MSI H61I-E35 User Manual [en, ru, de, fr]

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MS-7677

FCC -B Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable pro-

tection against harmful in-

terference in a residential installation. This equipment

generates, uses and can

radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the measures listed below.

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/ television technician for help.

Notice 1

The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.

VOIR LA NOTICE D’NSTALLATION AVANT DE RACCORDER AU RESEAU.

Micro-Star International

MS-7677

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1)this device may not cause harmful interference, and

(2)this device must accept any interference received, including interference that may cause undesired operation.

Part Number

G52-76771X2

The material in this document is the intellectual property of MICRO-STAR INTERNATIONAL. We take every care in the preparation of this document, but no guarantee is given as to the correctness of its contents. Our products are under continual improvement and we reserve the right to make changes without notice.

Trademarks

All trademarks are the properties of their respective owners.

■MSI® is registered trademark of Micro-Star Int’l Co.,Ltd.

■NVIDIA® is registered trademark of NVIDIA Corporation.

■ATI® is registered trademark of ATI Technologies, Inc.

■AMD® is registered trademarks of AMD Corporation.

■Intel® is registered trademarks of Intel Corporation.

■Windows® is registered trademarks of Microsoft Corporation.

■AMI® is registered trademark of American Megatrends, Inc.

■Award® is a registered trademark of Phoenix Technologies Ltd.

■Sound Blaster® is registered trademark of Creative Technology Ltd.

■Realtek® is registered trademark of Realtek Semiconductor Corporation.

■JMicron® is registered trademark of JMicron Technology Corporation.

■Netware® is a registered trademark of Novell, Inc.

Revision History

Revision	Revision History	Date
V1.0	First release	2011/03
V1.0	First release	2011/03

V1.1	Update BIOS DRAM configuration	2011/04

MS-7677

Safety Instructions

■Always read the safety instructions carefully.

■Keep this User Manual for future reference.

■Keep this equipment away from humidity.

■Lay this equipment on a reliable flat surface before setting it up.

■The openings on the enclosure are for air convection hence protects the equipment from overheating. Do not cover the openings.

■Make sure the voltage of the power source is at 110/220V before connecting.

■Place the power cord such a way that people can not step on it. Do not place anything over the power cord.

■Always Unplug the Power Cord before inserting any add-on card or module.

■All cautions and warnings on the equipment should be noted.

■Never pour any liquid into the opening that can cause damage or cause electrical shock.

■If any of the following situations arises, get the equipment checked by service personnel:

○The power cord or plug is damaged.

○Liquid has penetrated into the equipment.

○The equipment has been exposed to moisture.

○The equipment does not work well or you can not get it work according to User Manual.

○The equipment has been dropped and damaged.

○The equipment has obvious sign of breakage.

■DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT UNCONDITIONED, STORAGE TEMPERATURE ABOVE 60°C (140°F), IT MAY DAMAGE THE EQUIPMENT.

CAUTION

Danger of explosion if battery is incorrectly replaced.

For better environmental protection, waste batteries should be collected separately for recycling or special disposal.

WEEE Statement

ENGLISH

To protect the global environment and as an environmentalist, MSI must remind you that...

Under the European Union (“EU”) Directive on Waste Electrical and Electronic Equipment, Directive 2002/96/EC, which takes effect on August 13, 2005, products of “electrical and electronic equipment”

cannot be discarded as municipal wastes anymore, and manufacturers of covered electronic equipment will be obligated to take back such products at the end of their useful life. MSI will comply with the product take back requirements at the end of life of MSI-branded products that are sold into the EU. You can return these

products to local collection points.

DEUTSCH

Hinweis von MSI zur Erhaltung und Schutz unserer Umwelt

Gemäß der Richtlinie 2002/96/EG über Elektround Elektronik-Altgeräte dürfen Elektround Elektronik-Altgeräte nicht mehr als kommunale Abfälle entsorgt werden. MSI hat europaweit verschiedene Sammelund Recyclingunternehmen beauftragt, die in die Europäische Union in Verkehr gebrachten Produkte, am Ende seines Lebenszyklus zurückzunehmen. Bitte entsorgen Sie dieses Produkt zum gegebenen Zeitpunkt ausschliesslich an einer lokalen Altgerätesammelstelle in Ihrer Nähe.

FRANÇAIS

En tant qu’écologiste et afin de protéger l’environnement, MSI tient à rappeler ceci...

Au sujet de la directive européenne (EU) relative aux déchets des équipement électriques et électroniques, directive 2002/96/EC, prenant effet le 13 août 2005, que les produits électriques et électroniques ne peuvent être déposés dans les décharges ou tout simplement mis à la poubelle. Les fabricants de ces équipements seront obligés de récupérer certains produits en fin de vie. MSI prendra en compte cette exigence relative au retour des produits en fin de vie au sein de la communauté européenne. Par conséquent vous pouvez retourner localement ces matériels dans les points de collecte.

РУССКИЙ

Компания MSI предпринимает активные действия по защите окружающей среды, поэтому напоминаем вам, что....

В соответствии с директивой Европейского Союза (ЕС) по предотвращению загрязнения окружающей среды использованным электрическим и электронным оборудованием (директива WEEE 2002/96/EC), вступающей в силу 13 августа 2005 года, изделия, относящиеся к электрическому и электронному оборудованию, не могут рассматриваться как бытовой мусор, поэтому производители вышеперечисленного электронного оборудования обязаны принимать его для переработки по окончании срока службы. MSI обязуется соблюдать требования по приему продукции, проданной под маркой MSI на территории EC, в переработку по окончании срока службы. Вы можете вернуть эти изделия в специализированные пункты приема.

MS-7677

ESPAÑOL

MSI como empresa comprometida con la protección del medio ambiente, recomienda:

Bajo la directiva 2002/96/EC de la Unión Europea en materia de desechos y/ o equipos electrónicos, con fecha de rigor desde el 13 de agosto de 2005, los productos clasificados como “eléctricos y equipos electrónicos” no pueden ser depositados en los contenedores habituales de su municipio, los fabricantes de equipos electrónicos, están obligados a hacerse cargo de dichos productos al termino de su período de vida. MSI estará comprometido con los términos de recogida de sus productos vendidos en la Unión Europea al final de su periodo de vida. Usted debe depositar estos productos en el punto limpio establecido por el ayuntamiento de su localidad o entregar a una empresa autorizada para la recogida de estos residuos.

NEDERLANDS

Om het milieu te beschermen, wil MSI u eraan herinneren dat….

De richtlijn van de Europese Unie (EU) met betrekking tot Vervuiling van Electrische en Electronische producten (2002/96/EC), die op 13 Augustus 2005 in zal gaan kunnen niet meer beschouwd worden als vervuiling. Fabrikanten van dit soort producten worden verplicht om producten retour te nemen aan het eind van hun levenscyclus. MSI zal overeenkomstig de richtlijn handelen voor de producten die de merknaam MSI dragen en verkocht zijn in de EU. Deze goederen kunnen geretourneerd worden op lokale inzamelingspunten.

SRPSKI

Da bi zaštitili prirodnu sredinu, i kao preduzeće koje vodi računa o okolini i prirodnoj sredini, MSI mora da vas podesti da…

Po Direktivi Evropske unije (“EU”) o odbačenoj ekektronskoj i električnoj opremi, Direktiva 2002/96/EC, koja stupa na snagu od 13. Avgusta 2005, proizvodi koji spadaju pod “elektronsku i električnu opremu” ne mogu više biti odbačeni kao običan otpad i proizvođači ove opreme biće prinuđeni da uzmu natrag ove proizvode na kraju njihovog uobičajenog veka trajanja. MSI će poštovati zahtev o preuzimanju ovakvih proizvoda kojima je istekao vek trajanja, koji imaju MSI oznaku i koji su prodati u EU. Ove proizvode možete vratiti na lokalnim mestima za prikupljanje.

POLSKI

Aby chronić nasze środowisko naturalne oraz jako firma dbająca o ekologię, MSI przypomina, że...

ZgodniezDyrektywąUniiEuropejskiej(“UE”)dotyczącąodpadówproduktówelektrycznych i elektronicznych (Dyrektywa 2002/96/EC), która wchodzi w życie 13 sierpnia 2005, tzw. “produkty oraz wyposażenie elektryczne i elektroniczne “ nie mogą być traktowane jako śmieci komunalne, tak więc producenci tych produktów będą zobowiązani do odbierania ich w momencie gdy produkt jest wycofywany z użycia. MSI wypełni wymagania UE, przyjmując produkty (sprzedawane na terenie Unii Europejskiej) wycofywane z użycia. Produkty MSI będzie można zwracać w wyznaczonych punktach zbiorczych.

TÜRKÇE

Çevreci özelliğiyle bilinen MSI dünyada çevreyi korumak için hatırlatır:

Avrupa Birliği (AB) Kararnamesi Elektrik ve Elektronik Malzeme Atığı, 2002/96/ EC Kararnamesi altında 13 Ağustos 2005 tarihinden itibaren geçerli olmak üzere, elektrikli ve elektronik malzemeler diğer atıklar gibi çöpe atılamayacak ve bu elektonik cihazların üreticileri, cihazların kullanım süreleri bittikten sonra ürünleri geri toplamakla yükümlü olacaktır. Avrupa Birliği’ne satılan MSI markalı ürünlerin kullanım süreleri bittiğinde MSI ürünlerin geri alınması isteği ile işbirliği içerisinde olacaktır. Ürünlerinizi yerel toplama noktalarına bırakabilirsiniz.

ČESKY

Záleží nám na ochraně životního prostředí - společnost MSI upozorňuje...

Podle směrnice Evropské unie (“EU”) o likvidaci elektrických a elektronických výrobků 2002/96/EC platné od 13. srpna 2005 je zakázáno likvidovat “elektrické a elektronické výrobky” v běžném komunálním odpadu a výrobci elektronických výrobků, na které se tato směrnice vztahuje, budou povinni odebírat takové výrobky zpět po skončení jejich životnosti. Společnost MSI splní požadavky na odebírání výrobků značky MSI, prodávaných v zemích EU, po skončení jejich životnosti. Tyto výrobky můžete odevzdat v místních sběrnách.

MAGYAR

Annak érdekében, hogy környezetünket megvédjük, illetve környezetvédőként fellépve az MSI emlékezteti Önt, hogy ...

Az Európai Unió („EU”) 2005. augusztus 13-án hatályba lépő, az elektromos és elektronikus berendezések hulladékairól szóló 2002/96/EK irányelve szerint az elektromos és elektronikus berendezések többé nem kezelhetőek lakossági hulladékként, és az ilyen elektronikus berendezések gyártói kötelessé válnak az ilyen termékek visszavételére azok hasznos élettartama végén. Az MSI betartja a termékvisszavétellel kapcsolatos követelményeket az MSI márkanév alatt az EU-n belül értékesített termékek esetében, azok élettartamának végén. Az ilyen termékeket a legközelebbi gyűjtőhelyre viheti.

ITALIANO

Per proteggere l’ambiente, MSI, da sempre amica della natura, ti ricorda che…. In base alla Direttiva dell’Unione Europea (EU) sullo Smaltimento dei Materiali Elettrici ed Elettronici, Direttiva 2002/96/EC in vigore dal 13 Agosto 2005, prodotti appartenenti alla categoria dei Materiali Elettrici ed Elettronici non possono più essere eliminati come rifiuti municipali: i produttori di detti materiali saranno obbligati a ritirare ogni prodotto alla fine del suo ciclo di vita. MSI si adeguerà a tale Direttiva ritirando tutti i prodotti marchiati MSI che sono stati venduti all’interno dell’Unione Europea alla fine del loro ciclo di vita. È possibile portare i prodotti nel più vicino punto di raccolta

MS-7677

Table of Content

English..............................................................................9

Getting startED..........................................................................................9

SPECIFICATIONS............................................................................................10

REAR PANEL...................................................................................................11

HARDWARE SETUP........................................................................................11

BIOS Setup....................................................................................................18

.................................................................................23

...........................................................................................................23

..................................................................................................................24

..........................................................................................................25

...................................................................................................25

BIOS .........................................................................................................32

Français..........................................................................37

Pour commencer......................................................................................37

SPéCIFICATIONS............................................................................................38

Panneau arrière.......................................................................................39

Installation du matériel.......................................................................39

Réglage bios...............................................................................................46

DEUTSCH...........................................................................51

eINLEITUNG....................................................................................................51

SPEZIFIKATIONEN..........................................................................................52

Hinteres Anschlusspanel.....................................................................53

HARDWARE SETUP........................................................................................53

BIOS Setup....................................................................................................60

РУССКИЙ...........................................................................65

НАЧАЛО РАБОТЫ..........................................................................................65

ХАРАКТЕРИСТИКИ........................................................................................66

ЗАДНЯЯ ПАНЕЛЬ...........................................................................................67

УСТАНОВКА ОБОРУДОВАНИЯ....................................................................67

НАСТРОЙКА BIOS..........................................................................................74

..............................................................................79

..................................................................................................................79

..................................................................................................................80

...........................................................................................................81

Setup .....................................................................................................88

..............................................................................	93
..................................................................................................................	93
..................................................................................................................	94
..................................................................................................................	95
...........................................................................................................	95
BIOS .......................................................................................................	102
...............................................................................	107
.........................................................................................................	107
.......................................................................................	108
I/O ........................................................................................................	109
............................................................................	109
BIOS ....................................................................................................	116

MS-7677

English

Getting startED

Thank you for choosing the H61I-E35 (B3) series (MS-7677 v1.x) Mini-ITX mainboard. These series are designed based on Intel® H61 (B3) chipset for optimal system efficiency. Designed to fit the advanced Intel® LGA1155 processor, these series deliver a high performance and professional desktop platform solution.

Layout

Top : mouse

Bottom: keyboard

JPWR2

USB2.0 ports

Top: LAN Jack

Bottom: USB ports

Top: VGA port

Bottom:HDMI port

JUSB2 JUSB1

T:Line-In

M:LineOut

B:Mic-In

JAUD1		JFP1
JAUD1	JSP1	PCI _E1
	JSP1

	JBAT1	JTPM1

CPUFAN

DIMM2

DIMM1

JPWR1

SYSFAN1

SATA4 SATA3 SATA2 SATA1

SPECIFICATIONS

Processor Support

■Intel® Sandy Bridge processor in the LGA1155 package

(For the latest information about CPU, please visit http://www.msi.com/service/cpu-support)

Chipset

■ Intel® H61 (B3) chipset Memory Support

■2 DDR3 DIMMs support DDR3 1333/ 1066 SDRAM (total Max. 16GB)

■Supports Dual-Channel mode

(For more information on compatible components, please visit http://www.msi.com/service/test-report)

LAN

■ Supports LAN 10/ 100/ 1000 by Realtek® 8111E Audio

■Chip integrated by Realtek® ALC887

■Supports 8 channels audio out

■Compliant with Azalia 1.0 Spec

SATA

■ 4 SATA 3Gb/s ports by Intel® H61 (B3) Connectors

■Back panel

1 PS/2 mouse port

1 PS/2 keyboard port

1 VGA port*

1 HDMI port*

4 USB 2.0 ports

1 LAN jack

3 flexible audio jacks

*(The VGA and HDMI port only work with Integrated Graphics Processor.)

■On-Board Connectors

2 USB 2.0 connectors

1 Front Panel Audio connector

1 TPM connector

1 S/PDIF-Out connector

Slots

■ 1 PCIE x1 slot

Form Factor

■ Mini-ITX (17.0 cm X 17.0 cm)

Mounting

■ 4 mounting holes

If you need to purchase accessories and request the part numbers, you could search the product web page and find details on our web address below http://www.msi.com/index.php

MS-7677

REAR PANEL

The rear panel provides the following connectors:

Mouse	LAN	VGA Port
	USB Ports		Line-In
	USB Ports
			Line-Out
Keyboard	USB Ports	HDMI Port	MIC

Note: To reach the 8-channel sound effect, the 7th and 8th channels must be output from front panel.

HARDWARE SETUP

This section provides instructions on CPU and memory installation, as well as jumper settings on the mainboard. While doing the installation, be careful in holding the components and follow the installation procedures.

CPU & Cooler Installation Procedures for LGA1155

When you are installing the CPU, make sure that you install the cooler to prevent overheating. If you do not have the CPU cooler, consult your dealer before turning on the computer.

Introduction to LGA 1155 CPU

The figure below shows the surface of LGA 1155 CPU. Remember to apply some thermal paste on it for better heat dispersion.

Important

Please use the boxed CPU fan or other enhanced coolers to maintain the system stability.

Alignment Key

Yellow triangle is the Pin 1 indicator

Follow the steps below to install the CPU & cooler correctly. Wrong installation will cause the damage of your CPU & mainboard.

. Open the load level.

2.Lift the load lever up to fully open position.

3.The CPU socket has a plastic cap on it to protect the contact from damage. Before you install CPU, always cover it to protect the socket pin. Remove the cap.

4.After confirming the CPU direction for correct mating, put down the CPU in the socket housing frame. Be sure to grasp on the edge of the CPU base. Note that the alignment keys are matched.

5.Visually inspect if the CPU is seated well into the socket. If not, take out the CPU with pure vertical motion and reinstall.

6.Engage the load lever while pressing down lightly onto the load plate.

7.Secure the lever near the hook end under the retention tab.

8.Make sure the four hooks are in proper position before you install the cooler.

9.Align the holes on the mainboard with the heatsink. Push down the cooler until its four clips get wedged into the holes of the mainboard.

0. Press the four hooks down to fasten the cooler.

. Turn over the mainboard to confirm that the clip-ends are correctly inserted.

2. Finally, attach the CPU Fan cable to the CPU fan connector on the mainboard.

Important

*Read the CPU status in BIOS.

*Whenever CPU is not installed, always protect your CPU socket pin with the plastic cap covered to avoid damaging.

*Mainboard photos shown in this section are for demonstration of the CPU/ cooler installation only. The appearance of your mainboard may vary depending on the model you purchase.

*Please refer to the documentation in the CPU fan package for more details about the CPU fan installation.

MS-7677

Installing Memory Modules

. The memory module has only one notch on the center and will only fit in the right orientation.

2.Insert the memory module vertically into the DIMM slot. Then push it in until the golden finger on the memory module is deeply inserted in the DIMM slot. The plastic clip at each side of the DIMM slot will automatically close when the

memory module is properly seated. You can barely see the golden finger if the memory module is properly inserted in the DIMM slot.

3.Manually check if the memory module has been locked in place by the DIMM slot clips at the sides.

Notch

Volt

Important

*In Dual-Channel mode, make sure that you install memory modules of the same type and density in different channel DIMM slots.

*To enable successful system boot-up, always insert the memory modules into the DIMM1 first.

ATX 24-Pin Power Connector: JPWR1

This connector allows you to connect an ATX 24-pin power supply. To connect the ATX 24-pin power supply, make sure the plug of the power supply is inserted in the proper orientation and the pins are aligned. Then push down the power supply firmly into the connector.

						12.
						11	. +3	.
					910.			.
					7	.	+12V		3
					8				V
				6 .
			5 .
1			4	. +5
1		3 .		Ground
2			. +5									24.
		.GroundV										24.
	.				V
. +3.
+3			3								23.
		3V									23.			Ground
											+5			Ground
											. +5				V
											+5				V
											+5	V	V
							+3.Ground
									.	-
							13.		-	ON	#
									12V		#
									3
									V

ATX 4-Pin Power Connector: JPWR2

This 4-Pin power connector is used to provide power to the CPU.

	1
	.
2	Ground
.
Ground

	3
	.
4	+12V
.
+12V

Important

*Make sure that all the connectors are connected to proper ATX power supplies to ensure stable operation of the mainboard.

*Power supply of 350 watts (and above) is highly recommended for system stability.

Serial ATA Connector: SATA1 ~ 4

This connector is a high-speed Serial ATA interface port. Each connector can connect to one Serial ATA device.

Important

Please do not fold the Serial ATA cable into a 90-degree angle. Otherwise, data loss may occur during transmission.

MS-7677

Fan Power Connectors: CPUFAN, SYSFAN1

The fan power connectors support system cooling fan with +12V. When connecting the wire to the connectors, always note that the red wire is the positive and should be connected to the +12V; the black wire is Ground and should be connected to GND. If the mainboard has a System Hardware Monitor chipset onboard, you must use a specially designed fan with speed sensor to take advantage of the CPU fan control.

CPUFAN SYSFAN1

				1
		2 .
3			. G
4	.			+	o
4		S 1				u
.			e 2				n
C				n V				d
		o		s
			n
				t o
				r r
				o
				l

		1
	2 .
3	. Gr
3		+		o
.		1		u
N			2		n
	o			V		d
		U
			s
				e

S/PDIF-Out Connector: JSP1

This connector is used to connect S/PDIF (Sony & Philips Digital Interconnect Format) interface for digital audio transmission.

		1
	2 .
3	. Gr
		S			o
.			P		u
V				D		n
	C				I		d
		C			F

Front Panel Connectors: JFP1

This connector is for electrical connection to the front panel switches and LEDs. The JFP1 is compliant with Intel® Front Panel I/O Connectivity Design Guide.

	P
P	ower		S	10.
P			S	10.
ower		LE	witch			No
		LE				8Pi
			D			6	. n
			D			6		-
			4			.
			4			+
			2	.
			2		-
			.
			+

JFP1

					9
1 -						.
1 -			7				Reserve
	5			.
	5				+
3		.
3		-
.											d
+											d
.							Reset
							Reset			S
				HDD				LE		S
								LE	D		witch

Front Panel Audio Connector: JAUD1

This connector allows you to connect the front panel audio and is compliant with Intel® Front Panel I/O Connectivity Design Guide.

8 .

Front USB Connector: JUSB1, JUSB2

This connector, compliant with Intel® I/O Connectivity Design Guide, is ideal for connecting high-speed USB interface peripherals such as USB HDD, digital cameras, MP3 players, printers, modems and the like.

						1
								0
			6		8 .
			6				G NC
				.		.			r
	4			.					r
	4				U				o
2		.				S				u
2		U						B			n
.				S					1			d
V					B					+
		C					1
			C					-

						9
			7			.
							N
		5 .						o
	3		. Gr						P
			U				o			i
1	.				S			u n
	U								n
.			S			B				d
V				B			0
	C				0			+
		C				-

TPM Module connector: JTPM1

This connector connects to a TPM (Trusted Platform Module) module. Please refer to the TPM security platform manual for more details and usages.

1 .

. Gr

. G

i o

2 .

1 .

P C

MS-7677

Clear CMOS Jumper: JBAT1

There is a CMOS RAM onboard that has a power supply from an external battery to keep the data of system configuration. With the CMOS RAM, the system can automatically boot OS every time it is turned on. If you want to clear the system configuration, set the jumper to clear data.

JBAT1

1	1
Keep Data	Clear Data

Important

You can clear CMOS by shorting 1-2 pin while the system is off, then open it. Avoid clearing the CMOS while the system is on; it will damage the mainboard.

PCI Express Slot

The PCI Express slot supports the PCI Express interface expansion card.

PCI Express x1 slot.

BIOS Setup

Power on the computer and the system will start POST (Power On Self Test) process. When the message below appears on the screen, press <DEL> key to enter Setup.

Press DEL to enter Setup Menu

If the message disappears before you respond and you still wish to enter Setup, restart the system by turning it OFF and On or pressing the RESET button. You may also restart the system by simultaneously pressing <Ctrl>, <Alt>, and <Delete> keys.

The Menu Bar

Main Menu

Use this menu for basic system configurations, such as time, date etc.

Advanced

Use this menu to set up the items of special enhanced features.

Overclocking

Use this menu to specify the settings for DRAM timing and CPU features.

M-Flash

Use this menu to read/ flash the BIOS form storage drive (FAT/ FAT32 format only).

Security

Use this menu to set supervisor and user passwords. Boot

MS-7677

Use this menu to specify the priority of boot devices.

Save & Exit

This menu allows you to load the BIOS default values or factory default settings into the BIOS and exit the BIOS setup utility with or without changes.

Overclocking

Current CPU / DRAM Frequency

These items show the current clocks of CPU and Memory speed. Read-only.

Adjust CPU Ratio

This item controls the multiplier that is used to determine the internal clock speed of the processor relative to the external or motherboard clock speed. It is available only when the processor supports this function.

Adjusted CPU Frequency

It shows the adjusted CPU frequency. Read-only.

Internal PLL Overvoltage

This item are used to adjust the PLL voltage.

EIST

The Enhanced Intel SpeedStep technology allows you to set the performance level of the microprocessor whether the computer is running on battery or AC power. This field will appear after you installed the CPU which supports speedstep technology.

IntelTurbo Booster

This item will appear when you install a CPU with Intel Turbo Boost technology. This item is used to enable/ disable Intel Turbo Boost technology. It can scale processor frequency higher dynamically when applications demand more performance and TDP headroom exists. It also can deliver seamless power scalability (Dynamically scale up, Speed-Step Down).

OC Genie Button Operation

This field is used to enable/ disable OC Genie function.

DRAM Frequency

This setting controls the ratio of memory frequency to enable the memory to run at different frequency combinations.

Adjusted DRAM Frequency

It shows the adjusted DRAM frequency. Read-only.

DRAM Timing Mode

Select whether DRAM timing is controlled by the SPD (Serial Presence Detect) EEPROM on the DRAM module. Setting to [Auto] enables DRAM timings and the following “Advanced DRAM Configuration” sub-menu to be determined by BIOS based on the configurations on the SPD. Selecting [Manual] allows users to configure the DRAM timings and the following related “Advanced DRAM Configuration” sub-menu manually.

Advanced DRAM Configuration

Press <Enter> to enter the sub-menu. In this sub-menu you can adjust the advanced DRAM timing.

Command Rate

This setting controls the DRAM command rate.

tCL

This controls the CAS latency, which determines the timing delay (in clock cycles) before SDRAM starts a read command after receiving it.

tRCD

When DRAM is refreshed, both rows and columns are addressed separately. This setup item allows you to determine the timing of the transition from RAS (row address strobe) to CAS (column address strobe). The less the clock cycles, the faster the DRAM performance.

tRP

This setting controls the number of cycles for Row Address Strobe (RAS) to be allowed to precharge. If insufficient time is allowed for the RAS to accumulate its charge before DRAM refresh, refreshing may be incomplete and DRAM may fail to retain data. This item applies only when synchronous DRAM is installed in the system.

tRAS

This setting determines the time RAS takes to read from and write to memory cell.

tRFC

This setting determines the time RFC takes to read from and write to a memory cell.

tWR

Minimum time interval between end of write data burst and the start of a precharge command. Allows sense amplifiers to restore data to cells.

MS-7677

tWTR

Minimum time interval between the end of write data burst and the start of a column-read command. It allows I/O gating to overdrive sense amplifiers before read command starts.

tRRD

Specifies the active-to-active delay of different banks.

tRTP

Time interval between a read and a precharge command.

tFAW

This item is used to set the tFAW (four activate window delay) timing.

tWCL

This item is used to set the tWCL (Write CAS Latency) timing.

tCKE

This item is used to set the tCKE timing.

tRTL

This item is used to set the tRTL timing.

Advanced Channel 1/ 2 Timing Configuration

Press <Enter> to enter the sub-menu. And you can set the advanced memory timing for each channel.

GT OverClocking

This item allows you to enable/ disable the overclocking of integrated graphics.

GT Ratio

This setting controls the ratio of integrated graphics frequency to enable the integrated graphics to run at different frequency combinations.

Adjusted GT Frequency

It shows the adjusted integrated graphics frequency. Read-only.

Spread Spectrum

When the mainboard’s clock generator pulses, the extreme values (spikes) of the pulses create EMI (Electromagnetic Interference). The Spread Spectrum function reduces the EMI generated by modulating the pulses so that the spikes of the pulses are reduced to flatter curves.

Important

*If you do not have any EMI problem, leave the setting at [Disabled] for optimal system stability and performance. But if you are plagued by EMI, select the value of Spread Spectrum for EMI reduction.

*The greater the Spread Spectrum value is, the greater the EMI is reduced, and the system will become less stable. For the most suitable Spread Spectrum value, please consult your local EMI regulation.

*Remember to disable Spread Spectrum if you are overclocking because even a slight jitter can introduce a temporary boost in clock speed which may just cause your overclocked processor to lock up.

CPU Features

Press <Enter> to enter the sub-menu. In this sub-menu you can adjust the CPU features.

Save & Exit

Discard Changes and Exit

Use this item to abandon all changes and exit setup.

Save Changes and Reboot

Use this item to save changes and reboot the system.

Save Options

Use this item to save changes.

Discard Changes

Use this item to abandon all changes.

Restore Defaults

Use this item to load the optimized default values set by the BIOS vendor.

== Boot Override ==

The installed storage devices will appear on this menu, you can select one of them be a boot device.

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