The STTH12R06 uses ST Turbo 2 600V
technology and is specially suited as a boost
diode in continuous mode power factor
corrections and hard switching conditions.
This device is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.
RMS
DC
STTH12R06
K
A
K
TO-220AC
STTH12R06D
K
A
NC
2
PAK
D
STTH12R06G
Table 1.Device summary
STTH12R06FP
TO-220AC insulated
STTH12R06DIRG
TO-220FPAC
A
K
A
K
SymbolValue
I
F(AV)
V
RRM
(typ)7 A
I
RM
T
j
V
(typ)1.4 V
F
(max)25 ns
t
rr
12 A
600 V
175 °C
February 2010Doc ID 7973 Rev 41/11
www.st.com
11
Page 2
CharacteristicsSTTH12R06
1 Characteristics
Table 2.Absolute ratings (limiting values)
SymbolParameterValueUnit
V
Repetitive peak reverse voltage600V
RRM
TO-220AC / TO-220FPAC / D2PA K3 0
I
F(RMS)
I
F(AV)
I
T
Table 3.Thermal resistance
Forward rms current
TO-220AC ins.24
2
TO-220AC / D
Average forward current δ = 0.5
TO-220AC ins.T
Surge non repetitive forward currenttp = 10 ms sinusoidal100A
FSM
Storage temperature range-65 to + 175°C
stg
Maximum operating junction temperature175°C
T
j
PAK Tc = 125 °C
= 50 °C
c
= 80 °C
c
12ATO-220FPACT
SymbolParameterValue (max)Unit
2
PAK 1.7
°C/WTO-220FPAC4.4
R
th(j-c)
TO-220AC / D
Junction to case
TO-220AC ins.3.3
A
Table 4.Static electrical characteristics
SymbolParameterTest conditionsMin.Typ.Max.Unit
I
Reverse leakage current
R
V
Forward voltage drop
F
= 25 °C
j
= 125 °C50600
T
j
T
= 25 °C
j
Tj = 125 °C1.41.8
= V
V
R
= 12 A
I
F
RRM
45
2.9
T
To evaluate the conduction losses use the following equation:
P = 1.16 x I
F(AV)
+ 0.053 I
F2(RMS)
µA
V
2/11Doc ID 7973 Rev 4
Page 3
STTH12R06Characteristics
Table 5.Dynamic Characteristics
SymbolParameterTest conditionsMin.Typ.Max.Unit
= 0.5 A, Irr = 0.25 A,
I
F
IR = 1 A
Reverse recovery timeTj = 25 °C
t
rr
= 1 A,
I
F
/dt = -50 A/µs,
dI
F
VR = 30 V
Reverse recovery current
I
RM
S factor Softness factor0.2
Q
Reverse recovery charges180nC
rr
Forward recovery time
t
fr
V
Forward recovery voltage5.5V
FP
T
= 125 °C
j
= 25 °C
T
j
Figure 1.Conduction losses versus
average current
P(W)
30
δ = 0.05
25
20
15
10
5
0
0123456789101112131415
δ = 0.1
δ = 0.2
I(A)
F(AV)
δ = 0.5
δ
δ = 1
=tp/T
Figure 3.Relative variation of thermal
impedance junction to case versus
pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
TO-220AC
TO6220AC Ins
0.8
D2PAK
0.7
0.6
0.5
0.4
Single pulse
0.3
0.2
0.1
0.0
1.E-031.E-021.E-011.E+00
t (s)
p
= 12 A, VR = 400 V,
I
F
dIF/dt = -200 A/µs
I
= 12 A, dIF/dt = 96
F
A/µs,
= 1.1 x V
V
FR
Figure 2.Forward voltage drop versus
T
tp
Figure 4.Relative variation of thermal
Fmax
forward current
I (A)
FM
120
110
100
90
80
70
60
50
40
30
20
10
0
0123456
(maximum values)
T=125°C
j
(typical values)
T=125°C
j
impedance junction to case versus
pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
TO-220FPAC
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-031.E-021.E-011.E+001.E+01
t (s)
p
7.08.4A
V (V)
FM
25
ns
45
200ns
T=25°C
j
(maximum values)
Doc ID 7973 Rev 43/11
Page 4
CharacteristicsSTTH12R06
Figure 5.Peak reverse recovery current
versus dI
I (A)
RM
26
V =400V
R
24
T=125°C
j
22
20
18
16
14
12
10
8
6
4
2
0
02004006008001000
I =0.25 x I
FF(AV)
/dt (typical values)
F
I =2 x I
F F(AV)
I=I
FF(AV)
dI /dt(A/µs)
F
F F(AV)
I =0.5 x I
Figure 7.Reverse recovery charges
versus dI
Q (nC)
rr
500
V =400V
R
450
T=125°C
j
400
350
300
250
200
150
100
50
0
02004006008001000
/dt (typical values)
F
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
FF(AV)
dI /dt(A/µs)
F
Figure 9.Relative variations of dynamic
parameters versus junction
temperature
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
255075100125
I
RM
Q
RR
T (°C)
j
S factor
I=I
F F(AV)
V =400V
R
Reference:T =125°C
j
Figure 6.Reverse recovery time versus
dIF/dt (typical values)
t (ns)
rr
80
70
60
50
40
30
20
10
0
02004006008001000
I =2 x I
F F(AV)
I=I
F F(AV)
I =0.5 x I
FF(AV)
dI /dt(A/µs)
F
V =400V
R
T=125°C
j
Figure 8.Softness factor versus
dIF/dt (typical values)
S factor
0.50
I 2 x I
≤
F F(AV)
V =400V
R
T=125°C
j
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
02004006008001000
dI /dt(A/µs)
F
Figure 10. Transient peak forward voltage
versus dI
V (V)
FP
12
I=I
F F(AV)
11
T=125°C
j
10
9
8
7
6
5
4
3
2
1
0
0100200300400500
/dt (typical values)
F
dI /dt(A/µs)
F
4/11Doc ID 7973 Rev 4
Page 5
STTH12R06Characteristics
Figure 11. Forward recovery time versus
dI
/dt (typical values)
F
Figure 12. Junction capacitance versus
reverse voltage applied
(typical values)
t (ns)
fr
180
160
140
120
100
80
60
40
20
0
0100200300400500
dI /dt(A/µs)
F
I=I
F F(AV)
V =1.1 x V max.
FRF
T=125°C
j
C(pF)
100
V (V)
10
1101001000
R
Figure 13. Thermal resistance junction to ambient versus copper surface under tab
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 6.TO-220AC dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.404.600.1730.181
H2
Ø I
A
C
C1.231.320.0480.051
D2.402.720.0940.107
L5
L6
L2
L7
E0.490.700.0190.027
F0.610.880.0240.034
F11.141.700.0440.066
G4.955.150.1940.202
F1
L9
L4
F
D
H210.0010.400.3930.409
L216.40 typ.0.645 typ.
L413.0014.000.5110.551
M
E
L52.652.950.1040.116
L615.2515.750.6000.620
G
L76.206.600.2440.259
6/11Doc ID 7973 Rev 4
L93.503.930.1370.154
M2.6 typ.0.102 typ.
Dia. I3.753.850.1470.151
Page 7
STTH12R06Package information
Table 7.TO-220FPAC dimensions
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.44.60.1730.181
A
H
B
B2.52.70.0980.106
D2.52.750.0980.108
Dia
E0.450.700.0180.027
F0.7510.0300.039
L6
L2
L3
L5
F1
L4
D
F11.151.700.0450.067
L7
G4.955.200.1950.205
G12.42.70.0940.106
H1010.40.3930.409
L216 Typ.0.63 Typ.
L328.630.61.1261.205
F
G1
E
L49.810.60.3860.417
L52.93.60.1140.142
G
L615.916.40.6260.646
L79.009.300.3540.366
Dia.3.003.200.1180.126
Doc ID 7973 Rev 47/11
Page 8
Package informationSTTH12R06
Table 8.TO-220AC (nins. and ins. 20-up) dimensions
Dimensions
Ref.
MillimetersInches
Min.Typ. Max. Min.Typ.Max.
A15.2015.90 0.5980.625
a13.750.147
a213.0014.00 0.5110.551
B10.0010.40 0.3930.409
F
Ø I
B
L
C
b2
b10.610.88 0.0240.034
A
I4
b21.231.32 0.0480.051
C4.404.60 0.1730.181
a1
l2
a2
c2
c10.490.70 0.0190.027
c22.402.72 0.0940.107
e4.805.40 0.1890.212
b1
e
M
F6.206.60 0.2440.259
c1
ØI3.753.85 0.1470.151
I415.80 16.40 16.80 0.622 0.646 0.661
L2.652.95 0.1040.116
l21.141.70 0.0440.066
M2.600.102
8/11Doc ID 7973 Rev 4
Page 9
STTH12R06Package information
Table 9.D
L2
L
L3
2
PAK dimensions
E
A1
B2
B
G
* FLAT ZONE NO LESSTHAN 2mm
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.404.600.1730.181
A
A12.492.690.0980.106
C2
A20.030.230.0010.009
B0.700.930.0270.037
D
B21.141.700.0450.067
C0.450.600.0170.024
C21.231.360.0480.054
C
R
D8.959.350.3520.368
E10.0010.400.3930.409
A2
G4.885.280.1920.208
L15.0015.850.5900.624
M
*
V2
L21.271.400.0500.055
L31.401.750.0550.069
M2.403.200.0940.126
Figure 14. Footprint (dimensions in mm)
16.90
10.30
8.90
R0.40 typ.0.016 typ.
V20°8°0°8°
5.08
1.30
3.70
Doc ID 7973 Rev 49/11
Page 10
Ordering informationSTTH12R06
3 Ordering information
Table 10.Ordering information
Order codeMarkingPackageWeightBase qty
STTH12R06DSTTH12R06DTO-220AC1.90 g50Tube
STTH12R06GSTTH12R06GD
STTH12R06G-TRSTTH12R06GD
STTH12R06FPSTTH12R06FPTO-220FPAC1.70 g50Tube
STTH12R06DIRGSTTH12R06DITO-220AC ins.1.86 g50Tube
4 Revision history
Table 11.Document revision history
DateRevisionChanges
January-20021Initial release.
18-Oct-20042D2PAK and TO-220AC insulated packages added
10-Aug-20063
15-Feb-20104Corrected typographical error in order codes in Ta b le 1 0.
Delivery
mode
2
PAK1.48 g50Tube
2
PAK1.48 g1000Tape and reel
Reformatted to current standards. Added package insulation voltages
on page 1
10/11Doc ID 7973 Rev 4
Page 11
STTH12R06
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.