Nokia 22 Modules

Programmes After Market Services

TME-1 Series Transceivers

Modules

Issue 1 ãNokia Mobile Phones Ltd.

TME-1

Modules PAMS Technical Documentation

Table of Contents

Page No

Glossary of Terms.......................................................................................................... 3

Functional Description of TME-1.................................................................................. 5

Circuit Description .......................................................................................................5

Interfaces and Connectors ............................................................................................5

RS232 Connector ...................................................................................................... 5

M2M System Connector ........................................................................................... 5

UI Light Indicators......................................................................................................... 6

UI Light Indicator1 and 2 states: .................................................................................6

UI Light indicator 3, 4 and 5 states: ............................................................................7

Signal tones ..................................................................................................................8

Key Sequences .............................................................................................................8

Functional Description of DTX-1 .................................................................................. 9

Product and Module List .............................................................................................9

Connectors .................................................................................................................10

Trunk Connector ..................................................................................................... 10

Extension Connector ............................................................................................... 10

M2M System Connector ......................................................................................... 10

Page 2 ãNokia Mobile Phones Ltd. Issue 1

TME-1

PAMS Technical Documentation Modules

Glossary of Terms

ACCIf Accessory Interface block of MAD2WD1

AIF Application Interface

ASIC Application Specific Integrated Circuit

BB Baseband

CCONT Power management IC for digital phones

CIS PCMCIA Card Information Structure

COBBA_GJP DCT3 RF-interface and audio codec ASIC

with serial MAD interface

CSP Chip Scale Package

DB Dual band

DCS1800 Digital Cellular system at 1800 MHz

DCT3 Digital Core Technology, 3rd generation

DSP Digital Signal Processor

EMC Electromagnetic compatibility

EMI Electromagnetic Interference

FBUS Asynchronous Full Duplex Serial Bus

GSM Global System for Mobile communications

HSCSD High Speed Circuit Switched Data

MBUS 1-wire half duplex serial bus

MCU Micro Controller Unit

MDI MCU-DSP Interface

MAD MCU+ASIC+DSP asic, common name for whole family

MAD2PR1 Modified MAD2 asic, pin count 144 instead of 176

MAD2WD1 MCU+ASIC+DSP with HSCSD specific changes

Issue 1 ãNokia Mobile Phones Ltd. Page 3