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Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP ElitePOS 10TW
1.0 Items Requiring Selective Treatment
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
USB Type-c cable
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. 2
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 2
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
200mm
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
200mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the monitor on a flat, soft and clean surface.
2. Pull up the base cover
3. Release the screws to remove base assembly
4. Release the screws to remove USB type-c cable
5. Disconnect the connector to remove the rear cover
6. Release the screws to remove key boards
7. Disconnect the pins and remove tapes
8. Remove the mylar
9. Release the screws to remove the main board from mainframe
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 3
12. Mechanical Instructions
Step Figure Description
Preparation
Lay the
monitor on a
flat, soft and
clean
surface and
pull up the
deco cover.
Remove
the BASE
Unscrew
the screws
to move the
BASE
ASSY.
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Remove
the rear
cover
Unscrew
the screws
to remove
the USB
cable and
disconnect
the
connectors
to remove
the rear
cover.
Remove
key boards
Remove
the tapes
and pins.
Unscrew
the screws
to remove
the key
boards from
the rear
cover.
Disconnect
the
connectors
and remove
the tapes.
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Remove
the Mylar
Remove
the main
board.
Remove the
Mylar.
Unscrew
the screws
to remove
the main
board from
the
mainframe.
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The panel
The panel
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