The HA13159 is four-channel BTL amplifier IC designed for car audio, featuring high output and low
distortion, and applicable to digital audio equipment. It provides 37 W output per channel, with a 13.7 V
power supply and at Max distortion.
Functions
• 4 ch BTL power amplifiers
• Built-in standby circuit
• Built-in muting circuit
• Built-in protection circuit (surge, T.S.D and ASO)
Features
• Low power dissipation
• Soft thermal limiter
• Requires few external parts (C:3, R:1)
• Popping noise minimized
• Low output noise
• Built-in high reliability protectio n circuit
• Pin to pin with HA13153A/HA13154A/HA13155/HA13157/HA13158/HA13158A
HA13159
Block Diagram
11
13
C2
0.1 µ/16 V
14
IN V
STBY
2
IN-1
1
IN-2
IN-3
CC
Buffer & Mute-1
Buffer & Mute-2
Buffer & Mute-3
PV
18
CC
PVCC1
2
Amp-1
Amp-2
Amp-3
4400 µ/16 V
6
C1
3
4
5
7
8
9
15
16
V
CC
13.2 V
R1
7.5 k
Notes:Standby
1.
Power is turned on when a signal of
3.5 V or 0.05 mA is impressed at pin 2.
When pin 2 is open or connected to
GND, standby is turned on (output off).
Muting
2.
Muting is turned off (output on) when
a signal of 3.5 V or 0.2 mA is impressed
at pin 10.
When pin 10 is open or connected to
GND, muting is turned on (output off).
TAB (header of IC) connected to GND.3.
10
23
IN-4
MUTE
C3
5 V
5 V
Amp-4
2
10
Buffer & Mute-4
Protector
(ASO, Surge, TSD)
1222TAB
10 µ/10 V
37.5 k
23.5 k
25 k
17
19
20
21
Unit R: Ω
Q1 ON
↓
BIAS ON
Q2 ON
↓
MUTE ON
C: F
Rev.2, Jul. 1999, page 2 of 15
Absolute Maximum Ratings
ItemSymbolRatingUnit
Operating supply voltageV
Supply voltage when no signal*
Peak supply voltage*
Output current*
Power dissipation*
2
3
4
1
CC
VCC (DC)26V
VCC (PEAK)50V
IO (PEAK)4A
P
T
Junction temperatureTj150°C
Operating temperatureTopr–30 to +85°C
Storage temperatureTstg–55 to +125°C
Note:1. Tolerance within 30 seconds.
2. Tolerance in surge pulse waveform.
3. Value per 1 channel.
4. Value when attached on the infinite heat sink plate at Ta = 25 °C.
The derating carve is as shown in the graph below.
100
18V
83W
HA13159
83 W
(W)
T
50
28 W
Power dissipation P
0
25
A: When heat sink is infinite (θj-a = 1.5°C/W)
B: When θf (thermal resistance of heat sink) = 3°C/W
(θj-a = 4.5°C/W)
Quiescent currentI
Output offset voltage∆V
GainG
Gain difference between
Q1
∆G
Q
V
V
channels
Rated output powerP
Max output powerP
O
OMAX
Total harmonic distortionT.H.D.—0.03—%Po = 3 W
Output noise voltageWBN—0.15—mVrmsRg = 0 Ω,
Ripple rejectionSVR—55—dBf = 120 Hz
Channel cross talkC.T.—70—dBVout = 0 dBm
Input impedanceRin—25—kΩ
Standby currentI
Standby control voltage (high)V
Standby control voltage (low)V
Muting control voltage (high)V
Muting control voltage (low)V
input stage
4CH1 GNDCH1 power GND———
8CH2 GNDCH2 power GND
16CH3 GNDCH3 power GND
20CH4 GNDCH4 power GND
12IN GNDInput signal GND———
Rev.2, Jul. 1999, page 6 of 15
HA13159
Point of Application Board Design
1. Notes on Application Board’s Pattern Design
• For increasing stability, the connected line of V
impedance.
• For increasing stability, it is better to place the capacitor between V
• It is better to place the grounding of resistor (Rg), between input line and ground, close to INGND (Pin
12) because if OUTGND is connected to the line between Rg and INGND, THD will become worse due
to current from OUTGND.
and OUTGND is better to be made wider and lower
CC
and GND (0.1 µF) close to IC.
CC
Rg
0.1 µFV
6
1
12
3
4
5
CC
Figure 1 Notes on Application Board’s Pattern Design
2. How to Reduce the Popping Noise by Muting Circuit
At normal operating circuit, Muting circuit operates at high speed under 1 µs.
In case popping noise becomes a problem, it is possible to reduce the popping noise by connecting
capacitor, which determines the switching time constant, between pin 10 and GND. (Following figure
2)
We recommend value of capacitor greater then 1 µF.
Also transitional popping noise can be reduced sharply by muting before V
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, in cluding
intellectual property rights, in connection with u se of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Sales Offices
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
Asia : http://sicapac.hitachi-asia.com
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH
Electronic Components Group
Dornacher Straße 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 585160
Hitachi Asia Ltd.
Hitachi Tower
16 Collyer Quay #20-00,
Singapore 049318
Tel : <65>-538-6533/538-8577
Fax : <65>-538-6933/538-3877
URL : http://www.hitachi.com.sg
Hitachi Asia Ltd.
(Taipei Branch Office)
4/F, No. 167, Tun Hwa North Road,
Hung-Kuo Building,
Taipei (105), Taiwan
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon,
Hong Kong
Tel : <852>-(2)-735-9218
Fax : <852>-(2)-730-0281
URL : http://www.hitachi.com.hk
Colophon 2.0
Rev.2, Jul. 1999, page 15 of 15
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