Sony MDS-PC2 User Manual

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Page 1

MDS-PC2

SERVICE MANUAL

SPECIFICATIONS

US Model

Canadian Model

AEP Model

UK Model

E Model

Model Name Using Similar Mechanism MDS-S40 MD Mechanism Type MDM-5A Optical Pick-up Type KMS-260B/J1N

MICROFILM

— Continued on next page —

MINIDISC DECK

Page 2

SELF-DIAGNOSIS FUNCTION

The self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur , and error codes which show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the SelfDiagnosis Function (Error History Display Mode)”.

Procedure for using the Self-Diagnosis Function (Error History Display Mode). Note:

Perform the self-diagnosis function in the “error history display mode” in the test mode. The following describes the least required procedure. Be careful not to enter other modes by mistake. If you set other modes accidentally , press the p “PROGRAM” b utton to exit the mode.

1. While pressing the INPUT button and p button, connect the power plug to the outlet, and release the INPUT button and p button.

2. Press the + button and when “[Service]” is displayed, press the ^ “PROGRAM” button.

3. Press the + button and display “ERR DP MODE”.

4. Pressing the ^ “PROGRAM” button sets the error history mode and displays “total rec”.

5. Select the contents to be displayed or executed using the + button.

6. Pressing the r “PROGRAM” button will display or execute the contents selected.

7. Pressing the r “PROGRAM” button another time returns to step 4.

8. Pressing the p “PROGRAM” button displays “ERROR DP MODE” and exits the error history mode.

9. To exit the test mode, press the 6 “1” button. The unit sets into the STANDBY state, the disc is ejected, and the test mode ends.

*Note:

As this unit has only a few buttons, one button is assigned with several functions in the test mode. Press the INPUT button to switch the functions. Each time the INPUT button is pressed, the display switches in the following order; “PROGRAM” n “1” n blank n “PROGRAM” The functions of each button change with the display. For simplicity, operations of the INPUT button will not be described here. Instead, symbols are added to the names of buttons. Press the INPUT button as required to switch the display.

Example) p “PROGRAM” : Display “PROGRAM” and press the p button. p “1” : Display “1” and press the p button.

Page 3

ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS

Selecting the Test Mode

Display

total rec

total play

retry err

total err

err history

er refresh

Details of History

Displays the recording time. Displayed as “rππππππh”. The displayed time is the total time the laser is set to the high power state. This is about 1/4 of the actual recording time. The time is displayed in decimal digits from 0h to 65535h.

Displays the play time. Displayed as “pππππππh”. The time displayed is the total actual play time. Pauses are not counted. The time is displayed in decimal digits from 0h to 65535h.

Displays the total number of retries during recording and number of retry errors during play. Displayed as “rππ pππ”. “r” indicates the retries during recording while “p” indicates the retry errors during play. The number of retries and retry errors are displayed in hexadecimal digits from 00 to FF.

Displays the total number of errors. Displayed as “total ππ”. The number of errors is displayed in hexadecimal digits from 00 to FF.

Displays the 10 latest errors. Displayed as “0π E@@”. π indicates the history number. The smaller the number, the more recent is the error. (00 is the latest). @@ indicates the error code. Refer to the following table for the details. The error history can be switched by pressing the + button.

Mode which erases the “retry err”, “total err”, and “err history” histories. When returning the unit to the customer after completing repairs, perform this to erase the past error history, After pressing the r “PROGRAM” button and “er refresh?” is display ed, press the ^ “PROGRAM” button to erase the history. “Complete!” will be displayed momentarily. Be sure to check the following when this mode has been executed.

• The data has been erased.

• The mechanism operates normally when recording and play are performed.

tm refresh

Table of Error Codes

Error Code

E00 E01

E02

E03 E04

No error Read error. PTOC cannot be read (DISC ejected) TOC error. UTOC error (DISC not ejected) Loading error Address cannot be read (Servo has deviated)

Mode which erases the “total rec” and “total play” histories. These histories serve as approximate indications of when to replace the optical pickup. If the optical pickup has been replaced, perform this operation and erase the history. After pressing the ^ “PROGRAM” button and “tm refresh?” is displayed , press the r “PR OGRAM” b utton to erase the history. “Complete!” will be displayed momentarily. Be sure to check the following when this mode has been executed.

• The data has been erased.

• The mechanism operates normally when recording and play are performed.

Details of Error

Error Code

E05 E06 E07 E08 E09

E0A

Details of Error

FOK has deviated Cannot focus (Servo has deviated) Recording retry Recording retry error Playback retry error (Access error) Play retry error (C2 error)

Page 4

CAUTION

Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacture’s instructions.

ADVARSEL!

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering.

Udskiftning må kun ske med batteri af samme fabrikat og type.

Levér det brugte batteri tilbage til leverandøren.

ADVARSEL

Eksplosjonsfare ved feilakting skifte av batteri.

Benytt samme batteritype eller en tilsvarende type anbefalt av

apparatfabrikanten.

Brukte batterier katterier kasseres i henhold til fabrikantens

VARNIG

Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en likvärdig typ som rekommenderas av apparattillverkaren. Kassera använt batteri enligt gällande föreakrifter.

VAROITUS

Parist voi räjähtää, jos se on virheellisesti asennettu. V aihda paristo ainoastaan laite valmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

SAFETY-RELATED COMPONENT WARNING !!

COMPONENTS IDENTIFIED BY MARK ! OR DO TTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!! LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE ! SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT . NE REMPLA CER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

MODEL IDENTIFICATION — MODEL NUMBER LABEL —

Parts No.

PARTS No. MODEL

4-220-576-0π US model 4-220-577-0π Canadian model 4-220-578-0π AEP, UK model 4-220-579-0π Singapore model

Page 5

SAFETY CHECK-OUT

TABLE OF CONTENTS

After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for A C leakage. Check leaka ge as described below.

LEAKAGE

The AC leakage from any exposed metal part to earth Ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microampers). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a V OM or battery-operated A C v oltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A)

To Exposed Metal Parts on Set

0.15µF

1.5k

Ω

AC voltmeter (0.75V)

1. SERVICING NOTE .......................................................... 6

2. GENERAL ........................................................................12

3. DISASSEMBLY

3-1. Case and Front Panel .......................................................... 14

3-2. MD Mechanism .................................................................. 14

3-3. Slider (CAM) ......................................................................15

3-4. Base Unit (MBU-5A) BD Board ........................................ 15

3-5. SW Board and Loading Motor (M103) .............................. 16

4. TEST MODE ..................................................................... 17

5. ELECTRICAL ADJUSTMENTS ...............................22

6. DIAGRAMS

6-1. Circuit Boards Location ...................................................... 31

6-2. Block Diagrams

• BD Section ....................................................................... 33

• Main Section .................................................................... 34

6-3. Printed Wiring Board – BD Section –................................. 36

6-4. Schematic Diagram – BD (1/2) Section –........................... 37

6-5. Schematic Diagram – BD (2/2) Section –........................... 38

6-6. Schematic Diagram – Main (1/2) Section –........................ 39

6-7. Schematic Diagram – Main (2/2) Section –........................ 40

6-8. Printed Wiring Board – Main Section –.............................. 41

6-9. Schematic Diagram – Panel Section – ................................ 42

6-10. Printed Wiring Board – Panel Section – ............................ 43

6-11. Schematic Diagram – Power Section – ............................. 44

6-12. Printed Wiring Board – Power Section – .......................... 45

6-13. Schematic Diagram – BD Switch Section – ..................... 46

6-14. Printed Wiring Board – BD Switch Section –................... 46

6-15. IC Block Diagrams ........................................................... 46

6-15. IC Pin Functions ............................................................... 49

Earth Ground

Fig. A. Using an AC voltmeter to check AC leakage.

7. EXPLODED VIEWS

7-1. Cabinet Section ................................................................... 53

7-2. Mechanism Section (MDM-5A) ......................................... 54

7-3. Base Unit Section (MBU-5A)............................................. 55

8. ELECTRICAL PARTS LIST ........................................ 56

Page 6

SECTION 1

SERVICING NOTE

JIG FOR CHECKING BD BOARD WAVEFORM

The special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be performed are shown as follows.

GND : Ground I+3V : For measuring IOP (Check the deterioration of the optical pick-up laser) IOP : For measuring IOP (Check the deterioration of the optical pick-up laser) TEO : TRK error signal (Traverse adjustment) VC : Reference level for checking the signal RF : RF signal (Check jitter)

Mechanism deck

TEO

IOP

I+3V

GND

RF VC TEO

5P connector

CN110

6P connecto

RF VC TEO For MDMIOP I+3V

VC RF TEO

For MDM-5

IOP I+3V

GND

IOP I+3V

GND

Page 7

IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC171 OF BD BOARD) ARE REPLACED

The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need to look at the value on the label of the optical pick-up. When replacing the optical pick-up or non-volatile memory (IC171 of BD board), record the IOP value on the optical pick-up according to the following procedure.

Record Precedure:

1. While pressing the INPUT button and p button, connect the power plug to the outlet, and release the INPUT button and p button.

2. Press the + button to display “[Service]”, and press the ^ “PROGRAM” button.

3. Press the + button to display “lop.Write”, and press the ^ “PROGRAM” button.

4. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.

5. Input the IOP value written on the optical pick-up. To select the number : Press the + button. To select the digit : Press the r “PROGRAM” button.

6. When the ^ “PROGRAM” button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).

7. As the adjustment results are recorded for the 6 value. Leave it as it is and press the ^ “PROGRAM” button.

8. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write”.

9. Press the 6 “1” button to complete. “Standby” will be displayed.

Display Precedure:

1. While pressing the INPUT button and p button, connect the power plug to the outlet, and release the INPUT button and p button.

2. Press the + button to display “[Service]”, and press the ^ “PROGRAM” button.

3. Press the + button to display “lop.Read”, and press the ^ “PROGRAM” button.

4. “@@.@/##.#” is displayed and the recorded contents are displayed. @@.@ : indicates the Iop value labeled on the pick-up. ##.# : indicates the Iop value after adjustment

5. To end, press the r “PROGRAM” button or p “PROGRAM” button to display “Iop Read”. Then press the 6 “1” buttun.

*Note:

Example) p “PROGRAM” : Display “PROGRAM” and press the p button. p “1” : Display “1” and press the p button.

Page 8

CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS

Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent. Details of the procedures are described in “5 Electrical Adjustments”.

Laser power check (5-6-2 : See page 37)

Traverse check (5-6-3 : See page 37) Focus bias check (5-6-4 : See page 38)

C PLAY check (5-6-5 : See page 38)

Self-recording/playback check (REC/PLAY) (5-6-6 : See page 38)

TEMP check (Temperature compensation offset check) (5-6-1 : See page 37)

Criteria for Determination (Unsatisfactory if specified value is not satisfied)

• 0.9 mW power Specified value : 0.84 to 0.92 mW

• 7.0 mW power Specified value : 6.8 to 7.2 mW lop (at 7mW)

• Labeled on the optical pickup Iop value ± 10mA

• Traverse waveform Specified value : Below 10% offset

• Error rate check Specified value : For points a, b, and c C1 error : Below 220 AD error : Below 2

• Error rate check Specified value: a.When using test disc (MDW-74/AU-1)

C1 error : Below 80 AD error : Below 2

b.When using check disc (TDYS-1)

C1 error : Below 50

• CPLAY error rate check Specified value: C1 error : Below 80 AD error : Below 2

• Unsatisfactory if displayed as T=@@ (##) [NG” NG (@@, ## are both arbitrary numbers)

Measure if unsatisfactory:

• Clean the optical pick-up

• Adjust again

• Replace the optical pick-up

If always unsatisfactory:

• Replace the overwrite head

• Check for disconnection of the circuits around the overwrite head

If occasionally unsatisfactory:

• Check if the overwrite head is distorted

• Check the mechanism around the sled

• Check for disconnection of the circuits around D101 (BD board)

• Check the signals around IC101, IC121, CN102, CN103 (BD board)

Note:

The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments. When performing adjustments, use the specified values for adjustments.

Page 9

FORCED RESET

The system microprocessor can be reset in the following procedure. Use these procedure when the unit cannot be operated normally due to the overrunning of the microprocessor, etc. The line output level and PHONES output level can be varied in the range from 0 dB to -40 dB using the remote commander of this unit. When forced reset is executed, these levels will be set to the initial value of -20 dB.

Procedure :

1. Disconnect the power plug from the outlet.

2. Remove the BACK UP board.

3. Insert the power plug into the outlet.

4. Mount the back up board.

5. Press the I/u button. When “Initialize” is displayed, it means that forced reset has been executed.

[POWER BOARD] (Component Side)

Back up board

FLUORESCENT DISPLAY TUBE ALL LIGHTING AND KEY CHECK MODE

In this mode, the fluorescent display tube check and key check can be performed.

Procedure:

1. While pressing the INPUT button and r (REC) button, insert the power plug into the outlet.”

2. The fluorescent display tube displays “FL ALL 10n Key” momentarily and lights up completely.”

3. The display goes off partially each time a button is pressed.

4. When all buttons are pressed, “Push INPUT” is displayed.

5. When the INPUT button is pressed, the fluorescent display tube displays “Seg Chk” momentarily and lights up partially.

6. When the INPUT button is pressed, it displays “Rmk Chk” momentarily followed by “Push Rmc Key”. If not using a remote commander, end there and disconnect the power plug from the outlet. If using a remote commander, press any button.”

7. The check is completed when “Chk End!”is displayed. Press the I/u button to end.”

Page 10

RETRY CAUSE DISPLAY MODE

• In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set. This is useful for locating the faulty part of the unit.

• The following will be displayed : During recording and stop : Retry cause, number of retries, and number of retry errors. During playback : Information such as type of disc played, part played, copyright. These are displayed in hexadecimal.

Precedure:

1. Load a recordable disc whose contents can be erased into the unit.

2. For discs with no disc name, set the name display using the remote commander. (The time display is set after some time. Leave as it is if

desired.)

3. Press the p button immediately . W ait for a bout 10 seconds while pressing the button. (The AMS knob can be pressed instead of the YES

button for the same results.)

4. The fluorescent display tube displays “RTs@@c##e**”.

5. Press the r button to start recording. Then press the ^ button and start recording.

6. To check the “track mode”, press the ^ button to start play.

7. To exit the test mode, press the 1/u button. If the test mode cannot be exited, refer to “Forced Reset” on page 8.

Fig. 1 Reading the Test Mode Display (During recording and stop)

RTs@@c##c**

Fluorescent display tube display

@@ : Cause of retry ## : Number of retries ** : Number of retry errors

Higher Bits Lower Bits

Hexadecimal

Bit

Binary

84218421

b7 b6 b5 b4 b3 b2 b1 b0

00000001

00000010

00000100 00001000 00010000 00100000 01000000 10000000

Hexa-

decimal

04 08 10 20 40 80

Fig. 2 Reading the Test Mode Display (During playback)

@@####**$$

Fluorescent display tube display

@@ : Parts No. (name of area named on TOC) ## : Cluster ** : Sector $$ : Track mode (Track information such as copyright infor-

Reading the Retry Cause Display

Cause of Retry Occurring conditions

shock

ader5

Discontinuous address DIN unlock FCS incorrect IVR rec error CLV unlock Access fault

} Address (Physical address on disc)

mation of each part)

When track jump (shock) is detected When ADER was counted more than five times continuously When ADIP address is not continuous When DIN unlock is detected When not in focus When ABCD signal level exceeds the specified range When CLV is unlocked When access operation is not performed normally

Reading the Display:

Convert the hexadecimal display into binary display. If more than two causes, they will be added.

Example

When 42 is displayed: Higher bit : 4 = 0100 n b6 Lower bit : 2 = 0010 n b1 In this case, the retry cause is combined of “CLV unlock” and “ader5”.

When A2 is displayed: Higher bit : A = 1010 n b7+b5 Lower bit : 2 = 0010 n b2 The retry cause in this case is combined of “access fault”, “IVR rec error”, and “ader5”.

Page 11

Reading the Track Mode Display

Higher Bits Lower Bits

Hexadecimal

Bit

Binary

Reading the Display:

Convert the hexadecimal display into binary display. If more than two causes, they will be added.

Example When 84 is displayed:

Higher bit : 8 = 1000 n b7 Lower bit : 4 = 0100 n b2 In this case, as b2 and b7 are 1 and others are 0, it can be determined that the retry cause is combined of “emphasis OFF”, “monaural”, “original”, “copyright exists”, and “write allowed”.

Example When 07 is displayed:

Higher bit : 0 = 1000 n All 0 Lower bit : 7 = 0111 n b0+b1+b2 In this case, as b0, b1, and b2 are 1 and others are 0, it can be determined that the retry cause is combined of “emphasis ON”, “stereo”, “original”, “copyright exists”, and “write prohibited”.

84218421

b7 b6 b5 b4 b3 b2 b1 b0

00000001 00000010 00000100 00001000 00010000 00100000 01000000 10000000

Hexa-

decimal

01 02 04 08 10 20 40 80

When 0 When 1

Emphasis OFF Monaural This is 2-bit display. Normally 01. 01:Normal audio. Others:Invalid Audio (Normal) Original Copyright Write prohibited

Details

Emphasis ON Stereo

Invalid Digital copy No copyright Write allowed

Hexadecimal n Binary Conversion Table

Hexadecimal Binary Hexadecimal Binary

0 1 2 3 4 5 6 7

0000 0001 0010 0011 0100 0101 0110 0111

9 A B C D E F

1000 1001 1010 1011 1100 1101 1110 1111

Page 12

Front Panel

SECTION 2

GENERAL

This section is extracted from instruction manual.

Location of Parts and Controls

1011

Page 13

SECTION 3

DISASSEMBLY

Note: Follow the disassembly procedure in the numerical order given.

3-1. CASE AND FRONT PANEL

Two screws

(Flat head)

Case

Two screw

(Flat head)

Screw

(BTT M3)

Front panel

(Take not of two claws)

Two screws

(BTT M3)

3-2. MD MECHANISM

Two step screws

Screw

(M2 x 6.0)

Claw

MD mechanism

Flat type wire

(CN701)

Screw

(M2 x 6.0)

Two step screws

Claw

Main board

Screw

(BVTP 3 x 8)

Flat type wire

(CN421)

Screw

(BVTP 3 x 8)

Connector 8P

(CN503)

(CN412)

Flat type wire

(CN501)

Flat type wir

Page 14

3-3. SLIDER (CAM)

Bracket (Guide L)

T wo screws

(BTP 2.6 x 6)

Slider (Cam)

• Note for Installation of Slider (Cam)

Set the shaft of Cam gear to be at the position in the figure.

Leaf spring

3-4. BASE UNIT (MBU-5A) AND BD BOARD

Bracket (Guide R)

Set the shaft of Lever (O/C) to be at the position in the figure.

T wo screws

(BTP 2.6 x 6)

Flexible board

(CN104)

Flexible board

(CN101)

(BTP2.6 x 6)

Screw (M1.7 x 4)

Three screws

BD board

Base unit (MBU-5A)

Remove the solder (Five position)

Page 15

3-5. SW BOARD AND LOADING MOTOR (M103)

)

T wo screws

(PWH 1.7 x 3)

SW board

Gear B

Screw (PTPWH M2.6 x 6)

Loading motor (M103

Three screws

(BTP2.6 x 6)

Page 16

SECTION 4

TEST MODE

*Note:

As this unit has only a few buttons, one button is assigned with several functions in the test mode.” Press the INPUT button to switch the functions. Each time the INPUT button is pressed, the display switches in the following order;” “PROGRAM” n “1” n blank n “PROGRAM” The functions of each button change with the display.

Buttons and Corresponding Functions

Buttons

1/u 6 (EJECT) ^ = + p (STOP) r (REC)

Function when nothing displayed

1/u 6 (EJECT) ^ = (AMS) + (AMS) p (STOP) r (REC)

Function when “PROGRAM” is displayed

CLEAR ENTER/YES

0 (FR) ) (FF)

EDIT/NO PUSH (AMS)

Function when “1” is displayed

TIME REPEAT PLAY MODE

DISPLAY SCROLL

4-1. PRECAUTIONS FOR USE OF TEST MODE

• As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it. Even if the 6 (EJECT) button is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will not stop rotating. Therefore, it will be ejected while rotating. Be sure to press the 6 (EJECT) button after pressing the p “PROGRAM” button and the rotation of disc is stopped.

4-1-1. Recording laser emission mode and operating buttons

• Continuous recording mode (CREC MODE)

• Laser power check mode (LDPWR CHECK)

• Laser power adjustment mode (LDPWR ADJUST)

• Traverse (MO) check (EF MO CHECK)

• Traverse (MO) adjustment (EF MO ADJUST)

• When pressing the r (REC) button.

4-2. SETTING THE TEST MODE

The following are two methods of entering the test mode. Procedure 1:While pressing the INPUT button and p button, connect the power plug to an outlet, and release the INPUT button and p

button. When the test mode is set, “[Check]” will be displayed. Rotating the INPUT button switches between the following four groups; ···Nn Check Nn Adjust Nn Service Nn Develop Nn ···.

Procedure 2:While pressing the INPUT button, connect the power plug to the outlet and release the INPUT button.

When the test mode is set, “TEMP CHECK” will be displayed. By setting the test mode using this procedure, only the “Check” group of procedure 1 can be executed.

4-3. EXITING THE TEST MODE

Press the p “1” button. The disc is ejected when loaded, and “Standby” display blinks, and the STANDBY state is set.

4-4. BASIC OPERATIONS OF THE TEST MODE

All operations are performed using the = , + button, ^ “PROGRAM” button, and p “PROGRAM” button. The functions of these buttons are as follows.

Function name

= , + button ^ “PROGRAM” button p “PROGRAM” button

Changes parameters and modes Proceeds onto the next step. Finalizes input. Returns to previous step. Stops operations.

Function

Page 17

4-5. SELECTING THE TEST MODE

There are 27 types of test modes as shown below. The groups can be switched by pressing the = and = buttons. After selecting the group to be used, press the ^ “PROGRAM” button. After setting a certain group, pressing the = and = buttons switches between these modes. Refer to “Group” in the table for details selected. All items used for servicing can be treated using group S. So be carefully not to enter other groups by mistake.

Display

TEMP CHECK LDPWR CHECK EF MO CHECK EF CD CHECK FBIAS CHECK S curve CHECK VERIFY MODE DETRK CHECK TEMP ADJUST LDPWR ADJUST EF MO ADJUST EF CD ADJUST FBIAS ADJUST EEP MODE MANUAL CMD SVDATA READ ERR DP MODE SLED MOVE Inpossible ADJ CLEAR AG Set (MO) AG Set (CD) Iop Read Iop Write INFORMATION CPLAY MODE CREC MODE

Contents

Temperature compensation offset check Laser power check Traverse (MO) check Traverse (CD) check Focus bias check S letter check Non-volatile memory check Detrack check Temperature compensation offset adjustment Laser power adjustment Traverse (MO) adjustment Traverse (CD) adjustment Focus bias adjustment Non-volatile memory control Command transmission Status display Error history display, clear Sled check No function Initialization of non-volatile memory of adjustment value Auto gain output level adjustment (MO) Auto gain output level adjustment (CD) IOP data display IOP data write Microprocessing version display Continuous play mode Continuous recording mode

Mark

(X) (X) (X)

(X) (!) (X) (X)

(X) (X)

Group (*)

CS CS CS CS CS C C C

AS AS AS AS AS

D D D

D AS AS AS

CS CASD CASD

Group (*)

C: Check S: Service

A: Adjust D: Develop

• For details of each adjustment mode, refer to “5. Electrical Adjustments”. For details of “ERR DP MODE”, refer to “Self-Diagnosis Function” on page 2.

• If a different mode has been selected by mistake, press the p “PROGRAM” button to exit that mode.

• Modes with (X) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set accidentally, press the p “PROGRAM” button to e xit the mode immediately. Be especially careful not to set the modes with (!) as they will overwrite the non-volatile memory and reset it, and as a result, the unit will not operate normally.

Page 18

4-5-1. Operating the Continuous Playback Mode

1. Entering the continuous playback mode

1 Set the disc in the unit. (Whichever recordable discs or discs for playback only are available.) 2 Press the + button and display “CPLAY MODE”. 3 Press the ^ “PROGRAM” button to change the display to “CPLAY MID”. 4 When access completes, the display changes to “C1 = AD = ”.

Note : The numbers “ ” displayed show you error rates and ADER.

2. Changing the parts to be played back 1 Press the ^ “PROGRAM” button during continuous playback to change the display as below.

“CPLAY MID” n “CPLAY OUT” n “CPLAY IN”

When pressed another time, the parts to be played back can be moved.

2 When access completes, the display changes to “C1 = AD = ”. Note : The numbers “ ” displayed show you error rates and ADER.

3. Ending the continuous playback mode

1 Press the p “PROGRAM” button. The display will change to “CPLAY MODE”. 2 Press the 6 (EJECT) button to remove the disc.

Note : The playback start addresses for IN, MID, and OUT are as follows.

IN 40h cluster MID 300h cluster OUT 700h cluster

4-5-2. Operating the Continuous Recording Mode (Use only when performing self-recording/palyback check.)

1. Entering the continuous recording mode

1 Set a recordable disc in the unit. 2 Press the + button and display “CREC MODE”. 3 Press the ^ “PROGRAM” button to change the display to “CREC MID”. 4 When access completes, the display changes to “CREC ( )” and REC lights up.

Note : The numbers “ ” displayed shows you the recording position addresses.

2. Changing the parts to be recorded 1 When the + “PROGRAM” button is pressed during continuous recording, the display changes as below.

“REC MID” n “REC OUT” n “REC IN”

When pressed another time, the parts to be recorded can be changed. REC goes off.

2 When access completes, the display changes to “CREC ( ” and REC lights up. Note : The numbers “ ” displayed shows you the recording position addresses.

3. Ending the continuous recording mode

1 Press the p “PROGRAM” button. The display changes to “CREC MODE” and REC goes off. 2 Press the 6 (EJECT) button to remove the disc.

Note 1 : The recording start addresses for IN, MID, and OUT are as follows.

IN 40h cluster MID 300h cluster OUT 700h cluster

Note 2 :The p “PROGRAM” button can be used to stop recording anytime. Note 3 :Do not perform continuous recording for long periods of time above 5 minutes. Note 4 :During continuous recording, be careful not to apply vibration.

4-5-3. Non-Volatile Memory Mode (EEP MODE)

This mode reads and writes the contents of the non-volatile memory. It is not used in servicing. If set accidentally, press the p “PROGRAM” button immediately to exit it.

Page 19

4-6. FUNCTIONS OF OTHER BUTTONS

Mode display

Error rate display

Address display

Auto gain display (Not used in servicing)

Detrack check display (Not used in servicing)

IVR display (Not used in servicing)

Function

p + “PROGRAM” * = “PROGRAM” *

r “1” * ^ “1” * p “1”

6 (EJECT) 6 “1” *

Sets continuous playback when pressed in the STOP state. When pressed during continuous playback, the tracking servo turns ON/OFF. Stops continuous playback and continuous recording. The sled moves to the outer circumference only when this is pressed. The sled moves to the inner circumference only when this is pressed. Switches between the pit and groove modes when pressed. Switches the spindle servo mode (CLV S ˜ CLV A). Switches the displayed contents each time the button is pressed Ejects the disc Exits the test mode

Contents

*Note:

4-7. TEST MODE DISPLAYS

Each time the p “1” button is pressed, the display changes in the following order.

1. Mode display

Displays “TEMP ADJUST”, “CPLAYMODE”, etc.

2. Error rate display

Displays the error rate in the following way.

C1 = AD = C1 = Indicates the C1 error. AD = Indicates ADER.

3. Address display

The address is displayed as follows. (MO:recordable disc, CD:playback only disc) Pressing the r “1” button switches between the groove display and pit display. h = s = (MO pit and CD) h = a = (MO groove) h = Indicates the header address. s = Indicates the SUBQ address. a = Indicates the ADIP address.

Note : “–” is displayed when servo is not imposed.

4. Auto gain display (Not used in servicing)

The auto gain is displayed as follows. AG = / [ ]

5. Detrack check display (Not used in servicing)

The detrack is displayed as follows. ADR =

6. IVR display (Not used in servicing)

The IVR is displayed as follows. [ ][ ][

Page 20

MEANINGS OF OTHER DISPLAYS

Display

( P

REC SYNC L.SYNC OVER B ATRACK DISC SLEEP MONO

During continuous playback (CLV: ON) Tracking servo OFF Recording mode ON CLV low speed mode ABCD adjustment completed Tracking offset cancel ON Tracking auto gain OK Focus auto gain OK Pit High reflection CLV S CLV LOCK

When Lit

Contents

When Off

STOP (CLV: OFF) Tracking servo ON Recording mode OFF CLV normal mode

Tracking offset cancel OFF

Groove Low reflection CL V A CLV UNLOCK

Page 21

SECTION 5

ELECTRICAL ADJUSTMENTS

5-1. PARTS REPLACEMENT AND ADJUSTMENT

• Check and adjust the MDM and MBU as follows. The procedure changes according to the part replaced

• Temperature compensation offset check

• Laser power check

• Traverse check

• Focus bias check

• C PLAY check

• Self-recording/playback check

• Abbreviation OP : Optical pick-up OWH: Overwrite head

Parts Replacement and Repair

Has the OWH been replaced?

Has OP, IC171, IC101, or IC121 been replaced?

YES

Initial setting of the adjustment value

Has OP or IC171 been replaced?

Check the sleding and spindle mechanisms. Other causes can be suspected.

YES

IOP information recording (IOP value labeled on OP)

Has IC171 or D101 been replaced?

YES

Temperature compensation offset adjustment

• Laser power adjustment

• Traverse adjustment

• Focus bias adjustment

• Error rate adjustment

• Focus bias check

• Auto gain adjustment

Page 22

5-2. PRECA UTIONS FOR CHECKING LASER DIODE

EMISSINON

T o check the emission of the laser diode dur ing adjustments, ne ver view directly from the top as this may lose your eye-sight.

5-3. PRECAUTIONS FOR USE OF OPTICAL PICK-

UP (KMS-260A)

As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Befor e connecting the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity. Handle the flexible board with care as it breaks easily.

pick-up

laser tap

flexible board

Optical pick-up flexible board

5-4. PRECAUTIONS FOR ADJUSTMENTS

1) When replacing the following parts, perform the adjustments and checks with ¬ in the order shown in the following table.

D101

BD Board

IC101, IC121

IC192

1. Initial setting of adjustment value

2.Recording of IOP information (Value written in the pick-up)

3.Temperature compensation offset adjustment

Optical Pick-up

IC171

¬G¬¬

¬G¬GG

¬¬GGG

4) Use the following tools and measuring devices.

• Check Disc (MD) TDYS-1 (Parts No. 4-963-646-01)

• Test Disk (MDW-74/AU-1) (Parts No. 8-892-341-41)

• Laser power meter LPM-8001 (Parts No. J-2501-046-A)

MD Laser power meter 8010S (Parts No. J-2501-145-A)

• Oscilloscope (Measure after performing CAL of prove.)

• Digital voltmeter

• Thermometer

• Jig for checking BD board waveform (Parts No. : J-2501-149-A)

5) When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscilloscope. (VC and ground will become short-circuited.)

6) Using the above jig enables the waveform to be checked without the need to solder. (Refer to Servicing Note on page 6.)

7) As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.

Note:

When performing laser power checks and adjustment (electrical adjustment), use of the new MD laser power meter 8010S (J-2501145-A) instead of the conventional laser po wer meter is conv enient. It sharply reduces the time and trouble to set the laser power meter sensor onto the objective lens of the optical pick-up.

5-5. CREATING CONTINUOUSLY RECORDED DISC

* This disc is used in focus bias adjustment and error rate check.

The following describes how to create a continuous recording disc.

1. Insert a disc (blank disc) commercially available.

2. Press the + button and display “CREC MODE”.

3. Press the ^ “PROGRAM” button again to display “CREC MID”. Display “CREC (0300)” and start to recording.

4. Complete recording within 5 minutes.

5. Press the p “PROGRAM” button and stop recording .

6. Press the 6 (EJECT) button and remove the disc.

The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check. Note : Be careful not to apply vibration during continuous record-

ing.

4.Laser power adjustment

5.Traverse adjustment

6.Focus bias adjustment

7.Error rate check

8. Auto gain output level adjustment

¬G¬¬¬

¬G¬¬G

2) Set the test mode when performing adjustments. After completing the adjustments, exit the test mode. Perform the adjustments and checks in “group S” of the test mode.

3) Perform the adjustments to be needed in the order shown.

Page 23

5-6. CHECKS PRIOR TO REPAIRS

Specified value : Below 10% offset value Offset value (%) = X 100

A – B

2 (A + B)

Specified value : Below 10% offset value Offset value (%) = X 100

A – B

2 (A + B)

These checks are performed before replacing parts according to “approximate specifications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Replacement and Adjustments” (See page 8).

5-6-1. Temperature Compensation Offset Check

When performing adjustments, set the internal temperature and room temperature to 22 to 28°C.

Checking Procedure:

1. Press the + button to display “TEMP CHECK”.

2. Press the ^ “PROGRAM” button.

3. “T=@@(##) [OK]” should be displayed. If “T=@@ (##) [NG]” is displayed, it means that the results are bad. (@@ indicates the current value set, and ## indicates the value written in the non-volatile memory.)

5-6-2. Laser Power Check

Before checking, check the IOP value of the optical pick-up. (Refer to 5-8. Recording and Displaying IOP Information.)

Connection :

Optical pick-up objective lens

Laser power meter

Digital volt mete

Note 1: After step 4, each time the ^ “PROGRAM” button is

pressed, the display will be switched between “0.7 mW*** $ ”, “6.2 mW*** $ ”, and “WP *** $ ”. Nothing needs to be performed here.

5-6-3. T raverse Check

Connection :

CN110 pin

BD board

(TE)

(VC)

Oscilloscope

V : 0.5 V/div H : 10 ms/div Input : DC mod

Checking Procedure:

1. Connect an oscilloscope to CN110 pin 3 (TE) and CN110 pin 1 (VC) of the BD board.

2. Load a disc (any available on the market). (Refer to Note 1.)

3. Press the + “PROGRAM” button and move the optical pic kup outside the pit.

4. Press the + button and display “EF MO CHECK”.

5. Press the ^ “PROGRAM” button and display “EFB = MO-R”. (Laser power READ power/Focus serv o ON/tracking servo OFF/ spindle (S) servo ON)

6. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the = , + buttons. (Read power traverse checking)

CN110 pin

BD board

(I+3V)

(IOP)

Checking Procedure:

1. Set the laser power meter on the objective lens of the optical pick-up. (When it cannot be set properly , press the = “PR OGRAM” button or + “PROGRAM” button to move the optical pick-up.) Connect the digital volt meter to CN110 pin 5 (I+3V) and CN110 pin 4 (IOP).

2. Then, press the + button and display “LDPWR CHECK” .

3. Press the ^ “PROGRAM” button once and display “0.9 mW*** $ ”. Check that the reading of the laser power meter become 0.84 to 0.92 mW. (*** means IOP value)

4. Press the ^ “PROGRAM” button once more and display “7.0 mW*** $ ”. Check that the reading the laser po wer meter and digital volt meter satisfy the specified value.

Specified Value :

Laser power meter reading : 7.0 ± 0.2 mW Digital voltmeter reading : Optical pick-up displayed value ± 10%

(Optical pick-up label)

KMS

260A 27X40 B0825

(For details of the method for checking this value, refer to “5-8. Recording and Displaying IOP Information”.)

(Traverse Wav ef orm)

7. Press the ^ “PROGRAM” button and display “EFB = MO-W”.

8. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the = , + but- tons.. (Write power traverse checking)

(Traverse Wav ef orm)

Iop = 82.5 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)

5. Press the p “PROGRAM” button and display “LDPWR CHECK” and stop the laser emission. (The p “PROGRAM” button is effective at all times to stop the laser emission.)

P”.

9. Press the ^ “PROGRAM” button display “EFB =

MO-

Then, the optical pick-up moves to the pit area automatically and servo is imposed.

Page 24

10. Observe the waveform of the oscilloscope, and check that the

specified value is satisfied. Do not press the = , + buttons.

(Traverse Wav ef orm)

Specified value : Below 10% offset value

A – B

Offset value (%) = X 100

2 (A + B)

11. Press the ^ “PROGRAM” button displa y “EF MO CHECK” The disc stops rotating automatically.

12. Press the 6 (EJECT) button and remove the disc.

13. Load the check disc (MD) TDYS-1.

14. Press the + button and display “EF CD CHECK”.

15. Press the ^ “PROGRAM” button and display “EFB = CD”. Servo is imposed automatically.

16. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the = , + buttons.

(Traverse Wav ef orm)

Specified value : Below 10% offset value

A – B

Offset value (%) = X 100

2 (A + B)

17. Pr ess the ^ “PROGRAM” button and display “EF CD CHECK”.

18. Press the 6 (EJECT) button and remove the check disc (MD) TDYS-1.

Note 1 : MO reading data will be erased during if a recorded disc is

used in this adjustment.

Note 2 : If the traverse waveform is not clear, connect the oscillo-

scope as shown in the following figure so that it can be seen more clearly.

BD board CN110 pin CN110 pin

(TE)

(VC)

330 k

Ω

Oscilloscop

10pF

5-6-4. Focus Bias Check

Change the focus bias and check the focus tolerance amount.

Checking Procedure :

1. Load a test disk (MDW-74/AU-1).

2. Rotate the + button and display “CPLAY MODE”.

3. Press the ^ “PROGRAM” button twice and display “CPLAY MID”.

4. Press the p “PROGRAM” button when “C1 = AD = ” is displayed.

5. Press the + button and display “FBIAS CHECK”.

6. Press the ^ “PROGRAM” button and display “ / c =

”. The first four digits indicate the C1 error rate, the two digits after “/” indicate ADER, and the 2 digits after “c =” indicate the focus bias value. Check that the C1 error is below 220 and ADER is below 2.

7. Press the ^ “PROGRAM” button and display “ / b = ”.

Check that the C1 error is below 220 and ADER is below 2.

8. Press the ^ “PROGRAM” button and display “ / a = ”.

Check that the C1 error is below 220 and ADER is below 2.

9. Press the p “PROGRAM” button, next press the 6 (EJECT)

button, and remove the test disc.

5-6-5. C PLAY Checking

MO Error Rate Check

Checking Procedure :

1. Press a test disk (MDW-74/AU-1).

2. Rotate the + button knob and display “CPLAY MODE” .

3. Press the ^ “PROGRAM” button and display “CPLAY MID”.

4. The display changes to “C1 =

AD = ”.

5. If the C1 error rate is below 80, check that ADER is below 2.

6. Press the p “PROGRAM” button, stop playback, press the 6

(EJECT) button, and test disc.

CD Error Rate Check

Checking Procedure :

1. Load a check disc (MD) TDYS-1.

2. Press the + button knob and display “CPLAY MODE”.

3. Press the ^ “PROGRAM” button and display “CPLAY MID”.

4. The display changes to “C1 = AD = ”.

5. Check that the C1 error rate is below 50.

6. Press the p “PROGRAM” button, stop playback, press the 6

(EJECT) button, and the test disc.

5-6-6. Self-Recording/playback Check

Prepare a continuous recording disc using the unit to be repaired and check the error rate.

Checking Procedure :

1. Insert a recordable disc (blank disc) into the unit.

2. Press the + button knob to display “CREC MODE”.

3. Press the ^ “PROGRAM” button to display the “CREC MID”.

4. When recording starts, “ REC ” is displayed, this becomes

“CREC (@@@@)" (@@@@ is the address), and recording starts.

5. About 1 minute later, press the p “PROGRAM” button to stop

continuous recording.

6. Press the = button to display “C PLAY MODE”.

7. Press the ^ “PROGRAM” button to display “C PLAY MID”.

8. “C1 = AD = ” will be displayed.

9. Check that the C1 error becomes below 80 and the AD error

below 2.

10. Press the p “PROGRAM” button to stop playback, and press

the 6 (EJECT) button and remove the disc.

Page 25

5-7. INITIAL SETTING OF ADJUSTMENT VALUE

Note:

Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again excluding the temperature compensation offset adjustment. For details of the initial setting, refer to “5-4. Precautions on Adjustments” and execute the initial setting before the adjustment as required.

Setting Procedure :

1. Press the + button to display “ADJ CLEAR”.

2. Press the ^ “PROGRAM” button. “Complete!” will be displayed momentarily and initial setting will be executed, after which “ADJ CLEAR” will be displayed.

5-8. RECORDING AND DISPLAYING THE IOP

INFORMATION

The IOP data can be recorded in the non-volatile memory . The IOP value on the label of the optical pickup and the IOP value after the adjustment will be recorded. Recording these data eliminates the need to read the label on the optical pick-up.

5-9. TEMPERATURE COMPENSATION OFFSET

ADJUTMENT

Save the temperature data at that time in the non-volatile memory as 25 ˚C reference data.

Note :

1. Usually, do not perform this adjustment.

2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C. Perform it immediately after the power is turned on when the internal temperature of the unit is the same as the ambient temperature of 22 ˚C to 28 ˚C.

3. When D101 has been replaced, perform this adjustment after the temperature of this part has become the ambient temperature.

Adjusting Procedure :

1. Press the + button and display “TEMP ADJUST”.

2. Press the ^ “PROGRAM” button and select the “TEMP ADJUST” mode.

3. “TEMP = [OK]” and the current temperature data will be displayed.

4. To save the data, press the ^ “PROGRAM” button. When not saving the data, press the p “PROGRAM” button.

5. When the ^ “PROGRAM” button is pressed, “TEMP = SAVE” will be displayed and turned back to “TEMP ADJUST” display then. When the p “PROGRAM” button is pressed, “TEMP ADJUST” will be displayed immediatelly.

Recording Procedure :

1. While pressing the INPUT button and p button, connect the power plug to the outlet, and release the INPUT button and p button.

2. Press the + button to display “[Service]”, and press the ^ “PROGRAM” button.

3. Rotate the + button to display “Iop.Write”, and press the ^ “PROGRAM” button.

4. The display becomes Ref=@@@.@ (@ is an arbitrary number) and the numbers which can be changed will blink.

5. Input the IOP value written on the optical pick-up. To select the number : Press the = , + buttons. To select the digit : Press the r “PROGRAM” knob

6. When the ^ “PROGRAM” button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).

7. As the adjustment results are recorded for the 6 value. Leave it as it is and press the ^ “PROGRAM” button.

8. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write”.

Display Procedure :

1. Press the + button to display “Iop.Read”.

2. “@@.@/##.#” is displayed and the recorded contents are displayed. @@.@ indicates the Iop value labeled on the pick-up. ##.# indicates the Iop value after adjustment

3. To end, press the r “PR OGRAM” b utton or p “PROGRAM” button to display “Iop Read”.

Specified Value :

The “TEMP = ” should be within “E0 - EF”, “F0 - FF”, “00 0F”, “10 - 1F” and “20 - 2F”.

5-10. LASER POWER ADJUSTMENT

Check the IOP value of the optical pick-up before adjustments. (Refer to 5-8. Recording and Displaying IOP Information.)

Connection :

Optical pick-up objective lens

CN110 pin

BD board

(I+3V)

(IOP)

Adjusting Procedure :

2. Press the + button and display “LDPWR ADJUST”. (Laser power : For adjustment)

3. Press the ^ “PROGRAM” button once and display “LD 0.9 mW $ ”.

4. Press the = , + buttons so that the reading of the laser power meter becomes 0.85 to 0.91 mW. Press the ^ “PROGRAM” button after setting the range knob of the laser power meter, and save the adjustment results. (“LD SAVE $ ” will be displayed for a moment.)

5. Then “LD 7.0 mW $ ” will be displayed.

Laser power meter

Digital volt mete

Page 26

6. Press the = , + buttons so that the reading of the laser

power meter becomes 6.9 to 7.1 mW, press the ^ “PROGRAM” button and save it.

Note : Do not perform the emission with 7.0 mW more than 15

seconds continuously.

7. Then, press the + button and display “PWR CHECK”.

8. Press the ^ “PROGRAM” button once and display “0.9 mW*** $ ”. Check that the reading of the laser power meter become 0.85 to 0.91 mW. (*** means IOP value)

9. Press the ^ “PROGRAM” button once more and display “7.0 mW*** $ ”. Check that the reading the laser po wer meter and digital volt meter satisfy the specified value. Note down the digital voltmeter reading value.

Specified Value :

Laser power meter reading : 7.0 ± 0.1 mW Digital voltmeter reading : Optical pick-up displayed value ± 10%

(Optical pick-up label)

KMS

260A 27X40 B0825

Iop = 82.5 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)

(For details of the method for checking this value, refer to “5-8. Recording and Displaying IOP Information”.)

10. Press the p “PROGRAM” button and display “LDPWR CHECK” and stop the laser emission. (The p “PROGRAM” button is effective at all times to stop the laser emission.)

11. Press the + button to display “Iop.Write”.

12. Press the ^ “PROGRAM” button. When the display becomes Ref=@@@.@ (@ is an arbitrary number), press the ^ “PROGRAM” button to display “Measu=@@@.@” (@ is an arbitrary number).

13. The numbers which can be changed will blink. Input the Iop value noted down at step 9. To select the number : Press the = , + buttons. To select the digit : Press the r “PROGRAM” buttan

14. When the ^ “PROGRAM” button is pressed, “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write”.

Note 1: After step 4, each time the ^ “PROGRAM” button is

pressed, the display will be switched between “0.7 mW*** $ ”, “6.2 mW*** $ ”, and “ WP *** $ ”. Nothing needs to be performed here.

5-11. TRA VERSE ADJUSTMENT

Connection :

BD board

CN110 pin

(TE)

(VC)

Adjusting Procedure :

1. Connect an oscilloscope to CN110 pin 3 (TE) and CN110 pin 1 (VC) of the BD board.

2. Load a disc (any available on the market). (Refer to Note 1.)

3. Press the + “PROGRAM” button and move the optical pic kup outside the pit.

4. Press the + button and display “EF MO ADJUST”.

5. Press the + button and display “EFB = (Laser power READ power/Focus serv o ON/tracking servo OFF/ spindle (S) servo ON)

6. Press the + button so that the waveform of the oscilloscope becomes the specified value. (When the = , + buttons is pressed, the of “EFB= ” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Read power traverse adjustment)

(Traverse Wav ef orm)

Specification A = B

7. Press the ^ “PROGRAM” button and save the result of adjustment to the non-volatile memory (“EFB = SAVE” will be displayed for a moment. Then “EFB = MO-W” will be displayed).

8. Press the = , + buttons so that the waveform of the oscilloscope becomes the specified value. (When the = , + buttons is pressed, the of “EFB- ” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Write power traverse adjustment)

Oscilloscope

V : 0.5 V/div H : 10 ms/div Input : DC mod

MO-R”.

(Traverse Wav ef orm)

Specification A = B

9. Press the ^ “PROGRAM” button, and save the adjustment results in the non-volatile memory. (“EFB =

SAVE” will be

displayed for a moment.)

10. “EFB = MO-P”. will be displayed.

The optical pick-up moves to the pit area automatically and servo is imposed.

Page 27

11. Press the = , + buttons until the waveform of the oscil-

loscope moves closer to the specified value. In this adjustment, waveform varies at interv als of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.

(Traverse Wav ef orm)

Specification A = B

12. Press the ^ “PROGRAM” button, and save the adjustment results in the non-volatile memory. (“EFB =

SAVE” will be displayed for a moment.) Next “EF MO ADJUST” is displayed. The disc stops rotating automatically.

13. Press the 6 (EJECT) button and remove the disc.

14. Load the check disc (MD) TDYS-1.

15. Press + button and display “EF CD ADJUST”.

16. Press the ^ “PROGRAM” button and display “EFB = CD”. Servo is imposed automatically.

17. Press the = , + buttons so that the waveform of the oscilloscope moves closer to the specified value. In this adjustment, waveform varies at interv als of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.

(Traverse Wav ef orm)

5-12. FOCUS BIAS ADJUSTMENT

Adjusting Procedure :

1. Load a test disk (MDW-74/AU-1).

2. Press the + button and display “CPLAY MODE”.

3. Press the ^ “PROGRAM” button and display “CPLAY MID”.

4. Press the p “PROGRAM” button when “C1 = AD = ” is displayed.

5. Press the + button and display “FBIAS ADJUST”.

6. Press the p “PROGRAM” button and display “ / a =

”. The first four digits indicate the C1 error rate, the two digits after “/” indicate ADER, and the 2 digits after [a =] indicate the focus bias value.

7. Press the + button and find the focus bias value at which the C1 error rate becomes about 200 (Refer to Note 2).

8. Press the ^ “PROGRAM” button and display “ / b =

”.

9. Press the = button direction and find the focus bias value at which the C1 error rate becomes about 200.

10. Press the ^ “PROGRAM” button and display “ / c =

”.

11. Check that the C1 error rate is below 50 and ADER is 00. Then

press the ^ “PROGRAM” button.

12. If the “( )” in “ - - ( )” is above 20, press the p

“PROGRAM” button. If below 20, press the p “PROGRAM” b utton and repeat the adjustment from step 2.

13. Press the 6 (EJECT) button to remove the test disc.

Note 1 : The relation between the C1 error and focus bias is as

shown in the following figure. Find points a and b in the following figure using the above adjustment. The focal point position C is automatically calculated from points a and b.

Note 2 : As the C1 error rate changes, perform the adjustment us-

ing the average vale.

C1 error

Specification A = B

18. Press the ^ “PROGRAM” button, display “EFB =

SA VE” for a moment and save the adjustment results in the non-volatile memory. Next “EF CD ADJUST” will be displayed.

19. Press the 6 (EJECT) button and remove the check disc (MD) TDYS-1.

Note 1 : MO reading data will be erased during if a recorded disc is

used in this adjustment.

Note 2 : If the traverse waveform is not clear, connect the oscillo-

scope as shown in the following figure so that it can be seen more clearly.

Oscilloscop

330 k

CN110 pin

BD board

(TE)

(VC)

Ω

10pF

about 200

c a Focus bias value

(F. BIAS)

Page 28

5-13. ERROR RATE CHECK

5-13-1. CD Error Rate Check

5-15. AUTO GAIN CONTROL OUTPUT LEVEL

ADJUSTMENT

Checking Procedure :

1. Load a check disc (MD) TDYS-1.

2. Press the + button and display “CPLAY MODE”.

3. Press the ^ “PROGRAM” button twice and display “CPLAY MID”.

4. The display changes to “C1 = AD = ”.

5. Check that the C1 error rate is below 20.

6. Press the p “PROGRAM” button, stop playback, press the 6 (EJECT) button, and remove the test disc.

5-13-2. MO Error Rate Check

Checking Procedure :

1. Load a test disc (MDW-74/AU-1).

2. Press the + button and display “CPLAY MODE”.

3. Press the ^ “PROGRAM” button and display “CPLAY MID”.

4. The display changes to “C = AD = ”.

5. If the C1 error rate is below 50, check that ADER is 00.

6. Press the p “PROGRAM” button, stop playback, press the 6 (EJECT) button, and remove the test disc.

5-14. FOCUS BIAS CHECK

Change the focus bias and check the focus tolerance amount.

Checking Procedure :

1. Load a test disc (MDW-74/AU-1).

2. Press the + button and display “CPLAY MODE”.

3. Press the ^ “PROGRAM” button twice and display “CPLAY MID”.

4. Press the p “PROGRAM” button when “C1 = AD = ” is displayed.

5. Press the + button and display “FBIAS CHECK”.

6. Press the ^ “PROGRAM” button and display “ / c =

”. The first four digits indicate the C1 error rate, the two digits after “/” indicate ADER, and the 2 dig its after “c =” indicate the focus bias value. Check that the C1 error is below 50 and ADER is below 2.

7. Press the ^ “PROGRAM” button and display “ / b = ”.

Check that the C1 error is below 220 and ADER is below 2.

8. Press the ^ “PROGRAM” button and display “ / a = ”.

Check that the C1 error is below 220 and ADER is below 2

9. Press the p “PROGRAM” button, next press the 6 (EJECT)

button, and remove the continuously recorded disc.

Be sure to perform this adjustment when the pickup is replaced. If the adjustment results becomes “ Adjust NG!”, the pickup may be faulty or the servo system circuits may be abnormal.

5-15-1. CD Auto Gain Control Output Level Adjustment

Adjusting Procedure :

1. Insert the check disc (MD) TDYS-1.

2. Press the + button to display “AG Set (CD)”.

3. When the ^ “PROGRAM” button is pressed, the adjustment will be performed automatically. “Complete!!” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the display changes to “AG Set (CD)”.

4. Press the 6 (EJECT) button to remove the disc.

5-15-2. MO Auto Gain Control Output Level Adjustment

Adjusting Procedure :

1. Insert the reference disc (MDW-74/AU-1) for recording.

2. Press the + button to display “AG Set (MO)”.

4. Press the 6 (EJECT) button to remove the disc.

Note 1 : If the C1 error and ADER are above other than the speci-

fied value at points a (step 8. in the abov e) or b (step 7. in the above), the focus bias adjustment may not have been carried out properly. Adjust perform the beginning again.

Page 29

5-15. ADJUSTING POINTS AND CONNECTING POINTS

[BD BOARD] (SIDE A)

CN101

D101

NOTE

IC171

GND I+3V

IOP TE

RF VC

CN110

[BD BOARD] (SIDE B)

IC101

IC121

IC192

NOTE:

It is useful to use the jig. for checking the waveform. (Refer to Servicing Note on page 6.)

Page 30

6-1. CIRCUIT BOARDS LOCATION

BD board

SECTION 6

DIAGRAMS

Back up board

SW board

Power boar

Panel board

Main board

Page 31

6-2. BLOCK DIAGRAM – BD SECTION –

OVER WRITE HEAD DRIVE

IC181

DIGITAL SERVO SIGNAL PROCESSOR, DIGITAL SIGNAL PROCESSOR

EFM/ACIRC ENCODER/DECODER, SHOCK-PROOF MEMORY CONTROLLER,

ATRAC ENCODER/DECODER

IC121

MDS-PC2

SCTX XINIT

• SIGNAL PATH

:PB :REC :PB (Digital out) :REC (Digital in)

OPTICAL PICK-UP BLOCK

(KMS-260A/J1N)

DETECTOR

ILCC

HR901

OVER WRITE

HEAD

D101

LASER ON

Q101

APC

Q162,163

HEAD

DRIVE

Q181,182

TEMPR

TEMPI

•

48 47 46 40

RFO

MORFI

MORFO

RF AMP

IV AMP

CVB

TEMP

AMP

APCREF

APC

AGCI

E-F

BALANCE

VCC

RF AMP

IC101

RF AGC & EQ

BPF

VICONV

EQADJ

3TADJ

•

12 10

•

4 5

P-P

WBLADJ

2522 23

PEAK

BOTTOM

ABCD

AMP

FOCUS ERROR

AMP

TRACKING

ERROR

AMP

SERIAL

PARALLEL

DECODER

1 2

AUX

33 67

BOTM

PEAK

ABCD

34 66

ADAGC

BPF

ADFM

ADIN

ADFG

CSLED

SWDT

SCLK

XLAT

FOCNT

16 17 18

FILTER

15 14

XINIT

EFMO

100

EFM,

ADIP

ACIRC,

ENCODER/

DECODER

PCO

FILI

60 61 62

AUX1

64 63

75 74

ADFG

FILO CLTV

RFI

BOTM PEAK

ABCD

FE VC

TE SE

PLL

ANALOG

MUX

DEMODULATOR/

DECODER

SHOCK

RESISTANT

MEMORY

CONTROLLER

A/D

CONVERTER

APC

CONVERTER

SERVO

DSP

ATRAC

ENCODER/

DECODER

SAMPLING

RATE

DIGITAL

AUDIO

CLOCK

GENERATOR

SUBCODE

PROCESSOR

MONITOR CONTROL

CPU

I/F

DIN0

DIN1

ADDT

I/F

DADT

DOUT

XBCK

LRCK

OSCI

SQSY DQSY

MNT3 MNT2 MNT1 MNT0

SENS SRDT

SCLK

SWDT

XLAT

BUFFER IC123

11 12

4 3 2 1

9 8 6 5 7

DIN0

DIN1

ADDT

DADT

DOUT

BCK LRCK

512FS

SQSY DQSY

MNT3 MNT2 MNT1

MNT0

SENS SRDT SCLK SWDT XLAT CH

MAIN

SECTION

(Page 32)

SPINDLE

SERVO

DTRF

CKRF

XLRF

FOCNT

SPRD

SPFD

FG IN

95 10

XRST

RECP

GENERATOR

APCREF

FFDR

PWM

FRDR

TFDR

TRDR

SFDR

SRDR

91928586898883

D0 D3 A00 A09 49 • 48 • 50 • 51

AUTO

SEQUENCER

34 31 • 36 40 • 45

XWE XRAS XCAS XOE

47 46 44 43

DRAM

IC124

XWE

XRAS

XCAS

XOE

DQ1

•

• DQ4

6 9

•

11 15

• A9

LDON

TRACKING

MODULE

COIL

FOCUS

COIL

SLED MOTOR

SPINDLE MOTOR

M102

M101

HF MODULE

IC103,Q102-104

SLED/SPINDLE MOTOR DRIVE FOCUS/TRACKING COIL DRIVE

IC152

TRK– TRK+

FSC+ FSC–

SLED+

SLED–

SPDL+

SPDL–

DRIVER

PSB

TFDR

TRDR

FRDR

FFDR

SFDR

SRDR

SPFD

SPRD

XRST

EEP ROM

IC171

M103

LOADING MOTOR

DETECT SW S101, S102,

S601-604

SDA

WRPWR

MOD

SDA

SCLSCL

LIMIT-IN REFLECT PROTECT CHACK IN SW PACK OUT SW PLAY-P SW REC P SW

LOAD-IN LOAD-OUT

DIG-RST

31 31

Page 32

MDS-PC2

– MAIN SECTION –

DIN0

DIN1

DOUT

ADDT

BCK LRCK DADT

512FS

SCTX

XINT SQSY DQSY

MNT3 MNT2 MNT1 MNT0

SENS SRDT

SCLK

SWDT

XLATCH LIMIT-IN REFLECT

BD SECTION

(Page 31)

PROTECT

CHACKIN SW

PACK-OUT SW

PB P SW

REC-P SW

LD ON

WRPWR

MOD

LOAD-IN

LOAD OUT

SDA SCL

DIG-RST

SIRCS

RECEIVER

IC781

IC601

RXDI CLKI TXDI

MOTER

DRIVE IC441

LD LOW SWITCH

Q441

OPT IN 1

IC611

OPT IN 2

IC621

OPT OUT

IC661

IC351 IC351

X351

22.5792MHz

80 23

18 66 74 72 78 71 32 33 31 75 77 69 68 51 53 60 59 70 67 76

65 79 73

DIGITAL

(OPTICAL)

SYSTEM CONTROL

IC501

SCTX XINT SQSY

DQSY MNT3(S-LOCK) MNT2(X-BUSY) MNT1(SHOCK) MNT0(F-OK) SENS SRDT SCLK SWDT XLATCH LIMIT-IN REFLECT PROTECT

CHACKIN PACK-OUT PB-P

REC-P LDON WR PWR MOD

LD-IN

LD OUT

LD-LOVO

SDA SCL DIG-RST

RMC

A/D,D/A CONVERTER

IC301

DATAO VINL1

BCK

16 17

WS DATAI

SYSCLK

L3-CLOCK

L3-DATA

L3-MODE

MUTE

A1-OUT

A1-IN

XOUT

XIN

KEY0

FLDATA

FLCLK

FLCS

P.DOWN

STB

S.RST

VINR1

VOUTL VOUTR

L3MODE

L3CLK

L3DATA

28 30 47 49

13 15

95KEY1

35 37 34

19 50

RTSI

J101

J801

POWER

OUT

CONTROL

J101 LINE

(ANALOG)

R-CH

TXDI

RTSI

CLKI

RXDI

TRANSFORMER

X513

10MHz

DRIVER

DAT CLK CS

VFL

IC761

LINE AMP

IC381, 382

G13

S35

G12

RST

+ –

LED SW

Q751

GRID DRIVE

Q767

FLUORESCENT

INDICATOR TUBE

D751

FL701

MUTE

Q191

MUTE DRIVE

Q390

D390 D391

STANDBY

LOADING 5V

H5V

D5V

M5V

SYS+3.3V

ANA+5V

BACK+3.3V

LITHIUM

BATTERY

BT451

IC601

INVERTER

SWITCHING REG

IC 411

1 3

S RESET

12 2

+5V REG

+3.3V REG

+5V REG

BACK UP

–32V

RECTIFIER

D431,432

RECTIFIER

D411,412

–32V REG

3 1

IC421

RY911

ANA+5V

RY912

D421

ANA+5V

R-CH

26 24

R-CH

13 14 15

MATRIX SWITCH

63 62 61

-32V

• SIGNAL PATH

:PB :REC :PB (Digital out) :REC (Digital in)

32 32

Page 33

MDS-PC2

0.46Vp-p

0.1Vp-p

3.1Vp-p

22.581MHz

3.2Vp-p

44.1kHz

3.2Vp-p

176.4kHz

3.8Vp-p

11.29MHz

Note on Schematic Diagram: Note:

• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

• All resistors are in Ω and 1/ specified.

•

: internal component.

W or less unless otherwise

• C : panel designation.

Note:

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Note:

Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

• U : B+ Line.

• V : B– Line.

• H : adjustment for repair. no mark : STOP ( ) : Play the test disk (TDYS-1) < > : REC

: Can not be measured.

∗

• Voltages are taken with a V OM (Input impedance 10 MΩ). Voltage var iations may be noted due to normal production tolerances.

• Waveforms are taken with a oscilloscope. Voltage var iations may be noted due to normal production tolerances.

• Signal path. E : PB

: REC

p : PB (digital out) l : REC (digital in)

Note on Printed Wiring Boards: Note:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

• p : parts mounted on the conductor side.

•

: Through hole.

• b : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

Caution: Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated.

• Indication of transistor

These are omitted

WAVEFORMS

– BD (1/2) SECTION –

IC101 1, 2 (I, J) (PLAY mode)

IC101 4 (A) (PLAY mode)

IC101 8, 9 (E, F) (PLAY mode)

– BD (2/2) SECTION –

IC121 !§ (OSCI)

IC121 @¶ (LRCK)

2.822MHz

IC121 @• (XBCK)

0.06Vp-p

3.8Vp-p

– MAIN SECTION –

3.2Vp-p

10MHz

IC701 !£ (XOUT)

3.8Vp-p

44.1kHz

IC201 !™ (SYSCLK)

3.4Vp-p

2.822MHz

IC201 !¶ (LRCK1)

3.0Vp-p

22.581MHz

IC201 !§ (BCK)

CEB

These are omitted

33 33

IC121 @ª (FS256)

IC121 (º (FS4)

– PANEL SECTION –

3.9Vp-p

2.4MHz

IC901 %• (OSCO)

Page 34

MDS-PC2

6-3. PRINTED WIRING BOARD – BD SECTION –

• See page 30 for Circuit Boards Location.

• SEMICONDUCTOR LOCATION

Ref. No. Location D101 A-1

D181 D-3 D183 D-3

IC103 B-1 IC123 D-2 IC171 D-1

Q102 B-1 Q103 B-1 Q104 B-1

• SEMICONDUCTOR

34 34

(Page 43)

LOCATION

Ref. No. Location

IC101 A-3 IC121 C-3 IC124 C-3 IC152 B-1 IC181 C-1 IC192 D-1

Q101 B-3 Q162 B-3 Q163 B-3 Q181 C-1 Q182 C-2

(Page 39)

: SOLDER BRIDGE

Page 35

6-4. SCHEMATIC DIAGRAM – BD (1/2) SECTION –

• See page 33 for Waveform.

• See page 45 for IC Block Diagrams.

• See page 48 for IC Pin Function.

MDS-PC2

(Page 36)

35 35

(Page 36) (Page 36)

(Page 36)

Page 36

MDS-PC2

6-5. SCHEMATIC DIAGRAM – BD (2/2) SECTION –

• See page 33 for Waveform.

• See page 34 for Printed Wiring Board.

POWER BOARD

(Page 42)

(Page 35)

MAIN BOARD

(1/2)

(Page 37)

BA033FP-E2

36 36

Page 37

6-6. SCHEMATIC DIAGRAM – MAIN (1/2) SECTION –

• See page 33 for Waveform.

• See page 39 for Printed Wiring Board.

• See page 51 for IC Pin Function.

MDS-PC2

(Page 38)

SW BOARD

(Page 44)

BD BOARD

(2/2)

(Page 36)

(Page 38)

POWER BOARD

(Page 42)

(Page 38)

37 37

Page 38

MDS-PC2

6-7. SCHEMATIC DIAGRAM – MAIN (2/2) SECTION –

• See page 33 for Waveform.

• See page 47 for IC Block Diagrams.

PANEL BOARD

(Page

37)

(Page

37)

(Page

37)

(Page 40)

(Page

37)

OUT

LINE

(ANALOG)

38 38

Page 39

6-8. PRINTED WIRING BOARD – MAIN SECTION –

• See page 30 for Circuit Boards Location.

MDS-PC2

LINE

(ANALOG)

OUT

POWER BOARD

BD SWITCH

BOARD

BD BOARD

PANEL

BOARD

(Page 43) (Page 44) (Page 34) (Page 41)

• SEMICONDUCTOR LOCATION

Ref. No. Location D390 A-2

D391 A-2 IC301 A-3

IC308 A-1 IC351 A-4 IC381 A-2 IC382 A-2 IC441 A-5 IC501 B-7

Q191 A-1 Q192 A-1 Q291 A-1 Q292 A-1 Q390 A-2 Q441 B-6

39 39

Page 40

MDS-PC2

6-9. SCHEMATIC DIAGRAM – PANEL SECTION –

• See page 33 for Waveform.

MAIN

BOARD

(2/2)

(Page 38)

40 40

Page 41

6-10. PRINTED WIRING BOARD – PANEL SECTION –

• See page 30 for Circuit Boards Location.

MDS-PC2

41 41

MAIN BOARD

(Page 39)

Page 42

MDS-PC2

6-11. SCHEMATIC DIAGRAM – POWER SECTION –

MAIN

BOARD

(1/2)

(Page 37)

BD BOARD

(2/2)

(Page 36)

OUT

IN 1 IN 2

DIGITAL

(OPTICAL)

RESET

42 42

Page 43

6-12. PRINTED WIRING BOARD – POWER SECTION –

• See page 30 for Circuit Boards Location.

MAIN BOARD

(Page 39)

MDS-PC2

BD BOARD

(Page 34)

IN 2

• SEMICONDUCTOR LOCATION

Ref. No. Location D411 C-4

D412 C-3 D421 C-2 D422 C-1 D451 B-2 D452 B-2 D461 B-4 D462 B-4 D911 B-4 D912 C-2

IN 1

OUT

Ref. No. Location

IC411 B-2 IC421 C-1 IC611 C-5 IC621 B-5 IC661 D-5

Q801 E-5

DIGITAL

(OPTICAL)

CONTROL

A1 II

• SEMICONDUCTOR LOCATION

Ref. No. Location

D431 C-2 D432 C-2 D433 C-2 D466 B-2 D467 B-2 D801 E-1

IC601 C-1

43 43

Page 44

MDS-PC2

6-13. SCHEMATIC DIAGRAM – BD SWITCH SECTION –

6-14. PRINTED WIRING BOARD – BD SWITCH SECTION –

• See page 30 for Circuit Boards Location.

MAIN BOARD

(1/2)

(Page 37)

6-15. IC BLOCK DIAGRAM

• BD section

IC101 CXA2523AR

MORFO47MORFI46RFO45OPN

RFA1

CVB

3VC

IVR

+ –

OPO43ADDC42COMPP41COMPO40AGCI39RF AGC38RF37PEAK

USROP

– +

–

RFA2

– –

–

1 2

GRVA

CFST

GRV

HLPT

–1

–2

PTGR

–2

–1

+ + + +

ABCDA

+ –

BPF3T

RF AGC EQ

USRC

3T WBL

PEAK3T

P-P

PEAK

BOTTOM

WBL

PBH

DET

TEMP

BPFC

BOTM

ABCD

AUX

32 ADFG

MAIN BOARD

(Page 39)

IVR

GSW IV

10PD

11APC

12APCREF

+ –

–

FBAL

–

+ + – –

– – + +

EE'

FF'

AUXSW

FEA

BPF22

WBL

ATA

WBL

– + – +

EFB TESW

COMMAND

SCRI - PARA

DECODE

PTGR

ADIP

AGC

WBL

BGR

VREF

DET

–1

–2

SEA

–1

–2

TEA

VI CONV

31 ADAGC

30 ADIN

29 ADFM

28 SE

27 CSLED

26 TE

25 WBLADJ

44 44

GND

TEMPI

TEMPR

SWDT

SCLK

XLAT

XSTBY

F0CNT

VREF

EQADJ

3TADJ

VCC

Page 45

IC121 CXD2654R

EFMO

DVSS

TEST3

TEST2

100

99 98 97 96 95 94 93

TEST1

TEST0

SPFD

SPRD

SFDR91SRDR90FS489FRDR88FFDR87DVDD86TFDR85TRDR84LDDR83APCREF82DTRF81CKRF80XLRF79F0CNT78ADFG77APC76DCHG

MNT0

MNT1

MNT2

MNT3

SWDT

SCLK

XLAT

SRDT

SENS

XRST

SQSY

DQSY

RECP

XINT

OSCI

OSCO

XTSL

DIN0

DIN1

DOUT

SPINDLE

EACH BLOCK

DEMODULATOR/

EACH BLOCK

SERVO

ADIP

DECODER

SHOCK RESISTANT

MEMORY CONTROLLER

DIGITAL

AUDIO

I/F

MONITOR CONTROL

CPU I/F

SUBCODE

PROCESSOR

CLOCK

GENERATOR

SERVO

DSP

APC

SAMPLING

RATE

CONVERTER

PWM

A/D

CONVERTER

AUTO

SEQUENCER

ENCODER/

EFM/ACIRC

ANALOG

MUX

DECODER

COMP

PLL

AVSS

ADRB

ADRT

AVDD

ADIO

AUX1

ABCD

BOTM

PEAK

CLTV

FILO

FILI

PCO

AVSS

RFI

BIAS

AVDD

ASYI

ASYO

DATAI

LRCKI

XBCKI

ADDT

LRCK

XBCK

DADT

IC152 BH6511FS-E2

CAPA–

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

CHARGE

PUMP.

OSC

FS256

CAPA+

DVDD

IN2R

INTERFACE

IN2F

VM2

AMP

ATRAC

ENCODER/DECODER

ADDRESS/DATA BUS A00 - A11, D0 - D3

OUT2F

PGND2

OUT2R

VM12

AMP

A1140A0839A0738A0637A0536A0435A1034A0033A0132A0231A03

OUT1R

DVSS

PGND1

XOE

XCAS

OUT1F

AMP

AMPAMPAMP

A09

XRAS

VM1

PREDRIVEPREDRIVE

DRAM

XWE

IN1F

INTERFACE

MVCI

50D249D048D147

IN1R

PSB

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

GND

IN4R

IN4F

VM4

OUT4F

PGND4

OUT4R

VM34

OUT3R

PGND3

OUT3F

VM3

IN3F

IN3R

PSB

Page 46

• MAIN section

IC301 UDA1341TS/N2

VINL2

BCK

0DB/6DB

VINL1

VDDD

VSSD

DATAO

DATAI

QMUTE

VREF

VOUTL

VSS(AD)

VDD(AD)

PGA PGA

SWITCH

DAC

ADC2L

ADC1L

DIGITAL AGC

DIGITAL MIXER

DECIMATION FILTER

DIGITAL

INTERFACE

DSP FEATURES

INTERPOLATION FILTER

NOISE SHAPER

ADC2R

ADC1R

INTERFACE

0DB/6DB

SWITCH

L3-BUS

PRAK

DETECTOR

VADCP

DAC

VADCN

VINR2

VINR1

AGCSTAT

OVERFLOW

L3CLOCK

L3MODE

L3DATA

SYSCLK

TEST1

TEST2

VOUTR

DD(DAC)

IC441 LB1830M

IN2 IN1 VM VREF VCONT

10 9 8 7 6

VREF

LOGIC

PREDRIVER

2 3

VCC OUT2 GND OUT1 VS

VSS(DAC)

Page 47

6-16. IC PIN FUNCTIONS

• IC101 RF Amplifier (CXA2523AR) (BD board)

Pin No.

1 2 3

4 to 9

10 11 12 13 14 15 16 17 18 19

21 22 23 24 25 26 27 28 29 30 31 32

34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

Pin Name I/O Function

I J VC A to F PD APC APCREF GND TEMPI TEMPR SWDT SCLK XLAT XSTBY

F0CNT

VREF EQADJ 3TADJ Vcc WBLADJ TE CSLED SE ADFM ADIN ADAGC ADFG

AUX

FE ABCD BOTM PEAK RF RFAGC AGCI COMPO COMPP ADDC OPO OPN RFO MORFI MORFO

I-V converted RF signal I input

I-V converted RF signal J input

Middle point voltage (+1.5V) generation output

Signal input from the optical pick-up detector

Light amount monitor input

Laser APC output

Reference voltage input for setting laser power

—

Ground

Temperature sensor connection

Reference voltage output for the temperature sensor

Serial data input from the CXD2650R or CXD2652AR

Serial clock input from the CXD2650R or CXD2652AR

Latch signal input from the CXD2650R or CXD2652AR “L”: Latch

Stand by signal input “L”: Stand by Center frequency control voltage input of BPF22, BPF3T, EQ from the CXD2650R or

CXD2652AR

Reference voltage output (Not used)

I/O

Center frequency setting pin for the internal circuit EQ

I/O

Center frequency setting pin for the internal circuit BPF3T

—

+3V power supply

I/O

Center frequency setting pin for the internal circuit BPF22

Tracking error signal output to the CXD2650R or CXD2652AR

—

External capacitor connection pin for the sled error signal LPF

Sled error signal output to the CXD2650R or CXD2652AR

FM signal output of ADIP

ADIP signal comparator input ADFM is connected with AC coupling

—

External capacitor connection pin for AGC of ADIP

ADIP duplex signal output to the CXD2650R or CXD2652AR I

3 signal/temperature signal output to the CXD2650R or CXD2652AR

(Switching with a serial command)

Focus error signal output to the CXD2650R or CXD2652AR

Light amount signal output to the CXD2650R or CXD2652AR

RF/ABCD bottom hold signal output to the CXD2650R or CXD2652AR

RF/ABCD peak hold signal output to the CXD2650R or CXD2652AR

RF equalizer output to the CXD2650R or CXD2652AR

—

External capacitor connection pin for the RF AGC circuit

Input to the RF AGC circuit The RF amplifier output is input with AC coupling

User comparator output (Not used)

User comparator input (Fixed at “L”)

I/O

External capacitor pin for cutting the low band of the ADIP amplifier

User operation amplifier output (Not used)

User operation amplifier inversion input (Fixed at “L”)

RF amplifier output

Groove RF signal is input with AC coupling

Groove RF signal output

• Abbreviation APC: Auto Power Control AGC: Auto Gain Control

Page 48

• IC121 Digital Signal Processor, Digital Servo Signal Processor, EFM/ACIRC Encoder/Decoder, Shock-proof Memory Controller, ATRAC Encoder/Decoder, 2M Bit DRAM (CXD2654R) (BD board)

Pin No.

2 3 4 5 6 7 8 9

13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

31 to 34

36 to 40

41 42 43 44 45 46 47

Pin Name I/O

MNT0 (FOK)

MNT1 (SHCK) MNT2 (XBUSY) MNT3 (SLOC) SWDT SCLK XLAT SRDT SENS XRST

SQSY

DQSY

RECP XINT TX OSCI OSCO XTSL DIN0 DIN1 DOUT DADTI LRCKI XBCKI ADDT DADT LRCK XBCK FS256 DVDD A03 to A00 A10 A04 to A08 A11 DVSS XOE XCAS A09 XRAS XWE

Function

FOK signal output to the system control (monitor output)

“H” is output when focus is on Track jump detection signal output to the system control (monitor output)

Monitor 2 output to the system control (monitor output)

Monitor 3 output to the system control (monitor output)

Writing data signal input from the system control

Serial clock signal input from the system control

I (S)

Serial latch signal input from the system control

I (S)

Reading data signal output to the system control

O (3)

Internal status (SENSE) output to the system control

O (3)

Reset signal input from the system control “L”: Reset

I (S)

Subcode Q sync (SCOR) output to the system control

“L” is output every 13.3 msec. Almost all, “H” is output Digital In U-bit CD format or MD format subcode Q sync (SCOR) output to the system

control Laser power switching input from the system control “H”: Recording, “L”: Playback

Interrupt status output to the system control

Recording data output enable input from the system control

System clock input (512Fs=22.5792 MHz)

System clock output (512Fs=22.5792 MHz) (Not used)

System clock frequency setting “L”: 45.1584 MHz, “H”: 22.5792 MHz (Fixed at “H”)

Digital audio input (Optical input)

Digital audio output (Optical output)

Serial data input

LR clock input “H” : Lch, “L” : R ch

Serial data clock input

Data input from the A/D converter

Data output to the D/A converter

LR clock output for the A/D and D/A converter (44.1 kHz)

Bit clock output to the A/D and D/A converter (2.8224 MHz)

11.2896 MHz clock output (Not used)

+3V power supply (Digital)

—

DRAM address output

DRAM address output (Not used)

DRAM address output

DRAM address output (Not used)

Ground (Digital)

—

Output enable output for DRAM

CAS signal output for DRAM

Address output for DRAM

RAS signal output for DRAM

Write enable signal output for DRAM (Used : CXD2652AR, Not used : CXD2650R)

* I (S) stands for Schmidt input, I (A) for analog input, O (3) for 3-state output, and O (A) for analog output in the column I/O

Page 49

Pin No.

48 49

50, 51

52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85

Pin Name I/O

D1 D0 D2, D3 MVCI ASYO ASYI AVDD BIAS RFI AVSS PCO FILI FILO CLTV PEAK BOTM ABCD FE AUX1 VC ADIO AVDD ADRT ADRB AVSS SE TE DCHG APC ADFG F0CNT XLRF CKRF DTRF APCREF TEST0 TRDR

Function

I/O

Data input/output for DRAM

I/O I/O

Clock input from an external VCO (Fixed at “L”)

I (S)

Playback EFM duplex signal output

Playback EFM comparator slice level input

I (A)

+3V power supply (Analog)

—

Playback EFM comparator bias current input

I (A)

Playback EFM RF signal input

I (A)

Ground (Analog)

—

Phase comparison output for the recording/playback EFM master PLL

O (3)

Filter input for the recording/playback EFM master PLL

I (A)

Filter output for the recording/playback EFM master PLL

O (A)

Internal VCO control voltage input for the recording/playback EFM master PLL

I (A)

Light amount signal peak hold input from the CXA2523R

I (A)

Light amount signal bottom hold input from the CXA2523R

I (A)

Light amount signal input from the CXA2523R

I (A)

Focus error signal input from the CXA2523R

I (A)

Auxiliary A/D input

I (A)

Middle point voltage (+1.5V) input from the CXA2523R

I (A)

Monitor output of the A/D converter input signal (Not used)

O (A)

+3V power supply (Analog)

—

A/D converter operational range upper limit voltage input (Fixed at “H”)

I (A)

A/D converter operational range lower limit voltage input (Fixed at “L”)

I (A)

Ground (Analog)

—

Sled error signal input from the CXA2523R

I (A)

Tracking error signal input from the CXA2523R

I (A)

Connected to +3V power supply

I (A)

Error signal input for the laser digital APC (Fixed at “L”)

I (A)

ADIP duplex FM signal input from the CXA2523R (22.05 ± 1 kHz)

I (S)

Filter f

O O O O O O O

0 control output to the CXA2523R

Control latch output to the CXA2523R Control clock output to the CXA2523R Control data output to the CXA2523R Reference PWM output for the laser APC PWM output for the laser digital APC (Not used) Tracking servo drive PWM output (–)

• Abbreviation EFM: Eight to Fourteen Modulation PLL : Phase Locked Loop VCO: Voltage Controlled Oscillator

Page 50

Pin No.

86 87 88 89 90 91 92 93 94 95

96 to 98

100

• Abbreviation EFM: Eight to Fourteen Modulation

Pin Name I/O

TFDR DVDD FFDR FRDR FS4 SRDR SFDR SPRD SPFD FGIN TEST1 to TEST3 DVSS EFMO

Tracking servo drive PWM output (+)

+3V power supply (Digital)

—

Focus servo drive PWM output (+)

Focus servo drive PWM output (–)

176.4 kHz clock signal output (X’tal) (Not used)

Sled servo drive PWM output (–)

Sled servo drive PWM output (+)

Spindle servo drive PWM output (–)

Spindle servo drive PWM output (+)

I (S)

Test input (Fixed at “L”)

Ground (Digital)

—

EFM output when recording

Function

Page 51

• IC501 System Control (M30620MC-406FP) (MAIN board)

Pin No.

1, 2

3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

24 to 27

28 29 30 31 32 33 34 35 36 37

38 to 41

42, 43

44 45 46 47 48 49 50 51 52 53 54 55 56

57, 58

Pin Name I/O Function

NC C1ER ADER SQSY RMC A1 IN BYTE CNVSS XIN-T XOUT-T S.RST XOUT GND XIN +3.3V NMI DQSY P.DOWN KEYBOARD CLK KEYBOARD DATA BEEP OUT XINIT NC L3 CLOCK NC LC DATA SWDT SRDT SCLK FLCS FLDATA NC FLCLK NC JOG1, JOG0 NC A1 OUT NC L3 MODE DA.RST MUTE STB CHACK IN NC PACK-OUT LDIN LDOUT LD-LOW NC REC-P

Not used (Fixed at “L”)

C1 error rate voltage output (Fixed at “L”) (Not used)

AD error rate voltage output (Fixed at “L”) (Not used)

ADIP sync or subcode Q sync input from CXD2654R

Remote controls

A1 Control input (Fixed at “L”)

Data bus changed input (Fixed at “L”)

—

Ground

Not used (Fixed at “L”)

System rest input

Main clock output (7.0MHz)

—

Ground

Main clock input (7.0MHz)

—

+3.3V power supply

(Fixed at “H”)

Digital in sync input

Power down detection input “L”: Power down

Not used

—

Not used

Interrupt status input from CXD2654R

Not used

Serial clock signal output to IC301

Not used

Serial data signal input to IC301

Writing data signal output to the serial bus

Reading data signal input from the serial bus

Clock signal output to the serial bus

Chip select signal output to the display driver

Serial data signal output to the display driver

Not used (Fixed at “L”)

Serial clock signal output to the display driver

Not used

A1 output

Not used

Serial mode signal output to IC301

Not used Reset: “L”

DA line out muting output Mute: “L”

Strobe signal output to the power supply circuit Power supply ON: “H”, stand by: “L”

Detection input from the chucking-in switch “L”: Chucking

Not used (Fixed at “L”)

Detection input from the loading out switch. Loaded out position: “L”, Others: “H”

Loading motor control input

Loading motor control output

Loading motor voltage control output Low voltage: “H”

Not used (Fixed at “L”)

Detection signal input from the recording position detection switch

Page 52

Pin No.

60 61 62 63 64 65 66 67

70 71 72 73 74 75 76

81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99

100

Pin Name I/O

PB-P REC/PB +3.3V NC GND SDA MNT3 (SLOCK) WR PWR

PROTECT

REFLECT

LDON SENS NMT1 (SHOCK) DIG-RST MNT2 (XBUSY) XLATCH MOD

LIMIT-IN

MNT0 (FOK)

SCL

SCTX

CLKSET0 CLKSET1 LED0 LED1 OPT DEL OPT SEL MODE SEL 0 MODE SEL 1 REC BEEP SW NC NC KEY 3 KEY 2 KEY 1 AVSS KEY0 VREF +3.3V MONO/ST

Function

Detection signal input from the playback position detection switch

Not used Write: “H”

+3.3V power supply

—

Not used (Fixed at “L”)

Ground

—

Data signal input/output pin with the backup memory

I/O

In the state of spindle servo lock from the CXD2564R

Write power ON/OFF output

Recording-protection claw detection input from the protection detection switch

Protect: “H” Disk reflection rate detection input from the reflect detection switch

Disk with low reflection rate: “H” Laser ON/OFF control output “H”: Laser ON

Internal status (SENSE) input from the CXD2654R

Track jump signal input from the CXD2654R

Digital rest signal output to the CXD2654R and motor driver Reset: “L”

In the state of executive command from the CXD2654R

Latch signal output to the serial bus

Laser modulation switching signal output

Detection input from the limit switch

Sled limit-In: “L” Focus OK signal input from the CXD26504R

“H” is input when focus is on Clock signal output to the backup memory

Writing data transmission timing output to the CXD2654R

Shared with the magnetic head ON/OFF output Clock destination select pin US, Canadian: “L”, Except US, Canadian :“H”

Clock destination select pin US, Canadian: “H”, Except US, Canadian :“L”

I O O O

Not used

I O O

Beep switch

Not used

Key input pin (A/D input)

Ground (Analog)

—

Key input pin (A/D input)

A/D reference voltage (Fixed at “H”)

—

+3.3V power supply

—

Monaural, stereo change input Monaural: “L”

Page 53

SECTION 7

EXPLODED VIEWS

NOTE:

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• The mechanical parts with no reference number in the exploded views are not supplied.

• Hardware (# mark) list and accessories and packing materials are given in the last of this parts list.

7-1. CABINET SECTION

not supplied

• Abbreviation CND : Canadian model SP : Singapore model

MDM-5A

not supplied

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

(AEP,SP)

(SP)

(UK)

not supplied

(US,CND)

FL701

not supplied

T901

not supplied

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

1 X-4951-678-1 PANEL ASSY, FRONT 2 4-220-561-01 FOOT 3 4-216-729-31 LID(CARTRIDGE) 4 4-976-593-01 SPRING (LID), TORSION 5 3-348-383-01 SCREW(M2X6.0), +B TAPPING

6 X-4951-680-1 CHASSIS ASSY 7 3-703-599-01 SCREW, +BTT (M3) S TITE 8 A-4724-778-A PANEL BOARD, COMPLETE (US,CND) 8 A-4724-786-A PANEL BOARD, COMPLETE (AEP,UK,SP) 9 4-220-557-01 HOLDER (FL)

10 4-220-569-01 CASE 11 4-976-827-21 SCREW, FLAT HEAD 12 4-999-839-01 SCREW (+BVTTWH M3), STEP 13 1-569-008-21 ADAPTOR, CONVERSION 2P (SP) 14 A-4724-776-A MAIN BOARD, COMPLETE (US,CND)

14 A-4724-782-A MAIN BOARD, COMPLETE (AEP,UK,SP) 15 1-791-161-11 WIRE(FLAT TYPE) (15 CORE)

16 1-791-160-11 WIRE(FLAT TYPE) (23 CORE)(180mm) 17 1-791-158-11 WIRE(FLAT TYPE) (23 CORE)(90mm) 18 1-791-159-11 WIRE(FLAT TYPE) (21 CORE)

19 4-220-570-11 PANEL, BACK 20 3-703-244-00 BUSHING (2104), CORD

! 21 1-696-586-21 CORD, POWER (UK) ! 21 1-751-275-11 CORD, POWER (AEP,SP) ! 21 1-783-531-31 CORD, POWER (US,CND)

22 3-703-249-01 SCREW, S TIGHT, +PTTWH 3X6 23 4-965-822-01 FOOT 24 A-4724-780-A POWER BOARD, COMPLETE (US,CND) 24 A-4724-784-A POWER BOARD, COMPLETE (AEP,UK,SP) 25 1-674-897-11 BACK UP BOARD

* 26 4-949-935-51 CUSHION (FL)

FL701 1-517-907-11 INDICATOR TUBE, FLUORESCENT

! T901 1-433-910-11 TRANSFORMER, POWER (US,CND) ! T901 1-433-911-11 TRANSFORMER, POWER (AEP,UK,SP)

Page 54

7-2. MECHANISM SECTION (MDM-5A)

524

513

not supplied

509

503

507

508

502

501

510

513

511

514

512

515

516

517 518

503

519

521

520

522

523

507

525

526

506

M103

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

* 501 1-668-111-11 SW BOARD * 502 4-996-217-01 CHASSIS

503 4-996-223-01 INSULATOR (F)

* 504 4-996-218-01 BRACKET (GUIDE R)

505 4-996-277-01 SPRING (O/C), TENSION

506 4-996-226-01 LEVER (O/C) 507 4-999-347-01 INSULATOR (R)

* 508 4-996-225-01 BRACKET (GUIDE L)

509 4-988-466-21 SPRING (ELECTROSTATIC), LEAF 510 4-996-219-01 GEAR (CAM GEAR)

511 4-996-220-01 GEAR (A) 512 4-996-221-01 GEAR (B) 513 4-933-134-01 SCREW (+PTPWH M2.6X6) 514 4-996-224-01 SCREW (1.7X3), +PWH

515 4-996-227-01 LEVER (HEAD)

516 4-996-229-01 SPRING (HEAD LEVER), TORSION 517 4-996-212-01 LEVER (LIMITTER) 518 4-996-213-01 SPRING (LIMITTER), TORSION 519 4-996-214-01 SPRING (SLIDER), TENSION 520 4-996-216-01 SPRING (HOLDER), TENSION

521 4-210-396-01 SPRING (LOCK), TENSION 522 X-4951-631-1 SLIDER ASSY

* 523 X-4949-245-7 HOLDER ASSY * 524 4-996-211-01 SLIDER (CAM)

525 4-998-763-01 SPRING (SHUTTER), LEAF

526 A-4680-417-A HOLDER COMPLETE ASSY M103 X-4949-264-1 MOTOR ASSY, LOADING

504

MBU-5A

505

Page 55

7-3. BASE UNIT SECTION (MBU-5A)

564

552

565

566

HR901

571

563

570

not supplied

M101

S102

554

553

572

M102

562

561

552

557

567

569

568

555

556

559

560

558

551

552

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 551 A-4699-893-A BD BOARD, COMPLETE

552 3-372-761-01 SCREW (M1.7), TAPPING

* 553 4-996-267-01 BASE (BU-D) * 554 4-996-255-01 BASE (BU-C)

555 4-900-590-01 SCREW, PRECISION SMALL

556 4-996-258-01 SPRING, COMPRESSION 557 4-996-262-01 GEAR (SL-C) 558 1-667-954-11 FLEXIBLE BOARD

* 559 4-210-664-01 BASE (BU-A) ! 560 A-4672-541-A OPTICAL PICK-UP KMS-260B/J1N

* 561 4-996-252-01 CHASSIS, BU * 562 4-996-254-01 BASE (BU-B)

563 4-967-688-11 MAGNET, ABSORPTION 564 4-996-260-01 GEAR (SL-A)

565 4-996-261-01 GEAR (SL-B)

566 4-996-264-01 SPRING (SHAFT), LEAF 567 4-996-265-01 SHAFT, MAIN 568 4-996-256-01 SL(BASE) 569 4-996-257-01 RACK (SL) 570 4-996-263-01 SPRING (CLV), TORSION

571 4-988-560-01 SCREW (+P 1.7X6) 572 4-211-036-01 SCREW (1.7X2.5), +PWH HR901 1-500-502-11 HEAD, OVER LIGHT M101 A-4672-475-A MOTOR ASSY, SPINDLE M102 A-4672-474-A MOTOR ASSY, SLED

S102 1-762-148-21 SWITCH, PUSH (2 KEY)

Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

Page 56

SECTION 8

BACK UP

Note:

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

When indicating parts by reference number, please include the board name.

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

1-674-897-11 BACK UP BOARD

************

< BATTERY >

ELECTRICAL PARTS LIST

• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.

• -XX, -X mean standardized parts, so they may have some difference from the original one.

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• RESISTORS All resistors are in ohms METAL: Metal-film resistor METAL OXIDE: Metal Oxide-film resistor F : nonflammable

C142 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C143 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C144 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C146 1-163-038-91 CERAMIC CHIP 0.1uF 25V

• SEMICONDUCTORS In each case, u: µ , for example: uA...: µ A..., uPA...: µPA..., uPB...: µ PB..., uPC...: µ PC..., uPD...: µ PD...

• CAPACITORS uF : µ F

• COILS uH : µ H

• Abbreviation CND : Canadian model SP : Singapore model

BT451 1-528-887-11 BATTERY, LITHIUM SECONDARY

< CONNECTOR >

* CN452 1-569-499-11 PIN, CONNECTOR 3P

**************************************************************

* A-4699-893-A BD BOARD, COMPLETE

*****************

< CAPACITOR >

C101 1-125-822-11 TANTALUM 10uF 20% 10V C102 1-163-038-91 CERAMIC CHIP 0.1uF 25V C103 1-125-822-11 TANTALUM 10uF 20% 10V C104 1-125-822-11 TANTALUM 10uF 20% 10V C105 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V

C106 1-163-275-11 CERAMIC CHIP 0.001uF 5% 50V C107 1-163-038-91 CERAMIC CHIP 0.1uF 25V C108 1-163-038-91 CERAMIC CHIP 0.1uF 25V C109 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V C111 1-164-344-11 CERAMIC CHIP 0.068uF 10% 25V

C112 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C113 1-109-982-11 CERAMIC CHIP 1uF 10% 10V C115 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V C116 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V C117 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V

C151 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C152 1-163-038-91 CERAMIC CHIP 0.1uF 25V C153 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V C156 1-163-038-91 CERAMIC CHIP 0.1uF 25V C158 1-163-019-00 CERAMIC CHIP 0.0068uF 10% 50V

C160 1-104-601-11 ELECT CHIP 10uF 20% 10V C161 1-104-601-11 ELECT CHIP 10uF 20% 10V C163 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V C164 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V C167 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C168 1-163-038-91 CERAMIC CHIP 0.1uF 25V C169 1-125-822-11 TANTALUM 10uF 20% 10V C171 1-163-038-91 CERAMIC CHIP 0.1uF 25V C181 1-104-913-11 TANTAL. CHIP 10uF 20% 16V C183 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C184 1-117-970-11 ELECT CHIP 22uF 20% 10V C185 1-164-611-11 CERAMIC CHIP 0.001uF 10% 500V C187 1-104-913-11 TANTAL. CHIP 10uF 20% 16V C188 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V C189 1-163-989-11 CERAMIC CHIP 0.033uF 10% 25V

C190 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C191 1-163-038-91 CERAMIC CHIP 0.1uF 25V C196 1-163-038-91 CERAMIC CHIP 0.1uF 25V C197 1-163-038-91 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

C118 1-163-038-91 CERAMIC CHIP 0.1uF 25V C119 1-125-822-11 TANTALUM 10uF 20% 10V C121 1-125-822-11 TANTALUM 10uF 20% 10V C122 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V C123 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C124 1-163-038-91 CERAMIC CHIP 0.1uF 25V C127 1-163-038-91 CERAMIC CHIP 0.1uF 25V C128 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V C129 1-107-823-11 CERAMIC CHIP 0.47uF 10% 16V C130 1-163-251-11 CERAMIC CHIP 100PF 5% 50V

C131 1-163-023-00 CERAMIC CHIP 0.015uF 5% 50V C132 1-107-823-11 CERAMIC CHIP 0.47uF 10% 16V C133 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C134 1-163-038-91 CERAMIC CHIP 0.1uF 25V C135 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C136 1-126-206-11 ELECT CHIP 100uF 20% 6.3V

CN101 1-569-479-21 CONNECTOR, FPC 21P CN102 1-784-833-21 CONNECTOR,FFC(LIF(NON-ZIF))21P CN103 1-784-834-21 CONNECTOR,FFC(LIF(NON-ZIF))23P CN104 1-770-687-11 CONNECTOR, FFC/FPC 4P CN110 1-695-440-21 PIN, CONNECTOR (PC BOARD) 6P

< DIODE >

D101 8-719-988-61 DIODE 1SS355TE-17 D181 8-719-046-86 DIODE F1J6TP D183 8-719-046-86 DIODE F1J6TP

< IC >

IC101 8-752-080-95 IC CXA2523AR IC103 8-729-903-10 TRANSISTOR FMW1-T-148 IC121 8-752-389-44 IC CXD2654R IC123 8-759-096-87 IC TC7WU04FU(TE12R) IC124 8-759-498-44 IC MSM51V4400-70TS-K

Page 57

BD MAIN

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

IC152 8-759-430-25 IC BH6511FS-E2 IC171 8-759-487-04 IC BR24C02F-E2 IC181 8-759-481-17 IC MC74ACT08DTR2 IC192 8-759-460-72 IC BA033FP-E2

< COIL >

L101 1-414-813-11 FERRITE 0uH L102 1-414-813-11 FERRITE 0uH L103 1-414-813-11 FERRITE 0uH L105 1-414-813-11 FERRITE 0uH L106 1-414-813-11 FERRITE 0uH

L121 1-414-813-11 FERRITE 0uH L122 1-414-813-11 FERRITE 0uH L151 1-412-029-11 INDUCTOR CHIP 10uH L152 1-412-029-11 INDUCTOR CHIP 10uH L153 1-412-032-11 INDUCTOR CHIP 100uH

L154 1-412-032-11 INDUCTOR CHIP 100uH L161 1-414-813-11 FERRITE 0uH L162 1-414-813-11 FERRITE 0uH L181 1-216-295-91 SHORT 0

R136 1-216-049-91 RES,CHIP 1K 5% 1/10W R137 1-216-295-91 SHORT 0 R140 1-216-029-00 METAL CHIP 150 5% 1/10W R142 1-216-073-00 METAL CHIP 10K 5% 1/10W R143 1-216-073-00 METAL CHIP 10K 5% 1/10W

R144 1-216-025-91 RES,CHIP 100 5% 1/10W R145 1-216-073-00 METAL CHIP 10K 5% 1/10W R146 1-216-037-00 METAL CHIP 330 5% 1/10W R147 1-216-025-91 RES,CHIP 100 5% 1/10W R148 1-216-045-00 METAL CHIP 680 5% 1/10W

R149 1-216-073-00 METAL CHIP 10K 5% 1/10W R150 1-216-295-91 SHORT 0 R151 1-216-073-00 METAL CHIP 10K 5% 1/10W R152 1-216-073-00 METAL CHIP 10K 5% 1/10W R158 1-216-097-91 RES,CHIP 100K 5% 1/10W

R159 1-216-097-91 RES,CHIP 100K 5% 1/10W R160 1-216-295-91 SHORT 0 R161 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R162 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R163 1-216-057-00 METAL CHIP 2.2K 5% 1/10W

< TRANSISTOR >

Q101 8-729-403-35 TRANSISTOR UN5113 Q102 8-729-026-53 TRANSISTOR 2SA1576A-T106-QR Q103 8-729-402-93 TRANSISTOR UN5214 Q104 8-729-402-93 TRANSISTOR UN5214 Q162 8-729-101-07 TRANSISTOR 2SB798-DL

Q163 8-729-403-35 TRANSISTOR UN5113 Q181 8-729-018-75 TRANSISTOR 2SJ278MYTR Q182 8-729-017-65 TRANSISTOR 2SK1764KYTR

< RESISTOR >

R103 1-216-049-91 RES,CHIP 1K 5% 1/10W R104 1-216-073-00 METAL CHIP 10K 5% 1/10W R105 1-216-065-91 RES,CHIP 4.7K 5% 1/10W R106 1-216-133-00 METAL CHIP 3.3M 5% 1/10W R107 1-216-113-00 METAL CHIP 470K 5% 1/10W

R109 1-216-295-91 SHORT 0 R110 1-216-073-00 METAL CHIP 10K 5% 1/10W R111 1-216-295-91 SHORT 0 R112 1-216-089-91 RES,CHIP 47K 5% 1/10W R113 1-216-049-91 RES,CHIP 1K 5% 1/10W

R115 1-216-049-91 RES,CHIP 1K 5% 1/10W R117 1-216-113-00 METAL CHIP 470K 5% 1/10W R120 1-216-025-91 RES,CHIP 100 5% 1/10W R121 1-216-097-91 RES,CHIP 100K 5% 1/10W R123 1-216-295-91 SHORT 0

R124 1-216-025-91 RES,CHIP 100 5% 1/10W R125 1-216-025-91 RES,CHIP 100 5% 1/10W R127 1-216-025-91 RES,CHIP 100 5% 1/10W R129 1-216-295-91 SHORT 0 R130 1-216-295-91 SHORT 0

R164 1-216-045-00 METAL CHIP 680 5% 1/10W R165 1-216-097-91 RES,CHIP 100K 5% 1/10W R167 1-216-065-91 RES,CHIP 4.7K 5% 1/10W R169 1-219-724-11 METAL CHIP 1 1% 1/4W R170 1-216-073-00 METAL CHIP 10K 5% 1/10W

R171 1-216-073-00 METAL CHIP 10K 5% 1/10W R173 1-216-121-91 RES,CHIP 1M 5% 1/10W R175 1-216-065-91 RES,CHIP 4.7K 5% 1/10W R177 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R179 1-216-085-00 METAL CHIP 33K 5% 1/10W

R180 1-216-073-00 METAL CHIP 10K 5% 1/10W R182 1-216-089-91 RES,CHIP 47K 5% 1/10W R183 1-216-089-91 RES,CHIP 47K 5% 1/10W R184 1-216-073-00 METAL CHIP 10K 5% 1/10W R185 1-216-081-00 METAL CHIP 22K 5% 1/10W

R186 1-216-089-91 RES,CHIP 47K 5% 1/10W R188 1-216-073-00 METAL CHIP 10K 5% 1/10W R189 1-216-073-00 METAL CHIP 10K 5% 1/10W R190 1-216-073-00 METAL CHIP 10K 5% 1/10W R195 1-216-073-00 METAL CHIP 10K 5% 1/10W

R196 1-216-295-91 SHORT 0 R197 1-216-295-91 SHORT 0 R198 1-216-286-00 RES,CHIP 4.7M 5% 1/8W R198 1-216-296-91 SHORT 0

< SWITCH >

S101 1-762-596-21 SWITCH, PUSH (1 KEY)(LIMIT SW)

**************************************************************

A-4724-776-A MAIN BOARD, COMPLETE (US,CND)

********************

R131 1-216-073-00 METAL CHIP 10K 5% 1/10W R132 1-216-097-91 RES,CHIP 100K 5% 1/10W R133 1-216-117-00 METAL CHIP 680K 5% 1/10W R134 1-216-049-91 RES,CHIP 1K 5% 1/10W R135 1-216-061-00 METAL CHIP 3.3K 5% 1/10W

A-4724-782-A MAIN BOARD, COMPLETE (AEP,UK,SP)

********************

< CAPACITOR >

C101 1-163-005-11 CERAMIC CHIP 470PF 10% 50V

Page 58

MAIN

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

C102 1-124-779-00 ELECT CHIP 10uF 20% 16V C181 1-126-395-11 ELECT 22uF 20% 16V C182 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C183 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V

D390 8-719-016-74 DIODE 1SS352-TPH3 D391 8-719-016-74 DIODE 1SS352-TPH3

< DIODE >

C184 1-126-603-11 ELECT CHIP 4.7uF 20% 35V C185 1-163-117-00 CERAMIC CHIP 100PF 5% 50V C201 1-163-005-11 CERAMIC CHIP 470PF 10% 50V C202 1-124-779-00 ELECT CHIP 10uF 20% 16V C281 1-126-395-11 ELECT 22uF 20% 16V

C282 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C283 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C284 1-126-603-11 ELECT CHIP 4.7uF 20% 35V C285 1-163-117-00 CERAMIC CHIP 100PF 5% 50V C300 1-126-177-11 ELECT 100uF 20% 10V

C301 1-163-038-91 CERAMIC CHIP 0.1uF 25V C302 1-126-177-11 ELECT 100uF 20% 10V C303 1-163-038-91 CERAMIC CHIP 0.1uF 25V C304 1-163-038-91 CERAMIC CHIP 0.1uF 25V C305 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C306 1-126-934-11 ELECT 220uF 20% 10V C307 1-163-038-91 CERAMIC CHIP 0.1uF 25V C308 1-126-177-11 ELECT 100uF 20% 10V C315 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C316 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V

C317 1-163-117-00 CERAMIC CHIP 100PF 5% 50V C321 1-124-779-00 ELECT CHIP 10uF 20% 16V C322 1-124-779-00 ELECT CHIP 10uF 20% 16V C351 1-163-233-11 CERAMIC CHIP 18PF 5% 50V C352 1-163-234-11 CERAMIC CHIP 20PF 5% 50V

< GROUND TERMINAL >

EP911 1-537-771-21 TERMINAL BOARD, GROUND EP912 1-537-771-21 TERMINAL BOARD, GROUND

< FERRITE BEAD >

FB301 1-414-235-22 INDUCTOR CHIP 0UH FB302 1-414-235-22 INDUCTOR CHIP 0UH FB303 1-414-235-22 INDUCTOR CHIP 0UH FB306 1-414-235-22 INDUCTOR CHIP 0UH FB307 1-414-235-22 INDUCTOR CHIP 0UH

FB351 1-414-235-22 INDUCTOR CHIP 0UH FB352 1-414-235-22 INDUCTOR CHIP 0UH FB356 1-414-235-22 INDUCTOR CHIP 0UH

< IC >

IC301 8-759-553-65 IC UDA1341TS IC308 8-759-636-55 IC M5218AFP-T1 IC351 8-759-242-70 IC TC7WU04F-TE12L IC381 8-759-636-55 IC M5218AFP-T1 IC382 8-759-636-55 IC M5218AFP-T1

IC441 8-759-481-19 IC LB1830M-S-TE-L IC501 8-759-599-90 IC M30620MC-406FP

< JACK >

C353 1-163-038-91 CERAMIC CHIP 0.1uF 25V C354 1-163-038-91 CERAMIC CHIP 0.1uF 25V C370 1-126-933-11 ELECT 100uF 20% 16V C371 1-126-933-11 ELECT 100uF 20% 16V C385 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C386 1-163-038-91 CERAMIC CHIP 0.1uF 25V C426 1-128-551-11 ELECT 22uF 20% 35V C500 1-131-347-00 TANTALUM 1uF 10% 35V C512 1-163-038-91 CERAMIC CHIP 0.1uF 25V C516 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C519 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C562 1-163-038-91 CERAMIC CHIP 0.1uF 25V C571 1-163-117-00 CERAMIC CHIP 100PF 5% 50V C572 1-163-117-00 CERAMIC CHIP 100PF 5% 50V C595 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V

C597 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C598 1-163-038-91 CERAMIC CHIP 0.1uF 25V C599 1-163-038-91 CERAMIC CHIP 0.1uF 25V C951 1-104-664-11 ELECT 47uF 20% 10V C953 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C954 1-163-038-91 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

CN412 1-784-834-21 CONNECTOR,FFC(LIF(NON-ZIF))23P CN421 1-793-448-11 CONNECTOR, FFC 15P CN501 1-784-834-21 CONNECTOR,FFC(LIF(NON-ZIF))23P CN502 1-770-215-11 PIN, CONNECTOR (PC BOARD) 7P CN503 1-784-860-21 CONNECTOR, FFC(LIF(NON-ZIF))8P

J101 1-793-344-11 JACK, PIN 4P

< COIL >

L450 1-216-296-91 SHORT 0 L451 1-216-296-91 SHORT 0

< TRANSISTOR >

Q191 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO Q192 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO Q291 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO Q292 8-729-046-97 TRANSISTOR 2SD1938(F)-T(TX).SO Q390 8-729-424-08 TRANSISTOR UN2111-TX

Q441 8-729-421-22 TRANSISTOR UN2211-TX

< RESISTOR >

R82 1-216-097-91 RES,CHIP 100K 5% 1/10W R101 1-216-049-91 RES,CHIP 1K 5% 1/10W R102 1-216-097-91 RES,CHIP 100K 5% 1/10W R106 1-216-075-00 METAL CHIP 12K 5% 1/10W R181 1-216-073-00 METAL CHIP 10K 5% 1/10W

R182 1-216-073-00 METAL CHIP 10K 5% 1/10W R183 1-216-080-00 METAL CHIP 20K 5% 1/10W R184 1-216-683-11 METAL CHIP 22K 0.5% 1/10W R185 1-216-041-00 METAL CHIP 470 5% 1/10W R186 1-216-041-00 METAL CHIP 470 5% 1/10W

R187 1-216-089-91 RES,CHIP 47K 5% 1/10W R188 1-216-045-00 METAL CHIP 680 5% 1/10W

Page 59

MAIN

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

R189 1-216-037-00 METAL CHIP 330 5% 1/10W R191 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R192 1-216-057-00 METAL CHIP 2.2K 5% 1/10W

R201 1-216-049-91 RES,CHIP 1K 5% 1/10W R202 1-216-097-91 RES,CHIP 100K 5% 1/10W R206 1-216-075-00 METAL CHIP 12K 5% 1/10W R281 1-216-073-00 METAL CHIP 10K 5% 1/10W R282 1-216-073-00 METAL CHIP 10K 5% 1/10W

X351 1-579-314-11 VIBRATOR, CRYSTAL (22.5792MHz) X513 1-781-174-21 VIBRATOR, CERAMIC (10MHz)

**************************************************************

A-4724-778-A PANEL BOARD, COMPLETE (US,CND)

< VIBRATOR >

*********************

PANEL

R283 1-216-080-00 METAL CHIP 20K 5% 1/10W R284 1-216-683-11 METAL CHIP 22K 0.5% 1/10W R285 1-216-041-00 METAL CHIP 470 5% 1/10W R286 1-216-041-00 METAL CHIP 470 5% 1/10W R287 1-216-089-91 RES,CHIP 47K 5% 1/10W

R288 1-216-045-00 METAL CHIP 680 5% 1/10W R289 1-216-037-00 METAL CHIP 330 5% 1/10W R291 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R292 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R311 1-216-025-91 RES,CHIP 100 5% 1/10W

R312 1-216-025-91 RES,CHIP 100 5% 1/10W R313 1-216-025-91 RES,CHIP 100 5% 1/10W R314 1-216-025-91 RES,CHIP 100 5% 1/10W R339 1-216-295-91 SHORT 0 R341 1-216-295-91 SHORT 0

R342 1-216-295-91 SHORT 0 R351 1-216-121-91 RES,CHIP 1M 5% 1/10W R352 1-216-041-00 METAL CHIP 470 5% 1/10W R355 1-216-029-00 METAL CHIP 150 5% 1/10W R356 1-216-031-00 METAL CHIP 180 5% 1/10W

R357 1-216-296-91 SHORT 0 R391 1-216-097-91 RES,CHIP 100K 5% 1/10W R392 1-216-101-00 METAL CHIP 150K 5% 1/10W R441 1-216-057-00 METAL CHIP 2.2K 5% 1/10W R442 1-216-053-00 METAL CHIP 1.5K 5% 1/10W

R443 1-216-055-00 METAL CHIP 1.8K 5% 1/10W R500 1-216-073-00 METAL CHIP 10K 5% 1/10W R508 1-216-025-91 RES,CHIP 100 5% 1/10W R509 1-216-073-00 METAL CHIP 10K 5% 1/10W R530 1-216-065-91 RES,CHIP 4.7K 5% 1/10W

R531 1-216-073-00 METAL CHIP 10K 5% 1/10W R533 1-216-073-00 METAL CHIP 10K 5% 1/10W R549 1-216-025-91 RES,CHIP 100 5% 1/10W R550 1-216-073-00 METAL CHIP 10K 5% 1/10W R551 1-216-073-00 METAL CHIP 10K 5% 1/10W

R553 1-216-073-00 METAL CHIP 10K 5% 1/10W R559 1-216-073-00 METAL CHIP 10K 5% 1/10W R560 1-216-073-00 METAL CHIP 10K 5% 1/10W R568 1-216-073-00 METAL CHIP 10K 5% 1/10W R569 1-216-073-00 METAL CHIP 10K 5% 1/10W

R573 1-216-073-00 METAL CHIP 10K 5% 1/10W R575 1-216-073-00 METAL CHIP 10K 5% 1/10W R577 1-216-073-00 METAL CHIP 10K 5% 1/10W R581 1-216-097-91 RES,CHIP 100K 5% 1/10W R595 1-216-073-00 METAL CHIP 10K 5% 1/10W

R597 1-216-073-00 METAL CHIP 10K 5% 1/10W R852 1-216-097-91 RES,CHIP 100K 5% 1/10W

A-4724-786-A PANEL BOARD, COMPLETE (AEP,UK,SP)

*********************

4-220-557-01 HOLDER (FL)

* 4-949-935-51 CUSHION (FL)

7-685-647-79 SCREW +BVTP 3X10 TYPE2 IT-3

< CAPACITOR >

C411 1-126-939-11 ELECT 10000uF 20% 16V C412 1-126-964-11 ELECT 10uF 20% 50V C414 1-163-038-91 CERAMIC CHIP 0.1uF 25V C415 1-126-916-11 ELECT 1000uF 20% 6.3V C416 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C417 1-104-664-11 ELECT 47uF 20% 10V C418 1-163-038-91 CERAMIC CHIP 0.1uF 25V C419 1-126-964-11 ELECT 10uF 20% 50V C420 1-126-926-11 ELECT 1000uF 20% 10V C421 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V

C423 1-126-968-11 ELECT 100uF 20% 50V C424 1-163-038-91 CERAMIC CHIP 0.1uF 25V C425 1-126-967-11 ELECT 47uF 20% 50V C427 1-163-038-91 CERAMIC CHIP 0.1uF 25V C428 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C431 1-126-966-11 ELECT 33uF 20% 16V C432 1-126-964-11 ELECT 10uF 20% 50V C461 1-126-935-11 ELECT 470uF 20% 16V C466 1-126-935-11 ELECT 470uF 20% 16V C601 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V

C611 1-163-038-91 CERAMIC CHIP 0.1uF 25V C612 1-126-205-11 ELECT CHIP 47uF 20% 6.3V C613 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V C621 1-163-038-91 CERAMIC CHIP 0.1uF 25V C623 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V

C661 1-163-038-91 CERAMIC CHIP 0.1uF 25V C662 1-126-205-11 ELECT CHIP 47uF 20% 6.3V C802 1-163-038-91 CERAMIC CHIP 0.1uF 25V

! C901 1-113-924-11 CERAMIC 0.0047uF 20% 250V ! C902 1-113-924-11 CERAMIC 0.0047uF 20% 250V

C911 1-163-038-91 CERAMIC CHIP 0.1uF 25V C912 1-163-038-91 CERAMIC CHIP 0.1uF 25V C913 1-163-038-91 CERAMIC CHIP 0.1uF 25V

< CONNECTOR >

* CN401 1-564-509-11 PLUG, CONNECTOR 6P

CN411 1-778-692-11 CONNECTOR, FFC/FPC 21P CN414 1-770-651-11 CONNECTOR, FFC/FPC 23P CN451 1-569-490-11 SOCKET, CONNECTOR 3P

* CN901 1-580-230-11 PIN, CONNECTOR (PC BOARD) 2P

* CN902 1-566-693-11 PIN, CONNECTOR 2P

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

Page 60

POWERPANEL

Ref. No. Part No. Description Remark

< DIODE >

D411 8-719-210-39 DIODE EC10QS04-TE12L5 D412 8-719-210-39 DIODE EC10QS04-TE12L5 D421 8-719-210-33 DIODE EC10DS2TE12R D422 8-719-422-31 DIODE MA8047-M-TX D431 8-719-210-33 DIODE EC10DS2TE12R

D432 8-719-210-33 DIODE EC10DS2TE12R D433 8-719-016-74 DIODE 1SS352-TPH3 D451 8-719-016-74 DIODE 1SS352-TPH3 D452 8-719-313-73 DIODE SFPB-52V D461 8-719-210-39 DIODE EC10QS04-TE12L5

D462 8-719-210-39 DIODE EC10QS04-TE12L5 D466 8-719-210-39 DIODE EC10QS04-TE12L5 D467 8-719-210-39 DIODE EC10QS04-TE12L5 D801 8-719-016-74 DIODE 1SS352-TPH3 D911 8-719-016-74 DIODE 1SS352-TPH3

D912 8-719-016-74 DIODE 1SS352-TPH3

< FLUORESCENT >

FL701 1-517-907-11 INDICATOR TUBE, FLUORESCENT

< IC >

IC411 8-759-525-48 IC LA5632 IC421 8-759-633-42 IC M5293L IC601 8-759-269-92 IC SN74HCU04ANSR IC611 8-749-012-70 IC GP1F38R IC621 8-749-012-70 IC GP1F38R

Ref. No. Part No. Description Remark

R434 1-216-081-00 METAL CHIP 22K 5% 1/10W R435 1-216-091-00 METAL CHIP 56K 5% 1/10W R436 1-216-109-00 METAL CHIP 330K 5% 1/10W R437 1-216-049-91 RES,CHIP 1K 5% 1/10W R451 1-216-033-00 METAL CHIP 220 5% 1/10W

R613 1-216-113-00 METAL CHIP 470K 5% 1/10W R614 1-216-089-91 RES,CHIP 47K 5% 1/10W R623 1-216-113-00 METAL CHIP 470K 5% 1/10W R624 1-216-089-91 RES,CHIP 47K 5% 1/10W R801 1-216-067-00 METAL CHIP 5.6K 5% 1/10W

R802 1-216-295-91 SHORT 0 R803 1-216-065-91 RES,CHIP 4.7K 5% 1/10W R804 1-216-073-00 METAL CHIP 10K 5% 1/10W R805 1-216-001-00 METAL CHIP 10 5% 1/10W R806 1-216-025-91 RES,CHIP 100 5% 1/10W

R912 1-216-296-91 SHORT 0

< RELAY >

RY911 1-755-300-11 RELAY RY912 1-755-300-11 RELAY

< SWITCH >

S401 1-571-839-11 SWITCH, KEY BOARD (RESET)

**************************************************************

A-4724-780-A POWER BOARD, COMPLETE (US,CND)

*********************

IC661 8-749-012-69 IC GP1F38T

< JACK >

J801 1-779-655-21 JACK (SMALL TYPE) (2 GANG)

< JUMPER RESISTOR >

JW401 1-216-296-91 SHORT 0

< COIL >

L611 1-412-784-41 INDUCTOR 4.7uH L661 1-412-784-41 INDUCTOR 4.7uH

! L901 1-424-485-11 FILTER, LINE

< TRANSISTOR >

Q801 8-729-620-05 TRANSISTOR 2SC2603TP-EF

< RESISTOR >

R411 1-216-073-00 METAL CHIP 10K 5% 1/10W R412 1-216-097-91 RES,CHIP 100K 5% 1/10W R413 1-216-049-91 RES,CHIP 1K 5% 1/10W R420 1-216-099-00 METAL CHIP 120K 5% 1/10W R422 1-216-097-91 RES,CHIP 100K 5% 1/10W

R423 1-216-033-00 METAL CHIP 220 5% 1/10W R424 1-216-033-00 METAL CHIP 220 5% 1/10W R431 1-216-025-91 RES,CHIP 100 5% 1/10W R432 1-216-047-91 RES,CHIP 820 5% 1/10W R433 1-216-035-00 METAL CHIP 270 5% 1/10W

A-4724-784-A POWER BOARD, COMPLETE (AEP,UK,SP)

*********************

< CAPACITOR >

C760 1-163-038-91 CERAMIC CHIP 0.1uF 25V C761 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C762 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C763 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C764 1-163-038-91 CERAMIC CHIP 0.1uF 25V

C765 1-124-778-00 ELECT CHIP 22uF 20% 6.3V C766 1-163-038-91 CERAMIC CHIP 0.1uF 25V C769 1-163-109-00 CERAMIC CHIP 47PF 5% 50V C781 1-126-206-11 ELECT CHIP 100uF 20% 6.3V C782 1-163-021-91 CERAMIC CHIP 0.01uF 10% 50V

< CONNECTOR >

CN701 1-793-448-11 CONNECTOR, FFC 15P

< DIODE >

D751 8-719-051-89 DIODE SML-010VT-T87 (STANDBY)

< IC >

IC761 8-759-426-98 IC MSM9202-02GS-K IC781 8-749-013-92 IC GP1UC7X

< JACK >

J751 1-793-439-11 JACK (SMALL TYPE)

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

Page 61

POWER

Ref. No. Part No. Description Remark

< COIL >

L751 1-216-296-91 SHORT 0 L752 1-216-296-91 SHORT 0 L753 1-216-296-91 SHORT 0

< TRANSISTOR >

Q751 8-729-424-08 TRANSISTOR UN2111-TX Q767 8-729-424-67 TRANSISTOR UN2216-TX

< RESISTOR >

R322 1-216-166-00 RES,CHIP 47 5% 1/8W R323 1-216-166-00 RES,CHIP 47 5% 1/8W R324 1-216-166-00 RES,CHIP 47 5% 1/8W R325 1-216-166-00 RES,CHIP 47 5% 1/8W R702 1-216-057-00 METAL CHIP 2.2K 5% 1/10W

R703 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R704 1-216-065-91 RES,CHIP 4.7K 5% 1/10W R705 1-216-073-00 METAL CHIP 10K 5% 1/10W R706 1-216-085-00 METAL CHIP 33K 5% 1/10W R722 1-216-057-00 METAL CHIP 2.2K 5% 1/10W

R751 1-216-001-00 METAL CHIP 10 5% 1/10W R752 1-216-001-00 METAL CHIP 10 5% 1/10W R753 1-216-033-00 METAL CHIP 220 5% 1/10W R760 1-216-025-91 RES,CHIP 100 5% 1/10W R761 1-216-025-91 RES,CHIP 100 5% 1/10W

R762 1-216-025-91 RES,CHIP 100 5% 1/10W R763 1-216-025-91 RES,CHIP 100 5% 1/10W R767 1-216-097-91 RES,CHIP 100K 5% 1/10W R769 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R781 1-216-017-91 RES,CHIP 47 5% 1/10W

R782 1-216-025-91 RES,CHIP 100 5% 1/10W

< SWITCH >

S701 1-762-400-11 SWITCH (r) S702 1-762-400-11 SWITCH (p) S703 1-762-400-11 SWITCH (+) S704 1-762-400-11 SWITCH (=) S705 1-762-400-11 SWITCH (^)

S706 1-762-400-11 SWITCH (§) S721 1-762-400-11 SWITCH (INPUT) S722 1-762-400-11 SWITCH (1/u)

Ref. No. Part No. Description Remark

MISCELLANEOUS

*************

15 1-791-161-11 WIRE (FLAT TYPE) (15 CORE) 16 1-791-160-11 WIRE (FLAT TYPE) (23 CORE)(180mm) 17 1-791-158-11 WIRE (FLAT TYPE) (23 CORE)(90mm) 18 1-791-159-11 WIRE (FLAT TYPE) (21 CORE)

! 21 1-696-586-21 CORD, POWER (UK)

! 21 1-751-275-11 CORD, POWER (AEP,SP) ! 21 1-783-531-11 CORD, POWER (US,CND)

27 1-569-008-21 ADAPTOR, CONVERSION 2P (SP) 558 1-667-954-11 FLEXIBLE BOARD

! 560 A-4672-541-A OPTICAL PICK-UP KMS-260B/J1N

FL701 1-517-907-11 INDICATOR TUBE, FLUORESCENT HR901 1-500-502-11 HEAD, OVER LIGHT M101 A-4672-475-A MOTOR ASSY, SPINDLE M102 A-4672-474-A MOTOR ASSY, SLED M103 X-4949-264-1 MOTOR ASSY, LOADING

S102 1-762-148-21 SWITCH, PUSH (2 KEY)

! T901 1-433-910-11 TRANSFORMER, POWER (US,CND) ! T901 1-433-911-11 TRANSFORMER, POWER (AEP,UK,SP)

**************************************************************

ACCESSORIES & PACKING MATERIALS

*******************************

1-418-541-11 REMOTE COMMANDER (RM-D35) 1-558-271-11 CORD, CONNECTION (AUDIO 108cm) 1-574-264-11 CORD, OPTICAL PLUG (600mm) 1-777-172-11 CORD, CONNECTION (CONTROL A1II 100cm)(CND) 1-783-106-11 CORD, CONNECTION (MINI-PLUG 105cm)

3-866-796-11 MANUAL, INSTRUCTION (ENGLISH,FRENCH) 3-866-796-21 MANUAL, INSTRUCTION

(GERMAN,NETHER LAND,SWEDISH,ITALIAN)(AEP)

3-866-796-31 MANUAL, INSTRUCTION

(SPANISH,PORTUGUESE,CHINESE)(AEP,SP) 3-866-797-11 MANUAL, INSTRUCTION (ENGLISH,FRENCH) 3-866-797-21 MANUAL, INSTRUCTION

(GERMAN,NETHER LAND,SWEDISH,ITALIAN)(AEP)

3-866-797-31 MANUAL, INSTRUCTION

(SPANISH,PORTUGUESE,CHINESE)(AEP,SP) 4-981-643-31 LID, BATTERY (for RM-D35) A-4680-289-A CORD, CONNECTION (CAV-50C)(US,CND) A-4406-082-A CORD, CONNECTION (EXCEPT US, CND)

**************************************************************

* 1-668-111-11 SW BOARD

*******

< CONNECTOR >

* CN601 1-506-486-11 PIN, CONNECTOR 7P

< SWITCH >

S601 1-572-126-21 SWITCH, PUSH (1 KEY)(REC POSITION) S602 1-572-126-21 SWITCH, PUSH (1 KEY)(PACK OUT) S604 1-771-264-11 SWITCH, PUSH(DETECTION)(1 KEY)

(PB POSITION)

**************************************************************

**********

HARDWARE LIST

**********

#1 7-685-646-79 SCREW +BVTP 3X8 TYPE2 N-S #2 7-685-133-19 SCREW (DIA. 2.6) (IT3B) #3 7-685-533-19 SCREW +BTP 2.6X6 TYPE2 N-S #4 7-621-772-20 SCREW +B 2X5 #5 7-621-772-40 SCREW +B 2X8

#6 7-627-852-08 SCREW,PRECISION +P 1.7X2.5 #7 7-685-647-79 SCREW +BVTP 3X10 TYPE2 IT-3

The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.

Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

Page 62

MDS-PC2

9-928-916-11

(SP)

Sony Corporation

Home Audio Company

99F0986-1

Published by Quality Assurance Dept.

Sony MDS-PC2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual