Intel D810EMO, MO810E User Manual

Intel® Desktop Board D810EMO/MO810E

Technical Product Specification

February 2000 Order Number A00653-001

The Intel® Desktop Board D810EMO/MO810E may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D810EMO/MO810E Specification Update.

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board D810EMO/MO810E Technical Product Specification

This product specification applies to only standard D810EMO/MO810E boards with BIOS identifier MO81010A.86A.

Changes to this specification will be published in the Intel Desktop Board D810EMO/MO810E Specification Update before being incorporated into a revision of this document.

February 2000

Information in this doc um ent is provided in connecti on wi th Intel® products. No license, express or implied, by es toppel or otherwise, to any intell ectual property rights is granted by this document. E xcept as provided in Int el ’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and I nt el disclaims any express or implied warranty, relating to sale and/or use of I ntel products including liability or warranties relat i ng t o fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel produc ts are not intended for use in medical, l i f e saving, or life sustaining applications.

Intel may make changes t o specifications and product descriptions at any time, without noti ce. The D810EMO/MO810E board may cont ai n des i gn defects or errors known as errat a t hat may cause the product to deviate

from published specifi c ations. Current characteri z ed errata are available on request. Contact your local Int el sales office or your dis tributor to obtain the lates t specifications before placing your product order. Copies of documents whic h hav e an orderi ng number and are referenced in this document , or other Intel literature, m ay be

obtained from:

Intel Corporation P.O. Box 5937 Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.

†

All other brands and names are the property of their respective owners.

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the D810EMO/MO810E desktop board. It describes the standard product and available manufacturing options.

The D810EMO desktop board is known in some documentation and sales collateral as the MO810E. Both names refer to the same product.

Intended Audience

The TPS is intended to provide detailed, technical information about the board and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on this board 2 A map of the resources of the board 3 The features supported by the BIOS Setup program 4 The contents of the BIOS Setup program’s menus and submenus

5 A description of the BIOS error messages, beep codes, and POST codes

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

✏

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

WARNING

Warnings indicate conditions that, if not observed, can cause personal injury.

iii

Intel Desktop Board D810EMO/MO810E Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative

coordinates of its location on the board, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the

5J area. KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) MB Megabyte (1,048,576 bytes) Mbit Megabit (1,048,576 bits) GB Gigabyte (1,073,741,824 bytes) xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified.

†

This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

1 Product Description

1.1 Overview ................................................................................................................... 10

1.1.1 Feature Summary ....................................................................................... 10

1.1.2 Board Layout............................................................................................... 11

1.1.3 Block Diagram............................................................................................. 12

1.2 Online Support........................................................................................................... 13

1.3 Design Specifications ................................................................................................ 13

1.4 Processor..................................................................................................................16

1.5 System Memory......................................................................................................... 17

1.6 Intel

1.7 I/O Controller............................................................................................................. 21

1.8 Serial Debug Port......................................................................................................21

1.9 Graphics Subsystem ................................................................................................. 22

1.10 Audio Subsystem....................................................................................................... 23

1.11 Hardware Monitor Component................................................................................... 24

1.12 LAN Subsystem......................................................................................................... 25

1.13 Power Management Features.................................................................................... 27

810E Chipset................................................................................................... 18

1.6.1 Direct AGP.................................................................................................. 19

1.6.2 USB............................................................................................................. 19

1.6.3 IDE Support................................................................................................. 20

1.6.4 Real-Time Clock, CMOS SRAM, and Battery .............................................. 20

1.10.1 Creative Sound Blaster AudioPCI 128V ...................................................... 23

1.10.2 Creative ES1373D Digital Audio Controller..................................................23

1.10.3 Crystal Semiconductor CS4297A Analog Codec......................................... 23

1.10.4 Audio Connectors........................................................................................ 24

1.12.1 Intel

1.12.2 LAN Subsystem Software............................................................................26

1.12.3 RJ-45 LAN Connector LEDs........................................................................ 26

1.13.1 ACPI............................................................................................................ 27

1.13.2 Hardware Support....................................................................................... 29

82559 PCI LAN Controller ................................................................. 25

2 Technical Reference

2.1 Introduction................................................................................................................33

2.2 Memory Map ............................................................................................................. 33

2.3 I/O Map ..................................................................................................................... 34

2.4 DMA Channels .......................................................................................................... 35

2.5 PCI Configuration Space Map ................................................................................... 36

2.6 Interrupts...................................................................................................................36

2.7 PCI Interrupt Routing Map......................................................................................... 37

2.8 Connectors................................................................................................................ 38

2.8.1 Back Panel I/O Connectors......................................................................... 39

2.8.2 Internal I/O Connectors............................................................................... 41

2.8.3 External I/O Connectors.............................................................................. 46

Intel Desktop Board D810EMO/MO810E Technical Product Specification

2.9 Jumper Block............................................................................................................. 49

2.10 Mechanical Considerations........................................................................................ 51

2.10.1 FlexATX Form Factor.................................................................................. 51

2.10.2 I/O Shield .................................................................................................... 52

2.11 Electrical Considerations........................................................................................... 53

2.11.1 Add-in Board Considerations....................................................................... 53

2.11.2 Power Consumption.................................................................................... 53

2.11.3 Power Supply Considerations......................................................................54

2.11.4 Fan Power Requirements............................................................................ 54

2.12 Thermal Considerations............................................................................................. 55

2.13 Reliability................................................................................................................... 56

2.14 Environmental............................................................................................................ 57

2.15 Regulatory Compliance............................................................................................. 58

2.15.1 Safety Regulations...................................................................................... 58

2.15.2 EMC Regulations........................................................................................ 58

2.15.3 Certification Markings.................................................................................. 59

3 Overview of BIOS Features

3.1 Introduction................................................................................................................61

3.2 BIOS Flash Memory Organization............................................................................. 62

3.3 Resource Configuration............................................................................................. 62

3.3.1 PCI Autoconfiguration................................................................................. 62

3.3.2 PCI IDE Support.......................................................................................... 63

3.4 System Management BIOS (SMBIOS)...................................................................... 64

3.5 BIOS Upgrades ......................................................................................................... 65

3.5.1 Language Support....................................................................................... 65

3.5.2 Custom Splash Screen................................................................................ 65

3.6 Recovering BIOS Data.............................................................................................. 66

3.7 Boot Options.............................................................................................................. 67

3.7.1 CD-ROM and Network Boot........................................................................ 67

3.7.2 Booting Without Attached Devices.............................................................. 67

3.8 USB Legacy Support................................................................................................. 68

3.9 BIOS Security Features............................................................................................. 69

4 BIOS Setup Program

4.1 Introduction................................................................................................................71

4.2 Maintenance Menu.................................................................................................... 72

4.2.1 Extended Configuration Submenu............................................................... 73

4.3 Main Menu................................................................................................................. 74

4.4 Advanced Menu......................................................................................................... 75

4.4.1 Boot Configuration Submenu ...................................................................... 76

4.4.2 Peripheral Configuration Submenu.............................................................. 77

4.4.3 IDE Configuration Submenu ........................................................................ 78

4.4.4 Event Log Configuration .............................................................................. 81

4.4.5 Video Configuration..................................................................................... 82

4.5 Security Menu............................................................................................................83

4.6 Power Menu.............................................................................................................. 84

4.7 Boot Menu................................................................................................................. 85

4.8 Exit Menu.................................................................................................................. 87

5 Error Messages and Beep Codes

5.1 BIOS Error Messages................................................................................................ 89

5.2 Port 80h POST Codes............................................................................................... 91

5.3 Bus Initialization Checkpoints.................................................................................... 95

5.4 Speaker.....................................................................................................................96

5.5 BIOS Beep Codes..................................................................................................... 97

Figures

1. Board Components.................................................................................................... 11

2. Block Diagram........................................................................................................... 12

3. Intel 810E Chipset Block Diagram............................................................................. 18

4. Back Panel I/O Connectors ....................................................................................... 39

5. Internal I/O Connectors ............................................................................................. 41

6. External I/O Connectors ............................................................................................ 46

7. Location of the Jumper Block .................................................................................... 49

8. Board Dimensions..................................................................................................... 51

9. I/O Shield Dimensions............................................................................................... 52

10. High Temperature Zones........................................................................................... 55

11. Memory Map of the Flash Memory Device................................................................ 62

Contents

Tables

1. Feature Summary...................................................................................................... 10

2. Specifications ............................................................................................................ 13

3. Processors Supported by the Board.......................................................................... 16

4. System Memory Configuration................................................................................... 17

5. Supported Graphics Refresh Rates........................................................................... 22

6. LAN Connector LED States....................................................................................... 26

7. Effects of Pressing the Power Switch........................................................................ 27

8. Power States and Targeted System Power............................................................... 28

9. Wake Up Devices and Events................................................................................... 29

10. Fan Connector Descriptions...................................................................................... 30

11. System Memory Map................................................................................................. 33

12. I/O Map ..................................................................................................................... 34

13. DMA Channels .......................................................................................................... 35

14. PCI Configuration Space Map ................................................................................... 36

15. Interrupts...................................................................................................................36

16. PCI Interrupt Routing Map......................................................................................... 37

17. USB Connectors ........................................................................................................ 40

18. VGA Port Connector.................................................................................................. 40

19. LAN Connector.......................................................................................................... 40

20. Audio Line Out Connector ......................................................................................... 40

vii

Intel Desktop Board D810EMO/MO810E Technical Product Specification

21. Mic In Connector ....................................................................................................... 40

22. Chassis Fan Connector (J2J1) .................................................................................. 42

23. Processor Fan Connector (J7J1)............................................................................... 42

24. Primary IDE Connector (J7E1).................................................................................. 42

25. Slimline IDE Connector (J8E1).................................................................................. 43

26. Serial Debug Port Connector (J7C1)......................................................................... 43

27. Power Connector (J8B1) ........................................................................................... 44

28. PCI Bus Connector (J4B1) ........................................................................................ 45

29. ATAPI CD-ROM Connector (J2D1) ........................................................................... 45

30. USB Port Connector (J7A1)....................................................................................... 47

31. Front Panel Connector (J8C1)................................................................................... 47

32. States for a Single-colored Power LED...................................................................... 48

33. States for a Dual-colored Power LED........................................................................ 48

34. BIOS Setup Configuration Jumper Settings (J8F1).................................................... 50

35. Power Usage............................................................................................................. 53

36. Chassis Fan (J3A2) DC Power Requirements........................................................... 54

37. Thermal Considerations for Components .................................................................. 56

38. Board Environmental Specifications.......................................................................... 57

39. Safety Regulations .................................................................................................... 58

40. EMC Regulations....................................................................................................... 58

41. Supervisor and User Password Functions................................................................. 69

42. BIOS Setup Program Menu Functions....................................................................... 71

43. BIOS Setup Program Function Keys ......................................................................... 72

44. Maintenance Menu.................................................................................................... 72

45. Extended Configuration Submenu............................................................................. 73

46. Main Menu................................................................................................................. 74

47. Advanced Menu......................................................................................................... 75

48. Boot Configuration Submenu..................................................................................... 76

49. Peripheral Configuration Submenu............................................................................ 77

50. IDE Configuration Submenu...................................................................................... 78

51. Primary/Secondary IDE Master/Slave Submenus...................................................... 79

52. Event Log Configuration Submenu............................................................................ 81

53. Video Configuration Submenu................................................................................... 82

54. Security Menu............................................................................................................83

55. Power Menu.............................................................................................................. 84

56. Boot Menu................................................................................................................. 85

57. Exit Menu.................................................................................................................. 87

58. BIOS Error Messages................................................................................................ 89

59. Uncompressed INIT Code Checkpoints..................................................................... 91

60. Boot Block Recovery Code Checkpoints ................................................................... 91

61. Runtime Code Uncompressed in F000 Shadow RAM ............................................... 92

62. Bus Initialization Checkpoints.................................................................................... 95

63. Upper Nibble High Byte Functions............................................................................. 95

64. Lower Nibble High Byte Functions............................................................................. 96

65. Beep Codes............................................................................................................... 97

viii

1 Product Description

What This Chapter Contains

1.1 Overview ................................................................................................................... 10

1.2 Online Support........................................................................................................... 13

1.3 Design Specifications ................................................................................................ 13

1.4 Processor.................................................................................................................. 16

1.5 System Memory......................................................................................................... 17

1.6 Intel

1.7 I/O Controller............................................................................................................. 21

1.8 Serial Debug Port...................................................................................................... 21

1.9 Graphics Subsystem ................................................................................................. 22

1.10 Audio Subsystem....................................................................................................... 23

1.11 Hardware Monitor Component................................................................................... 24

1.12 LAN Subsystem......................................................................................................... 25

1.13 Power Management Features.................................................................................... 27

810E Chipset................................................................................................... 18

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the D810EMO/MO810E board’s major features.

Table 1. Feature Summary

Form Factor Processor

Memory

Chipset

Direct AGP Video

Audio

I/O Controller Peripheral

Interfaces Serial Debug

Port Expansion

capabilities Management

Level 4 Support Instantly

Available PC

BIOS

FlexATX (9.0 inches by 7.5 inches) Support for either an Intel

(FC-PGA) package or an Intel® Celeron™ processor in an FCPGA package or a PPGA package

• One 168-pin dual inline memory module (DIMM) socket

• Supports up to 256 MB of 100 MHz non-ECC synchronous DRAM (SDRAM)

• Support for serial presence detect (SPD) and non-SPD DIMMs

Intel® 810E chipset, consisting of:

• Intel

• Intel 82810E DC-133 GMCH

• 4 MB of display cache

• VGA port connector on back panel

Audio Codec ’97 (AC ’97) compatible audio subsystem, consisting of the foll owing:

• Creative Sound Blaster

• Crystal Semiconductor CS4297A analog codec

SMSC LPC47M102 SIO low pin count (LPC) interface I/O controller

• Up to four universal serial bus (USB) ports

• Two IDE interfaces with Ultra DMA support

One 9-pin stake-pin serial debug port connector

One PCI bus connector at PCI slot 5 location

• Intel

• Hardware monitor

• Support for

• Suspend-to-RAM support

• Wake on USB ports

• Intel

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

82810E DC-133 Graphics/Memory Controller Hub (GMCH)

82801AA I/O Controller Hub (ICH)

82802AB 4 Mbit Firmware Hub (FWH)

82559 local area network (LAN) controller

PCI Local Bus Specification

/AMI BIOS stored in an Intel 82802AB 4 Mbit firmware hub (FWH)

and SMBIOS

Pentium® III processor in a Flip Chip Pin Grid Array

†

AudioPCI 128V digital audio controller (ES1373D)

, Revision 2.2

NOTE

✏

The D810EMO/MO810E board is designed to support only USB-aware operating systems.

For information about Refer to

The board’s compliance level with ACPI, Plug and Play, and SMBIOS Table 2, page 13

1.1.2 Board Layout

Figure 1 shows the location of the major components on the board.

Product Description

DA B C

E O N

K J I H

OM08923

A Crystal Semiconductor CS4297A codec J Front panel connector B Creative ES1373D digital audio controller K Power connector C 4 MB display cache L SMSC LPC47M102 I/O controller D Back panel I/O connectors M Intel 82801AA ICH E Intel 82810E DC-133 GMCH N Intel 82559 PCI LAN Controller F Processor socket O Speaker G DIMM socket P Battery H Primary IDE connector Q PCI bus connector I Slimline Secondary IDE connector

Figure 1. Board Components

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Primary/

PPGA370 Processor

Socket

Secondary IDE

Interface

66/100/133

MHz Host Bus

810E Chipset

ATA33/66

USB

Hub

Port 0USB

Port 1

Port 2

Port 3

DIMM

Socket

VGA

Port

10/100

Ethernet

100 MHz

SDRAM

Bus

Mbps

Display

Interface

82810E

Graphics Memory

Controller Hub

(GMCH)

Hardware

Monitor

LAN

Subsystem

AHA

Bus

4 MB

Display

Cache

SMBus

PCI Bus

82801AA I/O Controller Hub

(ICH)

PCI Bus

Connector

LPC

Bus

LPC I/O

Controller

AC ’97 Link

Firmware Hub

Digital

Controller

Analog

Codec

82802AB

(FWH)

Serial Port

CD-ROM

Line Out

Mic In

OM09093

Figure 2. Block Diagram

Product Description

1.2 Online Support

Find information about Intel® desktop boards under “Product Info” or “Customer Support” at these

World Wide Web sites: http://www.intel.com/design/motherbd

http://support.intel.com/support/motherboards/desktop

1.3 Design Specifications

Table 2 lists the specifications applicable to the D810EMO/MO810E board.

Table 2. Specifications

Reference Name

AC ‘97

ACPI

AGP

AMI BIOS

ATA-3

ATAPI

ATX

El Torito Bootable CD-ROM format

FlexATX FlexATX Addendum to the

Specification Title

Audio Codec ‘97

Advanced Configuration and Power Interface Specification

Accelerated Graphics Port Interface Specification

American Megatrends BIOS Specification

Information Technology AT Attachment-3 Interface, X3T10/2008D

Information Technology AT Attachment with Packet Interface Extensions T13/1153D

ATX Specification

specification

microATX Specification

(2X only)

Version, Revision Date, and Ownership

Version 2.1, May 1998, Intel Corporation.

Version 1.0, July 1, 1998, Intel Corporation, Microsoft Corporation, and Toshiba Corporation.

Version 2.0, May 4, 1998, Intel Corporation.

AMIBIOS 99, June 1999, American Megatrends, Inc.

Version 6 ATA Anonymous FTP Site:

Version 18 August 13, 1998, Contact: T13 Chair, Seagate Technology

Version 2.01, February 1997, Intel Corporation.

Version 1.0, January 25, 1995, Phoenix Technologies Ltd., and IBM Corporation.

Version 1.0 http://www.teleport.com/~ffsupprt

This specification is available at:

ftp://download.intel.com/ pc-supp/platform/ac97

http://www.teleport.com/~acpi/

the Accelerated Graphics Implementers Forum at: http://www.agpforum.org/

http://www.ami.com/amibios/ bios.platforms.desktop.html

ftp://fission.dt.wdc.com

T13 Anonymous FTP Site: ftp://fission.dt.wdc.com/ x3t13/project/d1153r18.pdf

http://download.intel.com/ design/motherbd/atx.htm

the Phoenix Technologies web site at: http://www.ptltd.com/techs/ specs.html

/spec/FlexATXaddn1_01.pdf

continued

Intel Desktop Board D810EMO/MO810E Technical Product Specification

Table 2. Specifications (continued)

Reference Name

†

IrDA

LPC

MicroATX

PCI

Plug and Play

SDRAM DIMMs (64-and 72-bit)

SMBIOS

Specification Title

Serial Infrared Physical Layer Link Specification

Low Pin Count Interface Specification

microATX Motherboard Interface Specification

SFX Power Supply Design Guide

PCI Local Bus Specification

PCI Bus Power Management Interface Specification

Plug and Play BIOS Specification

PC SDRAM Unbuffered DIMM Specification

PC Serial Presence Detect (SPD) Specification

System Management BIOS

Version, Revision Date, and Ownership

Version 1.1, October 17, 1995 Infrared Data Association Phone: (510) 943-6546 Fax: (510) 943-5600

Version 1.0, September 29, 1997, Intel Corporation.

Version 1.0, December 1997 Intel Corporation

Version 1.1, February 1998

Intel Corporation Version 2.2,

December 18, 1998, PCI Special Interest Group.

Version 1.1, December 18, 1998, PCI Special Interest Group.

Version 1.0a, May 5, 1994, Compaq Computer Corp., Phoenix Technologies Ltd., and Intel Corporation.

Revision 1.0, February 1998, Intel Corporation.

Revision 1.2A, December 1997, Intel Corporation

Version 2.3, August 12, 1998, Award Software International Inc., Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, American Megatrends Inc., and SystemSoft Corporation.

This specification is available at:

E-mail: irda@netcom.com

http://www.intel.com/ design/chipsets/industry/ lpc.htm

http://www/teleport.com/ ~ffsupprt/spec/ microatxspecs.htm

http://www.pcisig.com/

ftp://download.intel.com/ ial/wfm/bio10a.pdf

http://www.intel.com/ design/chipsets/memory/ sdram.htm#S1

http://developer.intel.com/ ial/wfm/design/smbios

continued

Table 2. Specifications (continued)

Reference Name

UHCI

USB

WfM

Specification Title

Universal Host Controller Interface Design Guide

Universal Serial Bus Specification

Wired for Management Baseline

Version, Revision Date, and Ownership

Version 1.1, March 1996, Intel Corporation.

Version 1.1, September 23, 1998, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, and NEC.

Version 2.0, December 18, 1998, Intel Corporation

Product Description

This specification is available at:

This guide is available at: http://www.usb.org/ developers

http://www.usb.org/ developers/docs.html

http://developer.intel.com/ ial/WfM/wfmspecs.htm

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.4 Processor

CAUTION

The board supports processors that draw a maximum of 22 amps. Using a processor that draws more than 22 amps can damage the processor, the board, and the power supply. See the

processor’s data sheet for current usage requirements.

The board supports the processors listed in Table 3. The host bus frequency is automatically selected.

Table 3. Processors Supported by the Board

Processor Type Processor Speed Host Bus Frequency L2 Cache Size

600EB MHz 133 MHz 256 KBPentium III processor 600E MHz

550E MHz 500E MHz

Celeron processor 533 MHz

500 MHz 466 MHz 433 MHz 400 MHz 366 MHz

100 MHz 100 MHz 100 MHz

66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz

256 KB 256 KB 256 KB

128 KB 128 KB 128 KB 128 KB 128 KB 128 KB

All supported onboard memory can be cached, up to the cachability limit of the processor.

For information about Refer to

Processor support for the D810EMO/MO810E board

Processor data sheets http://www.intel.com/design/litcentr

http://support.intel.com/support/motherboards/desktop

Product Description

1.5 System Memory

CAUTION

To be fully compliant with all applicable Intel® SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your memory modules do not support SPD, you will see a notification to this effect on the screen at power up. The BIOS will attempt to configure the memory controller for normal operation; however, DIMMs may not function at the determined frequency.

CAUTION

Because the main system memory is also used as video memory, the board requires a 100 MHz SDRAM DIMM even though the host bus frequency is 66 MHz. It is highly recommended that an SPD DIMM be used, since this allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted.

The board has one DIMM socket. The minimum memory size is 32 MB and the maximum memory size is 256 MB. The BIOS automatically detects memory type, size, and frequency.

The board supports the following memory features:

• 3.3 V, 168-pin DIMM with gold-plated contacts

• 100 MHz SDRAM

• Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires an SPD DIMM)

• Non-ECC (64-bit) memory

• Unbuffered single- or double-sided DIMM

The board is designed to support the DIMM configurations listed in Table 4 below.

Table 4. System Memory Configuration

DIMM Size Non-ECC Configuration

32 MB 4 Mbit x 64 64 MB 8 Mbit x 64 128 MB 16 Mbit x 64 256 MB (Note) 32 Mbit x 64

Note: A 256 MB DIMM used with this board must be built with 128 Mbit device technol ogy.

For information about Refer to

The

PC Serial Presence Detect Specification

Obtaining copies of PC SDRAM specifications http://www.intel.com/design/pcisets/memory

Table 2, page 13

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.6 Intel® 810E Chipset

The Intel 810E chipset consists of the following devices:

• 82810E DC-133 Graphics Memory Controller Hub (GMCH) with accelerated hub architecture

(AHA) bus

• 82801AA I/O Controller Hub (ICH) with AHA bus

• 82802AB Firmware Hub (FWH)

The chipset provides the host, memory, display, and I/O interfaces shown in Figure 3.

66/100/133 MHz

Host Bus

ATA33/66 USB

810E Chipset

100 MHz

SDRAM

Bus

Display

Interface

82810E

Graphics Memory

Controller Hub

(GMCH)

AHA

Bus

82801AA I/O Controller Hub

(ICH)

SMBus

PCI Bus

AC Link

Figure 3. Intel 810E Chipset Block Diagram

For information about Refer to

The Intel 810E chipset http://developer.intel.com The resources used by the chipset Chapter 2 The chipset’s compliance with ACPI and AC ‘97 Table 2, page 13

82802AB

Firmware Hub

(FWH)

LPC Bus

OM09130

Product Description

1.6.1 Direct AGP

Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphics-intensive applications, such as 3-D applications. AGP overcomes certain limitations of the PCI bus related to handling large amount of graphics data with the following features:

• Pipelined memory read and write operations that hide memory access latency

• Demultiplexing of address and data on the bus for nearly 100 percent bus efficiency

For information about Refer to

The location of the VGA port connector Figure 4, page 39 Obtaining the

Accelerated Graphics Port Interface Specification

Table 2, page 13

1.6.2 USB

The board supports up to four USB ports; one USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to any of the ports. Two USB ports are implemented with stacked back panel connectors. The other two ports can be routed from the connector at location J7A1 via a cable to the front panel. The board fully supports UHCI and uses UHCI-compatible software drivers. USB features include:

• Support for self-identifying peripherals that can be connected or disconnected while the

computer is running

• Automatic mapping of function to driver and configuration

• Support for isochronous and asynchronous transfer types over the same set of wires

• Support for up to 127 physical devices

• Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other

applications

• Error-handling and fault-recovery mechanisms built into the protocol

NOTE

✏

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 4, page 39 The signal names of the USB connectors Table 17, page 40 The location of the USB port connector for the front panel Figure 6, page 46 The signal names for the USB port connector for the front panel Table 30, page 47 The USB and UHCI specifications Table 2, page 13

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.6.3 IDE Support

The board has two independent bus-mastering IDE interfaces. These interfaces support:

• ATAPI devices (such as CD-ROM drives)

• ATA devices using the transfer modes listed in Table 51 on page 79

The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

The board supports laser servo (LS-120) diskette technology through its IDE interfaces. The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu

to one of the following:

• ARMD-FDD (ATAPI removable media device – floppy disk drive)

• ARMD-HDD (ATAPI removable media device – hard disk drive)

The board has two IDE interface connectors. The primary IDE connector is a standard 40-pin IDE interface. The secondary IDE connector is a 50-pin Slimline IDE connector, intended for use with devices such as 2.5-inch hard disk drives and mobile CD-ROM drives. The Slimline IDE connector has the standard IDE interface pins but also includes audio and power signals.

For information about Refer to

The location of the IDE connectors Figure 5, page 41 The signal names of the primary IDE connector Table 24, page 42 The signal names of the Slimline secondary IDE connector Table 25, page 43

BIOS Setup program’s Boot menu Table 56, page 85

1.6.4 Real-Time Clock, CMOS SRAM, and Battery

The real-time clock is compatible with DS1287 and MC146818 components. The clock provides a time-of-day clock and a multicentury calendar with alarm features and century rollover. The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.

A coin-cell battery powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the 3.3 V standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.

NOTE

✏

If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS RAM at power on.

Product Description

NOTE

✏

The recommended method of accessing the date in systems with Intel desktop boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel desktop boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value.

For information about Refer to

Proper date access in systems with Intel de sktop boards http://support.intel.com/support/year2000/

1.7 I/O Controller

The SMSC LPC47M102 I/O controller provides the following features:

• Low pin count (LPC) interface

• One serial port

• Infrared (IrDA) interface

• Intelligent power management, including a programmable wake up event interface

• Fan control:  One pulse width modulation (PWM) fan speed control output  One fan tachometer input

The BIOS Setup program provides configuration options for the I/O controller.

For information about Refer to

SMSC LPC47M102 I/O controller http://www.smsc.com The IrDA interface Section 2.8.3, page 46

1.8 Serial Debug Port

The board has one 9-pin serial debug port connector. The serial debug port’s NS16C550-compatible UART supports data transfers at rates of up to 115.2 kbits/sec with BIOS support. The serial debug port can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).

For information about Refer to

The location of the serial debug port connector Figure 5, page 41 The signal names of the serial debug port connector Table 26, page 43

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.9 Graphics Subsystem

The Intel 82810E DC-133 GMCH graphics memory controller hub component provides the following graphics support features:

• Integrated 2-D and 3-D graphics engines

• Integrated hardware motion compression engine

• Integrated 230 MHz DAC

Table 5 lists the refresh rates supported by graphics subsystem.

Table 5. Supported Graphics Refresh Rates

Resolution Color Palette Available Refresh Frequencies (Hz)

640 x 480

720 x 480

720 x 576

800 x 600

1024 x 768

1152 x 864

1280 x 1024

1600 x 1200 256 colors 60, 70, 72, 75, 85

16 colors 60, 70, 72, 75, 85 256 colors 60, 70, 72, 75, 85 64 K colors 60, 70, 72, 75, 85 16 M colors 60, 70, 72, 75, 85 256 colors 75, 85 64 K colors 75, 85 16 M colors 75, 85 256 colors 60, 75, 85 64 K colors 60, 75, 85 16 M colors 60, 75, 85 256 colors 60, 70, 72, 75, 85 64 K colors 60, 70, 72, 75, 85 16 M colors 60, 70, 72, 75, 85 256 colors 60, 70, 72, 75, 85 64 K colors 60, 70, 72, 75, 85 16 M colors 60, 70, 72, 75, 85 256 colors 60, 70, 72, 75, 85 64 K colors 60, 70, 72, 75, 85 16 M colors 60, 70, 72, 75, 85 256 colors 60, 70, 72, 75, 85 64 K colors 60, 70, 72, 75, 85 16 M colors 60, 70, 75, 85

For information about Refer to

Obtaining graphics software and utilities http://support.intel.com/support/motherboards/desktop

Product Description

1.10 Audio Subsystem

The Audio Codec ’97 (AC ’97) compatible audio subsystem includes these features:

• Split digital/analog architecture for improved signal-to-noise ratio (≥ 85 dB) measured at line out, from any analog input, including line in, and CD-ROM

• 3-D stereo enhancement

• Power management support for ACPI 1.0a

The audio subsystem consists of these devices:

• Creative Sound Blaster AudioPCI 128V

• Crystal Semiconductor CS4297A stereo audio codec

• Audio connectors

For information about Refer to

Obtaining audio software and utilities Section 1.2, page 13

1.10.1 Creative Sound Blaster AudioPCI 128V

The Creative Sound Blaster AudioPCI 128V features:

• Creative ES1373D digital audio controller

• Interfaces to the PCI bus as a Plug and Play device

• 100% DOS legacy compatible

• Access to main memory (through the PCI bus) for wavetable synthesis support – does not

require a separate wavetable ROM device

• Conforms to the PC 98 and PC 99 design guides

For information about Refer to

Creative Sound Blaster AudioPCI 128V http://www.soundblaster.com

1.10.2 Creative ES1373D Digital Audio Controller

The Creative ES1373D digital audio controller’s features include:

• PCI 2.1 compliant

• PCI bus master for PCI audio

• 128-voice wavetable synthesizer

• Aureal A3D

• Ensoniq 3D positional audio and Microsoft DirectSound

†

API, Sound Blaster Pro†, Roland MPU-401 MIDI, joystick compatible

†

3D support

1.10.3 Crystal Semiconductor CS4297A Analog Codec

The Crystal Semiconductor CS4297A is a fully AC ’97 compliant codec. The codec's features include:

• 18-bit stereo full-duplex operation

• Up to 48 kHz sampling rate

• Connects to ES1373D digital controller using a five-wire digital interface

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.10.4 Audio Connectors

The audio connectors include the following:

• Line out (back panel)

• Mic in (back panel)

• ATAPI CD-ROM (connects an internal ATAPI CD-ROM drive to the audio mixer)

For information about Refer to

The back panel audio connectors Section 2.8.1, page 39 The location of the ATAPI CD-ROM connector Figure 5, page 41 The signal names of the ATAPI CD-ROM connector Table 29, page 45

1.11 Hardware Monitor Component

The hardware monitor component provides low-cost instrumentation capabilities. The features of the component include:

• Internal ambient temperature sensing

• Remote thermal diode sensing for direct monitoring of processor temperature

• Power supply monitoring (+12, +5, +3.3, +2.5, V

acceptable values

• SMBus interface

• The hardware monitor component enables the board to be compatible with the Wired for

Management (WfM) specification.

CCP) to detect levels above or below

For information about Refer to

The board’s compatibility with the WfM specification Table 2, page 13

Product Description

1.12 LAN Subsystem

The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both 10Base-T and 100Base-TX connectivity. Features include:

• 32-bit, 33 MHz direct bus mastering on the PCI bus

• 10Base-T and 100Base-TX capability using a single RJ-45 connector with connection and

activity status LEDs

• IEEE 802.3u Auto-Negotiation for the fastest available connection

• Jumperless configuration; the LAN subsystem is completely software-configurable

For information about Refer to

The WfM specification Table 2, page 13

1.12.1 Intel® 82559 PCI LAN Controller

The Intel 82559 PCI LAN controller’s features include:

• CSMA/CD Protocol Engine

• PCI bus interface

• DMA engine for movement of commands, status, and network data across the PCI bus

• Integrated physical layer interface, including:  Complete functionality necessary for the 10Base-T and 100Base-TX network interfaces;

when in 10 Mbit/sec mode, the interface drives the cable directly

 A complete set of Media Independent Interface (MII) management registers for control

and status reporting

 IEEE 802.3u Auto-Negotiation for automatically establishing the best operating mode

when connected to other 10Base-T or 100Base-TX devices, whether half- or full-duplex capable

• Integrated power management features, including support for wake on network event (from an ACPI

S3 state using the PCI bus PME# signal)

For information about Refer to

The LAN subsystem’s PCI specification compliance Table 2, page 13

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.12.2 LAN Subsystem Software

The Intel 82559 Fast Ethernet WfM PCI LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers Section 1.2, page 13

1.12.3 RJ-45 LAN Connector LEDs

Two LEDs are built into the RJ-45 LAN connector. Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 6. LAN Connector LED States

LED Color LED State Condition

Off 10 Mbit/sec data rate is selected.Green On 100 Mbit/sec date rate is selected.

Yellow

Off LAN link is not established. On (steady state) LAN link is established. On (brighter and pulsing) The computer is communicating with another computer on

the LAN.

Product Description

1.13 Power Management Features

Power management is implemented at several levels, including:

• Advanced Configuration and Power Interface (ACPI)

• Hardware support:  Power connector  Wake on network event  Instantly Available technology  Wake on Ring  Resume on Ring

1.13.1 ACPI

If the board is used with an ACPI-aware operating system, the BIOS can provide ACPI support. ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires the support of an operating system that provides full ACPI functionality. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in boards may

require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping state, and less than 5-watt system operation in the Suspend to RAM sleeping state

• A Soft-off feature that enables the operating system to power off the computer

• Support for multiple wake up events (see Table 9 on page 29)

• Support for a front panel power and sleep mode switch. Table 7 lists the system states based

on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 7. Effects of Pressing the Power Switch

…and the power switch is

If the system is in this state…

Off (ACPI G2/S5 state) Less than four seconds Power on On (ACPI G0 state) Less than four seconds Soft off/Suspend On (ACPI G0 state) More than four seconds Fail safe power off Sleep (ACPI G1 state) Less than four seconds Wake up Sleep (ACPI G1 state) More than four seconds Power off

For information about Refer to

The board’s compliance level with ACPI Section 1.3, page 13

pressed for …the system enters this state

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.13.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 8 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 8. Power States and Targeted System Power

Global States Sleeping States CPU States Device States Targeted System Power*

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off.

AC power is disconnected from the computer.

* Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the

system chassis’ power supply.

** Dependent on the standby power consumpt i on of wake up devices used in the system.

S0 – working C0 – working D0 – working

state

S1 – CPU stopped C1 – stop

grant

S3 – Suspend-toRAM. Context saved to RAM.

Context not saved. Cold boot is required.

No power to the system.

No power D3 – no power

No power D3 – no power for

D1, D2, D3 – device specification specific.

except for wake up logic.

wake up logic, except when provided by battery or external source.

Full power > 30 W

5 W < power < 30 W

Power < 5 W **

No power to t he system so that service can be performed.

Product Description

1.13.1.2 Wake Up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific states.

Table 9. Wake Up Devices and Events

These devices/events can wake up the computer… …from this state

Power switch S1, S3, S5 RTC alarm S1, S3, S5 LAN S1, S3 Modem S1, S3 USB S1, S3 PCI bus PME# S3

1.13.1.3 Plug and Play

In addition to power management, ACPI provides controls and information so that the operating system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to enumerate and configure devices that do not have other hardware standards for enumeration and configuration. PCI devices on a desktop board, for example, are not enumerated by ACPI.

1.13.2 Hardware Support

CAUTION

If Wake on network event and Instantly Available technology features are used, the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Refer to Section 2.11.3 on page 54 for additional information.

The board provides several hardware features that support power management, including:

• Power connector

• Wake on network event

• Instantly Available technology

• Wake on Ring

• Resume on Ring

Wake on network event and Instantly Available technology require power from the +5 V standby line. The sections discussing these features describe the incremental standby power requirements for each.

Wake on Ring and Resume on Ring enable telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal) and the power management mode being used (ACPI).

NOTE

✏

The use of Wake on Ring and Resume on Ring technologies from an ACPI state require the support of an operating system that provides full ACPI functionality.

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.13.2.1 Power Connector

When used with an ATX-compliant power supply that supports remote power on/off, the board can turn off the system power through software control. To enable soft-off control in software, advanced power management must be enabled in the BIOS Setup program and in the operating system. When the system BIOS receives the correct power management command from the operating system, the BIOS turns off power to the computer.

With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected power cord, when power resumes, the computer returns to the power state it was in before power was interrupted (on or off).

For information about Refer to

The location of the power connector Figure 5, page 41 The signal names of the power connector Table 27, page 44 The ATX specification Section 1.3, page 13

1.13.2.2 Fan Connectors

The board has two fan connectors. The functions of these connectors are described in Table 10.

Table 10. Fan Connector Descriptions

Connector Function

Chassis fan Provides +12 V DC for a system o r chassis fan. Processor fan Provides +12 V DC for a processor fan or active fan heatsink.

For information about Refer to

The location of the fan connectors Figure 5, page 41 The signal names of the chassis fan connector Table 22, page 42 The signal names of the processor fan connector Table 23, page 42

1.13.2.3 Wake on Network Event CAUTION

For Wake on network event, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Wake on network event can damage the power supply. Refer to Section 2.11.3 on page 54 for additional information.

Wake on network event enables remote wakeup of the computer through a network. The LAN subsystem, whether onboard or as a PCI bus network adapter, monitors network traffic at the

†

Media Independent Interface. Upon detecting a Magic Packet wakeup signal that powers up the computer. The board supports Wake on network event through the PCI bus PME# signal.

, the LAN subsystem asserts a

Product Description

1.13.2.4 Instantly Available Technology CAUTION

For Instantly Available technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when using this feature can damage the power supply. Refer to Section 2.11.3 on page 54 for additional information.

Instantly Available technology enables the board to enter the ACPI S3 (Suspend-to-RAM) sleepstate. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, the fans are off, and the power LED is amber). When signaled by a wake up device or event, the system quickly returns to its last known wake state. Table 9 on page 29 lists the devices and events that can wake the computer from the S3 state.

The board supports the PCI Bus Power Management Interface Specification. For information on the versions of these specifications, see Section 1.3. Add-in boards that also support these specifications can participate in power management and can be used to wake the computer.

1.13.2.5 Wake on Ring NOTE

✏

Wake on Ring requires the use of a modem (external USB or internal PCI) that supports the Wake on Ring feature.

The operation of Wake on Ring can be summarized as follows:

• Wakes up the computer from the ACPI S5 state

• Requires two calls to access the computer:

 First call restores the computer  Second call enables access (when the appropriate software is loaded)

• Detects incoming calls differently for external as opposed to internal modems:

 For external USB modems, the USB bus is monitored for the RING_DETECT signal  For internal PCI modems, incoming calls are detected through the PCI bus PME# signal

1.13.2.6 Resume on Ring

The operation of Resume on Ring can be summarized as follows:

• Resumes operation from the ACPI S1 state

• Requires only one call to access the computer

• Detects incoming call similarly for external and internal modems

Intel Desktop Board D810EMO/MO810E Technical Product Specification