HIT HA13152, HA13151 Datasheet

HA13151, HA13152

14 W × 4-Channel BTL Power IC

ADE-207-116 1st. Edition

Description

The HA13151/HA13152 are high output and low distortion 4 ch BTL power IC designed for digital car audio.

At 13.2 V to 4 Ω load, this power IC provides output power 14 W with 10% distortion.

Functions

∙4 ch BTL power amplifiers

∙Built-in standby circuit

∙Built-in muting circuit

∙Built-in protection circuit (surge, T.S.D, and ASO)

Features

∙Few external parts lead to compact set-area possibility

∙Popping noise minimized

∙Low output noise

∙Built-in high reliability protection circuit

HA13151, HA13152

Block Diagram

Absolute Maximum Ratings (Ta = 25°C)

Item

Symbol

Rating

Unit

Remarks

2

				HA13151, HA13152
	Operating supply voltage	VCC	18	V
	Supply voltage when no signal*1	VCC (DC)	26	V
	Peak supply voltage*2	VCC (PEAK)	50	V
	Output current*3	IO (PEAK)	3	A
	Power dissipation*4	PT	83	W
	Junction temperature	Tj	150	°C
	Operating temperature	Topr	–30 to +85	°C
	Storage temperature	Tstg	–55 to +125	°C

Notes: 1. Tolerance within 30 seconds

2.Tolerance in surge pulse waveform

3.Value per 1 channel

4.Value when attached on the infinite heat sink plate at Ta = 25 °C. The derating carve is as shown in the graph below.

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HA13151, HA13152

Electrical Characteristics (VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Rg = 600 Ω, Ta = 25°C)

HA13151

Item	Symbol	Min	Typ	Max	Unit	Test Conditions
Quiescent current	IQ1	—	270	—	mA	Vin = 0
Output offset voltage	VQ	–300	0	+300	mV
Gain	GV	30.5	32	33.5	dB
Gain difference between	GV	–1.5	0	+1.5	dB
channels
Rated output power	Po	—	14	—	W	VCC = 13.2 V
						THD = 10%, RL = 4 Ω
Max output power	Pomax	—	22	—	W	VCC = 13.7 V
						THD = Max, RL = 4 Ω
Total harmonic distortion	T.H.D.	—	0.05	—	%	Po = 3 W
Output noise voltage	WBN	—	0.15	—	mVrms	Rg = 0 Ω
						BW = 20 to 20 kHz
Ripple rejection	SVR	—	55	—	dB	Rg = 600 Ω, f = 120 Hz
Channel cross talk	C.T.	—	70	—	dB	Rg = 600 Ω
						Vout = 0 dBm
Input impedance	Rin	—	25	—	kΩ
Standby current	IQ2	—	—	200	µA
Standby control voltage	VSTH	3.5	—	VCC	V
(high)
Standby control voltage	VSTL	0	—	1.5	V
(low)
Muting control voltage	VMH	3.5	—	VCC	V
(high)
Muting control voltage	VML	0	—	1.5	V
(low)
Muting attenuation	ATTM	—	70	—	dB	Vout = 0 dBm

4

HA13151, HA13152

HA13152

Item	Symbol	Min	Typ	Max	Unit	Test Conditions
Quiescent current	IQ1	—	270	—	mA	Vin = 0
Output offset voltage	VQ	–300	0	+300	mV
Gain	GV	38.5	40	41.5	dB
Gain difference between	GV	–1.5	0	+1.5	dB
channels
Rated output power	Po	—	14	—	W	VCC = 13.2 V
						THD = 10%, RL = 4 Ω
Max output power	Pomax	—	22	—	W	VCC = 13.7 V
						THD = Max, RL = 4 Ω
Total harmonic distortion	T.H.D.	—	0.05	—	%	Po = 3%
Output noise voltage	WBN	—	0.25	—	mVrms	Rg = 0 Ω
						BW = 20 to 20 kHz
Ripple rejection	SVR	—	45	—	dB	Rg = 600 Ω, f = 120 Hz
Channel cross talk	C.T.	—	60	—	dB	Rg = 600 Ω
						Vout = 0 dBm
Input impedance	Rin	—	25	—	kΩ
Standby current	IQ2	—	—	200	µA
Standby control voltage	VSTH	3.5	—	VCC	V
(high)
Standby control voltage	VSTL	0	—	1.5	V
(low)
Muting control voltage	VMH	3.5	—	VCC	V
(high)
Muting control voltage	VML	0	—	1.5	V
(low)
Muting attenuation	ATTM	—	60	—	dB	Vout = 0 dBm

5

HA13151, HA13152

Pin Explanation

Pin			Input	DC
No.	Symbol	Functions	Impedance	Voltage	Equivalence Circuit
1	IN1	CH1 INPUT	25 kΩ (Typ)	0 V

11	IN2	CH2 INPUT
13	IN3	CH3 INPUT
23	IN4	CH4 INPUT
2	STBY	Standby control	90 kΩ	—
			(at Trs. cutoff)

3

OUT1 + CH1 OUTPUT

—

VCC/2

5	OUT1 –
7	OUT2 +	CH2 OUTPUT
9	OUT2 –
15	OUT3 +	CH3 OUTPUT
17	OUT3 –
19	OUT4 +	CH4 OUTPUT
21	OUT4 –
10	MUTE	Muting control	25 kΩ (Typ)	—

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					HA13151, HA13152
	Pin Explanation (cont)
	Pin			Input	DC
	No.	Symbol	Functions	Impedance	Voltage Equivalence Circuit
	22	RIPPLE	Bias stability	—	VCC/2

6	PVCC1	Power of output stage	—	VCC	—
18	PVCC2
14	INVCC	Power of input stage	—	VCC	—
4	CH1 GND	CH1 power GND	—	—	—
8	CH2 GND	CH2 power GND
16	CH3 GND	CH3 power GND
20	CH4 GND	CH4 power GND
12	IN GND	Input signal GND	—	—	—

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HA13151, HA13152

Point of Application Board Design

1. Notes on Application Board’s Pattern Design

∙For increasing stability, the connected line of VCC and OUTGND is better to be made wider and lower impedance.

∙For increasing stability, it is better to place the capacitor between VCC and GND (0.1 µF) close to IC.

∙For increasing stability, it is better to place C1 to C8 and R1 to R8, which are for stopping oscillation, close to IC.

∙It is better to place the grounding of resistor (Rg), between input line and ground, close to INGND (Pin 12) because if OUTGND is connected to the line between Rg and INGND, THD will become worse due to current from OUTGND.

Figure 1 Notes on Application Board’s Pattern Design

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