Analog Devices DAC8408GP, DAC8408FT, DAC8408FS, DAC8408FPC, DAC8408FP Datasheet

Quad 8-Bit Multiplying CMOS

a

FEATURES
Four DACs in a 28 Pin, 0.6 Inch Wide DIP or 28-Pin JEDEC

Plastic Chip Carrier
61/4 LSB Endpoint Linearity
Guaranteed Monotonic
DACs Matched to Within 1%
Microprocessor Compatible
Read/Write Capability (with Memory)
TTL/CMOS Compatible
Four-Quadrant Multiplication
Single-Supply Operation (+5 V)
Low Power Consumption
Latch-Up Resistant
Available In Die Form

APPLICATIONS
Voltage Set Points in Automatic Test Equipment
Systems Requiring Data Access for Self-Diagnostics
Industrial Automation
Multichannel Microprocessor-Controlled Systems
Digitally Controlled Op Amp Offset Adjustment
Process Control
Digital Attenuators

GENERAL DESCRIPTION

The DAC8408 is a monolithic quad 8-bit multiplying digital-to­analog CMOS converter. Each DAC has its own reference input,
feedback resistor, and onboard data latches that feature
read/write capability. The readback function serves as memory
for those systems requiring self-diagnostics.

D/A Converter with Memory

DAC8408

A common 8-bit TTL/CMOS compatible input port is used to
load data into any of the four DAC data-latches. Control lines
DS1, DS2, and A/B determine which DAC will accept data.
Data loading is similar to that of a RAMs write cycle. Data can
be read back onto the same data bus with control line R/
DAC8408 is bus compatible with most 8-bit microprocessors,
including the 6800, 8080, 8085, and Z80. The DAC8408 oper­ates on a single +5 volt supply and dissipates less than 20 mW.
The DAC8408 is manufactured using PMI’s highly stable,
thin-film resistors on an advanced oxide-isolated, silicon-gate,
CMOS process. PMI’s improved latch-up resistant design elimi­nates the need for external protective Schottky diodes.

ORDERING INFORMATION

Temperature Package

Model INL DNL Range Description

DAC8408GP ±1/4 LSB ±1/2 LSB 0°C to +70°C 28-Pin Plastic DIP
DAC8408ET ±1/4 LSB ±1/2 LSB –40°C to +85°C 28-Pin Cerdip
DAC8408AT2±1/4 LSB ±1/2 LSB –55°C to +125°C 28-Pin Cerdip
DAC8408FT ±1/2 LSB ±1 LSB –40°C to +85°C 28-Pin Cerdip
DAC8408BT2±1/2 LSB ±1 LSB –55°C to +125°C 28-Pin Cerdip
DAC8408FPC3±1/2 LSB ±1 LSB –40°C to +85°C 28-Contact PLCC
DAC8408FS ±1/2 LSB ±1 LSB –40°C to +85°C 28-Pin SOL
DAC8408FP ±1/2 LSB ± 1 LSB –40°C to +85°C 28-Pin Plastic DIP

NOTES

1

Burn-in is available on commercial and industrial temperature range parts
in cerdip, plastic DIP, and TO-can packages. For outline information see Pack­age Information section.

2

For devices processed in total compliance to MIL-STD-883, add /883 after
part number. Consult factory for 883 data sheet.

3

For availability and burn-in information on SO and PLCC packages, contact
your local sales office.

1

W. The

FUNCTIONAL BLOCK DIAGRAM

DAC8408

REV. A

Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] Fax: [phone]

DAC8408

ELECTRICAL CHARACTERISTICS

(@ VDD = +5 V; V

= 610 V; V

REF

A, B, C, D = 0 V; TA = –558C to +1258C apply for

OUT

DAC8408AT/BT, TA = –408C to +858C apply for DAC8408ET/FT/FP/FPC/FS; TA = 08C to +708C apply for DAC8408GP, unless otherwise noted.
Specifications apply for DAC A, B, C, & D.)

DAC8408

Parameter Symbol Conditions Min Typ Max Units

STATIC ACCURACY

Resolution N 8 Bits
Nonlinearity

1, 2

INL DAC8408A/E/G ±1/4 LSB

DAC8408B/F/H ±1/2 LSB

Differential DNL DAC8408A/E/G ±1/2 LSB

Nonlinearity DAC8408B/F/H ±1 LSB
Gain Error G
Gain Tempco

3, 6

TC

FSE

GFS

(Using Internal RFB) ±1 LSB

±2 ±40 ppm/°C

Power Supply Rejection

(∆V

= ±10%) PSR 0.001 %FSR/%

DD

I

OUT 1A, B, C, D

Leakage Current

13

I

LKG

TA =+25°C ±30 nA
TA = Full Temperature Range ±100 nA

REFERENCE INPUT

Input Voltage Range ±20 V
Input Resistance Match
Input Resistance R

4

IN

R

A, B, C, D

±1%

6 1014kΩ

DIGITAL INPUTS

Digital Input Low V
Digital Input High V
Input Current

Input Capacitance

5

6

IL
IH

2.4 V

TA = +25°C ±0.01 ±1.0 µA

I

IN

C

IN

TA = Full Temperature Range ±10.0 µA

0.8 V

8pF

DATA BUS OUTPUTS

Digital Output Low V
Digital Output High V
Output Leakage Current I

OL
OH

LKG

16 mA Sink 0.4 V
400 µA Source 4 V
TA = +25°C ±0.005 ± 1.0 µA
TA = Full Temperature Range ±0.075 ± 10.0 µA

DAC OUTPUTS

Propagation Delay
Settling Time
Output Capacitance C

6

11,12

7

t
t

PD
S

OUT

150 180 ns

190 250 ns
DAC Latches All “0s” 30 pF
DAC Latches All “1s” 50 pF

AC Feedthrough FT (20 V

SWITCHING CHARACTERISTICS

Write to Data Strobe Time t
Data Valid to Strobe Set-Up Time t
Data Valid to Strobe Hold Time t

DAC Select to Strobe Set-Up Time t
DAC Select to Strobe Hold Time t
Write Select to Strobe Set-Up Time t
Write Select to Strobe Hold Time t
Read to Data Strobe Width t

Data Strobe to Output Valid Time t
Output Data to Deselect Time t
Read Select to Strobe Set-Up Time t

Read Select to Strobe Hold Time t

Specifications subject to change without notice.

6, 10

or TA = +25°C90 ns

DS1

t

DS2
DSU

DH
AS
AH
WSU
WH
RDS

CO

OTD

RSU
RH

TA = Full Temperature Range 145 ns
TA = +25°C 150 ns
T

TA = +25°C 220 ns
T
TA = +25°C 320 ns
T
TA = +25°C 200 ns
T

@ F = 100 kHz) 54 dB

p-p

= Full Temperature Range 175 ns

A

10 ns
0ns
0ns
0ns
0ns

= Full Temperature Range 350 ns

A

= Full Temperature Range 430 ns

A

= Full Temperature Range 270 ns

A

0ns
0ns

–2–

REV. A

DAC8408

ELECTRICAL CHARACTERISTICS

@ VDD = +5 V; V

= 610 V; V

REF

A, B, C, D = 0 V; TA = –558C to +1258C apply for

OUT

DAC8408AT/BT, TA = –408C to +858C apply for DAC8408ET/FT/FP/FPC/FS; TA = 08C to +708C apply for DAC8408GP, unless otherwise noted.
Specifications apply for DAC A, B, C, & D.

Continued

DAC8408

Parameter Symbol Conditions Min Typ Max Units

POWER SUPPLY

Voltage Range V
Supply Current
Supply Current

8
9

DD

I

DD

I

DD

TA = +25°C 1.0 mA

4.5 5.5 V
50 µA

TA = Full Temperature Range 1.5 mA

NOTES

1

This is an end-point linearity specification.

2

Guaranteed to be monotonic over the full operating temperature range.

3

ppm/°C of FSR (FSR = Full Scale Range = V

4

Input Resistance Temperature Coefficient = +300ppm/ °C.

5

Logic Inputs are MOS gates. Typical input current at +25 °C Is less than 10 nA.

6

Guaranteed by design.

-1 LSB.)

REF

7

From Digital Input to 90% of final analog output current.

8

All Digital Inputs “0” or VDD.

9

All Digital Inputs VIH or VIL.

10

See Timing Diagram.

11

Digital Inputs = 0 V to VDD or VDD to 0 V.

12

Extrapolated: tS (1/2 LSB) = tPD + 6.2τ where τ = the measured first time con-

stant of the final RC decay.

13

All Digital Inputs = 0 V; V

Specifications subject to change without notice.

= +10 V.

REF

PIN CONNECTIONS

DAC8408

TOP VIEW

(Not to Scale)

ABSOLUTE MAXIMUM RATINGS

(TA = +25°C, unless otherwise noted.)

VDD to I
V

to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0 V, +7 V

DD

I

OUT 1A

I

OUT 1C

R

A, RFBB, RFBC, RFBD to I

FB

I

, I

OUT 2A

I

OUT 2C

DB0 through DB7 to DGND . . . . . . . . –0.3 V to V

OUT 2A

, I

OUT 1B

, I

OUT 2B

, I

, I

OUT 2B

, I

OUT 2C

, I

OUT 2D

. . . . . . . . . .0 V, +7 V

,

to DGND . . . . . . . . . –0.3 V to VDD +0.3 V

OUT 1D

. . . . . . . . . . . . . . . . . ±25 V

OUT

,

to DGND . . . . . . . . . –0.3 V to VDD + 0.3 V

OUT 2D

+ 0.3 V

DD

Control Logic

Input Voltage to DGND . . . . . . . . . . –0.3 V + V

V

REF

I

OUT 2A

A, V

REF

, I

B, V

OUT 2B

REF

, I

C, V

OUT 2C

REF

, I

D to

OUT 2D

. . . . . . . . . . . . . . . . ±25 V

+ 0.3 V

DD

Operating Temperature Range

Commercial Grade (GP) . . . . . . . . . . . . . . . . 0°C to +70°C

Industrial Grade (ET, FT, FP, FPC, FS) . –40°C to +85°C

Military Grade (AT, BT) . . . . . . . . . . . . . .–55°C to +125°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C

Storage Temperature . . . . . . . . . . . . . . . . . . .–65°C to +150°C

Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C

Package Type uJA* u

JC

Units

28-Pin Hermetic DIP (T) 55 10 °C/W
28-Pin Plastic DIP (P) 53 27 °C/W
28-Pin SOL (S) 68 23 °C/W
28-Contact PLCC (PC) 66 29 °C/W

*θJA is specified for worst case mounting conditions, i.e., θJA is specified for

device in socket for cerdip and P-DIP packages; θJA is specified for device
soldered to printed circuit board for SOL and PLCC packages.

CAUTION

1. Do not apply voltages higher than V
–0.3 V potential on any terminal except V

+0.3 V or less than

DD

and RFB.

REF

2. The digital control inputs are diode-protected; however,
permanent damage may occur on unconnected inputs from
high energy electrostatic fields. Keep in conductive foam at
all times until ready to use.

3. Use proper antistatic handling procedures.

4. Absolute Maximum Ratings apply to both packaged devices
and DICE. Stresses above those listed under Absolute Maxi­mum Ratings may cause permanent damage to the device.

REV. A

–3–

DAC8408

Burn-in Circuit

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8408 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

DICE CHARACTERISTICS

DIE SIZE 0.130 × 0.124 inch, 16,120 sq. mils

(3.30

×

3.15 mm, 10.4 sq. mm)

1. V

2. V

DD

A 16. DB7 (MSB)

REF

15. DB6

3. RFBA 17. A/B

4. I

OUT 1A

5. I

OUT 2A/IOUT 2B

6. I

OUT 1B

B 21. V

7. R

FB

8. V

B 22. RFBD

REF

9. DB0 (LSB) 23. I

10. DB1 24. I

11. DB2 25. I

18. R/W

19. DS1

20. DS2

REF

OUT 1D
OUT 2C/IOUT 2D
OUT 1C

D

12. DB3 26. RFBC

13. DB4 27. V

REF

C

14. DB5 28. DGND

–4–

REV. A

DAC8408

WAFER TEST LIMITS

at VDD = +5 V; V

= 610 V; V

REF

A, B, C, D = 0 V; TA = +258C, unless otherwise noted. Specifications apply for

OUT

DAC A, B, C, & D.

DAC8408G

Parameter Symbol Conditions Limits Units

STATIC ACCURACY

Resolution N 8 Bits min
Nonlinearity

1

INL ±1/2 LSB max
Differential Nonlinearity DNL ±1 LSB max
Gain Error G
Power Supply Rejection PSR Using Internal R

(∆V

= ±10%)

DD

I

OUT 1A, B, C, D

2

Leakage Current I

V

FSE

LKG

REF

= +10 V

Using Internal R

FB
FB

±1 LSB max

0.001 %FSR/% max

All Digital Inputs = 0 V ±30 nA max

REFERENCE INPUT

Reference Input R

Resistance

3

Input Resistance Match R

IN

IN

6/14 kΩ min/max
±1 % max

DIGITAL INPUTS

Digital Input Low V
Digital Input High V
Input Current

4

IL
IH

I

IN

0.8 V max

2.4 V min
±1.0 µA max

DATA BUS OUTPUTS

Digital Output Low V
Digital Output High V
Output Leakage Current I

POWER SUPPLY

Supply Current
Supply Current

NOTES

1

This is an endpoint linearity specification.

2

FSR is Full Scale Range = V

3

Input Resistance Temperature Coefficient approximately equals +300 ppm/ °C.

4

Logic inputs are MOS gates.Typical input current at +25°C is less than 10 nA.

5

All Digital Inputs are either “0” or VDD.

6

All Digital Inputs are either VIH or VIL.

5
6

–1 LSB.

REF

I

I

OL
OH

LKG

DD
DD

1.6 mA Sink 0.4 V max
400 µA Source 4 V min

±1.0 µA max

50 µA max

1.0 mA max

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.

REV. A

–5–