Page 1
DDR4 SDRAM Memory
Oct. 2016
Product Guide
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION
AND SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of
Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other
intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment,
or similar applications where product failure could result in loss of life or personal or physical harm,
or any military or defense application, or any governmental procurement to which special terms or
provisions may apply.
For updates or additional information about Samsung products, contact your nearest Samsung
office.
All brand names, trademarks and registered trademarks belong to their respective owners.
- 1 -
Page 2
Oct. 2016
4G : 4Gb
8G : 8Gb
AG : 16Gb
BG : 32Gb
04 : x 4
08 : x 8
16 : x16
5 : 16 Banks
3. DRAM Type
4. Density
5. Bit Organization
6. # of Internal Banks
M
A
B
C
D
E
F
G
B
M
2
4
C
I
9. Package Type
8. Revision
10. Temp & Power
1. SAMSUNG Memory : K
2. DRAM : 4
Revision
# of Internal Banks
Bit Organization
Density
DRAM Type
DRAM
SAMSUNG Memory
Interface (V
DD, VDDQ)
Package Type
Temp & Power
1 2 3 4 5 6 7 8 9 10 11
Speed
A : DDR4 SDRAM (1.2V VDD)
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Industrial Temp.(-40°C ~ 95°C) & Normal Power
: FBGA (Halogen-free & Lead-free, Flip Chip)
: FBGA (Halogen-free & Lead-free, DDP)
: FBGA (Halogen-free & Lead-free, 2H TSV)
: FBGA (Halogen-free & Lead-free, 4H TSV)
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen.
: 8th Gen.
11. Speed
K 4 A X X X X X X X - X X X X
: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)
: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)
: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)
: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15)
: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)
: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)
PB
RC
TD
RB
TC
WD
W : POD (1.2V, 1.2V)
7. Interface ( V
DD, VDDQ)
Product Guide DDR4 SDRAM Memory
1. DDR4 SDRAM MEMORY ORDERING INFORMATION
- 2 -
Page 3
Oct. 2016
Product Guide DDR4 SDRAM Memory
2. DDR4 SDRAM Component Product Guide
Density Banks Part Number
16Banks
4Gb D-die
4Gb E-die
8Gb B-die
8Gb C-die
NOTE:
1) Need to contact SAMSUNG for TD (2666Mbps) availability
(4Bank Groups)
8Banks
(2Bank Groups)
16Banks
(4Bank Groups)
8Banks
(2Bank Groups)
16Banks
(4Bank Groups)
8Banks
(2Bank Groups)
16Banks
(4Bank Groups)
8Banks
(2Bank Groups)
K4A4G045WD BCPB/RC 1G x 4
K4A4G085WD BCPB/RC 512M x 8
K4A4G165WD BCPB/RC 256M x 16 1.2V 96 ball FBGA
K4A4G045WE
K4A4G085WE
K4A4G165WE
K4A8G045WB
K4A8G085WB
K4A8G165WB
K4A8G045WC
K4A8G085WC
K4A8G165WC
Package & Power,
& Speed
Tem p.
BCPB/RC/TD
BCPB/RC/TD
BCPB/RC/TD
BCPB/RC/TD
BCPB/RC/TD
BCPB/RC/TD
BCRC/TD
BCRC/TD
BCRC/TD
1)
1)
1)
1)
1)
1)
1)
1)
1)
Org. VDD Voltage PKG Avail. NOTE
1.2V 78 ball FBGA
MP
1G x 4
512M x 8
256M x 16 1.2V 96 ball FBGA
2G x 4
1G x 8
512M x 16 1.2V 96 ball FBGA
2G x 4
1G x 8
512M x 16 1.2V 96 ball FBGA
1.2V 78 ball FBGA
1.2V 78 ball FBGA
1.2V 78 ball FBGA
MP
MP
CS
‘16 4Q
- 3 -
Page 4
Product Guide DDR4 SDRAM Memory
3 : DIMM
4 : SODIMM
: FBGA (Halogen-free & Lead-free, Flip Chip)
: FBGA (Halogen-free & Lead-free, DDP)
: FBGA (Halogen-free & Lead-free, 2H TSV)
: FBGA (Halogen-free & Lead-free, 4H TSV)
0 : None
2 : 2nd Rev.
4 : 4th Rev.
A : DDR4 SDRAM (1.2V VDD)
1. Memory Module : M
2. DIMM Type
3. Data Bits
4. DRAM Component Type
5. Depth
12. Speed
11. Temp & Power
10. PCB Revision
9. Package
8. Component Revision
4 : 16Banks & POD-1.2V
6. # of Banks in comp. & Interface
:
:
:
:
:
:
:
:
1 : 1st Rev.
3 : 3rd Rev.
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
PCB Revision
Component Revision
# of Banks in Comp. & Interface
Depth
DRAM Component Type
Data bits
DIMM Type
Memory Module
Package
Tem p & Po wer
Speed
M X X X A X X X X X X X - X X X X
1 2 3 4 5 6 7 8 9 10 11 12 13
Bit Organization
0 : x 4
3 : x 8
4 : x 16
7. Bit Organization
71: x64 260pin Unbuffered SODIMM
74
: x72 260pin ECC Unbuffered SODIMM
78: x64 288pin Unbuffered DIMM
86 : x72 288pin Load Reduced DIMM
91: x72 288pin ECC Unbuffered DIMM
92: x72 288pin VLP Registered DIMM
93 : x72 288pin Registered DIMM
: 256M
: 512M
: 1G
: 2G
: 4G
: 8G
56
51
1G
2G
4G
8G
: 16G
: 1G (for 8Gb)
: 2G (for 8Gb)
: 4G (for 8Gb)
: 8G (for 8Gb)
: 16G
AG
1K
2K
4K
8K
AK
B
M
2
4
M
B
D
F
1 st G e n.
3rd Gen.
5th Gen.
7th Gen.
A
C
E
G
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)
: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)
: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)
: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15)
: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)
: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)
PB
RC
TD
RB
TC
WD
Memory buffer
3. DDR4 SDRAM Module Ordering Information
Oct. 2016
- 4 -
Page 5
Oct. 2016
Product Guide DDR4 SDRAM Memory
4. DDR4 SDRAM Module Product Guide
4.1 288Pin DDR4 Registered DIMM
288Pin DDR4 Registered DIMM
Org. Density Part Number
512G x 72 4GB M393A5143DB0 CPB D (1Rx8) 512M x8 * 9pcs 4Gb D-die 16 1
512G x 72 4GB M393A5143DB0 CRC D (1Rx8) 512M x8 * 9pcs 4Gb D-die 16 1
1G x72 8GB M393A1G40DB0 CPB C (1Rx4) 1G x4 * 18pcs 4Gb D-die 16 1
1G x72 8GB M393A1G40DB1 CRC C (1Rx4) 1G x4 * 18pcs 4Gb D-die 16 1
1G x72 8GB M393A1G43DB0 CPB E (2Rx8) 512M x8 * 18pcs 4Gb D-die 16 2
1G x72 8GB M393A1G43DB1 CRC E (2Rx8) 512M x8 * 18pcs 4Gb D-die 16 2
1G x 72 8GB M393A1G40EB1 CPB C (1Rx4) 1G x4 * 18pcs 4Gb E-die 16 1
1G x 72 8GB M393A1G40EB1 CRC C (1Rx4) 1G x4 * 18pcs 4Gb E-die 16 1
1G x 72 8GB M393A1G40EB1 CTD C (1Rx4) 1G x4 * 18pcs 4Gb E-die 16 1
1G x 72 8GB M393A1G43EB1 CPB E (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2
1G x 72 8GB M393A1G43EB1 CRC E (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2
1G x 72 8GB M393A1G43EB1 CTD E (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2
1G x 72 8GB M393A1K43BB0 CPB D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1
1G x 72 8GB M393A1K43BB0 CRC D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1
1G x 72 8GB M393A1K43BB0 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1
2G x72 16GB M393A2G40DB0 CPB A (2Rx4) 1G x4 * 36pcs 4Gb D-die 16 2
2G x72 16GB M393A2G40DB1 CRC A (2Rx4) 1G x4 * 36pcs 4Gb D-die 16 2
2G x72 16GB M393A2G40EB1 CPB A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2
2G x72 16GB M393A2G40EB1 CRC A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2
2G x72 16GB M393A2G40EB1 CTD A (2Rx4) 1G x4 * 36pcs 4Gb E-die 16 2
2G x72 16GB M393A2K40BB0 CPB C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1
2G x72 16GB M393A2K40BB1 CRC C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1
2G x72 16GB M393A2K40BB1 CTD C (1Rx4) 2G x4 * 18pcs 8Gb B-die 16 1
2G x72 16GB M393A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2
2G x72 16GB M393A2K43BB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2
Tem p &
Power &
Speed
Raw Card Composition
Comp.
Version
Internal
Banks
Rank PKG Height Avail. NOTE
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm
31.25mm
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
EOL
4Q’17
EOL
4Q’17
EOL
3Q’17
EOL
3Q’17
EOL
3Q’17
EOL
3Q’17
EOL
2Q’17
EOL
2Q’17
- 5 -
Page 6
Oct. 2016
Product Guide DDR4 SDRAM Memory
2G x72 16GB M393A2K43BB1 CTD E (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2
4G x72 32GB M393A4K40BB0 CPB A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2
4G x72 32GB M393A4K40BB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2
4G x72 32GB M393A4K40BB1 CTD A (2Rx4) 2G x4 * 36pcs 8Gb
8G x72 64GB M393A8K40B21 CRB A (4Rx4)
8G x72 64GB M393A8K40B21 CTC A (4Rx4)
8G x 72 64GB M393A8K40B21 CWD A (4Rx4)
16G x 72 128GB M393AAK40B41 CTC A (8Rx4)
16G x 72 128GB M393AAK40B41 CWD A (8Rx4)
4.2
288Pin DDR4 Load Reduced DIMM
Tem p &
Org. Density Part Number
4G x72 32GB M386A4G40DM0 CPB D (4Rx4)
4G x72 32GB M386A4G40DM1 CRC D (4Rx4)
4G x72 32GB M386A4G40EM2 CPB D (4Rx4)
4G x72 32GB M386A4G40EM2 CRC D (4Rx4)
4G x72 32GB M386A4K40BB0 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2
8G x72 64GB M386A8K40BM1 CPB D (4Rx4)
8G x72 64GB M386A8K40BM1 CRC D (4Rx4)
8G x72 64GB M386A8K40BM2 CTD D (4Rx4)
16G x72 128GB M386AAK40B40 CTC A (8Rx4)
16G x72 128GB M386AAK40B40 CWD A (8Rx4)
Power &
Speed
Raw Card Composition
2H TSV
2H TSV
2H TSV
4H TSV
4H TSV
288Pin DDR4 Load Reduced DIMM
4H TSV
4H TSV
x4 * 36pcs 8Gb B-die 16 4
4G
x4 * 36pcs 8Gb B-die 16 4
4G
x4 * 36pcs 8Gb B-die 16 4
4G
x4 * 36pcs 8Gb B-die 16 8
8G
x4 * 36pcs 8Gb B-die 16 8
8G
DDP
x4 * 36pcs 4Gb D-die 16 4
2G
DDP
x4 * 36pcs 4Gb D-die 16 4
2G
DDP
x4 * 36pcs 4Gb E-die 16 4
2G
DDP
x4 * 36pcs 4Gb E-die 16 4
2G
DDP
x4 * 36pcs 8Gb B-die 16 4
4G
DDP
x4 * 36pcs 8Gb B-die 16 4
4G
DDP
x4 * 36pcs 8Gb B-die 16 4
4G
x4 * 36pcs 8Gb B-die 16 8
8G
x4 * 36pcs 8Gb B-die 16 8
8G
B-die 16 2
Comp.
Version
Internal
Banks
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
Rank PKG Height Avail. NOTE
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm
31.25mm MP
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm TBD
CS
4Q’16
CS
4Q’16
EOL
4Q’17
EOL
4Q’17
CS
1Q’17
CS
1Q’17
- 6 -
Page 7
Oct. 2016
Product Guide DDR4 SDRAM Memory
4.3 288Pin DDR4 VLP Registered DIMM
288Pin DDR4 VLP Registered DIMM
Org. Density Part Number
2G x72 16GB M392A2G40DM0 CPB J (2Rx4)
2G x72 16GB M392A2K43BB0 CPB H (2Rx8) 1G x8*18pcs 8Gb B-die 16 2
2G x72 16GB M392A2K43BB0 CRC H(2Rx8) 1G x8*18pcs 8Gb B-die 16 2
4G x72 32GB M392A4K40BM0 CPB J (2Rx4)
4G x72 32GB M392A4K40BM0 CRC J (2Rx4)
4.4
260Pin DDR4 ECC SODIMM
Org. Density Part Number
1G x72 8GB M474A1G43DB0 CPB G (2Rx8) 512M x8 * 18pcs 4Gb D-die 16 2
1G x72 8GB M474A1G43DB1 CRC G (2Rx8) 512M x8 * 18pcs 4Gb D-die 16 2
1G x72 8GB M474A1G43EB1 CPB G (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2
1G x72 8GB M474A1G43EB1 CRC G (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2
1G x72 8GB M474A1G43EB1 CTD G (2Rx8) 512M x8 * 18pcs 4Gb E-die 16 2
2G x72 16GB M474A2K43BB1 CPB G (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2
2G x72 16GB M474A2K43BB1 CRC G (2Rx8) 1G x8 * 18pcs 8Gb B-die 16 2
2G x72 16GB M474A2K43BB1 CTD G (2Rx8) 1G x8 * 18pcs 8Gb B-die 16
Tem p &
Power &
Speed
Tem p &
Power &
Speed
Raw Card Composition
DDP
x4 * 18pcs 4Gb D-die 16 2
2G
DDP
x4*18pcs 8Gb B-die 16 2
4G
DDP
x4*18pcs 8Gb B-die 16 2
4G
260Pin DDR4 ECC SODIMM
Raw Card Composition
Comp.
Version
Comp.
Version
Internal
Banks
Internal
Banks
Rank PKG Height Avail. NOTE
78ball
18.75mm
FBGA
78ball
18.75mm MP
FBGA
78ball
18.75mm MP
FBGA
78ball
18.75mm MP
FBGA
78ball
18.75mm MP
FBGA
Rank PKG Height Avail. NOTE
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
2
FBGA
30mm
30mm
30mm MP
30mm MP
30mm TBD
30mm MP
30mm MP
30mm TBD
EOL
4Q’17
EOL
4Q’17
ELO
4Q’17
- 7 -
Page 8
Oct. 2016
Product Guide DDR4 SDRAM Memory
4.5 260Pin DDR4 Non ECC SODIMM
260Pin DDR4 Non ECC SODIMM
Org. Density Part Number
256M x64 2GB M471A5644EB0 CPB A (1Rx16) 256M x16*4pcs 4Gb E-die 16 1
256M x64 2GB M471A5644EB0 CRC A(1Rx16) 256M x16*4pcs 4Gb E-die 16 1
512M x64 4GB M471A5143DB0 CPB A (1Rx8) 512M x8 * 8pcs 4Gb D-die 16 1
512M x64 4GB M471A5143EB0 CPB A (1Rx8) 512M x8*8pcs 4Gb E-die 16 1
512M x64 4GB M471A5143EB1 CRC A (1Rx8) 512M x8*8pcs 4Gb E-die 16 1
512M x64 4GB M471A5244BB0 CPB A (1Rx16) 512M x16 * 8pcs 8Gb B-die 16 1
512M x64 4GB M471A5244BB0 CRC A (1Rx16) 512M x16 * 8pcs 8Gb B-die 16 1
512M x64 4GB M471A5244BB0 CTD A (1Rx16) 512M x16 * 8pcs 8Gb B-die
512M x64 4GB M471A5244CB0 CRC A (1Rx16) 512M x16 * 8pcs 8Gb C-die 16 1
512M x64 4GB M471A5244CB0 CTD A (1Rx16) 512M x16 * 8pcs 8Gb C-die 16 1
1G x64 8GB M471A1G43DB0 CPB E (2Rx8) 512M x8 * 16pcs 4Gb D-die 16 2
1G x 64 8GB M471A1G43EB1 CPB E (2Rx8) 512M x8*16pcs 4Gb E-die 16 2
1G x 64 8GB M471A1G43EB1 CRC E (2Rx8) 512M x8*16pcs 4Gb E-die 16 2
1G x 64 8GB M471A1K43BB0 CPB A (1Rx8) 1G x8*8pcs 8Gb B-die 16 1
1G x 64 8GB M471A1K43BB1 CRC A (1Rx8) 1G x8*8pcs 8Gb B-die 16 1
1G x 64 8GB M471A1K43BB1 CTD A (1Rx16) 1G x16 * 8pcs
1G x 64 8GB M471A1K43CB1 CRC A (1Rx16) 1G x16 * 8pcs 8Gb C-die 16 1
1G x 64 8GB M471A1K43CB1 CTD A (1Rx16) 1G x16 * 8pcs 8Gb C-die 16 1
2G x 64 16GB M471A2K43BB1 CPB E (2Rx8) 1G x8*16pcs 8Gb B-die 16 2
2G x 64 16GB M471A2K43BB1 CRC E (2Rx8) 1G x8*16pcs 8Gb B-die 16 2
2G x 64 16GB M471A2K43BB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2
2G x 64 16GB M471A2K43CB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2
2G x 64 16GB M471A2K43CB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb C-die 16 2
Tem p &
Power &
Speed
Raw Card Composition
Comp.
Version
8Gb B-die 16 1
Internal
Banks
16 1
Rank PKG Height Avail. NOTE
96ball
FBGA
96ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
30mm
30mm
30mm
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
30mm MP
EOL
1Q’18
EOL
1Q’18
EOL
1Q’17
- 8 -
Page 9
Oct. 2016
Product Guide DDR4 SDRAM Memory
4.6 288Pin DDR4 ECC UDIMM
288Pin DDR4 ECC UDIMM
Org. Density Part Number
512M x72 4GB M391A5143EB1 CPB D (1Rx8) 512M x8*9pcs 4Gb E-die 16 1
512M x72 4GB M391A5143EB1 CRC D (1Rx8) 512M x8*9pcs 4Gb E-die 16 1
512M x72 4GB M391A5143EB1 CTD D (1Rx8) 512M x8*9pcs 4Gb E-die 16 1
1G x72 8GB M391A1G43DB0 CPB E (2Rx8) 512M x8*18pcs 4Gb D-die 16 2
1G x72 8GB M391A1G43DB1 CRC E (2Rx8) 512M x8*18pcs 4Gb D-die 16 2
1G x72 8GB M391A1G43EB1 CTD E (2Rx8) 512M x8*18pcs 4Gb E-die 16 2
1G x72 8GB M391A1G43EB1 CPB E (2Rx8) 512M x8*18pcs 4Gb E-die
1G x72 8GB M391A1G43EB1 CRC E (2Rx8) 512M x8*18pcs 4Gb E-die 16 2
1G x72 8GB M391A1K43BB1 CPB D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1
1G x72 8GB M391A1K43BB1 CRC D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1
1G x72 8GB M391A1K43BB1 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-die 16 1
2G x72 16GB M391A2K43BB1 CPB E (2Rx8) 1G x8*18pcs 8Gb B-die 16 2
2G x72 16GB M391A2K43BB1 CRC E (2Rx8) 1G x8*18pcs 8Gb B-die 16 2
2G x72 16GB M391A2K43BB1 CTD E (2Rx8) 1G x8
Tem p &
Power &
Speed
Raw Card Composition
*
18pcs 8Gb B-die 16 2
Comp.
Version
Internal
Banks
16 2
Rank PKG Height Avail. NOTE
78ball
31.25mm MP
FBGA
78ball
31.25mm MP
FBGA
78ball
31.25mm TBD
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm
31.25mm
31.25mm TBD
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm TBD
EOL
2Q’17
EOL
2Q’17
- 9 -
Page 10
Oct. 2016
Product Guide DDR4 SDRAM Memory
4.7 288Pin DDR4 Non ECC UDIMM
288Pin DDR4 Non ECC UDIMM
Org. Density Part Number
256M x64 2GB M378A5644EB0 CPB A (1Rx16) 256M x16 * 8psc 4Gb E-die 16 1
256M x64 2GB M378A5644EB0 CRC C (1Rx16) 256M x16 * 8psc 4Gb E-die 4 1
512M x64 4GB M378A5143DB0 CPB A (1Rx8) 512M x8 * 8pcs 4Gb D-die 16 1
512M x64 4GB M378A5143EB1 CPB A (1Rx8) 512M x8 * 8pcs 4Gb E-die 16 1
512M x64 4GB M378A5143EB1 CRC A (1Rx8) 512M x8 * 8pcs 4Gb E-die 16 1
512M x64 4GB M378A5244BB0 CPB C (1Rx16) 512M x16 * 4psc 8Gb B-die 16 1
512M x64 4GB M378A5244BB0 CRC C (1Rx16) 512M x16 * 4psc 8Gb B-die 16 1
512M x64 4GB M378A5244BB0 CTD C (1Rx16) 512M x16 * 4psc 8Gb B-die 16 1
512M x64 4GB M378A5244CB0 CRC C (1Rx16) 512M x16 * 4psc 8Gb C-die 16 1
512M x64 4GB M378A5244CB0 CTD C (1Rx16) 512M x16 * 4psc 8Gb C-die 16 1
1G x64 8GB M378A1G43DB0 CPB B (2Rx8) 512M x8 * 16pcs 4Gb D-die 16 2
1G x64 8GB M378A1G43EB1 CPB B (2Rx8) 512M x8 * 16pcs 4Gb E-die 16 2
1G x64 8GB M378A1G43EB1 CRC B (2Rx8) 512M x8 * 16pcs 4Gb E-die 16 2
1G x64 8GB M378A1K43BB1 CPB A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1
1G x64 8GB M378A1K43BB2 CRC A (1Rx8) 1G x8 * 8pcs 8Gb B-die 16 1
1G x64 8GB M378A1K43BB2 CTD A (1Rx8) 1G x8 * 8psc 8Gb
1G x64 8GB M378A1K43CB2 CRC A (1Rx8) 1G x8 * 8psc 8Gb C-die 16 1
1G x64 8GB M378A1K43CB2 CTD A (1Rx8) 1G x8 * 8psc 8Gb C-die 16 1
2G x64 16GB M378A2K43BB1 CPB B (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2
2G x64 16GB M378A2K43BB1 CRC B (2Rx8) 1G x8 * 16pcs 8Gb B-die 16 2
2G x64 16GB M378A2K43BB1 CTD B (2Rx8) 1G x8 * 16psc 8Gb B-die 16 2
2G x64 16GB M378A2K43CB1 CRC B (2Rx8) 1G x8 * 16psc 8Gb C-die 16 2
2G x64 16GB M378A2K43CB1 CTD B (2Rx8) 1G x8 * 16psc 8Gb C-die 16 2
Tem p &
Power &
Speed
Raw Card Composition
Comp.
Version
Internal
Banks
B-die 16 1
Rank PKG Height Avail. NOTE
96ball
31.25mm EOL
FBGA
96ball
31.25mm EOL
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
31.25mm MP
EOL
1Q’17
EOL
1Q’17
- 10 -
Page 11
Oct. 2016
32GB 4Rx4 PC3L -10600R-09-12-AB1-D4
Country
M386A4G40DM0-CPB
C06T0006213305BA3F YYWW
Product Guide DDR4 SDRAM Memory
5. RDIMM, LRDIMM Memory Buffer Information
5.1 Label Example
5.2 JEDEC Description Information
1. Module total capacity, in gigabytes, for primary bus (ECC not counted)
2. Number of package ranks of memory installed and number of logical ranks per package rank
3. Device organization (data bit width)
4. SDRAM and support component supply voltage (VDD)
blank = 1.2 V operable
5. Module speed in Mb/s/data pin
6. SDRAM speed grade
7. Module Type
E = Unbuffered DIMM ("UDIMM"), x64 primary + 8 bit ECC module data bus
L = Load Reduced DIMM (“LRDIMM”), x64 primary + 8 bit ECC module data bus
R = Registered DIMM ("RDIMM"), x64 primary + 8 bit ECC module data bus
S = Small Outline DIMM ("SO-DIMM"), n
U = Unbuffered DIMM ("UDIMM"), no ECC (x64 bit module data bus)
T = Unbuffered 72-bit small outline DIMM ("72b-SO-DIMM"
8. Reference design file used for
A = Reference design for raw card ’A’ is used for this assembly
B = Reference design for raw card ’B’ is used for this assembly
AC = Reference design for raw card ’AC’
ZZ = None of the JEDEC standard reference
9. Revision number of the reference design used
0 = Initial release
1 = First revision
2 = Second revision
P = Pre-release or Engineering sample
Z = To be used when reference raw card = ZZ
10. JEDEC SPD Revision Encoding and Additio
of SDRAMs used on this assembly
o ECC (x64 bit module data bus)
), x64 primary + 8bit ECC module data bus
this design (if applicable)
is used for this assembly (example only)
designs were used for this assembly
ns level used on this DIMM
5.3 RCD (& Data Buffer) Information
(These codes are only used SAMSUNG, Not JEDEC)
11&12. RCD, Data Buffer Revision & Vendor used on this DIMM
Jedec Desctription on label Buffer Vendor RCD ver DB ver (Only LRDIMM)
DC0 IDT C0 B1
MB1 Montage B1 A1
P20 Inphi GS02 GS01
MC0 Montage C0 B0
DC3 IDT C0 A3
MA0 Montage A0 A1
DB0 IDT B0 B0
PA0 Inphi A0 A0
- 11 -
Page 12
Oct. 2016
A
B
C
D
E
F
G
H
M
N
7.50 0.10
0.80 x12 = 9.60
3.20
0.80
4.80
78 - Æ0.48 Solder ball
0.2 ABM
(Datum B)
(Datum A)
0.10MAX
1.10 0.10
#A1
1.60
7.50 0.10
11.00 0.10
0.37 0.05
#A1 INDEX MARK
B
A
BOTTOM VIEW TOP VIEW
11.00 0.10
J
K
L
0.80
0.80
(Post Reflow Æ0.50 ± 0.05)
876543219
0.80 x 8 6.40
Product Guide DDR4 SDRAM Memory
6. Package Dimension
78ball FBGA for
4Gb D-die (x4/x8) / DDP 8Gb D-die (x4) / 4H 16Gb D-die (x4)
4Gb E-die (x4/x8)
8Gb B-die (x4/x8) / DDP 16Gb B-die (x4) / 2H 16Gb B-die (x4) / 4H 32Gb B-die (x4)
8Gb C-die (x4/x8)
- 12 -
Page 13
Oct. 2016
BOTTOM VIEW
A
B
C
D
E
F
G
H
M
N
0.80 x
15 = 12.00
3.20
0.80
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
13.30
0.10
J
K
L
0.80
0.40
(
Post reflow
0.50 ± 0.05)
(0.30)
(0.60)
876543219
x 8 = 6.40
A
0.80
7.50 0.10
R
T
P
0.2 ABM
96 - 0.48 Solder ball
0.10MAX
1.10 0.10
#A1
7.50 0.10
13.30
0.10
0.37 0.05
TOP VIEW
Product Guide DDR4 SDRAM Memory
96ball FBGA for
4Gb D-die (x16) / 4Gb E-die (x16)
8Gb B-die (x16) / 8Gb C-die (x16)
- 13 -
Page 14
Oct. 2016
133.35
Units : Millimeters
1.4 ± 0.10
0.85
0.25
E : 2.6
Detail B,E
Detail A
1.50 ± 0.05
0.6 ± 0.03
Detail C
31.25
Max 3.9
30.75
17.60
126.65
4.30
B : 2.1
2.1
9.35
10.20
2.6
2.1
9.35
10.20
2.6
Detail D
56.1064.60 3.35
AC EDB
3.85 ± 0.10
Product Guide DDR4 SDRAM Memory
7. Module Dimension
x72 288pin DDR4 SDRAM RDIMM
x72 288pin DDR4 SDRAM LRDIMM
x72 288pin DDR4 SDRAM ECC UDIMM
x64 288pin DDR4 SDRAM Non ECC UDIMM
- 14 -
Page 15
Oct. 2016
0.30 MAX
2.55
Detail BDetail A
1.00 ± 0.05
0.35 ± 0.03
4.00 ± 0.10
0.50
Units : Millimeters
35.50 28.50
A
B
1.375
30.00
69.60
65.60
Max 3.7
1.2 ± 0.10
Product Guide DDR4 SDRAM Memory
x72 260pin DDR4 SDRAM ECC SODIMM
x64 260pin DDR4 SDRAM Non ECC SODIMM
- 15 -
Page 16
Oct. 2016
133.35
Units : Millimeters
1.4 ± 0.10
18.75
Max 3.9
18.25
126.65
56.1064.60
A
C E
DB
Detail A
1.50 ± 0.05
3.85 ± 0.10
4.30
0.85
0.25
E : 2.6
Detail B,E
0.6 ± 0.03
Detail C
B : 2.1
2.1
9.35
10.20
2.6
2.1
9.35
10.20
2.6
Detail D
Product Guide DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM VLP RDIMM
- 16 -
Page 17
Oct. 2016
1. FRONT
2. BACK
13.6
127 ± 0.12
50.81
21.49
9.9
8.9
21.49
50.81
0.4
63.68
13.6
127 ± 0.12
50.81
21.49
9.9
8.9
21.49
50.81
"Hot surface"
Caution
"Hot surface"
3. CLIP
9.3
± 0.12
35.82
± 0.12
6.8
± 0.1
3.80
+0.5
-0.8
0.8 ± 0.05
0.4
Product Guide DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM VLP RDIMM Heat Spreader Design Guide (DDP)
- 17 -
Page 18
Oct. 2016
133.15
4.35
130.45 ±
0.2
127
25.75
2 ± 0.1
2.6 ± 0.2
31.1
5.785
1. FRONT PART
2. BACK PART
17.02
6.075
19
.25 ± 0.12
39.3 ±
0.2
7
±
0.12
Clip open size
3.2 ± 0.6
R4
3. CLIP PART
+0.40
-0.20
Product Guide DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM RDIMM Heat Spreader Design Guide (TSV)
- 18 -
Page 19
Oct. 2016
133.15
130.45 ±
0.2
127 ±
0.25
25.75 ± 0.2
2.8 ± 0.2
1. FRONT PART
2. BACK PART
19
.25 ± 0.12
39.3 ±
0.2
7
±
0.12
Clip open size
3.2
±
0.6
3. CLIP PART
+0.40
-0.20
18.6 ± 0.25
0.6 ± 0.1
Product Guide DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM LRDIMM Heat Spreader Design Guide (DDP)
- 19 -
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