This icon is used when
additional information is
available in the RTD InputModule User Manual,
publication 1771-6.5.76.
If you need a copy of this
manual, fax the enclosed User
Manual Request Card to
1-800-576-6340. If you are
outside the U.S., fax the card to
1-330-723-4036.
Prevent Electrostatic
Discharge
Use this document as a guide when installing the 1771-IR/C
input module.
ToSee page
Prevent Electrostatic DischargeBelow
Understand Compliance to European Union Directives 1
Understand Product Compatibility2
Calculate Power Requirements2
Determine Module Placement3
Key the Backplane Connector3
Install the Module and Field Wiring Arm4
Connect Wiring to the Field Wiring Arm5
Ground the Chassis and Module6
Configure the Module7
For this reference informationSee page
Status Indicators9
Troubleshooting9
Specifications11
Differences Between Series12
The RTD input module is sensitive to electrostatic discharge.
ATTENTION: Electrostatic discharge can damage
integrated circuits or semiconductors if you touch
!
backplane connector pins. Follow these guidelines
when you handle the module:
• Touch a grounded object to discharge static potential
• Wear an approved wrist-strap grounding device
• Do not touch the backplane connector or
connector pins
• Do not touch circuit components inside the module
• If available, use a static-safe work station
• When not in use, keep the module in its
static-shield bag
Understand Compliance to
European Union Directives
This product has the CE mark and is approved for installation within
the European Union and EEA regions. It has been designed and
tested to meet the following directives.
Publication 1771-5.50 – October 1996
RTD Input Module2
Nbe
I
e
I
e
Block
Block
C
EMC Directive
This product is tested to meet Council Directive 89/336/EEC
Electromagnetic Compatibility (EMC) and the following standards,
in whole or in part, documented in a technical construction file:
• EN 50081-2EMC – Generic Emission Standard,
Part 2 – Industrial Environment
• EN 50082-2EMC – Generic Immunity Standard,
Part 2 – Industrial Environment
This product is intended for use in an industrial environment.
Low Voltage Directive
This product is tested to meet Council Directive 73/23/EEC
Low Voltage, by applying the safety requirements of EN 61131–2
Programmable Controllers, Part 2 – Equipment Requirements and
Tests.
For specific information required by EN 61131-2, see the appropriate
sections in this publication, as well as these Allen-Bradley
publications:
Understand Product
Compatibility
Calculate Power
Requirements
PublicationPublication number
Industrial Automation Wiring and Grounding Guidelines
For Noise Immunity
Guidelines for Handling Lithium BatteriesAG-5.4
Automation Systems CatalogB111
1770-4.1
The 1771-IR/C module can be used with any 1771 I/O chassis.
Compatibility and data table use is listed below.
Use of Data TableCompatibility
Catalog
Number
1771-IR/C888/914/15YesYesYesA, B
A
= Compatible with 1771-A1, -A2, -A4 chassis.
B = Compatible with 1771-A1B, -A2B, -A3B, -A4B chassis.
Y
es = Compatible without restriction.
No = Restricted to complementary module placement.
Input
mag
Bits
Output
mag
Bits
Read
Words
Write
Words
Addressing
1/2-Slot1-Slot2-Slot
Chassis
Series
The module receives its power through the 1771 I/O power supply.
The maximum current drawn by the RTD module is 950mA
(4.75 Watts).
Publication
Add this current to the requirements of all other modules in the I/O
chassis to prevent overloading the chassis backplane and/or
backplane power supply.
1771-5.50 – October 1996
RTD Input Module3
Key
Determine Module
Placement in the I/O
Chassis
You can place your module in any I/O module slot of the I/O chassis
except for the extreme left slot. This slot is reserved for PC
processors or adapter modules.
Group your modules to minimize adverse affects from radiated
electrical noise and heat. We recommend the following.
• Group analog input and low voltage dc modules away from ac
• Do not place this module in the same I/O group with a discrete
the Backplane Connector
Place your module in any slot in the chassis
except the leftmost slot which is reserved for
processors or adapters.
ATTENTION: Do not insert or remove modules from
the I/O chassis while system power is ON. Failure to
!
modules or high voltage dc modules to minimize electrical noise
interference.
high-density I/O module when using 2-slot addressing. This
module uses a byte in both the input and output image tables for
block transfer.
observe this rule could result in damage to module
circuitry.
Position the keying bands in the backplane connectors to correspond to
the key slots on the module.
Place the keying bands:
between 10 and 12
28
between
and 30
ATTENTION: Observe the
following precautions when
!
inserting or removing keys:
• insert or remove keys with
your fingers
Upper
Connector
• make sure that key placement
is correct
Incorrect keying or the use of a tool
can result in damage to the
backplane connector and possible
system faults.
I/O chassis
11022-I
You can change the position of these bands if subsequent system design
and rewiring makes insertion of a different type of module necessary
.
Publication
1771-5.50 – October 1996
RTD Input Module4
Install the Module and
Field Wiring Arm
!
Place the module in the card guides on the top and bottom of the chassis that guide the module into position.
1
Important:
Apply firm even pressure on the module to seat it into its backplane connector.
ATTENTION: Remove power from the 1771 I/O
chassis backplane before you install the module.
Failure to remove power from the backplane
could cause:
• module damage
• degradation of performance
• injury or equipment damage due to possible
unexpected operation
1771-A1B, -A2B, -A3B, -A4B I/O chassis
Snap the chassis latch over the
top of the module to secure it.
Attach the wiring arm (1771-WF) to the horizontal bar at the
2
bottom of the I/O chassis.
The wiring arm pivots upward and connects with the
module so you can install or remove the module without
disconnecting the wires.
1771-A1B, -A2B, -A4B Series B I/O chassis
Swing the chassis locking bar
down into place to secure the
modules. Make sure the locking
pins engage.
1771-WF
Publication
1771-5.50 – October 1996
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