Datasheet FDA15N65 Datasheet (Fairchild)

Page 1

FDA15N65

650V N-Channel MOSFET

FDA15N65 650V N-Channel MOSFET
January 2007
TM
UniFET
• 16A, 650V, R
• Low gate charge ( typical 48.5 nC)
•Low C
•Fast switching
• 100% avalanche tested
• Improved dv/dt capability
( typical 23.6 pF)
rss
= 0.44Ω @VGS = 10 V
DS(on)
GSD
TO-3PN
FDA Series
Description
These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology.
This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction.
D
G
S
Absolute Maximum Ratings
Symbol Parameter FDA15N65 Unit
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
P
D
T
J, TSTG
T
L
Drain-Source Voltage 650 V
Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
Drain Current - Pulsed
Gate-Source voltage ± 30 V
Single Pulsed Avalanche Energy
Avalanche Current (Note 1) 16 A
Repetitive Avalanche Energy (Note 1) 26 mJ
Power Dissipation (TC = 25°C)
- Derate above 25°C
Operating and Storage Temperature Range -55 to +150 °C
Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
(Note 1)
(Note 2)
16
9.6
64
637 mJ
260
2.1
300 °C
W/°C
A A
A
W
Thermal Characteristics
Symbol Parameter Min. Max. Unit
R
θJC
R
θCS
R
θJA
©2007 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FDA15N65 Rev. A
Thermal Resistance, Junction-to-Case -- 0.48 °C/W
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
Thermal Resistance, Junction-to-Ambient -- 40 °C/W
Page 2
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Widt h Quantity
FDA15N65 FDA15N65 TO-3PN -- -- 30
FDA15N65 650V N-Channel MOSFET
Electrical Characteristics T
= 25°C unless otherwise noted
C
Symbol Parameter Conditions Min Typ Max Units
Off Characteristics
BV
DSS
ΔBV / ΔT
I
DSS
I
GSSF
I
GSSR
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Dynamic Characteristics
C
iss
C
oss
C
rss
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Drain-Source Breakdown Voltage VGS = 0V, ID = 250μA, TJ = 25°C 650 -- -- V
Breakdown Voltage Temperature
DSS
Coefficient
J
Zero Gate Voltage Drain Current VDS = 650V, VGS = 0V
ID = 250μA, Referenced to 25°C -- 0.65 -- V/°C
VDS = 520V, TC = 125°C
--
--
--
--
Gate-Body Leakage Current, Forward VGS = 30V, VDS = 0V -- -- 100 nA
Gate-Body Leakage Current, Reverse VGS = -30V, VDS = 0V -- -- -100 nA
Gate Threshold Voltage VDS = VGS, ID = 250μA 3.0 -- 5.0 V
Static Drain-Source On-Resistance
Forward Transconductance VDS = 40V, ID = 8A
Input Capacitance VDS = 25V, VGS = 0V,
Output Capacitance -- 295 385 pF
VGS = 10V, ID = 8A -- 0.36 0.44 Ω
(Note 4)
-- 19.2 -- S
-- 2380 3095 pF
f = 1.0MHz
Reverse Transfer Capacitance -- 23.6 35.5 pF
Turn-O n Delay Time VDD = 325V, ID = 15A
Turn-O n Ris e Ti me -- 125 260 ns
RG = 21.7Ω
-- 65 140 ns
Turn-O ff Delay Time -- 105 220 ns
Turn-O ff Fall Time -- 65 140 ns
Total Gate Charge VDS = 520V, ID = 15A
Gate-Source Charge -- 14.0 -- nC
VGS = 10V
Gate-Drain Charge -- 21.2 -- nC
(Note 4, 5)
-- 48.5 63.0 nC
(Note 4, 5)
Maximum Continuous Drain-Source Diode Forward Current -- -- 16 A
Maximum Pulsed Drain-Source Diode Forward Current -- -- 64 A
Drain-Source Diode Forward Voltage VGS = 0V, IS = 16A -- -- 1.4 V
Reverse Recovery Time VGS = 0V, IS = 15A
Reverse Recovery Charge -- 5.69 -- μC
dIF/dt =100A/μs (Note 4)
-- 496 -- ns
10
1
μA μA
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 4.6mH, IAS = 16A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 16A, di/dt ≤ 200A/μs, VDD ≤ BV
4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
, Starting TJ = 25°C
DSS
FDA15N65 Rev. A
2 www.fairchildsemi.com
Page 3
Typical Performance Characteristics
24681012
10
0
10
1
10
2
150oC
25oC
-55oC
* Notes :
1. V
DS
= 40V
2. 250
μs Pulse Test
I
D
, Drain Current [A]
VGS, Gate-Source Voltage [V]
10
-1
10
0
10
1
10
-1
10
0
10
1
V
GS
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V Bottom : 5.5 V
* Notes :
1. 250
μs Pulse Test
2. T
C
= 25oC
I
D
, Drain Current [A]
VDS, Drain-Source Voltage [V]
0 1020304050
0.0
0.2
0.4
0.6
0.8
1.0
VGS = 20V
VGS = 10V
* Note : TJ = 25oC
R
DS(ON)
[Ω],
Drain-Source On-Resistance
ID, Drain Current [ A]
0.2 0. 4 0.6 0.8 1.0 1. 2 1.4
10
0
10
1
150oC
* Notes :
1. V
GS
= 0V
2. 250
μs Pulse Test
25oC
I
DR
, Reverse Drain Current [A]
VSD, Source-Drain voltage [V]
0 10 20304050
0
2
4
6
8
10
12
VDS = 325V
VDS = 130V
VDS = 520V
* Note : ID = 15A
V
GS
, Gate-Source Voltage [V]
QG, Total Gate Charge [nC]
10
-1
10
0
10
1
0
1000
2000
3000
4000
5000
C
iss
= Cgs + Cgd (Cds = shorted)
C
oss
= Cds + C
gd
C
rss
= C
gd
* Note ;
1. V
GS
= 0 V
2. f = 1 MHz
C
rss
C
oss
C
iss
Capacitances [pF]
VDS, Drain-Source Voltage [V]
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperatue
FDA15N65 650V N-Channel MOSFET
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
FDA15N65 Rev. A
3 www.fairchildsemi.com
Page 4
Typical Performance Characteristics (Continued)
-100 -50 0 50 100 150 200
0.8
0.9
1.0
1.1
1.2
* Notes :
1. V
GS
= 0 V
2. I
D
= 250 μA
BV
DSS
, (Normalized)
Drain-Source Breakdown Voltage
TJ, Junction Temperature [oC]
-100 -50 0 50 100 150 200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
* Notes :
1. V
GS
= 10 V
2. I
D
= 5.5 A
R
DS(ON)
, (Normalized)
Drain-Source On-Resistance
TJ, Junction Temperat ure [oC]
-100 -50 0 50 100 150 200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
* Notes :
1. V
GS
= 10 V
2. I
D
= 8 A
R
DS(ON)
, (Normalized)
Drain-Source On-Resistance
TJ, Junction Temperature [oC]
10
0
10
1
10
2
10
3
10
-2
10
-1
10
0
10
1
10
2
100 ms
1 ms
10 μs
DC
10 ms
100 μs
Operation in This Area is Limited by R
DS(on)
* Notes :
1. T
C
= 25 oC
2. T
J
= 150 oC
3. Single Pulse
I
D
, Drain Current [A]
VDS, Drain-Source Voltage [V]
25 50 75 100 125 150
0
3
6
9
12
15
18
I
D
, Drain Current [A]
TC, Case Temperature [oC]
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
-2
10
-1
10
0
* Notes :
1. Z
θJC
(t) = 0.48 oC/W Max.
2. D uty Fa ctor, D = t
1/t2
3. TJM - TC = PDM * Z
θJC
(t)
single pulse
D=0.5
0.02
0.2
0.05
0.1
0.01
Z
θJC
(t), Thermal Response
t1, Sq u are W ave Pu lse D u ratio n [s ec]
t
1
P
DM
t
2
Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation
vs. Temperature vs. Temperature
Figure 9. Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature
FDA15N65 650V N-Channel MOSFET
Figure 11. Transient Thermal Response Curve
FDA15N65 Rev. A
4 www.fairchildsemi.com
Page 5
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDA15N65 650V N-Channel MOSFET
FDA15N65 Rev. A
5 www.fairchildsemi.com
Page 6
Peak Diode Recovery dv/dt Test Circuit & Waveforms
FDA15N65 650V N-Channel MOSFET
FDA15N65 Rev. A
6 www.fairchildsemi.com
Page 7
Mechanical Dimensions
TO-3PN
FDA15N65 650V N-Channel MOSFET
FDA15N65 Rev. A
Dimensions in Millimeters
7 www.fairchildsemi.com
Page 8
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
®
UniFET™ VCX™ Wire™
FDA15N65 650V N-Channel MOSFET
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Datasheet Identification Product Status Definition
Advance Information Formative or In Design This datasheet contains the design specifications for
product development. Specifications may change in any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
FDA15N65 Rev. A
Rev. I22
8 www.fairchildsemi.com
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