HP HCPL-4200 Datasheet

1-373

H

Optically Coupled 20 mA
Current Loop Receiver

Technical Data

HCPL-4200

Features

• Data Output Compatible
with LSTTL, TTL and CMOS

• 20 K Baud Data Rate at 1400
Metres Line Length

• Guaranteed Performance
over Temperature (0°C to
70°C)

• Guaranteed On and Off
Thresholds

• LED is Protected from
Excess Current

• Input Threshold Hysteresis

• Three-State Output Compat­ible with Data Buses

• Internal Shield for High
Common Mode Rejection

• Safety Approval

UL Recognized -2500 V rms,

for 1 Minute

CSA Approved

• Optically Coupled 20 mA
Current Loop Transmitter,
HCPL-4100, Also Available

Applications

• Isolated 20 mA Current

• Loop Receiver in:

Computer Peripherals
Industrial Control Equipment
Data Communications

Equipment

Description

The HCPL-4200 optocoupler is
designed to operate as a receiver
in equipment using the 20 mA
Current Loop. 20 mA current
loop systems conventionally sig­nal a logic high state by transmit­ting 20 mA of loop current
(MARK), and signal a logic low
state by allowing no more than a
few milliamperes of loop current
(SPACE). Optical coupling of the
signal from the 20 mA current
loop to the logic output breaks
ground loops and provides for a
very high common mode
rejection. The HCPL-4200 aids in
the design process by providing

guaranteed thresholds for logic
high state and logic low state for
the current loop, providing an
LSTTL, TTL, or CMOS compatible
logic interface, and providing
guaranteed common mode
rejection. The buffer circuit on
the current loop side of the
HCPL-4200 provides typically 0.8
mA of hysteresis which increases
the immunity to common mode
and differential mode noise. The
buffer also provides a controlled
amount of LED drive current
which takes into account any
LED light output degradation.
The internal shield allows a
guaranteed 1000 V/µs common
mode transient immunity.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.

Functional Diagram

A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.

5965-3580E

1-374

Ordering Information

Specify part number followed by Option Number (if desired).

HCPL-4200# XXX

300 = Gull Wing Surface Mount Lead Option
500 = Tape/Reel Package Option (1 K min)

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.

Package Outline Drawings – 8 Pin DIP Package (HCPL-4200)

8 Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4200)

0.635 ± 0.25

(0.025 ± 0.010)

12° NOM.

9.65 ± 0.25

(0.380 ± 0.010)

0.635 ± 0.130

(0.025 ± 0.005)

7.62 ± 0.25

(0.300 ± 0.010)

5

6

7

8

4

3

2

1

9.65 ± 0.25

(0.380 ± 0.010)

6.350 ± 0.25

(0.250 ± 0.010)

1.016 (0.040)

1.194 (0.047)

1.194 (0.047)

1.778 (0.070)

9.398 (0.370)

9.906 (0.390)

4.826

(0.190)



TYP.

0.381 (0.015)

0.635 (0.025)

PAD LOCATION (FOR REFERENCE ONLY)

1.080 ± 0.320

(0.043 ± 0.013)

4.19

(0.165)

MAX.

1.780

(0.070)

MAX.

1.19

(0.047)

MAX.

2.54

(0.100)

BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.254

+ 0.076

- 0.051

(0.010

+ 0.003)

- 0.002)

9.65 ± 0.25

(0.380 ± 0.010)

1.78 (0.070) MAX.

1.19 (0.047) MAX.

HP XXXX



YYWW

DATE CODE

1.080 ± 0.320

(0.043 ± 0.013)

2.54 ± 0.25

(0.100 ± 0.010)

0.51 (0.020) MIN.

0.65 (0.025) MAX.

4.70 (0.185) MAX.

2.92 (0.115) MIN.

DIMENSIONS IN MILLIMETERS AND (INCHES).

5678

4321

5° TYP.

TYPE NUMBER

UL
RECOGNITION

UR

0.254

+ 0.076

- 0.051

(0.010

+ 0.003)

- 0.002)

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

1-375

Thermal Profile (Option #300)

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

TEMPERATURE – °C

220
200
180
160
140
120
100

80
60
40
20

0

260

123456789101112

Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)

Regulatory Information

The HCPL-4200 has been
approved by the following
organizations:

UL

Recognized under UL 1577,
Component Recognition
Program, File E55361.

CSA

Approved under CSA Component
Acceptance Notice #5, File CA

88324.

Insulation and Safety Related Specifications

Parameter Symbol Value Units Conditions

Min. External Air Gap L(IO1) 7.1 mm Measured from input terminals to output
(External Clearance) terminals, shortest distance through air

Min. External Tracking Path L(IO2) 7.4 mm Measured from input terminals to output
(External Creepage) terminals, shortest distance path along body

Min. Internal Plastic Gap 0.08 mm Through insulation distance, conductor to
(Internal Clearance) conductor, usually the direct distance

between the photoemitter and photodetector
inside the optocoupler cavity

Tracking Resistance CTI 200 volts DIN IEC 112/VDE 0303 PART 1
(Comparative Tracking Index)

Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 – surface mount classification is Class A in accordance with CECC 00802.

1-376

Absolute Maximum Ratings

(No Derating Required up to 70°C)

Storage Temperature .................................................. -55°C to +125°C

Operating Temperature ................................................. -40°C to +85°C

Lead Solder Temperature .... 260°C for 10 s (1.6 mm below seating plane)

Supply Voltage – VCC.............................................................. 0 V to 20 V

Average Input Current - II........................................... -30 mA to 30 mA

Peak Transient Input Current - II............................................... 0.5 A

[1]

Enable Input Voltage – VE................................................ -0.5 V to 20 V

Output Voltage – VO........................................................ -0.5 V to 20 V

Average Output Current – IO.......................................................25 mA

Input Power Dissipation – PI................................................... 90 mW

[2]

Output Power Dissipation – PO............................................. 210 mW

[3]

Total Power Dissipation – P .................................................. 255 mW

[4]

Infrared and Vapor Phase Reflow Temperature

(Option #300) ..........................................see Fig. 1, Thermal Profile

Recommended Operating Conditions

Parameter Symbol Min. Max. Units

Power Supply Voltage V

CC

4.5 20 Volts

Forward Input Current I

SI

0 2.0 mA

(SPACE)
Forward Input Current I

MI

14 24 mA

(MARK)
Operating Temperature T

A

070 °C

Fan Out N 0 4 TTL Loads
Logic Low Enable V

EL

0 0.8 Volts

Voltage
Logic High Enable V

EH

2.0 20 Volts

Voltage