Beckhoff CB3064 Series Manual
CB3064-xxxx
Manual
Rev. 1.0
Kabylake
Beckhoff Automation GmbH & Co. KG phone: +49 (0) 52 46/963-0
Eiserstr. 5 fax: +49 (0) 52 46/963-198
33415 Verl email: info@beckhoff.de
Germany web: www.beckhoff.de
Contents
Contents
0 Document History................................................................................................................................. 6
1 Introduction .......................................................................................................................................... 7
1.1 Notes on the Documentation ........................................................................................................ 7
1.1.1 Disclaimer ............................................................................................................................. 7
1.1.2 Trademarks ........................................................................................................................... 7
1.1.3 Patent Pending ..................................................................................................................... 7
1.1.4 Copyright ............................................................................................................................... 7
1.2 Safety Instructions ........................................................................................................................ 8
1.2.1 Disclaimer ............................................................................................................................. 8
1.2.2 Description of Safety Symbols .............................................................................................. 9
1.3 FCC Approvals for the United States of America ......................................................................... 9
1.4 FCC Approval for Canada ............................................................................................................ 9
1.5 Essential Safety Measures ......................................................................................................... 10
1.5.1 Operator's Obligation to Exercise Diligence ....................................................................... 10
1.5.2 National Regulations Depending on the Machine Type ..................................................... 10
1.5.3 Operator Requirements ...................................................................................................... 10
1.6 Functional Range ........................................................................................................................ 11
2 Overview ............................................................................................................................................ 12
2.1 Features ...................................................................................................................................... 12
2.2 Feature List ................................................................................................................................. 13
2.3 Specifications and Documents ................................................................................................... 14
3 Detailed Description ........................................................................................................................... 15
3.1 Power Input ................................................................................................................................. 15
3.2 SUPS .......................................................................................................................................... 15
3.3 CPU ............................................................................................................................................ 15
3.4 Memory ....................................................................................................................................... 15
4 Connectors ......................................................................................................................................... 16
4.1 Connector Map ........................................................................................................................... 17
4.2 Power Input ................................................................................................................................. 18
4.3 Memory ....................................................................................................................................... 19
4.4 DVI .............................................................................................................................................. 22
4.5 DVI/HDMI/DisplayPort and USB3.0 ............................................................................................ 23
4.6 USB 3-6 ...................................................................................................................................... 25
4.7 USB2.0 (internal) ........................................................................................................................ 26
4.8 LAN ............................................................................................................................................. 28
4.9 SATA Interfaces .......................................................................................................................... 29
4.10 Serial Interface COM1 ................................................................................................................ 30
4.11 PCI-Express ................................................................................................................................ 31
4.12 GPIO ........................................................................................................................................... 33
4.13 Fan Connectors .......................................................................................................................... 34
4.14 System ........................................................................................................................................ 35
5 State LEDs ......................................................................................................................................... 36
5.1 RGB LED .................................................................................................................................... 36
6 BIOS Settings ..................................................................................................................................... 37
6.1 General Remarks ........................................................................................................................ 37
6.2 Main ............................................................................................................................................ 38
Beckhoff New Automation Technology CB3064-xxxx page 3
Contents
6.3 Advanced .................................................................................................................................... 40
6.3.1 Platform Misc Configuration Configuration ......................................................................... 42
6.3.2 CPU Configuration .............................................................................................................. 46
6.3.3 Intel(R) I210 Gigabit Network Connection .......................................................................... 51
6.3.4 Intel(R) Ethernet Connection I219-LM ................................................................................ 53
6.3.5 Driver Health ....................................................................................................................... 54
6.3.6 Trusted Computing ............................................................................................................. 57
6.3.7 ACPI Settings...................................................................................................................... 58
6.3.8 H/W Monitor ........................................................................................................................ 59
6.3.9 Serial Port Console Redirection.......................................................................................... 61
6.3.10 PCI Subsystem Settings ..................................................................................................... 62
6.3.11 Network Stack Configuration .............................................................................................. 64
6.3.12 Power Controller Options .................................................................................................... 65
6.3.13 Compatibility Support Module Configuration ...................................................................... 67
6.3.14 NVMe Controller and Drive Information .............................................................................. 68
6.3.15 USB Configuration .............................................................................................................. 69
6.3.16 SATA and RST Configuration ............................................................................................. 70
6.3.17 AMT Configuration .............................................................................................................. 74
6.4 Chipset ........................................................................................................................................ 80
6.4.1 System Agent (SA) Configuration ....................................................................................... 81
6.4.2 PCH-IO Configuration ......................................................................................................... 86
6.5 Security ..................................................................................................................................... 104
6.5.1 Secure Boot Menu ............................................................................................................ 105
6.6 Boot ........................................................................................................................................... 107
6.6.1 Fixed Boot Order Priority .................................................................................................. 109
6.7 Save & Exit ............................................................................................................................... 110
6.8 BIOS Update ............................................................................................................................. 111
7 Mechanical Drawings ....................................................................................................................... 112
7.1 PCB: Mounting Holes ............................................................................................................... 112
7.2 PCB: Pin 1 Dimensions ............................................................................................................ 113
7.3 PCB: DIE Center ....................................................................................................................... 114
7.4 PCB: Outlines ........................................................................................................................... 115
8 Technical Data ................................................................................................................................. 116
8.1 Electrical Data ........................................................................................................................... 116
8.2 Environmental Conditions ......................................................................................................... 116
8.3 Thermal Specifications ............................................................................................................. 117
9 Support and Service ........................................................................................................................ 118
9.1 Beckhoff's Branch Offices and Representatives ...................................................................... 118
9.2 Beckhoff Support ...................................................................................................................... 118
9.3 Beckhoff Service ....................................................................................................................... 118
9.4 Beckhoff Headquarters ............................................................................................................. 118
I Annex: Post-Codes .......................................................................................................................... 120
II Annex: Resources ............................................................................................................................ 121
Interrupt ................................................................................................................................................ 121
PCI Devices .......................................................................................................................................... 121
Resources: SMB-Devices .................................................................................................................... 122
page 4 Beckhoff New Automation Technology CB3064-xxxx
Notes on the Documentation Chapter: Document History
Beckhoff New Automation Technology CB3064-xxxx page 5
Chapter: Document History Notes on the Documentation
Version
Changes
0.1
first pre-release
1.0
First released version
0 Document History
All company names, brand names, and product names referred to in this manual are registered or
unregistered trademarks of their respective holders and are, as such, protected by national and
international law.
page 6 Beckhoff New Automation Technology CB3064-xxxx
Notes on the Documentation Chapter: Introduction
1 Introduction
1.1 Notes on the Documentation
This description is only intended for the use of trained specialists in control and automation engineering
who are familiar with the applicable national standards.
It is essential that the documentation and the following notes and explanations are followed when
installing and commissioning the components.
It is the duty of the technical personnel to use the documentation published at the respective time of each
installation and commissioning.
The responsible staff must ensure that the application or use of the products described satisfy all the
requirements for safety, including all the relevant laws, regulations, guidelines and standards.
1.1.1 Disclaimer
The documentation has been prepared with care. The products described are, however, constantly under
development.
For that reason the documentation is not in every case checked for consistency with performance data,
standards or other characteristics.
None of the statements of this manual represents a guarantee (Garantie) in the meaning of § 443 BGB of
the German Civil Code or a statement about the contractually expected fitness for a particular purpose in
the meaning of § 434 par. 1 sentence 1 BGB.
In the event that it contains technical or editorial errors, we retain the right to make alterations at any time
and without warning.
No claims for the modification of products that have already been supplied may be made on the basis of
the data, diagrams and descriptions in this documentation.
1.1.2 Trademarks
Beckhoff®, TwinCAT®, EtherCAT®, Safety over EtherCAT®, TwinSAFE®, XFC® and XTS® are
registered trademarks and licensed by Beckhoff Automation GmbH.
Other designations used in this publication may be trademarks whose use by third parties for their own
purposes could violate the rights of the owners.
1.1.3 Patent Pending
The EtherCAT Technology is covered, including but not limited to the following patent applications and
patents:
EP1590927, EP1789857, DE 102004044764, DE 102007017835
with corresponding applications or registrations in various other countries.
The TwinCAT Technology is covered, including but not limited to the following patent applications and
patents:
EP0851348, US6167425 with corresponding applications or registrations in various other countries..
EtherCAT® is registered trademark and patented technology, licensed by Beckhoff Automation GmbH,
Germany.
1.1.4 Copyright
© Beckhoff Automation GmbH & Co. KG, Germany.
The reproduction, distribution and utilization of this document as well as the communication of its contents
to others without express authorization are prohibited.
Offenders will be held liable for the payment of damages. All rights reserved in the event of the grant of a
patent, utility model or design.
Beckhoff New Automation Technology CB3064-xxxx page 7
Chapter: Introduction Safety Instructions
1.2 Safety Instructions
Consider the following safety instructions and descriptions!
Product specific safety instructions are to be found on the following pages or in the areas mounting,
wiring, commissioning etc.
1.2.1 Disclaimer
All the components are supplied in particular hardware and software configurations appropriate for the
application. Modifications to hardware or software configurations other than those described in the
documentation are not permitted, and nullify the liability of Beckhoff Automation GmbH & Co. KG.
page 8 Beckhoff New Automation Technology CB3064-xxxx
FCC Approvals for the United States of America Chapter: Introduction
DANGER
Acute risk of injury!
If you do not adhere the safety advise adjoining this symbol, there is immediate
danger to life and health of individuals!
WARNING
Risk of injury!
If you do not adhere the safety advise adjoining this symbol, there is danger to life
and health of individuals!
CAUTION
Hazard to devices and environment
If you do not adhere the safety advise adjoining this symbol, there is obvious
hazard to individuals!
Attention
Hazard to devices and environment
If you do not adhere the notice adjoining this symbol, there is obvious hazard to
materials and environment.
Notice
Note or pointer
This symbol indicates information that contributes to better understanding.
1.2.2 Description of Safety Symbols
The following safety symbols are used in this documentation. You have to read the safety symbols
carefully and adhere them strictly!
1.3 FCC Approvals for the United States of America
FCC: Federal Communications Commission Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
1.4 FCC Approval for Canada
FCC: Canadian Notice
This equipment does not exceed the Class A limits for radiated emissions as described in the Radio
Interference Regulations of the Canadian Department of Communications.
Beckhoff New Automation Technology CB3064-xxxx page 9
Chapter: Introduction Essential Safety Measures
1.5 Essential Safety Measures
1.5.1 Operator's Obligation to Exercise Diligence
The operator must ensure that
o the product is only used for its intended purpose
o the product is only operated in sound condition and in working order
o the instruction manual is in good condition and complete, and always available for reference at the
location where the products are used
o the product is only used by suitably qualified and authorised personnel
o the personnel is instructed regularly about relevant occupational safety and environmental protection
aspects
o the operating personnel is familiar with the operating manual and in particular the safety notes
contained herein
1.5.2 National Regulations Depending on the Machine Type
Depending on the type of machine and plant in which the product is used, national regulations governing
the controllers of such machines will apply, and must be observed by the operator. These regulations
cover, amongst other things, the intervals between inspections of the controller. The operator must initiate
such inspections in good time.
1.5.3 Operator Requirements
o Read the operating instructions
All users of the product must have read the operating instructions for the system they work with.
o System know-how
All users must be familiar with all accessible functions of the product.
page 10 Beckhoff New Automation Technology CB3064-xxxx
Functional Range Chapter: Introduction
1.6 Functional Range
The descriptions contained in the present documentation represent a detailed and extensive product
description. As far as the described motherboard was acquired as an integral component of an Industrial
PC from Beckhoff Automation GmbH & Co. KG, this product description shall be applied only in limited
scope. Only the contractually agreed specifications of the corresponding Industrial PC from Beckhoff
Automation GmbH & Co. KG shall be relevant. Due to several models of Industrial PCs, variations in the
component placement of the motherboards are possible. Support and service benefits for the built-in
motherboard will be rendered by Beckhoff Automation GmbH & Co. KG exclusively as specified in the
product description (inclusive operation system) of the particular Industrial PC.
Beckhoff New Automation Technology CB3064-xxxx page 11
Chapter: Overview Features
MEMORY
Power VCCCore; VTT;
DDRVTT, GFXVCC
1,05V; 1,5V; 1,8V; 3,3V
BIOS
4x SATA
USB9-14
Intel®
Core™ i7-6700TE,
Core™ i5-6500TE,
Core™ i3-6100TE,
Pentium® G4400TE,
Celeron® G3900TE
FDI
1.5/3/6 Gb/s
DMI
SPI
8x GPIO
SMBus
PCA9518PW
PHY
Intel® i219
LAN1
MAC/PHY
Intel® i210
PCIe
LAN2
PCIe
(4 x1 oder 1 x4)
NCT7491MNTXG
I2C
COM1
FAN 1-3
SMBus
DVI/HDMI
DVI/HDMI/DP (I-PEX)
Trusted
Platform
Module
USB 3.0
USB1-4
SPI
Watchdog
USB 3.0
USB11 (I-PEX)
USB 2.0
Intel® Q170-PCH
2x SO-DIMM260
DDR4-2133
(dual channel)
PEG/PCIe
2 Overview
2.1 Features
The CB3064 is a highly complex 3,5-inch board which incorporates complete motherboard functionality.
The motherboard is based on Intel®'s Q170 chipset and equipped with an Intel® Core™, Pentium™ or
Celeron™ processor of the Skylake-S family.
Such processors are optimized for real-time systems with a low power consumption, while at the same
time providing state-of-the-art computing performance and a huge I/O flexibilty.
Modern low voltage DDR4 technology provides top-notch memory performance, accomodating up to 32
GByte of RAM (DDR4-2133) via SO-DIMM260. It also provides a PCI-Express bus (via a 2x40-pin
custom connector, configurable as one x4 or four x1) and additional peripheral devices such as a serial
interface, two Gigabit Ethernet interfaces (LAN), four SATA channels (offering up to 6Gb/s), eleven USB
channels, DVI/HDMI, and DisplayPort available on a 30-pin I-PEX connector.
page 12 Beckhoff New Automation Technology CB3064-xxxx
Feature List Chapter: Overview
CB3064
3,5"-Board
CPU
Intel® Core™ i7-6700TE (8M, 4 Cores, 35W TDP)
Intel® Core™ i5-6500TE (6M, 4 Cores, 35W TDP)
Intel® Core™ i3-6100TE (3M, 2 Cores, 35W TDP)
Intel® Pentium™ G4400TE (3M, 2 Cores, 35W TDP)
Intel® Celeron™ G3900TE (2M, 2 Cores, 35W TDP)
Chipset
Intel® Q170
Memory
2 sockets, each with DDR4@2133MHz à 16GB, SODIMM260
I/O
External
1x DVI-D (DVI or HDMI 1.4)
4x USB3.0
2x GBit-LAN, Intel® i219 and i210
1x COM
Internal
1x I-PEX (HDMI1.4 or DP1.2 and USB3.0)
4x SATA 3.0, RAID 0/1/5/10
1x PCIe Gen3 (1x PCIe x4 or 4x PCIe x1)
6x USB2.0
8x GPIO
Graphics
HDMI / DP: 3840 x 2160
DVI: 1920 x 1200
RTC
external CMOS battery
BIOS
AMI® Aptio V
Power Supply
5V / S5V / 3,3V / 12V
Format
102 mm x 147 mm
Notice
The feature list specifies all suitable CPUs. Their actual availability is
manufacturer-specific.
2.2 Feature List
Beckhoff New Automation Technology CB3064-xxxx page 13
Chapter: Overview Specifications and Documents
2.3 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
PCI specification
Version 2.3 bzw. 3.0
www.pcisig.com
PCI Express® Base Specification
Version 2.0
www.pcisig.com
ACPI specification
Version 3.0
www.acpi.info
ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org
USB specification
www.usb.org
SM-Bus specification
Version 2.0
www.smbus.org
Intel® chip description
Intel® Atom™ Processor E3800 Product Family datasheet
www.intel.com
Intel® chip description
i210 datasheet
www.intel.com
NCT7491MNTXG
NCT7491 chip description
www.onsemi.com
American Megatrends®
Aptio™ Text Setup Environment (TSE) User Manual
www.ami.com
American Megatrends®
Aptio™ 5.x Status Codes
www.ami.com
page 14 Beckhoff New Automation Technology CB3064-xxxx
Power Input Chapter: Detailed Description
Attention
Only for use with Beckhoff-certified PSU!
The CB3064 is designated for use with the Beckhoff PSU CA2000-0021 only.
Caution
Do not use accumulator and S-UPS simultaneously!
The CB3064 can be used either with an accumulator or with an S-UPS module.
To avoid loss of data in case of a power fail, both components may not be used
simultaneously!
Notice
Driver Compatibility
For optimal driver compatibility we recommend the use of a Microsoft®
Windows® 8 operating system.
3 Detailed Description
3.1 Power Input
The connector for power supply is a 2x10-pin connector.
The 12V voltage supply is needed for employment of PCI-Express cards and FAN connectors. COM RXD
and TXD also can be used for PSU, e.g. the UPS functionality.
Communication is carried out via SMBus signaling (SMB_CLK/SMB_DAT).
3.2 SUPS
Optionally the CB3064 can be equipped with a plug-in SUPS, which can keep the board alive over a short
period of time in case of power failure or voltage fluctuation. The exact amount of time is hard to predict
as it also depends on factors such as the SUPS' capacitors and the boards' power consumption etc. The
capacitors size is only limited by the required space.
3.3 CPU
The motherboard is based on Intel®'s Q170 chipset and employs an Intel® Core™, Pentium™ or
Celeron™ processor of the Skylake-S family.
Such processors are optimized for real-time systems with a low power consumption, while at the same
time providing state-of-the-art computing performance and a huge I/O flexibilty. The CPUs feature a very
low power consumption and, depending on the variant, up to 2.7GHz processor base frequency. They
also offer many features known from the desktop range such as SSE4.1/4.2, loadable microcode etc.
The employed Intel®-CPUs operate in an extended range of thermal conditions and therefore are capable
for use in industrial systems.
3.4 Memory
Conventional SO-DIMM260 memory modules, as familiar from notebook computers, are used to equip
the board with memory. For technical and mechanical reasons it is possible that particular memory
modules cannot be employed. Please ask your distributor for recommended memory modules.
With currently available SO-DIMM260 modules a memory extension up to 32 GByte is possible
(DDR4-2133).
If both memory sockets are in use, notice that you must use identical memory modules.
All timing parameters for different memory modules are automatically set by BIOS.
Beckhoff New Automation Technology CB3064-xxxx page 15
Chapter: Connectors Memory
Notice
Please consider the requirements on the cabling!
For most interfaces, the cables must meet certain requirements. For instance,
USB 2.0 requires twisted and shielded cables to reliably maintain full speed data
rates. Restrictions on maximum cable length are also in place for many high
speed interfaces and for power supply. Please refer to the respective
specifications and use suitable cables at all times.
4 Connectors
This section describes all the connectors found on the CB3064.
page 16 Beckhoff New Automation Technology CB3064-xxxx
Connector Map Chapter: Connectors
Ref.-No.
Function
Page
P500/1/2/3
"SATA Interfaces"
p. 29
P504
"GPIO"
p. 33
P700/800
"LAN"
p. 28
P900
"DVI"
p. 22
P901
"DVI/HDMI/DisplayPort and USB3.0"
p. 23
P1000
"Fan Connectors"
p. 34
P1001
"PCI-Express",
p. 31
P1002
"System"
p. 35
P1100
"Serial Interface COM1"
p. 30
P1101/3
"USB 3-6"
p. 25
P1102/4
"USB2.0 (internal)"
p. 26
P1200
"Power Input"
p. 15
4.1 Connector Map
Please use the connector map below for quick reference. Only connectors on the component side are
shown. For more information on each connector refer to the table below.
Beckhoff New Automation Technology CB3064-xxxx page 17
Chapter: Connectors Power Input
Manufacturer
Description
Mating Connector
Molex
43045-2019
z.B. 43025-2000
Description
Name
Pin
Name
Description
SMBus clock signal/
COM transmit data
SMB_CLK/
COM.TXD
1
11
SMB_DAT/
COM.RXD
SMBus data /
COM receive data
'Power Supply On'enables/disables the output
voltages:
Ground = voltages ON
Open Drain = voltages OFF
PS_ON
2
12
ATXPWRGOOD
'ATX Powergood':
Low(0V) = voltage not ok
Open Drain = voltage ok
Powerbutton output to turn
on/off the connected
computer
ATXPWRBTN#
3
13
SVCC
S5V / 5A
12V / 8A
12V
4
14
12V
12V / 8A
ground
GND
5
15
GND
ground
ground
GND
6
16
GND
ground
5V / 17A
VCC
7
17
VCC
5V / 17A
5V / 17A
VCC
8
18
VCC
5V / 17A
SUSV activity:
Low (0V) = SUPS inactive
High (3.3V) = SUPS active
SUSV
9
19
GND
ground
3.3V / 10A
3.3V
10
20
3.3V
3.3V / 10A
4.2 Power Input
The connector for power supply is a 2x10-pin connector.
The 12V voltage supply is needed for employment of PCI-Express cards and FAN connectors. COM RXD
and TXD also can be used for PSU, e.g. the UPS functionality.
Communication is carried out via SMBus signaling (SMB_CLK/SMB_DAT).
page 18 Beckhoff New Automation Technology CB3064-xxxx
Memory Chapter: Connectors
Description
Name
Pin
Name
Description
Ground
GND
1 2 GND
Ground
Data lane 5
DQ5
3 4 DQ4
Data lane 4
Ground
GND
5 6 GND
Ground
Data lane 1
DQ1
7 8 DQ0
Data lane 0
Ground
GND
9
10
GND
Ground
Data Strobe 0 -
DQS0_c
11
12
NC
Reserved
Data Strobe 0 +
DQS0_t
13
14
GND
Ground
Ground
GND
15
16
DQ6
Data lane 6
Data lane 7
DQ7
17
18
GND
Ground
Ground
GND
19
20
DQ2
Data lane 2
Data lane 3
DQ3
21
22
GND
Ground
Ground
GND
23
24
DQ12
Data lane 12
Data lane 13
DQ13
25
26
GND
Ground
Ground
GND
27
28
DQ8
Data lane 8
Data lane 9
DQ9
29
30
GND
Ground
Ground
GND
31
32
DQS1_c
Data Strobe 1 -
Reserved
NC
33
34
DQS1_t
Data Strobe 1 +
Ground
GND
35
36
GND
Ground
Data lane 15
DQ15
37
38
DQ14
Data lane 14
Ground
GND
39
40
GND
Ground
Data lane 10
DQ10
41
42
DQ11
Data lane 11
Ground
GND
43
44
GND
Ground
Data lane 21
DQ21
45
46
DQ20
Data lane 20
Ground
GND
47
48
GND
Ground
Data lane 17
DQ17
49
50
DQ16
Data lane 16
Ground
GND
51
52
GND
Ground
4.3 Memory
The CB3064 is equipped with two SO-DIMM260 sockets for DDR4-2133-RAM. For technical and
mechanical reasons it is possible that particular memory modules cannot be employed. Please ask your
distributor for recommended memory modules
With currently available memory modules a memory extension up to 32 GByte is possible.
All timing parameters for different memory modules are automatically set by BIOS.
Beckhoff New Automation Technology CB3064-xxxx page 19
Chapter: Connectors Memory
Description
Name
Pin
Name
Description
Data Strobe 2 -
DQS2_c
53
54
NC
Reserved
Data Strobe 2 +
DQS2_t
55
56
GND
Ground
Ground
GND
57
58
DQ22
Data lane 22
Data lane 23
DQ23
59
60
GND
Ground
Ground
GND
61
62
DQ18
Data lane 18
Data lane 19
DQ19
63
64
GND
Ground
Ground
GND
65
66
DQ28
Data lane 28
Data lane 29
DQ29
67
68
GND
Ground
Ground
GND
69
70
DQ24
Data lane 24
Data lane 25
DQ25
71
72
GND
Ground
Ground
GND
73
74
DQS3_c
Data Strobe 3 -
Reserved
NC
75
76
DQS3_t
Data Strobe 3 +
Ground
GND
77
78
GND
Ground
Data lane 30
DQ30
79
80
DQ31
Data lane 31
Ground
GND
81
82
GND
Ground
Data lane 26
DQ26
83
84
DQ27
Data lane 27
Ground
GND
85
86
GND
Ground
Reserved
NC
87
88
NC
Reserved
Ground
GND
89
90
GND
Ground
Reserved
NC
91
92
NC
Reserved
Ground
GND
93
94
GND
Ground
Data Strobe 8 -
DQS8_c
95
96
NC
Reserved
Data Strobe 8 +
DQS8_t
97
98
GND
Ground
Ground
GND
99
100
NC
Reserved
Reserved
NC
101
102
GND
Ground
Ground
GND
103
104
NC
Reserved
Reserved
NC
105
106
GND
Ground
Ground
GND
107
108
RESET_n
Reset
Clock Enable 0
CKE0
109
110
CKE1
Clock Enable 1
Power supply 1,2V
VCC
111
112
VCC
Power supply 1,2V
Bank Group Input 1
BG1
113
114
ACT_n
Activation Command Input
Bank Group Input 0
BG0
115
116
ALERT_n
Alert
Power supply 1,2V
VCC
117
118
VCC
Power supply 1,2V
Address lane 12
A12
119
120
A11
Address lane 11
Address lane 9
A9
121
122
A7
Address lane 7
Power supply 1,2V
VCC
123
124
VCC
Power supply 1,2V
Address lane 8
A8
125
126
A5
Address lane 5
Address lane 6
A6
127
128
A4
Address lane 4
Power supply 1,2V
VCC
129
130
VCC
Power supply 1,2V
Address lane3
A3
131
132
A2
Address lane 2
Address lane 1
A1
133
134
EVENT_n
Event
Power supply 1,2V
VCC
135
136
VCC
Power supply 1,2V
Clock-Signal 0 +
CK0_t
137
138
CK1_t
Clock 1 +
Clock-Signal 0 -
CK0_c
139
140
CK1_c
Clock 1 -
Power supply 1,2V
VCC
141
142
VCC
Power supply 1,2V
Even parity check
Parity
143
144
A0
Address lane 0
SDRAM Bank 2
BA1
145
146
A10/AP
Address lane
10/Autoprecharge
Power supply 1,2V
VCC
147
148
VCC
Power supply 1,2V
Chip Select 0
CS0_n
149
150
BA0
Bank Adress 0
Address lane 14/Write
Enable
A14/WE_n
151
152
A16/RAS_n
Address lane 16/Row
Address Strobe
Power supply 1,2V
VCC
153
154
VCC
Power supply 1,2V
On Die Termination 0
ODT0
155
156
A15/CAS_n
Address lane 15/Column
Address Strobe
page 20 Beckhoff New Automation Technology CB3064-xxxx
Memory Chapter: Connectors
Description
Name
Pin
Name
Description
Chip Select 1
CS1_n
157
158
A13
Address lane 13
Power supply 1,2V
VCC
159
160
VCC
Power supply 1,2V
On Die Termination 1
ODT1
161
162
NC
Reserved
Power supply 1,2V
VCC
163
164
VREFCA
Reference voltage
Reserved
NC
165
166
SA2
SPD address 2
Ground
GND
167
168
GND
Ground
Data lane 37
DQ37
169
170
DQ36
Data lane 36
Ground
GND
171
172
GND
Ground
Data lane 33
DQ33
173
174
DQ32
Data lane 32
Ground
GND
175
176
GND
Ground
Data Strobe 4 -
DQS4_c
177
178
NC
Reserved
Data Strobe 4 +
DQS4_t
179
180
GND
Ground
Ground
GND
181
182
DQ39
Data lane 39
Data lane 38
DQ38
183
184
GND
Ground
Ground
GND
185
186
DQ35
Data lane 35
Data lane 34
DQ34
187
188
GND
Ground
Ground
GND
189
190
DQ45
Data lane 45
Data lane 44
DQ44
191
192
GND
Ground
Ground
GND
193
194
DQ41
Data lane 41
Data lane 40
DQ40
195
196
GND
Ground
Ground
GND
197
198
DQS5_c
Data Strobe 5 -
Reserved
NC
199
200
DQS5_t
Data Strobe 5 +
Ground
GND
201
202
GND
Ground
Data lane 46
DQ46
203
204
DQ47
Data lane 47
Ground
GND
205
206
GND
Ground
Data lane 42
DQ42
207
208
DQ43
Data lane 43
Ground
GND
209
210
GND
Ground
Data lane 52
DQ52
211
212
DQ53
Data lane 53
Ground
GND
213
214
GND
Ground
Data lane 49
DQ49
215
216
DQ48
Data lane 48
Ground
GND
217
218
GND
Ground
Data Strobe 6 -
DQS6_c
219
220
NC
Reserved
Data Strobe 6 +
DQS6_t
221
222
GND
Ground
Ground
GND
223
224
DQ54
Data lane 54
Data lane 55
DQ55
225
226
GND
Ground
Ground
GND
227
228
DQ50
Data lane 50
Data lane 51
DQ51
229
230
GND
Ground
Ground
GND
231
232
DQ60
Data lane 60
Data lane 61
DQ61
233
234
GND
Ground
Ground
GND
235
236
DQ57
Data lane 57
Data lane 56
DQ56
237
238
GND
Ground
Masse
GND
239
240
DQS7_c
Data Strobe 7 -
Reserved
NC
241
242
DQS7_t
Data Strobe 7 +
Ground
GND
243
244
GND
Ground
Data lane 62
DQ62
245
246
DQ63
Data lane 63
Ground
GND
247
248
GND
Ground
Data lane 58
DQ58
249
250
DQ59
Data lane 59
Ground
GND
251
252
GND
Ground
SMBus Clock
SCL
253
254
SDA
SMBus Data
I²C Power for SPD EEProm
VCCSPD
255
256
SA0
SPD address 0
DRAM Activating Power
VPP
257
258
VTT
Termination voltage
DRAM Activating Power
VPP
259
260
SA1
SPD address 1
Beckhoff New Automation Technology CB3064-xxxx page 21
Chapter: Connectors DVI
Pin
Name
Description
1
TMDSDAT2#
DVI data 2 -
2
TMDSDAT2
DVI data 2 +
3
GND
ground
4
N/C
reserved
5
N/C
reserved
6
DDC CLK
DDC clock (DVI/VGA)
7
DDC DAT
DDC data (DVI/VGA)
8
N/C
reserved
9
TMDSDAT1#
DVI data 1 -
10
TMDSDAT1
DVI data 1 +
11
GND
ground
12
N/C
reserved
13
N/C
reserved
14
VCC
5 volt supply
15
GND
ground
16
HP_DETECT
hot plug detect
17
TMDSDAT0#
DVI data 0 -
18
TMDSDAT0
DVI data 0 +
19
GND
ground
20
N/C
reserved
21
N/C
reserved
22
GND
ground
23
TMDS CLK
DVI clock +
24
TMDS CLK#
DVI clock -
C1
N/C
reserved
C2
N/C
reserved
C3
N/C
reserved
C4
N/C
reserved
C5
GND
ground
4.4 DVI
The CB3064 is connected to an external display via a DVI-D connector. Only digital displays are
supported.
Pinout DVI-D:
page 22 Beckhoff New Automation Technology CB3064-xxxx
DVI/HDMI/DisplayPort and USB3.0 Chapter: Connectors
Manufacturer
Description
Mating Connector
I-PEX
20455-030E-12
custom design
Pin
Name
Description
1
TMDS0#/DP2#
DVI Data 0 - / DP Lane 2 -
2
TMDS0/DP2
DVI Data 0 + / DP Lane 2 +
3
TMDS1#/DP1#
DVI Data 1 - / DP Lane 1 -
4
TMDS1/DP1
DVI Data 1 + / DP Lane 1 +
5
TMDS2#/DP0#
DVI Data 2 - / DP Lane 0 -
6
TMDS2/DP0
DVI Data 2 + / DP Lane 0 +
7
TMDSCLK#/DP3#
DVI Clock - / DP Lane 3 -
8
TMDSCLK/DP3
DVI Clock + / DP Lane 3 +
9
N/C
reserved
10
SEL_DVI/DP#
DVI-DisplayPort Select
11
DDCK/DPAUX
EDID Clock / DP Aux +
12
DDDA/DPAUX#
EDID Data / DP Aux -
13
VCC
5V supply
14
GND
ground
15
HPD
hot plug detect
16
USBVCC
5V supply for USB
17
USBVCC
5V supply for USB
4.5 DVI/HDMI/DisplayPort and USB3.0
The CB3064 provides a second DVI interface which is realized as a 30-pin flat cable header. Analog VGA
is not available on this connector. However, an HDMI device or DisplayPort device can be connected.
This custom connector also carries an additional USB interface. The USB interface supports USB 3.0. It
provides up to 900 mA current and is protected by an electronically resettable fuse.
When cabling, please make sure that receive lines are always connected to the transmit lines and vice
versa.
Maximum current is 2 amperes for VCC combined (0.5A per contact), and 1 ampere for 3.3V (0.5A per
contact).
Please note that a custom cable design is required.
Pinout 30pin connector DVI/HDMI/DisplayPort:
Beckhoff New Automation Technology CB3064-xxxx page 23
Chapter: Connectors DVI/HDMI/DisplayPort and USB3.0
Pin
Name
Description
18
N/C
reserved
19
N/C
reserved
20
SSRX#
Super Speed receiver -
21
SSRX
Super Speed receiver +
22
USB#
USB -
23
USB
USB +
24
SSTX#
Super Speed transmitter -
25
SSTX
Super Speed transmitter
26
3.3V
3.3V supply
27
3.3V
3.3V supply
28
VCC
5V supply
29
VCC
5V supply
30
VCC
5V supply
page 24 Beckhoff New Automation Technology CB3064-xxxx
USB 3-6 Chapter: Connectors
Pin
Name
Description
1
VCC
5 volt for USBX
2
USBX#
Minus channel USBX
3
USBX
Plus channel USBX
4
GND
ground
5
StdA_SSRX-
SuperSpeed Receiver -
6
StdA_SSRX+
SuperSpeed Receiver +
7
GND
ground
8
StdA_SSTX-
SuperSpeed Transmitter -
9
StdA_SSTX+
SuperSpeed Transmitter +
4.6 USB 3-6
USB channel 1 to 4 are made available via standard USB connectors.
The USB channels support USB 3.0. You may note that the setting of USB keyboard or USB mouse
support in the BIOS-setup is only necessary and advisable, if the OS offers no USB-support. BIOS-setup
can be changed with a USB keyboard without enabling USB keyboard support. Running Windows with
these features enabled may lead to significant performance or functionality limitations.
Every USB interface provides up to 900 mA current and is protected by an electronically resettable fuse.
Pinout USB3.0 connector for channel X:
Beckhoff New Automation Technology CB3064-xxxx page 25
Chapter: Connectors USB2.0 (internal)
Manufacturer
Description
Mating Connector
FCI
98424-G52-08LF
90311-008LF
Manufacturer
Description
Mating Connector
Amphenol FCI
98424-G52-16LF
e.g. 89947-716LF
Description
Name
Pin
Name
Description
5V for USB9
VCC
1 9 VCC
5V for USB10
Minus data channel USB9
USB9-
2
10
USB10-
Minus data channel USB10
Plus data channel USB9
USB9+
3
11
USB10+
Plus data channel USB10
Ground
GND
4
12
GND
Ground
Ground
GND
5
13
GND
Ground
Plus data channel USB12
USB12+
6
14
USB11+
Plus data channel USB11
Minus data channel USB12
USB12-
7
15
USB11-
Minus data channell USB11
5V for USB12
VCC
8
16
VCC
5V for USB11
Description
Name
Pin
Name
Description
5V for USB13
VCC
1 5 VCC
5V for USB14
Minus data channel USB13
USB13-
2 6 USB14-
Minus data channel USB14
4.7 USB2.0 (internal)
The USB channel 9 to 14 are made available via two connectors.
Channel 9 to 12 are provided via a 2x8-pin connector, channel 13 and 14 are provided via a 2x4-pin
connector.
The USB channels support USB 2.0. You may note that the setting of USB keyboard or USB mouse
support in the BIOS-setup is only necessary and advisable, if the OS offers no USB-support. BIOS-setup
can be changed with a USB keyboard without enabling USB keyboard support. Running Windows with
these features enabled may lead to significant performance or functionality limitations.
Every USB interface provides up to 500 mA current and is protected by an electronically resettable fuse.
2x8-pin connector:
Pinout 2x8-pin USB connector:
Pinout 2x4-pin USB connector:
page 26 Beckhoff New Automation Technology CB3064-xxxx
USB2.0 (internal) Chapter: Connectors
Description
Name
Pin
Name
Description
Plus data channel USB13
USB13+
3 7 USB14+
Plus data channel USB14
Ground
GND
4 8 GND
Ground
Beckhoff New Automation Technology CB3064-xxxx page 27
Chapter: Connectors LAN
Notice
For realtime applications, the external controller (MAC/PHY) is to prefer.
Pin
Name
Description
1
LAN-0
LAN channel 0 plus
2
LAN-0#
LAN channel 0 minus
3
LAN-1
LAN channel 1 plus
4
LAN-2
LAN channel 2 plus
5
LAN-2#
LAN channel 2 minus
6
LAN-1#
LAN channel 1 minus
7
LAN-3
LAN channel 3 plus
8
LAN-3#
LAN channel 3 minus
4.8 LAN
The module has two LAN interfaces. All interfaces support 10BaseT, 100BaseT, and 1000BaseT
compatible net components with automatic bandwidth selection. Controller chip are Intel®'s i219 (PHY,
LAN1) and i210 (MAC/PHY, LAN2). Auto-cross and auto-negotiate functionality is available as is PXE
and WOL.
Pinout LAN 10/100/1000:
page 28 Beckhoff New Automation Technology CB3064-xxxx
SATA Interfaces Chapter: Connectors
Pin
Name
Description
1
GND
ground
2
SATATX
SATA transmit +
3
SATATX#
SATA transmit -
4
GND
ground
5
SATARX
SATA receive -
6
SATARX#
SATA receive +
7
GND
ground
4.9 SATA Interfaces
The CB3064 provides four SATA interfaces which allows transfer rates of up to 6 Gb/s. The interface is
made available via a standard SATA connector and supports RAID 0/1/5/10.
The required settings are made in the BIOS setup.
Pinout SATA:
Beckhoff New Automation Technology CB3064-xxxx page 29
Chapter: Connectors Serial Interface COM1
Description
Name
Pin
Name
Description
data carrier detect
DCD
1 6 DSR
data set ready
receive data
RXD
2 7 RTS
request to send
transmit data
TXD
3 8 CTS
clear to send
data terminal ready
DTR
4 9 RI
ring indicator
ground
GND
5
4.10 Serial Interface COM1
The serial interface COM1 is made available via a 9-pin standard DSUB-connector (male). RS232
standard signals are provided.
The port address and the interrupt are set via the BIOS setup.
Pinout serial port (DSUB connector):
page 30 Beckhoff New Automation Technology CB3064-xxxx
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