Intel D810EMO, MO810E User Manual
Intel® Desktop Board
D810EMO/MO810E
Technical Product Specification
February 2000
Order Number A00653-001
The Intel® Desktop Board D810EMO/MO810E may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D810EMO/MO810E Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D810EMO/MO810E Technical
Product Specification
This product specification applies to only standard D810EMO/MO810E boards with BIOS
identifier MO81010A.86A.
Changes to this specification will be published in the Intel Desktop Board D810EMO/MO810E
Specification Update before being incorporated into a revision of this document.
February 2000
Information in this doc um ent is provided in connecti on wi th Intel® products. No license, express or implied, by es toppel or
otherwise, to any intell ectual property rights is granted by this document. E xcept as provided in Int el ’s Terms and
Conditions of Sale for such products, Intel assumes no liability whatsoever, and I nt el disclaims any express or implied
warranty, relating to sale and/or use of I ntel products including liability or warranties relat i ng t o fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel produc ts are not
intended for use in medical, l i f e saving, or life sustaining applications.
Intel may make changes t o specifications and product descriptions at any time, without noti ce.
The D810EMO/MO810E board may cont ai n des i gn defects or errors known as errat a t hat may cause the product to deviate
from published specifi c ations. Current characteri z ed errata are available on request.
Contact your local Int el sales office or your dis tributor to obtain the lates t specifications before placing your product order.
Copies of documents whic h hav e an orderi ng number and are referenced in this document , or other Intel literature, m ay be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
†
All other brands and names are the property of their respective owners.
Copyright 2000, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the D810EMO/MO810E desktop board.
It describes the standard product and available manufacturing options.
The D810EMO desktop board is known in some documentation and sales collateral as the
MO810E. Both names refer to the same product.
Intended Audience
The TPS is intended to provide detailed, technical information about the board and its components
to the vendors, system integrators, and other engineers and technicians who need this level of
information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on this board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
✏
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions that, if not observed, can cause personal injury.
iii
Intel Desktop Board D810EMO/MO810E Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the board, and X is the instance of the particular part at that
general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the
5J area.
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
GB Gigabyte (1,073,741,824 bytes)
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
†
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview ................................................................................................................... 10
1.1.1 Feature Summary ....................................................................................... 10
1.1.2 Board Layout............................................................................................... 11
1.1.3 Block Diagram............................................................................................. 12
1.2 Online Support........................................................................................................... 13
1.3 Design Specifications ................................................................................................ 13
1.4 Processor..................................................................................................................16
1.5 System Memory......................................................................................................... 17
®
1.6 Intel
1.7 I/O Controller............................................................................................................. 21
1.8 Serial Debug Port......................................................................................................21
1.9 Graphics Subsystem ................................................................................................. 22
1.10 Audio Subsystem....................................................................................................... 23
1.11 Hardware Monitor Component................................................................................... 24
1.12 LAN Subsystem......................................................................................................... 25
1.13 Power Management Features.................................................................................... 27
810E Chipset................................................................................................... 18
1.6.1 Direct AGP.................................................................................................. 19
1.6.2 USB............................................................................................................. 19
1.6.3 IDE Support................................................................................................. 20
1.6.4 Real-Time Clock, CMOS SRAM, and Battery .............................................. 20
1.10.1 Creative Sound Blaster AudioPCI 128V ...................................................... 23
1.10.2 Creative ES1373D Digital Audio Controller..................................................23
1.10.3 Crystal Semiconductor CS4297A Analog Codec......................................... 23
1.10.4 Audio Connectors........................................................................................ 24
®
1.12.1 Intel
1.12.2 LAN Subsystem Software............................................................................26
1.12.3 RJ-45 LAN Connector LEDs........................................................................ 26
1.13.1 ACPI............................................................................................................ 27
1.13.2 Hardware Support....................................................................................... 29
82559 PCI LAN Controller ................................................................. 25
2 Technical Reference
2.1 Introduction................................................................................................................33
2.2 Memory Map ............................................................................................................. 33
2.3 I/O Map ..................................................................................................................... 34
2.4 DMA Channels .......................................................................................................... 35
2.5 PCI Configuration Space Map ................................................................................... 36
2.6 Interrupts...................................................................................................................36
2.7 PCI Interrupt Routing Map......................................................................................... 37
2.8 Connectors................................................................................................................ 38
2.8.1 Back Panel I/O Connectors......................................................................... 39
2.8.2 Internal I/O Connectors............................................................................... 41
2.8.3 External I/O Connectors.............................................................................. 46
v
Intel Desktop Board D810EMO/MO810E Technical Product Specification
2.9 Jumper Block............................................................................................................. 49
2.10 Mechanical Considerations........................................................................................ 51
2.10.1 FlexATX Form Factor.................................................................................. 51
2.10.2 I/O Shield .................................................................................................... 52
2.11 Electrical Considerations........................................................................................... 53
2.11.1 Add-in Board Considerations....................................................................... 53
2.11.2 Power Consumption.................................................................................... 53
2.11.3 Power Supply Considerations......................................................................54
2.11.4 Fan Power Requirements............................................................................ 54
2.12 Thermal Considerations............................................................................................. 55
2.13 Reliability................................................................................................................... 56
2.14 Environmental............................................................................................................ 57
2.15 Regulatory Compliance............................................................................................. 58
2.15.1 Safety Regulations...................................................................................... 58
2.15.2 EMC Regulations........................................................................................ 58
2.15.3 Certification Markings.................................................................................. 59
3 Overview of BIOS Features
3.1 Introduction................................................................................................................61
3.2 BIOS Flash Memory Organization............................................................................. 62
3.3 Resource Configuration............................................................................................. 62
3.3.1 PCI Autoconfiguration................................................................................. 62
3.3.2 PCI IDE Support.......................................................................................... 63
3.4 System Management BIOS (SMBIOS)...................................................................... 64
3.5 BIOS Upgrades ......................................................................................................... 65
3.5.1 Language Support....................................................................................... 65
3.5.2 Custom Splash Screen................................................................................ 65
3.6 Recovering BIOS Data.............................................................................................. 66
3.7 Boot Options.............................................................................................................. 67
3.7.1 CD-ROM and Network Boot........................................................................ 67
3.7.2 Booting Without Attached Devices.............................................................. 67
3.8 USB Legacy Support................................................................................................. 68
3.9 BIOS Security Features............................................................................................. 69
4 BIOS Setup Program
4.1 Introduction................................................................................................................71
4.2 Maintenance Menu.................................................................................................... 72
4.2.1 Extended Configuration Submenu............................................................... 73
4.3 Main Menu................................................................................................................. 74
4.4 Advanced Menu......................................................................................................... 75
4.4.1 Boot Configuration Submenu ...................................................................... 76
4.4.2 Peripheral Configuration Submenu.............................................................. 77
4.4.3 IDE Configuration Submenu ........................................................................ 78
4.4.4 Event Log Configuration .............................................................................. 81
4.4.5 Video Configuration..................................................................................... 82
vi
4.5 Security Menu............................................................................................................83
4.6 Power Menu.............................................................................................................. 84
4.7 Boot Menu................................................................................................................. 85
4.8 Exit Menu.................................................................................................................. 87
5 Error Messages and Beep Codes
5.1 BIOS Error Messages................................................................................................ 89
5.2 Port 80h POST Codes............................................................................................... 91
5.3 Bus Initialization Checkpoints.................................................................................... 95
5.4 Speaker.....................................................................................................................96
5.5 BIOS Beep Codes..................................................................................................... 97
Figures
1. Board Components.................................................................................................... 11
2. Block Diagram........................................................................................................... 12
3. Intel 810E Chipset Block Diagram............................................................................. 18
4. Back Panel I/O Connectors ....................................................................................... 39
5. Internal I/O Connectors ............................................................................................. 41
6. External I/O Connectors ............................................................................................ 46
7. Location of the Jumper Block .................................................................................... 49
8. Board Dimensions..................................................................................................... 51
9. I/O Shield Dimensions............................................................................................... 52
10. High Temperature Zones........................................................................................... 55
11. Memory Map of the Flash Memory Device................................................................ 62
Contents
Tables
1. Feature Summary...................................................................................................... 10
2. Specifications ............................................................................................................ 13
3. Processors Supported by the Board.......................................................................... 16
4. System Memory Configuration................................................................................... 17
5. Supported Graphics Refresh Rates........................................................................... 22
6. LAN Connector LED States....................................................................................... 26
7. Effects of Pressing the Power Switch........................................................................ 27
8. Power States and Targeted System Power............................................................... 28
9. Wake Up Devices and Events................................................................................... 29
10. Fan Connector Descriptions...................................................................................... 30
11. System Memory Map................................................................................................. 33
12. I/O Map ..................................................................................................................... 34
13. DMA Channels .......................................................................................................... 35
14. PCI Configuration Space Map ................................................................................... 36
15. Interrupts...................................................................................................................36
16. PCI Interrupt Routing Map......................................................................................... 37
17. USB Connectors ........................................................................................................ 40
18. VGA Port Connector.................................................................................................. 40
19. LAN Connector.......................................................................................................... 40
20. Audio Line Out Connector ......................................................................................... 40
vii
Intel Desktop Board D810EMO/MO810E Technical Product Specification
21. Mic In Connector ....................................................................................................... 40
22. Chassis Fan Connector (J2J1) .................................................................................. 42
23. Processor Fan Connector (J7J1)............................................................................... 42
24. Primary IDE Connector (J7E1).................................................................................. 42
25. Slimline IDE Connector (J8E1).................................................................................. 43
26. Serial Debug Port Connector (J7C1)......................................................................... 43
27. Power Connector (J8B1) ........................................................................................... 44
28. PCI Bus Connector (J4B1) ........................................................................................ 45
29. ATAPI CD-ROM Connector (J2D1) ........................................................................... 45
30. USB Port Connector (J7A1)....................................................................................... 47
31. Front Panel Connector (J8C1)................................................................................... 47
32. States for a Single-colored Power LED...................................................................... 48
33. States for a Dual-colored Power LED........................................................................ 48
34. BIOS Setup Configuration Jumper Settings (J8F1).................................................... 50
35. Power Usage............................................................................................................. 53
36. Chassis Fan (J3A2) DC Power Requirements........................................................... 54
37. Thermal Considerations for Components .................................................................. 56
38. Board Environmental Specifications.......................................................................... 57
39. Safety Regulations .................................................................................................... 58
40. EMC Regulations....................................................................................................... 58
41. Supervisor and User Password Functions................................................................. 69
42. BIOS Setup Program Menu Functions....................................................................... 71
43. BIOS Setup Program Function Keys ......................................................................... 72
44. Maintenance Menu.................................................................................................... 72
45. Extended Configuration Submenu............................................................................. 73
46. Main Menu................................................................................................................. 74
47. Advanced Menu......................................................................................................... 75
48. Boot Configuration Submenu..................................................................................... 76
49. Peripheral Configuration Submenu............................................................................ 77
50. IDE Configuration Submenu...................................................................................... 78
51. Primary/Secondary IDE Master/Slave Submenus...................................................... 79
52. Event Log Configuration Submenu............................................................................ 81
53. Video Configuration Submenu................................................................................... 82
54. Security Menu............................................................................................................83
55. Power Menu.............................................................................................................. 84
56. Boot Menu................................................................................................................. 85
57. Exit Menu.................................................................................................................. 87
58. BIOS Error Messages................................................................................................ 89
59. Uncompressed INIT Code Checkpoints..................................................................... 91
60. Boot Block Recovery Code Checkpoints ................................................................... 91
61. Runtime Code Uncompressed in F000 Shadow RAM ............................................... 92
62. Bus Initialization Checkpoints.................................................................................... 95
63. Upper Nibble High Byte Functions............................................................................. 95
64. Lower Nibble High Byte Functions............................................................................. 96
65. Beep Codes............................................................................................................... 97
viii
1 Product Description
What This Chapter Contains
1.1 Overview ................................................................................................................... 10
1.2 Online Support........................................................................................................... 13
1.3 Design Specifications ................................................................................................ 13
1.4 Processor.................................................................................................................. 16
1.5 System Memory......................................................................................................... 17
®
1.6 Intel
1.7 I/O Controller............................................................................................................. 21
1.8 Serial Debug Port...................................................................................................... 21
1.9 Graphics Subsystem ................................................................................................. 22
1.10 Audio Subsystem....................................................................................................... 23
1.11 Hardware Monitor Component................................................................................... 24
1.12 LAN Subsystem......................................................................................................... 25
1.13 Power Management Features.................................................................................... 27
810E Chipset................................................................................................... 18
9
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the D810EMO/MO810E board’s major features.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Direct AGP Video
Audio
I/O Controller
Peripheral
Interfaces
Serial Debug
Port
Expansion
capabilities
Management
Level 4 Support
Instantly
Available PC
BIOS
FlexATX (9.0 inches by 7.5 inches)
Support for either an Intel
(FC-PGA) package or an Intel® Celeron™ processor in an FCPGA package or a PPGA
package
• One 168-pin dual inline memory module (DIMM) socket
• Supports up to 256 MB of 100 MHz non-ECC synchronous DRAM (SDRAM)
• Support for serial presence detect (SPD) and non-SPD DIMMs
Intel® 810E chipset, consisting of:
®
• Intel
• Intel
• Intel
• Intel 82810E DC-133 GMCH
• 4 MB of display cache
• VGA port connector on back panel
Audio Codec ’97 (AC ’97) compatible audio subsystem, consisting of the foll owing:
• Creative Sound Blaster
• Crystal Semiconductor CS4297A analog codec
SMSC LPC47M102 SIO low pin count (LPC) interface I/O controller
• Up to four universal serial bus (USB) ports
• Two IDE interfaces with Ultra DMA support
One 9-pin stake-pin serial debug port connector
One PCI bus connector at PCI slot 5 location
• Intel
• Hardware monitor
• Support for
• Suspend-to-RAM support
• Wake on USB ports
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
82810E DC-133 Graphics/Memory Controller Hub (GMCH)
®
82801AA I/O Controller Hub (ICH)
®
82802AB 4 Mbit Firmware Hub (FWH)
®
82559 local area network (LAN) controller
PCI Local Bus Specification
®
/AMI BIOS stored in an Intel 82802AB 4 Mbit firmware hub (FWH)
and SMBIOS
®
Pentium® III processor in a Flip Chip Pin Grid Array
†
AudioPCI 128V digital audio controller (ES1373D)
, Revision 2.2
NOTE
✏
The D810EMO/MO810E board is designed to support only USB-aware operating systems.
10
For information about Refer to
The board’s compliance level with ACPI, Plug and Play, and SMBIOS Table 2, page 13
1.1.2 Board Layout
Figure 1 shows the location of the major components on the board.
Q
Product Description
DA B C
P
E
O
N
F
M
L
G
K J I H
OM08923
A Crystal Semiconductor CS4297A codec J Front panel connector
B Creative ES1373D digital audio controller K Power connector
C 4 MB display cache L SMSC LPC47M102 I/O controller
D Back panel I/O connectors M Intel 82801AA ICH
E Intel 82810E DC-133 GMCH N Intel 82559 PCI LAN Controller
F Processor socket O Speaker
G DIMM socket P Battery
H Primary IDE connector Q PCI bus connector
I Slimline Secondary IDE connector
Figure 1. Board Components
11
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Primary/
PPGA370
Processor
Socket
Secondary IDE
Interface
66/100/133
MHz Host Bus
810E Chipset
ATA33/66
USB
Hub
Port 0USB
Port 1
Port 2
Port 3
DIMM
Socket
VGA
Port
10/100
Ethernet
100 MHz
SDRAM
Bus
Mbps
Display
Interface
82810E
Graphics Memory
Controller Hub
(GMCH)
Hardware
Monitor
LAN
Subsystem
AHA
Bus
4 MB
Display
Cache
SMBus
PCI Bus
82801AA I/O Controller Hub
(ICH)
PCI Bus
PCI Bus
PCI Bus
Connector
LPC
Bus
LPC I/O
Controller
AC ’97 Link
Firmware Hub
Digital
Controller
Analog
Codec
82802AB
(FWH)
Serial Port
CD-ROM
Line Out
Mic In
12
OM09093
Figure 2. Block Diagram
Product Description
1.2 Online Support
Find information about Intel® desktop boards under “Product Info” or “Customer Support” at these
World Wide Web sites:
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
1.3 Design Specifications
Table 2 lists the specifications applicable to the D810EMO/MO810E board.
Table 2. Specifications
Reference
Name
AC ‘97
ACPI
AGP
AMI BIOS
ATA-3
ATAPI
ATX
El Torito Bootable CD-ROM format
FlexATX FlexATX Addendum to the
Specification
Title
Audio Codec ‘97
Advanced Configuration
and Power Interface
Specification
Accelerated Graphics Port
Interface Specification
American Megatrends
BIOS Specification
Information Technology AT Attachment-3 Interface,
X3T10/2008D
Information Technology
AT Attachment with Packet
Interface Extensions
T13/1153D
ATX Specification
specification
microATX Specification
(2X only)
Version, Revision Date,
and Ownership
Version 2.1,
May 1998,
Intel Corporation.
Version 1.0,
July 1, 1998,
Intel Corporation,
Microsoft Corporation,
and Toshiba Corporation.
Version 2.0,
May 4, 1998,
Intel Corporation.
AMIBIOS 99,
June 1999,
American Megatrends, Inc.
Version 6 ATA Anonymous FTP Site:
Version 18
August 13, 1998,
Contact: T13 Chair,
Seagate Technology
Version 2.01,
February 1997,
Intel Corporation.
Version 1.0,
January 25, 1995,
Phoenix Technologies Ltd.,
and IBM Corporation.
Version 1.0 http://www.teleport.com/~ffsupprt
This specification is
available at:
ftp://download.intel.com/
pc-supp/platform/ac97
http://www.teleport.com/~acpi/
the Accelerated Graphics
Implementers Forum at:
http://www.agpforum.org/
http://www.ami.com/amibios/
bios.platforms.desktop.html
ftp://fission.dt.wdc.com
T13 Anonymous FTP Site:
ftp://fission.dt.wdc.com/
x3t13/project/d1153r18.pdf
http://download.intel.com/
design/motherbd/atx.htm
the Phoenix Technologies web
site at:
http://www.ptltd.com/techs/
specs.html
/spec/FlexATXaddn1_01.pdf
continued
13
Intel Desktop Board D810EMO/MO810E Technical Product Specification
Table 2. Specifications (continued)
Reference
Name
†
IrDA
LPC
MicroATX
PCI
Plug and
Play
SDRAM
DIMMs
(64-and
72-bit)
SMBIOS
Specification
Title
Serial Infrared Physical
Layer Link Specification
Low Pin Count Interface
Specification
microATX Motherboard
Interface Specification
SFX Power Supply
Design Guide
PCI Local Bus
Specification
PCI Bus Power
Management Interface
Specification
Plug and Play BIOS
Specification
PC SDRAM Unbuffered
DIMM Specification
PC Serial Presence
Detect (SPD)
Specification
System Management
BIOS
Version, Revision Date, and
Ownership
Version 1.1, October 17, 1995
Infrared Data Association
Phone: (510) 943-6546
Fax: (510) 943-5600
Version 1.0,
September 29, 1997,
Intel Corporation.
Version 1.0,
December 1997
Intel Corporation
Version 1.1,
February 1998
Intel Corporation
Version 2.2,
December 18, 1998,
PCI Special Interest Group.
Version 1.1,
December 18, 1998,
PCI Special Interest Group.
Version 1.0a,
May 5, 1994,
Compaq Computer Corp.,
Phoenix Technologies Ltd.,
and Intel Corporation.
Revision 1.0,
February 1998,
Intel Corporation.
Revision 1.2A,
December 1997,
Intel Corporation
Version 2.3,
August 12, 1998,
Award Software International Inc.,
Dell Computer Corporation,
Hewlett-Packard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
American Megatrends Inc.,
and SystemSoft Corporation.
This specification is
available at:
E-mail: irda@netcom.com
http://www.intel.com/
design/chipsets/industry/
lpc.htm
http://www/teleport.com/
~ffsupprt/spec/
microatxspecs.htm
http://www/teleport.com/
~ffsupprt/spec/
microatxspecs.htm
http://www.pcisig.com/
http://www.pcisig.com/
ftp://download.intel.com/
ial/wfm/bio10a.pdf
http://www.intel.com/
design/chipsets/memory/
sdram.htm#S1
http://www.intel.com/
design/chipsets/memory/
sdram.htm#S1
http://developer.intel.com/
ial/wfm/design/smbios
continued
14
Table 2. Specifications (continued)
Reference
Name
UHCI
USB
WfM
Specification
Title
Universal Host Controller
Interface Design Guide
Universal Serial Bus
Specification
Wired for Management
Baseline
Version, Revision Date, and
Ownership
Version 1.1,
March 1996,
Intel Corporation.
Version 1.1,
September 23, 1998,
Compaq Computer Corporation,
Intel Corporation, Microsoft
Corporation, and NEC.
Version 2.0,
December 18, 1998,
Intel Corporation
Product Description
This specification is
available at:
This guide is available at:
http://www.usb.org/
developers
http://www.usb.org/
developers/docs.html
http://developer.intel.com/
ial/WfM/wfmspecs.htm
15
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.4 Processor
CAUTION
The board supports processors that draw a maximum of 22 amps. Using a processor that draws
more than 22 amps can damage the processor, the board, and the power supply. See the
processor’s data sheet for current usage requirements.
The board supports the processors listed in Table 3. The host bus frequency is automatically
selected.
Table 3. Processors Supported by the Board
Processor Type Processor Speed Host Bus Frequency L2 Cache Size
600EB MHz 133 MHz 256 KBPentium III processor
600E MHz
550E MHz
500E MHz
Celeron processor 533 MHz
500 MHz
466 MHz
433 MHz
400 MHz
366 MHz
100 MHz
100 MHz
100 MHz
66 MHz
66 MHz
66 MHz
66 MHz
66 MHz
66 MHz
256 KB
256 KB
256 KB
128 KB
128 KB
128 KB
128 KB
128 KB
128 KB
All supported onboard memory can be cached, up to the cachability limit of the processor.
For information about Refer to
Processor support for the D810EMO/MO810E
board
Processor data sheets http://www.intel.com/design/litcentr
http://support.intel.com/support/motherboards/desktop
16
Product Description
1.5 System Memory
CAUTION
To be fully compliant with all applicable Intel® SDRAM memory specifications, the board should
be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your
memory modules do not support SPD, you will see a notification to this effect on the screen at
power up. The BIOS will attempt to configure the memory controller for normal operation;
however, DIMMs may not function at the determined frequency.
CAUTION
Because the main system memory is also used as video memory, the board requires a 100 MHz
SDRAM DIMM even though the host bus frequency is 66 MHz. It is highly recommended that an
SPD DIMM be used, since this allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory is installed,
the BIOS will attempt to correctly configure the memory settings, but performance and reliability
may be impacted.
The board has one DIMM socket. The minimum memory size is 32 MB and the maximum
memory size is 256 MB. The BIOS automatically detects memory type, size, and frequency.
The board supports the following memory features:
• 3.3 V, 168-pin DIMM with gold-plated contacts
• 100 MHz SDRAM
• Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires an SPD DIMM)
• Non-ECC (64-bit) memory
• Unbuffered single- or double-sided DIMM
The board is designed to support the DIMM configurations listed in Table 4 below.
Table 4. System Memory Configuration
DIMM Size Non-ECC Configuration
32 MB 4 Mbit x 64
64 MB 8 Mbit x 64
128 MB 16 Mbit x 64
256 MB (Note) 32 Mbit x 64
Note: A 256 MB DIMM used with this board must be built with 128 Mbit device technol ogy.
For information about Refer to
The
PC Serial Presence Detect Specification
Obtaining copies of PC SDRAM specifications http://www.intel.com/design/pcisets/memory
Table 2, page 13
17
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.6 Intel® 810E Chipset
The Intel 810E chipset consists of the following devices:
• 82810E DC-133 Graphics Memory Controller Hub (GMCH) with accelerated hub architecture
(AHA) bus
• 82801AA I/O Controller Hub (ICH) with AHA bus
• 82802AB Firmware Hub (FWH)
The chipset provides the host, memory, display, and I/O interfaces shown in Figure 3.
66/100/133 MHz
Host Bus
ATA33/66 USB
810E Chipset
100 MHz
SDRAM
Bus
Display
Interface
82810E
Graphics Memory
Controller Hub
(GMCH)
AHA
Bus
82801AA I/O Controller Hub
(ICH)
SMBus
PCI Bus
AC Link
Figure 3. Intel 810E Chipset Block Diagram
For information about Refer to
The Intel 810E chipset http://developer.intel.com
The resources used by the chipset Chapter 2
The chipset’s compliance with ACPI and AC ‘97 Table 2, page 13
82802AB
Firmware Hub
(FWH)
LPC Bus
OM09130
18
Product Description
1.6.1 Direct AGP
Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for
graphics-intensive applications, such as 3-D applications. AGP overcomes certain limitations of
the PCI bus related to handling large amount of graphics data with the following features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for nearly 100 percent bus efficiency
For information about Refer to
The location of the VGA port connector Figure 4, page 39
Obtaining the
Accelerated Graphics Port Interface Specification
Table 2, page 13
1.6.2 USB
The board supports up to four USB ports; one USB peripheral can be connected to each port. For
more than four USB devices, an external hub can be connected to any of the ports. Two USB ports
are implemented with stacked back panel connectors. The other two ports can be routed from the
connector at location J7A1 via a cable to the front panel. The board fully supports UHCI and uses
UHCI-compatible software drivers. USB features include:
• Support for self-identifying peripherals that can be connected or disconnected while the
computer is running
• Automatic mapping of function to driver and configuration
• Support for isochronous and asynchronous transfer types over the same set of wires
• Support for up to 127 physical devices
• Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other
applications
• Error-handling and fault-recovery mechanisms built into the protocol
NOTE
✏
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 4, page 39
The signal names of the USB connectors Table 17, page 40
The location of the USB port connector for the front panel Figure 6, page 46
The signal names for the USB port connector for the front panel Table 30, page 47
The USB and UHCI specifications Table 2, page 13
19
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.6.3 IDE Support
The board has two independent bus-mastering IDE interfaces. These interfaces support:
• ATAPI devices (such as CD-ROM drives)
• ATA devices using the transfer modes listed in Table 51 on page 79
The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The board supports laser servo (LS-120) diskette technology through its IDE interfaces. The
LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu
to one of the following:
• ARMD-FDD (ATAPI removable media device – floppy disk drive)
• ARMD-HDD (ATAPI removable media device – hard disk drive)
The board has two IDE interface connectors. The primary IDE connector is a standard 40-pin IDE
interface. The secondary IDE connector is a 50-pin Slimline IDE connector, intended for use with
devices such as 2.5-inch hard disk drives and mobile CD-ROM drives. The Slimline IDE
connector has the standard IDE interface pins but also includes audio and power signals.
For information about Refer to
The location of the IDE connectors Figure 5, page 41
The signal names of the primary IDE connector Table 24, page 42
The signal names of the Slimline secondary IDE connector Table 25, page 43
BIOS Setup program’s Boot menu Table 56, page 85
1.6.4 Real-Time Clock, CMOS SRAM, and Battery
The real-time clock is compatible with DS1287 and MC146818 components. The clock provides a
time-of-day clock and a multicentury calendar with alarm features and century rollover. The
real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved
for BIOS use.
A coin-cell battery powers the real-time clock and CMOS memory. When the computer is not
plugged into a wall socket, the battery has an estimated life of three years. When the computer is
plugged in, the 3.3 V standby current from the power supply extends the life of the battery. The
clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values
can be returned to their defaults by using the BIOS Setup program.
NOTE
✏
If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS
RAM at power on.
20
Product Description
NOTE
✏
The recommended method of accessing the date in systems with Intel desktop boards is indirectly
from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel desktop boards contains a
century checking and maintenance feature. This feature checks the two least significant digits of
the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than
80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature
enables operating systems and applications using the BIOS date/time services to reliably
manipulate the year as a four-digit value.
For information about Refer to
Proper date access in systems with Intel de sktop boards http://support.intel.com/support/year2000/
1.7 I/O Controller
The SMSC LPC47M102 I/O controller provides the following features:
• Low pin count (LPC) interface
• One serial port
• Infrared (IrDA) interface
• Intelligent power management, including a programmable wake up event interface
• Fan control:
One pulse width modulation (PWM) fan speed control output
One fan tachometer input
The BIOS Setup program provides configuration options for the I/O controller.
For information about Refer to
SMSC LPC47M102 I/O controller http://www.smsc.com
The IrDA interface Section 2.8.3, page 46
1.8 Serial Debug Port
The board has one 9-pin serial debug port connector. The serial debug port’s
NS16C550-compatible UART supports data transfers at rates of up to 115.2 kbits/sec with BIOS
support. The serial debug port can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or
COM4 (2E8h).
For information about Refer to
The location of the serial debug port connector Figure 5, page 41
The signal names of the serial debug port connector Table 26, page 43
21
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.9 Graphics Subsystem
The Intel 82810E DC-133 GMCH graphics memory controller hub component provides the
following graphics support features:
• Integrated 2-D and 3-D graphics engines
• Integrated hardware motion compression engine
• Integrated 230 MHz DAC
Table 5 lists the refresh rates supported by graphics subsystem.
Table 5. Supported Graphics Refresh Rates
Resolution Color Palette Available Refresh Frequencies (Hz)
640 x 480
720 x 480
720 x 576
800 x 600
1024 x 768
1152 x 864
1280 x 1024
1600 x 1200 256 colors 60, 70, 72, 75, 85
16 colors 60, 70, 72, 75, 85
256 colors 60, 70, 72, 75, 85
64 K colors 60, 70, 72, 75, 85
16 M colors 60, 70, 72, 75, 85
256 colors 75, 85
64 K colors 75, 85
16 M colors 75, 85
256 colors 60, 75, 85
64 K colors 60, 75, 85
16 M colors 60, 75, 85
256 colors 60, 70, 72, 75, 85
64 K colors 60, 70, 72, 75, 85
16 M colors 60, 70, 72, 75, 85
256 colors 60, 70, 72, 75, 85
64 K colors 60, 70, 72, 75, 85
16 M colors 60, 70, 72, 75, 85
256 colors 60, 70, 72, 75, 85
64 K colors 60, 70, 72, 75, 85
16 M colors 60, 70, 72, 75, 85
256 colors 60, 70, 72, 75, 85
64 K colors 60, 70, 72, 75, 85
16 M colors 60, 70, 75, 85
22
For information about Refer to
Obtaining graphics software and utilities http://support.intel.com/support/motherboards/desktop
Product Description
1.10 Audio Subsystem
The Audio Codec ’97 (AC ’97) compatible audio subsystem includes these features:
• Split digital/analog architecture for improved signal-to-noise ratio (≥ 85 dB) measured at line
out, from any analog input, including line in, and CD-ROM
• 3-D stereo enhancement
• Power management support for ACPI 1.0a
The audio subsystem consists of these devices:
• Creative Sound Blaster AudioPCI 128V
• Crystal Semiconductor CS4297A stereo audio codec
• Audio connectors
For information about Refer to
Obtaining audio software and utilities Section 1.2, page 13
1.10.1 Creative Sound Blaster AudioPCI 128V
The Creative Sound Blaster AudioPCI 128V features:
• Creative ES1373D digital audio controller
• Interfaces to the PCI bus as a Plug and Play device
• 100% DOS legacy compatible
• Access to main memory (through the PCI bus) for wavetable synthesis support – does not
require a separate wavetable ROM device
• Conforms to the PC 98 and PC 99 design guides
For information about Refer to
Creative Sound Blaster AudioPCI 128V http://www.soundblaster.com
1.10.2 Creative ES1373D Digital Audio Controller
The Creative ES1373D digital audio controller’s features include:
• PCI 2.1 compliant
• PCI bus master for PCI audio
• 128-voice wavetable synthesizer
• Aureal A3D
• Ensoniq 3D positional audio and Microsoft DirectSound
†
API, Sound Blaster Pro†, Roland MPU-401 MIDI, joystick compatible
†
3D support
1.10.3 Crystal Semiconductor CS4297A Analog Codec
The Crystal Semiconductor CS4297A is a fully AC ’97 compliant codec. The codec's features
include:
• 18-bit stereo full-duplex operation
• Up to 48 kHz sampling rate
• Connects to ES1373D digital controller using a five-wire digital interface
23
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.10.4 Audio Connectors
The audio connectors include the following:
• Line out (back panel)
• Mic in (back panel)
• ATAPI CD-ROM (connects an internal ATAPI CD-ROM drive to the audio mixer)
For information about Refer to
The back panel audio connectors Section 2.8.1, page 39
The location of the ATAPI CD-ROM connector Figure 5, page 41
The signal names of the ATAPI CD-ROM connector Table 29, page 45
1.11 Hardware Monitor Component
The hardware monitor component provides low-cost instrumentation capabilities. The features of
the component include:
• Internal ambient temperature sensing
• Remote thermal diode sensing for direct monitoring of processor temperature
• Power supply monitoring (+12, +5, +3.3, +2.5, V
acceptable values
• SMBus interface
• The hardware monitor component enables the board to be compatible with the Wired for
Management (WfM) specification.
CCP) to detect levels above or below
For information about Refer to
The board’s compatibility with the WfM specification Table 2, page 13
24
Product Description
1.12 LAN Subsystem
The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both
10Base-T and 100Base-TX connectivity. Features include:
• 32-bit, 33 MHz direct bus mastering on the PCI bus
• 10Base-T and 100Base-TX capability using a single RJ-45 connector with connection and
activity status LEDs
• IEEE 802.3u Auto-Negotiation for the fastest available connection
• Jumperless configuration; the LAN subsystem is completely software-configurable
For information about Refer to
The WfM specification Table 2, page 13
1.12.1 Intel® 82559 PCI LAN Controller
The Intel 82559 PCI LAN controller’s features include:
• CSMA/CD Protocol Engine
• PCI bus interface
• DMA engine for movement of commands, status, and network data across the PCI bus
• Integrated physical layer interface, including:
Complete functionality necessary for the 10Base-T and 100Base-TX network interfaces;
when in 10 Mbit/sec mode, the interface drives the cable directly
A complete set of Media Independent Interface (MII) management registers for control
and status reporting
IEEE 802.3u Auto-Negotiation for automatically establishing the best operating mode
when connected to other 10Base-T or 100Base-TX devices, whether half- or full-duplex
capable
• Integrated power management features, including support for wake on network event (from an ACPI
S3 state using the PCI bus PME# signal)
For information about Refer to
The LAN subsystem’s PCI specification compliance Table 2, page 13
25
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.12.2 LAN Subsystem Software
The Intel 82559 Fast Ethernet WfM PCI LAN software and drivers are available from Intel’s
World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.2, page 13
1.12.3 RJ-45 LAN Connector LEDs
Two LEDs are built into the RJ-45 LAN connector. Table 6 describes the LED states when the
board is powered up and the LAN subsystem is operating.
Table 6. LAN Connector LED States
LED Color LED State Condition
Off 10 Mbit/sec data rate is selected.Green
On 100 Mbit/sec date rate is selected.
Yellow
Off LAN link is not established.
On (steady state) LAN link is established.
On (brighter and pulsing) The computer is communicating with another computer on
the LAN.
26
Product Description
1.13 Power Management Features
Power management is implemented at several levels, including:
• Advanced Configuration and Power Interface (ACPI)
• Hardware support:
Power connector
Wake on network event
Instantly Available technology
Wake on Ring
Resume on Ring
1.13.1 ACPI
If the board is used with an ACPI-aware operating system, the BIOS can provide ACPI support.
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with this board requires the support of an operating
system that provides full ACPI functionality. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping
state, and less than 5-watt system operation in the Suspend to RAM sleeping state
• A Soft-off feature that enables the operating system to power off the computer
• Support for multiple wake up events (see Table 9 on page 29)
• Support for a front panel power and sleep mode switch. Table 7 lists the system states based
on how long the power switch is pressed, depending on how ACPI is configured with an
ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch
…and the power switch is
If the system is in this state…
Off (ACPI G2/S5 state) Less than four seconds Power on
On (ACPI G0 state) Less than four seconds Soft off/Suspend
On (ACPI G0 state) More than four seconds Fail safe power off
Sleep (ACPI G1 state) Less than four seconds Wake up
Sleep (ACPI G1 state) More than four seconds Power off
For information about Refer to
The board’s compliance level with ACPI Section 1.3, page 13
pressed for …the system enters this state
27
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.13.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 8 lists the power states supported by the board along with the associated system power
targets. See the ACPI specification for a complete description of the various system and power
states.
Table 8. Power States and Targeted System Power
Global States Sleeping States CPU States Device States Targeted System Power*
G0 – working
state
G1 – sleeping
state
G1 – sleeping
state
G2/S5 S5 – Soft off.
G3 –
mechanical off.
AC power is
disconnected
from the
computer.
* Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the
system chassis’ power supply.
** Dependent on the standby power consumpt i on of wake up devices used in the system.
S0 – working C0 – working D0 – working
state
S1 – CPU stopped C1 – stop
grant
S3 – Suspend-toRAM. Context
saved to RAM.
Context not saved.
Cold boot is
required.
No power to the
system.
No power D3 – no power
No power D3 – no power
No power D3 – no power for
D1, D2, D3 –
device
specification
specific.
except for wake
up logic.
except for wake
up logic.
wake up logic,
except when
provided by
battery or external
source.
Full power > 30 W
5 W < power < 30 W
Power < 5 W **
Power < 5 W **
No power to t he system so
that service can be
performed.
28
Product Description
1.13.1.2 Wake Up Devices and Events
Table 9 lists the devices or specific events that can wake the computer from specific states.
Table 9. Wake Up Devices and Events
These devices/events can wake up the computer… …from this state
Power switch S1, S3, S5
RTC alarm S1, S3, S5
LAN S1, S3
Modem S1, S3
USB S1, S3
PCI bus PME# S3
1.13.1.3 Plug and Play
In addition to power management, ACPI provides controls and information so that the operating
system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to
enumerate and configure devices that do not have other hardware standards for enumeration and
configuration. PCI devices on a desktop board, for example, are not enumerated by ACPI.
1.13.2 Hardware Support
CAUTION
If Wake on network event and Instantly Available technology features are used, the power supply
must be capable of providing adequate +5 V standby current. Failure to provide adequate standby
current can damage the power supply. The total amount of standby current required depends on
the wake devices supported and manufacturing options. Refer to Section 2.11.3 on page 54 for
additional information.
The board provides several hardware features that support power management, including:
• Power connector
• Wake on network event
• Instantly Available technology
• Wake on Ring
• Resume on Ring
Wake on network event and Instantly Available technology require power from the +5 V standby
line. The sections discussing these features describe the incremental standby power requirements
for each.
Wake on Ring and Resume on Ring enable telephony devices to access the computer when it is in
a power-managed state. The method used depends on the type of telephony device (external or
internal) and the power management mode being used (ACPI).
NOTE
✏
The use of Wake on Ring and Resume on Ring technologies from an ACPI state require the support
of an operating system that provides full ACPI functionality.
29
Intel Desktop Board D810EMO/MO810E Technical Product Specification
1.13.2.1 Power Connector
When used with an ATX-compliant power supply that supports remote power on/off, the board can
turn off the system power through software control. To enable soft-off control in software,
advanced power management must be enabled in the BIOS Setup program and in the operating
system. When the system BIOS receives the correct power management command from the
operating system, the BIOS turns off power to the computer.
With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected
power cord, when power resumes, the computer returns to the power state it was in before power
was interrupted (on or off).
For information about Refer to
The location of the power connector Figure 5, page 41
The signal names of the power connector Table 27, page 44
The ATX specification Section 1.3, page 13
1.13.2.2 Fan Connectors
The board has two fan connectors. The functions of these connectors are described in Table 10.
Table 10. Fan Connector Descriptions
Connector Function
Chassis fan Provides +12 V DC for a system o r chassis fan.
Processor fan Provides +12 V DC for a processor fan or active fan heatsink.
For information about Refer to
The location of the fan connectors Figure 5, page 41
The signal names of the chassis fan connector Table 22, page 42
The signal names of the processor fan connector Table 23, page 42
1.13.2.3 Wake on Network Event
CAUTION
For Wake on network event, the +5 V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Wake on network event can damage the power supply. Refer to Section 2.11.3 on
page 54 for additional information.
Wake on network event enables remote wakeup of the computer through a network. The LAN
subsystem, whether onboard or as a PCI bus network adapter, monitors network traffic at the
†
Media Independent Interface. Upon detecting a Magic Packet
wakeup signal that powers up the computer. The board supports Wake on network event through
the PCI bus PME# signal.
, the LAN subsystem asserts a
30
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