INTEL D815EFV, D815EPFV User Manual

Intel® Desktop Board D815EFV/D815EPFV

Technical Product Specification

May 2001

Order Number A49745-002

Desktop Boards D815EFV and D815EPFV may contain design defects or errors known as errata that may cause the product to deviate from published specifications.

The Intel Current characterized errata are documented in the Intel Desktop Board D815EFV/D815EPFV Specification Update.

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board D815EFV/D815EPFV Technical Product Specification

-002 Second release of the Intel® Desktop Board D815EFV/D815EPFV Technical Product Specification

This product specification applies to only standard D815EFV and D815EPFV boards with BIOS identifier EA81520A.86A.

Changes to this specification will be published in the Intel Desktop Board D815EFV/D815EPFV Specification Update before being incorporated into a revision of this document.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel products are not intended for use in medical, life saving, or life sustaining applications or for any other application in which the failure of the Intel product could create a situation where personal injury or death may occur.

Intel may make changes to specifications and product descriptions at any time, without notice.

The Intel as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:

Intel Corporation P.O. Box 5937 Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.

Intel, Pentium, LANDesk, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries

†

Other names and brands may be claimed as the property of others.

Desktop Board D815EFV and the Intel® Desktop Board D815EPFV may contain design defects or errors known

PRODUCTS. EXCEPT AS

February 2001

April 2001

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for these Intel Desktop Boards: D815EFV and D815EPFV. It describes the standard product and available manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the D815EFV and D815EPFV boards and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the D815EFV and D815EPFV boards

2 A map of the resources of the board

3 The features supported by the BIOS Setup program

4 The contents of the BIOS Setup program’s menus and submenus

5 A description of the BIOS error messages, beep codes, and POST codes

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

✏

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

WARNING

Warnings indicate conditions, which if not observed, can cause personal injury.

iii

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

(NxnX) When used in the description of a component, N indicates component type, xn are the relative

coordinates of its location on the D815EFV and D815EPFV boards, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area.

GB Gigabyte (1,073,741,824 bytes)

KB Kilobyte (1024 bytes)

Kbit Kilobit (1024 bits)

kbits/sec 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/sec Megabytes per second

Mbit Megabit (1,048,576 bits)

Mbit/sec Megabits per second

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

†

This symbol is used to indicate other names and brands that may be claimed as the property of others.

1 Product Description

1.1 Board Differences.......................................................................................................11

1.1.1 Feature Level Differences............................................................................11

1.1.2 Identifying Universal Boards .........................................................................12

1.2 Overview....................................................................................................................13

1.2.1 Feature Summary........................................................................................13

1.2.2 Manufacturing Options.................................................................................14

1.2.3 Board Layout................................................................................................15

1.2.4 Block Diagrams............................................................................................16

1.3 Online Support ...........................................................................................................18

1.4 Operating System Support.........................................................................................18

1.5 Design Specifications.................................................................................................19

1.6 Processor...................................................................................................................22

1.7 System Memory .........................................................................................................23

1.8 Chipsets .....................................................................................................................25

1.8.1 Intel® 815E Chipset......................................................................................25

1.8.2 Intel® 815EP Chipset....................................................................................30

1.9 I/O Controller..............................................................................................................35

1.9.1 Serial Ports ..................................................................................................35

1.9.2 Parallel Port..................................................................................................36

1.9.3 Diskette Drive Controller ..............................................................................36

1.9.4 Keyboard and Mouse Interface....................................................................36

1.10 Graphics Subsystems.................................................................................................37

1.10.1 Intel 815E Graphics Subsystem...................................................................37

1.10.2 Intel 815EP Graphics Subsystem.................................................................41

1.11 Audio Subsystem........................................................................................................42

1.11.1 AD1885 Audio Codec...................................................................................42

1.11.2 Audio Connectors.........................................................................................42

1.12 LAN Subsystem (Optional).........................................................................................44

1.12.1 Intel® 82562ET Platform LAN Connect Device.............................................44

1.12.2 RJ-45 LAN Connector LEDs.........................................................................44

1.13 Hardware Management Subsystem............................................................................45

1.13.1 Hardware Monitor Component.....................................................................45

1.13.2 Chassis Intrusion Detect Connector (Optional).............................................45

1.13.3 Fan Control and Monitoring..........................................................................46

1.14 CNR Connector (Optional)..........................................................................................46

1.15 Power Management ...................................................................................................47

1.15.1 Software Support .........................................................................................47

1.15.2 Hardware Support........................................................................................51

2 Technical Reference

2.1 Introduction.................................................................................................................57

2.2 Memory Map ..............................................................................................................57

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

2.3 I/O Map ......................................................................................................................58

2.4 DMA Channels ...........................................................................................................60

2.5 PCI Configuration Space Map ....................................................................................60

2.6 Interrupts ....................................................................................................................61

2.7 PCI Interrupt Routing Map..........................................................................................61

2.8 Connectors.................................................................................................................63

2.8.1 Back Panel Connectors................................................................................64

2.8.2 Internal I/O Connectors ................................................................................68

2.8.3 External I/O Connectors...............................................................................78

2.9 Jumper Blocks............................................................................................................82

2.9.1 Front Panel Audio Connector/Jumper Block.................................................82

2.9.2 BIOS Setup Configuration Jumper Block......................................................83

2.10 Mechanical Considerations.........................................................................................84

2.10.1 Form Factor .................................................................................................84

2.10.2 I/O Shields ...................................................................................................85

2.11 Electrical Considerations ............................................................................................92

2.11.1 Power Consumption.....................................................................................92

2.11.2 Add-in Board Considerations........................................................................93

2.11.3 Standby Current Requirements....................................................................93

2.11.4 Fan Connector Current Capability ................................................................94

2.11.5 Power Supply Considerations ......................................................................94

2.12 Thermal Considerations..............................................................................................95

2.13 Reliability ....................................................................................................................96

2.14 Environmental ............................................................................................................97

2.15 Regulatory Compliance ..............................................................................................98

2.15.1 Safety Regulations.......................................................................................98

2.15.2 EMC Regulations .........................................................................................98

2.15.3 Product Certification Markings (Board Level) ...............................................99

3 Overview of BIOS Features

3.1 Introduction...............................................................................................................101

3.2 BIOS Flash Memory Organization ............................................................................102

3.3 Resource Configuration............................................................................................102

3.3.1 PCI Autoconfiguration ................................................................................102

3.3.2 IDE Support ...............................................................................................102

3.4 System Management BIOS (SMBIOS).....................................................................103

3.5 Legacy USB Support ................................................................................................104

3.6 BIOS Updates ..........................................................................................................105

3.6.1 Language Support......................................................................................105

3.6.2 Custom Splash Screen...............................................................................105

3.7 Recovering BIOS Data .............................................................................................106

3.8 Boot Options.............................................................................................................107

3.8.1 CD-ROM and Network Boot.......................................................................107

3.8.2 Booting without Attached Devices..............................................................107

Product Description

3.9 Fast Booting Systems with Intel® Rapid BIOS Boot..................................................107

3.9.1 Peripheral Selection and Configuration ......................................................108

3.9.2 Intel Rapid BIOS Boot ................................................................................108

3.9.3 Operating System Selection.......................................................................108

3.10 BIOS Security Features............................................................................................109

4 BIOS Setup Program

4.1 Introduction...............................................................................................................111

4.2 Maintenance Menu...................................................................................................112

4.2.1 Extended Configuration Submenu..............................................................113

4.3 Main Menu................................................................................................................114

4.4 Advanced Menu........................................................................................................115

4.4.1 PCI Configuration Submenu.......................................................................116

4.4.2 Boot Configuration Submenu .....................................................................117

4.4.3 Peripheral Configuration Submenu.............................................................118

4.4.4 IDE Configuration Submenu.......................................................................120

4.4.5 Diskette Configuration Submenu................................................................123

4.4.6 Event Log Configuration Submenu.............................................................124

4.4.7 Video Configuration Submenu....................................................................125

4.5 Security Menu ..........................................................................................................126

4.6 Power Menu .............................................................................................................127

4.6.1 APM Submenu...........................................................................................128

4.6.2 ACPI Submenu ..........................................................................................129

4.7 Boot Menu................................................................................................................130

4.7.1 Boot Device Priority Submenu....................................................................131

4.7.2 Hard Disk Drives Submenu ........................................................................132

4.7.3 Removable Devices Submenu ...................................................................132

4.7.4 ATAPI CDROM Drives Submenu ...............................................................133

4.8 Exit Menu .................................................................................................................133

5 Error Messages and Beep Codes

5.1 BIOS Error Messages...............................................................................................135

5.2 Port 80h POST Codes..............................................................................................137

5.3 Bus Initialization Checkpoints ...................................................................................141

5.4 Speaker ...................................................................................................................142

5.5 BIOS Beep Codes ....................................................................................................143

5.6 Diagnostic LEDs (Optional) ......................................................................................144

Figures

1. Location of Universal Board Designator .........................................................................12

2. Board Components ........................................................................................................15

3. Block Diagram for the D815EFV Board ..........................................................................16

4. Block Diagram for the D815EPFV Board........................................................................17

5. Intel 815E Chipset Block Diagram ..................................................................................25

6. USB Port Configurations ................................................................................................28

7. Intel 815EP Chipset Block Diagram................................................................................30

8. USB Port Configurations ................................................................................................33

9. Block Diagram of Audio Subsystem ...............................................................................42

vii

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

10. ICH2 and CNR Signal Interface....................................................................................46

11. Using the Wake on LAN Technology Connector...........................................................53

12. Location of Standby Power Indicator LED ....................................................................54

13. Back Panel Connectors................................................................................................64

14. Audio, Video, Power, and Hardware Control Connectors .............................................69

15. Add-in Board and Peripheral Interface Connectors ......................................................73

16. External I/O Connectors ...............................................................................................78

17. Locations of the Jumper Blocks....................................................................................82

18. Board Dimensions........................................................................................................84

19. I/O Shield Dimensions (for D815EFV Universal Boards with Onboard LAN

Subsystem) ................................................................................................................86

20. I/O Shield Dimensions (for D815EPFV Universal Boards with Onboard LAN

Subsystem) ................................................................................................................87

21. I/O Shield Dimensions (for D815EPFV Universal Boards without Onboard LAN

Subsystem) ................................................................................................................88

22. I/O Shield Dimensions (for D815EFV Boards with Onboard LAN Subsystem)..............89

23. I/O Shield Dimensions (for D815EPFV Boards with Onboard LAN Subsystem) ...........90

24. I/O Shield Dimensions (for D815EPFV Boards without Onboard LAN Subsystem) ......91

25. Localized High Temperature Zones..............................................................................95

26. Diagnostic LEDs.........................................................................................................144

Tables

1. Summary of Board Differences...................................................................................11

2. Feature Summary.......................................................................................................13

3. Manufacturing Options ...............................................................................................14

4. Specifications .............................................................................................................19

5. Supported Processors ................................................................................................22

6. Supported Memory Configurations .............................................................................24

7. Supported Graphics Refresh Frequencies..................................................................38

8. LAN Connector LED States........................................................................................44

9. Effects of Pressing the Power Switch .........................................................................48

10. Power States and Targeted System Power ................................................................49

11. Wake Up Devices and Events ....................................................................................50

12. Fan Connector Descriptions .......................................................................................52

13. System Memory Map..................................................................................................57

14. I/O Map ......................................................................................................................58

15. DMA Channels ...........................................................................................................60

16. PCI Configuration Space Map ....................................................................................60

17. Interrupts ....................................................................................................................61

18. PCI Interrupt Routing Map..........................................................................................62

19. Overcurrent Protection for Back Panel Connectors ....................................................65

20. PS/2 Mouse/Keyboard Connectors.............................................................................65

21. USB Connectors.........................................................................................................65

22. VGA Port Connector (Present Only on D815EFV Boards)..........................................65

23. Parallel Port Connector...............................................................................................66

24. Serial Port A Connector..............................................................................................66

25. LAN Connector (Optional) ..........................................................................................67

26. Mic In Connector ........................................................................................................67

viii

Product Description

27. Audio Line Out Connector ..........................................................................................67

28. Audio Line In Connector .............................................................................................67

29. Auxiliary Line In Connector (J6B4) .............................................................................70

30. Front Panel Audio Connector (J6B2) (Optional)..........................................................70

31. ATAPI CD-ROM Connector (J6B3).............................................................................70

32. Digital Video Out Connector (J5C1) (Optional; present only on D815EFV boards).....71

33. Processor Fan Connector (J1B1) ...............................................................................71

34. Power Connector (J4H1) ............................................................................................71

35. Chassis Fan Connector (J4G1) (Optional)..................................................................72

36. System Fan Connector (J9H1) ...................................................................................72

37. Chassis Intrusion Connector (J9H3) (Optional) ..........................................................72

38. Wake on LAN Technology Connector (J9G1) (Optional) ............................................72

39. CNR Connector (J9B1) (Optional) ..............................................................................74

40. PCI Bus Connectors (J7B1, J8B2, and J9B2).............................................................75

41. AGP Universal Connector (J6C1) ...............................................................................76

42. Diskette Drive Connector (J6H2)................................................................................77

43. IDE Connectors (J6H1, Primary and J6G2, Secondary).............................................77

44. Serial Port B Connector (J8H1) ..................................................................................79

45. Front Panel USB Connector (J8F1) (Optional) ...........................................................79

46. Auxiliary Front Panel Power LED Connector (J9H2)...................................................79

47. SCSI LED Connector (J8H2)......................................................................................79

48. Front Panel Connector (J9H3)....................................................................................80

49. States for a Single-Colored Power LED......................................................................81

50. States for a Dual-Colored Power LED ........................................................................81

51. Front Panel Audio Connector / Jumper Block (J6B2)..................................................83

52. BIOS Setup Configuration Jumper Settings (J9G2)....................................................83

53. Power Usage for a D815EFV Board with Onboard LAN .............................................92

54. Power Usage for a D815EPFV Board with Add-in Graphics Card,

without Onboard LAN .................................................................................................92

55. Standby Current Requirements ..................................................................................93

56. Thermal Considerations for Components ...................................................................96

57. D815EFV and D815EPFV Board Environmental Specifications..................................97

58. Safety Regulations .....................................................................................................98

59. EMC Regulations........................................................................................................98

60. Supervisor and User Password Functions................................................................109

61. BIOS Setup Program Menu Bar ...............................................................................111

62. BIOS Setup Program Function Keys ........................................................................112

63. Maintenance Menu...................................................................................................112

64. Extended Configuration Submenu............................................................................113

65. Main Menu................................................................................................................114

66. Advanced Menu........................................................................................................115

67. PCI Configuration Submenu.....................................................................................116

68. Boot Configuration Submenu....................................................................................117

69. Peripheral Configuration Submenu...........................................................................118

70. IDE Configuration Submenu.....................................................................................120

71. Primary/Secondary IDE Master/Slave Submenus.....................................................121

72. Diskette Configuration Submenu ..............................................................................123

73. Event Log Configuration Submenu...........................................................................124

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

74. Video Configuration Submenu..................................................................................125

75. Security Menu ..........................................................................................................126

76. Power Menu .............................................................................................................127

77. APM Submenu .........................................................................................................128

78. ACPI Submenu.........................................................................................................129

79. Boot Menu................................................................................................................130

80. Boot Device Priority Submenu..................................................................................131

81. Hard Disk Drives Submenu ......................................................................................132

82. Removeable Devices Submenu................................................................................132

83. ATAPI CDROM Drives Submenu .............................................................................133

84. Exit Menu .................................................................................................................133

85. BIOS Error Messages...............................................................................................135

86. Uncompressed INIT Code Checkpoints....................................................................137

87. Boot Block Recovery Code Checkpoints ..................................................................137

88. Runtime Code Uncompressed in F000 Shadow RAM ..............................................138

89. Bus Initialization Checkpoints ...................................................................................141

90. Upper Nibble High Byte Functions............................................................................141

91. Lower Nibble High Byte Functions............................................................................142

92. Beep Codes..............................................................................................................143

93. Diagnostic LED Codes..............................................................................................145

1 Product Description

What This Chapter Contains

1.1 Board Differences.......................................................................................................11

1.2 Overview ....................................................................................................................13

1.3 Online Support ...........................................................................................................18

1.4 Operating System Support .........................................................................................18

1.5 Design Specifications .................................................................................................19

1.6 Processor ...................................................................................................................22

1.7 System Memory .........................................................................................................23

1.8 Chipsets .....................................................................................................................25

1.9 I/O Controller..............................................................................................................35

1.10 Graphics Subsystems.................................................................................................37

1.11 Audio Subsystem........................................................................................................42

1.12 LAN Subsystem (Optional) .........................................................................................44

1.13 Hardware Management Subsystem............................................................................45

1.14 CNR Connector (Optional)..........................................................................................46

1.15 Power Management ...................................................................................................47

1.1 Board Differences

1.1.1 Feature Level Differences

This TPS describes these Intel® Desktop boards: D815EFV and D815EPFV. Table 1 summarizes the differences between these boards.

Table 1. Summary of Board Differences

D815EFV

D815EPFV

• Includes the Intel

Memory Controller Hub (GMCH)

• Provides these video features: AGP universal connector and an optional

Digital Video Output (DVO) connector

• Includes the Intel

Controller Hub (MCH)

• Provides this video feature: AGP universal connector

815E Chipset, which includes the Intel® 82815 Graphics and

815EP Chipset, which includes the Intel® 82815EP Memory

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.1.2 Identifying Universal Boards

The Universal versions of the D815EFV and D815EPFV can be identified by an uppercase “U” on the silkscreen of the board. Figure 1 shows the location of the Universal board designator.

INTEL DESKTOP BOARD

D815EFV / D815EPFV

Figure 1. Location of Universal Board Designator

NOTE

✏

Unless otherwise stated, all information pertaining to standard boards also apply to Universal boards.

OM12011

1.2 Overview

1.2.1 Feature Summary

Table 2 summarizes the D815EFV and D815EPFV boards’ major features.

Table 2. Feature Summary

Form Factor

Processor

Memory

Chipsets

I/O Control

Video

Audio

Peripheral Interfaces

Expansion Capabilities

BIOS

microATX (9.6 inches by 8.2 inches)

Support for either an Intel (FC-PGA) package or an Intel® Celeron™ processor in an FC-PGA package

• Three 168-pin SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for up to 512 MB system memory

• Support for single-sided or double-sided DIMMs

• The D815EFV board includes the Intel 815E Chipset, consisting of:  Intel 82815 Graphics and Memory Controller Hub (GMCH)  Intel  4 Mbit Firmware Hub (FWH) (STM M50FW040 or equivalent)

• The D815EPFV board includes the Intel 815EP Chipset, consisting of:  Intel 82815EP Memory Controller Hub (MCH)  Intel 82801BA I/O Controller Hub (ICH2)

82801BA I/O Controller Hub (ICH2)

Pentium® III processor in a Flip Chip Pin Grid Array

 4 Mbit Firmware Hub (FWH) (STM M50FW040 or equivalent)

SMSC LPC47M132 LPC bus I/O controller

• The D815EFV board includes:  Intel 82815 integrated graphics support  AGP universal connector supporting 1x, 2x, and 4x AGP cards or a

Graphics Performance Accelerator (GPA)

• The D815EPFV board includes an AGP universal connector supporting

1x, 2x, and 4x AGP cards

• Intel 82801BA ICH2 digital controller (AC link output)

• Analog Devices AD1885 Audio Codec

• Four Universal Serial Bus (USB) ports

• Two serial ports

• One parallel port

• Two IDE interfaces with Ultra DMA, ATA-66/100 support

• One diskette drive interface

• PS/2

• Three PCI bus add-in card connectors (SMBus routed to PCI bus connector 2)

• One AGP universal connector

• Intel/AMI BIOS (stored in an STM M50FW040 4 Mbit FWH or equivalent)

• Support for Advanced Power Management (APM), Advanced Configuration and

†

keyboard and mouse ports

Power Interface (ACPI), Plug and Play, and SMBIOS

Product Description

continued

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

Table 2. Feature Summary (continued)

Instantly Available PC

Hardware Monitor Subsystem

SCSI LED Connector

• Support for PCI Local Bus Specification Revision 2.2

• Suspend to RAM support

• Wake on PS/2 keyboard and USB ports

• Voltage sense to detect out of range values

• Two fan sense inputs used to monitor fan activity

Allows add-in SCSI host bus adapters to use the same LED as the onboard I/O controller

For information about Refer to

The board’s compliance level with APM, ACPI, Plug and Play, and SMBIOS Table 4, page 19

1.2.2 Manufacturing Options

Table 3 describes the D815EFV and D815EPFV boards’ manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you.

Table 3. Manufacturing Options

Chassis fan connector

Chassis Intrusion Connector

Communication and Networking Riser (CNR) Connector

Diagnostic LEDs

Front Panel Audio Connector

Front Panel USB Connector

I/O Control

LAN Subsystem

Video

Wake on LAN† Technology Connector

Connector for an additional chassis fan

Detects chassis intrusion

One CNR connector (slot shared with PCI bus connector 3)

Four dual-color LEDs on the back panel

Routes mic in and line out to the front panel

Provides access to two additional USB ports, routed through the optional SMSC LPC47M142 I/O controller

SMSC LPC47M142 LPC bus I/O controller

Intel

Digital Video Output (DVO) connector

Support for system wake up using an add-in network interface card with remote wake up capability

82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device

NOTE

✏

Other drivers may be offered by other third party vendors.

Product Description

1.2.3 Board Layout

Figure 2 shows the location of the major components on the D815EFV and D815EPFV boards.

ONPMQR L JK

Present only on D815EFV boards

OM11469

K Power connector A Communication and Networking Riser (CNR)

connector (optional)

B AD1885 audio codec M Primary IDE connector C AGP universal connector N Secondary IDE connector D Back panel connectors O Intel 82801BA I/O Controller Hub (ICH2) E DVO connector (optional) P SMSC LPC47M132 I/O Controller

• Intel 82815 Graphics and Memory Controller

Hub (GMCH) (D815EFV boards)

• Intel 82815EP Memory Controller Hub (MCH)

(D815EPFV boards)

G Processor socket T Front panel USB connector (optional) H DIMM sockets U PCI bus add-in card connectors I Battery J Speaker

L Diskette drive connector

Q Serial port B connector R Front panel connectors S 4 Mbit Firmware Hub (FWH) (STM M50FW040

or equivalent)

Figure 2. Board Components

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.2.4 Block Diagrams

Figure 3 is a block diagram of the major functional areas of the D815EFV board.

DIMM

Banks

(3)

DVO Connector (Optional)

AGP

Universal

Connector

PCI Slot 1

PCI Slot 2

PCI Slot 3

Hardware

Monitor

SDRAM Bus

Primary/

Secondary IDE

System BusProcessor Socket

Graphics and

Memory Controller

Hub (GMCH)

Digital Video

Output

AGP Bus

82815

PCI Bus

SMBus

815E Chipset

Video

Bus

Onboard

Video

ATA-66/100

AHA

Bus

82801BA

I/O Controller Hub

(ICH2)

Network

USB

LPC

Bus

LPC I/O

Controller

Analog Codec

Optional

AC Link

Physical

Layer

Interface

USB Ports 0 and 1

USB Ports 2 and 3

Firmware Hub

(FWH)

(STM M50FW040

or equivalent)

Diskette Drive

Connector

Serial Port A

Serial Port B Parallel Port PS/2 Mouse

PS/2 Keyboard

CD-ROM

Line In

Line Out

Mic In

Auxiliary Line In

Front Panel

Audio (optional)

CNR

Connector

LAN

Connector

indicates connector or socket

Figure 3. Block Diagram for the D815EFV Board

OM11885

Product Description

Figure 4 is a block diagram of the major functional areas of the D815EPFV board.

DIMM

Banks

(3)

AGP

Universal

Connector

PCI Slot 1

PCI Slot 2

PCI Slot 3

Hardware

Monitor

SDRAM Bus

Primary/

Secondary IDE

System BusProcessor Socket

82815EP

Memory Controller

Hub (MCH)

AGP Bus

PCI Bus

SMBus

ATA-66/100

815EP Chipset

AHA

Bus

82801BA

I/O Controller Hub

(ICH2)

USB

LPC

Bus

LPC I/O

Controller

Analog Codec

USB Ports 0 and 1

USB Ports 2 and 3

Firmware Hub

(FWH)

(STM M50FW040

or equivalent)

Diskette Drive

Connector

Serial Port A

Serial Port B Parallel Port PS/2 Mouse

PS/2 Keyboard

CD-ROM

Line In

Line Out

Mic In

Auxiliary Line In

Front Panel

Audio (optional)

indicates connector or socket

Figure 4. Block Diagram for the D815EPFV Board

Network

AC Link

Physical

Interface

Optional

Layer

CNR

Connector

LAN

Connector

OM11886

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.3 Online Support

To find information about… Visit this World Wide Web site:

Intel’s D815EFV and D815EPFV boards under “Product Info” or “Customer Support”

Processor data sheets http://www.intel.com/design/litcentr

ICH2 addressing http://developer.intel.com/design/chipsets/datashts

Custom splash screens http://intel.com/design/motherbd/gen_indx.htm

Audio software and utilities http://www.intel.com/design/motherbd

LAN software and drivers http://www.intel.com/design/motherbd

http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop

1.4 Operating System Support

The D815EFV and D815EPFV boards support drivers for all of the onboard hardware and subsystems under the following operating systems:

†

• Windows

• Windows ME

• Windows NT

• Windows 2000

For information about Refer to

Supported drivers Section 1.3

98/98SE

†

4.0

NOTE

✏

Other drivers may be offered by other third party vendors.

Product Description

1.5 Design Specifications

Table 4 lists the specifications applicable to both the D815EFV and D815EPFV boards, except for the AIMM and GPA entries, which apply only to the D815EFV board.

Table 4. Specifications

Reference Name

AC ’97 Audio Codec ’97 Revision 2.2,

ACPI Advanced Configuration

AGP Accelerated Graphics Port

AIMM

(for Graphics Performance Accelerator cards)

AMI BIOS American Megatrends

APM Advanced Power

ATA/ ATAPI-5

ATX ATX Specification Version 2.03,

CNR

Specification Title

and Power Interface Specification

Interface Specification

AGP Inline Memory Module Revision 1.0,

BIOS Specification

Management BIOS Interface Specification

Information Technology AT Attachment with Packet Interface - 5 (ATA/ATAPI-5)

Communication and Network Riser (CNR) Specification

Version, Revision Date, and Ownership

September 2000, Intel Corporation.

Version 2.0, July 27, 2000, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Limited, and Toshiba Corporation.

Revision 2.0, May 4, 1998, Intel Corporation.

April 2000, Intel Corporation.

AMIBIOS 99, 1999, American Megatrends, Inc.

Version 1.2, February 1996, Intel Corporation and Microsoft Corporation.

Revision 3, February 29, 2000, Contact: T13 Chair, Seagate Technology.

December 1998, Intel Corporation.

Revision 1.1, October 18, 2000, Intel Corporation.

The information is

available from…

ftp://download.intel.com/ial/ scalableplatforms/ac97r22.pdf

http://www.teleport.com/~acpi/

http://www.agpforum.org/

http://developer.intel.com/ technology/memory/aimm/

298177.htm

http://www.amij.com/amibios/ bios.platforms.desktop.html

http://www.microsoft.com/ hwdev/busbios/amp_12.htm

http://www.t13.org

http://www.formfactors.org/ developer/specs/atx/ atxspecs.htm

http://developer.intel.com/ technology/cnr/index.htm

continued

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

Table 4. Specifications (continued)

Reference Name

DVI

EPP IEEE Std 1284.1-1997

El Torito Bootable CD-ROM

GPA (see AIMM)

LPC Low Pin Count Interface

MicroATX microATX Motherboard

PCI PCI Local Bus

PCI Bus Power

Plug and Play

Specification Title

Digital Visual Interface DVI

(Enhanced Parallel Port)

Format Specification

Specification

Interface Specification

Specification

Management Interface Specification

Plug and Play BIOS Specification

Version, Revision Date and Ownership

Revision 1.0, April 2, 1999, Intel Corporation, Silicon Image Incorporated, Compaq Computer Corporation, Fujitsu Limited, Hewlett-Packard Company, and NEC Corporation.

Version 1.7, 1997, Institute of Electrical and Electronic Engineers.

Version 1.0, January 25, 1995, Phoenix Technologies Limited and International Business Machines Corporation.

Version 1.0, September 29, 1997, Intel Corporation.

Version 1.0, December 1997, Intel Corporation.

Version 2.2, December 18, 1998, PCI Special Interest Group.

Version 1.1, December 18, 1998, PCI Special Interest Group.

Version 1.0a, May 5, 1994, Compaq Computer Corporation, Phoenix Technologies Limited, and Intel Corporation.

The information is available from…

http://www.ddwg.org/ downloads.html

http://standards.ieee.org/ reading/ieee/std_public/ description/busarch/

1284.1-1997_desc.html

http://www.phoenix.com/ PlatSS/products/specs.html

http://www.intel.com/ design/chipsets/industry/ lpc.htm

http://www.formfactors.org/ developer/specs/microatx/ microatxspecs.htm

http://www.pcisig.com/

http://www.microsoft.com/ hwdev/respec/ pnpspecs.htm

continued

Table 4. Specifications (continued)

Reference Name

SDRAM PC SDRAM Unbuffered

PC SDRAM Specification Revision 1.7,

PC Serial Presence

SMBIOS System Management

UHCI Universal Host Controller

USB Universal Serial Bus

WfM Wired for Management

Specification Title

DIMM Specification

Detect (SPD) Specification

BIOS

Interface Design Guide

Specification

Baseline

Version, Revision Date and Ownership

Revision 1.0, February 1998, Intel Corporation.

November 1999, Intel Corporation.

Revision 1.2B, November 1999, Intel Corporation.

Version 2.3.1, March 16, 1999, American Megatrends Incorporated, Award Software International Incorporated, Compaq Computer Corporation, Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, and SystemSoft Corporation.

Revision 1.1, March 1996, Intel Corporation.

Version 1.1, September 23, 1998, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, and NEC Corporation.

Version 2.0, December 18, 1998, Intel Corporation.

Product Description

The information is available from…

http://www.intel.com/ technology/memory

http://developer.intel.com/ ial/wfm/design/smbios

http://www.usb.org/ developers

http://developer.intel.com/ ial/WfM/wfmspecs.htm

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.6 Processor

CAUTION

Use only the processors listed below. Use of unsupported processors can damage the board, the processor, and the power supply. See the Intel Update for the most up-to-date list of supported processors for the D815EFV and D815EPFV boards.

The D815EFV and D815EPFV boards both support a single Pentium III or Celeron processor. The system bus frequency is automatically selected. The D815EFV and D815EPFV boards support the processors listed in Table 5.

Table 5. Supported Processors

Type Designation System Bus Frequency L2 Cache Size

533EB, 600EB, 667, 733,

an FC-PGA package

FC-PGA package

800B, 866, and 933 MHz

1.0 GHz

500E, 550E, 600E, 650, 700, 750, 800, and 850 MHz

800 and 850 MHz 100 MHz 128 KB Celeron processor in an

533A, 566, 600, 633, 667, 700, 733, and 766 MHz

All supported onboard memory can be cached, up to the cachability limit of the processor. See the processor’s data sheet for cachability limits.

For information about Refer to

Product information on supported processors Section 1.3, page 18

Processor data sheets Section 1.3, page 18

Desktop D815EFV/D815EPFV Specification

133 MHz 256 KB Pentium III processor in

100 MHz 256 KB

66 MHz 128 KB

Product Description

1.7 System Memory

CAUTION

Before installing or removing memory, make sure that AC power is disconnected by unplugging the power cord from the computer. Failure to do so could damage the memory and the board.

NOTE

✏

Remove the AGP video card before installing or upgrading memory to avoid interference with the memory retention mechanism.

NOTE

✏

To be fully compliant with all applicable Intel® SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency

The D815EFV and D815EPFV boards both have three DIMM sockets and support the following memory features:

• 3.3 V (only) 168-pin SDRAM DIMMs with gold-plated contacts

• Unbuffered single-sided or double-sided DIMMs

• Maximum total system memory: 512 MB; minimum total system memory: 64 MB

• 133 MHz SDRAM or 100 MHz SDRAM

• Serial Presence Detect (SPD) and non-SPD memory

• Non-ECC and ECC DIMMs (ECC DIMMs will operate in non-ECC mode only)

• Suspend to RAM

When installing memory, note the following:

• Non-SPD DIMMs will always revert to a 100 MHz with 3-3-3 timing SDRAM bus.

• Mixing Non-SPD DIMMs with SPD DIMMs will always revert to a 100 MHz with 3-3-3

timing SDRAM bus.

• The BIOS will not initialize installed memory above 512 MB.

• Mixed memory speed configurations (133 and 100 MHz) will default to 100 MHz.

• 133 MHz SDRAM operation requires a 133 MHz system bus frequency processor.

• The board should be populated with no more than four rows of 133 MHz SDRAM (two

double-sided or one double-sided plus two single-sided DIMMs).

• 100 MHz SDRAM may be populated with six rows of SDRAM (three double-sided DIMMs).

✏ NOTE

At boot, the BIOS displays a message indicating that any installed memory above 512 MB has not been initialized.

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

✏ NOTE

If more than four rows of 133 MHz SDRAM are populated, the BIOS will display a message indicating that it will initialize installed memory up to 512 MB at 100 MHz.

For information about Refer to

Obtaining the PC Serial Presence Detect (SPD) Specification Table 4, page 18

Table 6 lists the supported DIMM configurations.

Table 6. Supported Memory Configurations

DIMM Capacity

32 MB DS 16 Mbit 2 M x 8/2 M x 8 16

32 MB SS 64 Mbit 4 M x 16/empty 4

48 MB DS 64/16 Mbit 4 M x 16/2 M x 8 12

64 MB DS 64 Mbit 4 M x 16/4 M x 16 8

64 MB SS 64 Mbit 8 M x 8/empty 8

64 MB SS 128 Mbit 8 M x 16/empty 4

96 MB DS 64 Mbit 8 M x 8/4 M x 16 12

96 MB DS 128/64 Mbit 8 M x 16/4 M x 16 8

128 MB DS 64 Mbit 8 M x 8/8 M x 8 16

128 MB DS 128 Mbit 8 M x 16/8 M x 16 8

128 MB SS 128 Mbit 16 M x 8/empty 8

128 MB SS 256 Mbit 16 M x 16/empty 4

192 MB DS 128 Mbit 16 M x 8/8 M x 16 12

192 MB DS 128/64 Mbit 16 M x 8/8 M x 8 16

256 MB DS 128 Mbit 16 M x 8/16 M x 8 16

256 MB DS 256 Mbit 16 M x 16/16 M x 16 8

256 MB SS 256 Mbit 32 M x 8/empty 8

512 MB DS 256 Mbit 32 M x 8/32 M x 8 16

Notes:

1. If the number of SDRAM devices is greater than nine, the DIMM will be double sided.

2. Front side population/back side population indicated for SDRAM density and SDRAM organization.

3. In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM).

Number of Sides

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM devices

(Note 1)

(Notes 1 and 2)

(Note 1)

(Notes 1 and 2)

Product Description

1.8 Chipsets

This section describes the chipsets used by the D815EFV and D815EPFV boards:

• The D815EFV board uses the Intel 815E Chipset, described below.

• The D815EPFV board uses the Intel 815EP Chipset, described in Section 1.8.2, beginning on

page 30.

1.8.1 Intel® 815E Chipset

The Intel 815E chipset consists of the following devices:

• 82815 Graphics and Memory Controller Hub (GMCH) with Accelerated Hub Architecture (AHA) bus

• 82801BA I/O Controller Hub (ICH2) with AHA bus

• Firmware Hub (FWH) (STM M50FW040 or equivalent)

The GMCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the AHA bus. The ICH2 is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS.

The Intel 815E chipset provides the interfaces shown in Figure 5.

System Bus

SDRAM Bus

Memory Controller

Digital Video

Output

82815

Graphics and

Hub (GMCH)

Display

Interface

ATA-66/100

815E Chipset

AHA

Bus

AGP

Bus

82801BA

I/O Controller Hub

(ICH2)

Network

AC LinkPCI BusSMBus

USB

LPC Bus

Firmware Hub

(FWH)

(STM M50FW040

or equivalent)

OM11887

Figure 5. Intel 815E Chipset Block Diagram

For information about Refer to

The Intel 815E chipset http://developer.intel.com/design/chipsets/815e

The resources used by the chipset Chapter 2

The chipset’s compliance with ACPI, APM, and AC ’97 Table 4, page 19

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.8.1.1 Intel® 82815 Graphics and Memory Controller Hub (GMCH)

The GMCH provides the following:

• An integrated Synchronous DRAM memory controller with autodetection of SDRAM

• An interface for a single AGP device or a Graphics Performance Accelerator (GPA) card

• An interface for an optional digital video output (DVO) connector for a flat panel, digital CRT,

or TV-out

• Support for ACPI Rev. 2.0 and APM Rev. 1.2 compliant power management

1.8.1.2 Intel® 82801BA I/O Controller Hub (ICH2)

The ICH2 provides the following:

• 33 MHz PCI bus interface

• Support for up to four PCI master devices

• Low Pin Count (LPC) interface that supports an LPC-compatible I/O controller

• Support for two Master/DMA devices

• Integrated IDE controller that supports Ultra DMA (33 MB/sec) and ATA-66/100 mode

(66 MB/sec, 100 MB/sec)

• Integrated LAN Media Access Controller

• Universal Serial Bus interface with two USB controllers providing four ports in a

UHCI Implementation (additional USB ports provided with the optional SMSC LPC47M142 I/O controller)

• Power management logic for ACPI Rev. 1.0b compliance

• System Management Bus (SMBus clock and data lines also routed to PCI bus connector 2)

• Real-time clock with 256-byte battery-backed CMOS RAM

• AC ’97 digital link for audio codec, including:  AC ’97 2.1 compliance  Logic for PCM in, PCM out, and mic input  PCI functions for audio  Communication and Network Riser (CNR) interface

1.8.1.2.1 IDE Interfaces

The ICH2’s IDE controller has two independent bus-mastering IDE interfaces that can be independently enabled. The IDE interfaces support the following modes:

• Programmed I/O (PIO): CPU controls data transfer.

• 8237-style DMA: DMA offloads the CPU, supporting transfer rates of up to 16 MB/sec.

• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates

of up to 33 MB/sec.

• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.

• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH2 ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.

Product Description

✏ NOTE

ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling.

The IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes listed in Table 71 on page 121.

The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

The D815EFV board supports Laser Servo (LS-120) diskette technology through its IDE interfaces. The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:

• ARMD-FDD (ATAPI removable media device – floppy disk drive)

• ARMD-HDD (ATAPI removable media device – hard disk drive)

For information about Refer to

The location of the IDE connectors Figure 15, page 73

The signal names of the IDE connectors Table 43, page 77

BIOS Setup program’s Boot menu Table 79, page 130

1.8.1.2.2 USB

The ICH2 contains two separate USB controllers. The D815EFV board has four USB ports; one USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to any of the ports. The D815EFV board fully supports the Universal Hub Controller Interface (UHCI).

In the standard configuration, the D815EFV board’s four USB ports are implemented with stacked back panel connectors, routed through the ICH2, as shown in Figure 6.

With the optional SMSC LPC47M142 I/O controller, the D815EFV board supports up to seven USB ports. The SMSC LPC47M142 I/O controller provides four ports: two ports implemented with stacked back panel connectors and two ports routed to the optional front panel USB connector at location J8F1. The ICH2 provides three ports: two ports are implemented with stacked back panel connectors and the other port is accessible through a CNR add-in card, as shown in Figure 6.

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

Standard Configuration

82801BA

I/O Controller Hub

(ICH2)

82801BA

I/O Controller Hub

(ICH2)

USB

SMSC LPC47M142

LPC Bus

I/O Controller

USB ports 0 and 1

USB

USB ports 2 and 3

Optional Configuration

USB ports 0 and 2

USB

CNR connector

USB ports 1 and 3

USB

USB ports 4 and 5

Figure 6. USB Port Configurations

Back panel USB connectors

USB port accesible through a USB connector on an optional CNR add-in card

Back panel USB connectors

Front panel USB connector

OM11892

NOTE

✏

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 13, page 64

The signal names of the back panel USB connectors Table 21, page 65

The location of the optional front panel USB connector Figure 16, page 78

The signal names of the optional front panel USB connector Table 45, page 79

The USB specification and UHCI Table 4, page 19

Product Description

1.8.1.2.3 Real-Time Clock, CMOS SRAM, and Battery

The real-time clock provides a time-of-day clock and a multicentury calendar with alarm features. The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.

✏ NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS SRAM at power-on.

1.8.1.3 Firmware Hub (FWH)

The system BIOS is stored in the 4 Mbit FWH.

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.8.2 Intel® 815EP Chipset

The Intel 815EP chipset consists of the following devices:

• 82815EP Memory Controller Hub (MCH) with Accelerated Hub Architecture (AHA) bus

• 82801BA I/O Controller Hub (ICH2) with AHA bus

• Firmware Hub (FWH) (STM M50FW040 or equivalent)

The MCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the AHA bus. The ICH2 is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS.

The Intel 815EP chipset provides the interfaces shown in Figure 7.

ATA-66/100

System Bus

SDRAM Bus

Network

USB

815E Chipset

Graphics and

Memory Controller

Hub (GMCH)

Digital Video

Output

82815

Display

Interface

AGP

Bus

AHA

Bus

82801BA

I/O Controller Hub

(ICH2)

LPC Bus

AC LinkPCI BusSMBus

Firmware Hub

(FWH)

(STM M50FW040

or equivalent)

OM11887

Figure 7. Intel 815EP Chipset Block Diagram

For information about Refer to

The Intel 815EP chipset http://developer.intel.com/design/chipsets/815ep

The resources used by the chipset Chapter 2

The chipset’s compliance with ACPI, APM, and AC ’97 Table 4, page 19

Product Description

1.8.2.1 Intel® 82815EP Memory Controller Hub (MCH)

The MCH provides the following:

• An integrated Synchronous DRAM memory controller with autodetection of SDRAM

• An interface for a single AGP device

• Support for ACPI Rev. 2.0 and APM Rev. 1.2 compliant power management

1.8.2.2 Intel 82801BA I/O Controller Hub (ICH2)

The ICH2 provides the following:

• 33 MHz PCI bus interface

• Support for up to four PCI master devices

• Low Pin Count (LPC) interface that supports an LPC-compatible I/O controller

• Support for two Master/DMA devices

• Integrated IDE controller that supports Ultra DMA (33 MB/sec) and ATA-66/100 mode

(66 MB/sec, 100 MB/sec)

• Integrated LAN Media Access Controller

• Universal Serial Bus interface with two USB controllers providing four ports in a

UHCI Implementation (additional USB ports provided with the optional SMSC LPC47M142 I/O controller)

• Power management logic for ACPI Rev. 1.0b compliance

• System Management Bus (SMBus clock and data lines also routed to PCI bus connector 2)

• Real-time clock with 256-byte battery-backed CMOS RAM

1.8.2.2.1 IDE Interfaces

The ICH2’s IDE controller has two independent bus-mastering IDE interfaces that can be independently enabled. The IDE interfaces support the following modes:

• Programmed I/O (PIO): CPU controls data transfer.

• 8237-style DMA: DMA offloads the CPU, supporting transfer rates of up to 16 MB/sec.

• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates

of up to 33 MB/sec.

• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.

• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH2 ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.

✏ NOTE

ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling.

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

The IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes listed in Table 71 on page 121.

The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

The D815EPFV board supports Laser Servo (LS-120) diskette technology through its IDE interfaces. The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:

• ARMD-FDD (ATAPI removable media device – floppy disk drive)

• ARMD-HDD (ATAPI removable media device – hard disk drive)

For information about Refer to

The location of the IDE connectors Figure 15, page 73

The signal names of the IDE connectors Table 43, page 77

BIOS Setup program’s Boot menu Table 79, page 130

1.8.2.2.2 USB

The ICH2 contains two separate USB controllers. The D815EPFV board has four USB ports; one USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to any of the ports. The D815EPFV board fully supports the Universal Hub Controller Interface (UHCI).

In the standard configuration, the D815EPFV board’s four USB ports are implemented with stacked back panel connectors, routed through the ICH2, as shown in Figure 8.

With the optional SMSC LPC47M142 I/O controller, the D815EPFV board supports up to seven USB ports. The SMSC LPC47M142 I/O controller provides four ports: two ports implemented with stacked back panel connectors and two ports routed to the optional front panel USB connector at location J8F1. The ICH2 provides three ports: two ports are implemented with stacked back panel connectors and the other port is accessible through a CNR add-in card, as shown in Figure 8.

Standard Configuration

Product Description

82801BA

I/O Controller Hub

(ICH2)

82801BA

I/O Controller Hub

(ICH2)

USB

SMSC LPC47M142

LPC Bus

I/O Controller

USB ports 0 and 1

USB

USB ports 2 and 3

Optional Configuration

USB ports 0 and 2

USB

CNR connector

USB ports 1 and 3

USB

USB ports 4 and 5

Figure 8. USB Port Configurations

Back panel USB connectors

USB port accesible through a USB connector on an optional CNR add-in card

Back panel USB connectors

Front panel USB connector

OM11892

NOTE

✏

For information about Refer to

The location of the USB connectors on the back panel Figure 13, page 64

The signal names of the back panel USB connectors Table 21, page 65

The location of the optional front panel USB connector Figure 16, page 78

The signal names of the optional front panel USB connector Table 45, page 79

The USB specification and UHCI Table 4, page 19

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.8.2.2.3 Real-Time Clock, CMOS SRAM, and Battery

The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.

✏ NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS SRAM at power-on.

1.8.2.3 Firmware Hub (FWH)

The system BIOS is stored in the 4 Mbit FWH.

1.9 I/O Controller

The D815EFV and D815EPFV boards support either of two I/O controllers:

• The standard SMSC LPC47M132 I/O controller or

• The optional SMSC LPC47M142 I/O controller

Both I/O controllers provide the following features:

• Low pin count (LPC) interface

• 3.3 V operation

• Two serial ports

• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port

(EPP) support

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• PS/2-style mouse and keyboard interfaces

• Interface for one 1.2 MB, 1.44 MB, or 2.88 MB diskette drive

• Intelligent power management, including a programmable wake up event interface

• PCI power management support

• Fan control  One fan control output  Two fan tachometer inputs

The optional SMSC LPC47M142 I/O controller provides an additional USB hub.

Product Description

The BIOS Setup program provides configuration options for the I/O controller.

For information about Refer to

The USB hubs on the D815EFV board Section 1.8.1.2.2, page 27

The USB hubs on the D815EPFV board Section 1.8.2.2.2, page 32

SMSC LPC47M132 and LPC47M142 I/O controllers http://www.smsc.com/

1.9.1 Serial Ports

The D815EFV and D815EPFV boards each have two serial ports. Serial port A is located on the back panel. Serial port B is accessible using the connector at location J8H1. The serial ports’ NS16C550-compatible UARTs support data transfers at speeds up to 115.2 kbits/sec with BIOS support. The serial ports can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).

For information about Refer to

The location of the serial port A connector Figure 13, page 64

The signal names of the serial port A connector Table 24, page 66

The location of the serial port B connector Figure 16, page 78

The signal names of the serial port B connector Table 44, page 79

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.9.2 Parallel Port

The connector for the parallel port is a 25-pin D-Sub connector located on the back panel. In the BIOS Setup program, the parallel port can be set to the following modes:

†

• Output only (PC-AT

-compatible mode)

• Bi-directional (PS/2 compatible)

• EPP

• ECP

For information about Refer to

The location of the parallel port connector Figure 13, page 64

The signal names of the parallel port connector Table 23, page 66

Setting the parallel port’s mode Table 69, page 118

1.9.3 Diskette Drive Controller

The I/O controller supports one diskette drive that is compatible with the 82077 diskette drive controller and supports both PC-AT and PS/2 modes.

For information about Refer to

The location of the diskette drive connector Figure 15, page 73

The signal names of the diskette drive connector Table 42, page 77

The supported diskette drive capacities and sizes Table 72, page 123

1.9.4 Keyboard and Mouse Interface

PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these connectors are protected with a thermistor, which limits the current to a specified amperage.

NOTE

✏

The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.

The keyboard controller contains the AMI keyboard and mouse controller code, provides the keyboard and mouse control functions, and supports password protection for power-on/reset. A power-on/reset password can be specified in the BIOS Setup program.

The keyboard controller also supports the hot-key sequence <Ctrl><Alt><Del> for a software reset (operating system dependent). This key sequence resets the computer’s software by jumping to the beginning of the BIOS code and running the power-on self-test (POST).

For information about Refer to

The location of the keyboard and mouse connectors Figure 13, page 64

The signal names of the keyboard and mouse connectors Table 20, page 65

Overcurrent protection for back panel connectors Table 19, page 65

Product Description

1.10 Graphics Subsystems

This section describes the graphics subsystems used by the D815EFV and D815EPFV boards:

• The D815EFV board uses the Intel 815E graphics subsystem, described below.

• The D815EPFV board uses the Intel 815EP graphics subsystem, described in Section 1.10.2,

beginning on page 41.

1.10.1 Intel 815E Graphics Subsystem

The 815E chipset, used on the D815EFV board, contains two separate, mutually exclusive graphics options. Either the integrated graphics controller (contained within the 82815 GMCH) is used, or an add-in AGP adapter can be used.

The GMCH includes an integrated display cache SDRAM controller that supports a Graphics Performance Accelerator (GPA) card. The GPA card is a 32-bit 133 MHz 4 MB SDRAM array for enhanced integrated 2D and 3D graphics performance. This interface is multiplexed between the display cache interface and the AGP connector. When an AGP card is installed, the integrated graphics controller is disabled and the display cache interface is not used.

For information about Refer to

GPA support Section 1.10.1.3.1, page 40

1.10.1.1 Integrated Graphics Controller

The GMCH features the following:

• Integrated graphics controller  3-D Hyperpipelined architecture  Full 2-D hardware acceleration  Motion video acceleration

• 3-D graphics visual and texturing enhancement

• Display  Integrated 24-bit 230 MHz RAMDAC  Display Data Channel Standard, Version 3.0, Level 2B protocols compliant

• Video  Hardware motion compensation for software MPEG2 decode  Software DVD at 30 fps

• Integrated graphics memory controller

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

Table 7 lists the refresh frequencies supported by the graphics subsystem.

Table 7. Supported Graphics Refresh Frequencies

Resolution Color Palette

320 x 200

320 x 240

352 x 480

352 x 576

400 x 300

512 x 384

640 x 400

640 x 480

640 x 480 16 M colors 60, 70, 72, 75, 85 KDO

800 x 600

1024 x 768

256 colors 70

64 K colors 70 D3

16 M colors 70 D

256 colors 70

64 K colors 70 D3

16 M colors 70 D

256 colors 70

64 K colors 70 D3

16 M colors 70 D

256 colors 70

64 K colors 70 D3

16 M colors 70 D

256 colors 70

64 K colors 70 D3

16 M colors 70 D

256 colors 70

64 K colors 70 D3

16 M colors 70 D

256 colors 70

64 K colors 70 D3

16 M colors 70 D

256 colors 60, 70, 72, 75, 85 KDO

64 K colors 60, 75, 85 KD3O

64 K colors 70, 72 KDO

256 colors 60, 70, 72, 75, 85 KDO

64 K colors 60, 70, 72, 75, 85 KD3O

16 M colors 60, 70, 72, 75, 85 KDO

256 colors 60, 70, 75, 85 KDO

64 K colors 60, 70, 75 KD3O

64 K colors 85 KD3

16 M colors 60, 70, 75, 85 KD

Available Refresh Frequencies (Hz)

Notes

continued

Table 7. Supported Graphics Refresh Frequencies (continued)

Resolution Color Palette

1152 x 864

1280 x 768

1280 x 1024

1600 x 1200

Notes: K = Desktop

D = DirectDraw 3 = Direct3D O = Overlay F = Digital Display Device only. A mode will be supported on both analog CRTs and digital display devices (KD3O applies to both types of displays), unless indicated otherwise.

256 colors 60, 70, 72, 75 KDO

256 colors 85 KD

64 K colors 60, 70 KD3O

64 K colors 72, 75, 85 KD3

16 M colors 60 KDO

16 M colors 75, 85 KD

256 colors 60 (reduced blanking) KDOF

64 K colors 60 (reduced blanking) KD3F

16 M colors 60 (reduced blanking) KDF

256 colors 60 KDO

256 colors 70, 72, 75, 85 KD

64 K colors 60, 70, 72, 75, 85 KD3

16 M colors 60, 70, 75, 85 KD

256 colors

†

and OpenGL†

Available Refresh Frequencies (Hz)

60, 70, 72, 75 KD

Notes

Product Description

For information about Refer to

Obtaining graphics software and utilities Section 1.3, page 18

1.10.1.2 Digital Video Output (DVO) Connector (Optional)

The D815EFV board routes the Intel 82815 GMCH DVO port to an optional onboard 40-pin DVO connector. The DVO connector can be cabled to a DVI or TV out card to enable digital displays or TV out functionality. The Digital Visual Interface (DVI) specification provides a high-speed digital connection for visual data types when using the integrated graphics controller. This interface is active only when the integrated graphics controller is enabled.

The DVI interface allows interfacing with a discrete Transmission Minimized Differential Signaling (TMDS) transmitter to enable platform support for DVI compliant digital displays or with a discrete TV encoder for TV out functionality.

For information about Refer to

The location of the optional DVO connector Figure 14, page 69

The signal names of the optional DVO connector Table 32, page 71

Obtaining the DVI specification Table 4, page 19

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.10.1.3 AGP Universal Connector

NOTE

✏

Install memory in the DIMM sockets prior to installing the AGP video card to avoid interference with the memory retention mechanism.

The AGP universal connector supports either:

• Graphics Performance Accelerator (GPA) cards with 133 MHz SDRAM display cache

• 1x, 2x, or 4x AGP add-in cards with either 3.3 V or 1.5 V I/O

For information about Refer to

The location of the AGP universal connector Figure 15, page 73

The signal names of the AGP universal connector Table 41, page 76

1.10.1.3.1 Graphics Performance Accelerator (GPA) Support

The Intel 815E GMCH display cache is a single channel 32-bit wide SDRAM interface. The 4 MB display cache resides on a GPA card that plugs into the AGP connector. The BIOS detects a GPA card if present in the AGP port and initializes it as display cache memory. When a GPA card is initialized, the BIOS allocates 1 MB of system memory to support the internal display device operation.

1.10.1.3.2 Dynamic Video Memory Technology (DVMT)

DVMT enables enhanced graphics and memory performance through Direct AGP, and highly efficient memory utilization. DVMT ensures the most efficient use of all available memory for maximum 2D/3D graphic performance. DVMT is implemented on the D815EFV board with a GPA (Graphics Performance Accelerator) card installed in the AGP connector.

✏ NOTE

In earlier documentation, the GPA card was referred to as the AGP Inline Memory Module (AIMM).

DVMT uses 1 MB of system physical memory for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate the buffers needed for performing graphics functions. When the 4 MB GPA card is installed, the Z-buffer and GDI data are managed directly from this dedicated graphics memory thereby avoiding operating system memory manager calls and improving performance.

At system BIOS POST, the BIOS displays either the amount of physical memory allocated for display cache or the size of the GPA card (4 MB) if installed. Operating systems such as Windows NT 4.0 and Windows 2000 may display the maximum amount of frame buffer memory possible based on the system memory configuration.

Product Description

NOTE

✏

The use of DVMT requires operating system driver support.

For information about Refer to

Obtaining the DVMT white paper http://developer.intel.com/design/chipsets/815e/

Obtaining the AIMM specification Table 4, page 19

1.10.1.3.3 AGP Add-in Card Support

AGP is a high-performance interface for graphics-intensive applications, such as 3D applications. While based on the PCI Local Bus Specification, Rev. 2.1, AGP is independent of the PCI bus and is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of the PCI bus related to handling large amounts of graphics data with the following features:

• Pipelined memory read and write operations that hide memory access latency

• Demultiplexing of address and data on the bus for nearly 100 percent efficiency

For information about Refer to

Obtaining the Accelerated Graphics Port Interface Specification Table 4, page 19

1.10.2 Intel 815EP Graphics Subsystem

NOTE

✏

Install memory in the DIMM sockets prior to installing the AGP video card to avoid interference with the memory retention mechanism.

The Intel 815EP chipset, used on the D815EPFV board, provides an AGP universal connector which supports a 1x, 2x, or 4x AGP add-in card with either 3.3 V or 1.5 V I/O.

• Pipelined memory read and write operations that hide memory access latency

• Demultiplexing of address and data on the bus for nearly 100 percent efficiency

For information about Refer to

The location of the AGP universal connector Figure 15, page 73

The signal names of the AGP universal connector Table 41, page 76

Obtaining the Accelerated Graphics Port Interface Specification Table 4, page 19

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.11 Audio Subsystem

The D815EFV and D815EPFV boards both include an Audio Codec ’97 (AC ’97) compatible audio subsystem consisting of these devices:

• Intel 82801BA I/O Controller Hub (ICH2)

• Analog Devices AD1885 analog codec

1.11.1 AD1885 Audio Codec

The AD1885 is a fully AC ’97 compliant codec. The codec’s features include:

• > 90 dB signal-to-noise ratio sound quality

• Power management support for APM 1.2 and ACPI 1.0 (driver dependant)

• Playback sample rates up to 48 kHz

• 16 bit stereo full-duplex codec

• Software compatible with Windows 98 SE, Windows 2000, Windows NT 4.0, and

Windows Millennium (Me)

• Full-duplex operation at asynchronous hardware record/playback samples rates

• Frequency response: 20 Hz to 20 kHz (± 0.1 dB)

Figure 9 is a block diagram of the D815EFV and D815EPFV boards’ audio subsystem, including the Intel 82801BA ICH2 digital controller, the AD1885 analog codec, and the audio connectors.

82801BA

I/O Controller Hub

(ICH2)

For information about Refer to

Obtaining the AC ’97 specification Table 4, page 18

AC ’97 Link

Figure 9. Block Diagram of Audio Subsystem

1.11.2 Audio Connectors

The audio connectors include the following:

• Front panel audio (optional):  Mic in  Line out

• ATAPI-style connectors:  CD-ROM  Auxiliary line in

Analog Devices

AD1885

Analog Codec

CD-ROM

Line In

Audio In

Mic In

Front Panel Audio (optional)

Line Out

OM11888

Product Description

• Back panel audio connectors:  Line in  Line out  Mic in

For information about Refer to

The back panel audio connectors Section 2.8.1, page 64

1.11.2.1 Front Panel Audio Connector (Optional)

A 2 x 5-pin connector for routing mic in and line out to the front panel.

For information about Refer to

The location of the optional front panel audio connector Figure 14, page 69

The signal names of the optional front panel audio connector Table 30, page 70

NOTE

✏

The front panel audio connector is alternately used as a jumper block for routing audio signals. Refer to Section 2.9.1 on page 82 for more information.

1.11.2.2 ATAPI CD-ROM Connector

A 1 x 4-pin ATAPI-style connector connects an internal ATAPI CD-ROM drive to the audio mixer.

For information about Refer to

The location of the ATAPI CD-ROM connector Figure 14, page 69

The signal names of the ATAPI CD-ROM connector Table 31, page 70

1.11.2.3 Auxiliary Line In Connector

A 1 x 4-pin ATAPI-style connector connects the left and right channel signals of an internal audio device to the audio subsystem.

For information about Refer to

The location of the auxiliary line in connector Figure 14, page 69

The signal names of the auxiliary line in connector Table 29, page 70

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.12 LAN Subsystem (Optional)

The network interface controller subsystem consists of the ICH2, with integrated LAN Media Access Controller (MAC), and a physical layer interface device. Features of the LAN subsystem include:

• PCI Bus Master Interface

• CSMA/CD Protocol Engine

• Serial CSMA/CD unit interface that supports the following physical layer interface devices:  82562ET onboard LAN  82562ET/MT (10/100 Mbit/sec Ethernet) on the optional CNR  82562EH (1 Mbit/sec HomePNA

• PCI Power Management  Supports APM  Supports ACPI technology  Supports Wake up from suspend state (optional Wake on LAN technology)

For information about Refer to

Obtaining LAN software and drivers Section 1.3, page 18

†

) on the optional CNR

1.12.1 Intel® 82562ET Platform LAN Connect Device

The Intel 82562ET component provides an interface to the back panel RJ-45 connector with integrated LEDs. This physical interface may alternately be provided through the CNR connector.

The Intel 82562ET provides the following functions:

• Basic 10/100 Ethernet LAN Connectivity

• Supports RJ-45 connector with status indicator LEDs

• Full driver compatibility

• Advanced Power Management support

• Programmable transit threshold

• Configuration EEPROM that contains the MAC address

1.12.2 RJ-45 LAN Connector LEDs

Two LEDs are built into the RJ-45 LAN connector. Table 8 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 8. LAN Connector LED States

LED Color LED State Condition

Off 10 Mbit/sec data rate is selected. Green

On 100 Mbit/sec date rate is selected.

Yellow

Off LAN link is not established.

On (steady state) LAN link is established.

On (brighter and pulsing) The computer is communicating with another computer on

the LAN.

Product Description

1.13 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Hardware monitoring

• Chassis intrusion detect connector (optional)

• Fan control and monitoring (implemented on both the SMSC LPC47M132 and optional SMSC

1.13.1 Hardware Monitor Component

LPC47M142 I/O controllers)

For information about Refer to

Obtaining the WfM specification Table 4, page 18

Fan control functions of the SMSC LPC47M132 and optional SMSC LPC47M142 I/O controllers

Section 1.13.2, page 45

The hardware monitor component provides low-cost instrumentation capabilities. The features of the component include:

• Internal ambient temperature sensing

• Remote thermal diode sensing for direct monitoring of processor temperature (if supported in

the processor)

• Power supply monitoring (+12 V, +5 V, +3.3 V, +2.5 V, 3.3 VSB, and V

CCP) to detect levels

above or below acceptable values

• SMBus interface

1.13.2 Chassis Intrusion Detect Connector (Optional)

The board supports a chassis security feature that detects if the chassis cover is removed. For the chassis intrusion circuit to function, the chassis’ power supply must be connected to AC power. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion detect connector. The mechanical switch is closed for normal computer operation. Chassis intrusion detection can be supported with third party SMBus software.

For information about Refer to

The location of the optional chassis intrusion detect connector Figure 14, page 69

The signal names of the optional chassis intrusion detect connector Table 37, page 72

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.13.3 Fan Control and Monitoring

The SMSC LPC47M132 I/O controller and the optional SMSC LPC47M142 I/O controller both provide fan tachometer input for the processor fan (fan 1) and system fan (fan 2) and fan control output for the system fan (fan 2) and the chassis fan (fan 3). Monitoring and control can be implemented using third-party software.

For information about Refer to

The functions of the fan connectors Section 1.15.2.2, page 52

The location of the fan connectors Figure 14, page 69

The signal names of the fan connectors Section 2.8.2.2, page 69

1.14 CNR Connector (Optional)

The CNR connector supports the audio, modem, USB, and LAN interfaces of the Intel 815E and Intel 815EP chipsets. Figure 10 shows the signal interface between the riser and the ICH2.

✏

NOTE

Intel 82801BA

I/O Controller Hub

(ICH2)

Figure 10. ICH2 and CNR Signal Interface

AC ’97 Interfaces

LAN Interface

SMBus

USB (Optional)

Communication and

Networking Riser

(Up to two AC ’97 codecs

and one LAN device)

CNR Connector

OM11484

The USB interface from the ICH2 to the CNR is optional on this board.

The interfaces supported by the CNR connector include (but are not limited to) the following:

• AC ’97 interface: supports audio and/or modem functions on the CNR board.

• LAN interface: interface includes an eight-pin interface for use with Platform LAN Connect

(PLC) based devices.

• SMBus interface: provides Plug-and-Play functionality for the CNR board.

• USB interface (optional): provides a USB interface for the CNR board.

To learn more about the CNR, refer to the CNR specification.

For information about Refer to

Obtaining the CNR specification Table 4, page 19

1.15 Power Management

Power management is implemented at several levels, including:

• Software support:  Advanced Power Management (APM)  Advanced Configuration and Power Interface (ACPI)

• Hardware support:  Power connector  Fan connectors  Wake on LAN technology  Instantly Available technology  Resume on Ring  Wake from USB  Wake on Keyboard  Wake on PME#  Wake on RTC (real-time clock) alarm

Product Description

1.15.1 Software Support

The software support for power management includes:

• APM

• ACPI

If the D815EFV or D815EPFV board is used with an ACPI-aware operating system, the BIOS can provide ACPI support. Otherwise, it defaults to APM support.

1.15.1.1 APM

APM makes it possible for the computer to enter an energy-saving standby mode. The standby mode can be initiated in the following ways:

• Time-out period specified in the BIOS Setup program

• From the operating system, such as the standby menu item in Windows 98

In standby mode, the D815EFV and D815EPFV boards can reduce power consumption by

†

spinning down hard drives, and reducing power to, or turning off of, VESA monitors. Power management mode can be enabled or disabled in the BIOS Setup program.

While in standby mode, the system retains the ability to respond to external interrupts and service requests, such as incoming faxes or network messages. Any keyboard or mouse activity brings the system out of standby mode and immediately restores power to the monitor.

DPMS-compliant

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

The BIOS enables APM by default; but the operating system must support an APM driver for the power management features to work. For example, Windows 98 supports the power management features upon detecting that APM is enabled in the BIOS.

For information about Refer to

Enabling or disabling power management in the BIOS Setup program Section 4.6, page 127

The D815EFV and D815EPFV boards’ compliance level with APM Table 4, page 19

1.15.1.2 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the D815EFV or D815EPFV board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration) and APM support normally contained in the BIOS.

• Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives.

• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state.

• A soft-off feature that enables the operating system to power-off the computer.

• Support for multiple wake up events (see Table 11 on page 50).

• Support for a front panel power and sleep mode switch. Table 9 lists the system states based

on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 9. Effects of Pressing the Power Switch

If the system is in this state…

Off (ACPI G2/G5 – soft-off)

On (ACPI G0 – working state)

Sleep (ACPI G1 – sleeping state)

…and the power switch is pressed for

Less than seven seconds Power-on

Less than seven seconds Soft-off/Standby

More than seven seconds Fail safe power-off

Less than seven seconds Wake up

More than seven seconds Power-off

…the system enters this state

(ACPI G0 – working state)

(ACPI G1 – sleeping state)

(ACPI G2/G5 – soft-off)

(ACPI G0 – working state)

(ACPI G2/G5 – soft-off)

For information about Refer to

The D815EFV and D815EPFV boards’ compliance level with ACPI Table 4, page 19

Product Description

1.15.1.2.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 10 lists the power states supported by the D815EFV and D815EPFV boards along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 10. Power States and Targeted System Power

Global States Sleeping States

G0 – working state

G1 – sleeping state

G2/S5 S5 – soft-off.

G3 – mechanical off

AC power is disconnected from the computer.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

S0 – working C0 – working D0 – working

S1 – CPU stopped C1 – stop

S3 – suspend to RAM. Context saved to RAM.

Context not saved. Cold boot is required.

No power to the system.

CPU States Device States

state

D1, D2, D3 –

grant

No power D3 – no power

No power D3 – no power for

device specification specific.

except for wake up logic.

wake up logic, except when provided by battery or external source.

Targeted System Power

(Note 1)

Full power > 30 W

5 W < power < 30 W

Power < 5 W

No power to the system so that service can be performed.

(Note 2)

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.15.1.2.2 Wake Up Devices and Events

Table 11 lists the devices or specific events that can wake the computer from specific states.

Table 11. Wake Up Devices and Events

These devices/events can wake up the computer… …from this state

Power switch S1, S3, S5

RTC alarm S1, S3, S5

Wake on LAN technology connector (optional) S1, S3, S5

PME# S1, S3, S5

Modem (back panel serial port A) S1, S3

USB S1, S3

PS/2 keyboard S1, S3

Notes:

1. S5 events are supported only on PCI bus connector 2.

2. For the Wake on LAN technology connector and PME#, S5 is disabled by default in the BIOS Setup program. Setting these options to Power On will enable a wake-up event from LAN in the S5 state.

3. Wake from CNR modem is not supported on the D815EFV and D815EPFV boards.

(Note 1)

(Notes 1 and 2)

(Note 3)

NOTE

✏

The use of these wake up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

NOTE

✏

Wake up from PS/2 mouse is peripheral, operating system, and driver dependent; it is not a boardlevel feature.

1.15.1.2.3 Plug and Play

In addition to power management, ACPI provides controls and information so that the operating system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to enumerate and configure D815EFV and D815EPFV board devices that do not have other hardware standards for enumeration and configuration. PCI devices on the D815EFV and D815EPFV boards, for example, are not enumerated by ACPI.

Product Description

1.15.2 Hardware Support

CAUTION

If the Wake on LAN and Instantly Available technology features are used, ensure that the power supply provides adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Refer to Section 2.11.3 on page 93 for additional information.

The boards provides several hardware features that support power management, including:

• Power connector

• Fan connectors

• Wake on LAN technology connector (optional)

• Instantly Available technology

• Resume on Ring

• Wake from USB

• Wake from PS/2 keyboard

• PME# wakeup support

Wake on LAN technology and Instantly Available technology require power from the +5 V standby line. The sections discussing these features describe the incremental standby power requirements for each.

Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal) and the power management mode being used (APM or ACPI).

NOTE

✏

The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support.

1.15.2.1 Power Connector

When used with an ATX-compliant power supply that supports remote power on/off, the D815EFV and D815EPFV boards can turn off the system power through software control. To enable soft-off control in software, advanced power management must be enabled in the BIOS Setup program and in the operating system. When the system BIOS receives the correct APM command from the operating system, the BIOS turns off power to the computer.

With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected power cord, when power resumes, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the After Power Failure feature in the BIOS Setup program’s Power menu.

For information about Refer to

The location of the power connector Figure 14, page 69

The signal names of the power connector Table 34, page 71

The BIOS Setup program’s Power menu Section 4.6, page 127

The ATX specification Table 4, page 19

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

1.15.2.2 Fan Connectors

The D815EFV and D815EPFV boards both have two standard fan connectors and one optional fan connector. The functions of these connectors are described in Table 12.

Table 12. Fan Connector Descriptions

Connector

Processor fan Fan 1 J1B1 Provides +12 V DC for a processor fan or active fan

System fan Fan 2 J9H1 Provides +12 V DC for a system or chassis fan. The

Chassis fan (optional)

For information about Refer to

The location of the fan connectors Figure 14, page 69

The signal names of the fan connectors Section 2.8.2.2, page 69

Silkscreen Label

Fan 3 J4G1 Provides +12 V DC for a system or chassis. The fan

Reference Designator

Function

heatsink. A tachometer feedback connection is also provided.

fan voltage can be switched on or off, depending on the power management state of the computer. A tachometer feedback connection is also provided.

voltage can be switched on or off, depending on the power management state of the computer.

1.15.2.3 Wake on LAN Technology

CAUTION

For Wake on LAN technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Wake on LAN technology can damage the power supply. Refer to Section 2.11.3 on page 93 for additional information.

NOTE

✏

The optional Wake on LAN technology connector is present only on boards that do not have the Intel 82562ET PLC device, which is part of the optional onboard LAN subsystem.

Wake on LAN technology enables remote wakeup of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface.

†

Upon detecting a Magic Packet the computer. Depending on the LAN implementation, the D815EFV and D815EPFV boards support Wake on LAN technology in the following ways:

• Through the optional Wake on LAN technology connector (APM only)

• Through the PCI bus PME# signal for PCI 2.2 compliant LAN designs (ACPI only)

• Through the onboard LAN subsystem when enabled in Setup (ACPI only)

frame, the LAN subsystem asserts a wakeup signal that powers up

Product Description

The Wake on LAN technology connector can be used with PCI bus network adapters that have a remote wake up connector, as shown in Figure 11. Network adapters that are PCI 2.2 compliant assert the wakeup signal through the PCI bus signal PME# (pin A19 on the PCI bus connectors).

Network Interface Card

PCI Slot

Figure 11. Using the Wake on LAN Technology Connector

For information about Refer to

The location of the optional Wake on LAN technology connector Figure 14, page 69

The signal names of the optional Wake on LAN technology connector Table 38, page 72

Remote

Wake up

connector

Desktop Board

Wake on

LAN

technology

connector

OM09129

1.15.2.4 Instantly Available Technology

CAUTION

For Instantly Available technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available technology can damage the power supply. Refer to Section 2.11.3 on page 93 for additional information.

Instantly Available technology enables the D815EFV and D815EPFV boards to enter the ACPI S3 (suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, the fans are off, and the front panel LED is amber if dual-color, or off if single-color.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state.

The D815EFV and D815EPFV boards support the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer.

The use of Instantly Available technology requires operating system support and PCI 2.2 compliant add-in cards and drivers.

The standby power indicator LED (at location CR6E1) shows that power is still present at the DIMM and PCI bus connectors, even when the computer appears to be off. Figure 12 shows the location of the standby power indicator LED on the D815EFV and D815EPFV boards.

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

CR6E1

Present only on D815EFV boards

Figure 12. Location of Standby Power Indicator LED

OM11470

For information about Refer to

The devices and events that can wake the computer from the S3 state Table 11, page 50

The PCI Bus Power Management Interface Specification Table 4, page 19

1.15.2.5 Resume on Ring

The operation of Resume on Ring can be summarized as follows:

• Resumes operation from either the APM sleep mode or the ACPI S1 state

• Requires only one call to access the computer

• Detects incoming call similarly for external and internal modems

• Requires modem interrupt be unmasked for correct operation

Product Description

1.15.2.6 Wake from USB

USB bus activity wakes the computer from an ACPI S1 or S3 state.

NOTE

✏

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.15.2.7 Wake from PS/2 Keyboard

PS/2 keyboard activity wakes the computer from an ACPI S1 or S3 state.

1.15.2.8 PME# Wakeup Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, or S5 state.

1.15.2.9 Wake from RTC Alarm

An RTC alarm wakes the computer from an ACPI S1, S3, or S5 state.

Intel Desktop Board D815EFV/D815EPFV Technical Product Specification

2 Technical Reference

What This Chapter Contains

2.1 Introduction.................................................................................................................57

2.2 Memory Map ..............................................................................................................57

2.3 I/O Map .....................................................................................................................58