Beckhoff CB3051 User Manual
Beckhoff Automation GmbH phone: +49 (0) 52 46/963-0
Eiserstr. 5 fax: +49 (0) 52 46/963-198
33415 Verl email: info@beckhoff.de
Germany web: www.beckhoff.de
CB3051
Manual
rev. 1.2
Contents
Beckhoff New Automation Technology CB3051 page 3
Contents
0 Document History...........................................................................................................................5
1 Introduction.....................................................................................................................................6
1.1 Notes on the Documentation..................................................................................................6
1.1.1 Liability Conditions.............................................................................................................6
1.1.2 Copyright...........................................................................................................................6
1.2 Safety Instructions..................................................................................................................7
1.2.1 Disclaimer..........................................................................................................................7
1.2.2 Description of Safety Symbols............................................................................................7
1.3 Essential Safety Measures.....................................................................................................8
1.3.1 Operator's Obligation to Exercise Diligence........................................................................8
1.3.2 National Regulations Depending on the Machine Type.......................................................8
1.3.3 Operator Requirements......................................................................................................8
1.4 Functional Range...................................................................................................................9
2 Overview......................................................................................................................................10
2.1 Features...............................................................................................................................10
2.2 Specifications and Documents..............................................................................................12
3 Detailed Description......................................................................................................................13
3.1 Power Supply.......................................................................................................................13
3.2 CPU.....................................................................................................................................13
3.3 Memory................................................................................................................................13
4 Connectors...................................................................................................................................14
4.1 Connector Map.....................................................................................................................14
4.2 Power Supply.......................................................................................................................15
4.3 System.................................................................................................................................16
4.4 External CMOS Battery........................................................................................................17
4.5 Memory................................................................................................................................18
4.6 VGA/DVI..............................................................................................................................21
4.7 LVDS...................................................................................................................................22
4.8 Touch Screen.......................................................................................................................24
4.9 USB 1-4...............................................................................................................................25
4.10 USB 5-8...............................................................................................................................26
4.11 LAN1....................................................................................................................................27
4.12 LAN2....................................................................................................................................28
4.13 Audio....................................................................................................................................29
4.14 SATA Interfaces...................................................................................................................30
4.15 IDE Interface........................................................................................................................31
4.16 Serial Interface COM1..........................................................................................................33
4.17 Serial Ports COM2 through COM4........................................................................................34
4.18 SMB/I2C...............................................................................................................................35
4.19 Mini-PCI...............................................................................................................................36
4.20 GPIO....................................................................................................................................38
4.21 Fan Connectors....................................................................................................................39
5 BIOS Settings...............................................................................................................................40
5.1 Remarks for Setup Use........................................................................................................40
5.2 Top Level Menu....................................................................................................................40
5.3 Standard CMOS Features....................................................................................................41
Contents
page 4 Beckhoff New Automation Technology CB3051
5.3.1 IDE Channel 0 Master/Slave............................................................................................42
5.4 Advanced BIOS Features.....................................................................................................43
5.4.1 CPU Feature....................................................................................................................45
5.4.2 Hard Disk Boot Priority.....................................................................................................46
5.5 Advanced Chipset Features..................................................................................................47
5.5.1 PCI Express Root Port Function.......................................................................................49
5.6 Integrated Peripherals..........................................................................................................50
5.6.1 OnChip IDE Devices........................................................................................................51
5.6.2 Onboard Devices.............................................................................................................52
5.6.3 SuperIO Devices..............................................................................................................53
5.7 Power Management Setup...................................................................................................54
5.8 PnP/PCI Configuration..........................................................................................................56
5.8.1 IRQ Resources.................................................................................................................57
5.9 PC Health Status..................................................................................................................58
5.10 Frequency/Voltage Control...................................................................................................60
5.11 Load Fail-Safe Defaults........................................................................................................61
5.12 Load Optimized Defaults......................................................................................................61
5.13 Set Password.......................................................................................................................61
5.14 Save & Exit Setup................................................................................................................61
5.15 Exit Without Saving..............................................................................................................61
6 BIOS update.................................................................................................................................62
7 Mechanical Drawing......................................................................................................................63
7.1 PCB: Mounting Holes...........................................................................................................63
7.2 PCB: Pin 1 Dimensions........................................................................................................64
7.3 PCB: Heat Spreader.............................................................................................................65
8 Technical Data..............................................................................................................................66
8.1 Electrical Data......................................................................................................................66
8.2 Environmental Conditions.....................................................................................................66
8.3 Thermal Specifications.........................................................................................................67
9 Support and Service.....................................................................................................................68
9.1 Beckhoff's Branch Offices and Representatives....................................................................68
9.2 Beckhoff Headquarters.........................................................................................................68
9.2.1 Beckhoff Support..............................................................................................................68
9.2.2 Beckhoff Service..............................................................................................................68
I Annex: Post-Codes.......................................................................................................................69
II Annex: Resources........................................................................................................................72
A IO Range..................................................................................................................................72
B Memory Range.........................................................................................................................72
C Interrupt....................................................................................................................................72
D PCI Devices..............................................................................................................................73
E SMB Devices............................................................................................................................73
Notes on the Documentation Chapter: Document History
Beckhoff New Automation Technology CB3051 page 5
0 Document History
Version Changes
0.1 first pre-release
0.2 added SMB devices and PCI devices to resources section, updated block diagram,
several minor changes
1.0 updated block diagram and feature list, minor changes
1.1 updated contact details, minor changes
1.2 added connector map, updated COM4 description, minor changes
NOTE
All company names, brand names, and product names referred to in this manual are registered or
unregistered trademarks of their respective holders and are, as such, protected by national and
international law.
Chapter: Introduction Notes on the Documentation
page 6 Beckhoff New Automation Technology CB3051
1 Introduction
1.1 Notes on the Documentation
This description is only intended for the use of trained specialists in control and automation engineering
who are familiar with the applicable national standards. It is essential that the following notes and
explanations are followed when installing and commissioning these components.
1.1.1 Liability Conditions
The responsible staff must ensure that the application or use of the products described satisfy all the
requirements for safety, including all the relevant laws, regulations, guidelines and standards.
The documentation has been prepared with care. The products described are, however, constantly under
development. For that reason the documentation is not in every case checked for consistency with
performance data, standards or other characteristics. None of the statements of this manual represents a
guarantee (Garantie) in the meaning of § 443 BGB of the German Civil Code or a statement about the
contractually expected fitness for a particular purpose in the meaning of § 434 par. 1 sentence 1 BGB. In
the event that it contains technical or editorial errors, we retain the right to make alterations at any time
and without warning. No claims for the modification of products that have already been supplied may be
made on the basis of the data, diagrams and descriptions in this documentation.
1.1.2 Copyright
© This documentation is copyrighted. Any reproduction or third party use of this publication, whether in
whole or in part, without the written permission of Beckhoff Automation GmbH, is forbidden.
Safety Instructions Chapter: Introduction
Beckhoff New Automation Technology CB3051 page 7
1.2 Safety Instructions
Please consider the following safety instructions and descriptions. Product specific safety instructions are
to be found on the following pages or in the areas mounting, wiring, commissioning etc.
1.2.1 Disclaimer
All the components are supplied in particular hardware and software configurations appropriate for the
application. Modifications to hardware or software configurations other than those described in the
documentation are not permitted, and nullify the liability of Beckhoff Automation GmbH.
1.2.2 Description of Safety Symbols
The following safety symbols are used in this documentation. They are intended to alert the reader to the
associated safety instructions.
ACUTE RISK OF INJURY!
If you do not adhere to the safety advise next to this symbol, there is immediate danger to life and health
of individuals!
RISK OF INJURY!
If you do not adhere to the safety advise next to this symbol, there is danger to life and health of
individuals!
HAZARD TO INDIVIDUALS, ENVIRONMENT, DEVICES, OR DATA!
If you do not adhere to the safety advise next to this symbol, there is obvious hazard to individuals, to
environment, to materials, or to data.
NOTE OR POINTER
This symbol indicates information that contributes to better understanding.
Chapter: Introduction Essential Safety Measures
page 8 Beckhoff New Automation Technology CB3051
1.3 Essential Safety Measures
1.3.1 Operator's Obligation to Exercise Diligence
The operator must ensure that
o the product is only used for its intended purpose
o the product is only operated in sound condition and in working order
o the instruction manual is in good condition and complete, and always available for reference at the
location where the products are used
o the product is only used by suitably qualified and authorised personnel
o the personnel is instructed regularly about relevant occupational safety and environmental protection
aspects
o the operating personnel is familiar with the operating manual and in particular the safety notes
contained herein
1.3.2 National Regulations Depending on the Machine Type
Depending on the type of machine and plant in which the product is used, national regulations governing
the controllers of such machines will apply, and must be observed by the operator. These regulations
cover, amongst other things, the intervals between inspections of the controller. The operator must initiate
such inspections in good time.
1.3.3 Operator Requirements
o Read the operating instructions
All users of the product must have read the operating instructions for the system they work with.
o System know-how
All users must be familiar with all accessible functions of the product.
Functional Range Chapter: Introduction
Beckhoff New Automation Technology CB3051 page 9
1.4 Functional Range
NOTE
The descriptions contained in the present documentation represent a detailed and extensive product
description. As far as the described motherboard was acquired as an integral component of an Industrial
PC from Beckhoff Automation GmbH, this product description shall be applied only in limited scope. Only
the contractually agreed specifications of the corresponding Industrial PC from Beckhoff Automation
GmbH shall be relevant. Due to several models of Industrial PCs, variations in the component placement
of the motherboards are possible. Support and service benefits for the built-in motherboard will be
rendered by Beckhoff Automation GmbH exclusively as specified in the product description (inclusive
operation system) of the particular Industrial PC.
Chapter: Overview Features
page 10 Beckhoff New Automation Technology CB3051
2 Overview
2.1 Features
The CB3051 is a highly complex 3,5-inch board with the functionalities of a motherboard. It is equipped
with an Intel® Celeron® M, an Intel Core™ Duo, or an Intel® Core™2 Duo processor, with up to 4 GByte
DDR2-667-RAM via SoDIMM200, with a Mini-PCI-bus and with additional periphery such as four serial
busses, two LAN-connectors, sound input and output, eight USB channels, CRT and TFT connectors,
one IDE and two SATA channels. Furthermore, a touch screen can be connected to the board.
ICH7
Intel® 82801GB
Winbond®
W83627GF
LPC PCI
Winbond®
W83627GF
Intel®
82573L(E)
(10/100/1000)
2x
SoDIMM200
DDR2-667
MEMORY (DUAL CH.)
Power
VCCCore; VTT; DDRVTT
1,5V; 1,8V; 2,5V; 3,3V
Clock
IDTCV111PAG
BIOS
MS
RealTek®
ALC655
MIC
LINE
OUT
ACLink
KB
USB1
USB2
USB3
LAN2
USB4
COM1
COM2
Watchdog
Intel® Core™2 Duo, Core™
Duo, Pentium® M
HOST
CRT
LCD
LVDS 18
GMCH
Intel® 945GM(E)
DMI
USB 2.0
SPDIF i
SPDIF o
Mini-PCI
COM3
(PWR)
COM4
(Touch)
Intel®
82562EZ
(10/100)
USB5
USB6
LAN1
COACh3®
Touch
Controller
Touch-
Screen
FAN1
FAN2
DVI
16x GPIO
PATA
SATA1
SATA2
USB7
(USB8)
SMBus
USB8
PCIe x1
(COM4)
I2C
o Processor Intel® Celeron® M, Intel® Core™ Duo, Intel® Core™2 Duo
o Chipset Intel 945GM and Intel ICH7
o 2 SoDIMM200 sockets for up to 4 GByte DDR2-667
o Four serial interfaces COM1 up to COM4
o 1x Ethernet 10/100 (Base-T), 1x Ethernet 10/100/1000 (Base-T)
o IDE interface
o Two SATA connectors (up to SATA2, 3GByte/sec)
o PS/2 keyboard / mouse interface
o Eight USB 2.0 interfaces
o AWARD® BIOS 6.10
o CRT connection
o DVI connection
o TFT connection, LVDS 18 bit
Features Chapter: Overview
Beckhoff New Automation Technology CB3051 page 11
o AC97 compatible sound controller with SPDIF in and out
o RTC with external CMOS battery
o 5V single supply voltage
o Mini-PCI interface
o Touch screen interface
o Size 102 mm x 147 mm
Chapter: Overview Specifications and Documents
page 12 Beckhoff New Automation Technology CB3051
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation the following documents,
specifications and web-pages were used and are recommended.
§ PCI specification
Version 2.3 resp. 3.0
www.pcisig.com
§ Mini-PCI specification
Version 1.0
www.pcisig.com
§ ACPI specification
Version 3.0
www.acpi.info
§ ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org
§ USB specifications
www.usb.org
§ SM-Bus specification
Version 2.0
www.smbus.org
§ Intel chip set description
Mobile Intel 945 Express Chipset Family Datasheet
www.intel.com
§ Intel chip set description
ICH7 Datasheet
www.intel.com
§ Intel chip descriptions
Celeron M, Core Duo/Solo, Core2 Duo
www.intel.com
§ Winbond chip description
W83627HG Datasheet
www.winbond-usa.com or www.winbond.com.tw
§ Intel chip description
82562EZ/GZ Datasheet
www.intel.com
§ Intel chip description
82573L(E) Datasheet
www.intel.com
§ IDT chip description
IDTCV111i Datasheet
www.idt.com
§ Chrontel chip description
Chrontel 7307C
www.chrontel.com
§ Elo TouchSystems chip description
COACh3
www.elotouch.de
(NDA required)
Power Supply Chapter: Detailed Description
Beckhoff New Automation Technology CB3051 page 13
3 Detailed Description
3.1 Power Supply
The power supply of the hardware module is effected via the power connector. The board requires an
operating voltage of 5 volt ± 5%. The two fan connectors can be attached to 12 volt if required.
3.2 CPU
The board can be ordered with one of the following processors employed:Intel® Celeron® M, Intel®
Core™ Duo, and Intel® Core™ 2 Duo. The package type allows a maximum die temperature of 100
degrees Celsius and accords highest possible security even in rough environment.
The processor includes a second level cache of up to 4 MByte, depending on which model is used.
Furthermore the processors offer many features known from the desktop range such as MMX2, serial
number, loadable microcode etc.
3.3 Memory
There is one conventional SO-DIMM200 socket available to equip the board with memory. For
mechanical reasons it is possible that particular memory modules cannot be employed. Please ask your
sales representative for recommended memory modules.
With currently available SO-DIMM200 modules a memory extension up to 4 GByte is possible (DDR2-
667).
Chapter: Connectors Connector Map
page 14 Beckhoff New Automation Technology CB3051
4 Connectors
4.1 Connector Map
Please use the connector map below for quick reference. Only connectors on the component side are
shown. For more information on each connector refer to the table below.
Ref-No. Function Page
P501/4 "SATA Interfaces" p. 30
P503/J500 "IDE Interface" p. 31
U600/1 "Memory" p. 18
P800 "GPIO" p. 38
P900 "LAN1" p. 27
P1000 "LAN2" p. 28
P1200 "LVDS" p. 22
P1201 "Mini-PCI" p. 36
P1202 "VGA/DVI" p. 21
P1300/J1300 "Touch Screen" p. 24
P1301 "SMB/I2C" p. 35
P1302 "Audio" p. 29
P1303 "System" p. 16
P1400 "Serial Interface COM1" p. 33
P1401/4 "USB 1-4" p. 25
P1403/8 "Serial Ports COM2 through COM4" p. 34
P1406/10 "USB 5-8" p. 26
P1407/9 "Fan Connectors" p. 39
P1500 "External CMOS Battery" p. 17
P1600 "Power Supply" p. 15
Power Supply Chapter: Connectors
Beckhoff New Automation Technology CB3051 page 15
4.2 Power Supply
The power supply of the hardware module is effected via a 2x8-pin connector (Molex PS 43045-16xx,
mating connector: Molex PS 43025-16xx). The pins for 12 volt have the sole purpose of supplying one or
both fans with the necessary current. Thus, when no fan is installed, these pins have no function. COM3
RXD and TXD can also be used for connecting a second power supply unit, e. g. for UPS. As an ordering
option SMBus signals SCL/SDA can be provided (replacing COM3 TXD/RXD).
Description Name Pin Name Description
COM3 transmit data TXD 1 9 RXD COM3 receive data
PSU on PS-ON 2 10 RESET# PSU reset
powerbutton PSU PWRBTN# 3 11 SVCC standby-supply 5V
12 volt supply 12V 4 12 12V 12 volt supply
ground GND 5 13 GND ground
ground GND 6 14 GND ground
5 volt supply VCC 7 15 VCC 5 volt supply
5 volt supply VCC 8 16 VCC 5 volt supply
Chapter: Connectors System
page 16 Beckhoff New Automation Technology CB3051
4.3 System
Some typical signals for system control are provided through a 2x9 pin connector (JST B18B-PHDSS,
mating connector: PHDR-18VS). This connector combines signals for power button, reset, keyboard,
speaker, and several LEDs such as harddisk LED, touch screen LED, suspend LED, and three additional
LEDs which are driven by GPIOs. Of these three GPIO-LEDs, LED1 and LED2 are already provided with
a series resistor. As can be seen from the pinout table below, corresponding signals are often placed visà-vis or at least near to each other.
Description Name Pin Name Description
ground GND 1 10 PWRBTN# on/suspend button
ground GND 2 11 RESET# reset to ground
LED touch screen TOUCHLED 3 12 3.3V 3.3 volt supply
LED suspend / ACPI S-LED 4 13 S3.3V standby supply 3.3 volt
LED harddisk HDLED 5 14 3.3V 3.3 volt supply
LED GPIO device LED1 6 15 3.3V 3.3 volt supply
LED GPIO device LED2 7 16 LED3 LED GPIO device
speaker to 5 volt SPEAKER 8 17 KDAT keyboard data
standby supply 5 volt (S)VCC 9 18 KCLK keyboard clock
External CMOS Battery Chapter: Connectors
Beckhoff New Automation Technology CB3051 page 17
4.4 External CMOS Battery
For keeping the internal clock alive even if the rest of the board is switched off, an external battery can be
attached via a 2 pin connector (JST B2B-EH-A, mating connector: EHR-2).
Pin Name Description
1 BATT battery 3.3 volt
2 GND ground
Chapter: Connectors Memory
page 18 Beckhoff New Automation Technology CB3051
4.5 Memory
Conventional SO-DIMM200 memory modules, as familiar from notebook computers, are used to equip
the board with memory. For mechanical reasons it is possible that particular memory modules cannot be
employed. Please ask your distributor for recommended memory modules.
With currently available SO-DIMM200 modules a memory extension up to 4 GByte is possible (DDR2-
667).
All timing parameters for different memory modules are automatically set by BIOS.
Description Name Pin Name Description
memory reference current REF 1 2 GND ground
ground GND 3 4 DQ4 data 4
data 0 DQ0 5 6 DQ5 data 5
data 1 DQ1 7 8 GND ground
ground GND 9 10 DQM0 data mask 0
data strobe 0 - DQS0# 11 12 GND ground
data strobe 0 + DQS0 13 14 DQ6 data 6
ground GND 15 16 DQ7 data 7
data 2 DQ2 17 18 GND ground
data 3 DQ3 19 20 DQ12 data 12
ground GND 21 22 DQ13 data 13
data 8 DQ8 23 24 GND ground
data 9 DQ9 25 26 DQM1 data mask 1
ground GND 27 28 GND ground
data strobe 1 - DQS1# 29 30 CK0 clock 0 +
data strobe 1 + DQS1 31 32 CK0# clock 0 ground GND 33 34 GND ground
data 10 DQ10 35 36 DQ14 data 14
data 11 DQ11 37 38 DQ15 data 15
ground GND 39 40 GND ground
ground GND 41 42 GND ground
data 16 DQ16 43 44 DQ20 data 20
data 17 DQ17 45 46 DQ21 data 21
ground GND 47 48 GND ground
data strobe 2 - DQS2# 49 50 N/C reserved
Memory Chapter: Connectors
Beckhoff New Automation Technology CB3051 page 19
Description Name Pin Name Description
data strobe 2 + DQS2 51 52 DQM2 data mask 2
ground GND 53 54 GND ground
data 18 DQ18 55 56 DQ22 data 22
data 19 DQ19 57 58 DQ23 data 23
ground GND 59 60 GND ground
data 24 DQ24 61 62 DQ28 data 28
data 25 DQ25 63 64 DQ29 data 29
ground GND 65 66 GND ground
data mask 3 DQM3 67 68 DQS3# data strobe 3 reserved N/C 69 70 DQS3 data strobe 3 +
ground GND 71 72 GND ground
data 26 DQ26 73 74 DQ30 data 30
data 27 DQ27 75 76 DQ31 data 31
ground GND 77 78 GND ground
clock enables 0 CKE0 79 80 CKE1 clock enables 1
1.8 volt supply 1.8V 81 82 1.8V 1.8 volt supply
reserved N/C 83 84 N/C reserved
SDRAM bank 2 BA2 85 86 N/C reserved
1.8 volt supply 1.8V 87 88 1.8V 1.8 volt supply
address 12 A12 89 90 A11 address 11
address 9 A9 91 92 A7 address 7
address 8 A8 93 94 A6 address 6
1.8 volt supply 1.8V 95 96 1.8V 1.8 volt supply
address 5 A5 97 98 A4 address 4
address 3 A3 99 100 A12 address 2
address 1 A1 101 102 A0 address 0
1.8 volt supply 1.8V 103 104 1.8V 1.8 volt supply
address 10 A10 105 106 BA1 SDRAM bank 1
SDRAM bank 0 BA0 107 108 RAS# row address strobe
write enable WE# 109 110 S0# chip select 0
1.8 volt supply 1.8V 111 112 1.8V 1.8 volt supply
column address strobe CAS# 113 114 ODT0 on die termination 0
chip select 1 S1# 115 116 A13 address 13
1.8 volt supply 1.8V 117 118 1.8V 1.8 volt supply
on die termination 1 ODT1 119 120 N/C reserved
ground GND 121 122 GND ground
data 32 DQ32 123 124 DQ36 data 36
data 33 DQ33 125 126 DQ37 data 37
ground GND 127 128 GND ground
data strobe 4 - DQS4# 129 130 DQM4 data mask 4
data strobe 4 + DQS4 131 132 GND ground
ground GND 133 134 DQ38 data 38
data 34 DQ34 135 136 DQ39 data 39
data 35 DQ35 137 138 GND ground
ground GND 139 140 DQ44 data 44
data 40 DQ40 141 142 DQ45 data 45
data 41 DQ41 143 144 GND ground
ground GND 145 146 DQS5# data strobe 5 data mask 5 DQM5 147 148 DQS5 data strobe 5 +
ground GND 149 150 GND ground
data 42 DQ42 151 152 DQ46 data 46
data 43 DQ43 153 154 DQ47 data 47
ground GND 155 156 GND ground
data 48 DQ48 157 158 DQ52 data 52
data 49 DQ49 159 160 DQ53 data 53
Chapter: Connectors Memory
page 20 Beckhoff New Automation Technology CB3051
Description Name Pin Name Description
ground GND 161 162 GND ground
test TEST 163 164 CK1 clock 1 +
ground GND 165 166 CK1# clock 1 data strobe 6 - DQS6# 167 168 GND ground
data strobe 6 DQS6 169 170 DQM6 data mask 6
ground GND 171 172 GND ground
data 50 DQ50 173 174 DQ54 data 54
data 51 DQ51 175 176 DQ55 data 55
ground GND 177 178 GND ground
data 56 DQ56 179 180 DQ60 data 60
data 57 DQ57 181 182 DQ61 data 61
ground GND 183 184 GND ground
data mask 7 DQM7 185 186 DQS7# data strobe 7 ground GND 187 188 DQS7 data strobe 7 +
data 58 DQ58 189 190 GND ground
data 59 DQ59 191 192 DQ62 data 62
ground GND 193 194 DQ63 data 63
SMBus data SDA 195 196 GND ground
SMBus clock SCL 197 198 SA0 SPD address
3.3 volt supply 3.3V 199 200 SA1 SPD address
VGA/DVI Chapter: Connectors
Beckhoff New Automation Technology CB3051 page 21
4.6 VGA/DVI
The module is equipped with a standard DVI-I-connector, which can be used to connect either a DVI
capable display or a standard VGA CRT – using a DVI-DSUB adapter, if necessary.
Pin Name Description
1 TMDSDAT2# DVI data 2
2 TMDSDAT2 DVI data 2
3 GND ground
4 N/C reserved
5 N/C reserved
6 DDC CLK DDC clock (DVI/VGA)
7 DDC DAT DDC data (DVI/VGA)
8 VSYNC VGA vertical sync
9 TMDSDAT1# DVI data 1
10 TMDSDAT1 DVI data 1
11 GND ground
12 N/C reserved
13 N/C reserved
14 VCC 5 volt supply
15 GND ground
16 HP_DETECT hot plug detect
17 TMDSDAT0# DVI data 0
18 TMDSDAT0 DVI data 0
19 GND ground
20 N/C reserved
21 N/C reserved
22 GND ground
23 TMDS CLK DVI clock
24 TMDS CLK# DVI clock
C1 RED VGA red
C2 GREEN VGA green
C3 BLUE VGA blue
C4 HSYNC VGA horizontal sync
C5 GND ground
Chapter: Connectors LVDS
page 22 Beckhoff New Automation Technology CB3051
4.7 LVDS
The board also offers the possibility to use displays with LVDS interface. These can be connected via a
30 pin flat-cable plug (JAE FI-X30S-HF-NPB, mating connector: FI-X30C(2)-NPB). Only shielded and
twisted cables may be used. The display type is to be chosen over the BIOS setup. The connector has
two additional shield pins S1 and S2 which are omitted in the pinout table below.
Pinout LVDS connector:
Pin Name Description
1 TXO00# LVDS even data 0 2 TXO00 LVDS even data 0 +
3 TXO01# LVDS even data 1 4 TXO01 LVDS even data 1 +
5 TXO02# LVDS even data 2 6 TXO02 LVDS even data 2 +
7 GND ground
8 TXO0C# LVDS even clock 9 TXO0C LVDS even clock +
10 TXO03# LVDS even data 3 11 TXO03 LVDS even data 3 +
12 TXO10# LVDS odd data 0 13 TXO10 LVDS odd data 0 +
14 GND ground
15 TXO11# LVDS odd data 1 16 TXO11 LVDS odd data 1 +
17 GND ground
18 TXO12# LVDS odd data 2 19 TXO12 LVDS odd data 2 +
20 TXO1C# LVDS odd clock 21 TXO1C LVDS odd clock +
22 TXO13# LVDS odd data 3 23 TXO13 LVDS odd data 3 +
24 GND ground
25 3.3V 3.3 volt supply
26 DDC_CLK EDID clock for LCD
27 DDC_DAT EDID data for LCD
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