BC66-NA Hardware
Design
LPWA Module Series
Rev. BC66-NA_Hardware_Design_V1.0
Date: 2019-04-08
Status: Preliminary
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LPWA Module Series
BC66-NA Hardware Design
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About the Document
History
Revision Date Author Description
1.0 2019-04-08
Speed SUN/
Lewis SHEN
Initial
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Contents
About the Document ................................................................................................................................ 2
Contents .................................................................................................................................................... 3
Table Index ............................................................................................................................................... 5
Figure Index .............................................................................................................................................. 6
1 Introduction ....................................................................................................................................... 7
1.1. Safety Information .................................................................................................................... 8
2 Product Concept ............................................................................................................................. 13
2.1. General Description ................................................................................................................ 13
2.2. Key Features .......................................................................................................................... 14
2.3. Functional Diagram ................................................................................................................ 15
2.4. Development Board ................................................................................................................ 16
3 Application Interfaces ..................................................................................................................... 17
3.1. General Description ................................................................................................................ 17
3.2. Pin Assignment ....................................................................................................................... 18
3.3. Pin Description ....................................................................................................................... 19
3.4. Operating Modes .................................................................................................................... 22
3.5. Power Saving Mode (PSM) .................................................................................................... 23
3.6. Power Supply ......................................................................................................................... 25
3.6.1. Power Supply Pins ....................................................................................................... 25
3.6.2. Reference Design for Power Supply ............................................................................ 26
3.7. Power up/Power down Scenarios ........................................................................................... 26
3.7.1. Turn on ........................................................................................................................ 26
3.7.2. Turn off ........................................................................................................................ 28
3.7.3. Reset the Module ......................................................................................................... 29
3.8. USB Interface ......................................................................................................................... 30
3.9. UART Interfaces ..................................................................................................................... 31
3.9.1. Main UART Port ........................................................................................................... 32
3.9.2. Debug UART Port ........................................................................................................ 33
3.9.3. Auxiliary UART Port ..................................................................................................... 33
3.9.4. UART Application ......................................................................................................... 34
3.10. USIM Interface ....................................................................................................................... 36
3.11. ADC Interface* ....................................................................................................................... 38
3.12. RI Behaviors ........................................................................................................................... 38
3.13. Network Status Indication ....................................................................................................... 39
4 Antenna Interface ............................................................................................................................ 40
4.1. Pin Definition .......................................................................................................................... 40
4.2. Operating Frequencies ........................................................................................................... 40
4.3. RF Antenna Reference Design ............................................................................................... 41
4.4. Reference Design of RF Layout ............................................................................................. 42
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4.5. Antenna Requirements ........................................................................................................... 44
4.6. RF Output Power .................................................................................................................... 45
4.7. RF Receiving Sensitivity ......................................................................................................... 46
4.8. Recommended RF Connector for Antenna Installation ........................................................... 47
5 Electrical and Reliability Characteristics ...................................................................................... 49
5.1. Operation and Storage Temperatures ..................................................................................... 49
5.2. Current Consumption ............................................................................................................. 49
5.3. Electrostatic Discharge ........................................................................................................... 51
6 Mechanical Dimensions.................................................................................................................. 53
6.1. Mechanical Dimensions of the Module ................................................................................... 53
6.2. Recommended Footprint ........................................................................................................ 55
6.3. Top and Bottom Views of the Module ..................................................................................... 56
7 Storage, Manufacturing and Packaging ........................................................................................ 57
7.1. Storage ................................................................................................................................... 57
7.2. Manufacturing and Soldering .................................................................................................. 58
7.3. Packaging ............................................................................................................................... 59
7.3.1. Tape and Reel Packaging ............................................................................................ 59
8 Appendix A References .................................................................................................................. 61
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Table Index
TABLE 1: FREQUENCY BANDS OF BC66-NA MODULE ................................................................................ 13
TABLE 2: BC66-NA KEY FEATURES ............................................................................................................... 14
TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 19
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 22
TABLE 6: POWER SUPPLY PINS ..................................................................................................................... 25
TABLE 7: PWRKEY PIN .................................................................................................................................... 26
TABLE 8: RESET PIN ........................................................................................................................................ 29
TABLE 9: PIN DEFINITION OF USB INTERFACE ........................................................................................... 30
TABLE 10: PIN DEFINITION OF UART INTERFACES ..................................................................................... 32
TABLE 11: PIN DEFINITION OF USIM INTERFACE ........................................................................................ 36
TABLE 12: PIN DEFINITION OF ADC INTERFACE ......................................................................................... 38
TABLE 13: RI SIGNAL STATUS ........................................................................................................................ 38
TABLE 14: MODULE STATUS INDICATED BY NETLIGHT ............................................................................. 39
TABLE 15: PIN DEFINITION OF NB-IOT ANTENNA INTERFACE ................................................................... 40
TABLE 16: MODULE OPERATING FREQUENCIES ........................................................................................ 40
TABLE 17: ANTENNA CABLE INSERTION LOSS REQUIREMENTS ............................................................. 44
TABLE 18: REQUIRED ANTENNA PARAMETERS .......................................................................................... 44
TABLE 19: RF CONDUCTED OUTPUT POWER ............................................................................................. 45
TABLE 20: RECEIVING SENSITIVITY (WITH RF RETRANSMISSIONS) ....................................................... 46
TABLE 21: OPERATION AND STORAGE TEMPERATURES .......................................................................... 49
TABLE 22: MODULE CURRENT CONSUMPTION (3.3V VBAT POWER SUPPLY) ........................................ 50
TABLE 23: ELECTROSTATIC DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY) ........ 52
TABLE 24: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 58
TABLE 25: RELATED DOCUMENTS ................................................................................................................ 61
TABLE 26: TERMS AND ABBREVIATIONS ...................................................................................................... 61
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16
FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 18
FIGURE 3: MODULE OPERATING MODES .................................................................................................... 23
FIGURE 4: MODULE POWER CONSUMPTION IN DIFFERENT MODES ...................................................... 24
FIGURE 5: TIMING OF WAKING UP MODULE FROM PSM ........................................................................... 25
FIGURE 6: REFERENCE CIRCUIT FOR POWER SUPPLY ............................................................................ 26
FIGURE 7: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 27
FIGURE 8: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 27
FIGURE 9: POWER UP TIMING ....................................................................................................................... 27
FIGURE 10: POWER DOWN TIMING (POWER OFF BY AT COMMAND) ...................................................... 28
FIGURE 11: POWER DOWN TIMING (POWER OFF BY DISCONNECTING VBAT) ...................................... 28
FIGURE 12: REFERENCE CIRCUIT OF RESET BY USING DRIVING CIRCUIT ........................................... 29
FIGURE 13: REFERENCE CIRCUIT OF RESET BY USING BUTTON ........................................................... 29
FIGURE 14: RESET TIMING ............................................................................................................................. 30
FIGURE 15: USB INTERFACE REFERENCE DESIGN ................................................................................... 31
FIGURE 16: REFERENCE DESIGN FOR MAIN UART PORT ........................................................................ 33
FIGURE 17: REFERENCE DESIGN OF DEBUG UART PORT ....................................................................... 33
FIGURE 18: REFERENCE DESIGN OF AUXILIARY UART PORT .................................................................. 34
FIGURE 19: REFERENCE CIRCUIT WITH VOLTAGE LEVEL TRANSLATOR CHIP ...................................... 34
FIGURE 20: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 35
FIGURE 21: SKETCH MAP FOR RS-232 INTERFACE MATCH ...................................................................... 35
FIGURE 22: REFERENCE CIRCUIT FOR USIM INTERFACE WITH A 6-PIN USIM CARD CONNECTOR ... 37
FIGURE 23: BEHAVIORS OF RI WHEN A URC OR SMS MESSAGE IS RECEIVED ..................................... 39
FIGURE 24: REFERENCE DESIGN OF NETLIGHT ........................................................................................ 39
FIGURE 25: REFERENCE DESIGN OF NB-IOT ANTENNA INTERFACE ...................................................... 42
FIGURE 26: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 42
FIGURE 27: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 43
FIGURE 28: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .................................................................................................................................................. 43
FIGURE 29: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND) .................................................................................................................................................. 43
FIGURE 30: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 47
FIGURE 31: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 47
FIGURE 32: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 48
FIGURE 33: TOP VIEW OF THE MODULE ...................................................................................................... 56
FIGURE 34: BOTTOM VIEW OF THE MODULE .............................................................................................. 56
FIGURE 35: TAPE DIMENSIONS (UNIT: MM) .................................................................................................. 60
FIGURE 36: REEL DIMENSIONS (UNIT: MM) ................................................................................................. 60
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1 Introduction
This document defines the BC66-NA module and describes its air interface and hardware interface which
are connected with the customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. Associated with application notes
and user guides, customers can use BC66-NA to design and set up mobile applications easily.
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1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating BC66-NA module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
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1.2. FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based time-
averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements
of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body
and must not transmit simultaneously with any other antenna or transmitter.
3.A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR201907BC66NA.
4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
❒ LTE Band2/25:≤8.000dBi
❒ LTE Band4/66:≤5.000dBi
❒ LTE Band5:≤9.416dBi
❒ LTE Band12/17:≤8.734dBi
❒ LTE Band13:≤9.173dBi
❒ LTE Band71:≤8.447dBi
❒ LTE Band85:≤8.734dBi
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
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For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions
explaining to the OEM the labeling requirements, options and OEM user manual instructions that are
required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC
ID: XMR201907BC66NA” or “Contains FCC ID: XMR201907BC66NA” must be used. The host OEM
user manual must also contain clear instructions on how end users can find and/or access the module
and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria
for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the
user that changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment. In cases where the manual is provided only in
a form other than paper, such as on a computer disk or over the Internet, the information required by
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this section may be included in the manual in that alternative form, provided the user can reasonably be
expected to have the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Declaration of Conformity procedure without a
transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that
the after the module is installed and operational the host continues to be compliant with the Part 15B
unintentional radiator requirements.
1.3. IC Statement
IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions: (1) This device may not cause interference; and (2) This device must accept any
interference, including interference that may cause undesired operation of the device." or "Le présent
appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF
The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body
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and must not transmit simultaneously with any other antenna or transmitter.
L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm
de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre
antenne ou un autre émetteur.
To comply with IC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
❒ LTE Band2/25:≤8.000dBi
❒ LTE Band4/66:≤5.000dBi
❒ LTE Band5:≤6.100dBi
❒ LTE Band12/85:≤5.610dBi
❒ LTE Band13:≤5.930dBi
❒ LTE Band17:≤5.630dBi
❒ LTE Band26:≤9.008dBi
❒ LTE Band71:≤5.450dBi
The host product shall be properly labelled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host product; otherwise, the host product must be labeled
to display the Innovation, Science and Economic Development Canada certification number for the
module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-20197BC66NA” or “where: 10224A-20197BC66NA is the module’s certification
number”.
Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module
doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte
doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement
économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la
même signification, comme suit:
"Contient IC: 10224A-20197BC66NA " ou "où: 10224A-20197BC66NA est le numéro de certification du
module".
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2 Product Concept
2.1. General Description
BC66-NA is a high-performance NB-IoT module with extremely low power consumption. It is designed to
communicate with infrastructures of mobile network operators through NB-IoT radio protocols (3GPP
Rel.13 and 3GPP Rel.14). BC66-NA supports a broad range of frequency bands as listed below.
Table 1: Frequency Bands of BC66-NA Module
Mode BC66-NA
H-FDD B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/B19/B20/B25/B26*/B28/B66/B71/B85
BC66-NA is an SMD type module with LCC package, and has an ultra-compact profile of 17.7mm ×
15.8mm × 2.0mm. These make it can be easily embedded into size-constrained applications and provide
reliable connectivity with the applications.
BC66-NA provides abundant external interfaces (USB, UART, ADC*, NETLIGHT, etc.) and protocol
stacks (UDP/TCP, LwM2M, MQTT, etc.), which provide great convenience for customers' applications.
Due to compact form factor, ultra-low power consumption and extended temperature range, BC66-NA is
a best choice for a wide range of IoT applications, such as smart metering, bike sharing, smart wearables,
smart parking, smart city, home appliances, security and asset tracking, agricultural and environmental
monitoring, etc. It is able to provide a complete range of SMS* and data transmission services to meet
customers’ demands.
The module fully complies with the RoHS directive of the European Union.
NOTE
“*” means under development. B26 was disabled in software configuration for FCC version.
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2.2. Key Features
The following table describes the detailed features of BC66-NA module.
Table 2: BC66-NA Key Features
Feature Details
Power Supply
Supply voltage: 2.1V ~ 3.63V
Typical supply voltage: 3.3V
Power Saving Typical power consumption: 3.5μA
Frequency Bands
LTE Cat NB1:
B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/B19/B20/B25/B26*/B28/B66/B71/B85
Transmitting Power 23dBm±2dB
USIM Interface Support 1.8V USIM card
Conform to USB 1.1 specifications, with maximum data transfer rate up to
USB Interface
12Mbps
Used for software debugging and upgrading
Support USB serial driver under Windows/Linux operating systems
Main UART Port:
Used for AT command communication and data transmission.
By default, the module is in auto-baud mode, and it supports automatic
baud rates not exceeding 115200bps. When powering on the module, the
MCU has to send AT command consecutively to synchronize baud rate
with the module. When OK is returned, it indicates the baud rate has been
synchronized successfully. When the module is woken up from PSM or
UART Interfaces
idle mode, the baud rate synchronized during start-up will be used directly.
Also can be used for firmware upgrade, and in such case, the baud rate is
921600bps by default.
Debug UART Port:
Used for firmware debugging
Default baud rate: 115200bps
Auxiliary UART Port:
Used for firmware debugging
Default baud rate: 115200bps
Network Protocols UDP/TCP/LwM2M/MQTT/DTLS/SNTP/CoAP*/PPP*/TLS*/HTTP*/HTTPS*
SMS* Text/PDU Mode
Data Transmission
Features
Single-tone: Max. 103kbps (DL)/18kbps (UL)
Multi-tone: Max. 103kbps (DL )/151kbps (UL)
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AT Commands
3GPP TS 27.005/3GPP TS 27.007 AT commands (3GPP Rel. 13/Rel.14*)
and Quectel Enhanced AT commands
Firmware Update Upgrade firmware via main UART port or DFOTA
Real Time Clock Supported
Physical
Characteristics
Temperature Range
Size: (17.7±0.15)mm × (15.8±0.15)mm × (2.0±0.2)mm
Weight: 1.2g±0.2g
1)
Operation temperature range: -35°C ~ +75°C
Extended temperature range: -40°C ~ +85°C
2)
Storage temperature range: -40°C ~ +90°C
Antenna Interface 50Ω impedance control
RoHS All hardware components are fully compliant with EU RoHS directive
NOTES
1)
1.
Within operation temperature range, the module is 3GPP compliant.
2)
2.
Within extended temperature range, the module remains the ability to establish and maintain an
SMS*, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on
radio spectrum and no harm to radio network. Only one or more parameters like P
might reduce in
out
their value and exceed the specified tolerances. When the temperature returns to normal operation
temperature levels, the module will meet 3GPP specifications again.
3. "*" means under development.
2.3. Functional Diagram
The following figure shows a block diagram of BC66-NA and illustrates the major functional parts.
Radio frequency
Baseband
Power management
Peripheral interfaces
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Figure 1: Functional Diagram
NOTE
“*” means under development.
2.4. Development Board
Quectel provides a complete set of development tools to facilitate the use and testing of BC66-NA module.
The development tool kit includes the TE-B board, USB cable, antenna and other peripherals. For more
details, please refer to document [1].
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3 Application Interfaces
3.1. General Description
BC66-NA is equipped with a total of 58 pins, including 44 LCC pins and 14 LGA pins. The subsequent
chapters will provide detailed descriptions of the following functions/pins/interfaces:
PSM
Power Supply
PWRKEY
RESET
USB Interface
UART Interfaces
USIM Interface
ADC Interface*
RI Behaviors
Network Status Indication
NOTE
“*” means under development. B26 was disabled in software configuration for FCC version.
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3.2. Pin Assignment
VBAT_BB
RESERVED
VBAT_RF
42
43
44
GND14GND
40
41
TXD_DBG
39
GND
37
GND
36
RXD_DBG
38
15
RESET
SIM_VDD
Figure 2: Pin Assignment
NOTES
1. Keep all reserved pins unconnected.
2. “*” means under development.
USB_DP
VUSB_3V3
16
17
18
TXD
RXD
NETLIGHT
USB_DM
19
20
RI
PSM_EINT
21
22
RESERVED
RESERVED
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3.3. Pin Description
Table 3: I/O Parameters Definition
Type Description
AI Analog input
AO Analog output
DI Digital input
DO Digital output
IO Bidirectional
PI Power input
PO Power output
Table 4: Pin Description
Power Supply
Pin Name Pin No. I/O Description DC Characteristics Comment
Power supply for
VBAT_BB 42 PI
the module’s
baseband part
Power supply for
VBAT_RF 43 PI
the module’s RF
part
Vmax=3.63V
Vmin=2.1V
Vnorm=3.3V
Vmax=3.63V
Vmin=2.1V
Vnorm=3.3V
No voltage output in
PSM mode.
It is intended to supply
VDD_
EXT
24 PO
1.8V output
power supply
Vnorm=1.8V
power for the module’s
pull-up circuits, and is
thus not recommended
to be used as the
power supply for
external circuits.
1, 27, 34,
GND
36, 37, 40,
GND
41
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Power Key Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
Pull down
PWRKEY 7 DI
PWRKEY to turn
on the module
V
max=0.3*VBAT
IL
V
min=0.7*VBAT
IH
Reset Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
RESET 15 DI Reset the module Active low.
PSM_EINT Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
Dedicated
external interrupt
PSM_EINT 19 DI
pin.
Used to wake up
the module from
PSM.
Network Status Indication
Pin Name Pin No. I/O Description DC Characteristics Comment
NETLIGHT 16 DO
Network status
indication
ADC Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
General purpose
ADC0* 9 AI
analog to digital
converter
Voltage range:
0V~1.4V
interface
Main UART Port
Pin Name Pin No. I/O Description DC Characteristics Comment
RXD 18 DI Receive data
1.8V power domain.
TXD 17 DO Transmit data
Auxiliary UART Port
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Pin Name Pin No. I/O Description DC Characteristics Comment
RXD_AUX 28 DI Receive data
1.8V power domain.
TXD_AUX 29 DO Transmit data
Debug UART Port
Pin Name Pin No. I/O Description DC Characteristics Comment
RXD_DBG 38 DI Receive data
1.8V power domain.
TXD_DBG 39 DO Transmit data
Ringing Signal
Pin Name Pin No. I/O Description DC Characteristics Comment
RI 20 DO
Ring indication
signal
1.8V power domain.
USIM Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
SIM_VDD 14 DO
SIM_RST 12 DO
SIM_DATA 11 IO
SIM_CLK 13 DO
USIM card
power supply
USIM card reset
signal
USIM card data
signal
USIM card clock
signal
Vnorm=1.8V
V
max=0.15×SIM_VDD
OL
V
min=0.85×SIM_VDD
OH
V
max=0.25×SIM_VDD
IL
min=0.75×SIM_VDD
V
IH
V
max=0.15×SIM_VDD
OL
min=0.85×SIM_VDD
V
OH
V
max=0.15×SIM_VDD
OL
V
min=0.85×SIM_VDD
OH
Specified
SIM_GND 10 GND
ground for USIM
card
Antenna Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
RF_ANT 35 IO
RF antenna
interface
50Ω characteristic
impedance
USB Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
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Pull down the pin
USB_MODE 47 DI
to achieve USB
download
function
VUSB_3V3 49 PI
USB_DP 50 IO
USB power
supply
USB differential
data (+)
Vnorm=3.3V
Conform to USB 1.1
specifications.
Request 90 Ω
USB_DM 51 IO
USB differential
data (-)
differential
impedance.
Reserved Pins
Pin Name Pin No. I/O Description DC Characteristics Comment
2~6, 8,
21~23,
RESERVED
25, 26,
30~33,
44~46,
Keep these pins
unconnected.
48,
52~58
NOTES
1. Keep all unused pins unconnected.
2. “*” means under development. B26 was disabled in software configuration for FCC version.
3.4. Operating Modes
The following table briefly describes the three operating modes of the module.
Table 5: Overview of Operating Modes
Mode Description of Operating Modes
In connected mode, the module is in “Active” status. All functions of the
Normal
Operation
Connected
module are available and all processors are active; radio transmission
and reception can be performed. Transitions to idle mode or PSM can
be initiated in connected mode.
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In idle mode, the module is in “Light Sleep” status and network
Idle
connection is maintained in DRX/eDRX state; paging messages can be
received. Transitions to connected mode or PSM can be initiated in idle
mode.
In PSM, the module is in “Deep Sleep” status and only the 32kHz RTC
PSM
is working. CPU is powered off; the network is disconnected and thus
cannot receive downlink data. Transitions to connected mode can be
initiated in PSM.
Connected
CPU
Active
Software
control
Software control
1. RTC event
2. PSM_EINT
PSM
Deep Sleep
Only 32KH z RTC is
CPU
act ive
Idle
CPU
Light Sleep
Figure 3: Module Operating Modes
3.5. Power Saving Mode (PSM)
Based on system performance, the module consumes an ultra-low current (typically 3.5μA power
consumption) in PSM. PSM is designed to reduce power consumption of the module and improve battery
life. The following figure shows the power consumption of the module in different modes.
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Transmission
Power Consumption
Reception
Idle
PSM
Idle
T3324
UE inactive time
T3412
TAU
Figure 4: Module Power Consumption in Different Modes
The procedure for entering PSM is as follows: the module requests to enter PSM in “ATTACH REQUEST”
message during attach/TAU (Tracking Area Update) procedure. Then the network accepts the request
and provides an active time value (T3324) to the module and the mobile reachable timer starts. When the
T3324 timer expires, the module enters PSM for duration of T3412 (periodic TAU timer). Please note that
the module cannot request PSM when it is establishing an emergency attachment or initializing the PDN
(Public Data Network) connection.
When the module is in PSM, it cannot be paged and stops access stratum activities such as cell
reselection, but T3412 is still active.
Either of the following methods can make the module exit from PSM:
After the T3412 timer expires, the module will exit PSM automatically.
Pulling down PSM_EINT (falling edge) will wake the module up from PSM. The timing of waking up
the module from PSM is illustrated below.
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Figure 5: Timing of Waking up Module from PSM
NOTE
Among all GPIO interrupts, only the dedicated external interrupt pin PSM_EINT can successfully wake up
the module from PSM. The module cannot be woken up by any other general purpose GPIO interrupts.
3.6. Power Supply
3.6.1. Power Supply Pins
BC66-NA provides two VBAT pins for connection with an external power supply. The table below
describes the module's VBAT and ground pins.
Table 6: Power Supply Pins
Pin Name Pin No. Description Min. Typ. Max. Unit
Power supply for the
VBAT_BB 42
VBAT_RF 43
GND
1, 27, 34,
36, 37, 40, 41
module’s baseband
part
Power supply for the
module’s RF part
GND
2.1 3.3 3.63 V
2.1 3.3 3.63 V
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3.6.2. Reference Design for Power Supply
Power design for a module is critical to its performance. It is recommended to use a low quiescent current
LDO with output current capacity of 0.5A as the power supply for BC66-NA. A Li-MnO2/2S alkaline battery
can also be used as the power supply. The supply voltage of the module ranges from 2.1V to 3.63V.
When the module is working, please make sure its input voltage will never drop below 2.1V; otherwise the
module will be abnormal.
For better power performance, it is recommended to place a 100uF tantalum capacitor with low ESR
(ESR=0.7Ω) and three ceramic capacitors (100nF, 100pF and 22pF) near the VBAT pins. Also, it is
recommended to add a TVS diode on the VBAT trace (near VBAT pins) to improve surge voltage
withstand capability. In principle, the longer the VBAT trace is, the wider it should be. A reference circuit
for power supply is illustrated in the following figure.
Figure 6: Reference Circuit for Power Supply
3.7. Power up/Power down Scenarios
3.7.1. Turn on
BC66-NA will be powered up after driving the PWRKEY pin to a low level voltage for at least 500ms.
Table 7: PWRKEY Pin
Pin Name Pin No. Description PWRKEY Pull-down Time
PWRKEY 7
Pull down PWRKEY to power
up the module
≥500ms
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It is recommended use an open drain/collector driver to control the PWRKEY. A simple reference circuit is
illustrated in the following figure.
Figure 7: Turn on the Module Using Driving Circuit
Another way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike
may generate from the finger. Therefore, a TVS component is indispensable to be placed nearby the
button for ESD protection. A reference circuit is shown in the following figure.
Figure 8: Turn on the Module Using Keystroke
The power up timing is illustrated in the following figure.
Figure 9: Power up Timing
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NOTE
PWRKEY cannot be pulled down all the time, otherwise the module will not be able to enter into PSM.
3.7.2. Turn off
BC66-NA can be powered off though any of the following methods:
Power off by AT+QPOWD=0.
In emergent conditions, the module can be powered off through disconnecting VBAT power supply.
The module will be powered off automatically when VBAT drops below 2.1V.
Figure 10: Power down Timing (Power off by AT Command)
Figure 11: Power down Timing (Power off by Disconnecting VBAT)
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3.7.3. Reset the Module
Driving the RESET pin to a low level voltage for at least 50ms will reset the module.
Table 8: Reset Pin
Pin Name Pin No. Description Reset Pull-down Time
RESET 15
Reset the module.
Active low.
≥50ms
The recommended circuits of resetting the module are shown below. An open drain/collector driver or
button can be used to control the RESET pin.
Figure 12: Reference Circuit of RESET by Using Driving Circuit
Figure 13: Reference Circuit of RESET by Using Button
The reset scenario is illustrated in the following figure.
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Figure 14: Reset Timing
3.8. USB Interface
The USB interface of BC26 module conforms to USB 1.1 specifications and supports full speed (12Mbps)
mode. The interface can be used for software debugging and software upgrading, and supports USB
serial driver under Windows/Linux operating systems.
The following table is the pin definition of USB interface:
Table 9: Pin Definition of USB Interface
Pin Name Pin No. I/O Description Note
USB_MODE 47 DI
Pull down the pin to achieve USB
download function
VUSB_3V3 49 PI USB power supply Vnorm=3.3V
USB_DP 50 IO USB differential data (+)
Conform to USB 1.1
specifications.
USB_DM 51 IO USB differential data (-)
Require 90Ω differential
impedance.
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The following is a reference design of USB interface:
Module
VUSB_3V3
USB_DM
USB_DP
GND
3.3V
ESD Array
PC
USB_DM
USB_DP
GND
Figure 15: USB Interface Reference Design
In the circuit design of USB interface, in order to ensure the performance of USB, the following principles
are suggested in the circuit design:
It is important to route the USB signal traces as differential pairs with total grounding. The impedance
of USB differential trace is 90Ω.
Do not route signal traces under power supply, RF signal traces and other sensitive signal traces. It is
important to route the USB differential traces in inner-layer with ground shielding on not only upper
and lower layers but also right and left sides.
Pay attention to the influence of junction capacitance of ESD protection components on USB data
lines. Typically, the capacitance value should be less than 3pF.
Keep the ESD protection components as close to the USB connector as possible.
NOTES
1. USB_MODE must be pulled down so as to realize USB download function.
2. When the USB interface is used for log capturing, the module will not be able to enter PSM.
3. When using USB function of the module, an external 3.3V power supply should be provided.
3.9. UART Interfaces
The module provides three UART ports: main UART port, debug UART port and auxiliary UART port. The
module is designed as DCE (Data Communication Equipment), following the traditional DCE-DTE (Data
Terminal Equipment) connection.
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Table 10: Pin Definition of UART Interfaces
Interface Pin Name Pin No. Description Comment
TXD 17 Send data to RXD of DTE
Main UART Port
RXD 18 Receive data from TXD of DTE
RXD_DBG 38 Receive data from TXD of DTE
Debug UART Port
TXD_DBG 39 Send data to RXD of DTE
1.8V power
domain
RXD_AUX 28 Receive data from TXD of DTE
Auxiliary UART Port
TXD_AUX 29 Send data to RXD of DTE
Ring indication signal (when there is a
Ring Indication Signal RI 20
SMS or URC output, the module will
inform DTE with the RI pin)
NOTE
When the module enters idle mode with a fixed baud rate, please send AT via UART to wake up the
module first before sending other AT commands.
3.9.1. Main UART Port
The main UART port supports AT command communication, data transmission and firmware upgrade.
By default, the module is in auto-baud mode and it supports automatic baud rates not exceeding
115200bps. When powering on the module, the MCU has to send AT command consecutively to
synchronize baud rate with the module. When OK is returned, it indicates the baud rate has been
synchronized successfully. When the module is woken up from PSM or idle mode, the baud rate
synchronized during start-up will be used directly.
When the port is used for firmware upgrade, the baud rate is 921600bps by default.
The figure below shows the connection between DCE and DTE.
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Figure 16: Reference Design for Main UART Port
3.9.2. Debug UART Port
Through debug tools, the debug UART port can be used to output logs for firmware debugging. Its baud
rate is 115200bps by default. The following is a reference design of debug UART port.
Figure 17: Reference Design of Debug UART Port
3.9.3. Auxiliary UART Port
The auxiliary UART port is designed as a general purpose UART for communication with DTE. It also
supports log output for firmware debugging, and hardware flow control*. Its baud rate is 115200bps by
default. The following is a reference design of auxiliary UART port.
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Figure 18: Reference Design of Auxiliary UART Port
3.9.4. UART Application
The module provides 1.8V UART interfaces. A level translator should be used if the application is
equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments
(please visit http://www.ti.com
reference design.
for more information) is recommended. The following figure shows a
Module
VDD_EXT
0.1uF
RXD
TXD
RXD_DBG
TXD_DBG
RXD_AUX
TXD_AUX
RI GPIO
GND GND
51K 51K
VCCA VCCB
OE
A1
A2
A3
A4
A5
A6
A7
A8
Translator
GND
B1
B2
B3
B4
B5
B6
B7
B8
0.1uF
VDD
TXD
RXD
TXD_DBG
RXD_DBG
TXD_AUX
RXD_AUX
DTE
Figure 19: Reference Circuit with Voltage Level Translator Chip
Another example with transistor translation circuit is shown as below. The circuit design of dotted line
section can refer to the design of solid line section, in terms of both module input and output circuit
designs, but please pay attention to the direction of connection.
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4.7K
1nF
1nF
4.7K
VDD_EXT
DTE
TXD
RXD
10K
VCC_DTE
TXD_DBG
RXD_DBG
TXD_AUX
RXD_AUX
GPIO
Module
RXD_DBG
TXD_DBG
RXD_AUX
TXD_AUX
VDD_EXT
10K
RXD
TXD
VDD_EXT
RI
GNDGND
Figure 20: Reference Circuit with Transistor Circuit
The following circuit shows a reference design for the communication between the module and a PC with
standard RS-232 interface. Please make sure the I/O voltage of level shifter which connects to module is
1.8V.
Module
TXD
RXD
GND
C1+
C1-
C2+
C2-
T1IN
T2IN
T3IN
RI
Level Shifter
(1.8V~3.3V)
T4IN
T5IN
/R1OUT
R1OUT
R2OUT
R3OUT
RS-232
Transceiver
V+
GND
VCC
T2OUT
T1OUT
T5OUT
T3OUT
T4OUT
R1IN
R2IN
R3IN
GND
GND
3.3V
V-
GND
To PC Main Serial Port
6
7
8
9
1
2
3
4
5
GND
Figure 21: Sketch Map for RS-232 Interface Match
Please visit vendors’ websites to select a suitable RS-232 transceiver, such as: http://www.exar.com
http://www.maximintegrated.com
.
and
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NOTES
1. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.
2. “ ” represents the test point of UART interfaces. It is also recommended to reserve the test points of
VBAT and PWRKEY, for convenient firmware upgrade and debugging when necessary.
3. “*” means under development.
3.10. USIM Interface
The module provides a USIM interface compliant to ISO/IEC 7816-3, enabling the module to access to an
external 1.8V USIM card.
The external USIM card is powered by an internal regulator in the module and supports 1.8V power
supply.
Table 11: Pin Definition of USIM Interface
Pin Name Pin No. Description Comment
SIM_VDD 14 Power supply for USIM card
Voltage accuracy: 1.8V±5%.
Maximum supply current: about 60mA.
SIM_CLK 13 Clock signal of USIM card
SIM_DATA 11 Data signal of USIM card
SIM_RST 12 Reset signal of USIM card
SIM_GND 10 Specified ground for USIM card
A reference circuit design for USIM interface with a 6-pin USIM card connector is illustrated below.
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Figure 22: Reference Circuit for USIM Interface with a 6-pin USIM Card Connector
For more information of USIM card connector, please visit http://www.amphenol.com
http://www.molex.com
.
or
In order to enhance the reliability and availability of USIM card in application, please follow the criteria
below in USIM circuit design:
Keep the placement of USIM card connector as close as possible to the module. Keep the trace
length as less than 200mm as possible.
Keep USIM card signals away from RF and VBAT traces.
Assure the trace between the ground of module and that of USIM card connector is short and wide.
Keep the trace width of ground no less than 0.5mm to maintain the same electric potential. The
decouple capacitor between SIM_VDD and GND should be not more than 1μF and be placed close
to the USIM card connector.
To avoid cross talk between SIM_DATA and SIM_CLK, keep them away from each other and shield
them separately with surrounded ground.
In order to offer good ESD protection, it is recommended to add a TVS diode array. For more
information of TVS diode, please visit http://www.onsemi.com
. The ESD protection device should be
placed as close to USIM card connector as possible, and make sure the USIM card signal lines go
through the ESD protection device first and then to the module. The 22Ω resistors should be
connected in series between the module and the USIM card connector so as to suppress EMI
spurious transmission and enhance ESD protection. Please note that the USIM peripheral circuit
should be close to the USIM card connector.
Place the RF bypass capacitors (33pF) close to the USIM card connector on all signal traces to
improve EMI suppression.
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3.11. ADC Interface*
The module provides a 10-bit ADC input channel to read the voltage value. The interface is available in
active mode, and has to be woken up first to ensure availability in sleep modes.
Table 12: Pin Definition of ADC Interface
Pin Name Pin No. Description Sample Range
ADC0* 9 Analog to digital converter interface 0V ~ 1.4V
NOTE
“*” means under development.
3.12. RI Behaviors
When there is a message received or URC output, the module will notify DTE through RI pin.
Table 13: RI Signal Status
Module Status RI Signal Level
Idle RI keeps in high level
SMS
URC
When an SMS is received, RI outputs 120ms low pulse first and then changes to
high level and starts data output.
When URC is incoming, RI outputs 120ms low pulse first and then changes to
high level and starts data output.
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Output data
HIGH
LO W
RI
idl e
A UR C or SMS me ssage is rec eived
120ms
Figure 23: Behaviors of RI When a URC or SMS Message is Received
3.13. Network Status Indication
The NETLIGHT signal can be used to indicate the network status of the module. The following table
illustrates the module status indicated by NETLIGHT.
Table 14: Module Status Indicated by NETLIGHT
NETLIGHT Level Module Status
Always Low (LED OFF) The module is not working or in idle/PSM mode
64ms High (LED ON)/800ms Low (LED OFF) Network searching
64ms High (LED ON)/2000ms Low (LED OFF) Network connected
A reference circuit is shown as below.
Figure 24: Reference Design of NETLIGHT
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4 Antenna Interface
The pin 35 is the RF antenna pad. The antenna port has an impedance of 50Ω.
4.1. Pin Definition
Table 15: Pin Definition of NB-IoT Antenna Interface
Pin Name Pin No. Description
RF_ANT 35 RF antenna interface
GND 34, 36, 37 Ground
4.2. Operating Frequencies
Table 16: Module Operating Frequencies
Frequency Band Receiving Frequency Transmitting Frequency
B1 2110MHz~2170MHz 1920MHz~1980MHz
B2 1930MHz~1990MHz 1850MHz~1910MHz
B3 1805MHz~1880MHz 1710MHz~1785MHz
B4 2110MHz~2155MHz 1710MHz~1755MHz
B5 869MHz~894MHz 824MHz~849MHz
B8 925MHz~960MHz 880MHz~915 MHz
B12 729MHz~746MHz 699MHz~716MHz
B13 746MHz~756MHz 777MHz~787MHz
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B17 734MHz~746MHz 704MHz~716MHz
B18 860MHz~875MHz 815MHz~830MHz
B19 875MHz~890MHz 830MHz~845MHz
B20 791MHz~821MHz 832MHz~862MHz
B25 1930MHz~1995MHz 1850MHz~1915MHz
B26* 859MHz~894MHz 814MHz~849MHz
B28 758MHz~803MHz 703MHz~748MHz
B66 2110MHz~2200MHz 1710MHz~1780MHz
B71 617MHz~652MHz 663MHz~698MHz
B85 728MHz~746MHz 698MHz~716MHz
NOTE
“*” means under development.
4.3. RF Antenna Reference Design
BC66-NA provides an RF antenna pad for external NB-IoT antenna connection.
The RF trace on host PCB connected to the module’s RF antenna pad should be coplanar
waveguide or microstrip, whose characteristic impedance should be close to 50Ω.
BC66-NA comes with ground pads which are next to the antenna pad in order to give a better
grounding.
In order to achieve better RF performance, it is recommended to reserve a π type matching circuit
and place the π-type matching components (R1/C1/C2) as close to the antenna as possible. By
default, the capacitors (C1/C2) are not mounted and a 0Ω resistor is mounted on R1.
A reference design of the RF interface is shown as below.
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Figure 25: Reference Design of NB-IoT Antenna Interface
4.4. Reference Design of RF Layout
For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50Ω. The
impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,
the height between signal layer and reference ground (H), and the clearance between RF trace and
ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic
impedance control. The following are reference designs of microstrip line or coplanar waveguide line with
different PCB structures.
.
Figure 26: Microstrip Line Design on a 2-layer PCB
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Figure 27: Coplanar Waveguide Line Design on a 2-layer PCB
Figure 28: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)
Figure 29: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground)
In order to ensure RF performance and reliability, the following principles should be complied with in RF
layout design:
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Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.
The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.
The distance between the RF pins and the RF connector should be as short as possible, and all the
right angle traces should be changed to curved ones.
There should be clearance area under the signal pin of the antenna connector or solder joint.
The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W).
For more details, please refer to document [2].
4.5. Antenna Requirements
To minimize the loss on RF trace and RF cable, please pay attention to the antenna design. The following
tables show the requirements on NB-IoT antenna.
Table 17: Antenna Cable Insertion Loss Requirements
Band Requirements
LTE B5/B8/B12/B13/B17/B18/B19/B20/B26/B28/B71/B85 Cable Insertion loss: <1dB
LTE B1/B2/B3/B4/B25/B66 Cable Insertion loss: <1.5dB
Table 18: Required Antenna Parameters
Parameters Requirements
Frequency Range 617MHz~2200MHz
VSWR ≤2
Efficiency > 30%
Max Input Power (W) 50
Input Impedance (Ω) 50
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4.6. RF Output Power
Table 19: RF Conducted Output Power
Frequency Band Max. Min.
B1 23dBm±2dB <-39dBm
B2 23dBm±2dB <-39dBm
B3 23dBm±2dB <-39dBm
B4 23dBm±2dB <-39dBm
B5 23dBm±2dB <-39dBm
B8 23dBm±2dB <-39dBm
B12 23dBm±2dB <-39dBm
B13 23dBm±2dB <-39dBm
B17 23dBm±2dB <-39dBm
B18 23dBm±2dB <-39dBm
B19 23dBm±2dB <-39dBm
B20 23dBm±2dB <-39dBm
B25 23dBm±2dB <-39dBm
B26* 23dBm±2dB <-39dBm
B28 23dBm±2dB <-39dBm
B66 23dBm±2dB <-39dBm
B71 23dBm±2dB <-39dBm
B85 23dBm±2dB <-39dBm
NOTES
1. The design conforms to the NB-IoT radio protocols in 3GPP Rel.13 and 3GPP Rel.14.
2. “*” means under development. B26 was disabled in software configuration for FCC version.
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4.7. RF Receiving Sensitivity
Table 20: Receiving Sensitivity (with RF Retransmissions)
Frequency Band Receiving Sensitivity
B1 -129dBm
B2 -129dBm
B3 -129dBm
B4 -129dBm
B5 -129dBm
B8 -129dBm
B12 -129dBm
B13 -129dBm
B17 -129dBm
B18 -129dBm
B19 -129dBm
B20 -129dBm
B25 -129dBm
B26* -129dBm
B28 -129dBm
B66 -129dBm
B71 -129dBm
B85 -129dBm
NOTE
“*” means under development.
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4.8. Recommended RF Connector for Antenna Installation
If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector
provided by HIROSE.
Figure 30: Dimensions of the U.FL-R-SMT Connector (Unit: mm)
U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.
Figure 31: Mechanicals of U.FL-LP Connectors
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The following figure describes the space factor of mated connector.
Figure 32: Space Factor of Mated Connector (Unit: mm)
For more details, please visit http://www.hirose.com
.
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5 Electrical and Reliability
Characteristics
5.1. Operation and Storage Temperatures
The following table lists the operation and storage temperatures of BC66-NA.
Table 21: Operation and Storage Temperatures
Parameter Min. Typ. Max. Unit
Operation Temperature Range 1) -35 +25 +75 ºC
Extended Temperature Range 2) -40 +85 ºC
Storage Temperature Range -40 +90 ºC
NOTES
1)
1.
Within operation temperature range, the module is 3GPP compliant.
2)
2.
Within extended temperature range, the module remains the ability to establish and maintain an
SMS*, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on
radio spectrum and no harm to radio network. Only one or more parameters like P
their value and exceed the specified tolerances. When the temperature returns to normal operation
temperature levels, the module will meet 3GPP specifications again.
might reduce in
out
5.2. Current Consumption
The table below lists the current consumption of BC66-NA under different states.
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Table 22: Module Current Consumption (3.3V VBAT Power Supply)
Parameter Mode Description Min. Typ. Max.
PSM Sleep mode 3.5 5 μA
eDRX=81.92s, PTW=40.96s 130 µA
Idle
@DRX=1.28s 520 μA
@DRX=2.56s 250 μA
B1 @23dBm 130 280 mA
B2 @23dBm 130 280 mA
B3 @23dBm 130 280 mA
B4 @23dBm 130 280 mA
B5 @23dBm 130 280 mA
B8 @23dBm 140 290 mA
2)
Unit
I
VBAT
B12 @23dBm 120 230 mA
Single-tone
B13 @23dBm 120 230 mA
B17 @23dBm 120 230 mA
(15kHz subcarrier
Connected 1)
spacing)
B18 @23dBm 130 270 mA
B19 @23dBm 130 270 mA
B20 @23dBm 130 270 mA
B25 @23dBm 130 270 mA
B26* @23dBm 130 270 mA
B28 @23dBm 120 240 mA
B66 @23dBm 140 280 mA
B71 @23dBm 115 230 mA
B85 @23dBm TBD TBD mA
Single-tone B1 @23dBm 195 280 mA
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(3.75kHz
subcarrier
spacing)
B2 @23dBm 195 280 mA
B3 @23dBm 195 280 mA
B4 @23dBm 195 280 mA
B5 @23dBm 195 280 mA
B8 @23dBm 215 290 mA
B12 @23dBm 180 230 mA
B13 @23dBm 180 230 mA
B17 @23dBm 170 230 mA
B18 @23dBm 190 270 mA
B19 @23dBm 195 270 mA
B20 @23dBm 195 270 mA
B25 @23dBm 195 270 mA
B26* @23dBm 195 270 mA
B28 @23dBm 185 240 mA
B66 @23dBm 210 280 mA
B71 @23dBm 175 230 mA
B85 @23dBm TBD TBD mA
NOTES
1)
1.
Power consumption under instrument test condition.
2)
2.
The “maximum value” in “Connected” mode refers to the maximum pulse current during RF
emission.
3. “*” means under development. B26 was disabled in software configuration for FCC version.
5.3. Electrostatic Discharge
The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
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packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module’s electrostatic discharge characteristics.
Table 23: Electrostatic Discharge Characteristics (25ºC, 45% Relative Humidity)
Test Contact Discharge Air Discharge Unit
VBAT, GND ±5 ±10 kV
Antenna interface ±5 ±10 kV
Other interfaces ±0.5 ±1 kV
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6 Mechanical Dimensions
This chapter describes the mechanical dimensions of the module. All dimensions are measured in
millimetre (mm), and the tolerances for dimensions without tolerance values are ±0.05mm.
6.1. Mechanical Dimensions of the Module
Pin 1
Figure 31: BC66-NA Top and Side Dimensions (Unit: mm)
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Pin 1
Figure 32: Module Bottom Dimension (Bottom View)
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6.2. Recommended Footprint
36
Pin 1
1
23
14
Figure 33: Recommended Footprint (Unit: mm)
NOTE
The module should be kept about 3mm away from other components on the host PCB.
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6.3. Top and Bottom Views of the Module
Figure 33: Top View of the Module
Figure 34: Bottom View of the Module
NOTE
These are renderings of BC66-NA module. For authentic dimension and appearance, please refer to the
module that you receive from Quectel.
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7 Storage, Manufacturing and
Packaging
7.1. Storage
BC66-NA module is stored in a vacuum-sealed bag. It is rated at MSL 3, and storage restrictions are
shown as below.
1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.
Stored at <10%RH.
3. Devices require baking before mounting, if any circumstance below occurs.
When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity
is >10% before opening the vacuum-sealed bag.
Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%.
4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
NOTE
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
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7.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.18mm~0.20mm. For more details, please
refer to document [4].
It is suggested that the peak reflow temperature is 238~245ºC, and the absolute maximum reflow
temperature is 245ºC. To avoid damage to the module caused by repeated heating, it is strongly
recommended that the module should be mounted after reflow soldering for the other side of PCB has
been completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and
related parameters are shown below.
Temp. (°C)
245
238
220
200
Soak Zon e
150
A
100
Max slope: 1~3°C/sec
Figure 36: Recommended Reflow Soldering Thermal Profile
Table 24: Recommended Thermal Profile Parameters
Reflow Zone
Max slope:
2~3°C/sec
B
C
D
Cooling down
slope: 1~4°C/sec
Factor Recommendation
Soak Zone
Max slope 1 to 3°C/sec
Soak time (between A and B: 150°C and 200°C) 60 to 120 sec
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Reflow Zone
Max slope 2 to 3°C/sec
Reflow time (D: over 220°C) 40 to 60 sec
Max temperature 238°C ~ 245°C
Cooling down slope 1 to 4°C/sec
Reflow Cycle
Max reflow cycle 1
NOTES
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still clearly
identifiable and the QR code is still readable, although white rust may be found.
7.3. Packaging
The modules are stored in a vacuum-sealed bag which is ESD protected. The bag should not be opened
until the devices are ready to be soldered onto the application.
7.3.1. Tape and Reel Packaging
The reel is 330mm in diameter and each reel contains 250 modules.
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Figure 35: Tape Dimensions (Unit: mm)
Figure 36: Reel Dimensions (Unit: mm)
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8 Appendix A References
Table 25: Related Documents
SN Document Name Remark
[1] Quectel_BC66-NA-TE-B_User_Guide BC66-NA-TE-B User Guide
[2] Quectel_RF_Layout_Application_Note RF Layout Application Note
[3] Quectel_BC66-NA_AT_Commands_Manual BC66-NA AT Commands Manual
[4] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide
Table 26: Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
CoAP Constrained Application Protocol
DCE Data Communications Equipment (typically module)
DTE Data Terminal Equipment (typically computer, external controller)
DTLS Datagram Transport Layer Security
EMI Electromagnetic Interference
ESD Electrostatic Discharge
FTP File Transfer Protocol
H-FDD Half Frequency Division Duplexing
HTTP Hyper Text Transfer Protocol
HTTPS Hyper Text Transfer Protocol over Secure Socket Layer
I/O Input/Output
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kbps Kilo Bits Per Second
LED Light Emitting Diode
Li-MnO2 Lithium-manganese Dioxide
Li-2S Lithium Sulfur
LTE Long Term Evolution
LwM2M Lightweight M2M
MQTT Message Queuing Telemetry Transport
NB-IoT Narrow Band- Internet of Things
PCB Printed Circuit Board
PDU Protocol Data Unit
PPP Point-to-Point Protocol
PSM Power Save Mode
RF Radio Frequency
RTC Real Time Clock
RXD Receive Data
SMS Short Message Service
SSL Secure Sockets Layer
TCP Transmission Control Protocol
TE Terminal Equipment
TXD Transmitting Data
UART Universal Asynchronous Receiver & Transmitter
UDP User Datagram Protocol
URC Unsolicited Result Code
USIM Universal Subscriber Identification Module
VSWR Voltage Standing Wave Ratio
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Vmax Maximum Voltage Value
Vnorm Normal Voltage Value
Vmin Minimum Voltage Value
VIHmax Maximum Input High Level Voltage Value
VIHmin Minimum Input High Level Voltage Value
VILmax Maximum Input Low Level Voltage Value
VILmin Minimum Input Low Level Voltage Value
VImax Absolute Maximum Input Voltage Value
VInorm Absolute Normal Input Voltage Value
VImin Absolute Minimum Input Voltage Value
VOHmax Maximum Output High Level Voltage Value
VOHmin Minimum Output High Level Voltage Value
VOLmax Maximum Output Low Level Voltage Value
VOLmin Minimum Output Low Level Voltage Value
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