Thermal Resistance Junction to Case TO-220,TO-2631.3
Thermal Resistance Junction to Ambient TO-220, TO-263 ( Note 2)62
Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad ar ea43
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
FDB13AN06A0FDB13AN06A0TO-263AB330mm24mm800 units
FDP13AN06A0FDP13AN06A0TO-220ABTubeN/A50 units
FDB13AN06A0 / FDP13AN06A0
Electrical Characteristics
TC = 25°C unless otherwise noted
SymbolParameterTest Con ditionsMinTypMaxUnits
Off Characteristics
B
I
DSS
I
GSS
VDSS
Drain to Sou r c e Br ea k down Voltag eID = 250µA, VGS = 0V60--V
V
= 50V--1
Zero Gate Voltage Drain Current
DS
= 0VTC = 150oC- -250
V
GS
Gate to Source Leakage CurrentVGS = ±20V--±100nA
On Characteristics
V
GS(TH)
r
DS(ON)
Gate to Source Threshold VoltageVGS = VDS, ID = 250µA2-4V
I
= 62A, VGS = 10V -0.0115 0.0135
D
I
= 31A, VGS = 6V -0.0220.034
Drain to S ou r c e On Re si st ance
D
= 62A, VGS = 10V,
I
D
T
= 175oC
J
-0.0260.030
Dynamic Characteristics
C
C
C
Q
Q
Q
Q
Q
ISS
OSS
RSS
g(TOT)
g(TH)
gs
gs2
gd
Input Capacitance
Output Capacitance-260-pF
Reverse Transfer Capacitance-90-pF
= 25V, VGS = 0V,
V
DS
f = 1MHz
Total Gate Charge at 10VVGS = 0V to 10V
Threshold Gate ChargeVGS = 0V to 2V-2.63.4nC
Gate to Source Gate Charg e-8.5-nC
Gate Charge Threshold to Plateau-5.9-nC
V
DD
I
= 62A
D
I
= 1.0m A
g
= 30V
Gate to Drain “Miller” Charge-6.4-nC
-1350-pF
2229nC
µA
Ω
Switching Characteristics
t
ON
t
d(ON)
t
r
t
d(OFF)
t
f
t
OFF
Turn-On Time
Turn-On Delay Time-9-ns
Rise Time-96-ns
Turn-Off D elay Time-24-ns
Fall Time-26-ns
Turn-Off Time--74ns