AGP 4X/8X Slot & PCI Riser Card
PCI Slots 1 & 2 & 3
ATA33/66/100 IDE & Video Connectors
USB & LAN Connectors
H/W Monitor & FAN
ATX & Front Panel
AGP & MEMORY & USB Regulator Controller
VCC_DAC & VTT Regulator & VR Thermal
VRM 10 - Intersil HIP 6556B + HIP 6602B
PULL UP/ DOWN RESISTORS
GPIO
19
20
21
22
23
24
25
26
27
28
29
Main Memory:
DDR2700 * 4 (Max 4GB)
Expansion Slots:
PCI2.3 SLOT * 3
AGP4X/8X SLOT * 1
Intersil PWM:
Controller: HIP6556B
Driver: HIP6602B * 2
Regulators
System : FAN5236
1
MSI
Title
SizeDocument NumberRev
Date:Sheetof
MICRO-STAR INt'L CO., LTD.
H/W Project Leader : Andy Chen
H/W Project Engineer : Prudence Wang
COVER SHEET
VISE (MS-6715)
130Friday, September 27, 2002
0A
1
VRM 10
Intersil 6556
Intel mPAG478B Processor
Block Diagram
4-Phase PWM
FSB
64bit DDR
133/166MHz@2.1/2.7GB/s
4 DDR
DIMM
Modules
AGP 1.5V
Connector
Analog
133/166MHz@4.2/4.5GB/s
4X/8X w/Fast Write
66MHz@2.1GB/s
Springdale
Video
Out
HCT
ICH5
Link
PCI CNTRL
PCI ADDR/DATA
33MHz@133MB/s
PCI Slot 1
PCI Slot 2
PCI Slot 3
66MHz@266MB/s
UltraDMA
IDE Primary
IDE Secondary
AA
USB Port 0
33/66/100/133
44.44MHz(W)/50MHz(R)@88.9/100MB/s
USB Port 1
USB Port 2
USB Port 3
USB Port 4
USB
240MHz@60MB/s
LPC Bus
33MHz@16.5MB/s
LPC SIO
USB Port 5
SMSC
LPC47B387
USB Port 6
USB Port 7
AD1981B
AC'97 Codec
GIGA LAN
BCM5702
AC'97 Link
12.288MHz@1.536MB/s
PCI
33MHz@133MB/s
Flash
Keyboard
Mouse
1
FloopyParallelSerial
MSI
Title
SizeDocument NumberRev
Date:Sheetof
MICRO-STAR INt'L CO., LTD.
H/W Project Leader : Andy Chen
H/W Project Engineer : Prudence Wang
BLOCK DIAGRAM
VISE (MS-6715)
230Friday, September 27, 2002
0A
5
Revision Initial ver: 0AE0 on 07/31/2002
Schematic Initial on July 31.
Revision change list from ver: 0AE0 to ver: 0AE1 on 08/01/2002
Sheet 1: Modify some txts.
Sheet 2: Modify some txts.
Sheet 16: Move Lan connector to page 26.
DD
Sheet 25: Modify some block for customer request, detail list on below:
(1) Modify 5v USB power supplier.
(2) Modify 5V main power circuit.
(3) Modify GMCH VTT voltage supplier.
(4) Add GMCH VTT reference voltage circuit.
Sheet 26: Modify some block for customer request, detail list on below:
(1) Modify 3V standby power supplier.
(2) Change VTT_DDR to LP2995.
(3) Add lan magnetic circuit.
(4) Modify Lan connector.
(5) Add 1.5V standby voltage.
Revision change list from ver: 0AE1 to ver: 0AE2 on 08/09/2002
Sheet 8: Change VTT_FSB to capacitors termination on pin A15 and A21.
Sheet 9: Change VCC_DDR to capacitors termination on pin
CC
E35,E35,AA35,AR21 and AR15.
Sheet 27: Change some bulk caps from 2200uF to 560uF.
Revision change list from ver: 0AE2 to ver: 0AE3 on 08/13/2002
Sheet 12: Modify some block for customer request, detail list on below:
(1) Delete GP14 and GP15 on pin U21 and pin T20 on ICH5.
(2) Add CHASIS_ID2 on pin V3 on ICH5.
(3) Delete USB6+, USB6-, USB7+, and USB7-.
(4) Change FRONT_USB_DET# from pin C13 to pin D13 on ICH5.
Sheet 13: Modify some block for customer request, detail list on below:
(3) Add strapping resistors.
Sheet 17: Delete some caps on VCC_DDR.
Sheet 18: Delete some caps on VCC_DDR.
BB
Sheet 19: Delete some AGP termination resistors.
Sheet 20: Change PCI clock label.
Sheet 22: Modify some block for customer request, detail list on below:
(1) Delete 2 ports USB, and one USB power.
(2) Removed LAN connector to here.
Sheet 24: Modify some block for customer request, detail list on below:
(1) Change from GP14 to NC on pin 10 of F_P1.
(2) Change from NC to CHASIS_ID2 on pin 15 of F_P1.
(3) Change from GP15 to CHASIS_ID0 on pin 17 of F_P1.
(4) Change from GND to CHASIS_ID1 on pin 18 of F_P1.
(5) Pull VCC3_SB to pin C13 on ICH5.
Sheet 27: Modify some block for customer request, detail list on below:
(1) Change R473 from 1Kohm to NC.
AA
(2) Change R475 from 0 ohm to NC.
(3) Change some bulk caps from 2200uF to 560uF.
Sheet 28: Delete R89,R90,R91, and R92.
5
4
3
Revision change list from ver: 0AE3 to ver: 0AE4 on 8/14/2002
Sheet 13: Modify clock generator library.
Sheet 14: Modify some block for customer request, detail list on below:
(1) Change SERIAL PORT 2 connector to 10 pin center-keyed shrouded header.
(2) Add TI GD75232.
(3) Change label PS_ON to PS_ON#.
Sheet 15: Modify some block for customer request, detail list on below:
(1) Delete Q7,Q8,Q10,Q11,Q12,Q34.
(2) Modify this page same as reference schematic.
Sheet 17: Exchange pin 103 and pin 167 on DIMM1 and DIMM2.
Sheet 18: Exchange pin 103 and pin 167 on DIMM3 and DIMM4.
Sheet 21: Modify some block for customer request, detail list on below:
(1) Add 33 ohm series resistors on Data 15:0 on Primary IDE.
(2) Add 33 ohm series resistors on Data 15:0 on Secondary IDE.
(3) Delete U12, NC7WZ08.
Sheet 24: Modify some block for customer request, detail list on below:
(1) Delete Q31, R376, R377,and R378.
(2) Change label PS_ON to PS_ON#.
(3) Delete U12, NC7WZ08.
Sheet 25: Change Q25 from 2N3904 to 2N7002.
Revision change list from ver: 0AE4 to ver: 0AE5 on 08/16/2002
Sheet 6: Modify some block for customer request, detail list on below:
(1) All TESTHI pull up resistors change from 51ohm to 62ohm.
(2) Delete OPTIMZ label.
Sheet 7: Modify some block for customer request, detail list on below:
(1) Delete EC1 and EC2.
(2) Change L1 and L2 from 4.7uH to 10uH.
Sheet 8: Modify some block for customer request, detail list on below:
(1) Separate from VCCA_FSB and add 0.1uF cap to GND on pin A31.
(2) Change C225 from 0.22uF to 0.47uF.
Sheet 10: Modify some block for customer request, detail list on below:
(1) Add 2pins header to pin T20.
(2) Change pin D14 and C14 to OC#2 signal.
(3) Change label OC#2 to OC#3.
(4) Change label OC#3 to OC#7.
(5) Add label CI_VREF and CI_SWING to pin AF4 and AF2.
(6) Delete R65 on pin AG10.
Sheet 11: Modify some block for customer request, detail list on below:
(1) Add 0.1uF cap to pin F19.
(2) Add 0.1uF cap to pin Y5, AA4 and AB4.
(3) Add 0.1uF cap to pin F7 and F8.
Sheet 12: Modify some block for customer request, detail list on below:
(1) Change R102 from 0ohm to 10Kohm.
Sheet 13: Modify some block for customer request, detail list on below:
(1) Change R154 and R152 from 300ohm to 330ohm.
(1) Change R151 from 2Kohm to 2.2Kohm.
Sheet 15: Modify some block for customer request, detail list on below:
(1) Add 47ohm resistor to AC_SDIN0.
(2) Change R199 from 10ohm to 47ohm and add 47pF cap.
(3) Change R219 and R209 from 4.7Kohm to 100ohm.
(4) Change R202, R203, R207, R208 from 6.8Kohm to 4.7Kohm.
(5) Add divide 1Kohm pull down resistor to OUT_R and OUT_L signals.
(6) Delete C71.
4
3
2
1
Revision change list from ver: 0AE4 to ver: 0AE5 on 08/16/2002
Sheet 17: Modify some block for customer request, detail list on below:
(1) Add two 75 ohm divide resistors in DDR_VREF.
(2) Change 110ohm to 56ohm on Rterm array resistors.
(3) Add two divide 75ohm resistors pin 1.
Sheet 18: Modify some block for customer request, detail list on below:
(1) Add two 75 ohm divide resistors in DDR_VREF.
(2) Change 110ohm to 56ohm on Rterm array resistors.
(3) Add two divide 75ohm resistors pin 1.
Sheet 20: Modify some block for customer request, detail list on below:
(1) Add 2pins header for support Prochot latch.
Sheet 21: Modify some block for customer request, detail list on below:
(1) Change R299 and R295 from 4.7Kohm to 8.2Kohm.
Sheet 22: Modify some block for customer request, detail list on below:
(1) Add one usb power circuit to seperate port 0,1 and 2,3.
(2) Change R315 and R313 from 21Kohm to 470Kohm.
(3) Change R320 and R319 from 51Kohm to 560Kohm.
(4) Change C134 from 470pF to 1000pF.
Sheet 24: Modify some block for customer request, detail list on below:
(1) Change R380 from 330ohm to 68ohm.
Sheet 27: Modify some block for customer request, detail list on below:
(1) Change CT41-CT44 from 2200uF to 560uF.
Sheet 28: Modify some block for customer request, detail list on below:
(1) Change label OC#3 to OC#7.
(2) Add some divide resistors to CI_VREF and CI_SWING signals.
(3) Change R1 from 100ohm to 200ohm and add a 200ohm resistor pull to VTT voltage.
(4) Delete R14. and ITP_VCC direct connect to Vccp.
(5) Change BPM# from 51ohm to 62ohm.
(6) Change R30 from 220ohm to 200ohm.
(7) Add two 0ohm resistors to support ITP or USB_ITP port.
(6) Change R17 from 27ohm to 47ohm.
Revision change list from ver: 0AE5 to ver: 0AE6 on 08/19/2002
Sheet 25: Modify some block for customer request, detail list on below:
(1) Add 300 ohm resistor from BOOT to VCC_VID and change R423 to 10Kohms.
(2) Change R411 and R415 to 3V_SW_CTRL# signal.
Sheet 27: Modify some block for customer request, detail list on below:
(1) Add Northwood FB network and Prescott FB network to VRM controlled by BOOT.
(2) Change 110ohm to 56ohm on Rterm array resistors.
(3) Change R460,R464,R467,and R470 from 2.83Kohm to 3.3Kohm.
Sheet 28: Add teo 10Kohm pull down resistors to RSMRST# and ICH_GD signals.
Revision change list from ver: 0AE6 to ver: 0AE7 on 08/20/2002
Sheet 13: Modify some block for customer request, detail list on below:
(1) Change R495 from ICHPCLK to LANPCLK signal.
(2) Change R496 from FWHPCLK to PCICLK0 signal.
(3) Change R497 from LANPCLK to PCICLK1 signal.
Sheet 16: Delete CB89,CB90,CB88,CB114, CB117, and CB118.
Sheet 17: Change all component from 0603 to 0402.
Sheet 18: Change all component from 0603 to 0402.
MSI
Title
SizeDocument NumberRev
2
Date:Sheetof
MICRO-STAR INt'L CO., LTD.
H/W Project Leader : Andy Chen
H/W Project Engineer : Prudence Wang
REVISION HISTORY - 1
VISE (MS-6715)
1
330Friday, September 27, 2002
0A
5
Revision change list from ver: 0AE7 to ver: 0AE8 on 08/21/2002
Sheet 7: Change some caps of north side to not install.
Sheet 12: Modify some block for customer request, detail list on below:
(1) Add LPC_DRQ#1 label on pin R2 on ICH5.
(2) Change pin Y12 from INTRUDER# to HOOD_SENSE#.
Sheet 13: Modify some block for customer request, detail list on below:
DD
(1) Remove R143 and R142. Connect FWH RST# signal directly to PCIRST#.
(2) Delete R154,Q5,Q3, and R151.
(3) Change R152 from 330 ohm to 8.2K ohm.
(4) Add one resistor to SEC_PCLK signal and share with SIO_PCLK.
(5) Delete INIT# BLOCK.
Sheet 14: Modify some block for customer request, detail list on below:
(1) Change pin 44 to BRD_V1.
(2) Change pin 45 to MB_ADPT_DET#.
(3) Change pin 47 to SEC_TPM_PRES.
(4) Change pin 49 to MB_ADPT_DET#.
(5) Change pin 54 to FDD_2M.
(6) Add pin 104 to 5V_IN.
Sheet 18: Change all component from 0603 to 0402.
Sheet 20: Modify some block for customer request, detail list on below:
CC
(1) Change TAP resistors from 4.7Kohm to 2.2Kohm.
(2) Add a 2.2Kohm pull down resistor to PCIRST#1.
Sheet 24: Add Security header.
Sheet 25: Change VCC5 & VCC3 Discharge Residual Voltage same as reference schematic.
Revision change list from ver: 0AE8 to ver: 0AE9 on 08/23/2002
Sheet 16: Support BCM4401.
Sheet 20: Modify some block for customer request, detail list on below:
(1) Delete CT17.
(2) Change CT16 from intall to not install.
Sheet 23: Delete CB284 and R324.
Sheet 27: Change R456,R466,R479, and R489 from 1 ohm/1206 to 4.7ohm/0805.
Revision change list from ver: 0AE9 to ver: 0AEA on 08/26/2002
Sheet 11: Change Label from VCC3_SB to 3VSB.
Sheet 13: Modify some block for customer request, detail list on below:
BB
(1) Change Label from PCIRST# to PCIRST_ICH5#.
(2) Change all pull high resistors of clock generator from VCC3V to VCC3.
Sheet 14: Modify some block for customer request, detail list on below:
(1) Change Label from VCC3_SB to 3VSB.
(2) Change pin 45 to GP25 and add a 4.7Kohm resistor to VCC3 on GP25.
(3) Add a label SYSMAG_INT on pin 61.
(4) Change pin 44 to MB_ADPT_DET#.
(5) Change pin 49 to SEC_TPM_PRES.
Sheet 15: Modify some block for customer request, detail list on below:
(1) Delete R514, R515, C81, C86, C88, C89.
(2) Change R211 & R216 to 0 ohm.
(3) Change C82 & C84 to 4.7uF.
(4) Change R209 & R219 to 4.7K.
AA
(5) Add 0.22uF and 4.12K in series to pin1 of Front Audio Header.
(6) Add label bias circuit to pin 3 of Front Audio Header.
(7) Add X_330 ohm from OUT_L to junction of C218 & R504.
Sheet 16: Change Label from VCC3_SB to 3VSB.
Sheet 21: Change Label from VCC3_SB to 3VSB.
Sheet 22: Change Label from VCC3_SB to 3VSB.
5
4
Revision change list from ver: 0AE9 to ver: 0AEA on 08/26/2002
Sheet 23: Modify some block for customer request, detail list on below:
(1) Change H/W monitoring circuit.
(2) Change Fan circuit.
Sheet 24: Change Label from VCC3_SB to 3VSB.
Sheet 25: Change Label from VCC3_SB to 3VSB.
Sheet 26: Change Label from VCC3_SB to 3VSB.
Sheet 27: Change Label from VCC3_SB to 3VSB.
Sheet 28: Change Label from VCC3_SB to 3VSB.
Revision change list from ver: 0AEA to ver: 0AEB on 09/03/2002
Sheet 6: Change CPU Symbol - pin F6=GTLREF3, pin F20=GTLREF2, pin
AA6=GTLREF1, pin AA21=GTLREF0.
Sheet 9: Modify some block for customer request, detail list on below:
(1) Disconnect U28 pin E34 (GMCH) directly to VREF.
(2) Add a 2.2uF cap to this pin E34.
Sheet 13: Modify some block for customer request, detail list on below:
(1) Change R135 & R139 from 1K to 10K.
(2) Add pullup resistor from BSEL0 to VCC3.
(3) Add pullup resistor from BSEL1 to VCC3.
Sheet 21: Change FB16, FB18 & FB20 to be the same as FB17, FB19 & FB21.
Sheet 25: Modify some block for customer request, detail list on below:
(1) Change Q40 & Q41 to Depletion Mode JFETs.
(2) Connect R400 to -12V.
(3) Change R399 to a 39 ohm RNET and connect in parallel to VCC5.
(4) Change R405 to a 39 ohm RNET and connect in parallel to VCC3.
(5) Move R417 from Drain of Q51 to Source.
(6) Change R417 from 150 to 866 ohms.
(7) Change R425 from 150 to 634ohms.
(8) Change R426 from 150 to 499 ohms.
Sheet 28: Change R46 & R50 to 150 ohms 1%.
Revision change list from ver: 0AEB to ver: 0AEC on 09/09/2002
Sheet 7: Delete 0.1uF caps on CPU side.
Sheet 8: Change R41 from 24.9ohm to 20ohm.
Sheet 9: Modify some block for customer request, detail list on below:
(1) Disconnect U2 pin AR31 (GMCH).
(2) Disconnect U2 pin AL35 (GMCH) and add single cap to it.
Sheet 17: Delete decoupling caps between VCC_DDR and VTT_DDR.
Sheet 18: Delete decoupling caps between VCC_DDR and VTT_DDR.
Sheet 21: Change all arrary resistors from 0603 to 0402 on all IDE.
Sheet 22: Add secondary transformer to support 10M and 100M NIC.
Revision change list from ver: 0AEC to ver: 0AED on 09/12/2002
Sheet 6: Modify some block for customer request, detail list on below:
(1) Disconnect CPU1 pin AC3, IERR# signal.
(2) Add a pull down resistor to CPU1 pin AE26, OPTIMIZ signal, and not install.
Sheet 7: Change R36 from 1Kohm to 2.43Kohm.
Sheet 11: Add RN91 to support VCCSUS1_5A,B,C voltage for ICH5.
Sheet 12: Modify some block for customer request, detail list on below:
(1) Change net GPI12 to PS_DETECT.
(2) Add net FAN_CMD to pin U20.
(3) Change net GPI7 to PROC_HOT#.
(4) Change R102 to 390Kohm, not install ,and a resistor to GND.
(5) Delete net RTC_XI.
Sheet 14: Modify some block for customer request, detail list on below:
(1) Change net TRMTRIP# to SIO_TRMTRIP#.
4
(2) Delete R551, and change net 5V_IN to COMM_B_DET#.
3
2
1
Revision change list from ver: 0AEC to ver: 0AED on 09/12/2002
Sheet 14: Modify some block for customer request, detail list on below:
(1) Swap net BRD_V1 and FAN_CLAMP.
(2) Delete R551, and change net 5V_IN to COMM_B_DET#.
Sheet 15: Modify some block for customer request, detail list on below:
(1) Change R196 to 3.3Kohm.
(2) Add a 270pF cap to GND and AGND, not install.
(3) Add a 1uF caps to MONO_L and MONO_L_R.
(4) Add a 1uF caps to MONO_R and MONO_R_R.
(5) Change R501 and R555 to 130ohm.
(6) Change C218 from 4700pF to 0.01uF.
Sheet 17: Change net DDR_VREF to DDR_VREF1.
Sheet 18: Change net DDR_VREF to DDR_VREF2, and add two resistors.
Sheet 23: Modify some block for customer request, detail list on below:
(1) Modify H/W monitoring and FAN controller.
(2) Change U13 pin 22 from VCC_DDR to No Connect.
Sheet 24: Add PROCHOT# LED.
Sheet 25: Modify some block for customer request, detail list on below:
(1) Delete R394 and R401.
(2) Change C166 to 0.01uF.
(3) Change Q38 pin 5 and pin 6 to VCC5_STR.
(4) Change Q39 pin 5 and pin 6 to VCC3.
(5) Change Q38 pin 3 to PHASE_2V5.
(6) Change Q39 pin 3 to PHASE_1V5.
(7) Change DZ5 to VCC5.
(8) Change U15 pin 15 and 16 to VCC5_STR.
Sheet 26: Modify some block for customer request, detail list on below:
(1) Add VR THERMAL BLOCK.
(2) Add ICH5 VCCSUS1_5A, B, and C voltage regulatot to support this version fail
chipset.
Sheet 28: Modify some block for customer request, detail list on below:
(1) Delete R35, IERR#.
(2) Change net GPI12 to PS_DETECT.
(3) Change net GPI7 to PROC_HOT#.
(4) Add Thermtrip Translation Block.
(5) Change RN3 pin 2 to No Connect.
(6) Delete C36, C37, and R100.
(7) Delete net RTC_XI.
Revision change list from ver: 0AED to ver: 0AEE on 09/18/2002
Sheet 11: Change U3 pin A5 from PREQ#A to BRD_ID1. Delete R72.
Sheet 12: Modify some block for customer request, detail list on below:
(1) Change U3 pin G23 from BRD_ID1 to SATALED#.
(2) Change U3 pin U22 from RISER#2 to No Connect.
(3) Change U3 pin T1 from BRD_ID0 to NIC_ENABLE#.
(4) Change U3 pin V2 from SIO_PME# to PCI_PME#.
(5) Change U3 pin F21 from CH_FAN_OVRD to BRD_ID0.
Sheet 13: Change R625 and R626 to 1Kohm.
Sheet 14: Modify some block for customer request, detail list on below:
(1) Change U6 pin 29 from COMM_B_DET# to DDRC and add pull up to VCC3.
(2) Change R191 from 3VSB to VCC3.
MSI
Title
SizeDocument NumberRev
3
2
Date:Sheetof
MICRO-STAR INt'L CO., LTD.
H/W Project Leader : Andy Chen
H/W Project Engineer : Prudence Wang
REVISION HISTORY - 2
VISE (MS-6715)
430Friday, September 27, 2002
1
0A
5
4
3
2
1
Revision change list from ver: 0AED to ver: 0AEE on 09/18/2002
Sheet 14: Modify some block for customer request, detail list on below:
(3) Change U6 pin 8 from PLED to SUSLED.
(4) Change U6 pin 13 from SUSLED to PLED.
(5) Change U6 pin 14 from SIO_PME# to RI#.
DD
(6) Change U5 & U22 from 75232 to TI75185.
Sheet 19: Change U11 pin 55 from RISER#2 to No Connect. Delete R148.
Sheet 21: Modify some block for customer request, detail list on below:
(1) Add 1K pull up from IDEA_RST# to VCC5.
(2) Add 1K pull up from IDEB_RST# to VCC5.
Sheet 22: Delete U32.
Sheet 23: Change CT53 and CT54 to 25V part.
Sheet 25: Change Q51 and Q53 to FDV301N.
Sheet 26: Add U35 for support sata led on front panel.
Sheet 28: Modify some block for customer request, detail list on below:
(1) Add R36 62 ohms from TRMTRIP# to VCCP.
(2) Change R80 from TRMTRIP# to ICH_TRMTRIP#.
Revision change list from ver: 0AEE to ver: 0AEF on 09/22/2002
Sheet 14: Modify some block for customer request, detail list on below:
CC
(1) Change KBGND to GND on COM2.
(2) Delete FB3.
(5) Change U6 pin 14 from SIO_PME# to RI#.
(6) Change U5 & U22 from 75232 to TI75185.
Sheet 19: Change U11 pin 55 from RISER#2 to No Connect. Delete R148.
BB
AA
MSI
Title
SizeDocument NumberRev
5
4
3
2
Date:Sheetof
MICRO-STAR INt'L CO., LTD.
H/W Project Leader : Andy Chen
H/W Project Engineer : Prudence Wang
It should be able to source 150mA.
It drives the power logic of BSEL[1:0] and VID[5:0].It must rout to the enable pin of PWM and CK-409.
VID to VIDGD delay time is from 1ms to 10ms.VIDGD to Vccp delay time is from 1ms to 10ms.