USER’S MANUAL
Model : CBM-202PC Series
Control LSI for Citizen Thermal Printer Mechanism
Rev. 1.0, November 1st, 1996
Rev. 1.1, February 2nd, 1997
Japan CBM Corporation
Information Systems Div.
CBM-202PC User’s Manual
NOTICE
1. Description in this manual are subject to changes without prior notification.
2. Upon finding of any inappropriateness, error, or omission concerning contents of this manual,
please contact us at any time.
3. Notwithstanding the above Item 2, we will not be responsible for the influences of employment of this
manual.
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CBM-202PC User’s Manual
CONTENTS
1.OUTLINE................................................................................................................................................................5
1.1 MODEL CLASSIFICATIONS.....................................................................................................................5
2. GENERAL SPECIFICATIONS.............................................................................................................................5
2.1 OUTER APPEARANCE..............................................................................................................................5
2.2 STRUCTURE...............................................................................................................................................5
2.3 DATA TRANSFER SYSTEM.....................................................................................................................5
2.4 PRINT FUNCTION......................................................................................................................................6
2.5 OPERATING VOLTAGE AND CURRENT CONSUMPTION.................................................................6
2.6 OPERATING FREQUENCY.......................................................................................................................6
3. HARDWARE SPECIFICATIONS.........................................................................................................................7
3.1 ABSOLUTE MAXIMUM RATINGS..........................................................................................................7
3.2 ELECTRICAL CHARACTERISTICS.........................................................................................................7
3.3 TERMINAL PIN CONFIGURATION.........................................................................................................8
3.4 RESET CIRCUIT.......................................................................................................................................13
3.5 OSCILLATION CIRCUIT.........................................................................................................................14
3.6 HEAD-UP DETECTION CIRCUIT...........................................................................................................15
3.7 HEAD DETECTION CIRCUIT.................................................................................................................16
3.8 PAPER END DETECTION CIRCUIT.......................................................................................................17
3.9 MOTOR CONTROL CIRCUIT.................................................................................................................18
3.10 AUTO CUTTER CONTROL CIRCUIT ..................................................................................................19
3.11 PARALLEL INTERFACE CIRCUIT.......................................................................................................20
3.12 SERIAL INTERFACE CIRCUIT.............................................................................................................22
3.13 SWITCH CIRCUIT..................................................................................................................................24
3.14 ERROR OUTPUT CIRCUIT....................................................................................................................25
3.15 FUNCTION SELECTION CIRCUIT.......................................................................................................26
3.16 EXTERNAL RAM INTERFACE ............................................................................................................29
4. OPERATING TIMING........................................................................................................................................32
5. PACKAGE SPECIFICATIONS...........................................................................................................................33
6. SPECIAL REMARKS FOR MOUNTING...........................................................................................................34
6.1 CAUTIONS................................................................................................................................................34
6.2 REFLOW MOUNTING.............................................................................................................................34
6.3 RECOMMENDED CONDITIONS FOR VARIOUS MOUNTING METHODS.....................................34
6.4 CLEANING METHOD..............................................................................................................................36
6.5 STORAGE METHOD................................................................................................................................36
7. COMMAND LIST................................................................................................................................................37
8. CHARACTER CODE TABLE.............................................................................................................................39
8.1 INTERNATIONAL....................................................................................................................................39
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8.2 INTERNATIONAL CHARACTER CODE TABLE..................................................................................40
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CBM-202PC User’s Manual
1.OUTLINE
This LSI, through use of the Japan CBM Corp. gate array, serves to control CITIZEN line thermal
printer, being featured by the following:
(1) High print quality due to a detector which detects temperature to adjust print density automatically.
(2) Both parallel and serial interfaces are available.
(3) Print density can be freely selected with the function selection terminal.
(4) Bar-code printing is available.
(5) Prints such as double width, double high and bit image printing are available by various commands.
1.1 MODEL CLASSIFICATIONS
LSI (Chip) Model name Applied Printer Mechanism
CBM-202PC-01 LT-380
CBM-202PC-02 LT-381
CBM-202PC-03 LT-282/283
2. GENERAL SPECIFICATIONS
2.1 OUTER APPEARANCE
100-pin flat package
2.2 STRUCTURE
C-MOS LSI
2.3 DATA TRANSFER SYSTEM
Parallel transfer or serial transfer (Selectable by User)
(1) 8-bit parallel transfer
(Conforms to Centronics.)
(2) Asynchronous type serial transfer (Selectable by User)
1200, 2400, 4800, 9600, 19200 bps
Parity : odd, even, none
7 bits, 8 bits
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2.4 PRINT FUNCTION
(1) No. of Print Columns and Print Speed
Machine Type
LT-282 37 448 50
LT-283 34 416 50
No of
Digits
Total No of
Dots
Character Size (mm) Print Speed (m/s)
1.25×3.00 (Font A)
0.88×2.13 (Font B)
LT-380 48 576 50
LT-381 48 576
2.5 OPERATING VOLTAGE AND CURRENT CONSUMPTION
Voltage : DC 5V± 5%
Current consumption : Max. 80mA
2.6 OPERATING FREQUENCY
16MHz
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3. HARDWARE SPECIFICATIONS
3.1 ABSOLUTE MAXIMUM RATINGS
ITEM SYMBOL RATINGS
Supply voltage VCC
Input voltage Vi
Reference supply voltage V
Analog supply voltage AVCC
Analog input voltage VAN
Operating temperature Topr
Storage temperature Tstg
3.2 ELECTRICAL CHARACTERISTICS
ITEM SYMBOL
Input
"HIGH"
level
Input
"LOW"
level
Output
"HIGH"
level
Output
"LOW"
level
RES, STBY, NMI
MDO, MD1, MD2
EXTAL
THEM 2.0
Others
Total input
terminal
Total output
terminal
RESO
LEDER, LEDPE
Others
VIH
V
IL
V
OH
VOL
CBM-202PC User’s Manual
-0.3 to＋7V
-03 to Vcc＋0.3V
REF
-0.3 to AVcc＋0.3V
-0.3 to＋7V
-0.3 to AVcc＋0.3V
-20 to＋75℃
-55 to＋125℃
MIN MAX UNIT CONDITION
Vcc−0.7 Vcc＋0.3
Vcc×0.7 Vcc＋0.3
AVcc＋0.3
2.0
−0.3
3.5
−
−
Vcc＋0.3
0.5
−
0.4 V
1.0 V
V
V
V
V
V
V
0.4 V
IOH＝−1 mA
IOL＝2.6 mA
IOL＝10 mA
IOL＝1.6 mA
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3.3 TERMINAL PIN CONFIGURATION
PIN NO. SIGNAL NAME I/O FUNCTION LOGIC
1 VCC
2 LFSW I LF switch input LOW
3 LEDER O Error LED output LOW
4 LEDPE O Paper end LED output LOW
5 NC
6 NC
7 NC
8 DRQ I DMA request LOW
9 NC
10 RESO O Watchdog output LOW
11 VSS
12 DTR O Serial DTR (RS-232C) HIGH
13 TXD O Serial TXD (RS-232C) HIGH
14 DI I Print head output data HIGH
15 RXD I Serial RXD (RS-232C) HIGH
16 CP I Print head clock HIGH
17 NC
18 CTSW I Cutter switch input LOW
19 NC
20 NC
21 NU
22 VSS
23 MOTORA O Motor A
24 MOTORB O Motor B
25 MOTORA O Motor A
I = Input, O = Output, I/O = Input/Output
−
−
−
−
−
−
−
−
−
−
−
VCC
NC
NC
NC
NC
GND
NC
NC
NC
RESERVED
GND
−
−
−
−
−
−
−
−
−
−
−
−
−
−
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PIN NO. SIGNAL NAME I/O FUNCTION LOGIC
26 Motor B O Motor B
−
27 D0 I/O D0 HIGH
28 D1 I/O D1 HIGH
29 D2 I/O D2 HIGH
30 D3 I/O D3 HIGH
31 D4 I/O D4 HIGH
32 D5 I/O D5 HIGH
33 D6 I/O D6 HIGH
34 D7 I/O D7 HIGH
35 VCC
−
VCC
−
36 A0 O A0 HIGH
37 A1 O A1 HIGH
38 A2 O A2 HIGH
39 A3 O A3 HIGH
40 A4 O A4 HIGH
41 A5 O A5 HIGH
42 A6 O A6 HIGH
43 A7 O A7 HIGH
44 VSS
−
GND
−
45 A8 O A8 HIGH
46 A9 O A9 HIGH
47 A10 O A10 HIGH
48 A11 O A11 HIGH
49 A12 O A12 HIGH
50 A13 O A13 HIGH
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PIN NO. SIGNAL NAME I/O FUNCTION LOGIC
51 A14 O A14 HIGH
52 A15 O NC
53 A16 O NC
54 A17 O NC
55 A18 O NC
56 A19 O NC
57 VSS
58 P60 O NC
59 P61 O NC
60 P62 O NC
61
62 STBY I
63 RES I Reset input LOW
64 NMI I
65 VSS
66 EXTAL
67 XTAL
68 VCC
69 P63 O NC
70 RD O RD LOW
71 HRW O HRW LOW
72 P66 O NC
73 MD0 I
74 MD1 I
75 MD2 I
φ
−
GND
O Clock output HIGH
(Pull up in VCC with 10KΩ.)
(Pull up in VCC with 10K Ω.)
−
GND
−
EXTAL (16 MHz)
−
XTAL (16 MHz)
−
VCC
( Pull up in VCC with 10KΩ.)
(Pull down in GND with 10KΩ.)
(Pull up in VCC with 10K Ω.)
−
−
−
−
−
−
−
−
−
LOW
LOW
−
−
−
−
−
−
HIGH
LOW
HIGH
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PIN NO. SIGNAL NAME I/O FUNCTION LOGIC
76 AVCC
77 VREF
78 THERM I Head temperature detection terminal
79 NC I
80 NC I
81 NC I
82 NC I
83 NC I
84 NC I
85 NC I
86 AVSS
87 STB I Parallel data interrupt LOW
88 HEADUP I Headup detection terminal LOW
89 CS2 O Gate array chip selection LOW
90 CS1 O RAM chip selection LOW
91 CS0 O (Kanji ROM chip selection.
92 VSS
93 NC O NC
94 STRB1 O Head Strobe 1 LOW
95 STRB2 O Head Strobe 2 LOW
96 STRB3 O Head Strobe 3 LOW
97 INH O Motor control LOW
98 LATCH O Head latch signal LOW
99 PAPER I Paper end input HIGH
100 DSR I Serial DSR (RS-232C) HIGH
−
VCC
−
VCC
(Pull down in GND with 10K Ω.) −
(Pull down in GND with 10K Ω.) −
(Pull down in GND with 10K Ω.) −
(Pull down in GND with 10K Ω.) −
(Pull down in GND with 10K Ω.) −
(Pull down in GND with 10K Ω.) −
(Pull down in GND with 10K Ω.) −
−
GND
Only for Japanese use.)
−
GND
−
−
−
−
LOW
−
−
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Pin Arrangement and Functions of Gate Array(CBM-202LA)
PIN NO. SIGNAL NAME I/O FUNCTION LOGIC
44 D7 I Parallel input data D7 HIGH
45 D6 I Parallel input data D6 HIGH
46 D5 I Parallel input data D5 HIGH
47 D4 I Parallel input data D4 HIGH
48 D3 I Parallel input data D3 HIGH
49 D2 I Parallel input data D2 HIGH
50 D1 I Parallel input data D1 HIGH
51 D0 I Parallel input data D0 HIGH
52 STROBE I Parallel STROBE LOW
55 BUSY O Parallel BUSY HIGH
58 PAO7 O NC
59 ACK O Parallel ACK
61 PE O Parallel paper end HIGH
62 FAULT O Parallel FAULT LOW
63 CUTTERX O Cutter X
64 CUTTERY O Cutter Y
65 PAO1 O NC
67 PAO0 O NC
CBM-202PC User’s Manual
−
−
−
−
−
−
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3.4 RESET CIRCUIT
With RES terminal set to "Low", reset state is created.
In order to assure resetting, it is necessary to hold "Low" for min. 20ms on supply of power and
for min. 625ns while in operation.
When external reset is not used, those parts inside the broken lines are not required.
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3.5 OSCILLATION CIRCUIT
A clock oscillator, being installed, generates a system clock and an internal clock. Two clock supplying
methods are available including one to connect a ceramic oscillator and the other to input an external clock.
When using a ceramic oscillator, you are recommended to use CSTCS16.00MX0C3 (with a condenser)
manufactured by Murata Mfg. Co.. For input of an external clock, two methods are available,
one of which is to open XTAL terminal and the other of which is to input an antiphase clock in
XTAL terminal.
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3.6 HEAD-UP DETECTION CIRCUIT
Up/down state of the head is detected so that no power is supplied in head-up state, with the head-up sensor
installed in the printer. With head UP, it becomes "OPEN". With head DOWN, it becomes "CLOSE".
In head UP state, CPU's HEADUP (Pin 88) gets "HIGH", where printing is immediately stopped with error
output if it is while in print operation. Printing is resumed when it becomes head DOWN.
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3.7 HEAD DETECTION CIRCUIT
VP is controlled so as to prevent the head from electrolytic etching.
When turning ON the VP, set 11VC (Pin 4) of the gate array (CBM-202LA)to "HIGH".
When turning it OFF, set the HVC to "LOW".
It is also provided with a temperature detection circuit which serves to prevent print quality from being
deteriorated or destroyed by temperature. This function, through use of a thermistor installed in the printer,
detects temperature based on which energy applied to the head is determined. Further, when head
temperature has exceeded 60℃, printing is stopped so that the head is protected from being destroyed.
For protection of CPU runaway, make connection so that the gate array is reset by output of the CPU
watchdog timer. The CPU itself has been set to which resetting can work. Further, to prevent the head
strobe from being turned ON at that time, place a pull-up resistance in STRB1 to STRB3 each by one.
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3.8 PAPER END DETECTION CIRCUIT
Existence of printing paper is detected by the paper sensor which is installed in the paper
not to supply power when paper runs our.
Without printing paper, CPU PAPER (Pin 99) gets "HIGH". When this takes place while in printing
operation, the operation stops at the end of the line, sending an error output. Printing is automatically
resumed when paper is supplied.
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3.9 MOTOR CONTROL CIRCUIT
Except while in paper feed, the motor is held unexcited by CPU INH (Pin 97) so that heating of the motor is
prevented. While INH is held in "HIGH", the motor is maintained unexcited.
On supply of power, 4 dot lines of line feed is performed to meet the motor phase.
Avoid continuous printing over 15 min.
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3.10 AUTO CUTTER CONTROL CIRCUIT
This CPU, by using the gate array (CBM-202LA), has auto cutter control function.
When an auto cutter is not used, set DS1-1 to OFF. When DS1-1 is ON, alarm state is created where
normal operation is interrupted.
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3.11 PARALLEL INTERFACE CIRCUIT
This circuit performs 8-bit parallel interface by mainly using the gate array ports. When the parallel
interface is not used, pull up STB (Pin 52) of the gate array (CBM-202LA) through use of 10KΩ
resistance. Also, either connect CPU's STB (Pin 87) to INTR (Pin 56) of the gate array or pull it up with
10K Ω resistance.
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Gate Array Signal Names and Functions
SIGNAL NAME PIN NO. I/O FUNCTION
STROBE 52 Input The signal to read data (negative logic)
D0 51
D1 50
D2 49
D3 48
D4 47
D5 46
D6 45
D7 44
ACK 59 Output
BUSY
PE 61 Output
FAULT 62 Output
GND
Timing Chart
55
Input
Output
Input data (positive logic)
Signal to indicate that data have been read.
(negative logic)
Signal to indicate that data receiving is possible.
(positive logic) Send data while it is in
"LOW".
Signal which is output when printing paper
runs out . (positive logic)
Signal to indicate a printer error (negative
logic)
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3.12 SERIAL INTERFACE CIRCUIT
Serial interface applies asynchronous serial system.
When not using serial interface, pull up, CPU's RXD (Pin 15) and DSR (Pin 100) with
10K Ω resistance.
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Transmits data while this signal is held in "LOW".
Signal Names and Functions
SIGNAL NAME PIN NO. I/O FUNCTION
TXD
RXD
DSR
DTR
13
15
100
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CBM-202PC User’s Manual
Output
Input
Input
Output
Transmits status.
When data receiving is not available while in
XON/XOFF, XOFF (13H) is transmitted.
When receiving is made possible, XON (11H) is
transmitted.
Receiving data signal.
On occurrence of a framing error or parity error, the
data are printed in "?".
With this signal held in "LOW" when data are
transmitted from CPU while DTR/DSR has been
selected, transmitting takes place. With this signal
held in "HIGH", transmitting is does not take place
until it gets "LOW".
If writing takes place while in "HIGH", overrun error
is created, where data are ignored.
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3.13 SWITCH CIRCUIT
This circuit is provided with switch input function for printer paper feeding.
Also, a function for self printing is equipped through use of this switch. (Either supply power as pushing
this switch or apply resetting in power supplied state as pushing this switch. Self printing starts
automatically and, on completion of printing, normal standby state is recovered.)
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3.14 ERROR OUTPUT CIRCUIT
Two kinds of error output are held for output of various errors. (Max. 10mA current can be taken for
display with mainly LED, etc.. When this level is exceeded, however, CPU may be destroyed. Pay
attention, therefore, to select an appropriate current control resistance, LED, etc..)
CPU's LEDPE (Pin 4) is exclusively for output of paper error. When printing paper has got scarce,
"LOW" is output automatically. When paper is supplied, it becomes "HIGH".
CPU's LEDER (Pin 3) output various other errors in the following patterns:
ERROR DISPLAY PATTERN RECOVERY
CBM-202PC User’s Manual
Head UP
Head DOWN
Memory check
Not available
Head overheat
Head temperature lowered
Macro execution standby
LF switch
Cutter motor lock
Paper jamming cancelled
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3.15 FUNCTION SELECTION CIRCUIT
The gate array input ports have terminals for function selection. To connect a DIP switch, etc., do it as it
is. When fixing with a jumper, etc., connect to GND only for those to be set to "LOW".
GATE ARRAY
PIN NO. SIGNAL NAME
33 PAI0 Auto cutter Equipped None
32 PAI1 CR Selection LF Ignored
31 PAI2 Print density
30 PAI3 DTR/XON-XOFF XON-XOFF DTR/DSR
29 PAI4
28 PAI5
27 PAI6
26 PAI7
PAI 3 is valid only when serial interface is used.
GATE ARRAY
PIN NO. SIGNAL NAME
43 PBI0
42 PBI1
39 PBI2
38 PBI3 Auto loading Valid Invalid
37 PBI4 Input buffer 4K bytes 72 bytes
36 PBI5 Print density
35 PBI6 Bit length 8 bits 7 bits
34 PBI7 Type of printer mechanism LT-282 LT-283
PBI6 is valid only when serial interface is used.
CBM-202PC User’s Manual
FUNCTION “LOW” “HIGH”
See Table③
Interface
FUNCTION “LOW” “HIGH”
Selection of international
character
See Table①
See Table②
See Table③
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①Interface
INPUT SYSTEM
Parallel
Serial
PARITY BAUD RATE PAI7 PAI6 PAI5 PAI4
− −
None
19200 HIGH LOW HIGH LOW
Odd
1200 HIGH HIGH HIGH LOW
2400 HIGH HIGH LOW HIGH
4800 HIGH HIGH LOW LOW
9600 HIGH LOW HIGH HIGH
1200 HIGH LOW LOW HIGH
2400 HIGH LOW LOW LOW
4800 LOW HIGH HIGH HIGH
HIGH HIGH HIGH HIGH
9600 LOW HIGH HIGH LOW
19200 LOW HIGH LOW HIGH
Even
1200 LOW HIGH LOW LOW
2400 LOW LOW HIGH HIGH
4800 LOW LOW HIGH LOW
9600 LOW LOW LOW HIGH
19200 LOW LOW LOW LOW
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②International Characters
International Characters PBI2 PBI1 PBI0
Japan (JIS) HIGH HIGH HIGH
Japan (Shift JIS) HIGH HIGH LOW
Sweden HIGH LOW HIGH
Denmark I HIGH LOW LOW
U.K. LOW HIGH HIGH
Germany LOW HIGH LOW
France LOW LOW HIGH
U.S.A. LOW LOW LOW
③Print Density
Print Density PAI 2 PAI 1
Light HIGH HIGH
Standard HIGH LOW
Dark LOW HIGH
Darker LOW LOW
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3.16 EXTERNAL RAM INTERFACE
An external SRAM of 32 K bytes is always necessary for printing. When no external RAM is
connected, normal operation cannot be obtained.
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Bus Timing
CBM-202PC User’s Manual
VCC＝5.0V±10%, AVCC＝5.0V±10%, VF＝4.5V〜AVCC,
VSS＝AVSS＝0V, φ2〜16MHz, TA＝−20〜＋75℃
ITEM SYMBOL MIN MAX
Clock cycle time tcyc 62.5 500
Clock pulse width "LOW" level time tCL 20
Clock pulse width "HIGH" level time tCH 20
Clock rise time tCR
Clock breaking time tCF
Address delay time tAD
−
−
−
Address hold time tAH 10
Address strobe delay time t
Write strobe delay time t
ASD
WSD
Strobe delay time tSD
Write data strobe pulse width 1 t
Write data strobe pulse width 2 t
Address setup time 1 t
Address setup time 2 t
Read data setup time t
Read data hold time t
Write data delay time t
Write data setup time 1 t
Write data setup time 2 t
Write data hold time t
Read data access time 1 t
Read data access time 2 t
WSW1
WSW2
AS1
AS2
RDS
RDH
WDD
WDS1
WDS2
WDH
ACC1
ACC2
35
65
10
40
20
0
35
5
20
−
−
−
−
−
−
−
−
10
10
30
−
30
30
30
−
−
−
−
−
−
60
−
−
−
55
115
Unit: ns
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4. OPERATING TIMING
Operating timing after resetting is canceled for this CPU is shown below:
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5. PACKAGE SPECIFICATIONS
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6. SPECIAL REMARKS FOR MOUNTING
6.1 CAUTIONS
As relative humidity gets low, static electricity tends to be charged. Although surface mount type
packages need to be stored in dry environments not to be affected by humidity, there is no worry for
charging as the packages in storage are not subject to friction. However, during handling and mounting to
substrates where friction and electric discharge are likely to take place, the relative humidity is
recommended to be 45 to 75% for prevention of electric charge.
6.2 REFLOW MOUNTING
The pattern on a PCB board has been formed to facilitate soldering with the package lead pins,
where a fixed amount of soldering paste is applied by screen process printing and the package is mounted.
The package is temporarily fixed by surface tension of soldering paste.
Then, with solder being reflowed, the package lead and the pattern on the base board are fitted by surface
tension of the reflowed solder.
Although the design value of the lead joint part pattern on a PCB board varies by soldering paste material,
reflow conditions, etc., the standard level is 1.1 to 1.3 times of the width of a lead pin subject to soldering.
CBM-202PC User’s Manual
6.3 RECOMMENDED CONDITIONS FOR VARIOUS MOUNTING METHODS
Mounting methods most commonly applied to surface mounting devices are the infrared rays reflow
method, the vapor phase reflow method, and the flow soldering method.
In all of these mounting methods, as the entire part of a package is heated, strong thermal stress is applied
to the package. For reliability assurance sake, therefore, not only temperature of the solder joint part but
also temperature of the package surface need to be controlled. As the recommended mounting conditions,
use package surface temperature for the reflow method and solder temperature as well as dipping time
for the flow soldering method.
The basic understanding of the recommended conditions is explained in Fig. 6.1:
Fig. 6.1
Peak temperature
and time
Thermal gradient 1
Package
surface
temperature
Thermal
gradient 2
Preparatory
heating
Time
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CBM-202PC User’s Manual
1) Thermal Gradient 1
On a sudden temperature increase, unevenness in temperature is produced among package parts of
a surface mounting device, where difference in thermal expansion coefficients of materials can
cause a warp in the package, resulting in damaged chips. Attention, therefore, should be paid to the
upper limit for the increase speed. The lower limit is based on operation efficiency of the reflow
device.
2) Preparatory Heating
The parts and base boards are prepared at a temperature below the solder melting temperature so that
solder jointing is stabilized and thermal shock is lessened. In general, the temperature is set to a level
close to the rated temperature of the surface mounting device.
3) Thermal Gradient 2
The upper limit of increase temperature, as in 1), is determined based on necessity to maintain the
peak temperature and time within the specific range.
4) Peak Temperature and Time
The greatest care must be taken to minimize damage of a package. As a peak temperature directly
influences to reduce package strength and steam pressure inside a package, temperature should be held
low. Also, as steam pressure rises as time passes, set time as short as possible. Conditions shown
here indicate, not in mean values but in the maximum values, the points at which both the above
allowable region and the solder available region are satisfied. On setting conditions, therefore, be
careful not to exceed the upper limit values.
The recommended conditions for the various mounting methods are shown in Figs. 6.2 and 6.3:
Fig. 6.2 Recommended Conditions for Infrared Rays Reflow and Air Reflow
Package
Surface
Temperature
235℃ max
1 to 4℃ / sec.
140 to 160
℃
10 sec. max.
max
max. 60 sec.
1 to 5℃ / sec.
Time
Fig. 6.3 Recommended Conditions for Vapor Phase Reflow
Package
Surface
Temperature
215℃ max
140 to 160
℃
max. 60 sec.
30 sec. max.
max
1 to 5℃ / sec.
Time
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6.4 CLEANING METHOD
As flux residue from soldering adversely affects reliability of parts and base PCB, it should be normally
removed by cleaning.
Ultrasonic cleaning, for example, is performed in the following conditions, for which cares should be taken
to an applied frequency, electricity (especially, peak power), time and device resonance to prevent the
device from breakage:
Frequency ..... 28 to 29KHz (Device should not resonate.)
Ultrasonic output ..... 15W/1 (1 time)
Time ..... 30 seconds and less
Others ..... Neither a device nor a PCB board directly touches an oscillation
source.
6.5 STORAGE METHOD
Epoxy resin used in plastic packages, when stored in a humid place, cannot escape
from moisture absorption. Absorbed moisture content, as it gets high, can suddenly
vaporize on soldering implementation, causing peeling of resin/lead frame joint or even
causing a crack on a package. It is, therefore, important to store it in dry environment
(under normal temperature and humidity within 5 to 35 ℃and 45 to 75%RH) in dampproof
package. After opening the package, please keep it in the specified environments to avoid
development of moisture absorption and perform reflow implementation in the shortest
possible time. When restoring it in the dampproof package, place new silica gel.
To remove water content having been absorbed during transport, storage, and handling,
drying (at 125 ℃) for 16 to 24 hours is recommended to be performed.
Store external terminals as they are not yet subject to machining.
This is to prevent soldering failure from taking place on implementation caused by
produced rust, etc..
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CONTROL
1 HT Horizontal tab command
09H
2 CR Print comm
and 0DH
3 LF Printing and paper feed
0DH
4 ESC SP
1BH 20H n
5 ! Collective specifying printing mode
1BH21H n
6 % Specifying/canceling download character set
1BH25Hn
8 * Specifying the bit image mode
1BH2Amn1n2[d]k
9 - Specifying/canceling underline
1BH2DH n
10 2
Specifying 1/6
-
inch line feed rate
1BH32H
12 @ Initializi
ng the Printer
1BH40H
13 D
Setting horizontal tab position
1BH44H[n]k00H
14 E
Specifying/canceling highlighting
1BH45Hn
15 G
Specifying/canceling double printing
1BH47Hn
16 J
Printing and feeding paper n/203 inch
1BH4An
17 R
Selecting the internationa
l characters
1BH52Hn
19 c4 NOP
1BH63H34Hn
20 c5
Enabling/disabling the panel switches
1BH63H35Hn
21 d
Printing and feeding the paper by n lines
1BH64Hn
22 p
NOP
1BH70Hmn1n2
23 t
Selecting the character code table
1BH74Hn
24 v Transmitting the printer status (Serial type)
1BH75Hn
25 u
NOP
1BH76H
26 {
Specifying/canceling the inverted characters
1BH7BHn
27 V
turned
1BH56Hn
28 $
Specifying the absolute positions
1BH24Hn1n2
29 ¥ Specifying the relative positions
1BH5Cn1n2
30
GS k
Printing the bar code
1DH6BHn[“d”]k00H
7. COMMAND LIST
CODE
CBM-202PC User’s Manual
FUNCTION CODE
Setting the right space amount of the character
7
11
18
& Defining download characters 1BH26H5nm
[ap1p2...p5xa]m-n+1
3 Setting line feed rate of minimum pitch 1BH33Hn
c3 NOP
1BH63H33Hn
Specifying/canceling the 90 ° - right-
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CBM-202PC User’s Manual
31 w
1DH77n
32
h
Selecting the height of the bar code
1DH68Hn
33 H
Selecting of print posi
tion of HRI code
1DH48Hn
34 f Selecting the font of HRI code
1DH66Hn
35 * Defining the download bit image
1DH2An1n2[d]n1xn2x
36 / Printing the download bit image
1DH2FHm
37 :
Starting/ending macro definition
1DH3AH
38 ^
Executing the macro
1DH5En1n2n
3 39 ESC =
Data input control
1BH3DHn
40 a
Aligning the characters
1BH61Hn
41 i
Activating auto cutter (Full cut)
1BH69H
42 m
Activating auto cutter (Partial cut)
1BH6DH
Selecting the horizontal size (scale factor) of bar code
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8. CHARACTER CODE TABLE
8.1 INTERNATIONAL
CBM-202PC User’s Manual
39
CITIZEN
8.2 INTERNATIONAL CHARACTER CODE TABLE
CBM-202PC User’s Manual
40
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