Intel® Desktop Board D815EEA
Technical Product Specification
May 2000
Order Number A16964 –001
The Intel® Desktop Board D815EEA may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D815E E A Sp ecif icat ion Updat e.
Revision History
Revision Revision History Date
-P1 First review draft of the Intel Desktop Board D815EEA Technical Product
Specification
-P2 Second review draft of the Intel Desktop Board D815EEA Technical
Product Specification
-P3 Third review draft of the Intel Desktop Board D815EEA Technical Product
Specification
-001 First release of the Intel Desktop Board D815EEA Technical Product
Specification
This product specification applies to only standard D815EEA boards with BIOS identifier
EA81510A.86A.
Changes to this specification will be published in the Intel Desktop Board D815EEA Specification
Update before being incorporated into a revision of this document.
March 2000
April 2000
June 2000
June 2000
Information in this doc um ent is provided in connection wi t h Intel® products. No license, express or implied, by est oppel or
otherwise, to any intell ectual property rights is granted by this document. E x cept as provided in Intel’s Terms and
Conditions of Sale for such products, Intel assumes no liability whatsoever, and I nt el dis claims any express or implied
warranty, relating to sale and/or use of I ntel products including liability or warranties relat i ng t o f i t ness for a particular
purpose, merchantability, or infringement of any patent, copyright or other int ellec t ual propert y right. Intel products are not
intended for use in medical, l i f e saving, or life sustai ni ng appl i cations.
Intel may make changes t o specifications and produc t descriptions at any tim e, without notice.
®
The Intel
deviate from published spec i fications. Current charac terized errata are available on request.
Contact your local Int el sales office or your distributor to obtain the latest specifications before pl acing your product order.
Copies of documents whic h hav e an orderi ng number and are referenced in this document, or other Intel literature, may be
obtained from:
†
Copyright 2000, Intel Corporation. All rights reserved.
Desktop Board D815EEA may contain design defect s or errors known as errata that may cause the produc t to
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Third-party brands and names are the property of their respective owners.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the Intel Desktop Board D815EEA. It
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the D815EEA board and its
components to the vendors, system integrators, and other engineers and technicians who need this
level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the D815EEA board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, POST codes, and diagnostic
LEDs
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
✏
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel® Desktop Board D815EEA Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the D815EEA board, and X is the instance of the particular part
at that general location. For example, J5J1 is a connector, located at 5J. It is the first
connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
†
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview ................................................................................................................... 12
1.1.1 Feature Summary ....................................................................................... 12
1.1.2 Manufacturing Options................................................................................ 13
1.1.3 D815EEA Board Layout .............................................................................. 14
1.1.4 Block Diagram............................................................................................. 15
1.2 Online Support........................................................................................................... 16
1.3 Design Specifications ................................................................................................ 16
1.4 Processor..................................................................................................................19
1.5 System Memory......................................................................................................... 20
®
1.6 Intel
1.7 I/O Controller............................................................................................................. 26
1.8 Graphics Subsystem ................................................................................................. 28
1.9 Audio Subsystem (Optional)...................................................................................... 32
1.10 LAN Subsystem......................................................................................................... 35
1.11 CNR (Optional).......................................................................................................... 36
1.12 Hardware Management Subsystem (Optional).......................................................... 37
1.13 Power Management .................................................................................................. 39
815E Chipset................................................................................................... 22
®
1.6.1 Intel
1.6.2 Intel
1.6.3 Intel
82815E Graphics and Memory Controller Hub (GMCH)....................23
®
82801BA I/O Controller Hub (ICH2)................................................... 23
®
82802AB 4 Mbit Firmware Hub (FWH) .............................................. 25
1.7.1 Serial Ports.................................................................................................. 26
1.7.2 Infrared Support.......................................................................................... 26
1.7.3 Parallel Port................................................................................................. 27
1.7.4 Diskette Drive Controller.............................................................................. 27
1.7.5 Keyboard and Mouse Interface ................................................................... 27
1.8.1 Integrated Graphics Controller.................................................................... 28
1.8.2 Digital Video Output (DVO) Connector........................................................ 30
1.8.3 AGP Universal Connector ........................................................................... 31
1.9.1 Basic Audio Subsystem............................................................................... 32
1.9.2 Enhanced PCI Audio Subsystem................................................................. 33
1.9.3 Audio Connectors........................................................................................ 34
®
1.10.1 Intel
82562ET Platform LAN Connect Device (Optional) ........................... 36
1.10.2 RJ-45 LAN Connector LEDs........................................................................ 36
1.10.3 LAN Subsystem Software............................................................................ 36
1.12.1 Hardware Monitor Component.................................................................... 38
1.12.2 Chassis Intrusion Detect Connector............................................................ 38
1.12.3 Fan Control and Monitoring......................................................................... 38
1.13.1 Software Support ........................................................................................ 39
1.13.2 Hardware Support....................................................................................... 42
v
Intel® Desktop Board D815EEA Technical Product Specification
2 Technical Reference
2.1 Introduction................................................................................................................47
2.2 Memory Map ............................................................................................................. 47
2.3 I/O Map ..................................................................................................................... 48
2.4 DMA Channels .......................................................................................................... 50
2.5 PCI Configuration Space Map ................................................................................... 50
2.6 Interrupts...................................................................................................................51
2.7 PCI Interrupt Routing Map......................................................................................... 51
2.8 Connectors................................................................................................................ 53
2.8.1 Back Panel Connectors............................................................................... 54
2.8.2 Internal I/O Connectors............................................................................... 58
2.8.3 External I/O Connectors.............................................................................. 69
2.9 Jumper Block............................................................................................................. 73
2.10 Mechanical Considerations........................................................................................ 75
2.10.1 Form Factor................................................................................................. 75
2.10.2 I/O Shield.................................................................................................... 76
2.11 Electrical Considerations........................................................................................... 77
2.11.1 Power Consumption.................................................................................... 77
2.11.2 Add-in Board Considerations....................................................................... 78
2.11.3 Standby Current Requirements................................................................... 78
2.11.4 Fan Connector Current Capability............................................................... 79
2.11.5 Power Supply Considerations...................................................................... 80
2.12 Thermal Considerations............................................................................................. 80
2.13 Reliability................................................................................................................... 82
2.14 Environmental............................................................................................................ 83
2.15 Regulatory Compliance............................................................................................. 84
2.15.1 Safety Regulations...................................................................................... 84
2.15.2 EMC Regulations ........................................................................................ 84
2.15.3 Certification Markings.................................................................................. 85
3 Overview of BIOS Features
3.1 Introduction................................................................................................................87
3.2 BIOS Flash Memory Organization............................................................................. 88
3.3 Resource Configuration............................................................................................. 88
3.3.1 PCI Autoconfiguration................................................................................. 88
3.3.2 PCI IDE Support.......................................................................................... 88
3.4 System Management BIOS (SMBIOS)...................................................................... 89
3.5 USB Legacy Support................................................................................................. 90
3.6 BIOS Updates............................................................................................................ 90
3.6.1 Language Support....................................................................................... 91
3.6.2 Custom Splash Screen................................................................................ 91
3.7 Recovering BIOS Data.............................................................................................. 91
3.8 Boot Options.............................................................................................................. 92
3.8.1 CD-ROM and Network Boot........................................................................ 92
3.8.2 Booting Without Attached Devices.............................................................. 92
vi
3.9 Fast Booting Systems with I nt el® Rapid BIOS Boot................................................... 92
3.9.1 Peripheral Selection and Configuration ....................................................... 93
3.9.2 Intel Rapid BIOS Boot................................................................................. 93
3.9.3 Operating System ....................................................................................... 94
3.10 BIOS Security Features............................................................................................. 94
4 BIOS Setup Program
4.1 Introduction................................................................................................................97
4.2 Maintenance Menu.................................................................................................... 98
4.2.1 Extended Configuration Submenu............................................................... 99
4.3 Main Menu............................................................................................................... 100
4.4 Advanced Menu....................................................................................................... 101
4.4.1 PCI Configuration Submenu...................................................................... 102
4.4.2 Boot Configuration Submenu .................................................................... 103
4.4.3 Peripheral Configuration Submenu............................................................ 104
4.4.4 IDE Configuration Submenu...................................................................... 106
4.4.5 Diskette Configuration Submenu............................................................... 109
4.4.6 Event Log Configuration Submenu............................................................ 110
4.4.7 Video Configuration Submenu................................................................... 111
4.5 Security Menu..........................................................................................................112
4.6 Power Menu............................................................................................................ 113
4.7 Boot Menu............................................................................................................... 114
4.7.1 IDE Drive Configuration Submenu............................................................. 115
4.8 Exit Menu................................................................................................................ 116
Contents
5 Error Messages and Beep Codes
5.1 BIOS Error Messages.............................................................................................. 116
5.2 Port 80h POST Codes............................................................................................. 119
5.3 Bus Initialization Checkpoints.................................................................................. 123
5.4 Speaker................................................................................................................... 124
5.5 BIOS Beep Codes................................................................................................... 124
5.6 Diagnostic LEDs...................................................................................................... 125
Figures
1. D815EEA Board Components................................................................................... 14
2. Block Diagram........................................................................................................... 15
3. Intel 815E Chipset Block Diagram............................................................................. 22
4. Block Diagram of Basic Audio Subsystem................................................................. 33
5. Block Diagram of Enhanced PCI Audio Subsystem................................................... 33
6. ICH2 and CNR Signal Interface................................................................................. 37
7. Using the Wake on LAN Technology Connector........................................................ 44
8. Location of Standby Power Indicator LED................................................................. 45
9. Back Panel Connectors............................................................................................. 54
10. Audio, Video, Hardware Control, and Fan Connectors .............................................. 59
11. Add-in Board and Peripheral Interface Connectors.................................................... 63
12. External I/O Connectors............................................................................................ 69
13. Location of the Jumper Block.................................................................................... 73
vii
Intel® Desktop Board D815EEA Technical Product Specification
14. D815EEA Board Dimensions..................................................................................... 75
15. I/O Shield Dimensions............................................................................................... 76
16. Localized High Temperature Zones........................................................................... 81
17. Diagnostic LEDs...................................................................................................... 125
Tables
1. Feature Summary...................................................................................................... 12
2. Manufacturing Options............................................................................................... 13
3. Specifications............................................................................................................ 16
4. Supported Processors............................................................................................... 19
5. Supported Memory Configurations............................................................................ 21
6. Supported Graphics Refresh Frequencies................................................................. 29
7. LAN Connector LED States....................................................................................... 36
8. Effects of Pressing the Power Switch........................................................................ 40
9. Power States and Targeted System Power............................................................... 41
10. Wake Up Devices and Events................................................................................... 42
11. Fan Connector Descriptions...................................................................................... 43
12. System Memory Map................................................................................................. 47
13. I/O Map ..................................................................................................................... 48
14. DMA Channels .......................................................................................................... 50
15. PCI Configuration Space Map ................................................................................... 50
16. Interrupts...................................................................................................................51
17. PCI Interrupt Routing Map......................................................................................... 52
18. PS/2 Mouse/Keyboard Connectors............................................................................ 55
19. LAN Connector.......................................................................................................... 55
20. USB Connectors ........................................................................................................ 55
21. VGA Port Connector.................................................................................................. 56
22. Parallel Port Connector.............................................................................................. 56
23. Serial Port A Connector............................................................................................. 56
24. MIDI/Game Port Connector....................................................................................... 57
25. Audio Line Out Connector ......................................................................................... 57
26. Audio Line In Connector............................................................................................ 57
27. Mic In Connector ....................................................................................................... 57
28. Chassis Fan Connector (J3F1).................................................................................. 60
29. CD-ROM Legacy Style Connector (J2F2) .................................................................. 60
30. ATAPI CD-ROM Connector (J2F1)............................................................................ 60
31. Auxiliary Line In Connector (J2G1)............................................................................ 60
32. Telephony Connector (J2G2)..................................................................................... 60
33. Digital Video Out Connector (J3H1)........................................................................... 61
34. Processor Fan Connector (J3M1).............................................................................. 61
35. Power Connector (J8K1) ........................................................................................... 61
36. Wake on LAN Technology Connector (J6B1) ............................................................ 62
37. Chassis Intrusion Connector (J7B1).......................................................................... 62
38. Chassis Fan Connector (J8B1) .................................................................................. 62
39. CNR Connector (J3A1).............................................................................................. 64
40. PCI Bus Connectors (J4A1, J4B1, J4C1, J4D1, J4E1).............................................. 65
viii
Contents
41. AGP Universal Connector (J5E1).............................................................................. 66
42. Diskette Drive Connector (J8G3)............................................................................... 67
43. PCI IDE Connectors (J8G2, Primary and J6G1, Secondary)..................................... 68
44. Front Panel USB Connector (J8C1)........................................................................... 70
45. Serial Port B Connector (J8E1).................................................................................. 70
46. SCSI LED Connector (J7A1)..................................................................................... 70
47. Auxiliary Front Panel Power LED Connector (J8C2).................................................. 70
48. Front Panel Connector (J8C3)................................................................................... 71
49. States for a Single-Colored Power LED..................................................................... 72
50. States for a Dual-Colored Power LED....................................................................... 72
51. BIOS Setup Configuration Jumper Settings (J7B1) ................................................... 74
52. Power Usage For Board with Basic Audio and Onboard LAN.................................... 77
53. Power Usage For Board with Enhanced PCI Audio Subsystem and
no Onboard LAN subsystem...................................................................................... 78
54. Standby Current Requirements................................................................................. 79
55. Thermal Considerations for Components .................................................................. 82
56. D815EEA Board Environmental Specifications.......................................................... 83
57. Safety Regulations .................................................................................................... 84
58. EMC Regulations....................................................................................................... 84
59. Supervisor and User Password Functions................................................................. 95
60. BIOS Setup Program Menu Bar................................................................................. 97
61. BIOS Setup Program Function Keys ......................................................................... 98
62. Maintenance Menu.................................................................................................... 98
63. Extended Configuration Submenu............................................................................. 99
64. Main Menu............................................................................................................... 100
65. Advanced Menu....................................................................................................... 101
66. PCI Configuration Submenu.................................................................................... 102
67. Boot Configuration Submenu................................................................................... 103
68. Peripheral Configuration Submenu.......................................................................... 104
69. IDE Configuration Submenu.................................................................................... 106
70. Primary/Secondary IDE Master/Slave Submenus.................................................... 107
71. Diskette Configuration Submenu............................................................................. 109
72. Event Log Configuration Submenu.......................................................................... 110
73. Video Configuration Submenu................................................................................. 111
74. Security Menu.......................................................................................................... 112
75. Power Menu............................................................................................................ 113
76. Boot Menu............................................................................................................... 114
77. IDE Drive Configuration Submenu ........................................................................... 115
78. Exit Menu................................................................................................................ 116
79. BIOS Error Messages.............................................................................................. 116
80. Uncompressed INIT Code Checkpoints................................................................... 119
81. Boot Block Recovery Code Checkpoints ................................................................. 119
82. Runtime Code Uncompressed in F000 Shadow RAM ............................................. 120
83. Bus Initialization Checkpoints.................................................................................. 123
84. Upper Nibble High Byte Functions........................................................................... 123
85. Lower Nibble High Byte Functions........................................................................... 124
86. Beep Codes............................................................................................................. 125
87. Diagnostic LED Codes............................................................................................. 126
ix
Intel® Desktop Board D815EEA Technical Product Specification
x
1 Product Description
What This Chapter Contains
1.1 Overview ................................................................................................................... 12
1.2 Online Support........................................................................................................... 16
1.3 Design Specifications ................................................................................................ 16
1.4 Processor.................................................................................................................. 19
1.5 System Memory......................................................................................................... 20
®
1.6 Intel
1.7 I/O Controller............................................................................................................. 26
1.8 Graphics Subsystem ................................................................................................. 28
1.9 Audio Subsystem (Optional)...................................................................................... 32
1.10 LAN Subsystem......................................................................................................... 35
1.11 CNR (Optional).......................................................................................................... 36
1.12 Hardware Management Subsystem (Optional).......................................................... 37
1.13 Power Management .................................................................................................. 39
815E Chipset................................................................................................... 22
11
Intel® Desktop Board D815EEA Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the D815EEA board’s major features.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
I/O Control
Video
Peripheral
Interfaces
Expansion
Capabilities
BIOS
Diagnostic LEDs
Instantly Available
PC
Wake on LAN
Technology
Connector
†
ATX (12.0 inches by 8.2 inches)
Support for either an Intel
(FC-PGA) package or an Intel® Celeron™ processor in an FCPGA package or a
PPGA package
• Three 168-pin SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for up to 512 MB system memory
• Single- or double-sided DIMMs supported
Intel® 815E Chipset, consisting of:
®
• Intel
• Intel
• Intel
SMSC LPC47M102 LPC bus I/O controller
• Intel
• AGP universal connector supporting 1X, 2X, and 4X AGP cards or a Graphics
• Digital video output (DVO) connector
• Four Universal Serial Bus (USB) ports
• Two serial ports
• One parallel port
• Two IDE interfaces with Ultra DMA, ATA-66/100 support
• One diskette drive interface
• MIDI/game port
• PS/2
• Five PCI bus add-in card connectors (SMBus routed to PCI bus connector 2)
• One AGP universal connector
• Intel/AMI BIOS (resident in the Intel 82802AB 4 Mbit FWH)
• Support for Advanced Power Management (APM), Advanced Configuration and
Four dual-color LEDs on back panel
• Support for
• Suspend to RAM support
• Wake on PS/2 keyboard and USB ports
Support for system wake up using an add-in network interface card with remote
wake up capability
82815E Graphics and Memory Controller Hub (GMCH)
®
82801BA I/O Controller Hub (ICH2)
®
82802AB 4 Mbit Firmware Hub (FWH)
®
82815E integrated graphics support
Performance Accelerator (GPA)
†
keyboard and mouse ports
Power Interface (ACPI), Plug and Play, and SMBIOS
PCI Local Bus Specification Revision 2.2
®
Pentium® III processor in a Flip Chip Pin Grid Array
12
For information about Refer to
The board’s compliance level with APM, ACPI, Plug and Play, and SMBIOS. Section 1.3, page 16
1.1.2 Manufacturing Options
Table 2 describes the D815EEA board’s manufacturing options.
Table 2. Manufacturing Options
Audio
LAN
Hardware Monitor
Subsystem
Communication
and Networking
Riser (CNR)
Two separate Audio Codec ’97 (AC ’97) compatible audio subsystem options:
• A basic audio subsystem that includes the ICH2 component and an
Analog Devices AD1885 analog codec, or
• An enhanced audio subsystem that includes a Creative Labs ES1373 AC ’97
digital controller and a Crystal Semiconductor CS4297 stereo audio codec.
®
Intel
82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device
• Voltage sense to detect out of range values
• Chassis intrusion detect connector
• Two fan sense inputs used to monitor fan activity
One CNR connector (slot shared with PCI bus connector 5)
Product Description
13
Intel® Desktop Board D815EEA Technical Product Specification
1.1.3 D815EEA Board Layout
Figure 1 shows the location of the major components on the D815EEA board.
EA B C D
U
F
G
T
S
R
KPQ O N J IML
A Creative Labs ES1373 Digital Controller
(optional)
B AD1885 audio codec (optional) M Intel 82801BA I/O Controller Hub (ICH2)
C AGP universal connector N SMSC LPC47M102 I/O Controller
D DVO connector O Front panel connectors
E Back panel connectors P Intel 82802AB 4 Mbit Firmware Hub (FWH)
F Intel 82815E Graphics and Memory Controller
Hub (GMCH)
G Processor socket S Speaker
H DIMM sockets T PCI bus add-in card connectors
IJPower connector
Diskette drive connector
KLIDE connectors
Serial port B connector
QRBattery
Front panel USB connector
U Communication and Networking Riser (CNR)
connector (optional)
H
OM10041
14
Figure 1. D815EEA Board Components
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the D815EEA board.
Primary/
Secondary IDE
ATA-33/66/100
Product Description
Diagnostic
LEDs
Processor Socket
SDRAM Bus
DIMM
Banks
(3)
DVO
Connector
AGP
Universal
Connector
System Bus
82815E
Graphics and
Memory Controller
Hub (GMCH)
Digital video
output
AGP / Display Cache
Interface
Hardware
Monitor
(Optional)
815E Chipset
AHA
Bus
SMBus
82801BA
I/O Controller Hub
(ICH2)
USB
LPC
Bus
LPC I/O
Controller
Optional
USB Ports 0 and 1
USB Ports 2 and 3
82802AB
Firmware Hub
(FWH)
Diskette Drive
Connector
Serial Port A
Serial Port B
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Analog
Codec
PCI Slot 1
PCI Slot 2
PCI Slot 3
PCI Slot 4
PCI Slot 5
PCI Bus
Optional
CSMA/CD
Interface
Audio Digital
Controller
AC Link
Figure 2. Block Diagram
Unit
AC Link
Physical
Interface
AC ’97
Audio
Codec
Layer
CNR
Connector
LAN
Connector
CD-ROM
Line In
Line Out
Mic In
Auxiliary Line In
Telephony
OM10090
15
Intel® Desktop Board D815EEA Technical Product Specification
1.2 Online Support
Find information about the Intel® D815EEA board under “Product Info” or “Customer Support” at
these World Wide Web sites:
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
Find “Processor Data Sheets” or information about “Proper Date Access in Systems with Intel
Motherboards” at these World Wide Web sites:
http://www.intel.com/design/litcentr
http://support.intel.com/support/year2000
Find information about the ICH addressing at this World Wide Web site:
http://developer.intel.com/design/chipsets/datashts/
1.3 Design Specifications
Table 3 lists the specifications applicable to the D815EEA board.
Table 3. Specifications
Reference
Name
AC ‘97
ACPI
AGP
AIMM
(for Graphics
Performance
Accelerator
cards)
AMI BIOS
APM
Specification
Title
Audio Codec ‘97
Advanced Configuration
and Power Interface
Specification
Accelerated Graphics Port
Interface Specification
AGP Inline Memory Module
American Megatrends
BIOS Specification
Advanced Power
Management BIOS
Interface Specification
Version, Revision Date,
and Ownership
Version 2.1,
May 1998,
Intel Corporation.
Version 1.0b,
February 1, 1999,
Intel Corporation,
Microsoft Corporation,
and Toshiba Corporation.
Version 2.0,
May 4, 1998,
Intel Corporation.
Version 0.9,
March 2000,
Intel Corporation
AMIBIOS 99,
1999
American Megatrends, Inc.
Version 1.2,
February 1996,
Intel Corporation,
Microsoft Corporation.
The information is
available from…
ftp://download.intel.com/
pc-supp/platform/ac97
http://www.teleport.com/~acpi/
the Accelerated Graphics
Implementers Forum at:
http://www.agpforum.org/
http://developer.intel.com/
technology/memory/aimm/
index.htm
Intel document order number
298177-003
http://www.amibios.com, or
http://www.ami.com/download/
amibios99.pdf
http://www.microsoft.com/
hwdev/busbios/amp_12.htm
®
continued
16
Table 3. Specifications (continued)
Specification
Description
ATA-3
ATAPI
ATX
CNR
EPP
El Torito
GPA (see
AIMM)
†
IrDA
LPC
PCI
Plug and
Play
Title
Information Technology AT Attachment-3
Interface,
X3T10/2008D
Information Technology
AT Attachment with
Packet Interface
Extensions
T13/1153D
ATX Specification
Communication and
Network Riser (CNR)
Specification
Enhanced Parallel Port
IEEE std 1284.1-1997
Bootable CD-ROM
format specification
Serial Infrared Physical
Layer Link specification
Low Pin Count Interface
Specification
PCI Local Bus
Specification
PCI Bus Power
Management Interface
Specification
Plug and Play BIOS
specification
Version, Revision Date and
Ownership
Version 6,
October 1995,
ASC X3T10 Technical
Committee.
Version 18,
August 19, 1998,
Contact: T13 Chair,
Seagate Technology.
Version 2.01,
February 1997,
Intel Corporation.
Version 1.0,
February 7, 2000,
Intel Corporation
Version 1.7,
1997,
Institute of Electrical and
Electronic Engineers.
Version 1.0,
January 25, 1995,
Phoenix Technologies Ltd., and
IBM Corporation.
Version 1.1,
October 17, 1995,
Infrared Data Association.
Version 1.0,
September 29, 1997,
Intel Corporation.
Version 2.2,
December 18, 1998,
PCI Special Interest Group.
Version 1.1,
December 18, 1998,
PCI Special Interest Group.
Version 1.0a,
May 5, 1994,
Compaq Computer Corp.,
Phoenix Technologies Ltd.,
and Intel Corporation.
Product Description
The information is
available from…
ATA Anonymous FTP Site:
ftp://www.dt.wdc.com/ata/
ata-3/
T13 Anonymous FTP Site:
ftp://fission.dt.wdc.com/
x3t13/project/
d1153r18.pdf
http://developer.intel.com/
design/motherbd/atx.htm
http://developer.intel.com/
technology/cnr/index.htm
http://standards.ieee.org/
reading/ieee/std_public/
description/busarch/
1284.1-1997_desc.html
the Phoenix Web site at:
http://www.ptltd.com/techs/
specs.html
Phone: (510) 943-6546
Fax: (510) 943-5600
E-mail: irda@netcom.com
http://www.intel.com/
design/chipsets/industry/
lpc.htm
http://www.pcisig.com/
http://www.pcisig.com/
http://www.microsoft.com/
hwdev/respec/
pnpspecs.htm
continued
17
Intel® Desktop Board D815EEA Technical Product Specification
Table 3. Specifications (continued)
Specification
Description
SDRAM PC SDRAM Unbuffered
SMBIOS
Title
DIMM Specification
PC SDRAM DIMM
Specification
PC Serial Presence
Detect (SPD)
Specification
System Management
BIOS
UHCI
Universal Host Controller
Interface Design Guide
USB
Universal Serial Bus
Specification
WfM
Wired for Management
Baseline
Version, Revision Date
and Ownership
Revision 1.0,
February, 1998,
Intel Corporation.
Revision 1.5,
November, 1997,
Intel Corporation.
Revision 1.2A,
December, 1997
Intel Corporation.
Version 2.3,
August 12, 1998,
Award Software International Inc.,
Dell Computer Corporation,
Hewlett-Packard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
American Megatrends Inc.,
and SystemSoft Corporation.
Version 1.1,
March 1996,
Intel Corporation.
Version 1.1,
September 23, 1998,
Compaq Computer Corporation,
Intel Corporation, Microsoft
Corporation, and NEC.
Version 2.0,
December 18, 1998,
Intel Corporation.
The information is
available from…
http://www.intel.com/
design/chipsets/memory
http://www.intel.com/
design/chipsets/memory
http://www.intel.com/
design/pcisets/memory
http://developer.intel.com/
ial/wfm/design/smbios
http://www.usb.org/
developers
http://www.usb.org/
developers
http://developer.intel.com/
ial/WfM/wfmspecs.htm
18
Product Description
1.4 Processor
CAUTION
The D815EEA board supports processors that have an 18.2 A maximum current draw with a 1.65
to 2.0 V core voltage. Using a processor not in compliance with the above guidelines can damage
the processor, the D815EEA board, and the power supply. See the processor’s data sheet for
voltage and current usage requirements.
The D815EEA board supports a single Pentium III or Celeron processor. The system bus speed is
automatically selected. The D815EEA board supports the processors listed in Table 4.
Table 4. Supported Processors
Type Designation System Bus Frequency L2 Cache Size
an FC-PGA package
Celeron processor in an
FC-PGA package
Celeron processor in a
PPGA package
533EB, 600EB, 667, 733,
800EB, 866, and 933
500E, 550E, 600E, 650, 700,
750, 800, and 850
533A, 566, and 600 66 MHz 128 KB
500 and 533 66 MHz 128 KB
133 MHz 256 KBPentium III processor in
100 MHz 256 KB
All supported onboard memory can be cached, up to the cachability limit of the processor. See the
processor’s data sheet for cachability limits.
For information about Refer to
Processor support Section 1.2, page 16
Processor data sheets Section 1.2, page 16
19
Intel® Desktop Board D815EEA Technical Product Specification
1.5 System Memory
The D815EEA board has three DIMM sockets and supports the following memory features:
• 3.3 V (only) 168-pin SDRAM DIMMs with gold-plated contacts
• Unbuffered single- or double-sided DIMMs
• Maximum system memory: 512 MB; minimum system memory: 32 MB
• 133 MHz SDRAM or 100 MHz SDRAM
• Serial Presence Detect (SPD) and non-SPD memory
• Non-ECC and ECC DIMMs (ECC DIMMs will operate in non-ECC mode only)
• Suspend to RAM
Table 5 lists the supported DIMM configurations. In the second column of Table 5:
• “DS” refers to double-sided memory modules (containing two rows of SDRAM)
• “SS” refers to single-sided memory modules (containing one row of SDRAM).
When installing memory, note the following:
• Non-SPD DIMMs will always revert to a 100 MHz with 3-3-3 timing SDRAM bus.
• Mixing Non-SPD DIMMs with SPD DIMMs will always revert to a 100 MHz with 3-3-3
timing SDRAM bus.
• The BIOS will not initialize installed memory above 512 MB. At boot, the BIOS displays a
message indicating that any installed memory above 512 MB has not been initialized.
• Mixed memory speed configurations (133 and 100 MHz) will default to 100 MHz.
• 133 MHz SDRAM operation requires a 133 MHz system bus frequency processor.
• The board should be populated with no more than four rows of 133 MHz SDRAM (two
double-sided or one double-sided plus two single-sided DIMMs)
• 100 MHz SDRAM may be populated with six rows of SDRAM (three double-sided DIMMs).
✏ NOTE
If more than four rows of 133 MHz SDRAM are populated, the BIOS will initialize installed
memory up to 512 MB at 100 MHz.
20
Product Description
Table 5. Supported Memory Configurations
DIMM
Capacity
32 MB DS 16 Mbit 2 M X 8 / 2 M X 8 16 (Note 1)
32 MB SS 64 Mbit 4 M X 16 / empty 4
48 MB DS 64 / 16 Mbit 4 M X 16 / 2 M X 8 12 (Notes 1 and 2)
64 MB DS 64 Mbit 4 M X 16 / 4 M X 16 8
64 MB SS 64 Mbit 8 M X 8 / empty 8
64 MB SS 128 Mbit 8 M X 16 / empty 4
96 MB DS 64 Mbit 8 M X 8 / 4 M x 16 12 (Notes 1 and 2)
96 MB DS 128 / 64 Mbit 8 M X 16 / 4 M x 16 8 (Notes 1 and 2)
128 MB DS 64 Mbit 8 M X 8 / 8 M X 8 16 (Note 1)
128 MB DS 128 Mbit 8 M X 16 / 8 M X 16 8 (Notes 1 and 2)
128 MB SS 128 Mbit 16 M X 8 / empty 8
128 MB SS 256 Mbit 16 M X 16 / empty 4
192 MB DS 128 Mbit 16 M X 8 / 8 M x 16 12 (Notes 1 and 2)
192 MB DS 128 / 64 Mbit 16 M X 8 / 8 M x 8 16 (Notes 1 and 2)
256 MB DS 128 Mbit 16 M X 8 / 16 M X 8 16 (Notes 1 and 2)
256 MB DS 256 Mbit 16 M X 16 / 16 M X 16 8 (Notes 1 and 2)
256 MB SS 256 Mbit 32 M X 8 / empty 8
512 MB DS 256 Mbit 32 M X 8 / 32 M X 8 16 (Notes 1 and 2)
Notes
1. If the number of SDRAM devices is greater than nine, the DIMM will be double sided.
2. Front side popul ation / back side population i ndi c ated for SDRAM density and SDRAM organization.
Number of
Sides
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of
SDRAM devices
CAUTION
To be fully compliant with all applicable Intel® SDRAM memory specifications, the motherboard
should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If
your memory modules do not support SPD, you will see a notification to this effect on the screen at
power up. The BIOS will attempt to configure the memory controller for normal operation.
However, DIMMs may not function under the determined frequency. You can access the PC Serial
Presence Detect Specification at:
http://www.intel.com/design/pcisets/memory/
21
Intel® Desktop Board D815EEA Technical Product Specification
1.6 Intel® 815E Chipset
The Intel 815E chipset consists of the following devices:
• 82815E Graphics and Memory Controller Hub (GMCH) with Accelerated Hub Architecture
(AHA) bus
• 82801BA I/O Controller Hub (ICH2) with AHA bus
• 82802AB Firmware Hub (FWH).
The GMCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the
Accelerated Hub Architecture interface. The ICH2 is a centralized controller for the board’s I/O
paths. The FWH provides the nonvolatile storage of the BIOS as well as hardware-dependent
security features. The chipset provides the interfaces shown in Figure 3.
SDRAM Bus
System Bus
82815E
Graphics and
Memory Controller
Hub (GMCH)
Digital video
output
ATA-33/66/100
Network
USB
815E Chipset
AHA
Bus
AGP
Interface
82801BA
I/O Controller Hub
(ICH2)
LPC Bus
AC LinkPCI BusSMBus
Figure 3. Intel 815E Chipset Block Diagram
82802AB
Firmware Hub
(FWH)
OM10202
22
For information about Refer to
The Intel 815E chipset Http://developer.intel.com
The resources used by the chipset Chapter 2
The chipset’s compliance with ACPI, APM, AC ‘97 Section 1.3, page 16
Product Description
1.6.1 Intel® 82815E Graphics and Memory Controller Hub (GMCH)
The GMCH provides the following:
• An integrated Synchronous DRAM memory controller with autodetection of SDRAM
• An interface for a single AGP device or a Graphics Performance Accelerator (GPA) card
• An interface for a digital video output (DVO) connector for a flat panel, digital CRT, or
TV-out
• Support for ACPI Rev 1.0 and APM Rev 1.2 compliant power management
1.6.2 Intel® 82801BA I/O Controller Hub (ICH2)
The ICH2 provides the following:
• 33 MHz PCI bus interface
• Support for up to six PCI master devices
• Low Pin Count (LPC) interface that supports an LPC-compatible I/O controller
• Support for two Master/DMA devices
• Integrated IDE controller that supports Ultra DMA (33 MB/sec) and ATA-66/100 mode
(66 MB/sec, 100 MB/sec)
• Integrated LAN Media Access Controller
• Universal Serial Bus interface with two USB controllers providing four ports in a
UHCI Implementation
• Power management logic for ACPI Rev 1.0b compliance
• System Management Bus (SMBus clock and data lines also routed to PCI bus connector 2)
• Real-Time Clock with 256-byte battery-backed CMOS RAM
• AC’97 digital link for Audio and telephony codecs, including:
AC’97 2.1 compliance
Logic for PCM in, PCM out, Mic input, Modem in, and Modem out
Separate PCI functions for audio and modem
Communications Network Riser (CNR) interface
1.6.2.1 IDE Interfaces
The ICH2’s IDE controller has two independent bus-mastering IDE interfaces that can be
independently enabled. The IDE interfaces support the following modes:
• Programmed I/O (PIO): CPU controls data transfer
• 8237-style DMA: DMA offloads the CPU, supporting transfer rates of up to 16 MB/sec
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• Ultra ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer
rates of up to 66 MB/sec. ATA-66 protocol is similar to ATA-33 and is device driver
compatible. ATA-66 uses faster timings and requires a specialized cable to reduce reflections,
noise, and inductive coupling.
• Ultra ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH2 Ultra
ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec. The higher quality cable used for ATA-66 DMA support is adequate to reduce
reflections, noise, and inductive coupling for ATA-100 operation.
23
Intel® Desktop Board D815EEA Technical Product Specification
The IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA devices using
the transfer modes listed in Table 70 on page 107.
The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The D815EEA board supports laser servo (LS-120) diskette technology through its IDE interfaces.
The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot
menu to one of the following:
• ARMD-FDD (ATAPI removable media device – floppy disk drive)
• ARMD-HDD (ATAPI removable media device – hard disk drive)
For information about Refer to
The location of the IDE connectors Figure 11, page 63
The signal names of the IDE connectors Table 43, page 68
BIOS Setup program’s Boot menu Table 76, page 114
1.6.2.2 USB
The ICH2 contains two separate USB controllers. The D815EEA board has four USB ports; one
USB peripheral can be connected to each port. For more than four USB devices, an external hub
can be connected to any of the ports. Two of the USB ports are implemented with stacked back
panel connectors; the other two are accessible via the front panel USB connector at location J8C1.
The D815EEA board fully supports UHCI and uses UHCI-compatible software drivers.
NOTE
✏
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 54
The signal names of the back panel USB connectors Table 20, page 55
The location of the front panel USB connector Figure 12, page 69
The signal names of the front panel USB connector Table 44, page 70
The USB specification and UHCI Section 1.3, page 16
24
Product Description
1.6.2.3 Real-Time Clock, CMOS SRAM, and Battery
The real-time clock provides a time-of-day clock and a multicentury calendar with alarm features.
The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are
reserved for BIOS use.
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values
can be returned to their defaults by using the BIOS Setup program.
✏ NOTE
If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS
RAM at power-on.
✏ NOTE
The recommended method of accessing the date in systems with D815EEA boards is indirectly
from the Real-Time Clock (RTC) via the BIOS. The BIOS on D815EEA boards contains a century
checking and maintenance feature. This feature checks the two least significant digits of the year
stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e.,
1980 is the first year supported by the PC), updates the century byte to 20. This feature enables
operating systems and applications using the BIOS date/time services to reliably manipulate the
year as a four-digit value.
For information about Refer to
Proper date access in systems with D815EEA boards Section 1.2, page 16
1.6.3 Intel® 82802AB 4 Mbit Firmware Hub (FWH)
The FWH provides the following:
• System BIOS
• System security and manageability logic that enables protection for storing and updating of
platform information
25
Intel® Desktop Board D815EEA Technical Product Specification
1.7 I/O Controller
The SMSC LPC47M102 I/O Controller provides the following features:
• Low pin count (LPC) interface
• 3.3 V operation
• Two serial ports
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.2 MB, 1.44 MB, or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake up event interface
• PCI power management support
• IrDA
• Fan control:
†
1.0 compliant
Two fan control outputs
Two fan tachometer inputs
The BIOS Setup program provides configuration options for the I/O controller.
For information about Refer to
SMSC LPC47M102 I/O controller http://www.smsc.com
1.7.1 Serial Ports
The D815EEA board has two serial ports. Serial port A is located on the back panel. Serial port B
is accessible using the connector at location J8E1. The serial ports’ NS16C550-compatible
UARTs support data transfers at speeds up to 115.2 kbits/sec with BIOS support. The serial ports
can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).
For information about Refer to
The location of the Serial port A connector Figure 9, page 54
The signal names of the Serial port A connector Table 23, page 56
The location of the Serial port B connector Figure 12, page 69
The signal names of the Serial port B connector Table 45, page 70
1.7.2 Infrared Support
The front panel connector includes four pins that support Hewlett-Packard HSDL-1000 compatible
infrared (IR) transmitters and receivers. In the BIOS Setup program, Serial port B can be directed
to a connected IR device. The IR connection can be used to transfer files to or from portable
devices like laptops, PDAs, and printers. The Infrared Data Association (IrDA) specification
supports data transfers of 115.2 kbits/sec at a distance of 1 meter.
26
Product Description
For information about Refer to
The location of the front panel connector Figure 12, page 69
The signal names of the front panel connector Table 48, page 71
Configuring serial port B for infrared applications Section 4.4.3, page 104
The IrDA specification Section 1.3, page 16
1.7.3 Parallel Port
The connector for the multimode bidirectional parallel port is a 25-pin D-Sub connector located on
the back panel. In the BIOS Setup program, the parallel port can be configured for the following:
†
• Output only (PC AT
• Bi-directional (PS/2 compatible)
• EPP
• ECP
For information about Refer to
The location of the parallel port connector Figure 9, page 54
The signal names of the parallel port connector Table 22, page 56
-compatible mode)
1.7.4 Diskette Drive Controller
The I/O controller supports one diskette drive that is compatible with the 82077 diskette drive
controller and supports both PC-AT and PS/2 modes.
For information about Refer to
The location of the diskette drive connector Figure 11, page 63
The signal names of the diskette drive connector Table 42, page 67
The supported diskette drive capacities and sizes Table 71, page 109
1.7.5 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these
†
connectors are protected with a PolySwitch
connection after an overcurrent condition is removed.
NOTE
✏
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top
PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is
connected or disconnected.
The keyboard controller contains the AMI keyboard and mouse controller code, provides the
keyboard and mouse control functions, and supports password protection for power-on/reset. A
power-on/reset password can be specified in the BIOS Setup program.
circuit that, like a self-healing fuse, reestablishes the
The keyboard controller also supports the hot-key sequence <Ctrl><Alt><Del> for a software reset
(operating system dependent). This key sequence resets the computer’s software by jumping to the
beginning of the BIOS code and running the power-on self-test (POST).
27
Intel® Desktop Board D815EEA Technical Product Specification
For information about Refer to
The location of the keyboard and mouse connectors Figure 9, page 54
The signal names of the keyboard and mouse connectors Table 18, page 55
1.8 Graphics Subsystem
The 815E chipset contains two separate, mutually exclusive graphics options. Either the integrated
graphics controller (contained within the 82815E GMCH) is used, or an add-in AGP adapter can
be used.
The GMCH includes an integrated display cache SDRAM controller that supports a Graphics
Performance Accelerator (GPA) card. The GPA card is a 32-bit 133 MHz 4 MB SDRAM array for
enhanced integrated 2D and 3D graphics performance. This interface is multiplexed between the
display cache interface and the AGP connector. When an AGP card is installed, the integrated
graphics controller is disabled and the display cache interface is not used.
For information about Refer to
GPA support Section 1.8.3.1, page 31
1.8.1 Integrated Graphics Controller
The GMCH features the following:
• Integrated graphics controller
3-D Hyper pipelined architecture
Full 2-D hardware acceleration
Motion video acceleration
• 3-D graphics visual and texturing enhancement
• Display
Integrated 24-bit 230 MHz RAMDAC
Display Data Channel Standard, Version 3.0, Level 2B protocols compliant
• Video
Hardware motion compensation for software MPEG2 decode
Software DVD at 30 fps
• Integrated graphics memory controller
Table 6 lists the refresh frequencies supported by the graphics subsystem.
28
Table 6. Supported Graphics Refresh Frequencies
Available Refresh
Resolution Color Palette
320 x 200
320 x 240
352 x 480
352 x 576
400 x 300
512 x 384
640 x 400
640 x 480
640 x 480 16 M colors 60, 70, 72, 75, 85 KDO
800 x 600
1024 x 768
256 colors 70
64 K colors 70 D3
16 M colors 70 D
256 colors 70
64 K colors 70 D3
16 M colors 70 D
256 colors 70
64 K colors 70 D3
16 M colors 70 D
256 colors 70
64 K colors 70 D3
16 M colors 70 D
256 colors 70
64 K colors 70 D3
16 M colors 70 D
256 colors 70
64 K colors 70 D3
16 M colors 70 D
256 colors 70
64 K colors 70 D3
16 M colors 70 D
256 colors 60, 70, 72, 75, 85 KDO
64 K colors 60, 75, 85 KD3O
64 K colors 70, 72 KDO
256 colors 60, 70, 72, 75, 85 KDO
64 K colors 60, 70, 72, 75, 85 KD3O
16 M colors 60, 70, 72, 75, 85 KDO
256 colors 60, 70, 75, 85 KDO
64 K colors 60, 70, 75 KD3O
64 K colors 85 KD3
16 M colors 60, 70, 75, 85 KD
Frequencies (Hz) Notes
D
D
D
D
D
D
D
Product Description
continued
29
Intel® Desktop Board D815EEA Technical Product Specification
Table 6. Supported Graphics Refresh Frequencies (continued)
Available Refresh
Resolution Color Palette
1152 x 864
1280 x 768
1280 x 1024
1600 x 1200
Notes: K = Desktop
D = DirectDraw
3 = Direct3D and OpenGL
O = Overlay
F = Digital Display Device only. A mode will be support ed on bot h analog CRTs and digital display devices (the
KD3O flags above apply to both types of displays), unl ess indicated otherwise.
256 colors 60, 70, 72, 75 KDO
256 colors 85 KD
64 K colors 60, 70 KD3O
64 K colors 72, 75, 85 KD3
16 M colors 60 KDO
16 M colors 75, 85 KD
256 colors 60 (reduced blanking) KDOF
64 K colors 60 (reduced blanking) KD3F
16 M colors 60 (reduced blanking) KDF
256 colors 60 KDO
256 colors 70, 72, 75, 85 KD
64 K colors 60, 70, 72, 75, 85 KD3
16 M colors 60, 70, 75, 85 KD
256 colors
Frequencies (Hz) Notes
60, 70, 72, 75 KD
For information about Refer to
Obtaining graphics software and utilities Section 1.2, page 16
1.8.2 Digital Video Output (DVO) Connector
The board routes the Intel 82815E GMCH DVO port to an onboard 40-pin DVO connector. The
DVO connector can be cabled to a DVI or TV out card to enable digital displays or TV out
functionality. The Digital Visual Interface (DVI) specification provides a high-speed digital
connection for visual data types when using the integrated graphics controller. This interface is
active only when the integrated graphics controller is enabled.
The DVI interface allows interfacing with a discrete Transmission Minimized Differential
Signaling (TMDS) transmitter to enable platform support for DVI compliant digital displays or
with a discrete TV encoder for TV Out functionality.
For information about Refer to
The location of the DVO connector Figure 10, page 59
The signal names of the DVO connector Table 33, page 61
30
Product Description
1.8.3 AGP Universal Connector
The AGP universal connector supports either:
• Graphics Performance Accelerator (GPA) cards with 133 MHz SDRAM display cache
• AGP add-in cards with either 3.3 V or 1.5 V I/O
For information about Refer to
The location of the AGP universal connector Figure 11, page 63
The signal names of the AGP universal connector Table 41, page 66
1.8.3.1 Graphics Performance Accelerator (GPA) Support
The Intel 815E GMCH display cache is a single channel 32-bit wide SDRAM interface. The 4 MB
display cache resides on a GPA card that plugs into the AGP connector. The BIOS detects a GPA
card if present in the AGP port and initializes it as display cache memory. When a GPA card is
initialized, the BIOS allocates 1 MB of system memory to support the internal display device
operation.
1.8.3.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through Direct AGP, and highly
efficient memory utilization. DVMT ensures the most efficient use of all available memory for
maximum 2D/3D graphic performance. DVMT is implemented on the D815EEA board with a
GPA (Graphics Performance Accelerator) card installed in the AGP port.
✏ NOTE
In earlier documentation, the GPA card was referred to as the AGP Inline Memory Module
(AIMM).
DVMT technology uses 1 MB of system physical memory for compatibility with legacy
applications. An example of this would be when using VGA graphics under DOS. Once loaded,
the operating system and graphics drivers allocate the buffers needed for performing graphics
functions. When the 4 MB GPA card is installed, the Z-buffer and GDI data are managed directly
from this dedicated graphics memory thereby avoiding operating system memory manager calls
and improving performance.
At system BIOS POST, the BIOS displays either the amount of physical memory allocated for
display cache or the size of the GPA card (4 MB) if installed. Operating systems such as
†
Windows NT
memory possible based on the system memory configuration.
4.0 and Windows† 2000 may display the maximum amount of frame buffer
31
Intel® Desktop Board D815EEA Technical Product Specification
1.8.3.3 AGP Add-in Card Support
AGP is a high-performance interface for graphics-intensive applications, such as 3D applications.
While based on the PCI Local Bus Specification, Rev. 2.1, AGP is independent of the PCI bus and
is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of
the PCI bus related to handling large amounts of graphics data with the following features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for nearly 100 percent efficiency
For information about Refer to
Obtaining the
Accelerated Graphics Port Interface Specification
Section 1.3, page 16
1.9 Audio Subsystem (Optional)
The D815EEA board offers two separate audio subsystems. Both audio subsystems include these
features:
• Split digital/analog architecture for improved S/N (signal-to-noise) ratio: ≥ 85 dB
• Power management support for APM 1.2 and ACPI 1.0 (driver dependant)
• 3-D stereo enhancement
Both audio subsystems support the following audio connectors:
• Inputs:
Three analog line-level stereo inputs for connection from line in, CD, and auxiliary line in
Two analog line-level inputs for speakerphone
One mono microphone input
• Outputs:
Stereo line-level output
Mono output for speakerphone
1.9.1 Basic Audio Subsystem
The basic audio subsystem consists of the following:
• Intel 82801BA I/O Controller Hub (ICH2)
• Analog Devices AD1885 analog codec
Figure 4 is a block diagram of the basic audio subsystem. The basic audio subsystem supports the
following features:
• 94 dB signal-to-noise ratio sound quality
• Playback sample rates up to 48 kHz
• 64 voice synthesizer
• Software compatible with Windows 98 Gold and SE, Windows 2000, and Windows NT 4.0
• Full-duplex operation at asynchronous hardware record/playback samples rates
• Frequency response: 20 Hz to 20 kHz (+- 0.1 dB)
• ACPI and APM power management compliant
32
Product Description
82801BA
I/O Controller Hub
(ICH2)
LPC
Bus
AC ’97 Link
SMSC LPC47M102
I/O Controller
Analog Devices
AD1885
Analog Codec
Game Port
MIDI Interface
CD-ROM
Line In
Audio In
Mic In
Modem Audio
Line Out
OM10226
Figure 4. Block Diagram of Basic Audio Subsystem
1.9.2 Enhanced PCI Audio Subsystem
The D815EEA board offers an optional subsystem of AC ’97 V 1.03 compliant audio features
supported by the Creative Labs ES1373 digital controller with Crystal Semiconductor CS4297 (A)
codec. Figure 5 is a block diagram of the enhanced PCI audio subsystem.
Analog Codec
(Crystal Semiconductor
82801BA
I/O Controller Hub
(ICH2)
CS4297(A))
AC ’97 Link
Modem Audio
CD-ROM
Line In
Audio In
Mic In
Line Out
CNR
Connector
AC ’97 Link
PCI Bus
Digital Controller
(Creative Labs ES1373)
Game Port
MIDI Interface
OM10227
Figure 5. Block Diagram of Enhanced PCI Audio Subsystem
The Creative Labs ES1373 digital controller with the Crystal Semiconductor CS4297 (A) codec
support the following features:
• Creative Labs ES1373 AC ’97 V1.03 Digital Controller:
PCI 2.1 compliant
PCI bus master for PCI audio
64-voice wavetable synthesizer
†
Aureal A3D
API, Sound Blaster Pro†, Roland MPU-401 MIDI, and joystick compatible
Ensoniq 3D positional audio and Microsoft† DirectSound† 3D support
33
Intel® Desktop Board D815EEA Technical Product Specification
• Crystal Semiconductor CS4297 (A) Stereo Audio Codec:
20-bit stereo digital-to-analog and 18-bit stereo analog-to-digital converters
High performance 18-bit stereo full-duplex audio codec with up to 48 kHz sampling rate
Connects to the ES1373 digital controller using a five-wire digital interface
For information about Refer to
Obtaining audio software and utilities Section 1.2, page 16
1.9.3 Audio Connectors
The audio connectors include the following:
• CD-ROM (legacy-style 2-mm connector)
• ATAPI-style connectors:
CD-ROM
Telephony
Auxiliary line in
• Back panel audio connectors:
MIDI/Game Port
Line out
Line in
Mic in
For information about Refer to
The back panel audio connectors Section 2.8.1, page 54
CAUTION
The pins on both the legacy-style 2-mm and the ATAPI CD-ROM connectors are wired to the same
inputs on the audio mixer. Do not attach CD-ROM drives to both connectors. Otherwise, the
board could be damaged.
1.9.3.1 CD-ROM (Legacy-style 2-mm) Audio Connector
A 1 x 4-pin legacy-style 2-mm connector connects an internal CD-ROM drive to the audio mixer.
For information about Refer to
The location of the legacy-style 2-mm connector Figure 10, page 59
The signal names of the legacy-style 2-mm connector Table 39, page 60
34
Product Description
1.9.3.2 ATAPI CD-ROM Audio Connector
A 1 x 4-pin ATAPI-style connector connects an internal ATAPI CD-ROM drive to the audio
mixer.
For information about Refer to
The location of the ATAPI CD-ROM connector Figure 10, page 59
The signal names of the ATAPI CD-ROM connector Table 30, page 60
1.9.3.3 Telephony Connector
A 1 x 4-pin ATAPI-style connector connects the monoaural audio signals of an internal telephony
device to the audio subsystem. A monaural audio-in and audio-out signal interface is necessary for
telephony applications such as speakerphones, fax/modems, and answering machines.
For information about Refer to
The location of the telephony connector Figure 10, page 59
The signal names of the telephony connector Table 32, page 60
1.9.3.4 Auxiliary Line In Connector
A 1 x 4-pin ATAPI-style connector connects the left and right channel signals of an internal audio
device to the audio subsystem.
For information about Refer to
The location of the auxiliary line in connector Figure 10, page 59
The signal names of the auxiliary line in connector Table 31, page 60
1.10 LAN Subsystem
The Network Interface Controller subsystem consists of the ICH2 (with integrated LAN Media
Access Controller) and a physical layer interface device. Feature of the LAN subsystem include:
• PCI Bus Master Interface
• CSMA/CD Protocol Engine
• Serial CSMA/CD unit interface that supports the following physical layer interface devices:
82562ET onboard LAN
82562ET/MT (10/100 Mbit/sec Ethernet) on CNR bus
82562EH (1 Mbit/sec HomePNA
• PCI Power Management
Supports APM
Supports ACPI technology
Supports Wake up from suspend state (Wake on LAN
†
) on CNR bus
†
technology)
35
Intel® Desktop Board D815EEA Technical Product Specification
1.10.1 Intel® 82562ET Platform LAN Connect Device (Optional)
The Intel 82562ET component provides an interface to the back panel RJ-45 connector with
integrated LEDs. This physical interface may alternately be provided via the CNR connector.
The Intel 82562ET provides the following functions:
• Basic 10/100 Ethernet LAN Connectivity
• Supports RJ-45 connector with status indicator LEDs
• Full driver compatibility
• Advanced Power Management support
• Programmable transit threshold
• Configuration EEPROM that contains the MAC address
1.10.2 RJ-45 LAN Connector LEDs
Two LEDs are built into the RJ-45 LAN connector. Table 7 describes the LED states when the
board is powered up and the LAN subsystem is operating.
Table 7. LAN Connector LED States
LED Color LED State Condition
Off 10 Mbit/sec data rate is selected.Green
On 100 Mbit/sec date rate is selected.
Yellow
Off LAN link is not established.
On (steady state) LAN link is established.
On (brighter and pulsing) The computer is communicating with another computer on
the LAN.
1.10.3 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.2, page 16
1.11 CNR (Optional)
The CNR connector supports the audio, modem, USB, and LAN interfaces of the Intel 815E
chipset. Figure 6 shows the signal interface between the riser and the ICH2.
36
Product Description
✏
NOTE
Intel 82801BA
I/O Controller Hub
(ICH2)
AC ’97 Interface
LAN Interfaces
SMBus
USB
Power
Figure 6. ICH2 and CNR Signal Interface
Communication and
Networking Riser
(Up to two AC ’97 codecs
and one LAN device)
CNR Connector
OM10412
The USB interface from the ICH2 to the CNR is not supported on this board.
The interfaces supported by the CNR connector include (but are not limited to) the following:
• AC ’97 interface: supports audio and/or modem functions on the CNR board.
• LAN interfaces: provides one of two LAN interfaces for networking functions. Interfaces
include an eight-pin interface for use with Platform LAN Connection (PLC) based devices, and
a 17-pin interface for Media Independent Interface (MII) based devices (commonly referred to
as a PHY).
• SMBus interface: provides Plug-and-Play functionality for the CNR board.
The CNR connector includes power signals required for power management and for CNR board
operation.
1.12 Hardware Management Subsystem (Optional)
The hardware management features enable the board to be compatible with the Wired for
Management (WfM) specification. The board has several hardware management features,
including the following:
• Hardware monitoring
• Chassis intrusion detect connector
• Fan control and monitoring (implemented on the SMSC LPC47M102 I/O controller)
For information about Refer to
The WfM specification Table 3, page 16
Fan control functions of the SMSC LPC47M102 I/O controller Section 1.11, page 36
37
Intel® Desktop Board D815EEA Technical Product Specification
1.12.1 Hardware Monitor Component
The hardware monitor component provides low-cost instrumentation capabilities. The features of
the component include:
• Internal ambient temperature sensing
• Remote thermal diode sensing for direct monitoring of processor temperature (if supported in
the processor)
• Power supply monitoring (+12, +5, +3.3, +2.5, 3.3 VSB, VCCP) to detect levels above or below
acceptable values
• SMBus interface
1.12.2 Chassis Intrusion Detect Connector
The board supports a chassis security feature that detects if the chassis cover is removed and
sounds an alarm through the onboard speaker. For the chassis intrusion circuit to function, the
chassis’ power supply must be connected to AC power. The security feature uses a mechanical
switch on the chassis that attaches to the chassis intrusion detect connector. The mechanical
switch is closed for normal computer operation.
For information about Refer to
The location of the chassis intrusion detect connector Figure 10, page 59
The signal names of the chassis intrusion detect connector Table 37, page 62
1.12.3 Fan Control and Monitoring
The SMSC LPC47M102 I/O controller provides two fan control outputs and two fan tachometer
inputs. Monitoring and control can be implemented using third-party software.
For information about Refer to
The functions of the fan connectors Section 1.13.2.2, page 43
The location of the fan connectors Figure 10, page 59
The signal names of the fan connectors Section 2.8.2.2, page 59
38
1.13 Power Management
Power management is implemented at several levels, including:
• Software support:
Advanced Power Management (APM)
Advanced Configuration and Power Interface (ACPI)
• Hardware support:
Power connector
Fan connectors
Wake on LAN technology
Instantly Available technology
Resume on Ring
Wake from USB
Wake on Keyboard
Wake on PME#
Product Description
1.13.1 Software Support
The software support for power management includes:
• APM
• ACPI
If the D815EEA board is used with an ACPI-aware operating system, the BIOS can provide ACPI
support. Otherwise, it defaults to APM support.
1.13.1.1 APM
APM makes it possible for the computer to enter an energy-saving standby mode. The standby
mode can be initiated in the following ways:
• Time-out period specified in the BIOS Setup program
• From the operating system, such as the Standby menu item in Windows 98
In standby mode, the D815EEA board can reduce power consumption by spinning down hard
drives, and reducing power to, or turning off of, VESA
management mode can be enabled or disabled in the BIOS Setup program.
While in standby mode, the system retains the ability to respond to external interrupts and service
requests, such as incoming faxes or network messages. Any keyboard or mouse activity brings the
system out of standby mode and immediately restores power to the monitor.
†
DPMS-compliant monitors. Power
39
Intel® Desktop Board D815EEA Technical Product Specification
The BIOS enables APM by default; but the operating system must support an APM driver for the
power management features to work. For example, Windows 98 supports the power management
features upon detecting that APM is enabled in the BIOS.
For information about Refer to
Enabling or disabling power management in the BIOS Setup program Section 4.6, page 112
The D815EEA board’s compliance level with APM Table 3, page 16
1.13.1.2 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with the D815EEA board requires an operating system
that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration) and APM support normally contained in
the BIOS
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 30-watt system operation in the power-on/standby sleeping
state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake up events (see Table 10 on page 42)
• Support for a front panel power and sleep mode switch. Table 8 lists the system states based
on how long the power switch is pressed, depending on how ACPI is configured with an
ACPI-aware operating system.
Table 8. Effects of Pressing the Power Switch
…and the power switch is
If the system is in this state…
Off (ACPI G2/G5 – Soft off) Less than four seconds Power-on
On (ACPI G0 – working state) Less than four seconds Soft-off/Standby
On (ACPI G0 – working state) More than four seconds Fail safe power-off
Sleep (ACPI G1 – sleeping
state)
Sleep (ACPI G1 – sleeping
state)
For information about Refer to
The D815EEA board’s compliance level with ACPI Section 1.3, page 16
pressed for …the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
Less than four seconds Wake up
(ACPI G0 – working state)
More than four seconds Power-off
(ACPI G2/G5 – Soft off)
40
Product Description
1.13.1.2.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 9 lists the power states supported by the D815EEA board along with the associated system
power targets. See the ACPI specification for a complete description of the various system and
power states.
Table 9. Power States and Targeted System Power
Targeted System Power
Global States Sleeping States CPU States Device States
G0 – working
state
G1 – sleeping
state
G1 – sleeping
state
G2/S5 S5 – Soft off.
G3 –
mechanical off
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
S0 – working C0 – working D0 – working
state
S1 – CPU stopped C1 – stop
grant
S3 – Suspend to
RAM. Context
saved to RAM.
Context not saved.
Cold boot is
required.
No power to the
system.
No power D3 – no power
No power D3 – no power
No power D3 – no power for
D1, D2, D3 –
device
specification
specific.
except for wake
up logic.
except for wake
up logic.
wake up logic,
except when
provided by
battery or external
source.
(Note 1)
Full power > 30 W
5 W < power < 30 W
Power < 5 W (Note 2)
Power < 5 W (Note 2)
No power to t he system so
that service can be
performed.
41
Intel® Desktop Board D815EEA Technical Product Specification
1.13.1.2.2 Wake Up Devices and Events
Table 10 lists the devices or specific events that can wake the computer from specific states.
Table 10. Wake Up Devices and Events
These devices/events can wake up the computer… …from this state
Power switch S1, S3, S5
RTC alarm S1, S3, S5
LAN S1, S3, S5 (Note)
PME# S1, S3, S5 (Note)
Modem (back panel Serial Port A) S1, S3
IR command S1, S3
USB S1, S3
PS/2 keyboard S1, S3
Note: For LAN and PME#, S5 is di sabled by default in the BIOS Setup program. Setting this option to Power On will
enable a wake-up event from LAN in the S 5 state.
NOTE
✏
The use of these wake up events from an ACPI state requires an operating system that provides full
ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
1.13.1.2.3 Plug and Play
In addition to power management, ACPI provides controls and information so that the operating
system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to
enumerate and configure D815EEA board devices that do not have other hardware standards for
enumeration and configuration. PCI devices on the D815EEA board, for example, are not
enumerated by ACPI.
1.13.2 Hardware Support
CAUTION
If the Wake on LAN and Instantly Available technology features are used, ensure that the power
supply provides adequate +5 V standby current. Failure to do so can damage the power supply.
The total amount of standby current required depends on the wake devices supported and
manufacturing options. Refer to Section 2.11.3 on page 78 for additional information.
The board provides several hardware features that support power management, including:
• Power connector
• Fan connectors
• Wake on LAN technology
• Instantly Available technology
• Resume on Ring
• Wake from USB
• Wake from PS/2 keyboard
• PME# wakeup support
42
Product Description
Wake on LAN technology and Instantly Available technology require power from the +5 V
standby line. The sections discussing these features describe the incremental standby power
requirements for each.
Resume on Ring enables telephony devices to access the computer when it is in a power-managed
state. The method used depends on the type of telephony device (external or internal) and the
power management mode being used (APM or ACPI).
NOTE
✏
The use of Resume on Ring, and Wake from USB technologies from an ACPI state requires an
operating system that provides full ACPI support.
1.13.2.1 Power Connector
When used with an ATX-compliant power supply that supports remote power on/off, the
D815EEA board can turn off the system power through software control. To enable soft-off
control in software, advanced power management must be enabled in the BIOS Setup program and
in the operating system. When the system BIOS receives the correct APM command from the
operating system, the BIOS turns off power to the computer.
With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected
power cord, when power resumes, the computer returns to the power state it was in before power
was interrupted (on or off). The computer’s response can be set using the After Power Failure
feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the power connector Figure 10, page 59
The signal names of the power connector Table 35, page 61
The BIOS Setup program’s Boot menu Table 76, page 114
The ATX specification Section 1.3, page 16
1.13.2.2 Fan Connectors
The D815EEA board has three fan connectors. The functions of these connectors are described in
Table 11.
Table 11. Fan Connector Descriptions
Connector Function
System fan (fa n 1) Pr ovides +12 V DC for a system or chassis fan. The fan voltage can be switched
on or off, depending on the power management state of the computer. A
tachometer feedback connection is also provided.
Power supply fan
control (fan 2)
Processor fan (fan 3) Provides +12 V DC for a processor fan or active fan heatsink.
Provides +12 V DC for a system or chassis fan. Th e fan voltage can be switched
on or off, depending on the power management state of the computer. A
tachometer feedback connection is also provided.
43
Intel® Desktop Board D815EEA Technical Product Specification
For information about Refer to
The location of the fan connectors Figure 10, page 59
The signal names of the fan connectors Section 2.8.2.2, page 59
1.13.2.3 Wake on LAN Technology
CAUTION
For Wake on LAN technology, the 5-V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Wake on LAN technology can damage the power supply. Refer to Section 2.11.3 on
page 78 for additional information.
Wake on LAN technology enables remote wakeup of the computer through a network. The LAN
subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface.
†
Upon detecting a Magic Packet
the computer. Depending on the LAN implementation, the D815EEA board supports Wake on
LAN technology in the following ways:
• Through the Wake on LAN technology connector (APM only)
• Through the PCI bus PME# signal for PCI 2.2 compliant LAN designs (ACPI only)
• Through the onboard LAN subsystem when enabled in Setup (ACPI only)
frame, the LAN subsystem asserts a wakeup signal that powers up
The Wake on LAN technology connector can be used with PCI bus network adapters that have a
remote wake up connector, as shown in Figure 7. Network adapters that are PCI 2.2 compliant
assert the wakeup signal through the PCI bus signal PME# (pin A19 on the PCI bus connectors).
Network
Interface
Card
PCI Slot
Figure 7. Using the Wake on LAN Technology Connector
For information about Refer to
The location of the Wake on LAN technology connector Figure 10, page 59
The signal names of the Wake on LAN technology connector Table 36, page 62
Remote
Wake up
connector
Wake on
LAN
technology
connector
Desktop Board
OM09129
44
Product Description
1.13.2.4 Instantly Available Technology
CAUTION
For Instantly Available technology, the 5-V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Instantly Available technology can damage the power supply. Refer to
Section 2.11.3 on page 78 for additional information.
Instantly Available technology enables the D815EEA board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power
supply is off, the fans are off, and the front panel LED is amber if dual-color, or off if singlecolor.) When signaled by a wake-up device or event, the system quickly returns to its last known
wake state. Table 10 on page 42 lists the devices and events that can wake the computer from the
S3 state.
The D815EEA board supports the PCI Bus Power Management Interface Specification. For
information on the versions of this specification, see Section 1.3. Add-in boards that also support
this specification can participate in power management and can be used to wake the computer.
The use of Instantly Available technology requires operating system support and PCI 2.2
compliant add-in cards and drivers.
The standby power indicator LED shows that power is still present at the DIMM and PCI bus
connectors, even when the computer appears to be off. Figure 8 shows the location of the standby
power indicator LED.
CR5G1
Figure 8. Location of Standby Power Indicator LED
OM10042
45
Intel® Desktop Board D815EEA Technical Product Specification
1.13.2.5 Resume on Ring
The operation of Resume on Ring can be summarized as follows:
• Resumes operation from either the APM sleep mode or the ACPI S1 state
• Requires only one call to access the computer
• Detects incoming call similarly for external and internal modems
• Requires modem interrupt be unmasked for correct operation
1.13.2.6 Wake from USB
USB bus activity wakes the computer from an ACPI S1 or S3 state.
NOTE
✏
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.13.2.7 Wake from PS/2 Keyboard
PS/2 keyboard activity wakes the computer from an ACPI S1 or S3 state.
1.13.2.8 PME# Wakeup Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1 or
S3 state.
46
2 Technical Reference
What This Chapter Contains
2.1 Introduction................................................................................................................47
2.2 Memory Map ............................................................................................................. 47
2.3 I/O Map ..................................................................................................................... 48
2.4 DMA Channels .......................................................................................................... 50
2.5 PCI Configuration Space Map ................................................................................... 50
2.6 Interrupts...................................................................................................................51
2.7 PCI Interrupt Routing Map......................................................................................... 51
2.8 Connectors................................................................................................................ 53
2.9 Jumper Block............................................................................................................. 73
2.10 Mechanical Considerations........................................................................................ 75
2.11 Electrical Considerations........................................................................................... 77
2.12 Thermal Considerations............................................................................................. 80
2.13 Reliability................................................................................................................... 82
2.14 Environmental............................................................................................................ 83
2.15 Regulatory Compliance............................................................................................. 84
2.1 Introduction
Sections 2.2 - 2.6 contain several standalone tables. Table 12 describes the system memory map,
Table 13 shows the I/O map, Table 14 lists the DMA channels, Table 15 defines the PCI
configuration space map, and Table 16 describes the interrupts. The remaining sections in this
chapter are introduced by text found with their respective section headings.
2.2 Memory Map
Table 12. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 524288 K 100000 - 1FFFFFFF 511 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Available high DOS memory (open
to the PCI bus)
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 K Conventional memory
47
Intel® Desktop Board D815EEA Technical Product Specification
2.3 I/O Map
Table 13. I/O Map
Address (hex) Size Description
0000 - 000F 16 bytes DMA controller
0020 - 0021 2 bytes Programmable Interrupt Control (PIC)
0040 - 0043 4 bytes System timer
0060 1 byte Keyboard controller byte—reset IRQ
0061 1 byte System speaker
0064 1 byte Keyboard controller, CMD / STAT byte
0070 - 0071 2 bytes System CMOS / Real Time Clock
0072 - 0073 2 bytes System CMOS
0080 - 008F 16 bytes DMA controller
0092 1 byte Fast A20 and PIC
00A0 - 00A1 2 bytes PIC
00B2 - 00B3 2 bytes APM control
00C0 - 00DF 32 bytes DMA
00F0 1 byte Numeric data processor
0170 - 0177 8 bytes Secondary IDE channel
01F0 - 01F7 8 bytes Primary IDE channel
One of these ranges:
0200 - 0207
0208 - 020F
0210 - 0217
0218 - 021F
One of these ranges: Audio (Sound Blaster Pro-compatible)
0220 - 022F 16 bytes
0240 - 024F 16 bytes
0228 - 022F* 8 bytes LPT3
0278 - 027F* 8 bytes LPT2
02E8 - 02EF* 8 bytes COM4 / video (8514A)
02F8 - 02FF* 8 bytes COM2
One of these ranges:
0320 - 0327
0330 - 0337
0340 - 0347
0350 - 0357
0376 1 byte Secondary IDE channel command port
0377, bits 6:0 7 bits Secondary IDE channel status port
0378 - 037F 8 bytes LPT1
0388 - 038B 6 bytes AdLib† (FM synthesizer)
03B0 - 03BB 12 bytes Intel 82815E GMCH
03C0 - 03DF 32 bytes Intel 82815E GMCH
03E8 - 03EF 8 bytes COM3
Can vary from 1 byte
to 8 bytes
8 bytes MPU-401 (MIDI)
Audio / game port
continued
48
Table 13. I/O Map (continued)
Address (hex) Size Description
03F0 - 03F5 6 bytes Diskette channel 1
03F6 1 byte Primary IDE channel command port
03F8 - 03FF 8 bytes COM1
04D0 - 04D1 2 bytes Edge/level triggered PIC
One of these ranges:
0530 - 0537
0E80 - 0E87
0F40 - 0F47
LPTn + 400 8 bytes ECP port, LPTn base address + 400h
0CF8 - 0CFB** 4 bytes PCI configuration address register
0CF9*** 1 byte Turbo and reset control register
0CFC - 0CFF 4 bytes PCI configuration data register
FFA0 - FFA7 8 bytes Primary bus master IDE registers
FFA8 - FFAF 8 bytes Secondary bus master IDE registers
96 contiguous bytes starting on a 128-byte
divisible boundary
64 contiguous bytes starting on a 64-byte
divisible boundary
64 contiguous bytes starting on a 64-byte
divisible boundary
32 contiguous bytes starting on a 32-byte
divisible boundary
16 contiguous bytes starting on a 16-byte
divisible boundary
4096 contiguous bytes starting on a 4096-byte
divisible boundary
* Default, but can be changed to another address range.
** Dword access only
*** By t e ac cess only
8 bytes Windows Sound System
ICH (ACPI + TCO)
D815EEA board resource
Onboard audio controller
ICH (USB)
ICH (SMBus)
Intel 82801BA PCI bridge
Technical Reference
✏ NOTE
Some additional I/O addresses are not available due to ICH addresses aliassing. For information
about the ICH addressing, refer to Section 1.2 on page 16.
49
Intel® Desktop Board D815EEA Technical Product Specification
2.4 DMA Channels
Table 14. DMA Channels
DMA Channel Number Data Width System Resource
0 8- or 16-bits Audio
1 8- or 16-bits Audio / parallel port
2 8- or 16-bits Diskette drive
3 8- or 16-bits Parallel port (for ECP or EPP) / audio
4 8- or 16-bits DMA controller
5 16-bits Open
6 16-bits Open
7 16-bits Open
2.5 PCI Configuration Space Map
Table 15. PCI Configuration Space Map
Bus
Number (hex)
00 00 00 Memory controller of Intel 82815E component
00 01 00 PCI to AGP bridge
00 02 00 Intel 82815E GMCH (graphics memory controller hub)
00 1E 00 Hub link to PCI bridge
00 1F Intel 82801BA ICH2 PCI to LPC bridge
00 1F 01 IDE controller
00 1F 02 USB
00 1F 03 SMBus controller
00 1F 04 USB
00 1F 05 AC ’97 audio controller (optional)
00 1F 06 AC ’97 modem controller (optional)
01 (Note) 00 00 Add-in AGP adapter card
01/02 Note 07 00 Creative Labs ES1373 digital controller
01/02 (Note) 08 00 LAN controller (optional)
01/02 (Note) 09 00 PCI bus connector 1 (J4E1)
01/02 (Note) 0A 00 PCI bus connector 2 (J4D1)
01/02 (Note) 0B 00 PCI bus connector 3 (J4C1)
01/02 (Note) 0C 00 PCI bus connector 4 (J4B1)
01/02 (Note) 0D 00 PCI bus connector 5 (J4A1)
Note: If an add-in AGP card is i nstalled, it occupies P CI Bus 01 and the other devices oc cupy PCI Bus 02. If no add-i n
AGP card is install ed, these PCI devices oc cupy PCI Bus 01.
Device
Number (hex)
Function
Number (hex) Description
50
2.6 Interrupts
Table 16. Interrupts
IRQ System Resource
NMI I/O channel check
0 Reserved, interval timer
1 Reserved, keyboard buffer full
2 Reserved, cascade interrupt from slave PIC
3 COM2 (Note)
4 COM1 (Note)
5 LPT2 (Plug and Play option) / Audio / User available
6 Diskette drive
7 LPT1 (Note)
8 Real-time clock
9 Reserved for ICH system management bus
10 User available
11 User available
12 Onboard mouse port (if present, else user available)
13 Reserved, math coprocessor
14 Primary IDE (if present, else user available)
15 Secondary IDE (if present, else user available)
Note: Default, but can be changed to another IRQ
Technical Reference
2.7 PCI Interrupt Routing Map
This section describes interrupt sharing and how the interrupt signals are connected between the
PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can
be shared between devices attached to the PCI bus. In most cases, the small amount of latency
added by interrupt sharing does not affect the operation or throughput of the devices. In some
special cases where maximum performance is needed from a device, a PCI device should not share
an interrupt with other PCI devices. Use the following information to avoid sharing an interrupt
with a PCI add-in card.
PCI devices are categorized as follows to specify their interrupt grouping:
• INTA: By default, all add-in cards that require only one interrupt are in this category. For
almost all cards that require more than one interrupt, the first interrupt on the card is also
classified as INTA.
• INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is
classified as INTB. (This is not an absolute requirement.)
• INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a
fourth interrupt is classified as INTD.
51
Intel® Desktop Board D815EEA Technical Product Specification
The ICH2 has eight programmable interrupt request (PIRQ) input signals. All PCI interrupt
sources either onboard or from a PCI add-in card connect to one of these PIRQ signals. Some PCI
interrupt sources are electrically tied together on the D815EEA board and therefore share the same
interrupt. Table 17 shows an example of how the PIRQ signals are routed on the D815EEA board.
For example, using Table 17 as a reference, assume an add-in card using INTA is plugged into PCI
bus connector 4. In PCI bus connector 4, INTA is connected to PIRQB, which is already
connected to the SMBus. The add-in card in PCI bus connector 4 now shares interrupts with these
onboard interrupt sources.
Table 17. PCI Interrupt Routing Map
ICH PIRQ Signal Name
PCI Interrupt Source
GMCH INTB INTA to PIRQA
ICH2 USB controller INTD to PIRQD
SMBus controller INTB
ICH2 USB controller INTC to PIRQC
ICH2 Audio / Modem INTB
ICH2 LAN INTA to PIRQE
Creative Labs ES1373 digital controller INTA
PCI Bus Connector 1 (J4E1) INTA INTB INTC INTD
PCI Bus Connector 2 (J4D1) INTD INTA INTB INTC
PCI Bus Connector 3 (J4C1) INTC INTD INTA INTB
PCI Bus Connector 4 (J4B1) INTB INTC INTD INTA
PCI Bus Connector 5 (J4A1) INTA INTB INTC INTD
PIRQF PIRQG PIRQH PIRQB Other
NOTE
✏
The ICH can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 6, 7, 10, 11, 12,
14, and 15). Typically, a device that does not share a PIRQ line will have a unique interrupt.
However, in certain interrupt-constrained situations, it is possible for two or more of the PIRQ
lines to be connected to the same IRQ signal.
52
Technical Reference
2.8 Connectors
CAUTION
Only the back panel connectors of the D815EEA board have overcurrent protection. The
D815EEA board’s internal connectors are not overcurrent protected and should connect only to
devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these
connectors to power devices external to the computer’s chassis. A fault in the load presented by
the external devices could cause damage to the computer, the interconnecting cable, and the
external devices themselves.
This section describes the board’s connectors. This section describes the board’s connectors. The
connectors can be divided into the following groups:
• Back panel I/O connectors (see page 54)
PS/2 keyboard and mouse
LAN
USB (2)
Parallel port
Serial port
VGA
MIDI/game port
Audio (Line out, Line in, and Mic in)
• Internal I/O connectors (see page 58)
Audio (ATAPI CD-ROM, legacy style CD-ROM, telephony, auxiliary line input)
Digital video interface
Fans (3)
Power
Chassis intrusion
Wake on LAN technology
Add-in boards (one CNR connector, one AGP universal connector, and five PCI bus
connectors)
IDE (2)
Diskette drive
• External I/O connectors (see page 69)
SCSI LED
Front panel USB
Serial port B
Front panel (power/sleep/message-waiting LED, power switch, hard drive activity LED,
reset switch, infrared port, and auxiliary front panel LED)
53
Intel® Desktop Board D815EEA Technical Product Specification
2.8.1 Back Panel Connectors
Figure 9 shows the location of the back panel connectors. The back panel connectors are colorcoded in compliance with PC 99 recommendations. The figure legend below lists the colors used.
C
A
B
E
D
Item Description Color For more information see:
A PS/2 mouse port Green Table 18
B PS/2 keyboard port Purple Table 18
C LAN Black Table 19
D USB port 0 Black Table 20
E USB port 1 Black Table 20
F VGA port Dark blue Table 21
G Parallel port Burgundy Table 22
H Serial port A Teal Table 23
I MIDI / Game port Gold Table 24
J Audio line out Lime green Table 25
K Audio line in Light blue Table 26
L Mic in Pink Table 27
G
F
H
JLK
I
OM10043
Figure 9. Back Panel Connectors
54
Technical Reference
NOTE
✏
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
Table 18. PS/2 Mouse/Keyboard Connectors
Pin Signal Name
1Data
2 Not connected
3 Ground
4 Fused +5 V
5Clock
6 Not connected
Table 19. LAN Connector
Pin Signal Name
1TX+
2TX3RX+
4 Ground
5 Ground
6RX7 Ground
8 Ground
Table 20. USB Connectors
Pin Signal Name
1 +5 V (fused)
2 USBP0# [USBP1#]
3 USBP0 [USBP1]
4 Ground
Signal names in brackets ([ ]) are for USB port 1.
55
Intel® Desktop Board D815EEA Technical Product Specification
Table 21. VGA Port Connector
Pin Signal Name Pin Signal Name Pin Signal Name
1 Red 6 Ground 11 No connect
2 Green 7 Ground 12 MONID1
3 Blue 8 Ground 13 HSYNC
4 No connect 9 Fused VCC 14 VSYNC
5 Ground 10 Ground 15 MONID2
Table 22. Parallel Port Connector
Pin Standard Signal Name ECP Signal Name EPP Signal Name
1 STROBE# STROBE# WRITE#
2 PD0 PD0 PD0
3 PD1 PD1 PD1
4 PD2 PD2 PD2
5 PD3 PD3 PD3
6 PD4 PD4 PD4
7 PD5 PD5 PD5
8 PD6 PD6 PD6
9 PD7 PD7 PD7
10 ACK# ACK# INTR
11 BUSY BUSY#, PERIPHACK WAIT#
12 PERROR PE, ACKREVERSE# PE
13 SELECT SELECT SELECT
14 AUDOFD# AUDOFD#, HOSTACK DATASTB#
15 FAULT# FAULT#, PERIPHREQST# FAULT#
16 INIT# INIT#, REVERSERQST# RESET#
17 SLCTIN# SLCTIN# ADDRSTB#
18 - 25 GND GND GND
Table 23. Serial Port A Connector
Pin Signal Name
1 DCD (Data Carrier Detect)
2 RXD# (Receive Data)
3 TXD# (Transmit Data)
4 DTR (Data Terminal Ready)
5 Ground
6 DSR (Data Set Ready)
7 RTS (Request to Send)
8 CTS (Clear to Send)
9 RI (Ring Indicator)
56
Table 24. MIDI/Game Port Connector
Pin Signal Name Pin Signal Name
1 +5 V (fused) 9 +5 V (fused)
2 JOY4 10 JOY6
3 JOYTIME0 11 JOYTIME2
4 Ground 12 MIDI-OUT
5 Ground 13 JOYTIME3
6 JOYTIME1 14 JOY7
7 JOY5 15 MIDI-IN
8 +5 V (fused)
Table 25. Audio Line Out Connector
Pin Signal Name
Tip Audio left out
Ring Audio right out
Sleeve Ground
Technical Reference
Table 26. Audio Line In Connector
Pin Signal Name
Tip Audio left in
Ring Audio right in
Sleeve Ground
Table 27. Mic In Connector
Pin Signal Name
Tip Mono in
Ring Mic bias voltage
Sleeve Ground
57
Intel® Desktop Board D815EEA Technical Product Specification
2.8.2 Internal I/O Connectors
The internal I/O connectors are divided into the following functional groups:
• Audio, video, power, and hardware control (see page 59)
ATAPI CD-ROM
Legacy style (2-mm) CD-ROM
Telephony
Auxiliary line in
Digital video out
Fans (3)
Power
Chassis intrusion
Wake on LAN technology
• Add-in boards and peripheral interfaces (see page 62)
CNR (communication and networking riser)
PCI bus (5)
AGP Universal
IDE (2)
Diskette drive
2.8.2.1 Expansion Slots
The board has the following expansion slots:
• One Accelerated Graphics Port (ATX Expansion slot 6). A 4X AGP retention mechanism can be
installed during board manufacturing (at OEM request).
• Five PCI Local Bus slots (compliant with PCI rev 2.2 specification). The SMBus is routed to
PCI bus connector 2 only (ATX Expansion slot 4). PCI add-in cards with SMBus support can
access sensor data and other information residing on the desktop board.
• One CNR (optional), shared with PCI bus connector 5 (ATX Expansion slot 1).
NOTE
✏
This document references back-panel slot numbering with respect to processor location on the
desktop board. The AGP slot is identified as “AGP” and is not numbered. PCI slots are identified
as “PCI slot #x, starting with the slot closest to the processor. The CNR slot shares a PCI slot
number.
The ATX/MicroATX specifications identify expansion slot locations with respect to the far edge of
a full-sized ATX chassis. The ATX specification and the board’s silkscreen are opposite and could
cause confusion. The ATX numbering convention is made without respect to slot type (PCI vs
AGP), but refers to an actual slot location on a chassis. Figure 11 on page 63 illustrates the
board’s PCI slot numbering.
58
2.8.2.2 Audio, Video, Power, and Hardware Control Connectors
Figure 10 shows the location of the audio, video, power, and hardware control connectors.
FDECB GA
1
1
1
1
Technical Reference
1
1
1
1
1
11
10
20
1
HK J I
OM10044
Item Description Color Reference Designator For more information see:
A Chassis Fan (Fan 2) N/A J3F1 Table 28
B CD-ROM, Legacy style, 2 mm White J2F2 Table 29
C ATAPI CD-ROM Black J2F1 Table 30
D Auxiliary line in, ATAPI style White J2G1 Table 31
E Telephony, ATAPI style Green J2G2 Table 32
F Digital video out N/A J3H1 Table 33
G Processor fan (Fan 3) N/A J3M1 Table 34
H Power N/A J8K1 Table 35
I Wake on LAN technology N/A J6B1 Table 36
J Chassis intrusion N/A J7B1 Table 37
K Chassis fan (Fan 1) N/A J8B1 Table 38
Figure 10. Audio, Video, Hardware Control, and Fan Connectors
59
Intel® Desktop Board D815EEA Technical Product Specification
For information about Refer to
The power connector Section 1.13.2.1, page 43
The functions of the fan connectors Section 1.13.2.2, page 43
Wake on LAN technology Section 1.13.2.3, page 44
Table 28. Chassis Fan Connector (J3F1)
Pin Signal Name
1 FAN2_PWM
2 +12 V
3 FAN2_TACH
Table 29. CD-ROM Legacy Style Connector
(J2F2)
Pin Signal Name
1 CD_Ground
2 CD_IN-Left
3 CD_Ground
4 CD_IN-Right
Table 30. ATAPI CD-ROM Connector (J2F1)
Pin Signal Name
1 Left audio input from CD-ROM
2 CD audio differential ground
3 CD audio differential ground
4 Right audio input from CD-ROM
Table 31. Auxiliary Line In Connector (J2G1)
Pin Signal Name
1 Left auxiliary line in
2 Ground
3 Ground
4 Right auxiliary line in
Table 32. Telephony Connector (J2G2)
Pin Signal Name
1 Analog audio mono input
2 Ground
3 Ground
4 Analog audio mono output
60
Table 33. Digital Video Out Connector (J3H1)
Pin Signal Name Pin Signal Name
1 LTVCLKIN 2 +5 VDC
3 P_RST_SLOTS# 4 LTVCL_3V
5 Ground 6 LTVDA_3V
7 Ground 8 LTVVSYNC
9 Ground 10 LTVHSYNC
11 Ground 12 LTVDAT0
13 Ground 14 LTVDAT1
15 Ground 16 LTVDAT2
17 Ground 18 LTVDAT3
19 Ground 20 LTVDAT4
21 Ground 22 LTVDAT5
23 Ground 24 LTVDAT6
25 Ground 26 LTVDAT7
27 Ground 28 LTVDAT8
29 Ground 30 LTVDAT9
31 Ground 32 LTVDAT10
33 Ground 34 LTVDAT11
35 Ground 36 LTVCLKOUT0
37 Ground 38 LTVCLKOUT1
39 Ground 40 LTVBLNK#
Technical Reference
Table 34. Processor Fan Connector (J3M1)
Pin Signal Name
1 Ground
2 +12 V
3 Ground
Table 35. Power Connector (J8K1)
Pin Signal Name Pin Signal Name
1 +3.3 V 11 +3.3 V
2 +3.3 V 12 -12 V
3 Ground 13 Ground
4 +5 V 14 PS-ON# (power supply remote on/off)
5 Ground 15 Ground
6 +5 V 16 Ground
7 Ground 17 Ground
8 PWRGD (Power Good) 18 TP_PWRCONN_18
9 +5 V (Standby) 19 +5 V
10 +12 V 20 +5 V
61
Intel® Desktop Board D815EEA Technical Product Specification
Table 36. Wake on LAN Technology
Connector (J6B1)
Pin Signal Name
1 +5 VSB
2 Ground
3WOL
Table 37. Chassis Intrusion Connector (J7B1)
Pin Signal Name
1 INTRUDER#
2 Ground
Table 38. Chassis Fan Connector (J8B1)
Pin Signal Name
1 FAN1_PWM
2 +12 V
3 FAN1_TACH
For information about Refer to
The power connector Section 1.13.2.1, page 43
The functions of the fan connectors Section 1.13.2.2, page 43
Wake on LAN technology Section 1.13.2.3, page 44
62
Technical Reference
2.8.2.3 Add-in Board and Peripheral Interface Connectors
Figure 11 shows the location of the add-in board connector and peripheral connectors. Note the
following considerations for the PCI bus connectors:
• All of the PCI bus connectors are bus master capable.
• PCI bus connector 2 has SMBus signals routed to it. This enables PCI bus add-in boards with
SMBus support to access sensor data on the board. The specific SMBus signals are as follows:
The SMBus clock line is connected to pin A40
The SMBus data line is connected to pin A41
A B C D E FG
240
1
240
1
2
1
IJ
H
39
39
34
33
OM10045
Item Description Reference Designator For more information see:
A Communication and networking riser (CNR) J3A1 Table 39
B PCI bus connector 5 J4A1 Table 40
C PCI bus connector 4 J4B1 Table 40
D PCI bus connector 3 J4C1 Table 40
E PCI bus connector 2 J4D1 Table 40
F PCI bus connector 1 J4E1 Table 40
G AGP universal connector J5E1 Table 41
H Diskette drive J8G3 Table 42
I Primary IDE J8G2 Table 43
J Secondary IDE J8G1 Table 43
Figure 11. Add-in Board and Peripheral Interface Connectors
63
Intel® Desktop Board D815EEA Technical Product Specification
Table 39. CNR Connector (J3A1)
Pin Signal Name
A1 Reserved B1 Reserved
A2 Reserved B2 Reserved
A3 Ground B3 Reserved
A4 Reserved B4 Ground
A5 Reserved B5 Reserved
A6 Ground B6 Reserved
A7 LAN_TXD2 B7 Ground
A8 LAN_TXD0 B8 LAN_TXD1
A9 Ground B9 LAN_RSTSYNC
A10 LAN_CLK B10 Ground
A11 LAN_RXD1 B11 LAN_RXD2
A12 Reserved B12 LAN_RXD0
A13 USB+ B13 Ground
A14 GND B14 Reserved
A15 USB- B15 +5VDUAL
A16 +12V B16 USB_OC
A17 GND B17 Ground
A18 +3.3VDUAL B18 -12V
A19 +5VD B19 +3.3VD
A20 Ground B20 Ground
A21 EEDI B21 EED0
A22 EECS B22 EECK
A23 SMB_A1 B23 Ground
A24 SMB_A2 B24 SMB_A0
A25 SMB_SDA B25 SMB_SCL
A26 AC97_RESET B26 CDC_DWN_ENAB
A27 Reserved B27 Ground
A28 AC97_SDATA_IN1 B28 AC97_SYNC
A29 AC97_SDATA_IN0 B29 AC97_SDATA_OUT
A30 GND B30 AC97_BITCLK
Pin Signal Name
64
For information about Refer to
The CNR Section 1.11, page 36
Technical Reference
Table 40. PCI Bus Connectors (J4A1, J4B1, J4C1, J4D1, J4E1)
Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name
A1 Ground (TRST#)* B1 -12 V A32 AD16 B32 AD17
A2 +12 V B2 Ground (TCK)* A33 +3.3 V B33 C/BE2#
A3 +5 V (TMS)* B3 Ground A34 FRAME# B34 Ground
A4 +5 V (TDI)* B4 no connect (TDO)* A35 Ground B35 IRDY#
A5 +5 V B5 +5 V A36 TRDY# B36 +3.3 V
A6 INTA# B6 +5 V A37 Ground B37 DEVSEL#
A7 INTC# B7 INTB# A38 STOP# B38 Ground
A8 +5 V B8 INTD# A39 +3.3 V B39 LOCK#
A9 Reserved B9 no connect (PRSNT1#)* A40 Reserved ** B40 PERR#
A10 +5 V (I/O) B10 Reserved A41 Reserved *** B41 +3.3 V
A11 Reserved B11 no connect (PRSNT2#)* A42 Ground B42 SERR#
A12 Ground B12 Ground A43 PAR B43 +3.3 V
A13 Ground B13 Ground A44 AD15 B44 C/BE1#
A14 +3.3 V aux B14 Reserved A45 +3.3 V B45 AD14
A15 RST# B15 Ground A46 AD13 B46 Ground
A16 +5 V (I/O) B16 CLK A47 AD11 B47 AD12
A17 GNT# B17 Ground A48 Ground B48 AD10
A18 Ground B18 REQ# A49 AD09 B49 Ground
A19 PME# B19 +5 V (I/O) A50 Key B50 Key
A20 AD30 B20 AD31 A51 Key B51 Key
A21 +3.3 V B21 AD29 A52 C/BE0# B52 AD08
A22 AD28 B22 Ground A53 +3.3 V B53 AD07
A23 AD26 B23 AD27 A54 AD06 B54 +3.3 V
A24 Ground B24 AD25 A55 AD04 B55 AD05
A25 AD24 B25 +3.3 V A56 Ground B56 AD03
A26 IDSEL B26 C/BE3# A57 AD02 B57 Ground
A27 +3.3 V B27 AD23 A58 AD00 B58 AD01
A28 AD22 B28 Ground A59 +5 V (I/O) B59 +5 V (I/O)
A29 AD20 B29 AD21 A60 REQ64C# B60 ACK64C#
A30 Ground B30 AD19 A61 +5 V B61 +5 V
A31 AD18 B31 +3.3 V A62 +5 V B62 +5 V
* These s i gnal s (in parentheses) are optional in the P CI specification and are not currently implemented.
** On PCI bus connector 2 (J4D1), t hi s pi n i s connected to the SMBus clock line.
*** On PCI bus connector 2 (J4D1), thi s pin is connected to the SMBus data line.
65
Intel® Desktop Board D815EEA Technical Product Specification
Table 41. AGP Universal Connector (J5E1)
Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name
A1 +12V B1 No Connect A34 Vcc3.3 B34 Vcc3.3
A2 TYPEDET# B2 Vcc A35 AD22 B35 AD21
A3 Reserved B3 Vcc A36 AD20 B36 AD19
A4 No Connect B4 No Connect A37 Ground B37 Ground
A5 Ground B5 Ground A38 AD18 B38 AD17
A6 INTA# B6 INTB# A39 AD16 B39 C/BE2#
A7 RST# B7 CLK A40 Vcc3.3 B40 Vcc3.3
A8 GNT1# B8 REQ# A41 FRAME# B41 IRDY#
A9 Vcc3.3 B9 Vcc3.3 A42 Reserved B42 +3.3 V aux
A10 ST1 B10 ST0 A43 Ground B43 Ground
A11 Reserved B11 ST2 A44 Reserved B44 Reserved
A12 PIPE# B12 RBF# A45 Vcc3.3 B45 Vcc3.3
A13 Ground B13 Ground A46 TRDY# B46 DEVSEL#
A14 WBF# B14 No Connect A47 STOP# B47 Vcc3.3
A15 SBA1 B15 SBA0 A48 PME# B48 PERR#
A16 Vcc3.3 B16 Vcc3.3 A49 Ground B49 Ground
A17 SBA3 B17 SBA2 A50 PAR B50 SERR#
A18 SBSTB# B18 SB_STB A51 AD15 B51 C/BE1#
A19 Ground B19 Ground A52 Vcc3.3 B52 Vcc3.3
A20 SBA5 B20 SBA4 A53 AD13 B53 AD14
A21 SBA7 B21 SBA6 A54 AD11 B54 AD12
A22 Key B22 Key A55 Ground B55 Ground
A23 Key B23 Key A56 AD9 B56 AD10
A24 Key B24 +3.3 V aux A57 C/BE0# B57 AD8
A25 Key B25 Key A58 Vcc3.3 B58 Vcc3.3
A26 AD30 B26 AD31 A59 AD_STB0# B59 AD_STB0
A27 AD28 B27 AD29 A60 AD6 B60 AD7
A28 Vcc3.3 B28 Vcc3.3 A61 Ground B61 Ground
A29 AD26 B29 AD27 A62 AD4 B62 AD5
A30 AD24 B30 AD25 A63 AD2 B63 AD3
A31 Ground B31 Ground A64 Vcc3.3 B64 Vcc3.3
A32 AD_STB1# B32 AD_STB1 A65 AD0 B65 AD1
A33 C/BE3# B33 AD23 A66 VRREFG_C B66 VREFC_G
66
Technical Reference
Table 42. Diskette Drive Connector (J8G3)
Pin Signal Name Pin Signal Name
1 Ground 2 DENSEL
3 Ground 4 Reserved
5Key 6FDEDIN
7 Ground 8 FDINDX# (Index)
9 Ground 10 FDM00# (Motor Enable A)
11 Ground 12 No connect
13 Ground 14 FDDS0# (Drive Select A)
15 Ground 16 No connect
17 No connect 18 FDDIR# (Stepper Motor Direction)
19 Ground 20 FDSTEP# (Step Pulse)
21 Ground 22 FDWD# (Write Data)
23 Ground 24 FDWE# (Write Enable)
25 Ground 26 FDTRK0# (Track 0)
27 No connect 28 FDWPD# (Write Protect)
29 Ground 30 FDRDATA# (Read Data)
31 Ground 32 FDHEAD# (Side 1 Select)
33 Ground 34 DSKCHG# (Diskette Change)
67
Intel® Desktop Board D815EEA Technical Product Specification
Table 43. PCI IDE Connectors (J8G2, Primary and J6G1, Secondary)
Pin Signal Name Pin Signal Name
1 Reset IDE 2 Ground
3 Data 7 4 Data 8
5 Data 6 6 Data 9
7 Data 5 8 Data 10
9 Data 4 10 Data 11
11 Data 3 12 Data 12
13 Data 2 14 Data 13
15 Data 1 16 Data 14
17 Data 0 18 Data 15
19 Ground 20 Key
21 DDRQ0 [DDRQ1] 22 Ground
23 I/O Write# 24 Ground
25 I/O Read# 26 Ground
27 IOCHRDY 28 P_ALE (Cable Select pul l-up)
29 DDACK0# [DDACK1#] 30 Ground
31 IRQ 14 [IRQ 15] 32 Reserved
33 DAG1 (Address 1) 34 GPIO_DMA66_Detect_Pri (GPIO_DMA66_Detect_Sec)
35 DAG0 (Address 0) 36 DAG2 (Address 2)
37 Chip Select 1P# [Chip Select 1S#] 38 Chip Select 3P# [Chip Select 3S#]
39 Activity# 40 Ground
Note: Signal names in brackets ([ ]) are for the secondary I DE connector.
68
2.8.3 External I/O Connectors
Figure 12 shows the locations of the external I/O connectors.
Technical Reference
1
A
10
7
1
2
1
15
16
1
2
CDB E
8
2
9
1
Item Description Reference Designator For more information see:
A SCSI LED J7A1 Table 46
B Auxiliary front panel power LED J8C2 Table 47
C Front panel J8C3 Table 48
D Front panel USB J8C1 Table 44
E Serial port B J8E1 Table 45
Figure 12. External I/O Connectors
OM10046
69
Intel® Desktop Board D815EEA Technical Product Specification
Table 44. Front Panel USB Connector (J8C1)
Pin Signal Name Pin Signal Name
1 VREG_FP_USB_PWR 2 VREG_FP_USB_PWR
3 ICH_U_P2# 4 ICH_U_P3#
5 ICH_U_P2 6 ICH_U_P3
7 Ground 8 Ground
9 Key (no pin) 10 ICU_U_OC1_2#
Table 45. Serial Port B Connector (J8E1)
Pin Signal Name Pin Signal Name
1 DCD2 2 Serial In# (SIN2#)
3 Serial Out# (SOUT2#) 4 DTR2
5 Ground 6 DSR2
7RTS2 8 CTS2
9 RI2 10 Key (no pin)
2.8.3.1 SCSI Hard Drive Activity LED Connector
The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows add-in
SCSI controller to use the same LED as the IDE controller. This connector can be connected to the
LED output of the add-in controller card. The LED will indicate when data is being read or written
using the add-in controller. Table 46 lists the signal names of the SCSI hard drive activity LED
connector.
Table 46. SCSI LED Connector (J7A1)
Pin Signal Name
1 SCSI activity
2 Not connected
2.8.3.2 Auxiliary Front Panel Power LED Connector
This connector duplicates the signals on pins 2 and 4 of the front panel connector.
Table 47. Auxiliary Front Panel Power LED Connector (J8C2)
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 No connect
3 HDR_BLNK_YEL Out Front panel yellow LED
70
Technical Reference
2.8.3.3 Front Panel Connector
This section describes the functions of the front panel connector. Table 48 lists the signal names
of the front panel connector.
Table 48. Front Panel Connector (J8C3)
Pin Signal In/Out Description Pin Signal In/Out Description
1 HD_PWR Out Hard disk LED pull-
up (330 Ω) to +5 V
3 HDA# Out Hard disk active LED 4 HDR_BLNK_
5 GND Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 GND Ground
9 +5 V Out IR Power 10 N/C
11 IRRX In IrDA serial input 12 GND Ground
13 GND Ground 14 (pin removed) Not connected
15 IRTX Out IrDA serial output 16 +5 V Out Power
2 HDR_BLNK_
GRN
YEL
Out Front panel green
LED
Out Front panel yellow
LED
2.8.3.3.1 Infrared Port Connector
Serial port B can be configured to support an IrDA module connected to pins 9, 11, 13, and 15.
For information about Refer to
Infrared support Section 1.7.2, page 26
Configuring serial port B for infrared applications Section 4.4.3, page 104
2.8.3.3.2 Reset Switch Connector
Pins 5 and 7 can be connected to a momentary SPST type switch that is normally open. When the
switch is closed, the D815EEA board resets and runs the POST.
2.8.3.3.3 Hard Drive Activity LED Connector
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from
or written to a hard drive. For the LED to function properly, an IDE drive must be connected to
the onboard IDE interface. The LED will also show activity for devices connected to the SCSI
hard drive activity LED connector.
For information about Refer to
The SCSI hard drive activity LED connector Section 2.8.3.1, page 70
2.8.3.3.4 Power/Sleep/Message Waiting LED Connector
Pins 2 and 4 can be connected to a single- or dual-colored LED. Table 49 shows the possible
states for a single-colored LED. Table 50 shows the possible states for a dual-colored LED.
71
Intel® Desktop Board D815EEA Technical Product Specification
Table 49. States for a Single-Colored Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Blinking Green Running/message waiting
Table 50. States for a Dual-Colored Power LED
LED State Description
Off Power off
Steady Green Running
Blinking Green Running/message waiting
Steady Yellow Sleeping
Blinking Yellow Sleeping/message waiting
✏ NOTE
To use the message waiting function, ACPI must be enabled in the operating system and a
message-capturing application must be invoked.
2.8.3.3.5 Power Switch Connector
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must
pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off.
(The time requirement is due to internal debounce circuitry on the D815EEA board.) At least two
seconds must pass before the power supply will recognize another on/off signal.
72
Technical Reference
2.9 Jumper Block
CAUTION
Do not move any jumpers with the power on. Always turn off the power and unplug the power
cord from the computer before changing a jumper setting. Otherwise, the board could be
damaged.
Figure 13 shows the location of the jumper block. This 3-pin jumper block determines the BIOS
Setup program’s mode. Table 51 describes the jumper settings for the three modes: normal,
configure, and recovery.
When the jumper is set to configuration mode and the computer is powered-up, the BIOS
compares the CPU version and the microcode version in the BIOS and reports if the two match.
3
1
J7C1
Figure 13. Location of the Jumper Block
OM10047
73
Intel® Desktop Board D815EEA Technical Product Specification
Table 51. BIOS Setup Configuration Jumper Settings (J7B1)
Function/Mode Jumper Setting Configuration
Normal
1-2
3
1
The BIOS uses current configuration information and
passwords for booting.
Configure
Recovery
2-3
None
3
1
3
1
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
The BIOS attempts to recover the BIOS configuration. A
recovery diskette is required.
For information about Refer to
How to access the BIOS Setup program Section 4.1, page 97
The maintenance menu of the BIOS Setup program Section 4.2, page 98
BIOS recovery Section 3.7, page 91
74
Technical Reference
2.10 Mechanical Considerations
2.10.1 Form Factor
The D815EEA board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the
mechanical form factor for the D815EEA board. Dimensions are given in inches [millimeters].
The outer dimensions are 8.20 inches by 12.00 inches [208.20 millimeters by 304.80 millimeters].
Location of the I/O connectors and mounting holes are in compliance with the ATX specification
(see Section 1.3).
3.10[78.74]
0.40[10.16]
0.00
0.90[22.86]
6.10[154.94]
7.80[198.12]
0.65[16.51]
0.00
11.35[288.29]
4.90[124.46] 11.10[281.94]
OM10048
Figure 14. D815EEA Board Dimensions
75
Intel® Desktop Board D815EEA Technical Product Specification
2.10.2 I/O Shield
The back panel I/O shield for the D815EEA board must meet specific dimension and material
requirements. Systems based on this board need the back panel I/O shield to pass certification
testing. Figure 15 shows the critical dimensions of the chassis-dependent I/O shield. Dimensions
are given in inches, to a tolerance of ±0.02 inches.
These figures also indicate the position of each cutout. Additional design considerations for I/O
shields relative to chassis requirements are described in the ATX specification. See Section 1.3 for
information about the ATX specification.
NOTE
✏
An I/O shield compliant with the ATX chassis specification 2.01 is available from Intel.
6.390 Ref
[162.30]
0.157
[4.00]
0.61 Ref
[15.49]
0.94 Ref
[23.87]
0.88[22.35]
0.280
[7.10]
0.00
[0.00]
[11.43]
0.471
[11.95]
[14.43]
8x R .02 Min
[0.50]
0.39 Dia
[9.90]
0.450
0.568
0.00
[0.00]
0.442
[11.22]
0.787 ± .01 Typ.[20.00]
6.268
[159.20]
1.799
[45.68]
2.071
[52.60]
1.189
[30.20]
3.215
[81.65]
3x Dia 0.33[8.38]
4.618[117.30]
4.404
[111.85]
4.783
[121.50]
5.276
[134.00]
5.768
0.465
[11.80]
0.171[4.33]
0.321[8.14]
0.471[11.95]
0.621[15.76]
[146.50]
0.063
[1.60]
0.114
[2.90]
1.89 Ref
[48.00]
76
Pictorial
View
OM10343
Figure 15. I/O Shield Dimensions
Technical Reference
2.11 Electrical Considerations
2.11.1 Power Consumption
Table 52 and Table 53 list voltage and current measurements for a computer that contains the
D815EEA board and the following:
• 667 MHz Intel Pentium III processor with a 512 KB cache
• 128 MB SDRAM
• 3.5-inch diskette drive
• 1.6 GB ATA-33 IDE hard disk drive
• 24X IDE CD-ROM drive
This information is provided only as a guide for calculating approximate power usage with
additional resources added.
Values for the Windows 98 desktop mode are measured at 640 x 480 x 256 colors and 60 Hz
refresh rate. AC watts are measured with the computer is connected to a typical 200 W power
supply, at nominal input voltage and frequency, with a true RMS wattmeter at the line input.
✏ NOTE
Actual system power consumption depends upon system configuration. The power supply should
comply with the recommendations found in the ATX Form Factor Specification document (see
Table 3 on page 16 for specification information).
Table 52 lists the power usage for a D815EEA board with the configuration listed above and
including the basic audio subsystem and the onboard LAN subsystem.
Table 52. Power Usage For Board with Basic Audio and Onboard LAN
DC Current at:
Mode AC Power +3.3 V +5 V +12 V -12 V +5 VSB
Windows 98 APM full on 51 W 1.96 A 2.30 A 0.10 A 0.00 A 0.17 A
Windows 98 APM Suspend 35 W 1.92 A 0.58 A 0.10 A 0.00 A 0.16 A
Windows 98 ACPI S0 29 W 1.81 A 0.59 A 0.11 A 0.02 A 0.18 A
Windows 98 ACPI S1 24 W 1.77 A 0.59 A 0.11 A 0.02 A 0.18 A
Windows 98 ACPI S3 1 W 0.0 A 0.0 A 0.0 A 0 .0 A 0.31 A
Windows 98 ACPI Off 0 W 0.0 A 0.0 A 0.0 A 0.0 A 0.18 A
Table 53 lists the power usage for a D815EEA board with the configuration listed above and
including the enhanced PCI audio subsystem, but no onboard LAN subsystem.
77
Intel® Desktop Board D815EEA Technical Product Specification
Table 53. Power Usage For Board with Enhanced PCI Audio Subsystem and no Onboard
LAN subsystem
DC Current at:
Mode AC Power +3.3 V +5 V +12 V -12 V +5 VSB
Windows 98 APM full on 43 W 1.80 A 2.81 A 0.18 A 0.00 A 0.09 A
Windows 98 APM Suspend 25 W 1.72 A 0.68 A 0.18 A 0.00 A 0.09 A
Windows 98 ACPI S0 30 W 1.82 A 0.68 A 0.18 A 0.02 A 0.09 A
Windows 98 ACPI S1 25 W 1.73 A 0.68 A 0.18 A 0.02 A 0.09 A
Windows 98 ACPI S3 1 W 0.0 A 0.0 A 0.0 A 0 .0 A 0.23 A
Windows 98 ACPI Off 0 W 0.0 A 0.0 A 0.0 A 0.0 A 0.09 A
2.11.2 Add-in Board Considerations
The D815EEA board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards in a fully-loaded D815EEA board (all six expansion
slots filled) must not exceed 12 A.
2.11.3 Standby Current Requirements
CAUTION
Power supplies used with the board must provide enough standby current to support the Instantly
Available (ACPI S3 sleep state) configuration. If the standby current necessary to support
multiple wake events from the PCI and/or USB buses exceeds power supply capacity, the board
may lose register settings stored in memory and may not awaken properly.
To estimate the standby current required for a specific system configuration, the standby current
requirements of all installed components must be combined. Refer to Table 54 and follow these
steps:
1. List the board’s standby current requirement (767 mA).
2. List the PS/2 ports’ standby current requirement (see note below).
3. List, from the AGP and PCI 2.2 slots (wake enabled devices) row, the total number of wake-
enabled devices installed and multiply by the standby current requirement.
4. List, from the AGP and PCI 2.2 slots (non-wake enabled devices) row, the total number of
wake-enabled devices installed and multiply by the standby current requirement.
5. List all additional wake enabled devices’ and non-wake enabled devices’ standby current
requirements as applicable.
6. Add all the listed standby current totals from steps 1 through 5 to determine the total estimated
standby current power supply requirement.
78
Table 54. Standby Current Requirements
Instantly Available
Current Support
Requirements Description
Minimum
Optional
Note: Dependent upon system configuration. See the note on the following page.
NOTE
✏
Total for the board 767
Onboard LAN (optional) 95
WOL header connected to wake enabled PCI LAN card 525
PS/2 ports (Note) 345
AGP and PCI 2.2 slots (wake enabled devices) (Note) 375
AGP and PCI 2.2 slots (non-wake enabled devices) (Note) 20
USB ports (Note) 517.5 (max)
CNR (Note) 375
AGP and PCI requirements are calculated by totaling the following:
Technical Reference
Standby Current
Requirements (mA)
• One wake-enabled device @ 375 mA
• Five non wake-enabled devices @ 20 mA each
PS/2 Ports requirements per the IBM PS/2 Port Specification (Sept 1991):
• Keyboard @ 275 mA (Actual measurements are 220 mA-300 mA, depending on the type of
keyboard and the operational state of the keyboard’s LEDs.)
• Mouse @ 70 mA
USB requirements are calculated by totaling the following:
• One wake-enabled device @ 500 mA
• Three USB non-wake-enabled devices @ 2.5 mA each
The USB ports are limited to a combined total of 700 mA.
CNR requirements are calculated as follows:
• One wake-enabled device @ 375 mA
• Non wake-enabled devices @ 20 mA
2.11.4 Fan Connector Current Capability
The D815EEA board is designed to supply a maximum of 225 mA per fan connector.
79
Intel® Desktop Board D815EEA Technical Product Specification
2.11.5 Power Supply Considerations
CAUTION
The 5-V standby line for the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options. Refer to
Section 2.11.3 on page 78 for additional information.
System integrators should refer to the power usage values listed in Section 2.11.1, on page 77
when selecting a power supply for use with the D815EEA board.
Measurements account only for current sourced by the D815EEA board while running in idle
modes of the started operating systems.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the following recommendations found in the indicated
sections of the ATX form factor specification.
• The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
• The current capability of the +5 VSB line (Section 4.2.1.2)
• All timing parameters (Section 4.2.1.3)
• All voltage tolerances (Section 4.2.2)
For information about Refer to
The ATX form factor specification Section 1.3, page 16
2.12 Thermal Considerations
CAUTION
An ambient temperature that exceeds the board’s maximum operating temperature by 5 oC to 10 oC
could cause components to exceed their maximum case temperature and malfunction. For
information about the maximum operating temperature, see the environmental specifications in
Section 2.14.
80
Technical Reference
CAUTION
The processor voltage regulator area (item A in Figure 16) can reach a temperature of up to 85 oC
in an open chassis. System integrators should ensure that proper airflow is maintained in the
voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit.
Figure 16 shows the locations of the localized high temperature zones.
E
A
B
D
A Processor voltage regulator area
B Processor
C Intel 82815E GMCH
D Intel 82801BA ICH2
E Creative Labs ES1373 digital controller
C
OM10049
Figure 16. Localized High Temperature Zones
81
Intel® Desktop Board D815EEA Technical Product Specification
Table 55 provides maximum case temperatures for D815EEA board components that are sensitive
to thermal changes. Case temperatures could be affected by the operating temperature, current
load, or operating frequency. Maximum case temperatures are important when considering proper
airflow to cool the D815EEA board.
Table 55. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Pentium III processor
Intel Celeron processor
Intel 82815E GMCH 116 oC (under bias)
Intel 82801BA ICH2 109 oC (under bias)
Creative Labs ES1373 70 oC
For information about Refer to
Intel Pentium III processor datasheets and specification updates Section 1.2, page 16
Intel Celeron processor datasheets and specification updates Section 1.2, page 16
For processor case temperature, see processor
datasheets and processor specification updates
2.13 Reliability
The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 35 ºC.
D815EEA board MTBF: 417538 hours
82
2.14 Environmental
Table 56 lists the environmental specifications for the D815EEA board.
Table 56. D815EEA Board Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40 °C to +70 °C
Operating 0 °C to +55 °C
Shock
Unpackaged 30 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz : 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz : 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz : 0.015 g² Hz (flat)
40 Hz to 500 Hz : 0.015 g² Hz sloping down to 0.00015 g² Hz
Technical Reference
83
Intel® Desktop Board D815EEA Technical Product Specification
2.15 Regulatory Compliance
This section describes the D815EEA board’s compliance with safety and EMC regulations.
2.15.1 Safety Regulations
Table 57 lists the safety regulations the D815EEA board complies with when it is correctly
installed in a compatible host system.
Table 57. Safety Regulations
Regulation Title
UL 1950/CSA950, 3rd edition,
Dated 07-28-95
EN 60950, 2nd Edition, 1992 (with
Amendments 1, 2, 3, and 4)
IEC 950, 2nd edition, 1991 (with
Amendments 1, 2, 3, and 4)
EMKO-TSE (74-SEC) 207/94 Summary of Nordic deviations to EN 60950. (Norway, Sweden,
Bi-National Standard for Safety of Information Technology Equipment
including Electrical Business Equipment. (USA and Canada)
The Standard for Safety of Information Technology Equipment including
Electrical Business Equipment. (European Community)
The Standard for Safety of Information Technology Equipment including
Electrical Business Equipment. (International)
Denmark, and Finland)
2.15.2 EMC Regulations
Table 58 lists the EMC regulations with which the D815EEA board complies when it is correctly
installed in a compatible host system.
Table 58. EMC Regulations
Regulation Title
FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,
pertaining to unintentional radiators. (USA)
CISPR 22, 2nd Edition, 1993
(Class B)
VCCI Class B (ITE) Implementation Regulations for Voluntary Control of Radio Interference
EN55022 (1994) (Class B) Limits and methods of measurement of Radio Interference
EN50082-1 (1992) Generic Immunity Standard; currently compliance is determined via
ICES-003 (1997) Interference-Causing Equipment Standard, Digital Apparatus, Class B
AS/NZ 3548 Australian Communications Authority (ACA), Standard for
Limits and methods of measurement of Radio Interference
Characteristics of Information Technology Equipment. (International)
by Data Processing Equipment and Electronic Office Machines.
(Japan)
Characteristics of Information Technology Equipment. (Europe)
testing to IEC 801-2, -3, and -4. (Europe)
(Including CRC c.1374). (Canada)
Electromagnetic Compatibility.
84
Technical Reference
2.15.3 Certification Markings
This printed circuit assembly has the following markings related to product certification:
• UL Joint Recognition Mark: Consists of small c followed by a stylized backward UR and
followed by a small US (Component side)
• Manufacturer’s recognition mark: Consists of a unique UL recognized manufacturer’s logo,
along with a flammability rating (94V-0) (Solder side)
• UL File Number for D815EEA boards: E139761 (Component side)
• PB Part Number: Intel bare circuit board part number (Solder side) PBA10641-001
• Battery “+ Side Up” marking: located on the component side of the D815EEA board in close
proximity to the battery holder
• FCC Logo/Declaration: (Solder side)
• ACA (C-Tick) mark: Consists of a unique letter C, with a tick mark; followed by N-232.
Located on the component side of the D815EEA board and on the shipping container
• CE Mark: (Component side) The CE mark should also be on the shipping container
85
Intel® Desktop Board D815EEA Technical Product Specification
86
3 Overview of BIOS Features
What This Chapter Contains
3.1 Introduction................................................................................................................87
3.2 BIOS Flash Memory Organization............................................................................. 88
3.3 Resource Configuration............................................................................................. 88
3.4 System Management BIOS (SMBIOS)...................................................................... 89
3.5 USB Legacy Support................................................................................................. 90
3.6 BIOS Updates............................................................................................................ 90
3.7 Recovering BIOS Data.............................................................................................. 91
3.8 Boot Options.............................................................................................................. 92
®
3.9 Fast Booting Systems with I nt el
3.10 BIOS Security Features............................................................................................. 94
3.1 Introduction
The D815EEA board uses an Intel/AMI BIOS, which is stored in flash memory and can be updated
using a disk-based program. In addition to the BIOS, the flash memory contains the BIOS Setup
program, POST, APM, the PCI auto-configuration utility, and Plug and Play support.
Rapid BIOS Boot................................................... 92
The D815EEA board supports system BIOS shadowing, allowing the BIOS to execute from 64-bit
onboard write-protected DRAM.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOS is identified as EA81510A.86A.
When the D815EEA board jumper is set to configuration mode and the computer is powered-up,
the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two
match.
For information about Refer to
The D815EEA board’s compliance level with APM and Plug and Play Section 1.3, page 16
87
Intel® Desktop Board D815EEA Technical Product Specification
3.2 BIOS Flash Memory Organization
The Intel 82802AB Firmware Hub (FWH) includes a 4 Mbit (512 KB) symmetrical flash memory
device. Internally, the device is grouped into eight 64-KB blocks that are individually erasable,
lockable, and unlockable.
3.3 Resource Configuration
3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards.
Autoconfiguration lets a user insert or remove PCI cards without having to configure the system.
When a user turns on the system after adding a PCI card, the BIOS automatically configures
interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are
considered to be available for use by the add-in card.
PCI interrupts are distributed to available ISA interrupts that have not been assigned to system
resources. The assignment of PCI interrupts to ISA IRQs is non-deterministic. PCI devices can
share an interrupt, but an ISA device cannot share an interrupt allocated to PCI or to another ISA
device. Autoconfiguration information is stored in ESCD format.
For information about the versions of PCI and Plug and Play supported by the BIOS, see
Section 1.3.
3.3.2 PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the two
PCI IDE connectors with independent I/O channel support. The IDE interface supports hard drives
up to Ultra ATA-66/100 and recognizes any ATAPI devices, including CD-ROM drives, tape
drives, and Ultra DMA drives (see Section 1.3 for the supported version of ATAPI). The BIOS
determines the capabilities of each drive and configures them to optimize capacity and
performance. To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending
on the capability of the drive. You can override the auto-configuration options by specifying
manual configuration in the BIOS Setup program.
To use Ultra ATA-66/100 features the following items are required:
• An Ultra ATA-66/100 peripheral device
• An Ultra ATA-66/100 compatible cable
• Ultra ATA-66/100 operating system device drivers
NOTE
✏
Ultra ATA-66/100 compatible cables are backward compatible with drives using slower IDE
transfer protocols. If an Ultra ATA-66/100 disk drive and a disk drive using any other IDE
transfer protocol are attached to the same cable, the maximum transfer rate between the drives is
33 MB/sec.
88
Overview of BIOS Features
NOTE
✏
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For
example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the management information format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates for
system components. The MIF database defines the data and provides the method for accessing this
®
information. The BIOS enables applications such as Intel
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
LANDesk® Client Manager to use
Non-Plug and Play operating systems, such as Windows NT, require an additional interface for
obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such
operating systems. Using this support, an SMBIOS service-level application running on a nonPlug and Play operating system can obtain the SMBIOS information.
For information about Refer to
The D815EEA board’s compliance level with SMBIOS Section 1.3, page 16
89
Intel® Desktop Board D815EEA Technical Product Specification
3.5 USB Legacy Support
USB legacy support enables USB devices such as keyboards, mice, and hubs to be used even when
no operating system USB drivers are in place. USB legacy support is used in accessing the BIOS
Setup program and installing an operating system that supports USB. By default, USB legacy
support is set to Auto. The Auto setting enables USB legacy support if a supported USB device is
connected to the USB port.
This sequence describes how USB legacy support operates in the Auto (default) mode.
1. When you power up the computer, USB legacy support is disabled.
2. POST begins.
3. USB legacy support is temporarily enabled by the BIOS. This allows you to use a USB
keyboard to enter the BIOS Setup program or the maintenance mode.
4. POST completes and disables USB legacy support (unless it was set to Enabled or Auto while
in the BIOS Setup program).
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are not recognized (unless USB legacy support was set to Enabled or Auto while in the BIOS
Setup program). After the operating system loads the USB drivers, the USB devices are
recognized by the operating system.
To install an operating system that supports USB, enable USB Legacy support or set it to Auto in
the BIOS Setup program and follow the operating system’s installation instructions. Once the
operating system is installed and the USB drivers have been configured, USB legacy support is no
longer used. USB Legacy support can be left enabled or set to Auto in the BIOS Setup program if
needed.
NOTE
✏
USB legacy support is for keyboards, mice, and hubs only. Other USB devices are not supported.
3.6 BIOS Updates
A new version of the BIOS can be updated from a 1.44 MB diskette (from a legacy diskette drive
®
or an LS-120 diskette drive) or a CD-ROM using the Intel
available from Intel. This utility supports the following BIOS maintenance functions:
• Updating the flash BIOS from a file on a diskette or a CD-ROM
• Changing the language section of the BIOS
• Verifying that the updated BIOS matches the target system to prevent accidentally installing
an incompatible BIOS
• Updating the BIOS boot block
• Inserting a user logo
Flash Memory Update Utility that is
Updating the flash BIOS from a file automatically updates both the BIOS boot block and the main
BIOS. This process is fault tolerant to prevent boot block corruption. The BIOS boot block may
also be updated separately if selected in the update menu.
BIOS upgrades and the Intel Flash Memory Update Utility are available from Intel through the
Intel World Wide Web site.
90
Overview of BIOS Features
NOTE
✏
Please review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about Refer to
The Intel World Wide Web site Section 1.2, page 16
3.6.1 Language Support
The BIOS Setup program and help messages are supported in five languages: US English,
German, Italian, French, and Spanish. The default language is US English, which is present unless
another language is selected in the BIOS Setup program.
3.6.2 Custom Splash Screen
During POST, an Intel splash screen is displayed by default. This splash screen can be replaced
with a custom splash screen. A utility is available from Intel to assist with creating a custom
splash screen. The custom splash screen can be programmed into the flash memory using the
BIOS upgrade utility. Information about this capability is available on the Intel Support World
Wide Web site. See Section 1.2 for more information about this site.
3.7 Recovering BIOS Data
Some types of failure can destroy the BIOS. For example, the data can be lost if a power outage
occurs while the BIOS is being updated in flash memory. The BIOS can be recovered from a
diskette using the BIOS recovery mode. When recovering the BIOS, be aware of the following:
• Because of the small amount of code available in the non-erasable boot block area, there is no
video support. You can only monitor this procedure by listening to the speaker or looking at
the diskette drive LED.
• The recovery process may take several minutes; larger BIOS flash memory devices require
more time.
• Two beeps and the end of activity in the diskette drive indicate successful BIOS recovery.
• A series of continuous beeps indicates a failed BIOS recovery.
To create a BIOS recovery diskette, a bootable diskette must be created and the BIOS update files
copied to it. BIOS upgrades and the Intel Flash Memory Upgrade utility are available from Intel
Customer Support through the Intel World Wide Web site.
NOTE
✏
If the computer is configured to boot from an LS-120 diskette (in the Setup program’s Removable
Devices submenu), the BIOS recovery diskette must be a standard 1.44 MB diskette not a 120 MB
diskette.
91
Intel® Desktop Board D815EEA Technical Product Specification
For information about Refer to
The BIOS recovery mode jumper settings Table 51, page 12
The Boot menu in the BIOS Setup program Section 4.7, page 114
Contacting Intel customer support Section 1.2, page 16
3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives,
CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device,
the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled.
3.8.1 CD-ROM and Network Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a
boot device. Boot devices are defined in priority order. If the CD-ROM is selected as the boot
device, it must be the first device with bootable media.
The network can be selected as a boot device. This selection allows booting from a network add-in
card with a remote boot ROM installed.
For information about Refer to
The El Torito specification Section 1.3, page 16
3.8.2 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the
operating system loader is invoked even if the following devices are not present:
• Video adapter
• Keyboard
• Mouse
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot
There are three factors that affect system boot speed:
• Selecting and configuring peripherals properly
• Using an optimized BIOS, such as the Intel
• Selecting a compatible operating system
®
Rapid BIOS
The BIOS is not configured by default to boot at the fastest possible speed. Empirical
measurements have shown that some Intel
®
Desktop boards, when optimized as described above,
can complete POST (Power On Self Test) in six seconds or less and boot to an active Microsoft
†
Windows Millennium
92
(Me) operating system in 21 seconds.
Overview of BIOS Features
In addition to the appliance-like speed that benefits end users, fast booting systems can also
increase an OEMs manufacturing line throughput.
3.9.1 Peripheral Selection and Configuration
The following techniques will help speed system boot:
• Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds
to minimize hard drive startup delays. The Western Digital Caviar AA or BA series are
examples of drives that meet this parameter.
• Select a CD-ROM drive with a fast initialization rate; variations can influence POST times.
• Eliminate unnecessary features such as video-company-logo displaying, screen repaints, or
mode changes. These all add time in the boot process. The Plug and Play communication
between the video BIOS and the monitor shows time variances.
• Try different monitors. Some monitors initialize more quickly, thereby enabling the system to
boot more quickly.
3.9.2 Intel Rapid BIOS Boot
There are several BIOS settings which, if adjusted, can reduce the execution time of the POST:
• Set the hard disk drive as the first boot device. As a result, the POST will not seek a diskette
drive (saving about one second from the POST time) or a CD-ROM drive (saving about two
seconds).
• Make sure that Quiet Boot is disabled, to eliminate the logo splash screen. This could save
several seconds of painting complex graphic images and changing video modes.
• Make sure the Intel Rapid BIOS Boot option (in the Boot menu of the BIOS Setup Program) is
enabled (this is typically the default setting). This feature bypasses memory count and floppy
seek.
• Disable the LAN feature PXE (Preboot eXecutable Environment) if it will not be used. Doing
so can reduce up to four seconds of option ROM boot time.
NOTE
✏
It is possible to optimize the boot process to the point where the system boots so quickly that the
Intel Logo Screen (or a custom logo splash screen) will not be seen. Monitors and hard disk
drives with minimum initialization times can also contribute to a boot time that might be so fast
that necessary logo screens and POST messages cannot be seen. If this should occur, it is possible
to introduce a programmable delay ranging from 3 to 30 seconds using the Hard Disk Pre-Delay
feature in the IDE Configuration Submenu of the BIOS Setup Program.
For information about Refer to
IDE Configuration Submenu in the BIOS Setup Program Table 69, page 106
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Intel® Desktop Board D815EEA Technical Product Specification
3.9.3 Operating System
3.9.3.1 Selection
The Microsoft Windows Millennium Edition (Windows Me) operating system has built-in
capabilities for making PCs boot more quickly. For additional information, see the following
URL:
http://www.microsoft.com/hwdev/newpc/fast-boot.htm
3.9.3.2 Optimization
To speed operating system availability at boot time, limit the number of applications that load into
the system tray or the task bar.
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can
boot the computer. A supervisor password and a user password can be set for the BIOS Setup
program and for booting the computer, with the following restrictions:
• The supervisor password gives unrestricted access to view and change all the Setup options in
the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the BIOS Setup
program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the
BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the supervisor
password or the user password to access Setup. Users have access to Setup respective to
which password is entered.
• Setting the user password restricts who can boot the computer. The password prompt will be
displayed before the computer is booted. If only the supervisor password is set, the computer
boots without asking for a password. If both passwords are set, the user can enter either
password to boot the computer.
94
Overview of BIOS Features
Table 59 shows the effects of setting the supervisor password and user password. This table is for
reference only and is not displayed on the screen.
Table 59. Supervisor and User Password Functions
Supervisor
Password Set
Neither Can change all
Supervisor
only
User only N/A Can change all
Supervisor
and user set
Note: If no password is set , any user can change all Setup options.
Mode User Mode Setup Options
options (Note)
Can change all
options
Can change all
options
Can change all
options (Note)
Can change a
limited number
of options
options
Can change a
limited number
of options
None None None
Supervisor Password Supervisor None
Enter Password
Clear User Password
Supervisor Password
Enter Password
Password to
Enter Setup
User User
Supervisor or
user
Password
During Boot
Supervisor or
user
For information about Refer to
Setting user and supervisor passwords Section 4.5, page 112
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Intel® Desktop Board D815EEA Technical Product Specification
96
4 BIOS Setup Program
What This Chapter Contains
4.1 Introduction................................................................................................................97
4.2 Maintenance Menu.................................................................................................... 98
4.3 Main Menu............................................................................................................... 100
4.4 Advanced Menu....................................................................................................... 101
4.5 Security Menu..........................................................................................................112
4.6 Power Menu............................................................................................................ 113
4.7 Boot Menu............................................................................................................... 114
4.8 Exit Menu................................................................................................................ 116
4.1 Introduction
The BIOS Setup program can be used to view and change the BIOS settings for the computer. The
BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST)
memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
Table 60 lists the BIOS Setup program menu features.
Table 60. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Selects boot
options and
power supply
controls
✏
Clears
passwords and
BIS credentials
and enables
extended
configuration
mode
NOTE
Allocates
resources for
hardware
components
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Configures
power
management
features
In this chapter, all examples of the BIOS Setup Program menu bar include the maintenance menu;
however, the maintenance menu is displayed only when the board is in configuration mode.
Section 2.9 on page 73 tells how to put the board in configuration mode.
Saves or
discards
changes to
Setup
program
options
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Intel® Desktop Board D815EEA Technical Product Specification
Table 61 lists the function keys available for menu screens.
Table 61. BIOS Setup Program Function Keys
BIOS Setup Program Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
4.2 Maintenance Menu
To access this menu, select Maintenance on the menu bar at the top of the screen.
Maintenance
Main Advanced Security Power Boot Exit
Extended Configuration
The menu shown in Table 62 is for clearing Setup passwords and enabling extended configuration
mode. Setup only displays this menu in configuration mode. See Section 2.9 on page 73 for
configuration mode setting information.
Table 62. Maintenance Menu
Feature Options Description
Clear All Passwords No options Clears the user and administrative passwords.
Clear BIS Credentials No options Clears the Wired for Management Boot Integrity Service (BIS)
credentials.
Extended
Configuration
CPU Information No options Displays CPU Information.
CPU Microcode
Update Revision
CPU Stepping
Signature
• Default (default)
• User-Defined
No options Displays CPU’s Microcode Update Revision.
No options Displays CPU’s Stepping Signature.
Invokes the Extended Configuration submenu.
98
4.2.1 Extended Configuration Submenu
To access this submenu, select Maintenance on the menu bar, then Extended Configuration.
BIOS Setup Program
Maintenance
Main Advanced Security Power Boot Exit
Extended Configuration
The submenu represented by Table 63 is for setting video memory cache mode. This submenu
becomes available when User Defined is selected under Extended Configuration.
Table 63. Extended Configuration Submenu
Feature Options Description
Extended Configuration
Video Memory Cache Mode • USWC
SDRAM Auto-Configuration
CAS# Latency • 3
SDRAM RAS# to CAS#
Delay
SDRAM RAS# Precharge • 3
• Default
(default)
• User-Defined
• UC (default)
• Auto
(default)
• User Defined
• 2
• Auto
(default)
• 3
• 2
• Auto
(default)
• 2
• Auto
(default)
User Defined allows setting memory control and video
memory cache mode. If selected here, will also display in
the Advanced Menu as: “Extended Menu:
Selects Uncacheable Speculative Write-Combining
(USWC) video memory cache mode. Full 32 byte contents
of the Write Combining buffer are written to memory as
required. Cache lookups are not performed. Both the
video driver and the application must support Write
Combining.
Selects UnCacheable (UC) video memory cache mode.
This setting identifies the video memory range as
uncacheable by the processor. Memory writes are
performed in program order. Cache lookups are not
performed. Well suited for applications not supporting
Write Combining.
Sets extended memory configuration options to auto or
user defined.
Selects the number of clock cycles required to address a
column in memory.
Selects the number of clock cycles between addressing a
row and addressing a column.
Selects the length of time required before accessing a new
row.
Used
.”
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Intel® Desktop Board D815EEA Technical Product Specification
4.3 Main Menu
To access this menu, select Main on the menu bar at the top of the screen.
Maintenance
Main
Advanced Security Power Boot Exit
Table 64 describes the Main Menu. This menu reports processor and memory information and is
for configuring the system date and system time.
Table 64. Main Menu
Feature Options Description
BIOS Version No options Displays the version of the BIOS.
Processor Type No options Displays processor type.
Processor Speed No options Displays processor speed.
System Bus
Frequency
Cache RAM No options Displays the size of second-level cache and whether it is
Total Memory No options Displays the total amount of RAM.
Memory Bank 0
Memory Bank 1
Memory Bank 2
Language • English (default)
Processor Serial
Number
System Time Hour, minute, and
System Date Day of week
No options Displays the system bus frequency.
ECC-capable.
No options Displays the amount and type of RAM in the memory
banks
Selects the current default language used by the BIOS.
• Espanol
• Deutsch
• Disabled (default)
• Enabled
second
Month/day/year
Enables and disables the processor serial number.
(Present only when a Pentium III processor is installed)
Specifies the current time.
Specifies the current date.
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