Parts No. J-2501-145-A)

• Oscilloscope (Measure after performing CAL of prove.)

• Digital voltmeter

• Thermometer

• Jig for checking BD board waveform

(Parts No. : J-2501-196-A)

5-7. INITIAL SETTING OF ADJUSTMENT VALUES

5-8. RECORDING OF Iop INFORMATION

5-9. TEMP COMPENSATION OFF SET ADJUST

5-10. LASER POWER ADJUSTMENT

5-11. Iop NV SAVE

5-12. TRAVERSE ADJUSTMENT

5-13. FOCUS BIAS ADJUSTMENT

5-16. AUTO GAIN ADJUSTMENT

5-6-4. Auto Check

in the order shown in the following table.

Adjustment

optical

pick-up

5) When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscilloscope. (VC and ground will become short-circuited.)

6) Using the above jig enables the waveform to be checked without the need to solder. (Refer to Servicing Note on page 6.)

7) As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.

Parts to be replaced

IC101 IC102 IC151 IC190 IC195 D101

Page 27

5-5. USING THE CONTINUOUSL Y RECORDED DISC

* This disc is used in focus bias adjustment and error rate check.

The following describes how to create a continuous recording disc.

1. Insert a disc (blank disc) commercially available.

2. Rotate the AMS knob and display “CREC 1MODE” (C35).

3. Press the @/1 button again to display “CREC1 MID”.

Display “CREC (0300)” and start to recording.

4. Complete recording within 5 minutes.

5. Press the x/Z button and stop recording .

6. Press the x/Z“PGM” button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check.

Note :

• Be careful not to apply vibration during continuous recording.

5-6. CHECKS PRIOR TO REPAIRS

These checks are performed before replacing parts according to “approximate specifications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Replacement and Adjustments” (See page 8).

5-6-1. Temperature Compensation Offset Check

When performing adjustments, set the internal temperature and room temperature to 22 to 28ºC. Checks cannot be performed properly if performed after some time from power ON due to the rise in the temperature of the IC and diode, etc. So, perform the checks again after waiting some time.

Checking Procedure:

1. Rotate the AMS knob to display “TEMP CHECK” (C12).

2. Press the @/1 button.

3. “T=@@(##) [OK]” should be displayed. If “T=@@ (##) [NG]” is displayed, it means that the results are bad. (@@ indicates the current value set, and ## indicates the value written in the non-volatile memory.)

5-6-2. Laser Power Check

Before checking, check Iop value of the optical pick-up. (Refer to 5-8. Recording and Displaying Iop Information.)

Connection :

Laser power meter

optical pick-up objective lens

Digital volt mete

Checking Procedure:

1. Set the laser power meter on the objective lens of the optical pick-up. Connect the digital volt meter to CN105 pin 1 (I+3V) and CN105 pin 2 (Iop).

2. Then, rotate the AMS knob and display “LDPWR CHECK” (C13).

3. Press the @/1 button once and display “LD 0.9 mW $ ”. Check that the reading of the laser power meter become 0.84 to

0.92 mW.

4. Press the @/1 button once more and display “ LD 7.0 mW $

”. Check that the reading the laser power meter and digital

volt meter satisfy the specified value.

Specified Value :

Laser power meter reading : 7.0 ± 0.2 mW Digital voltmeter reading : Optical pick-up displayed value ± 10%

KMS

260B 20101 H0576

Iop = 57.6 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)

(For details of the method for checking this value, refer to “5-8. Recording and Displaying Iop Information”.)

(Optical pick-up label)

5. Press the x/Z button and display “LDPWR CHECK” (C13)

and stop the laser emission. (The x/Z button is effective at all times to stop the laser emission.)

Note 1: After step 4, each time the @/1 button is pressed, the

display will be switched between “LD 0.7 mW $ ”, “LD 6.2 mW $ ”, and “LD Wp $ ”. Nothing needs to be performed here.

5-6-3. Iop Compare

The current Iop value at laser power 7 mw output and reference Iop value (set at shipment) written in the nonvolatile memory are compared, and the rate of increase/decrease will be displayed in percentage.

Note: Perform this function with the optical pick-up set at room

temperature.

Procedure

1. Rotate the AMS knob to display “Iop Compare” (C27).

2. Press the @/1 button and start measurements.

3. When measurements complete, the display changes to “±xx%yy”. xx is the percentage of increase/decrease, and OK or NG is displayed at yy to indicate whether the percentage of increase/ decrease is within the allowable range.

4. Press the x/Z button to end.

CN105 pin 1 (I+3V)

BD board

CN105 pin 2 (Iop)

Page 28

5-6-4. Auto Check

This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked. Perform Auto Check after the laser power check and Iop compare.

Procedure

1. Press the @/1 button. If “LDPWR minicheck” is displayed, it

means that the laser power check has not been performed. In this case, perform the laser power check and Iop compare, and then repeat from step 1.

2. If a disc is in the mechanical deck, it will be ejected forcibly. “DISC IN” will be displayed in this case. Load a test disc (MDW74/GA-1) which can be recorded.

3. If a disk is loaded at step 2, the check will start automatically.

5. When the disc is loaded, the check will automatically be resumed from “07 CHECK”.

6. After completing to test item 12, check OK or NG will be displayed. If all items are OK, “CHECK ALL OK” will be displayed. If any item is NG, it will be displayed as “NG:xxxx”.

5-6-5. Other Checks

All the following checks are performed by the Auto Check mode. They therefore need not be performed in normal operation.

5-6-6. T raverse Check 5-6-7. Focus Bias Check 5-6-8. C PLAY Check 5-6-9. Self-Recording/Playback Check

5-6-6. T raverse Check

Connection :

BD board

CN105 pin 4 (TE)

CN105 pin 6 (VC)

Oscilloscope

5. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not rotate the AMS knob. (Read power traverse checking)

(Traverse Waveform)

Specified value : Below 10% offset value Offset value (%) = X 100

IA – BI

2 (A + B)

6. Press the @/1 button and display “EFB = MO-W”.

7. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not rotate the AMS knob. (Write power traverse checking)

(Traverse Waveform)

Specified value : Below 10% offset value Offset value (%) = X 100

IA – BI

2 (A + B)

8. Press the @/1 button display “EFB = MO-P”.

Then, the optical pick-up moves to the pit area automatically and servo is imposed.

9. Observe the waveform of the oscilloscope, and check that the

specified value is satisfied. Do not rotate the AMS knob.

(Traverse Waveform)

V : 0.5 V/div H : 10 ms/div Input : DC mod

Checking Procedure:

1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) of the BD board.

2. Load a test disc (MDW-74/GA-1). (Refer to Note 1.)

3. Rotate the AMS knob and display “EF MO CHECK” (C14).

4. Press the @/1 button and display “EFB =

MO-R”. (Laser power READ power/Focus servo ON/tracking servo OFF/ spindle (S) servo ON)

Specified value : Below 10% offset value Offset value (%) = X 100

IA – BI

2 (A + B)

10. Press the @/1 button display “EF MO CHECK” (C14)

The disc stops rotating automatically.

11. Press the x/Z “PGM” button and remove the disc.

12. Load the check disc (MD) TDYS-1.

13. Roteto the AMS knob and display “EF CD CHECK” (C15).

14. Press the @/1 button and display “EFB =

CD”. Servo is

imposed automatically.

Page 29

15. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not rotate the AMS knob.

(Traverse Wavef orm)

Specified value : Below 10% offset value Offset value (%) = X 100

IA – BI

2 (A + B)

16. Press the @/1 button and display “EF CD CHECK” (C15).

17. Press the x/Z “PGM” button and remove the check disc (MD) TDYS-1.

Note 1 : MO reading data will be erased during if a recorded disc is

used in this adjustment.

Note 2 : If the traverse waveform is not clear, connect the oscillo-

scope as shown in the following figure so that it can be seen more clearly.

BD board

CN105 pin 4 (TE)

CN105 pin 6 (VC)

330 kΩ

Oscilloscop

10pF

5-6-7. Focus Bias Check

Change the focus bias and check the focus tolerance amount.

Checking Procedure :

1. Load a continuously recorded test disc (MDW-74/GA-1). (Refer to “5-5. Using the Continuously Recorded Disc”.)

2. Rotate the AMS knob and display “CPLAY1MODE” (C34).

3. Press the @/1 button and display “CPLAY1 MID”.

4. Press the x/Z button when “C = AD = )” is dis- played.

5. Rotate the AMS knob and display “FBIAS CHECK” (C16).

6. Press the @/1 button and display “ / c = )”. The first four digits indicate the C1 error rate, the two digits after [/] indicate ADER, and the 2 digits after [c =] indicate the focus bias value. Check that the C1 error is below 20 and ADER is below 2.

7. Press the @/1 button and display “ / b = )”. Check that the C1 error is below 100 and ADER is below 2.

8. Press the @/1 button and display “ / a = )”. Check that the C1 error is below 100 and ADER is below 2.

9. Press the x/Z button, next press the A button, and remove the test disc.

5-6-8. C PLAY Check

MO Error Rate Check

Checking Procedure :

1. Load a continuously recorded test disc (MDW-74/GA-1). (Refer to “5-5. Using the Continuously Recorded Disc”.)

2. Rotate the AMS knob and display “CPLAY1MODE” (C34).

3. Press the @/1 button and display “CPLAY1 MID”.

4. The display changes to “C = AD = )”.

5. If the C1 error rate is below 20, check that ADER is 00.

6. Press the x/Z button, stop playback, press the x/Z “PGM” button, and test disc.

CD Error Rate Check

Checking Procedure :

1. Load a check disc (MD) TDYS-1.

2. Rotate the AMS knob and display “CPLAY1MODE” (C34).

3. Press the @/1 button twice and display “CPLAY1 MID”.

4. The display changes to “C = AD = )”.

5. Check that the C1 error rate is below 20.

6. Press the x/Z button, stop playback, press the x/Z “PGM” button, and the test disc.

5-6-9. Self-Recording/playback Check

Prepare a continuous recording disc using the unit to be repaired and check the error rate.

Checking Procedure :

1. Insert a recordable test disc (MDW-74/GA-1) into the unit.

2. Rotate the AMS knob to display “CREC 1MODE” (C35).

3. Press the @/1 button to display the “CREC1 MID”.

4. When recording starts, “ REC ” is displayed, this becomes

“CREC1 (@@@@)” (@@@@ is the address), and recording starts.

5. About 1 minute later, press the x/Z button to stop continuous recording.

6. Rotate the AMS knob to display “CPLAY 1MODE” (C34).

7. Press the @/1 button to display “CPLAY1 MID”.

8. “C =

AD = )” will be displayed.

9. Check that the C1 error becomes below 20 and the AD error below 2.

10. Press the x/Z button to stop playback, and press the x/Z

“PGM” button and remove the disc.

Page 30

5-7. INITIAL SETTING OF ADJUSTMENT VALUE

Note:

Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again excluding the temperature compensation offset adjustment. For details of the initial setting, refer to “5-4. Precautions for Adjustments” and execute the initial setting before the adjustment as required.

Setting Procedure :

1. Rotate the AMS knob to display “ADJ CLEAR” (C28).

2. Press the @/1 button. “Complete!” will be displayed momen-

tarily and initial setting will be executed, after which “ADJ CLEAR” (C28) will be displayed.

5-8. RECORDING AND DISPLAYING Iop

INFORMATION

The Iop (C28) data can be recorded in the non-volatile memory. Iop value on the label of the optical pick-up and Iop value after the adjustment will be recorded. Recording these data eliminates the need to read the label on the optical pick-up.

5-9. TEMPERATURE COMPENSATION OFFSET ADJUTMENT

Save the temperature data at that time in the non-volatile memory as 25 ˚C reference data.

Note :

1. Usually, do not perform this adjustment.

2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C. Perform it immediately after the power is turned on when the internal temperature of the unit is the same as the ambient temperature of 22 ˚C to 28 ˚C.

3. When D101 has been replaced, perform this adjustment after the temperature of this part has become the ambient temperature.

Adjusting Procedure :

1. Rotate the AMS knob and display “TEMP ADJUST” (C03).

2. Press the @/1 button and select the “TEMP ADJUST” (C03) mode.

3. “TEMP = [OK]” and the current temperature data will be displayed.

4. To save the data, press the @/1 button. When not saving the data, press the x/Z button.

5. When the @/1 button is pressed, “TEMP = SAVE” will be displayed and turned back to “TEMP ADJUST” (C03) display then. When the x/Z button is pressed, “TEMP ADJUST” (C03) will be displayed immediatelly.

Recording Procedure :

1. While pressing the AMS knob and x/Z button, connect the power plug to the outlet, and release the AMS knob and x/Z button.

2. Rotate the AMS knob to display “[Service]”, and press the @/1 button.

3. Rotate the AMS knob to display “Iop Write” (C05), and press the @/1 button.

4. The display becomes Ref=@@@.@ (@ is an arbitrary number) and the numbers which can be changed will blink.

5. Input Iop value written on the optical pick-up. To select the number : Rotate the AMS knob. To select the digit : Press the AMS knob

6. When the @/1 button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).

7. As the adjustment results are recorded for the 6 value. Leave it as it is and press the @/1 button.

8. “Complete! !” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write” (C05).

Display Procedure :

1. Rotate the AMS knob to display “Iop Read” (C26).

2. “@@.@/##.#” is displayed and the recorded contents are displayed. @@.@ indicates Iop value labeled on the pick-up. ##.# indicates Iop value after adjustment

3. To end, press the x/Z button to display “Iop Read” (C26).

Specified Value :

The “TEMP = ” should be within “E0 - EF”, “F0 - FF”, “00 0F”, “10 - 1F” and “20 - 2F”.

5-10. LASER POWER ADJUSTMENT

Check Iop value of the optical pick-up before adjustments. (Refer to 5-8. Recording and Displaying Iop Information.)

Connection :

optical pick-up objective lens

BD board

CN105 pin 1 (I+3V)

CN105 pin 2 (Iop)

Adjusting Procedure :

1. Set the laser power meter on the objective lens of the optical pick-up. Connect the digital volt meter to CN105 pin 1 (I+3V) and CN105 pin 2 (Iop).

2. Rotate the AMS knob and display “LDPWR ADJUST” (C13). (Laser power : For adjustment)

3. Press the @/1 button once and display “LD 0.9 mW $ ”.

4. Rotate the AMS knob so that the reading of the laser power meter becomes 0.85 to 0.91 mW. Press the @/1 button after setting the range knob of the laser power meter, and save the adjustment results. (“LD SAVE $ ” will be displayed for a moment.)

5. Then “LD 7.0 mW $ ” will be displayed.

6. Rotate the AMS knob so that the reading of the laser power meter becomes 6.9 to 7.1 mW, press the @/1 button and save it.

Note : Do not perform the emission with 7.0 mW more than 15

seconds continuously.

Laser power meter

Digital volt mete

Page 31

7. Then, rotate the AMS knob and display “LDPWR CHECK”

(C13).

8. Press the @/1 button once and display “LD 0.9 mW $ ”.

Check that the reading of the laser power meter become 0.85 to

0.91 mW.

9. Press the @/1 button once more and display “LD 7.0 mW $

”. Check that the reading the laser power meter and digital volt meter satisfy the specified value. Note down the digital voltmeter reading value.

Specified Value :

Laser power meter reading : 7.0 ± 0.2 mW Digital voltmeter reading : Optical pick-up displayed value ± 10%

KMS

260B 20101 H0576

Iop = 57.6 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)

(For details of the method for checking this value, refer to “5-8. Recording and Displaying Iop Information”.)

(Optical pick-up label)

10. Press the x/Z button and display “LDPWR CHECK” (C13)

and stop the laser emission. (The x/Z button is effective at all times to stop the laser emission.)

11. Rotate the AMS knob to display “Iop Write” (C05).

12. Press the @/1 button. When the display becomes Ref=@@@.@ (@ is an arbitrary number), press the @/1 button to display “Measu=@@@.@” (@ is an arbitrary number).

13. The numbers which can be changed will blink. Input Iop value noted down at step 9. To select the number : Rotate the AMS knob. To select the digit : Press the AMS knob

14. When the @/1 button is pressed, “Complete! !” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write” (C05).

5-12. TRA VERSE ADJUSTMENT

Connection :

BD board CN105 pin 4 (TE) CN105 pin 6 (VC)

Adjusting Procedure :

1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) of the BD board.

2. Load a test disc (MDW-74/GA-1). (Refer to Note 1.)

3. Rotate the AMS knob and display “EF MO ADJUST” (C07).

4. Press the @/1 button and display “EFB = (Laser power READ power/Focus servo ON/tracking servo OFF/ spindle (S) servo ON)

5. Rotate the AMS knob so that the waveform of the oscilloscope becomes the specified value. (When the AMS knob is rotated, the of “EFB= ” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Read power traverse adjustment)

(Traverse Waveform)

Oscilloscope

V : 0.5 V/div H : 10 ms/div Input : DC mod

MO-R”.

Note 1: After step 4, each time the @/1 button is pressed, the

display will be switched between “LD 0.7 mW $ ”, “LD

6.2 mW $ ”, and “LD Wp $ ”. Nothing needs to be performed here.

5-11. Iop NV SAVE

Write the reference values in the nonvolatile memory to perform “Iop Compare”. As this involves rewriting the reference values, do not perform this procedure except when adjusting the laser power during replacement of the optical pick-up and when replacing the IC102. Otherwise the optical pick-up check may deteriorate.

Note: Perform this function with the optical pick-up set at room

temperature.

Procedure

1. Rotate the AMS knob to display “Iop NV Save” (C06).

2. Press the @/1 button and display “Iop [stop]”.

3. After the display changes to “Iop =xxsave?”, press the @/1

button.

4. After “Complete!” is displayed momentarily, the display changes to “Iop 7.0 mW”.

5. After the display changes to “Iop=yysave?”, press the @/1 button.

6. When “Complete!” is displayed, it means that Iop NV saving has been completed.

Specification A = B

6. Press the @/1 button and save the result of adjustment to the

non-volatile memory (“EFB = SAVE” will be displayed for a moment. Then “EFB = MO-W” will be displayed).

7. Rotate the AMS knob so that the waveform of the oscilloscope becomes the specified value. (When the AMS knob is rotated, the of “EFB- MO-W” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Write power traverse adjustment)

(Traverse Waveform)

Specification A = B

8. Press the @/1 button, and save the adjustment results in the non-volatile memory. (“EFB =

SAVE” will be displayed for

a moment.)

9. “EFB = MO-P”. will be displayed.

The optical pick-up moves to the pit area automatically and servo is imposed.

Page 32

10. Rotate the AMS knob until the waveform of the oscilloscope

moves closer to the specified value. In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.

(Traverse Waveform)

Specification A = B

11. Press the @/1 button, and save the adjustment results in the

non-volatile memory. (“EFB =

SAVE” will be displayed for a moment.) Next “EF MO ADJUS (C07)” is displayed. The disc stops rotating automatically.

12. Press the x/Z “PGM” button and remove the disc.

13. Load the check disc (MD) TDYS-1.

14. Roteto AMS knob and display “EF CD ADJUS” (C08).

15. Press the @/1 button and display “EFB = CD”. Servo is

imposed automatically.

16. Rotate the AMS knob so that the waveform of the oscilloscope moves closer to the specified value. In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.

(Traverse Waveform)

5-13. FOCUS BIAS ADJUSTMENT

Adjusting Procedure :

1. Load a test disk (MDW-74/GA-1).

2. Rotate the AMS knob and display “CPLAY1MODE” (C34).

3. Press the @/1 button and display “CPLAY1 MID”.

4. Press the x/Z button when “C = AD = )” is dis-

played.

5. Rotate the AMS knob and display “FBIAS ADJUST” (C09).

6. Press the @/1 button and display “ / a = T)”.

The first four digits indicate the C error rate, the two digits after [/] indicate ADER, and the 2 digits after [a =] indicate the focus bias value.

7. Rotate the AMS knob in the clockwise direction and find the focus bias value at which the C error rate becomes 200 (Refer to Note 2).

8. Press the @/1 button and display “ / b = T”.

9. Rotate the AMS knob in the counterclockwise direction and find the focus bias value at which the C error rate becomes 200.

10. Press the @/1 button and display “ / c = T)”.

11. Check that the C error rate is below 20 and ADER is 00. Then

press the @/1 button.

12. If the “( ” in “ - - ( ” is above 20, press the @/1

button. If below 20, press the x/Z button and repeat the adjustment from step 2.

13. Press the x/Z “PGM” button to remove the test disc.

Note 1 : The relation between the C error and focus bias is as

shown in the following figure. Find points a and b in the following figure using the above adjustment. The focal point position c is automatically calculated from points a and b.

Note 2 : As the C error rate changes, perform the adjustment using

the average vale.

Specification A = B

17. Press the @/1 button, display “EFB =

SAVE” for a moment and save the adjustment results in the non-volatile memory. Next “EF CD ADJUST” (C08) will be displayed.

18. Press the x/Z “PGM” button and remove the check disc

(MD) TDYS-1.

Note 1 : MO reading data will be erased during if a recorded disc is

used in this adjustment.

Note 2 : If the traverse waveform is not clear, connect the oscillo-

scope as shown in the following figure so that it can be seen more clearly.

BD board

CN105 pin 4 (TE)

CN105 pin 6 (VC)

330 kΩ

Oscilloscop

10pF

200

C error

c a Focus bias value

(F. BIAS)

Page 33

5-14. ERROR RATE CHECK

5-14-1. CD Error Rate Check

5-16. AUTO GAIN CONTROL OUTPUT LEVEL

ADJUSTMENT

Checking Procedure :

1. Load a check disc (MD) TDYS-1.

2. Rotate the AMS knob and display “CPLAY1MODE” (C34).

3. Press the @/1 button twice and display “CPLAY1 MID”.

4. The display changes to “C =

5. Check that the C1 error rate is below 20.

6. Press the x/Z button, stop playback, press the x/Z “PGM”

button, and remove the test disc.

5-14-2. MO Error Rate Check

Checking Procedure :

1. Load a continuously recorded test disc (MDW-74/GA-1). (Refer to “5-5. Using the Continuously Recorded Disc”.)

2. Rotate the AMS knob and display “CPLAY1MODE” (C34).

3. Press the @/1 button and display “CPLAY1 MID”.

4. The display changes to “C =

5. If the C1 error rate is below 20, check that ADER is 00.

6. Press the x/Z button, stop playback, press the x/Z “PGM” button, and remove the test disc.

AD = )”.

5-15. FOCUS BIAS CHECK

Change the focus bias and check the focus tolerance amount.

Checking Procedure :

1. Load a continuously recorded test disc (MDW-74/GA-1). (Refer to “5-5. Using the Continuously Recorded Disc”.)

2. Rotate the AMS knob and display “CPLAY1MODE” (C34).

3. Press the @/1 button twice and display “CPLAY1 MID”.

4. Press the x/Z button when “C = AD = )” is displayed.

5. Rotate the AMS knob and display “FBIAS CHECK” (C16).

6. Press the @/1 button and display “ / c = ”. The first four digits indicate the C error rate, the two digits after [/] indicate ADR, and the 2 digits after [c =] indicate the focus bias value. Check that the C error is below 20 and ADER is below 2.

7. Press the @/1 button and display “ / b = ”. Check that the C error is below 100 and ADER is below 2.

8. Press the @/1 button and display “ / a = ”. Check that the C error is below 100 and ADER is below 2

9. Press the x/Z button, next press the x/Z “PGM” button, and remove the continuously recorded disc.

Be sure to perform this adjustment when the optical pick-up is replaced. If the adjustment results becomes “Adjust NG!”, the optical pickup may be faulty or the servo system circuits may be abnormal.

5-16-1. CD Auto Gain Control Output Level Adjustment

Adjusting Procedure :

1. Insert the check disc (MD) TDYS-1.

2. Rotate the AMS knob to display “AG Set (CD)” (C11).

3. When the @/1 button is pressed, the adjustment will be

performed automatically. “Complete! !” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the display changes to “AG Set (CD)” (C11).

4. Press the x/Z “PGM” button to remove the disc.

5-16-2. MO Auto Gain Control Output Level Adjustment

Adjusting Procedure :

1. Insert the reference disc (MDW-74/GA-1) for recording.

2. Rotate the AMS knob to display “AG Set (MO)” (C10).

3. When the @/1 button is pressed, the adjustment will be

performed automatically. “Complete! !” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the display changes to “AG Set (MO)” (C10).

4. Press the x/Z “PGM” button to remove the disc.

Note 1 : If the C error and ADER are above other than the speci-

fied value at points a (step 8. in the above) or b (step 7. in the above), the focus bias adjustment may not have been carried out properly. Adjust perform the beginning again.

Page 34

5-17. ADJUSTING POINTS AND CONNECTING POINTS

[BD BOARD] (SIDE A)

CN101

D101

[BD BOARD] (SIDE B)

IC190

IC195

23 1 27 1

CN103 CN102

IC151

IC101

IC102

CN105

* NOTE

NOTE:It is useful to use the jig. for checking the waveform. (Refer

to Servicing Note on page 6.)

Page 35

SECTION 6

DIAGRAMS

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.)

For schematic diagrams.

Note:

• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/ specified.

•

• 2 : nonflammable resistor.

• 5 : fusible resistor.

• C : panel designation.

• U : B+ Line.

• V : B– Line.

• H : adjustment for repair.

• Voltages and waveforms are dc with respect to ground

• Voltages are taken with a VOM (Input impedance 10 MΩ).

• Waveforms are taken with a oscilloscope.

• Circled numbers refer to waveforms.

• Signal path.

• Abbreviation

: internal component.

Note:

The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified.

under no-signal (detuned) conditions. Voltage variations may be noted due to normal produc-

tion tolerances. Voltage variations may be noted due to normal produc-

tion tolerances.

E : PB j : REC p : PB (DIGITAL OUT) l : REC (DIGITAL IN)

CND : Canadian model SP : Singapore model MY : Malaysia model

W or less unless otherwise

Note:

Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

• Indication of transistor

C Q

These are omitted.

• WA VEFORMS

– BD Board –

IC101 ek (RF)

IC101 ef (FE)

(Play mode)

IC101 wh (TE)

(Play mode)

IC151 qh (OSCI)

22nsec

1.3Vp-p

0.2Vp-p

1.6Vp-p

3.1Vp-p

IC151 wj (LRCK)

22.6µsec

IC151 wk (XBCK)

354nsec

IC151 o; (FS4)

5.67µsec

IC171 3

22nsec

3.2Vp-p

3.8Vp-p

3.2Vp-p

1.0Vp-p

– MAIN Board –

1 IC300 w; (XOUT)

2.6Vp-p

100nsec

2 IC550 2

0.7Vp-p

22nsec

3 IC451 3 (C1+)

4.8Vp-p

8µsec

For printed wiring boards.

Note:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

•

• b : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

Caution: Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated.

: Through hole.

Page 36

MDS-PC3

6-1. BLOCK DIAGRAMS – BD SECTION –

HR901

OVER WRITE HEAD

OPTICAL PICK-UP

(KMS-260B/J1N)

C B

I J

DETECTOR

LDPD

LASER DIODE

ILCC

C D E

AUTOMATIC

POWER CONTROL

Q121, 122

LASER ON

SWITCH

Q101

4 5 6 7

A B C D

APC

48 47

MORFO

RF AMP

I-V

AMP

I-V

AMP

LD/PD

AMP

MORFI

RFO

46 40

B.P.F.

TEMP

AMP

ABCD

AMP

APCREF

OVER WRITE

HEAD DRIVE

IC181, Q181, 182

WBL

ADFM

B.P.F.

COMMAND

SERIAL/PARALLEL

CONVERTER,

DECODER

SWDT

SCLK

SHOCK PROOF MEMORY CONTROLLER,

SCTX

FOCUS/TRACKING ERROR AMP

AGCI

WBL

PEAK &

BOTTOM

ADIN

3029

FOCUS

ERROR AMP

TRACKING

ERROR AMP

CONVERTER

XLAT

181716

DIGITAL SIGNAL PROCESSOR,

EFM/ACIRC ENCODER/DECODER,

ATRAC ENCODER/DECODER

IC151 (1/2)

RF AMP,

IC101

V-I

RF AGC

& EQ

WBL

AUX

PEAK

BOTM

ADFG

ABCD

F0CNT

FILTER

100

EFMO

FILI

PCO

CLTV

FILO

ASYO

ASYI

COMPA-

RFI

RATOR

ADFG

DEMODULATOR/

DECODER

F0CNT

PLL

ADIP

SPINDLE

SERVO

SPFD

94 93

INTERFACE

SENS

SRDT

ATRAC

ENCODER/DECODER

CPU

SWDT

EFM/ACIRC

SHOCK PROOF

ENCODER/DECODER

MEMORY CONTROLLER

SUBCODE

PROCESSOR

SPRD

DQSY

SQSY

XINT

12 11 14 9 8 5 6 7 1 2 3 4

27 32 48 40 42 50 58 5638

SCLK

XLAT

SAMPLING

RATE

CONVERTER

DIGITAL

AUDIO

INTERFACE

CLOCK

GENERATOR

INTERNAL BUS

MONITOR CONTROL

MNT0

IC151 (1/2)

ADDT

DATAI

XBCKI

LRCKI

DIN0

DIN1

DOUT

DADT XBCK LRCK

FS256

MNT1

MNT2

XBUSY

SHOCK

MNT3

26 28 27 29

SWDT

SCLK

ADDT

WAVE

SHAPER

IC600

OPTICAL

RECEIVER

IC611

OPTICAL

TRANSCEIVER

IC661

DADT, BCK, LRCK

DIGITAL IN

(OPTICAL)

DIGITAL

(OPTICAL)

OUT

(Page 37)

OSCI

OSCO

XOE

XWE XRAS XCAS

D0 – D3A00 – A09

49, 48, 50, 51

34 – 31, 36 – 40, 45

43 47 46 44

1, 2, 24, 25

5, 9 – 12, 14 – 18

RAS

CAS

D-RAM

DQ1 – DQ4

A0 – A9

IC153

BUFFER

IC171

SWDT, SCLK

(Page 37)

2-AXIS DEVICE

(TRACKING)

HF MODULE

FCS+

(FOCUS)

FCS– TRK+ TRK–

MOD

FOCUS/TRACKING COIL DRIVE,

SPINDLE/SLED MOTOR DRIVE

M101

(SPINDLE)

M102

(SLED)

IC141

XINT

LDIN

12 13

9 10

IN1

OUT1

4 2

M103

LDOUT

VCC

IN2

VREF

OUT2

SENS

SQSY

DQSY

LDON

DIG-RST

WR-PWR

MOD

PSB

OUT4F

OUT4R

OUT2F

OUT2R

OUT1F

21 23

OUT1R

OUT3F

12 10

OUT3R

IN4R

IN4F

IN2F

IN2R

IN1F

IN1R

IN3F

IN3R

SPFD

SPRD

19 18

14 15

83 13 67 65 66 75 74 63 64

XRST

APCREF

SFDR

SRDR

FFDR

FRDR

86 85

PWM GENERATOR

TFDR TRDR

RECP

AUTOMATIC

POWER

CONTROL

DIGITAL SERVO

SIGNAL

PROCESS

DIGITAL SERVO

SIGNAL PROCESSOR

IC151 (2/2)

AUX1

ABCD

ANALOG MUX

A/D CONVERTER

FROM CPU INTERFACE

AUTO

SEQUENCER

PEAK

BOTM

MOTOR DRIVE

IC440

XLRF CKRF DTRF

XLAT

SCLK

SWDT

HF MODULE

SWITCH

IC102, Q131 – 134

(LOADING)

SRDT

SWDT

SCLK

XLATCH

MNT2 (XBUSY)

MNT1 (SHOCK)

SYSTEM CONTROLLER

IC1 (1/2)

UNREG

+5V

REFERENCE

VOLTAGE SWITCH

Q440

EEPROM

IC195

SDA

SCL

56661

LD-LOW

SDA

SCL

LIMIT-IN

OUT-SW

PLAY-SW

REC-P

REFLECT

PROTECT

S102

(REFLECT/PROTECT DETECT)

HIGH REFELECT RATE/

WRITE PROTECT

LOW REFELECT RATE/

UN-PROTECT

+3.3V

REG.

IC190

S101

(LIMIT IN)

S103

(OUT SW)

S104

(PLAY SW)

S105

(REC POSITION)

• SIGNAL PATH

+5VD+3V

: PLAY (ANALOG OUT) : PLAY (DIGITAL OUT) : REC (ANALOG IN) : REC (DIGITAL IN)

Page 37

– MAIN SECTION –

ADDT

(Page 36)

DADT, BCK, LRCK

(Page 36)

DADT

BCK

LRCK

MDS-PC3

A/D, D/A CONVERTER

IC500

SDTO

AUDIO

INTERFACE

CONTROLLER

SDTI

BICK

LRCK

HIGH-PASS FILTER,

DIGITAL

ATTENUATOR

DIGITAL

ATTENUATOR,

SOFT MUTE

A/D

CONVERTER

BLOCK

D/A

CONVERTER

BLOCK

SUB-

TRACKTION

AINL

AINR

AOUTL+

AOUTL–

AOUTR+

AOUTR–

LINE AMP

IC502

MIX AMP

IC501 (1/2)

MIX AMP

IC501 (2/2)

CN100

ANALOG

CN200

ANALOG

OUT

(VARIABLE)

• SIGNAL PATH : PLAY (ANALOG OUT) : REC (ANALOG IN)

(Page 36)

SWDT, SCLK

X22

10MHz

SWDT SCLK

XIN

XOUT

47 72

LCD MODULE

DIG-RST

RESET

LCD701

DATA(FL)

CLK(FL)

128

1615

FLDT

FLCK

15 16 17

AD/DA LATCH

CS(FL)

FLCS

CDTI CCLK CS

LED701

LCD

BACK

LIGHT

D751

I /

CONTROL REGISTER INTERFACE

910

AD/DA RESET

LED DRIVE

Q701

LED INV. DRIVE

Q751

25,24-16,8-1,48

100-94,92,85-77,75,73

LED

CLOCK

GENERATOR,

CLOCK DIVIDER

FLASH RAM

A0 – A18 DQ0-DQ15

A1 – A19 D0 – D15

IC301

29-36,38-45

122-119,113-102

SYSTEM CONTROLLER

IC1 (2/2)

1 3

ROTARY

ENCODER

GND

S713

. AMS >

PUSH u

JOG0

JOG1

124123

XTI

R/WWPCE

11 14 26 28

65 90 69 63

CS0

WE R/W

KEY1

139

S702 S701

z x / Z

OSC

IC550

KEY2

138

REMOTE CONTROL

S726

I /

X550

45.1584MHz

RECEIVER

IC781

SIRCS

KEY0

141

RESET

MUTING

Q170,270

MUTING

CONTROL SWITCH

Q100

D301

8 26

MUTE

1 3

+3.3V

(SYS)

+3.3V

(BACKUP)

IC420

RESET

EXT ON

GND

J180

PHONES

3 4

J800

CONTROL-I

PDOWN

LIN

HEADPHONE

RIN

IIC CLK

IIC DATA

AMP

IC503

MUTE

MUTING

Q451

LOUT

ROUT

IC800

IIC BUS BUFFER

IIC CLK

IIC DATA

172

POWER(IIC)

IIC BUSY

129 115

IIC POWER

IIC BUSY

XBUSY

GND

+5V

VCCRESET

D422

BT420

LITHUM

BATTERY

+5V

D421

CN420

+3.3V

REG

IC402

+5V

(ANALOG)

-5V

(ANALOG)

IC401

VOLTAGE LEVEL DETECT

VINOUT

1 3

SWITCHING

REG.

IC400,Q400

+5V REG

IC450

-5V

DC/DC

CONVERTER

IC451

THP400

DC IN

Page 38

MDS-PC3

6-2. PRINTED WIRING BOARD – BD SECTION –

• Semiconductor

Location

Ref. No. Location D101 A-4

Q101 B-1 Q131 C-1 Q132 B-1 Q133 B-1 Q134 C-1

There are a few cases that the part isn’t mounted in model is printed on diagram.

• Semiconductor

Location

Ref. No. Location D181 D-3

D183 D-3 IC101 A-3

IC102 B-3 IC141 C-1 IC151 C-2 IC153 C-3 IC171 D-2

Ref. No. Location

IC181 D-3 IC190 D-1 IC195 D-2

Q121 B-3 Q122 B-3 Q181 D-3 Q182 D-3

Page 39

6-3. SCHEMATIC DIAGRAM – BD SECTION (1/2) – • See page 35 for Waveforms. • See page 46 for IC Block Diagrams. • See page 49 for IC Pin Functions. • See page 38 for Printed Wiring Board.

PIN FUNCTION

MDS-PC3

Page 40

MDS-PC3

6-4. SCHEMATIC DIAGRAM – BD SECTION (2/2) – • See page 35 for Waveforms. • See page 46 for IC Block Diagrams. • See page 50 for IC Pin Functions. • See page 38 for Printed Wiring Board.

PIN FUNCTION

Page 41

6-5. PRINTED WIRING BOARD – MAIN SECTION –

• MAIN and PANEL boards are lead free soldered (contains no lead).

MDS-PC3

• Semiconductor

Location

Ref. No. Location D155 C-4

D156 C-4 D255 C-4 D256 C-4 D301 B-1 D400 A-1 D402 B-3 D421 B-3 D422 B-3

IC300 C-2 IC301 C-4 IC400 B-2 IC401 B-1 IC402 B-4 IC420 C-1

Ref. No. Location

IC440 B-1 IC451 A-4 IC500 C-5 IC501 B-5 IC502 B-4 IC503 C-5 IC550 D-5 IC600 A-3 IC800 A-2

Q100 B-1 Q170 B-5 Q270 B-5 Q400 B-3 Q440 C-1 Q451 C-5

• Semiconductor

Location

Ref. No. Location IC450 A-3

IC611 A-3 IC661 A-4

Q450 D-2

There are a few cases that the part isn’t mounted in model is printed on diagram.

Page 42

MDS-PC3

6-6. SCHEMATIC DIAGRAM – MAIN SECTION (1/2) – • See page 35 for Waveforms. • See page 41 for Printed Wiring Board. • See page 48 for IC Block Diagrams. • See page 53 for IC Pin Functions.

PIN FUNCTON

Page 43

6-7. SCHEMATIC DIAGRAM – MAIN SECTION (2/2) – • See page 35 for Waveforms. • See page 41 for Printed Wiring Board. • See page 47 for IC Block Diagrams.

MDS-PC3

Page 44

MDS-PC3

6-8. PRINTED WIRING BOARD – PANEL SECTION –

• MAIN and PANEL boards are lead free soldered (contains no lead).

• Semiconductor

Location

Ref. No. Location D751 A-6

Q701 A-6 Q751 A-6

• Semiconductor

Location

Ref. No. Location IC781 A-6

There are a few cases that the part isn’t mounted in model is printed on diagram.

Page 45

6-9. SCHEMATIC DIAGRAM – PANEL SECTION – • See page 35 for Waveforms.

MDS-PC3

Page 46

6-10. IC BLOCK DIAGRAMS

IC101 CXA2523AR (BD BOARD)

CVB

3VC

IVR

GSW

MORFO47MORFI46RFO45OPN

RFA1

–

+ –

–

– –

–

GRVA

EBAL

RFA2

OFST

+ –

FBAL

GRV

– +

HLPT

EE'

USROP

– – – –

+ + – –

– – + +

OPO43ADDC42COMPP41COMPO40AGCI39RF AGC38RF37PEAK

RF AGC EQ

USRC

PEAK

BOTTOM

WBL

ADIP

PTGR

PEAK3T

P-P

PBH

AGC

WBL

3T WBL

DET

–1

–2

–1

–2

TEMP

DET

AUX

BPFC

SEA

TEA

VI CONV

RFA3

–1

–2

PTGR

–2

–1

PBSW

ABCDA

FEA

BPF22

WBL

ATA

WBL

– + –

EFB TESW

ESW

FF'

+ –

BPF3T

BOTM

ABCD

AUX

32 ADFG

31 ADAGC

30 ADIN

29 ADFM

28 SE

27 CSLED

26 TE

25 WBLADJ

IC151 CXD2662R (BD BOARD)

EFMO

DVSS

TEST3

TEST2

TEST1

FS256

EACH BLOCK

DEMODULATOR/

EACH BLOCK

DVDD

TEST0

SPINDLE

DECODER

EACH BLOCK

SERVO

MNT0

MNT1

MNT2

MNT3

SWDT

SCLK

XLAT

SRDT

SENS

XRST

SQSY

DQSY

RECP

XINT

OSCI

OSCO

XTSL

DIN0

DIN1

DOUT

DATAI

LRCKI

XBCKI

ADDT

100

99 98 97 96 95 94 93

MONITOR CONTROL

CPU I/F

SUBCODE

PROCESSOR

GENERATOR

DADT

CLOCK

LRCK

XBCK

SPFD

ADIP

SPRD

DIGITAL

AUDIO

SFDR91SRDR90FS489FRDR88FFDR87DVDD86TFDR85TRDR84LDDR83APCREF82DTRF81CKRF80XLRF79F0CNT78ADFG77APC76DCHG

PWM

GENERATOR

SERVO

DSP

APC

SHOCK RESISTANT

MEMORY CONTROLLER

SAMPLING

I/F

ENCODER/DECODER

RATE

CONVERTER

ATRAC/ATRAC3

ADDRESS/DATA BUS A00 - A11, D0 - D3

A1140A0839A0738A0637A0536A0435A1034A0033A0132A0231A03

CONVERTER

XOE

DVSS

A/D

XCAS

AUTO

A09

XRAS

SEQUENCER

DECODER

ENCODER/

EFM/ACIRC

COMP

DRAM

XWE

ANALOG

MUX

50D249D048D147

PLL

AVSS

ADRB

ADRT

AVDD

ADIO

AUX1

ABCD

BOTM

PEAK

CLTV

FILO

FILI

PCO

AVSS

RFI

BIAS

AVDD

ASYI

ASYO

MVCI

AUXSW

TEMPR

COMMAND

SCRI - PARA

DECODE

SWDT

SCLK

BGR

VREF

XLAT

XSTBY

F0CNT

VREF

EQADJ

3TADJ

VCC

IC141 BH6511FS (BD BOARD)

CAPA–

CAPA+

IN2R

IN2F

VM2

OUT2F

PGND2

OUT2R

VM12

OUT1R

PGND1

OUT1F

VM1

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

IN4F

AMP

VM4

INTERFACE

CHARGE

PUMP.

OSC

INTERFACE

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

GND

IN4R

OUT4F

AMP

PGND4

OUT4R

VM34

AMP

OUT3R

PGND3

AMP

AMPAMPAMP

OUT3F

PREDRIVEPREDRIVE

VM3

IN1F

INTERFACE

IN3F

IN1R

IN3R

PSB

10PD

11APC

12APCREF

–

GND

TEMPI

Page 47

IC400 MAX1626ESA-TE2 (MAIN BOARD)

1.5V

MINIMUM ON-TIME

ONE-SHOT

TRIG

MINIMUM OFF-TIME

ONE-SHOT

CURRENT-SENSE

COMPARATOR

OUT

SHDN

REF

ERROR

R3 R1

3/5

COMPARATOR

–

REF

IC440 LB1830M-S-TE-L (MAIN BOARD)

IC451 XC6351A120MR (MAIN BOARD)

GND

EXT

GND

–

CCE/

C1+

IC500 AK4524 (MAIN BOARD)

V+

VCOM

AINR

AINL

CHIP

ENABLE

OSCILLATOR

N3 N4

A/D

CONVERTER

BLOCK

BUFFER

D/A

CONVERTER

BLOCK

28 27 26 25

AOUTR+ AOUTR– AOUTL+ AOUTL–

C1-

VIN

VOUT

IN2 IN1 VM VREF VCONT

10 9 8 7

VREF

LOGIC

PREDRIVER

2 3

VCC OUT2 GND OUT1 VS

VREF

AGND

TEST

XTAO

XTAI

XTALE

LRCK

BICK

SDTO

SDTI

4 5 6

8 9

11 12 13 14

CLOCK

GENERATOR

& DIVIDER

AUDIO

INTERFACE

CONTROLLER

H.P.F.

D-ATT

D-ATT,

S-MUTE

CONTROL REGISTER INTERFACE

DGND

CLKO M/S

CIF

18 17

CCLK

CDTI

Page 48

IC420 M62016FP-E1 (MAIN BOARD)

VCC

3 4 5 6

COM

–

COM

–

GND

INTERRUPT

SIGNAL

GENERATOR

RESET

SIGNAL

GENERATOR

IC503 BH3541F-E2 (MAIN BOARD)

VCC LOUT BIAS LIN

INT

RESET

58 7

BIAS

0dB

MUTE

ROUT MUTE RIN VEE

3 41 2

IC800 P82B715TD.118 (MAIN BOARD)

SDA

SCL

VCC

BUFFER

180k

LDA

LCL

GND

Page 49

6-11. IC PIN FUNCTIONS

• IC101 CXA2523AR RF Amplifier (BD BOARD)

Pin No.

1 2 3

4 to 9

10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

Pin Name I/O Function

I J VC A to F PD APC APCREF GND TEMPI TEMPR SWDT SCLK XLAT XSTBY F0CNT VREF EQADJ 3T ADJ Vcc WBLADJ TE CSLED SE ADFM ADIN ADAGC ADFG

AUX

FE ABCD BOTM PEAK RF RFAGC AGCI COMPO COMPP ADDC OPO OPN RFO MORFI MORFO

I-V converted RF signal I input

I-V converted RF signal J input

Middle point voltage (+1.5V) generation output

Signal input from the optical pick-up detector

Light amount monitor input

Laser APC output

Reference voltage input for setting laser power

—

Ground

Temperature sensor connection

Reference voltage output for the temperature sensor

Serial data input from the CXD2662R

Serial clock input from the CXD2662R

Latch signal input from the CXD2662R “L”: Latch

Stand by signal input “L”: Stand by

Center frequency control voltage input of BPF22, BPF3T, EQ from the CXD2662R

Reference voltage output (Not used)

I/O

Center frequency setting pin for the internal circuit EQ

I/O

Center frequency setting pin for the internal circuit BPF3T

—

+3V power supply

I/O

Center frequency setting pin for the internal circuit BPF22

Tracking error signal output to the CXD2662R

—

External capacitor connection pin for the sled error signal LPF

Sled error signal output to the CXD2662R

FM signal output of ADIP

ADIP signal comparator input ADFM is connected with AC coupling

—

External capacitor connection pin for AGC of ADIP

ADIP duplex signal output to the CXD2662R I

3 signal/temperature signal output to the CXD2662R

(Switching with a serial command)

Focus error signal output to the CXD2662R

Light amount signal output to the CXD2662R

RF/ABCD bottom hold signal output to the CXD2662R

RF/ABCD peak hold signal output to the CXD2662R

RF equalizer output to the CXD2662R

—

External capacitor connection pin for the RF AGC circuit

Input to the RF AGC circuit The RF amplifier output is input with AC coupling

User comparator output (Not used)

User comparator input (Fixed at “L”)

I/O

External capacitor pin for cutting the low band of the ADIP amplifier

User operation amplifier output (Not used)

User operation amplifier inversion input (Fixed at “L”)

RF amplifier output

Groove RF signal is input with AC coupling

Groove RF signal output

• Abbreviation APC: Auto Power Control AGC: Auto Gain Control

Page 50

• IC151 CXD2662R Digital Signal Processor, Digital Servo Signal Processor (BD BOARD)

Pin No.

2 3 4 5 6 7 8 9

13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

31 to 34

36 to 40

41 42 43 44 45 46 47 48 49

50, 51

Pin Name I/O

MNT0 (FOK)

MNT1 (SHCK) MNT2 (XBUSY) MNT3 (SLOC) SWDT SCLK XLAT SRDT SENS XRST

SQSY

DQSY

RECP XINT TX OSCI OSCO XTSL DIN0 DIN1 DOUT DADTI LRCKI XBCKI ADDT DADT LRCK XBCK FS256 DVDD A03 to A00 A10 A04 to A08 A11 DVSS XOE XCAS A09 XRAS XWE D1 D0 D2, D3

Function

FOK signal output to the system control (monitor output)

“H” is output when focus is on Track jump detection signal output to the system control (monitor output)

Monitor 2 output to the system control (monitor output)

Monitor 3 output to the system control (monitor output)

Writing data signal input from the system control

Serial clock signal input from the system control

I (S)

Serial latch signal input from the system control

I (S)

Reading data signal output to the system control

O (3)

Internal status (SENSE) output to the system control

O (3)

Reset signal input from the system control “L”: Reset

I (S)

Subcode Q sync (SCOR) output to the system control

“L” is output every 13.3 msec. Almost all, “H” is output Digital In U-bit CD format or MD format subcode Q sync (SCOR) output to the system

control Laser power switching input from the system control “H”: Recording, “L”: Playback

Interrupt status output to the system control

Recording data output enable input from the system control

System clock input (512Fs=22.5792 MHz)

System clock output (512Fs=22.5792 MHz) (Not used)

System clock frequency setting “L”: 45.1584 MHz, “H”: 22.5792 MHz (Fixed at “H”)

Digital audio input (Optical input)

Digital audio output (Optical output)

Serial data input

LR clock input “H” : Lch, “L” : R ch

Serial data clock input

Data input from the A/D converter

Data output to the D/A converter

LR clock output for the A/D and D/A converter (44.1 kHz)

Bit clock output to the A/D and D/A converter (2.8224 MHz)

11.2896 MHz clock output (Not used)

+3V power supply (Digital)

—

DRAM address output

DRAM address output (Not used)

DRAM address output

DRAM address output (Not used)

Ground (Digital)

—

Output enable output for DRAM

CAS signal output for DRAM

Address output for DRAM

RAS signal output for DRAM

Write enable signal output for DRAM

I/O

Data input/output for DRAM

I/O I/O

* I (S) stands for Schmidt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O

Page 51

Pin No.

52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95

96 to 98

100

Pin Name I/O

MVCI ASYO ASYI AVDD BIAS RFI AVSS PCO FILI FILO CLTV PEAK BOTM ABCD FE AUX1 VC ADIO AVDD ADRT ADRB AVSS SE TE DCHG APC ADFG F0CNT XLRF CKRF DTRF APCREF TEST0 TRDR TFDR DVDD FFDR FRDR FS4 SRDR SFDR SPRD SPFD FGIN TEST1 to TEST3 DVSS EFMO

Function

Clock input from an external VCO (Fixed at “L”)

I (S)

Playback EFM duplex signal output

Playback EFM comparator slice level input

I (A)

+3V power supply (Analog)

—

Playback EFM comparator bias current input

I (A)

Playback EFM RF signal input

I (A)

Ground (Analog)

—

Phase comparison output for the recording/playback EFM master PLL

O (3)

Filter input for the recording/playback EFM master PLL

I (A)

Filter output for the recording/playback EFM master PLL

O (A)

Internal VCO control voltage input for the recording/playback EFM master PLL

I (A)

Light amount signal peak hold input from the CXA2523AR

I (A)

Light amount signal bottom hold input from the CXA2523AR

I (A)

Light amount signal input from the CXA2523AR

I (A)

Focus error signal input from the CXA2523AR

I (A)

Auxiliary A/D input

I (A)

Middle point voltage (+1.5V) input from the CXA2523AR

I (A)

Monitor output of the A/D converter input signal (Not used)

O (A)

+3V power supply (Analog)

—

A/D converter operational range upper limit voltage input (Fixed at “H”)

I (A)

A/D converter operational range lower limit voltage input (Fixed at “L”)

I (A)

Ground (Analog)

—

Sled error signal input from the CXA2523AR

I (A)

Tracking error signal input from the CXA2523AR

I (A)

Connected to +3V power supply

I (A)

Error signal input for the laser digital APC (Fixed at “L”)

I (A)

ADIP duplex FM signal input from the CXA2523AR (22.05 ± 1 kHz)

I (S)

Filter f

O O O O O O O O

—

O O O O O O O

I (S)

—

0 control output to the CXA2523AR

Control latch output to the CXA2523AR Control clock output to the CXA2523AR Control data output to the CXA2523AR Reference PWM output for the laser APC PWM output for the laser digital APC (Not used) Tracking servo drive PWM output (–) Tracking servo drive PWM output (+) +3V power supply (Digital) Focus servo drive PWM output (+) Focus servo drive PWM output (–)

176.4 kHz clock signal output (X’tal) (Not used) Sled servo drive PWM output (–) Sled servo drive PWM output (+) Spindle servo drive PWM output (–) Spindle servo drive PWM output (+)

Test input (Fixed at “L”)

Ground (Digital) EFM output when recording

• Abbreviation

EFM: Eight to Fourteen Modulation PLL : Phase Locked Loop VCO: Voltage Controlled Oscillator

Page 52

• IC300 M30805SGP (MAIN BOARD)

Pin No.

1 DATA(FL) O Serial data signal output to the display driver 2 CLK(FL) O Serial clock signal output to the display driver L: Active 3 A1-IN I Fixed at H (Pull-up) 4 SIRCS I Remote control input

5, 6 NC — Not used

7 LED O LCD back light ON/lOFF signal output 8 MUTE O Mute signal output

9 A/D,D/A RESET O A/D, D/A (AK4524-TP) reset signal output 10 A/D, D/A LATCH O A/D, D/A (AK4524-TP) chip sekect signal output 11 LD-LOW O Loading motor voltage control output L: High voltage H: Low voltage 12 LDIN I Loading motor control input H: IN 13 LDOUT O Loading motor control output H: OUT 14 MOD O Laser modulation switching signal output L: OFF H: ON 15 BYTE I Data bus changed input (Connected to ground) 16 CNVSS — Ground 17 XIN-T I Not used 18 XOUT-T O Not used 19 RESET I System rest input L : reset 20 XOUT O Main clock output (10MHz) 21 VSS — Ground 22 XIN I Main clock input (10MHz) 23 VCC — Power supply (+3.3V) 24 NMI I Fixed at H (Pull-up) 25 DQSY I Digital in sync input 26 PDOWN I Power down detection input L: Power down 27 SQSY I ADIP (MO) sync or subcode Q (PIT) sync input from CXD2662R (Playback system) 28 K.B-CLK I Fixed at H (Pull-up) 29 LDON O Laser ON/OFF control output H: Laser ON 30 LIMIT-IN I Detection input from the limit switch L: Sled limit-In H: Sled limit-Out 31 A1 OUT O Not used 32 XINIT I Interrupt status input from CXD2662R 33 BEEP O Not used 34 LRCK1 O Not used 35 WR PWR O Write power ON/OFF output L: OFF H: ON 36 IIC CLK O IIC clock output 37 IIC DATA I/O IIC data input/output to the CONTROL-I 38 SWDT O Writing data signal output to the serial bus 39 VCC — Power supply (+3.3V) 40 SRDT I Reading data signal input from the serial bus 41 VSS — Ground 42 SCLK O Clock signal output to the serial bus 43 REC-SW I Detection signal input from the recording position detection switch L: REC 44 CLIP DATA O CLIP serial data output 45 CLIP DATA I CLIP serial data input 46 CLIP CLK O CLIP serial clock output (Not used) 47 DIG-RST O Digital rest signal output to the CXD2662R and motor driver L: Reset 48 SENS I Internal status (SENSE) input from the CXD2662R 49 PLAY-SW I Detection signal input from the playback position detection switch L: PLAY 50 XLATCH O Latch signal output to the serial bus 51 OUT-SW I Detection signal input from the loading out detection switch 52 RDY I Fixed at H (Pull-up) 53 ALE/RAS O Microprocessor mode output (Not used) 54 HOLD I Fixed at H (Pull-up) 55 HLDA/ALE O Microprocessor mode output (Not used) 56 XBUSY (MNT2) I In the state of executive command from the CXD2662R 57 VSS — Ground

I/O

FunctionPin Name

Page 53

FunctionPin NamePin No. I/O

58 SHCK (MNT1) I Track jump signal input from the CXD2662R 59 VCC — Power supply (+3.3V) 60 EEP-WP O EEP-ROM write protect signal output L: write possibility 61 SDA I/O Data signal input/output pin with the EEP-ROM 62 BUSCLK O Not used 63 OE O Not used 64 CASH O Not used 65 WE R/W O Write signal output 66 SCL O Clock signal output to the EEP-ROM 67 REFLECT-SW I Disk reflection rate detection input from the reflect detection switch H: Disk with low reflection rate 68 PROTECT-SW I Recording-protection claw detection input from the protection detection switch H: Protect 69 CS0 O Chip select signal output to the Flash ROM 70 CS1 O Not used 71 CS2 O Not used 72 A20 O Address bus signal output to Flash ROM (Not used) 73 A19 O Address bus signal output to Flash ROM 74 VCC — Power supply (+3.3V) 75 A18 O Address bus signal output to Flash ROM

76 VSS — Ground 77 to 85 A17 to A9 O Address bus signal output to Flash ROM 86 to 89 MODEL SEL-1-4 O Not used

90 WP O Write protect signal to the Flash ROM

91 VCC — Power supply (+3.3V)

92 A8 O Address bus signal output to Flash ROM

93 VSS — Ground

94 to 100 A7 to A1 O Address bus signal output to Flash ROM

101 A0 LB O Not used

102 to 113 D15 to D4 I/O Data bus signal input/output to the Flash ROM

114 KB.CLK-CTL O Not used 115 IIC BUSY I IIC busy signal input 116 KB DATA I fixed at H (Pull-up) 117 REC-VOL-B O Not used 118 REC-VOL-A O Not used

119 to 122 D3 to D0 I/O Data bus signal input/output to the Flash ROM

123 JOG0 I JOG encoder signal input 124 JOG1 I JOG encoder signal input 125 LATCH (AD) O Not used 126 REC O Not used 127 L: DIN1/H: CLIP O Not used 128 CS (FL) O Chip select signal output to the display driver 129 POWER (IIC) O CONTROL-I power ON/OFF signal output 130 VSS — Ground 131 STB O Strobe signal output (Not used) 132 VCC — Power supply. (+3.3V) 133 IOP I Optical Pick-up IR power level detect signal input 134 A/D 6 I Not used 135 A/D-5 I Not used 136 TIMER/BEEP SW I Fixed at H (pull up) 137 KEY3 I Fixed at H (pull up) 138 KEY2 I Key input pin (A/D input) 139 KEY 1 I Key input pin (A/D input) 140 AVSS — Ground (Analog) 141 KEY0 I Key input pin (A/D input) 142 VREF I A/D reference voltage (Conect in sys 3.3V) 143 AVCC — BAK 3.3V 144 NC I Not used

Page 54

NOTE:

• -XX, -X mean standardized parts, so they may have some differences from the original one.

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• The mechanical parts with no reference number in the exploded views are not supplied.

• Hardware (# mark) list and accessories and packing materials are given in the last of this parts list.

7-1. CHASSIS SECTION

not supplied

SECTION 7

EXPLODED VIEWS

• Abbreviation CND : Canadian model SP : Singapore model MY : Malaysia model

The components identified by mark 0 or dotted line with mark 0 are critical for safety . Replace only with part number specified.

Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.

15 14

MDM-7A

not supplied

not supplied (PANEL board)

LCD701

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

1 4-230-473-01 CASE(B) 2 7-685-647-79 SCREW+BVTP 3X10 TYPE2 N-S

* 3 4-978-398-21 CUSHION

4 4-230-482-01 KNOB(AMS) 5 X-4953-181-1 PANELASSY, FRONT

16 7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S 17 4-230-472-01 CASE(U)

* 18 1-565-514-11 SOCKET, CONNECTOR 2P

19 1-792-812-11 WIRE(FLAT TYPE) (27 CORE) 20 1-792-811-11 WIRE(FLAT TYPE) (23 CORE)

6 4-230-848-71 LID (MD) 7 4-228-630-11 SPRING (LID), TENSION COIL 8 1-804-189-11 LIGHT, LCD BACK

11 1-757-134-11 WIRE(FLAT TYPE) (13 CORE) 12 4-951-620-01 SCREW (2.6X8), +BVTP 13 7-685-870-01 SCREW +BVTT 3X5 (S) 14 4-228-689-01 INSULATOR 15 4-228-643-21 SCREW (+BVTTWH M3), STEP

21 A-4725-377-A MAINBOARD, COMPLETE (US) 21 A-4725-378-A MAINBOARD, COMPLETE (CND) 21 A-4725-379-A MAINBOARD, COMPLETE (AEP) 21 A-4725-380-A MAINBOARD, COMPLETE (UK) 21 A-4725-381-A MAINBOARD, COMPLETE (MY,SP)

22 4-230-476-11 PANEL, BACK 23 7-682-248-04 SCREW (+K 3X8) LCD701 1-804-188-11 LCD MODULE

Page 55

7-2. MECHANISM SECTION-1

(MDM-7A)

not supplied

319

302

311

308

310

309

304

306

312

305

321

317

303

313

314

315

316

305

318

307

320

302

301

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

* 301 4-996-267-01 BASE (BU-D)

302 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI 303 4-227-007-01 GEAR (SB) 304 4-227-025-01 BELT (LOADING) 305 3-372-761-01 SCREW (M1.7), TAPPING

306 4-227-002-01 GEAR, PULLEY 307 4-226-999-01 LEVER (HEAD) 308 X-4952-665-1 SPRING (SHT) ASSY, LEAF 309 4-228-923-01 LOCK (HOLDER) 310 4-229-533-02 SPRING (STOPPER), TORSION

311 4-231-118-01 SPRING (HOLDER), TENSION

312 4-227-019-02 PLATE (HOLDER), RETAINER 313 4-227-013-01 SPRING (EJ), TENSION 314 4-226-995-01 SLIDER (EJ)

315 4-226-996-01 LIMITTER (EJ) 316 4-226-997-04 SLIDER 317 4-226-998-01 LEVER (CHG) 318 4-227-006-01 GEAR (SA) 319 A-4735-075-A HOLDER ASSY

320 4-226-994-01 GUIDE (L) 321 7-685-850-04 SCREW +BVTT 2X3 (S)

Page 56

7-3. MECHANISM SECTION-2

(MDM-7A)

359

HR901

357

368

352

S102

355

354

358

367

M101

362

356

359

361

364

360

369

362

366

353

365

353

352

363

353

M102

353

M103

351

352

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

351 A-4725-054-A BDBOARD, COMPLETE 352 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI 353 3-372-761-01 SCREW (M1.7), TAPPING 354 4-226-993-01 RACK 355 4-227-014-01 SPRING (RACK), COMPRESSION

356 4-226-992-01 BASE, SL 357 1-678-514-11 FLEXIBLE BOARD

0 358 A-4672-541-A OPTICAL PICK-UP KMS-260B/J1N

359 4-988-560-01 SCREW (+P 1.7X6) 360 4-996-265-01 SHAFT, MAIN

361 4-226-989-01 CHASSIS 362 4-211-036-01 SCREW (1.7X2.5), +PWH

363 4-226-990-01 BASE (BU-A) 364 4-227-023-01 SPRING (SPINDLE), TORSION 365 4-227-004-01 GEAR (LC)

366 4-227-005-01 GEAR (LD) 367 4-227-009-01 GEAR (SD) 368 4-227-008-01 GEAR (SC) 369 7-685-204-19 SCREW +KTP 2X6 TYPE2 NON-SLIT M101 A-4672-898-A MOTOR ASSY, SPINDLE

M102 A-4672-900-A MOTOR ASSY, SLED M103 A-4672-975-A MOTOR ASSY, LOADING S102 1-771-957-11 SWITCH, PUSH (2 KEY) (REFLECT/PROTECT SW) HR901 1-500-670-12 HEAD, OVER LIGHT

The components identified by mark 0 or dotted line with mark 0 are critical for safety . Replace only with part number specified.

Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.

Page 57

SECTION 8

ELECTRICAL PARTS LIST

NOTE:

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.

• -XX, -X mean standardized parts, so they may have some difference from the original one.

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• CAPACITORS: uF: µF

• RESISTORS All resistors are in ohms. METAL: metal-film resistor METAL OXIDE: Metal Oxide-film resistor F: nonflammable

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

A-4725-054-A BD BOARD, COMPLETE

******************

< CAPACITOR >

C101 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V C102 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V C103 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C104 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C105 1-115-416-11 CERAMIC CHIP 0.001uF 5% 25V

C106 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C107 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C108 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V C109 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16V C110 1-163-038-11 CERAMIC CHIP 0.1uF 25V

C111 1-117-720-11 CERAMIC CHIP 4.7uF 10V C112 1-110-563-11 CERAMIC CHIP 0.068uF 10% 16V C113 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C114 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V C115 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V

C116 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V C117 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C118 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16V C119 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16V C120 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C121 1-164-156-11 CERAMIC CHIP 0.1uF 25V C125 1-117-720-11 CERAMIC CHIP 4.7uF 10V C128 1-164-156-11 CERAMIC CHIP 0.1uF 25V C131 1-117-720-11 CERAMIC CHIP 4.7uF 10V C132 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C133 1-164-156-11 CERAMIC CHIP 0.1uF 25V C141 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C142 1-164-156-11 CERAMIC CHIP 0.1uF 25V C143 1-164-156-11 CERAMIC CHIP 0.1uF 25V C144 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C145 1-164-156-11 CERAMIC CHIP 0.1uF 25V C146 1-117-720-11 CERAMIC CHIP 4.7uF 10V C147 1-117-720-11 CERAMIC CHIP 4.7uF 10V C151 1-117-370-11 CERAMIC CHIP 10uF 10V C152 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C153 1-164-156-11 CERAMIC CHIP 0.1uF 25V C154 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C155 1-164-156-11 CERAMIC CHIP 0.1uF 25V C156 1-164-156-11 CERAMIC CHIP 0.1uF 25V C157 1-164-156-11 CERAMIC CHIP 0.1uF 25V

• COILS uH: µH

• SEMICONDUCTORS In each case, u: µ, for example: uA...: µA... , uPA... , µPA... , uPB... , µPB... , uPC... , µPC... , uPD..., µPD...

• Abbreviation CND : Canadian model SP : Singapore model MY : Malaysia model

When indicating parts by reference number, please include the board name.

The components identified by mark 0 or dotted line with mark 0 are critical for safety . Replace only with part number specified.

Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.

C158 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C159 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C160 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C161 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V C162 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C163 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V C164 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C165 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V C166 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V C167 1-164-245-11 CERAMIC CHIP 0.015uF 10% 25V

C169 1-164-156-11 CERAMIC CHIP 0.1uF 25V C171 1-164-156-11 CERAMIC CHIP 0.1uF 25V C172 1-164-156-11 CERAMIC CHIP 0.1uF 25V C180 1-117-370-11 CERAMIC CHIP 10uF 10V C181 1-126-206-11 ELECT CHIP 100uF 20% 6.3V

C182 1-163-038-11 CERAMIC CHIP 0.1uF 25V C183 1-164-156-11 CERAMIC CHIP 0.1uF 25V C184 1-117-970-11 ELECT CHIP 22uF 20% 10V C185 1-131-872-91 CERAMIC CHIP 1000PF 10% 630V C191 1-126-206-11 ELECT CHIP 100uF 20% 6.3V

C192 1-164-156-11 CERAMIC CHIP 0.1uF 25V C193 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C194 1-164-156-11 CERAMIC CHIP 0.1uF 25V C195 1-164-156-11 CERAMIC CHIP 0.1uF 25V C196 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C1401 1-117-720-11 CERAMIC CHIP 4.7uF 10V

< CONNECTOR >

CN101 1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P CN102 1-784-835-21 CONNECTOR,FFC(LIF(NON-ZIF))27P CN103 1-784-834-21 CONNECTOR,FFC(LIF(NON-ZIF))23P

* CN104 1-580-055-21 PIN, CONNECTOR (SMD) 2P

CN105 1-784-859-21 CONNECTOR, FFC(LIF(NON-ZIF))7P

< DIODE >

D101 8-719-988-61 DIODE 1SS355TE-17 D181 8-719-080-81 DIODE DIODE FS1J6 D183 8-719-080-81 DIODE DIODE FS1J6

< IC >

IC101 8-752-080-95 IC CXA2523AR IC102 8-759-473-51 IC TLV2361CDBV IC141 8-759-430-25 IC BH6511FS IC151 8-752-404-64 IC IC CXD2662R IC153 8-759-671-27 IC IC MSM51V4400E-70TS-K

Page 58

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

R111 1-216-833-11 METAL CHIP 10K 5% 1/16W IC171 8-759-096-87 IC TC7WU04FU(TE12R) IC181 8-759-481-17 IC MC74ACT08DTR2 IC190 8-759-460-72 IC BA033FP-E2 IC195 8-759-640-41 IC IC BR24C08F-E2

R112 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R113 1-216-833-11 METAL CHIP 10K 5% 1/16W

R114 1-216-827-11 METAL CHIP 3.3K 5% 1/16W

R115 1-216-833-11 METAL CHIP 10K 5% 1/16W

< JUMPER RESISTOR >

JW201 1-216-295-11 SHORT 0 JW202 1-216-295-11 SHORT 0 JW203 1-216-295-11 SHORT 0 JW903 1-216-295-11 SHORT 0 JW904 1-216-295-11 SHORT 0

< COIL >

L101 1-500-245-11 INDUCTOR 0uH L102 1-500-245-11 INDUCTOR 0uH L103 1-500-245-11 INDUCTOR 0uH L105 1-414-235-22 INDUCTOR 0uH L106 1-500-245-11 INDUCTOR 0uH

L121 1-500-245-11 INDUCTOR 0uH L122 1-500-245-11 INDUCTOR 0uH L131 1-500-245-11 INDUCTOR 0uH L141 1-412-029-11 INDUCTOR CHIP 10uH L142 1-412-032-11 INDUCTOR CHIP 100uH

L143 1-412-029-11 INDUCTOR CHIP 10uH L144 1-412-032-11 INDUCTOR CHIP 100uH L145 1-412-032-11 INDUCTOR CHIP 100uH L146 1-469-855-21 FERRITE 0uH L147 1-469-855-21 FERRITE 0uH

L161 1-500-245-11 INDUCTOR 0uH L171 1-500-245-11 INDUCTOR 0uH L180 1-469-855-21 FERRITE 0uH L181 1-469-855-21 FERRITE 0uH L182 1-500-245-11 INDUCTOR 0uH

L183 1-216-296-91 SHORT 0 L184 1-216-296-91 SHORT 0

< TRANSISTOR >

Q101 8-729-403-35 TRANSISTOR UN5113 Q121 8-729-403-35 TRANSISTOR UN5113 Q122 8-729-101-07 TRANSISTOR 2SB798-DL Q131 8-729-026-53 TRANSISTOR 2SA1576A-T106-QR Q132 8-729-903-10 TRANSISTOR FMW1

Q133 8-729-402-93 TRANSISTOR UN5214-TX Q134 8-729-402-93 TRANSISTOR UN5214-TX Q181 8-729-018-75 TRANSISTOR 2SJ278MY Q182 8-729-017-65 TRANSISTOR 2SK1764KY

< RESISTOR >

R101 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R102 1-216-853-11 METAL CHIP 470K 5% 1/16W R103 1-216-863-11 RES-CHIP 3.3M 5% 1/16W R104 1-216-853-11 METAL CHIP 470K 5% 1/16W R105 1-216-825-11 METAL CHIP 2.2K 5% 1/16W

R106 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R107 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R108 1-216-833-11 METAL CHIP 10K 5% 1/16W R109 1-216-845-11 METAL CHIP 100K 5% 1/16W R110 1-216-845-11 METAL CHIP 100K 5% 1/16W

R116 1-216-839-11 METAL CHIP 33K 5% 1/16W

R117 1-216-837-11 METAL CHIP 22K 5% 1/16W

R118 1-218-855-11 METAL CHIP 2.2K 0.5% 1/16W

R119 1-218-863-11 METAL CHIP 4.7K 0.5% 1/16W

R120 1-218-889-11 METAL CHIP 56K 0.5% 1/16W

R121 1-218-863-11 METAL CHIP 4.7K 0.5% 1/16W

R122 1-218-855-11 METAL CHIP 2.2K 0.5% 1/16W

R123 1-216-819-11 METAL CHIP 680 5% 1/16W

R124 1-216-809-11 METAL CHIP 100 5% 1/16W

R125 1-216-815-11 METAL CHIP 330 5% 1/16W

R126 1-216-819-11 METAL CHIP 680 5% 1/16W

R127 1-216-845-11 METAL CHIP 100K 5% 1/16W

R128 1-219-724-11 METAL CHIP 1 1% 1/4W

R129 1-216-298-00 METAL CHIP 2.2 5% 1/10W

R130 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R131 1-216-833-11 METAL CHIP 10K 5% 1/16W

R132 1-216-841-11 METAL CHIP 47K 5% 1/16W

R133 1-216-821-11 METAL CHIP 1K 5% 1/16W

R134 1-216-821-11 METAL CHIP 1K 5% 1/16W

R135 1-216-821-11 METAL CHIP 1K 5% 1/16W

R136 1-216-295-11 SHORT 0

R138 1-216-833-11 METAL CHIP 10K 5% 1/16W

R150 1-216-833-11 METAL CHIP 10K 5% 1/16W

R151 1-216-833-11 METAL CHIP 10K 5% 1/16W

R154 1-216-833-11 METAL CHIP 10K 5% 1/16W

R155 1-216-864-11 METAL CHIP 0 5% 1/16W

R156 1-216-864-11 METAL CHIP 0 5% 1/16W

R157 1-216-809-11 METAL CHIP 100 5% 1/16W

R158 1-216-809-11 METAL CHIP 100 5% 1/16W

R159 1-216-833-11 METAL CHIP 10K 5% 1/16W

R160 1-216-833-11 METAL CHIP 10K 5% 1/16W

R161 1-216-833-11 METAL CHIP 10K 5% 1/16W

R163 1-216-809-11 METAL CHIP 100 5% 1/16W

R164 1-216-809-11 METAL CHIP 100 5% 1/16W

R165 1-216-809-11 METAL CHIP 100 5% 1/16W

R167 1-216-833-11 METAL CHIP 10K 5% 1/16W

R168 1-216-845-11 METAL CHIP 100K 5% 1/16W

R169 1-216-855-11 METAL CHIP 680K 5% 1/16W

R170 1-216-827-11 METAL CHIP 3.3K 5% 1/16W

R171 1-216-821-11 METAL CHIP 1K 5% 1/16W

R173 1-216-821-11 METAL CHIP 1K 5% 1/16W

R174 1-216-811-11 METAL CHIP 150 5% 1/16W

R175 1-216-857-11 METAL CHIP 1M 5% 1/16W

R176 1-216-809-11 METAL CHIP 100 5% 1/16W

R179 1-216-295-11 SHORT 0

R181 1-216-841-11 METAL CHIP 47K 5% 1/16W

R182 1-216-841-11 METAL CHIP 47K 5% 1/16W

R183 1-216-841-11 METAL CHIP 47K 5% 1/16W

R184 1-220-942-11 METAL CHIP 3.3 1% 1/4W

R185 1-220-942-11 METAL CHIP 3.3 1% 1/4W

R195 1-216-833-11 METAL CHIP 10K 5% 1/16W

R196 1-216-833-11 METAL CHIP 10K 5% 1/16W

R197 1-216-833-11 METAL CHIP 10K 5% 1/16W

R218 1-216-864-11 METAL CHIP 0 5% 1/16W

Page 59

BD MAIN

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

< SWITCH >

C319 1-164-156-11 CERAMIC CHIP 0.1uF 25V

S101 1-762-596-21 SWITCH, PUSH (1 KEY) (LIMIT IN SW) S103 1-771-956-21 SWITCH, PUSH (1 KEY) (OUT SW) S104 1-771-955-21 SWITCH, PUSH (1 KEY) (PLAY SW) S105 1-771-955-21 SWITCH, PUSH (1 KEY) (REC SW)

**************************************************************

A-4725-377-A MAIN BOARD, COMPLETE (US)

*************************

A-4725-378-A MAIN BOARD, COMPLETE (CND)

**************************

A-4725-379-A MAIN BOARD, COMPLETE (AEP)

**************************

A-4725-380-A MAIN BOARD, COMPLETE (UK)

*************************

A-4725-381-A MAIN BOARD, COMPLETE (MY,SP)

****************************

< CAPACITOR >

C100 1-115-156-11 CERAMIC CHIP 1uF 10V C101 1-115-156-11 CERAMIC CHIP 1uF 10V C151 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C152 1-128-551-11 ELECT 22uF 20% 25V C153 1-128-551-11 ELECT 22uF 20% 25V

C161 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C165 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C166 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C176 1-128-551-11 ELECT 22uF 20% 25V C177 1-164-230-11 CERAMIC CHIP 220PF 5% 50V

C180 1-126-960-11 ELECT 1uF 20% 50V C181 1-126-934-11 ELECT 220uF 20% 10V C182 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C251 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C252 1-128-551-11 ELECT 22uF 20% 25V

C253 1-128-551-11 ELECT 22uF 20% 25V C261 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C265 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C266 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C276 1-128-551-11 ELECT 22uF 20% 25V

C277 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C280 1-126-960-11 ELECT 1uF 20% 50V C281 1-126-934-11 ELECT 220uF 20% 10V C282 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C301 1-126-791-11 ELECT 10uF 20% 16V

C302 1-164-156-11 CERAMIC CHIP 0.1uF 25V C304 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C306 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C307 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C308 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C309 1-164-156-11 CERAMIC CHIP 0.1uF 25V C311 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C312 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C313 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C314 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C315 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C316 1-164-156-11 CERAMIC CHIP 0.1uF 25V C317 1-164-156-11 CERAMIC CHIP 0.1uF 25V C318 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C320 1-164-156-11 CERAMIC CHIP 0.1uF 25V C321 1-801-862-11 VARISTOR, CHIP 1050PF 7.5V C401 1-164-156-11 CERAMIC CHIP 0.1uF 25V C402 1-164-156-11 CERAMIC CHIP 0.1uF 25V C404 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C406 1-164-156-11 CERAMIC CHIP 0.1uF 25V C407 1-128-547-11 ELECT 6800uF 20% 16V C408 1-164-156-11 CERAMIC CHIP 0.1uF 25V C409 1-164-156-11 CERAMIC CHIP 0.1uF 25V C410 1-119-879-11 ELECT 15uF 16V

C412 1-119-765-11 ELECT 47uF 20% 6.3V C413 1-126-926-11 ELECT 1000uF 20% 10V C414 1-164-156-11 CERAMIC CHIP 0.1uF 25V C415 1-164-156-11 CERAMIC CHIP 0.1uF 25V C416 1-126-934-11 ELECT 220uF 20% 10V

C420 1-165-112-11 CERAMIC CHIP 0.33uF 16V C421 1-164-156-11 CERAMIC CHIP 0.1uF 25V C430 1-126-926-11 ELECT 1000uF 20% 10V C431 1-164-156-11 CERAMIC CHIP 0.1uF 25V C432 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C441 1-164-156-11 CERAMIC CHIP 0.1uF 25V C450 1-126-934-11 ELECT 220uF 20% 10V C451 1-164-156-11 CERAMIC CHIP 0.1uF 25V C452 1-164-156-11 CERAMIC CHIP 0.1uF 25V C453 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C454 1-164-156-11 CERAMIC CHIP 0.1uF 25V C456 1-126-934-11 ELECT 220uF 20% 10V C457 1-126-934-11 ELECT 220uF 20% 10V C458 1-126-934-11 ELECT 220uF 20% 10V C459 1-115-156-11 CERAMIC CHIP 1uF 10V

C460 1-104-664-11 ELECT 47uF 20% 10V C461 1-164-156-11 CERAMIC CHIP 0.1uF 25V C462 1-164-156-11 CERAMIC CHIP 0.1uF 25V C500 1-126-934-11 ELECT 220uF 20% 10V C501 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C502 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V C503 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V C504 1-104-665-11 ELECT 100uF 20% 10V C505 1-164-156-11 CERAMIC CHIP 0.1uF 25V C506 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C507 1-164-156-11 CERAMIC CHIP 0.1uF 25V C515 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C516 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C517 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C519 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C520 1-126-934-11 ELECT 220uF 20% 10V C522 1-164-156-11 CERAMIC CHIP 0.1uF 25V C523 1-104-665-11 ELECT 100uF 20% 10V C524 1-164-156-11 CERAMIC CHIP 0.1uF 25V C540 1-216-864-11 METAL CHIP 0 5% 1/16W

C550 1-104-665-11 ELECT 100uF 20% 10V C551 1-164-156-11 CERAMIC CHIP 0.1uF 25V C552 1-162-910-11 CERAMIC CHIP 5PF 0.25PF 50V C553 1-162-917-11 CERAMIC CHIP 15PF 5% 50V C554 1-216-813-11 METAL CHIP 220 5% 1/16W

C555 1-164-156-11 CERAMIC CHIP 0.1uF 25V C556 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C601 1-164-156-11 CERAMIC CHIP 0.1uF 25V

Page 60

MAIN

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

C611 1-164-156-11 CERAMIC CHIP 0.1uF 25V C613 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C661 1-164-156-11 CERAMIC CHIP 0.1uF 25V C662 1-104-665-11 ELECT 100uF 20% 10V C800 1-164-156-11 CERAMIC CHIP 0.1uF 25V C804 1-164-156-11 CERAMIC CHIP 0.1uF 25V C814 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C851 1-216-864-11 METAL CHIP 0 5% 1/16W C852 1-216-864-11 METAL CHIP 0 5% 1/16W C853 1-216-864-11 METAL CHIP 0 5% 1/16W C854 1-216-864-11 METAL CHIP 0 5% 1/16W C856 1-164-156-11 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

CN100 1-573-798-11 JACK, MINIATURE (DIA. 3.5) (ANALOG IN) CN101 1-784-384-11 CONNECTOR, FFC/FPC 27P CN102 1-793-991-11 CONNECTOR, FFC/FPC 23P CN103 1-784-373-21 CONNECTOR, FFC/FPC 14P CN200 1-573-798-11 JACK, MINIATURE

(DIA. 3.5) (ANALOG OUT (VARIABLE))

L151 1-216-864-11 METAL CHIP 0 5% 1/16W

L178 1-414-760-21 FERRITE 0uH

L180 1-414-760-21 FERRITE 0uH

L251 1-216-864-11 METAL CHIP 0 5% 1/16W

L278 1-414-760-21 FERRITE 0uH

L280 1-414-760-21 FERRITE 0uH

L400 1-424-674-11 INDUCTOR 22uH

L501 1-414-760-21 FERRITE 0uH

L502 1-414-760-21 FERRITE 0uH

L503 1-414-760-21 FERRITE 0uH

L504 1-216-864-11 METAL CHIP 0 5% 1/16W

L550 1-414-760-21 FERRITE 0uH

L551 1-164-156-11 CERAMIC CHIP 0.1uF 25V

L552 1-414-760-21 FERRITE 0uH

L553 1-412-979-21 INDUCTOR 1uH

L611 1-216-864-11 METAL CHIP 0 5% 1/16W

L661 1-216-864-11 METAL CHIP 0 5% 1/16W

L801 1-216-864-11 METAL CHIP 0 5% 1/16W

< COIL >

* CN420 1-565-513-11 PIN, CONNECTOR 2P

< DIODE >

D155 8-719-988-61 DIODE 1SS355TE-17 D156 8-719-988-61 DIODE 1SS355TE-17 D255 8-719-988-61 DIODE 1SS355TE-17 D256 8-719-988-61 DIODE 1SS355TE-17 D301 8-719-941-09 DIODE DAP202U

D400 8-719-313-73 DIODE SFPB-52 D402 8-719-313-73 DIODE SFPB-52 D421 8-719-988-61 DIODE 1SS355TE-17 D422 8-719-074-34 DIODE RB495D-T146

< GROUND TERMINAL >

EP550 1-537-771-21 TERMINAL BOARD, GROUND

< IC >

IC300 8-759-698-95 IC M30805SGP IC301 8-759-827-38 IC MT28F800B3WG-10T-PC3 IC400 8-759-485-63 IC MAX1626ESA-TE2 IC401 8-759-712-90 IC XC61FN3012MR IC402 8-759-460-72 IC BA033FP-E2

IC420 8-759-565-74 IC M62016FP-E1 IC440 8-759-481-19 IC LB1830M-S-TE-L IC450 8-759-450-47 IC BA05T IC451 8-759-712-91 IC XC6351A120MR IC500 8-759-579-68 IC AK4524

IC501 8-759-358-47 IC NJM2115V(TE2) IC502 8-759-358-47 IC NJM2115V(TE2) IC503 8-759-713-72 IC BH3541F-E2 IC550 8-759-591-61 IC TC7WHU04FU IC600 8-759-096-87 IC TC7WU04FU(TE12R)

IC611 8-749-012-70 IC GP1F38R (DIGITAL OPTICAL IN) IC661 8-749-012-69 IC GP1F38T (DIGITAL OPTICAL OUT) IC800 8-759-549-80 IC P82B715TD.118

< TRANSISTOR >

Q100 8-729-015-74 TRANSISTOR UN5111

Q170 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO

Q270 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO

Q400 8-729-036-99 TRANSISTOR HAT1020R-EL

Q440 8-729-015-76 TRANSISTOR UN5211

Q450 8-729-194-57 TRANSISTOR 2SC945-P

Q451 8-729-015-76 TRANSISTOR UN5211

< RESISTOR >

R151 1-216-839-11 METAL CHIP 33K 5% 1/16W

R152 1-216-835-11 METAL CHIP 15K 5% 1/16W

R153 1-216-849-11 METAL CHIP 220K 5% 1/16W

R155 1-216-805-11 METAL CHIP 47 5% 1/16W

R161 1-216-833-11 METAL CHIP 10K 5% 1/16W

R162 1-216-833-11 METAL CHIP 10K 5% 1/16W

R163 1-216-833-11 METAL CHIP 10K 5% 1/16W

R164 1-216-833-11 METAL CHIP 10K 5% 1/16W

R165 1-218-716-11 METAL CHIP 10K 0.5% 1/16W

R166 1-218-716-11 METAL CHIP 10K 0.5% 1/16W

R170 1-216-833-11 METAL CHIP 10K 5% 1/16W

R176 1-216-819-11 METAL CHIP 680 5% 1/16W

R177 1-216-845-11 METAL CHIP 100K 5% 1/16W

R178 1-216-815-11 METAL CHIP 330 5% 1/16W

R180 1-216-789-11 METAL CHIP 2.2 5% 1/16W

R181 1-216-821-11 METAL CHIP 1K 5% 1/16W

R251 1-216-839-11 METAL CHIP 33K 5% 1/16W

R252 1-216-835-11 METAL CHIP 15K 5% 1/16W

R253 1-216-849-11 METAL CHIP 220K 5% 1/16W

R255 1-216-805-11 METAL CHIP 47 5% 1/16W

R261 1-216-833-11 METAL CHIP 10K 5% 1/16W

R262 1-216-833-11 METAL CHIP 10K 5% 1/16W

R263 1-216-833-11 METAL CHIP 10K 5% 1/16W

R264 1-216-833-11 METAL CHIP 10K 5% 1/16W

R265 1-218-716-11 METAL CHIP 10K 0.5% 1/16W

< JACK >

J180 1-507-678-51 JACK (PHONES) J400 1-691-452-11 JACK,DC(POLARITY UNIFIET TYPE) (DC IN 9V) J800 1-580-394-11 CONNECTOR, DIN 6P (PC LINK)

R266 1-218-716-11 METAL CHIP 10K 0.5% 1/16W

R270 1-216-833-11 METAL CHIP 10K 5% 1/16W

R276 1-216-819-11 METAL CHIP 680 5% 1/16W

R277 1-216-845-11 METAL CHIP 100K 5% 1/16W

R278 1-216-815-11 METAL CHIP 330 5% 1/16W

Page 61

MAIN PANEL

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

R280 1-216-789-11 METAL CHIP 2.2 5% 1/16W R281 1-216-821-11 METAL CHIP 1K 5% 1/16W R301 1-216-864-11 METAL CHIP 0 5% 1/16W R302 1-216-864-11 METAL CHIP 0 5% 1/16W R303 1-216-864-11 METAL CHIP 0 5% 1/16W

R304 1-216-864-11 METAL CHIP 0 5% 1/16W R305 1-216-864-11 METAL CHIP 0 5% 1/16W R306 1-216-864-11 METAL CHIP 0 5% 1/16W R307 1-216-833-11 METAL CHIP 10K 5% 1/16W R308 1-216-833-11 METAL CHIP 10K 5% 1/16W

R309 1-216-833-11 METAL CHIP 10K 5% 1/16W R310 1-216-833-11 METAL CHIP 10K 5% 1/16W R311 1-216-833-11 METAL CHIP 10K 5% 1/16W R312 1-216-833-11 METAL CHIP 10K 5% 1/16W R313 1-216-833-11 METAL CHIP 10K 5% 1/16W

R314 1-216-833-11 METAL CHIP 10K 5% 1/16W R315 1-216-833-11 METAL CHIP 10K 5% 1/16W R316 1-216-833-11 METAL CHIP 10K 5% 1/16W R317 1-216-833-11 METAL CHIP 10K 5% 1/16W R318 1-216-833-11 METAL CHIP 10K 5% 1/16W

R601 1-216-841-11 METAL CHIP 47K 5% 1/16W

R800 1-216-864-11 METAL CHIP 0 5% 1/16W R801 1-216-864-11 METAL CHIP 0 5% 1/16W R803 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R804 1-216-821-11 METAL CHIP 1K 5% 1/16W R805 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R806 1-216-833-11 METAL CHIP 10K 5% 1/16W R807 1-216-839-11 METAL CHIP 33K 5% 1/16W R808 1-216-833-11 METAL CHIP 10K 5% 1/16W R809 1-216-864-11 METAL CHIP 0 5% 1/16W

R810 1-216-864-11 METAL CHIP 0 5% 1/16W

< COMPOSITION CIRCUIT BLOCK >

RB301 1-236-908-11 NETWORK RESISTOR (CHIP) 10K RB302 1-236-908-11 NETWORK RESISTOR (CHIP) 10K RB303 1-236-908-11 NETWORK RESISTOR (CHIP) 10K RB304 1-236-908-11 NETWORK RESISTOR (CHIP) 10K

< TRANSFORMER >

R319 1-216-833-11 METAL CHIP 10K 5% 1/16W R320 1-216-833-11 METAL CHIP 10K 5% 1/16W R321 1-216-833-11 METAL CHIP 10K 5% 1/16W R322 1-216-833-11 METAL CHIP 10K 5% 1/16W R323 1-216-833-11 METAL CHIP 10K 5% 1/16W

R324 1-216-833-11 METAL CHIP 10K 5% 1/16W R325 1-216-833-11 METAL CHIP 10K 5% 1/16W R326 1-216-845-11 METAL CHIP 100K 5% 1/16W R327 1-216-845-11 METAL CHIP 100K 5% 1/16W R329 1-216-833-11 METAL CHIP 10K 5% 1/16W

R330 1-216-833-11 METAL CHIP 10K 5% 1/16W R331 1-216-837-11 METAL CHIP 22K 5% 1/16W R332 1-216-864-11 METAL CHIP 0 5% 1/16W R334 1-216-864-11 METAL CHIP 0 5% 1/16W R401 1-240-037-91 METAL 0.05 1% 1/4W

R403 1-218-708-11 METAL CHIP 4.7K 0.5% 1/16W R404 1-218-716-11 METAL CHIP 10K 0.5% 1/16W R421 1-216-813-11 METAL CHIP 220 5% 1/16W R430 1-216-815-11 METAL CHIP 330 5% 1/16W R431 1-216-822-11 METAL CHIP 1.2K 5% 1/16W

R432 1-216-864-11 METAL CHIP 0 5% 1/16W R441 1-216-821-11 METAL CHIP 1K 5% 1/16W R442 1-216-822-11 METAL CHIP 1.2K 5% 1/16W R443 1-216-823-11 METAL CHIP 1.5K 5% 1/16W R450 1-216-845-11 METAL CHIP 100K 5% 1/16W

R455 1-216-833-11 METAL CHIP 10K 5% 1/16W R456 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R500 1-216-813-11 METAL CHIP 220 5% 1/16W R501 1-216-813-11 METAL CHIP 220 5% 1/16W R502 1-216-813-11 METAL CHIP 220 5% 1/16W

R503 1-216-813-11 METAL CHIP 220 5% 1/16W R504 1-216-809-11 METAL CHIP 100 5% 1/16W R505 1-216-809-11 METAL CHIP 100 5% 1/16W R506 1-216-809-11 METAL CHIP 100 5% 1/16W R550 1-216-857-11 METAL CHIP 1M 5% 1/16W

T400 1-411-312-11 FILTER, COMMON MODE

< THERMISTOR(POSITIVE) >

THP400 1-771-075-21 THERMISTOR, POSITIVE

< VIBRATOR >

X301 1-795-004-21 VIBRATOR, CERAMIC (10MHz) X550 1-781-998-11 VIBRATOR, CRYSTAL (45.1584MHz)

**************************************************************

PANEL BOARD

***********

< CAPACITOR >

C701 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C740 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C741 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C748 1-164-156-11 CERAMIC CHIP 0.1uF 25V C750 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C751 1-164-156-11 CERAMIC CHIP 0.1uF 25V C752 1-164-156-11 CERAMIC CHIP 0.1uF 25V C753 1-164-156-11 CERAMIC CHIP 0.1uF 25V C754 1-164-156-11 CERAMIC CHIP 0.1uF 25V C755 1-115-156-11 CERAMIC CHIP 1uF 10V

C756 1-115-156-11 CERAMIC CHIP 1uF 10V C760 1-164-156-11 CERAMIC CHIP 0.1uF 25V C761 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C762 1-164-230-11 CERAMIC CHIP 220PF 5% 50V C763 1-164-230-11 CERAMIC CHIP 220PF 5% 50V

C764 1-164-156-11 CERAMIC CHIP 0.1uF 25V C770 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C781 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C782 1-164-156-11 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

R551 1-414-760-21 FERRITE 0UH R552 1-216-813-11 METAL CHIP 220 5% 1/16W R554 1-216-815-11 METAL CHIP 330 5% 1/16W R600 1-216-853-11 METAL CHIP 470K 5% 1/16W

CN701 1-750-341-11 CONNECTOR, FFC/EPC (ZIF) 18P CN702 1-784-866-21 CONNECTOR,FFC(LIF(NON-ZIF))14P

* CN703 1-580-055-21 PIN, CONNECTOR (SMD) 2P

Page 62

MDS-PC3

PANEL

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks

< DIODE >

D751 8-719-051-89 DIODE SML-010VT-T87 (@/1)

< IC >

IC781 8-749-013-92 IC GP1UC7X (REMOTE SENSOR)

< TRANSISTOR >

Q701 8-729-015-76 TRANSISTOR UN5211 Q751 8-729-015-74 TRANSISTOR UN5111

< RESISTOR >

R702 1-216-825-11 METAL CHIP 2.2K 5% 1/16W R713 1-216-829-11 METAL CHIP 4.7K 5% 1/16W R726 1-216-841-11 METAL CHIP 47K 5% 1/16W R750 1-216-847-11 METAL CHIP 150K 5% 1/16W R751 1-216-811-11 METAL CHIP 150 5% 1/16W

R752 1-216-809-11 METAL CHIP 100 5% 1/16W R760 1-216-809-11 METAL CHIP 100 5% 1/16W R761 1-216-809-11 METAL CHIP 100 5% 1/16W R762 1-216-809-11 METAL CHIP 100 5% 1/16W R763 1-216-809-11 METAL CHIP 100 5% 1/16W

R781 1-216-805-11 METAL CHIP 47 5% 1/16W R782 1-216-809-11 METAL CHIP 100 5% 1/16W

< SWITCH >

A-4680-613-A OVERALL ASSY (PCLK-MN10) 1-469-089-11 FILTER, CLAMP

1-476-295-11 REMOTE COMMANDER(RM-D52M)

0 1-476-351-11 ADAPTOR, AC (AC-96NP) (CND,US) 0 1-476-352-11 ADAPTOR, AC (AC-96NP) (AEP,MY,SP)

0 1-476-353-11 ADAPTOR, AC (AC-96NP) (UK)

1-500-386-21 FILTER, CLAMP (FERRITE CORE)

1-543-793-11 FILTER, CLAMP (FERRITE CORE)(PCLK-MN10) 1-574-264-11 CORD, OPTICAL PLUG 1-757-409-11 CORD, CONNECTION (AUDIO)

1-757-471-11 CABLE, CONNECTION (USB) 1-772-866-12 CD-ROM 4-230-574-31 MANUAL, INSTRUCTION (PCLK-MN10)

4-232-693-11 MANUAL, INSTRUCTION (MDS-PC3)(ENGLISH) 4-230-661-21 MANUAL, INSTRUCTION (MDS-PC3)(FRENCH)

4-230-661-31 MANUAL, INSTRUCTION (MDS-PC3)(GERMAN) 4-230-661-41 MANUAL, INSTRUCTION (MDS-PC3)(SPANISH) 4-230-661-51 MANUAL, INSTRUCTION (MDS-PC3)(DUTCH) 4-230-661-61 MANUAL, INSTRUCTION

4-230-661-71 MANUAL, INSTRUCTION (MDS-PC3)(ITALIAN)

ACCESSORIES & PACKING MATERIALS

*******************************

(FERRITE CORE)(for USB CABLE)(CND,US)

(for USB CABLE)(AEP,MY,SP,UK)

(ENGLISH/FRENCH/GERMAN/SPANISH/DUTCH/

SWEDISH/ITALIAN/PORTUGUESE/

TRADITIONAL CHINESE)

(MDS-PC3)(SWEDISH)

S701 1-762-875-21 SWITCH, KEYBOARD (z) S702 1-762-875-21 SWITCH, KEYBOARD (x/Z) S713 1-475-235-21 ENCODER, ROTARY (./>, PUSH u) S726 1-762-875-21 SWITCH, KEYBOARD (@/1)

**************************************************************

MISCELLANEOUS

*************

11 1-757-134-11 WIRE (FLAT TYPE) (13 CORE)

* 18 1-565-514-11 SOCKET, CONNECTOR 2P

19 1-792-812-11 WIRE (FLAT TYPE) (27 CORE) 20 1-792-811-11 WIRE (FLAT TYPE) (23 CORE) 21 A-4725-377-A MAIN BOARD, COMPLETE (US)

21 A-4725-378-A MAIN BOARD, COMPLETE (CND) 21 A-4725-379-A MAIN BOARD, COMPLETE (AEP) 21 A-4725-380-A MAIN BOARD, COMPLETE (UK) 21 A-4725-381-A MAIN BOARD, COMPLETE (MY,SP) 351 A-4725-054-A BD BOARD, COMPLETE

357 1-678-514-11 FLEXIBLE BOARD

0 358 A-4672-541-A OPTICAL PICK-UP KMS-260B/J1N

M101 A-4672-898-A MOTOR ASSY, SPINDLE M102 A-4672-900-A MOTOR ASSY, SLED M103 A-4672-975-A MOTOR ASSY, LOADING

S102 1-771-957-11 SWITCH, PUSH

(2 KEY) (REFLECT/PROTECT SW) HR901 1-500-670-12 HEAD, OVER LIGHT LCD701 1-804-188-11 LCD MODULE LED701 1-804-189-11 LIGHT, LCD BACK

4-230-661-81 MANUAL, INSTRUCTION

(MDS-PC3)(PORTUGUESE)

4-230-661-91 MANUAL, INSTRUCTION

(MDS-PC3)(TRADITIONAL CHINESE)

4-233-452-01 COVER, BATTERY (For RM-D52M)

The components identified by mark 0 or dotted line with mark 0 are critical for safety . Replace only with part number specified.

Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié.

**************************************************************

9-929-545-11

Sony Corporation

Audio Entertainment Group

2000J0971-1

Published by General Engineering Dept.

Sony MDS-PC3 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual