HIT HA13152, HA13151 Datasheet
HA13151, HA13152
14 W × 4-Channel BTL Power IC
ADE-207-116
1st. Edition
Description
The HA13151/HA13152 are high output and low distortion 4 ch BTL power IC designed for digital car
audio.
At 13.2 V to 4 Ω load, this power IC provides output power 14 W with 10% distortion.
Functions
• 4 ch BTL power amplifiers
• Built-in standby circuit
• Built-in muting circuit
• Built-in protection circuit (surge, T.S.D, and ASO)
Features
• Few external parts lead to compact set-area possibility
• Popping noise minimized
• Low output noise
• Built-in high reliability protection circuit
HA13151, HA13152
Block Diagram
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Rating Unit Remarks
2
HA13151, HA13152
Operating supply voltage V
CC
18 V
Supply voltage when no signal*1VCC (DC) 26 V
Peak supply voltage*
Output current*
Power dissipation*
2
3
4
VCC (PEAK) 50 V
IO (PEAK) 3 A
P
T
83 W
Junction temperature Tj 150 °C
Operating temperature Topr –30 to +85 °C
Storage temperature Tstg –55 to +125 °C
Notes: 1. Tolerance within 30 seconds
2. Tolerance in surge pulse waveform
3. Value per 1 channel
4. Value when attached on the infinite heat sink plate at Ta = 25 °C.
The derating carve is as shown in the graph below.
3
HA13151, HA13152
Electrical Characteristics (VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Rg = 600 Ω, Ta =
25°C)
HA13151
Item Symbol Min Typ Max Unit Test Conditions
Quiescent current IQ1 — 270 — mA Vin = 0
Output offset voltage ∆V
Gain G
Gain difference between
∆G
Q
V
V
channels
Rated output power Po — 14 — W VCC = 13.2 V
Max output power Pomax — 22 — W VCC = 13.7 V
Total harmonic distortion T.H.D. — 0.05 — % Po = 3 W
Output noise voltage WBN — 0.15 — mVrms Rg = 0 Ω
Ripple rejection SVR — 55 — dB Rg = 600 Ω, f = 120 Hz
Channel cross talk C.T. — 70 — dB Rg = 600 Ω
Input impedance Rin — 25 — kΩ
Standby current IQ2 — — 200 µA
Standby control voltage
V
STH
(high)
Standby control voltage
V
STL
(low)
Muting control voltage
V
MH
(high)
Muting control voltage
V
ML
(low)
Muting attenuation ATTM — 70 — dB Vout = 0 dBm
–300 0 +300 mV
30.5 32 33.5 dB
–1.5 0 +1.5 dB
3.5 — V
CC
V
0 — 1.5 V
3.5 — V
CC
V
0 — 1.5 V
THD = 10%, RL = 4 Ω
THD = Max, RL = 4 Ω
BW = 20 to 20 kHz
Vout = 0 dBm
4
HA13151, HA13152
HA13152
Item Symbol Min Typ Max Unit Test Conditions
Quiescent current IQ1 — 270 — mA Vin = 0
Output offset voltage ∆V
Gain G
Gain difference between
∆G
Q
V
V
channels
Rated output power Po — 14 — W VCC = 13.2 V
Max output power Pomax — 22 — W VCC = 13.7 V
Total harmonic distortion T.H.D. — 0.05 — % Po = 3%
Output noise voltage WBN — 0.25 — mVrms Rg = 0 Ω
Ripple rejection SVR — 45 — dB Rg = 600 Ω, f = 120 Hz
Channel cross talk C.T. — 60 — dB Rg = 600 Ω
Input impedance Rin — 25 — kΩ
Standby current IQ2 — — 200 µA
Standby control voltage
V
STH
(high)
Standby control voltage
V
STL
(low)
Muting control voltage
V
MH
(high)
Muting control voltage
V
ML
(low)
Muting attenuation ATTM — 60 — dB Vout = 0 dBm
–300 0 +300 mV
38.5 40 41.5 dB
–1.5 0 +1.5 dB
3.5 — V
CC
V
0 — 1.5 V
3.5 — V
CC
V
0 — 1.5 V
THD = 10%, RL = 4 Ω
THD = Max, RL = 4 Ω
BW = 20 to 20 kHz
Vout = 0 dBm
5
HA13151, HA13152
Pin Explanation
Pin
No. Symbol Functions
1 IN1 CH1 INPUT 25 kΩ (Typ) 0 V
11 IN2 CH2 INPUT
13 IN3 CH3 INPUT
23 IN4 CH4 INPUT
2 STBY Standby control 90 kΩ
3 OUT1 + CH1 OUTPUT — VCC/2
Input
Impedance
(at Trs. cutoff)
DC
Voltage Equivalence Circuit
—
5 OUT1 –
7 OUT2 + CH2 OUTPUT
9 OUT2 –
15 OUT3 + CH3 OUTPUT
17 OUT3 –
19 OUT4 + CH4 OUTPUT
21 OUT4 –
10 MUTE Muting control 25 kΩ (Typ) —
6
Pin Explanation (cont)
HA13151, HA13152
Pin
No. Symbol Functions
Input
Impedance
DC
Voltage Equivalence Circuit
22 RIPPLE Bias stability — VCC/2
6 PVCC1 Power of output stage — V
CC
—
18 PVCC2
14 INV
CC
Power of input stage — V
CC
—
4 CH1 GND CH1 power GND — — —
8 CH2 GND CH2 power GND
16 CH3 GND CH3 power GND
20 CH4 GND CH4 power GND
12 IN GND Input signal GND — — —
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HA13151, HA13152
Point of Application Board Design
1. Notes on Application Board’s Pattern Design
• For increasing stability, the connected line of VCC and OUTGND is better to be made wider and
lower impedance.
• For increasing stability, it is better to place the capacitor between VCC and GND (0.1 µF) close to
IC.
• For increasing stability, it is better to place C1 to C8 and R1 to R8, which are for stopping
oscillation, close to IC.
• It is better to place the grounding of resistor (Rg), between input line and ground, close to INGND
(Pin 12) because if OUTGND is connected to the line between Rg and INGND, THD will become
worse due to current from OUTGND.
Figure 1 Notes on Application Board’s Pattern Design
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