ANALOG DEVICES AD5253, AD5254 Service Manual

Quad 64-/256-Position I2C Nonvolatile
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FEATURES

AD5253: quad 64-position resolution AD5254: quad 256-position resolution 1 kΩ, 10 kΩ, 50 kΩ, 100 kΩ Nonvolatile memory Power-on refreshed to EEMEM settings in 300 μs typ EEMEM rewrite time = 540 μs typ Resistance tolerance stored in nonvolatile memory 12 extra bytes in EEMEM for user-defined information
2
C-compatible serial interface
I Direct read/write access of RDAC Predefined linear increment/decrement commands Predefined ±6 dB step change commands Synchronous or asynchronous quad-channel update Wiper setting readback 4 MHz bandwidth—1 kΩ version Single supply 2.7 V to 5.5 V Dual supply ±2.25 V to ±2.75 V 2 slave address-decoding bits allow operation of 4 devices 100-year typical data retention, T Operating temperature: –40°C to +85°C

APPLICATIONS

Mechanical potentiometer replacement Low resolution DAC replacement RGB LED backlight control White LED brightness adjustment RF base station power amp bias control Programmable gain and offset control Programmable attenuators Programmable voltage-to-current conversion Programmable power supply Programmable filters Sensor calibrations

GENERAL DESCRIPTION

The AD5253/AD5254 are quad-channel, I2C®, nonvolatile mem-ory, digitally controlled potentiometers with 64/256 positions, respectively. These devices perform the same electronic adjust-ment functions as mechanical potentiometers, trimmers, and variable resistors.
The parts’ versatile programmability allows multiple modes of operation, including read/write access in the RDAC and EEMEM registers, increment/decrement of resistance, resistance changes in ±6 dB scales, wiper setting readback, and extra EEMEM for storing user-defined information, such as memory data for other components, look-up table, or system identification information.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
1
stores wiper settings w/write protection
2
and EEMEM registers
= 55°C
A
Memory Digital Potentiometers
AD5253/AD5254

FUNCTIONAL BLOCK DIAGRAM

V
DD
V
SS
DGND
WP
SCL SDA
AD0 AD1
SERIAL
INTERFACE
The AD5253/AD5254 allow the host I2C controllers to write any of the 64-/256-step wiper settings in the RDAC registers and store them in the EEMEM. Once the settings are stored, they are restored automatically to the RDAC registers at system power-on; the settings can also be restored dynamically.
The AD5253/AD5254 provide additional increment, decrement, +6 dB step change, and –6 dB step change in synchronous or asynchronous channel update mode. The increment and decrement functions allow stepwise linear adjustments, with a ± 6 dB step change equivalent to doubling or halving the RDAC wiper setting. These functions are useful for steep-slope, nonlinear adjustments, such as white LED brightness and audio volume control.
The AD5253/AD5254 have a patented resistance-tolerance storing function that allows the user to access the EEMEM and obtain the absolute end-to-end resistance values of the RDACs for precision applications.
The AD5253/AD5254 are available in TSSOP-20 packages in 1 kΩ, 10 kΩ, 50 kΩ, and 100 kΩ options. All parts are guaranteed to operate over the –40°C to +85°C extended industrial temperature range.
1
The terms nonvolatile memory and EEMEM are used interchangeably.
2
The terms digital potentiometer and RDAC are used interchangeably.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2003–2009 Analog Devices, Inc. All rights reserved.
RDAC EEMEM
EEMEM
POWER-ON
REFRESH
DATA
I2C
CONTROL
COMMAND
DECODE LOGIC
ADDRESS
DECODE LOGIC
CONTROL LOGIC
AD5253/AD5254
RAB TOL
Figure 1.
RDAC0 REGIS-
TER
RDAC1 REGIS-
TER
RDAC2 REGIS-
TER
RDAC3 REGIS-
TER
RDAC0
RDAC1
RDAC2
RDAC3
A0 W0 B0
A1 W1 B1
A2 W2 B2
A3 W3 B3
03824-0-001
AD5253/AD5254
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TABLE OF CONTENTS

Features .............................................................................................. 1
I2C-Compatible 2-Wire Serial Bus ........................................... 20
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Electrical Characteristics ................................................................. 3
1 kΩ Version .................................................................................. 3
10 kΩ, 50 kΩ, 100 kΩ Versions .................................................. 5
Interface Timing Characteristics ................................................ 7
Absolute Maximum Ratings ............................................................ 8
ESD Caution .................................................................................. 8
Pin Configuration and Function Descriptions ............................. 9
Typical Performance Characteristics ........................................... 10
I2C Interface ..................................................................................... 14
I2C Interface General Description ............................................ 14
I2C Interface Detail Description ............................................... 15
Theory of Operation ...................................................................... 21
Linear Increment/Decrement Commands ............................. 21
±6 dB Adjustments (Doubling/Halving Wiper Setting) ....... 21
Digital Input/Output Configuration........................................ 22
Multiple Devices on One Bus ................................................... 22
Terminal Voltage Operation Range ......................................... 23
Power-Up and Power-Down Sequences .................................. 23
Layout and Power Supply Biasing ............................................ 23
Digital Potentiometer Operation ............................................. 24
Programmable Rheostat Operation ......................................... 24
Programmable Potentiometer Operation ............................... 25
Applications Information .............................................................. 26
RGB LED Backlight Controller for LCD Panels .................... 26
Outline Dimensions ....................................................................... 28
Ordering Guide .......................................................................... 29

REVISION HISTORY

10/09—Rev. A to Rev. B
Change to Figure 27 ....................................................................... 15
9/05—Rev. 0 to Rev. A
Change to Figure 6 ......................................................................... 10
Change to EEMEM Write Protection Section ............................ 18
Changes to Figure 37 ...................................................................... 22
Deleted Table 13 and Table 14 ...................................................... 24
Change to Figure 43 ....................................................................... 25
Changes to Ordering Guide .......................................................... 29
5/03—Revision 0: Initial Version
Rev. B | Page 2 of 32
AD5253/AD5254
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ELECTRICAL CHARACTERISTICS

1 kΩ VERSION

VDD = +3 V ± 10% or +5 V ± 10%, VSS = 0 V or VDD/VSS = ±2.5 V ± 10%, VA = VDD, VB = 0 V, –40°C < TA < +85°C, unless otherwise noted.
Table 1.
Parameter Symbol Conditions Min Typ1 Max Unit
DC CHARACTERISTICS—
RHEOSTAT MODE Resolution N AD5253 6 Bits AD5254 8 Bits Resistor Differential Nonlinearity2 R R R Resistor Nonlinearity2 R-INL RWB, RWA = NC, VDD = 5.5 V, AD5253 –0.5 ±0.2 +0.5 LSB R R R Nominal Resistor Tolerance ΔRAB/RAB T Resistance Temperature Coefficient (ΔRAB/RAB) × 106/ΔT 650 ppm/°C Wiper Resistance RW I I Channel-Resistance Matching ΔR
DC CHARACTERISTICS—
POTENTIOMETER DIVIDER MODE Differential Nonlinearity3 DNL AD5253 –0.5 ±0.1 +0.5 LSB AD5254 –1.00 ±0.25 +1.00 LSB Integral Nonlinearity3 INL AD5253 –0.5 ±0.2 +0.5 LSB AD5254 –2.0 ±0.5 +2.0 LSB Voltage Divider Tempco (ΔVW/VW) × 106/ΔT Code = half scale 25 ppm/°C Full-Scale Error V Code = full scale, VDD = 5.5 V, AD5254 –16 –11 0 LSB Code = full scale, VDD = 2.7 V, AD5253 –6 –4 0 LSB Code = full scale, VDD = 2.7 V, AD5254 –23 –16 0 LSB Zero-Scale Error V Code = zero scale, VDD = 5.5 V, AD5254 0 11 16 LSB Code = zero scale, VDD = 2.7 V, AD5253 0 4 6 LSB Code = zero scale, VDD = 2.7 V, AD5254 0 15 20 LSB
RESISTOR TERMINALS
Voltage Range4 V Capacitance5 A, B CA, CB
Capacitance5 W CW
Common-Mode Leakage Current ICM V
R-DNL RWB, RWA = NC, VDD = 5.5 V, AD5253 –0.5 ±0.2 +0.5 LSB
, RWA = NC, VDD = 5.5 V, AD5254 –1.00 ±0.25 +1.00 LSB
WB
, RWA = NC, VDD = 2.7 V, AD5253 –0.75 ±0.30 +0.75 LSB
WB
, RWA = NC, VDD = 2.7 V, AD5254 –1.5 ±0.3 +1.5 LSB
WB
, RWA = NC, VDD = 5.5 V, AD5254 –2.0 ±0.5 +2.0 LSB
WB
, RWA = NC, VDD = 2.7 V, AD5253 –1.0 +2.5 +4.0 LSB
WB
, RWA = NC, VDD = 2.7 V, AD5254 –2 +9 +14 LSB
WB
= 25°C –30 +30 %
A
= 1 V/R, VDD = 5 V 75 130 Ω
W
= 1 V/R, VDD = 3 V 200 300 Ω
W
/ΔR
AB1
0.15 %
AB2
Code = full scale, VDD = 5.5 V, AD5253 –5 –3 0 LSB
WFSE
Code = zero scale, VDD = 5.5 V, AD5253 0 3 5 LSB
WZSE
, VB, VW V
A
f = 1 kHz, measured to GND,
VDD V
SS
85 pF
code = half scale f = 1 kHz, measured to GND,
95 pF
code = half scale
= VB = VDD/2 0.01 1.00 μA
A
Rev. B | Page 3 of 32
AD5253/AD5254
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Parameter Symbol Conditions Min Typ1 Max Unit
DIGITAL INPUTS AND OUTPUTS
Input Logic High VIH V V Input Logic Low VIL V V Output Logic High (SDA) VOH R Output Logic Low (SDA) VOL R
I
WP Leakage Current
WP
A0 Leakage Current IA0 A0 = GND 3 μA
I
Input Leakage Current
(Other than WP
and A0)
Input Capacitance5 C
V
I
5 pF
I
POWER SUPPLIES
Single-Supply Power Range VDD V Dual-Supply Power Range VDD/VSS ±2.25 ±2.75 V Positive Supply Current IDD V Negative Supply Current ISS
EEMEM Data Storing Mode Current I EEMEM Data Restoring Mode
Current
6
Power Dissipation7 P
V
DD_STORE
I
DD_RESTORE
V
V
DISS
Power Supply Sensitivity PSS ΔVDD = 5 V ± 10% −0.025 +0.010 +0.025 %/% ΔVDD = 3 V ± 10% –0.04 +0.02 +0.04 %/%
DYNAMIC CHARACTERISTICS
5, 8
Bandwidth –3 dB BW RAB = 1 kΩ 4 MHz Total Harmonic Distortion THD VA =1 V rms, VB = 0 V, f = 1 kHz 0.05 % VW Settling Time tS V Resistor Noise Voltage e
N_WB
Digital Crosstalk CT
Analog Coupling CAT
1
Typical values represent average readings at 25°C and VDD = 5 V.
2
Resistor position nonlinearity error (R-INL) is the deviation from an ideal value measured between the maximum and minimum resistance wiper positions. R-DNL is the
relative step change from an ideal value measured between successive tap positions. Parts are guaranteed monotonic, except R-DNL of AD5254 1 kΩ version at V
= VDD/R for both VDD = 3 V and VDD = 5 V.
I
W
3
INL and DNL are measured at VW with the RDAC configured as a potentiometer divider similar to a voltage output digital-to-analog converter. VA = VDD and VB = 0 V.
DNL specification limits of ±1 LSB maximum are guaranteed monotonic operating conditions.
4
Resistor Terminal A, Terminal B, and Terminal W have no limitations on polarity with respect to each other.
5
Guaranteed by design and not subject to production test.
6
Command 0 NOP should be activated after Command 1 to minimize I
7
P
is calculated from IDD × VDD = 5 V.
DISS
8
All dynamic characteristics use VDD = 5 V.
= 5 V, VSS = 0 V 2.4 V
DD
= +2.7 V/0 V or VDD/VSS = ±2.5 V 2.1 V
DD/VSS
= 5 V, VSS = 0 V 0.8 V
DD
= +2.7 V/0 V or VDD/VSS = ±2.5 V 0.6 V
DD/VSS
= 2.2 kΩ to VDD = 5 V, VSS = 0 V 4.9 V
PULL-UP
= 2.2 kΩ to VDD = 5 V, VSS = 0 V 0.4 V
PULL-UP
= VDD
WP
= 0 V or VDD ±1 μA
IN
= 0 V 2.7 5.5 V
SS
= VDD or VIL = GND 5 15 μA
IH
= VDD or VIL = GND, VDD = 2.5 V,
V
IH
= –2.5 V
V
SS
= VDD or VIL = GND 35 mA
IH
= VDD or VIL = GND 2.5 mA
IH
= VDD = 5 V or VIL = GND 0.075 mW
IH
= VDD, VB = 0 V 0.2 μs
A
= 500 Ω, f = 1 kHz
R
WB
5 μA
–5 –15 μA
3 nV/√Hz
(thermal noise only)
= VDD, VB = 0 V, measure VW with
V
A
–80 dB adjacent RDAC making full-scale change
Signal input at A0 and measure the
–72 dB output at W1, f = 1 kHz
DD
current consumption.
DD_RESTORE
= 2.7 V,
Rev. B | Page 4 of 32
AD5253/AD5254
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10 kΩ, 50 kΩ, 100 kΩ VERSIONS

VDD = +3 V ± 10% or +5 V ± 10%, VSS = 0 V or VDD/VSS = ±2.5 V ± 10%, VA = VDD, VB = 0 V, –40°C < TA < +85°C, unless otherwise noted.
Table 2.
Parameter Symbol Conditions Min Typ1 Max Unit
DC CHARACTERISTICS—
RHEOSTAT MODE Resolution N AD5253/AD5254 6/8 Bits Resistor Differential Nonlinearity2 R-DNL RWB, RWA = NC, AD5253 −0.75 ±0.10 +0.75 LSB R Resistor Nonlinearity2 R-INL RWB, RWA = NC, AD5253 −0.75 ±0.25 +0.75 LSB R Nominal Resistor Tolerance ΔRAB/RAB T Resistance Temperature
Coefficient Wiper Resistance RW I I Channel-Resistance Matching ΔR R
DC CHARACTERISTICS—
POTENTIOMETER DIVIDER MODE Differential Nonlinearity3 DNL AD5253 −0.5 ±0.1 +0.5 LSB AD5254 −1.0 ±0.3 +1.0 LSB Integral Nonlinearity3 INL AD5253 −0.50 ±0.15 +0.50 LSB AD5254 −1.5 ±0.5 +1.5 LSB Voltage Divider
Temperature Coefficient Full-Scale Error V Code = full scale, AD5254 −3 −1 0 LSB Zero-Scale Error V Code = zero scale, AD5254 0 1.2 3.0 LSB
RESISTOR TERMINALS
Voltage Range4 V Capacitance5 A, B CA, CB
Capacitance5 W CW
Common-Mode Leakage Current ICM V
DIGITAL INPUTS AND OUTPUTS
Input Logic High VIH V V Input Logic Low VIL V V Output Logic High (SDA) VOH R Output Logic Low (SDA) VOL R WP Leakage Current A0 Leakage Current IA0 A0 = GND 3 μA Input Leakage Current
(Other than WP
and A0)
Input Capacitance5 C
, RWA = NC, AD5254 −1.00 ±0.25 +1.00 LSB
WB
, RWA = NC, AD5254 −2.5 ±1.0 +2.5 LSB
WB
= 25°C −20 +20 %
A
(ΔR
) × 106/ΔT 650 ppm/°C
AB/RAB
= 1 V/R, VDD = 5 V 75 130 Ω
W
= 1 V/R, VDD = 3 V 200 300 Ω
W
/ΔR
AB1
R
AB2
= 10 kΩ, 50 kΩ 0.15 %
AB
= 100 kΩ 0.05 %
AB
(ΔV
) × 106/ΔT Code = half scale 15 ppm/°C
W/VW
Code = full scale, AD5253 −1.0 −0.3 0 LSB
WFSE
Code = zero scale, AD5253 0 0.3 1.0 LSB
WZSE
, VB, VW V
A
f = 1 kHz, measured to GND,
VDD V
SS
85 pF
code = half scale f = 1 kHz, measured to GND,
95 pF
code = half scale
= VB = VDD/2 0.01 1 μA
A
= 5 V, VSS = 0 V 2.4 V
DD
= +2.7 V/0 V or VDD/VSS = ±2.5 V 2.1 V
DD/VSS
= 5 V, VSS = 0 V 0.8 V
DD
= +2.7 V/0 V or VDD/VSS = ±2.5 V 0.6 V
DD/VSS
= 2.2 kΩ to VDD = 5 V, VSS = 0 V 4.9 V
PULL-UP
= 2.2 kΩ to VDD = 5 V, VSS = 0 V 0.4 V
PULL-UP
I
WP
V
I
I
5 pF
I
= VDD
WP
= 0 V or VDD ±1 μA
IN
5 μA
Rev. B | Page 5 of 32
AD5253/AD5254
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Parameter Symbol Conditions Min Typ1 Max Unit
POWER SUPPLIES
Single-Supply Power Range VDD V Dual-Supply Power Range VDD/VSS ±2.25 ±2.75 V Positive Supply Current IDD V Negative Supply Current ISS
I
EEMEM Data Storing Mode
V
DD_STORE
Current
EEMEM Data Restoring Mode
Current
6
I
DD_RESTORE
Power Dissipation7 P
V
V
DISS
Power Supply Sensitivity PSS ΔVDD = 5 V ± 10% −0.005 +0.002 +0.005 %/% ΔVDD = 3 V ± 10% −0.010 +0.002 +0.010 %/%
DYNAMIC CHARACTERISTICS
5, 8
–3 dB Bandwidth BW RAB = 10 kΩ/50 kΩ/100 kΩ 400/80/40 kHz Total Harmonic Distortion THDW V VW Settling Time tS
Resistor Noise Voltage e
N_WB
Digital Crosstalk CT
Analog Coupling CAT
1
Typical values represent average readings at 25°C and VDD = 5 V.
2
Resistor position nonlinearity error (R-INL) is the deviation from an ideal value measured between the maximum and minimum resistance wiper positions. R-DNL is the
relative step change from an ideal value measured between successive tap positions. Parts are guaranteed monotonic, except R-DNL of AD5254 1 kΩ version at VDD = 2.7 V, IW = VDD/R for both VDD = 3 V and VDD = 5 V.
3
INL and DNL are measured at VW with the RDAC configured as a potentiometer divider, similar to a voltage output DAC. VA = VDD and VB = 0 V. DNL specification limits
of ±1 LSB maximum are guaranteed monotonic operating conditions.
4
Resistor Terminal A, Terminal B, and Terminal W have no limitations on polarity with respect to each other.
5
Guaranteed by design and not subject to production test.
6
Command 0 NOP should be activated after Command 1 to minimize I
7
P
is calculated from IDD × VDD = 5 V.
DISS
8
All dynamic characteristics use VDD = 5 V.
= 0 V 2.7 5.5 V
SS
= VDD or VIL = GND 5 15 μA
IH
= VDD or VIL = GND, VDD = 2.5 V,
V
IH
= −2.5 V
V
SS
= VDD or VIL = GND, TA = 0°C to 85°C 35 mA
IH
= VDD or VIL = GND, TA = 0°C to 85°C 2.5 mA
IH
= VDD = 5 V or VIL = GND 0.075 mW
IH
= 1 V rms, VB = 0 V, f = 1 kHz 0.05 %
A
= VDD, VB = 0 V,
V
A
= 10 kΩ/50 kΩ/100 kΩ
R
AB
= 10 kΩ/50 kΩ/100 kΩ, code =
R
AB
−5 −15 μA
1.5/7/14 μs
9/20/29 nV/√Hz
midscale, f = 1 kHz (thermal noise only)
= VDD, VB = 0 V, measure VW with
V
A
−80 dB
adjacent RDAC making full-scale change Signal input at A0 and measure output
−72 dB
at W1, f = 1 kHz
current consumption.
DD_RESTORE
Rev. B | Page 6 of 32
AD5253/AD5254
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INTERFACE TIMING CHARACTERISTICS

All input control voltages are specified with tR = tF = 2.5 ns (10% to 90% of 3 V) and timed from a voltage level of 1.5 V. Switching characteristics are measured using both V
Table 3.
Parameter1 Symbol Conditions Min Typ2 Max Unit
INTERFACE TIMING
SCL Clock Frequency f t
Bus-Free Time Between Stop and Start t1 1.3 μs
BUF
t
Hold Time (Repeated Start) t2
HD;STA
t
Low Period of SCL Clock t3 1.3 μs
LOW
t
High Period of SCL Clock t4 0.6 μs
HIGH
t
Set-up Time for Start Condition t5 0.6 μs
SU;STA
t
Data Hold Time t6 0 0.9 μs
HD;DAT
t
Data Set-up Time t7 100 ns
SU;DAT
tF Fall Time of Both SDA and SCL Signals t8 300 ns tR Rise Time of Both SDA and SCL Signals t9 300 ns t
Set-up Time for Stop Condition t10 0.6 μs
SU;STO
EEMEM Data Storing Time t EEMEM Data Restoring Time at Power-On3 t
EEMEM Data Restoring Time upon Restore
Command or Reset Operation
3
EEMEM Data Rewritable Time4 t
FLASH/EE MEMORY RELIABILITY
Endurance5 100 K cycles Data Retention
1
See Figure 23 for location of measured values.
2
Typical values represent average readings at 25°C and VDD = 5 V.
3
During power-up, all outputs are preset to midscale before restoring the EEMEM contents. RDAC0 has the shortest EEMEM restore time, whereas RDAC3 has the longest.
4
Delay time after power-on or reset before new EEMEM data to be written.
5
Endurance is qualified to 100,000 cycles per JEDEC Std. 22 Method A117 and measured at –40°C, +25°C, and +85°C; typical endurance at +25°C is 700,000 cycles.
6
Retention lifetime equivalent at junction temperature TJ = 55°C per JEDEC Std. 22, Method A117. Retention lifetime based on an activation energy of 0.6 eV derates
with junction temperature.
7
When the part is not in operation, the SDA and SCL pins should be pulled high. When these pins are pulled low, the I2C interface at these pins conducts a current of
about 0.8 mA at V
6, 7
100 Years
= 5.5 V and 0.2 mA at VDD = 2.7 V.
DD
= 3 V and 5 V.
DD
400 kHz
SCL
EEMEM_STORE
EEMEM_RESTORE1
t
EEMEM_RESTORE2
EEMEM_REWRITE
After this period, the first clock pulse is
0.6 μs
generated.
26 ms
rise time dependent. Measure without
V
DD
decoupling capacitors at V
DD
and VSS.
300 μs
VDD = 5 V. 300 μs
540 μs
Rev. B | Page 7 of 32
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ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted
Table 4.
Parameter Rating
VDD to GND −0.3 V, +7 V VSS to GND +0.3 V, −7 V VDD to VSS 7 V VA, VB, VW to GND VSS, VDD Maximum Current
IWB, IWA Pulsed ±20 mA IWB Continuous (RWB ≤ 1 kΩ, A Open)1 ±5 mA IWA Continuous (RWA ≤ 1 kΩ, B Open)1 ±5 mA IAB Continuous
(R
= 1 kΩ/10 kΩ/50 kΩ/100 kΩ)1
AB
Digital Inputs and Output Voltage to GND 0 V, 7 V Operating Temperature Range −40°C to +85°C Maximum Junction Temperature (T Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C TSSOP-20 Thermal Resistance2 θJA 143°C/W
1
Maximum terminal current is bound by the maximum applied voltage across
any two of the A, B, and W terminals at a given resistance, the maximum current handling of the switches, and the maximum power dissipation of the package. VDD = 5 V.
2
Package power dissipation = (T
JMAX
JMAX
− TA)/θJA.
±5 mA/±500 μA/ ±100 μA/±50 μA
) 150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. B | Page 8 of 32
AD5253/AD5254
A
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

W0
B0 A0
AD0
WP W1
B1 A1
SD
V
SS
1 2
AD5253/
3
AD5254
4
TOP VIEW
(Not to Scale)
5 6 7 8 9
10
20 19 18 17 16 15 14 13 12 11
V
DD
W3 B3 A3 AD1 DGND SCL W2 B2 A2
03824-0-002
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 W0 Wiper Terminal of RDAC0. VSS ≤ VW0 ≤ VDD. 2 B0 B Terminal of RDAC0. VSS ≤ VB0 ≤ VDD. 3 A0 A Terminal of RDAC0. VSS ≤ VA0 ≤ VDD. 4 AD0 I2C Device Address 0. AD0 and AD1 allow four AD5253/AD5254 devices to be addressed. 5
WP
Write Protect, Active Low. V
≤ VDD + 0.3 V.
WP
6 W1 Wiper Terminal of RDAC1. VSS ≤ VW1 ≤ VDD. 7 B1 B Terminal of RDAC1. VSS ≤ VB1 ≤ VDD. 8 A1 A Terminal of RDAC1. VSS ≤ VA1 ≤ VDD. 9 SDA
Serial Data Input/Output Pin. Shifts in one bit at a time upon positive clock edges. MSB loaded first. Open-drain MOSFET requires pull-up resistor.
10 VSS
Negative Supply. Connect to 0 V for single supply or –2.7 V for dual supply, where V rather than grounded in dual supply, V
must be able to sink 35 mA for 26 ms when storing data to EEMEM.
SS
– VSS ≤ +5.5 V. If VSS is used
DD
11 A2 A Terminal of RDAC2. VSS ≤ VA2 ≤ VDD. 12 B2 B Terminal of RDAC2. VSS ≤ VB2 ≤ VDD. 13 W2 Wiper Terminal of RDAC2. VSS ≤ VW2 ≤ VDD. 14 SCL
Serial Input Register Clock Pin. Shifts in one bit at a time upon positive clock edges. V
SCL
resistor is recommended for SCL to ensure minimum power. 15 DGND Digital Ground. Connect to system analog ground at a single point. 16 AD1 I2C Device Address 1. AD0 and AD1 allow four AD5253/AD5254 devices to be addressed. 17 A3 A Terminal of RDAC3. VSS ≤ VA3 ≤ VDD. 18 B3 B Terminal of RDAC3. VSS ≤ VB3 ≤ VDD. 19 W3 Wiper Terminal of RDAC3. VSS ≤ VW3 ≤ VDD. 20 VDD
Positive Power Supply Pin. Connect +2.7 V to +5 V for single supply or ±2.7 V for dual supply, where V
must be able to source 35 mA for 26 ms when storing data to EEMEM.
V
DD
≤ (VDD + 0.3 V). Pull-up
– VSS ≤ +5.5 V.
DD
Rev. B | Page 9 of 32
AD5253/AD5254
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TYPICAL PERFORMANCE CHARACTERISTICS

1.0
0.8
0.6
0.4
0.2
0
–0.2
R-INL (LSB)
–0.4
–0.6
–0.8
–1.0
0 32 64 96 128 160 192 224 256
TA= –40°C, +25°C, +85°C, +125°C
CODE (Decimal)
Figure 3. R-INL vs. Code Figure 6. DNL vs. Code
03824-0-015
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL (LSB)
–0.4
–0.6
–0.8
–1.0
0 32 64 96 128 160 192 224 256
T
= –40°C, +25°C, +85°C, +125°C
A
CODE (Decimal)
03824-0-018
1.0
0.8
0.6
0.4
0.2
0
–0.2
R-DNL (LSB)
–0.4
–0.6
–0.8
–1.0
0 32 64 96 128 160 192 224 256
TA = –40°C, +25°C, +85°C, +125°C
CODE (Decimal)
Figure 4. R-DNL vs. Code Figure 7. Supply Current vs. Temperature
1.0
0.8
0.6
0.4
0.2
0
–0.2
INL (LSB)
–0.4
–0.6
–0.8
–1.0
0 32 64 96 128 160 192 224 256
T
= –40°C, +25°C, +85°C, +125°C
A
CODE (Decimal)
Figure 5. INL vs. Code Figure 8. Supply Current vs. Digital Input Voltage, TA = 25°C
03824-0-016
03824-0-017
10
8
6
4
2
0
(μA)
DD
I
–2
–4
–6
–8
–10
–40 –20 0 20 40 60 80 100 120
10
1
0.1
(mA)
DD
I
0.01
0.001
0.0001 0123456
IDD @ VDD= +5.5V
IDD @ VDD= +2.7V
ISS @ VDD= +2.7V, VSS= –2.7V
TEMPERATURE (°C)
VDD= 5.5V
VDD= 2.7V
DIGITAL INPUT VOLTAGE (V)
03824-0-019
03824-0-020
Rev. B | Page 10 of 32
AD5253/AD5254
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240 220 200 180 160 140
(Ω)
120
WB
R
100
80 60 40 20
0
10 23456
VDD= 2.7V
T
= 25°C
A
V
BIAS
(V)
Figure 9. Wiper Resistance vs. V
VDD= 5.5V
T
= 25°C
A
DATA = 0x00
03824-0-021
BIAS
30
VDD= 5V T
= –40°C/+85°C
25
20
15
10
5
POTENTIOMETER MODE TEMPCO (ppm/°C)
0
0 32 64 96 128 160 192 224 256
CODE (Decimal)
A
V
= V
A
VB= 0V
DD
Figure 12. Potentiometer Mode Tempco (∆VWB/VWB)/∆T × 106 vs. Code
03824-0-024
6
4
2
(%)
WB
0
ΔR
–2
–4
–6
–40 –20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Figure 10. Change of RWB vs. Temperature
90
80
70
60
50
40
30
20
RHEOSTAT MODE TEMPCO (ppm/°C)
10
0
0 32 64 96 128 160 192 224 256
CODE (Decimal)
VDD= 5V T
= –40°C/+85°C
A
V
= V
A
DD
VB= 0V
Figure 11. Rheostat Mode Tempco (∆RWB/RWB)/∆T × 106 vs. Code
03824-0-022
03824-0-023
0
–6
–12
–18
–24
–30
0x08
GAIN (dB)
–36
–42
–48
–54
–60
0x04
0x02
1k 10k10 100 100k 1M 10M
FREQUENCY (Hz)
0x01
0x40 0x20
0x10
0x00
Figure 13. Gain vs. Frequency vs. Code, RAB = 1 kΩ, TA = 25°C
0
–6
–12
–18
–24
–30
GAIN (dB)
–36
–42
–48
–54
–60
0xFF 0x80
0x40 0x20 0x10
0x08 0x04
0x01 0x00
0x02
1k 10k10 100 100k 1M 10M
FREQUENCY (Hz)
Figure 14. Gain vs. Frequency vs. Code, RAB = 10 kΩ, TA = 25°C
0xFF
0x80
03824-0-025
03824-0-026
Rev. B | Page 11 of 32
AD5253/AD5254
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0
–6
–12
–18
–24
–30
GAIN (dB)
–36
–42
–48
–54
–60
0x80
0x40 0x20 0x10
0x08
0x04 0x02 0x01
1k 10k10 100 100k 1M 10M
FREQUENCY (Hz)
0xFF
Figure 15. Gain vs. Frequency vs. Code, RAB = 50 kΩ, TA = 25°C
0x00
03824-0-027
1.2
1.0
0.8
0.6
(mA)
DD
I
0.4
0.2
0
1 10010 1k 10k 100k 1M 10M
CLOCK FREQUENCY (Hz)
TA= 25°C
VDD= 5.5V
VDD= 2.7V
Figure 18. Supply Current vs. Digital Input Clock Frequency
03824-0-030
0
–6
–12
–18
–24
–30
GAIN (dB)
–36
–42
–48
–54
–60
0x80
0x40
0x20
0x10
0x08
0x04 0x02 0x01
1k 10k10 100 100k 1M 10M
FREQUENCY (Hz)
0xFF
Figure 16. Gain vs. Frequency vs. Code, RAB = 100 kΩ, TA = 25°C
100
80
60
40
20
)
Ω
(
0
AB
R
–20
Δ
–40
–60
–80
–100
0 32 64 96 128 160 192 224 256
100k
Ω
1k
Ω
CODE (Decimal)
10k
Ω
50k
VDD = 5.5V
Ω
Figure 17. ΔRAB vs. Code, TA = 25°C
0x00
03824-0-028
03824-0-029
CLK
V
DD
V
W
DIGITAL FEEDTHROUGH
MIDSCALE TRANSITION
7FH 80H
400ns/DIV
Figure 19. Clock Feedthrough and Midscale Transition Glitch
V
DD
(NO DE­COUPLING CAPS)
V
WB0
(0xFF STORED IN EEMEM)
V
WB3
(0xFF STORED IN EEMEM)
MIDSCALE PRESET
MIDSCALE PRESET
Figure 20. t
RESTORE RDAC0 SETTING TO 0xFF
EEMEM_RESTORE
RESTORE RDAC3 SETTING TO 0xFF
VDD = VA0 = VA3 = 3.3V GND = VB0 = VB3
of RDAC0 and RDAC3
= 5V
03824-0-031
03824-0-046
Rev. B | Page 12 of 32
AD5253/AD5254
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6
6
5
(mA)
4
WB_MAX
3
RAB= 10kΩ
RAB= 100kΩ
0 8 16 24 32 40 48 56 64
THEORETICAL I
2
1
0
RAB= 1kΩ
RAB= 50kΩ
CODE (Decimal)
Figure 21. AD5253 I
vs. Code Figure 22. AD5254 I
WB_MAX
VA= VB= OPEN T
=25°C
A
03824-0-033
RAB= 50kΩ
RAB= 1kΩ
CODE (Decimal)
WB_MAX
VA= VB= OPEN T
=25°C
A
vs. Code
5
(mA)
4
WB_MAX
3
2
THEORETICAL I
1
0
0 32 64 96 128 160 192 224 256
RAB= 10kΩ
RAB= 100kΩ
03824-0-034
Rev. B | Page 13 of 32
AD5253/AD5254
www.BDTIC.com/ADI

I2C INTERFACE

t
2
SCL
t
8
t
t
6
9
t
2
3
t
8
SDA
t
t
1
PS

I2C INTERFACE GENERAL DESCRIPTION

From Master to Slave
From Slave to Master
S = start condition P = stop condition A = acknowledge (SDA low)
= not acknowledge (SDA high)
A R/
= read enable at high; write enable at low
W
SLAVE ADDRESS
(7-BIT)
R/W A/AS
t
9
Figure 23. I
t
4
2
C Interface Timing Diagram
A
INSTRUCTIONS
(8-BIT)
t
7
t
5
S
A
DATA
(8-BIT)
t
10
03824-0-003
P
P
0 WRITE
Figure 24. I
2
C—Master Writing Data to Slave
DATA TRANSFERRED
(N BYTES + ACKNOWLEDGE)
03824-0-004
SLAVE ADDRESS
(7-BIT)
R/W AS
A A
1 READ
Figure 25. I
2
DATA
(8-BIT)
C—Master Reading Data from Slave
DATA TRANSFERRED
(N BYTES + ACKNOWLEDGE)
DATA
(8-BIT)
P
03824-0-005
SLAVE ADDRESS
(7-BIT)
R/W R/WS
A
READ OR WRITE (N BYTES +
DATA
ACKNOWLEDGE)
Figure 26. I
A/A
S
SLAVE ADDRESS
REPEATED START READ
DIRECTION OF TRANSFER MAY
2
C—Combined Write/Read
A
OR WRITE
CHANGE AT THIS POINT
DATA
(N BYTES +
ACKNOWLEDGE)
A/A
P
03824-0-006
Rev. B | Page 14 of 32
AD5253/AD5254
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I2C INTERFACE DETAIL DESCRIPTION

From Master to Slave
From Slave to Master
S = start condition P = stop condition A = acknowledge (SDA low)
= not acknowledge (SDA high)
A AD1, AD0 = I
R/
= read enable bit at logic high; write enable bit at logic low
W CMD/ EE/
RDAC
A4, A3, A2, A1, A0 = RDAC/EEMEM register addresses
2
C device address bits, must match with the logic states at Pins AD1, AD0
= command enable bit at logic high; register access bit at logic low
REG
= EEMEM register at logic high; RDAC register at logic low
S 0 1 0 1 1 A
SLAVE ADDRESS INSTRUCTIONS
D 1
A D 0
0 WRITE
0 A A4A3A2A1A0A PDATA0
CMD/
REG
0 REG
EE/
RDAC
AND ADDRESS
(1 BYTE +
ACKNOWLEDGE)
A/
A
03824-0-007
Figure 27. Single Write Mode
S 0 1 0 1 1 A
SLAVE ADDRESS INSTRUCTIONS
A
0 A A4A3A2A1A
D
1
D
0
0 WRITE
CMD/
REG
0 REG
Figure 28. Consecutive Write Mode
0
EE/
RDAC
AND ADDRESS
0
DATA
RDAC_N + 1
DATA
(N BYTE +
ACKNOWLEDGE)
A/
PA ARDAC_N
A
03824-0-008
Table 6. Addresses for Writing Data Byte Contents to RDAC Registers (R/
= 0, CMD/
W
REG
= 0, EE/
RDAC
= 0)
A4 A3 A2 A1 A0 RDAC Data Byte Description
0 0 0 0 0 RDAC0 6-/8-bit wiper setting (2 MSB of AD5253 are X) 0 0 0 0 1 RDAC1 6-/8-bit wiper setting (2 MSB of AD5253 are X) 0 0 0 1 0 RDAC2 0 0 0 1 1 RDAC3 0 0 1 0 0 Reserved : : : : : : : : : : : :
6-/8-bit wiper setting (2 MSB of AD5253 are X) 6-/8-bit wiper setting (2 MSB of AD5253 are X)
0 1 1 1 1 Reserved
Rev. B | Page 15 of 32
AD5253/AD5254
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RDAC/EEMEM Write

Setting the wiper position requires an RDAC write operation. The single write operation is shown in Figure 27, and the consecutive write operation is shown in Figure 28. In the consecutive write operation, if the
is selected and the
RDAC
address starts at 0, the first data byte goes to RDAC0, the second data byte goes to RDAC1, the third data byte goes to RDAC2, and the fourth data byte goes to RDAC3. This operation can be continued for up to eight addresses with four unused addresses; it then loops back to RDAC0. If the address starts at any of the eight valid addresses, N, the data first goes to RDAC_N, RDAC_N + 1, and so on; it loops back to RDAC0 after the eighth address. The RDAC address is shown in . Tabl e 6
While the RDAC wiper setting is controlled by a specific RDAC register, each RDAC register corresponds to a specific EEMEM location, which provides nonvolatile wiper storage functionality. The addresses are shown in Tab le 7 . The single and consecutive write operations also apply to EEMEM write operations.
There are 12 nonvolatile memory locations: EEMEM4 to EEMEM15. Users can store 12 bytes of information, such as memory data for other components, look-up tables, or system identification information.
In a write operation to the EEMEM registers, the device disables
2
the I
C interface during the internal write cycle. Acknowledge polling is required to determine the completion of the write cycle. See the EEMEM Write-Acknowledge Polling section.

RDAC/EEMEM Read

The AD5253/AD5254 provide two different RDAC or EEMEM read operations. For example, Figure 29 shows the method of reading the RDAC0 to RDAC3 contents without specifying the address, assuming Address RDAC0 was already selected in the previous operation. If an RDAC_N address other than RDAC0 was previously selected, readback starts with Address N, followed by N + 1, and so on.
Figure 30 illustrates a random RDAC or EEMEM read operation. This operation allows users to specify which RDAC or EEMEM register is read by issuing a dummy write command to change the RDAC address pointer and then proceeding with the RDAC read operation at the new address location.
Table 7. Addresses for Writing (Storing) RDAC Settings and User-Defined Data to EEMEM Registers (R/
= 0, CMD/
W
A4 A3 A2 A1 A0 Data Byte Description
0 0 0 0 0 Store RDAC0 setting to EEMEM01 0 0 0 0 1 Store RDAC1 setting to EEMEM11 0 0 0 1 0 Store RDAC2 setting to EEMEM21 0 0 0 1 1 Store RDAC3 setting to EEMEM31 0 0 1 0 0 Store user data to EEMEM4 0 0 1 0 1 Store user data to EEMEM5 0 0 1 1 0 Store user data to EEMEM6 0 0 1 1 1 Store user data to EEMEM7 0 1 0 0 0 Store user data to EEMEM8 0 1 0 0 1 Store user data to EEMEM9 0 1 0 1 0 Store user data to EEMEM10 0 1 0 1 1 Store user data to EEMEM11 0 1 1 0 0 Store user data to EEMEM12 0 1 1 0 1 Store user data to EEMEM13 0 1 1 1 0 Store user data to EEMEM14 0 1 1 1 1 Store user data to EEMEM15
REG
= 0, EE/
RDAC
= 1)
Table 8. Addresses for Reading (Restoring) RDAC Settings and User Data from EEMEM (R/
= 1, CMD/
W
A4 A3 A2 A1 A0 Data Byte Description
0 0 0 0 0 Read RDAC0 setting from EEMEM0 0 0 0 0 1 Read RDAC1 setting from EEMEM1 0 0 0 1 0 Read RDAC2 setting from EEMEM2 0 0 0 1 1 Read RDAC3 setting from EEMEM3 0 0 1 0 0 Read User data from EEMEM4 0 0 1 0 1 Read user data from EEMEM5 0 0 1 1 0 Read user data from EEMEM6 0 0 1 1 1 Read user data from EEMEM7 0 1 0 0 0 Read user data from EEMEM8 0 1 0 0 1 Read user data from EEMEM9 0 1 0 1 0 Read user data from EEMEM10 0 1 0 1 1 Read user data from EEMEM11 0 1 1 0 0 Read user data from EEMEM12 0 1 1 0 1 Read user data from EEMEM13 0 1 1 1 0 Read user data from EEMEM14 0 1 1 1 1 Read user data from EEMEM15
1
Users can store any of the 64 RDAC settings for AD5253 or any of the 256
RDAC settings for the AD5254 directly to the EEMEM. This is not limited to current RDAC wiper setting.
REG
= 0, EE/
RDAC
= 1)
Rev. B | Page 16 of 32
AD5253/AD5254
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From Master to Slave
From Slave to Master
S = start condition P = stop condition A = acknowledge (SDA low)
= not acknowledge (SDA high)
A AD1, AD0 = I R/
= read enable bit at logic high; write enable bit at logic low
W CMD/ C3, C2, C1, C0 = command bits A2, A1, A0 = RDAC/EEMEM register addresses
2
C device address bits, must match with the logic states at Pins AD1, AD0
= command enable bit at logic high; register access bit at logic low
REG
S 0 1 0 1 1 A
SLAVE ADDRESS (N BYTES + ACKNOWLEDGE)
A
1 A PARDAC_N OR EEMEM_N
D
D
1
0
1 READ
REGISTER DATA
RDAC_N + 1 OR EEMEM_N + 1
REGISTER DATA
A
03824-0-009
Figure 29. RDAC Current Read (Restricted to Previously Selected Address Stored in the Register)
A0A
0 WRITE
ADDRESS
REPEATED START 1 READ
SLAVE ADDRESSINSTRUCTIONAL AND
Figure 30. RDAC or EEMEM Random Read
A1S
RDAC OR
EEMEM DATA
(N BYTES + ACKNOWLEDGE)
A/A
PS SLAVE ADDRESS
03824-0-010
S 0 1 0 1 1 A
RDAC SLAVE ADDRESS
Figure 31. RDAC Quick Command Write (Dummy Write)
D 1
A D
0
0 WRITE
CMD/
0 A C3C2C1C0A2A1A0A P
REG
1 CMD
03824-0-011
Rev. B | Page 17 of 32
AD5253/AD5254
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RDAC/EEMEM Quick Commands

The AD5253/AD5254 feature 12 quick commands that facilitate easy manipulation of RDAC wiper settings and provide RDAC­to-EEMEM storing and restoring functions. The command format is shown in Figure 31, and the command descriptions are shown in Ta ble 9 .
When using a quick command, issuing a third byte is not needed, but is allowed. The quick commands reset and store RDAC to EEMEM require acknowledge polling to determine whether the command has finished executing.

RAB Tolerance Stored in Read-Only Memory

The AD5253/AD5254 feature patented RAB tolerances storage in the nonvolatile memory. The tolerance of each channel is stored in the memory during the factory production and can be read by users at any time. The knowledge of the stored tolerance, which is the average of R users to predict R
AB
over all codes (see Figure 16), allows
AB
accurately. This feature is valuable for precision, rheostat mode, and open-loop applications, in which knowledge of absolute resistance is critical.
The stored tolerances reside in the read-only memory and are expressed as percentages. Each tolerance is 16 bits long and is stored in two memory locations (see Ta b le 1 0). The tolerance data is expressed in sign magnitude binary format stored in two bytes; an example is shown in Figure 32 . For the first byte in Register N, the MSB is designated for the sign (0 = + and 1 = –) and the 7 LSB is designated for the integer portion of the tolerance. For the second byte in Register N + 1, all eight data
Table 9. RDAC-to-EEMEM Interface and RDAC Operation Quick Command Bits (CMD/
C3 C2 C1 C0 Command Description
0 0 0 0 NOP 0 0 0 1 Restore EEMEM (A1, A0) to RDAC (A1, A0)1 0 0 1 0 Store RDAC (A1, A0) to EEMEM (A1, A0) 0 0 1 1 Decrement RDAC (A1, A0) 6 dB 0 1 0 0 Decrement all RDACs 6 dB 0 1 0 1 Decrement RDAC (A1, A0) one step 0 1 1 0 Decrement all RDACs one step 0 1 1 1 Reset: restore EEMEMs to all RDACs 1 0 0 0 Increment RDACs (A1, A0) 6 dB 1 0 0 1 Increment all RDACs 6 dB 1 0 1 0 Increment RDACs (A1, A0) one step 1 0 1 1 Increment all RDACs one step 1 1 0 0 Reserved :
: 1 1 1 1 Reserved
1
This command leaves the device in the EEMEM read power state, which consumes power. Issue the NOP command to return the device to its idle state.
: :
: :
: :
: :
bits are designated for the decimal portion of tolerance. As shown in Tab l e 1 0 and Figure 32, for example, if the rated R
is
AB
10 kΩ and the data readback from Address 11000 shows 0001 1100 and Address 11001 shows 0000 1111, then RDAC0 tolerance can be calculated as
MSB: 0 = + Next 7 MSB: 001 1100 = 28 8 LSB: 0000 1111 = 15 × 2
–8
= 0.06 Tolerance = 28.06% and, therefore, R
AB_ACTUAL
= 12.806 kΩ

EEMEM Write-Acknowledge Polling

After each write operation to the EEMEM registers, an internal write cycle begins. The I determine if the internal write cycle is complete and the I interface is enabled, interface polling can be executed. I
2
C interface of the device is disabled. To
2
C
2
C interface polling can be conducted by sending a start condition followed by the slave address and the write bit. If the I
2
C interface responds with an ACK, the write cycle is complete and the interface is ready to proceed with further operations. Other-
2
wise, I
C interface polling can be repeated until it succeeds.
Command 2 and Command 7 also require acknowledge polling.

EEMEM Write Protection

Setting the WP pin to logic low after EEMEM programming protects the memory and RDAC registers from future write
operations. In this mode, the EEMEM and RDAC read operations function as normal.
= 1, A2 = 0)
REG
Rev. B | Page 18 of 32
AD5253/AD5254
www.BDTIC.com/ADI
Table 10. Address Table for Reading Tolerance (CMD/
A4 A3 A2 A1 A0 Data Byte Description
1 1 0 0 0 Sign and 7-bit integer values of RDAC0 tolerance (read only) 1 1 0 0 1 8-bit decimal value of RDAC0 tolerance (read only) 1 1 0 1 0 1 1 0 1 1 1 1 1 0 0 1 1 1 0 1 1 1 1 1 0
Sign and 7-bit integer values of RDAC1 tolerance (read only) 8-bit decimal value of RDAC1 tolerance (read only) Sign and 7-bit integer values of RDAC2 tolerance (read only) 8-bit decimal value of RDAC2 tolerance (read only) Sign and 7-bit integer values of RDAC3 tolerance (read only)
1 1 1 1 1 8-bit decimal value of RDAC3 tolerance (read only)
AA
D7 D6 D5 D4 D3 D2 D1 D0
6252423222120
SIGN
2
REG
= 0, EE/
= 1, A4 = 1)
RDAC
D7 D6 D5 D4 D3 D2 D1 D0
2–12–22–32–42–52–62
A
–8
–7
2
SIGN
Figure 32. Format of Stored Tolerance in Sign Magnitude Format with Bit Position Descriptions (Unit is Percent, Only Data Bytes Are Shown)
7 BITS FOR INTEGER NUMBER
8 BITS FOR DECIMAL NUMBER
03824-0-012
Rev. B | Page 19 of 32
AD5253/AD5254
A
Y
XXXXXXX
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I2C-COMPATIBLE 2-WIRE SERIAL BUS

START B
MASTER
SCL SD
1
1
0
11
0
FRAME 1
SLAVE ADDRESS BYTE
AD1 AD0
R/W
ACK. BY
AD525x
9
1
X
INSTRUCTION BYTE
Figure 33. General I
1
SCL
0
1
SDA
START BY
MASTER
0
FRAME1
SLAVE ADDRESS BYTE
11
AD1
AD0
Figure 34. General I
The first byte of the AD5253/AD5254 is a slave address byte (see Figure 33 and Figure 34). It has a 7-bit slave address and an
W
R/
bit. The 5 MSB of the slave address is 01011, and the next 2 LSB is determined by the states of the AD1 and AD0 pins. AD1 and AD0 allow the user to place up to four AD5253/AD5254 devices on one bus.
2
AD5253/AD5254 can be controlled via an I
C-compatible serial
bus and are connected to this bus as slave devices. The 2-wire
2
I
C serial bus protocol (see Figure 33 and Figure 34) follows:
1. The master initiates a data transfer by establishing a start
condition, such that SDA goes from high to low while SCL
is high (see Figure 33). The following byte is the slave
address byte, which consists of the 5 MSB of a slave address
2
defined as 01011. The next two bits are AD1 and AD0, I
C device address bits. Depending on the states of their AD1 and AD0 bits, four AD5253/AD5254 devices can be addressed on the same bus. The last LSB, the R/
W
bit, determines whether data is read from or written to the slave device.
The slave whose address corresponds to the transmitted address responds by pulling the SDA line low during the ninth clock pulse (this is called an acknowledge bit). At this stage, all other devices on the bus remain idle while the selected device waits for data to be written to or read from its serial register.
2. In the write mode (except when restoring EEMEM to the
RDAC register), there is an instruction byte that follows the slave address byte. The MSB of the instruction byte is labeled CMD/
. MSB = 1 enables CMD, the command
REG
instruction byte; MSB = 0 enables general register writing. The third MSB in the instruction byte, labeled EE/
RDAC
,
is true when MSB = 0 or when the device is in general writing mode. EE enables the EEMEM register, and REG enables the RDAC register. The 5 LSB, A4 to A0, designates
Rev. B | Page 20 of 32
9
1
D6 D5
D7
ACK. BY
AD525x
FRAME 2
2
C Write Pattern
91 9
R/W
ACK. BY
AD525x
D7 D6 D5 D4 D3 D2
FRAME 2
RDAC REGISTER
2
C Read Pattern
D1 D0
the addresses of the EEMEM and RDAC registers (see Figure 27 Figure 28
and ). When MSB = 1 or when the device is in CMD mode, the four bits following the MSB are C3 to C1, which correspond to 12 predefined EEMEM controls and quick commands; there are also four factory­reserved commands. The 3 LSB—A2, A1, and A0—are 4­channel RDAC addresses (see ). After acknowledging the instruction byte, the last byte in the write mode is the data byte. Data is transmitted over the serial bus in sequences of nine clock pulses (eight data bits followed by an acknowledge bit). The transitions on the SDA line must occur during the low period of SCL and remain stable during the high period of SCL (see ).
3. In current read mode, the RDAC0 data byte immediately
follows the acknowledgment of the slave address byte. After an acknowledgement, RDAC1 follows, then RDAC2, and so on. (There is a slight difference in write mode, where the last eight data bits representing RDAC3 data are followed by a no acknowledge bit.) Similarly, the transitions on the SDA line must occur during the low period of SCL and remain stable during the high period of SCL (see Figure 34). Another reading method, random read method, is shown in Figure 30.
4. When all data bits have been read or written, a stop
condition is established by the master. A stop condition is defined as a low-to-high transition on the SDA line that occurs while SCL is high. In write mode, the master pulls the SDA line high during the 10 stop condition (see Figure 33). In read mode, the master issues a no acknowledge for the ninth clock pulse, that is, the SDA line remains high. The master brings the SDA line low before the 10 line high to establish a stop condition (see Figure 34).
D4 D3 D2 D1
FRAME 1
DATA BYTE
NO ACK. BY
MASTER
STOP BY MASTER
th
clock pulse and then brings the SDA
9
D0
ACK. BY
AD525x
STOP BY
03824-0-014
MASTER
03824-0-013
Figure 31
Figure 33
th
clock pulse to establish a
AD5253/AD5254
www.BDTIC.com/ADI

THEORY OF OPERATION

The AD5253/AD5254 are quad-channel digital potentiometers in 1 kΩ, 10 kΩ, 50 kΩ, or 100 kΩ that allow 64/256 linear resis­tance step adjustments. The AD5253/AD5254 employ double­gate CMOS EEPROM technology, which allows resistance settings and user-defined data to be stored in the EEMEM registers. The EEMEM is nonvolatile, such that settings remain when power is removed. The RDAC wiper settings are restored from the nonvolatile memory settings during device power-up and can also be restored at any time during operation.
The AD5253/AD5254 resistor wiper positions are determined by the RDAC register contents. The RDAC register acts like a scratch-pad register, allowing unlimited changes of resistance settings. RDAC register contents can be changed using the device’s serial I
2
C interface. The format of the data-words and
the commands to program the RDAC registers are discussed in
2
the I
C Interface section.
The four RDAC registers have corresponding EEMEM memory locations that provide nonvolatile storage of resistor wiper position settings. The AD5253/AD5254 provide commands to store the RDAC register contents to their respective EEMEM memory locations. During subsequent power-on sequences, the RDAC registers are automatically loaded with the stored value.
Whenever the EEMEM write operation is enabled, the device activates the internal charge pump and raises the EEMEM cell gate bias voltage to a high level; this essentially erases the current content in the EEMEM register and allows subsequent storage of the new content. Saving data to an EEMEM register consumes about 35 mA of current and lasts approximately 26 ms. Because of charge-pump operation, all RDAC channels may experience noise coupling during the EEMEM writing operation.
The EEMEM restore time in power-up or during operation is about 300 μs. Note that the power-up EEMEM refresh time depends on how fast V
reaches its final value. As a result, any
DD
supply voltage decoupling capacitors limit the EEMEM restore time during power-up. For example, Figure 20 shows the power-up profile of the V
where there is no decoupling
DD
capacitors and the applied power is a digital signal. The device initially resets the RDACs to midscale before restoring the EEMEM contents. The omission of the decoupling capacitors should only be considered when the fast restoring time is absolutely needed in the application. In addition, users should issue a NOP Command 0 immediately after using Command 1 to restore the EEMEM setting to RDAC, thereby minimizing supply current dissipation. Reading user data directly from EEMEM does not require a similar NOP command execution.
In addition to the movement of data between RDAC and EEMEM registers, the AD5253/AD5254 provide other shortcut commands that facilitate programming, as shown in Tabl e 11 .
Table 11. Quick Commands
Command Description
0 NOP. 1
2 Store RDAC register setting to EEMEM. 3 Decrement RDAC 6 dB (shift data bits right). 4 Decrement all RDACs 6 dB (shift all data bits right). 5 Decrement RDAC one step. 6 Decrement all RDACs one step. 7 Reset EEMEM contents to all RDACs. 8 Increment RDAC 6 dB (shift data bits left). 9 Increment all RDACs 6 dB (shift all data bits left). 10 Increment RDAC one step. 11 Increment all RDACs one step. 12 to 15 Reserved.
Restore EEMEM content to RDAC. User should issue NOP immediately after this command to conserve power.

LINEAR INCREMENT/DECREMENT COMMANDS

The increment and decrement commands (10, 11, 5, and 6) are useful for linear step-adjustment applications. These commands simplify microcontroller software coding by allowing the controller to send just an increment or decrement command to the AD5253/AD5254. The adjustments can be directed to a single RDAC or to all four RDACs.

±6 dB ADJUSTMENTS (DOUBLING/HALVING WIPER SETTING)

The AD5253/AD5254 accommodate ±6 dB adjustments of the RDAC wiper positions by shifting the register contents to left/ right for increment/decrement operations, respectively. Com­mand 3, Command 4, Command 8, and Command 9 can be used to increment or decrement the wiper positions in 6 dB steps synchronously or asynchronously.
Incrementing the wiper position by +6 dB essentially doubles the RDAC register value, whereas decrementing the wiper position by –6 dB halves the register content. Internally, the AD5253/AD5254 use shift registers to shift the bits left and right to achieve a ±6 dB increment or decrement. The maximum number of adjustments is nine and eight steps for incrementing from zero scale and decrementing from full scale, respectively. These functions are useful for various audio/video level adjustments, especially for white LED brightness settings in which human visual responses are more sensitive to large adjustments than to small adjustments.
Rev. B | Page 21 of 32
AD5253/AD5254
S
www.BDTIC.com/ADI

DIGITAL INPUT/OUTPUT CONFIGURATION

SDA is a digital input/output with an open-drain MOSFET that requires a pull-up resistor for proper communication. On the other hand, SCL and
resistors are recommended to minimize the MOSFET cross­conduction current when the driving signals are lower than V
. SCL and WP have ESD protection diodes, as shown in
DD
and . Figure 35 Figure 36
can be permanently tied to VDD without a pull-up resistor if
WP the write-protect feature is not used. If internal current source pulls it low to enable write protection. In applications in which the device is programmed infrequently, this allows the part to default to write-protection mode after any one-time factory programming or field calibration without using an on-board pull-down resistor. Because there are protection diodes on all inputs, the signal levels must not be greater than V
to prevent forward biasing of the diodes.
DD
are digital inputs for which pull-up
WP
is left floating, an
WP
V
DD

MULTIPLE DEVICES ON ONE BUS

The AD5253/AD5254 are equipped with two addressing pins, AD1 and AD0, that allow up to four AD5253/AD5254 devices to be operated on one I AD1 and AD0 on each device must first be defined. An example is shown in Tabl e 12 and Figure 37. In I device is issued a different slave address—01011(AD1)(AD0)— to complete the addressing.
Table 12. Multiple Devices Addressing
AD1 AD0 Device Addressed
0 0 U1 0 1 U2 1 0 1 1 U4
R
PRP
MASTER
2
C bus. To achieve this result, the states of
2
C programming, each
U3
5V
5V
5V
5V
SDA
SCL
CL
GND
Figure 35. SCL Digital Input
SCL
SDA
AD1 AD0
AD5253/ AD5254
03824-0-035
V
DD
Figure 37. Multiple AD5253/AD5254 Devices on a Single Bus
In wireless base station smart-antenna systems that require arrays of digital potentiometers to bias the power amplifiers, large numbers of AD5253/AD5254 devices can be addressed by
SDA
SCL SDA
AD1 AD0
AD5253/ AD5254
SCL SDA
AD1 AD0
AD5253/ AD5254
SCL
AD1 AD0
AD5253/ AD5254
03824-0-037
using extra decoders, switches, and I/O buses, as shown in
INPUTS
Figure 38. For example, to communicate to a total of 16 devices, four decoders and 16 sets of combinational switches (four sets
WP
shown in Figure 38) are needed. Two I/O buses serve as the common inputs of the four 2 × 4 decoders and select four sets of outputs at each combination. Because the four sets of
03824-0-036
GND
Figure 36. Equivalent
WP
Digital Input
combination switch outputs are unique, as shown in Figure 38, a specific device is addressed by properly programming the I
2
C with the slave address defined as 01011(AD1)(AD0). This operation allows one of 16 devices to be addressed, provided that the inputs of the two decoders do not change states. The inputs of the decoders are allowed to change once the operation of the specified device is completed.
Rev. B | Page 22 of 32
AD5253/AD5254
V
V
www.BDTIC.com/ADI
+5V
X
+5V
+5V
X
+5V
× 4
AD1 AD0
× 4
AD1
+5
P2
Y
P2
Y
R3
N3
Y
× 4
× 4
AD0
AD1
Y
AD0
AD1 AD0
03824-0-038
2 × 4 DECODER
2 × 4 DECODER
2 × 4 DECODER
2 × 4 DECODER
R1
N142
R2
X
4
4
4
N2
X
P3
R3
P4
R4
Figure 38. Four Devices with AD1 and AD0 of 00

TERMINAL VOLTAGE OPERATION RANGE

The AD5253/AD5254 are designed with internal ESD diodes for protection; these diodes also set the boundaries for the terminal operating voltages. Positive signals present on Ter mi n al A, Te rm in a l B , or Te r m in al W th a t e x ce ed V clamped by the forward-biased diode. Similarly, negative signals on Te rm in a l A , Te rm in a l B , or Te rm in a l W th at a re m ore negative than V users should not operate V the voltage across V
are also clamped (see Figure 39). In practice,
SS
, VWA, and VWB to be higher than
AB
to VSS, but VAB, VWA, and VWB have no
DD
polarity constraint.
DD
are
V
DD
A
W
B
V
SS
Figure 39. Maximum Terminal Voltages Set by V
and V
DD
03824-0-039
SS

POWER-UP AND POWER-DOWN SEQUENCES

Because the ESD protection diodes limit the voltage compliance at Te rm i na l A , Ter mi na l B, a nd Te rm in a l W (Figure 39), it is important to power V
before applying any voltage to
DD/VSS
these terminals. Otherwise, the diodes are forward biased such that V user’s circuit. Similarly, V
are powered unintentionally and may affect the
DD/VSS
should be powered down last.
DD/VSS
The ideal power-up sequence is in the following order: GND, V
, VSS, digital inputs, and VA/VB/VW. The order of powering
DD
V
, VB, VW, and the digital inputs is not important, as long as
A
they are powered after V
DD/VSS
.

LAYOUT AND POWER SUPPLY BIASING

It is always a good practice to employ a compact, minimum lead-length layout design. The leads to the input should be as direct as possible, with a minimum conductor length. Ground paths should have low resistance and low inductance.
Similarly, it is also good practice to bypass the power supplies with quality capacitors. Low equivalent series resistance (ESR) 1 μF to 10 μF tantalum or electrolytic capacitors should be applied at the supplies to minimize any transient disturbance and filter low frequency ripple. Figure 40 illustrates the basic supply-bypassing configuration for the AD5253/AD5254.
AD5253/AD5254
DD
SS
C1
C3
10μF
0.1μF
C4
C2
10μF
0.1μF
Figure 40. Power Supply-Bypassing Configuration
The ground pin of the AD5253/AD5254 is used primarily as a digital ground reference. To minimize the digital ground bounce, the AD5253/AD5254 ground terminal should be joined remotely to the common ground (see Figure 40).
V
DD
V
SS
GND
03824-0-040
Rev. B | Page 23 of 32
AD5253/AD5254
www.BDTIC.com/ADI

DIGITAL POTENTIOMETER OPERATION

The structure of the RDAC is designed to emulate the performance of a mechanical potentiometer. The RDAC contains a string of resistor segments with an array of analog switches that act as the wiper connection to the resistor array. The number of points is the resolution of the device. For example, the AD5253/AD5254 emulate 64/256 connection points with 64/256 equal resistance, R provide better than 1.5%/0.4% resolution.
Figure 41 provides an equivalent diagram of the connections between the three terminals that make up one channel of the RDAC. Switches SW switches SW(0) to SW(2
and SWB are always on, but only one of
A
N–1
) can be on at a time (determined by the setting decoded from the data bit). Because the switches are nonideal, there is a 75 Ω wiper resistance, R is a function of supply voltage and temperature: Lower supply voltages and higher temperatures result in higher wiper resistances. Consideration of wiper resistance dynamics is important in applications in which accurate prediction of output resistance is required.
RDAC
WIPER
REGISTER
AND
DECODER
R
S
, allowing them to
S
SW
A
SW (2N– 1)
N
SW (2
– 2)
. Wiper resistance
W
A
X
W
X

PROGRAMMABLE RHEOSTAT OPERATION

If either the W-to-B or W-to-A terminal is used as a variable resistor, the unused terminal can be opened or shorted with W; such operation is called rheostat mode (see Figure 42). The resistance tolerance can range ±20%.
A
W
B
Figure 42. Rheostat Mode Configuration
The nominal resistance of the AD5253/AD5254 has 64/256 contact points accessed by the wiper terminal, plus the B terminal contact. The 6-/8-bit data-word in the RDAC register is decoded to select one of the 64/256 settings. The wiper’s first connection starts at the B terminal for Data 0x00. This B termi­nal connection has a wiper contact resistance, R regardless of the nominal resistance. The second connection (the AD5253 10 kΩ part) is the first tap point where R (R
= RAB/64 + RW = 156 Ω + 75 Ω) for Data 0x01, and so on.
WB
Each LSB data value increase moves the wiper up the resistor ladder until the last tap point is reached at R Figure 41 for a simplified diagram of the equivalent RDAC circuit.
The general equation that determines the digitally programmed output resistance between W and B is
AD5253: RWB(D) = (D/64) × RAB + 75 Ω (1)
AD5254: RWB(D) = (D/256) × RAB + 75 Ω (2)
A
W
B
A
W
B
, of 75 Ω,
W
WB
= 9893 Ω. See
WB
03824-0-042
= 231 Ω
where:
R
S
SW(1)
R
S
SW(0)
RS= RAB/2
DIGITAL CIRCUITRY OMIITTED FOR CLARITY
N
SW
B
Figure 41. Equivalent RDAC Structure
B
X
03824-0-041
D is the decimal equivalent of the data contained in the RDAC latch.
R
is the nominal end-to-end resistance.
AB
Rev. B | Page 24 of 32
AD5253/AD5254
www.BDTIC.com/ADI
(%)
AB
R
100
R
WA
75
50
25
R
WB

PROGRAMMABLE POTENTIOMETER OPERATION

If all three terminals are used, the operation is called potenti­ometer mode (see Figure 44); the most common configuration is the voltage divider operation.
V
I
Figure 44. Potentiometer Mode Configuration
A
V
C
W
B
03824-0-044
0
0
Figure 43. AD5253 R
10 32 48 63
D (Code in Decimal)
(D) and RWB(D) vs. Decimal Code
WA
03824-0-043
Since the digital potentiometer is not ideal, a 75 Ω finite wiper resistance is present that can easily be seen when the device is programmed at zero scale. Because of the fine geometric and interconnects employed by the device, care should be taken to limit the current conduction between W and B to no more than ±5 mA continuous for a total resistance of 1 kΩ or a pulse of ±20 mA to avoid degradation or possible destruction of the device. The maximum dc current for AD5253 and AD5254 are shown in Figure 21 and Figure 22, respectively.
Similar to the mechanical potentiometer, the resistance of the RDAC between Wiper W and Terminal A also produces a digitally controlled complementary resistance, R terminals are used, the B terminal can be opened. The R
. When these
WA
WA
starts at a maximum value and decreases as the data loaded into the latch increases in value (see Figure 43. The general equation for this operation is
AD5253: RWA(D) = [(64 – D)/64] × RAB + 75 Ω (3)
AD5254: RWA(D) = [(256 – D)/256] × RAB + 75 Ω (4)
The typical distribution of R
from channel-to-channel
AB
matches is about ±0.15% within a given device. On the other hand, device-to-device matching is process-lot dependent with a ±20% tolerance.
If the wiper resistance is ignored, the transfer function is simply
AD5253:
AD5254:
V +×=
W
V +×=
W
D
64
D
256
(5)
VV
B
AB
(6)
VV
B
AB
A more accurate calculation that includes the wiper resistance effect is
D
+
RR
W
AB
N
2
)(
where 2
= (7)
DV
W
N
is the number of steps.
+
AB
V
A
RR
2
W
Unlike in rheostat mode operation, where the tolerance is high, potentiometer mode operation yields an almost ratiometric
N
function of D/2 R
terms. Therefore, the tolerance effect is almost cancelled.
W
with a relatively small error contributed by the
Similarly, the ratiometric adjustment also reduces the temperature coefficient effect to 50 ppm/°C, except at low value codes where R
dominates.
W
Potentiometer mode operations include other applications such as op amp input, feedback-resistor networks, and other voltage­scaling applications. The A, W, and B terminals can, in fact, be input or output terminals, provided that |V not exceed V
to VSS.
DD
|, |VW|, and |VB| do
A
Rev. B | Page 25 of 32
AD5253/AD5254
www.BDTIC.com/ADI

APPLICATIONS INFORMATION

RGB LED BACKLIGHT CONTROLLER FOR LCD PANELS

Because high power (>1 W) RGB LEDs offer superior color quality compared with cold cathode florescent lamps (CCFLs) as backlighting sources, it is likely that high-end LCD panels will employ RGB LEDs as backlight in the near future. Unlike conventional LEDs, high power LEDs have a forward voltage of 2 V to 4 V and consume more than 350 mA at maximum brightness. The LED brightness is a linear function of the conduction current, but not of the forward voltage. To increase the brightness of a given color, multiple LEDs can be connected in series, rather than in parallel, to achieve uniform brightness. For example, three red LEDs configured in series require an average of 6 V to 12 V headroom, but the circuit operation requires current control. As a result, Figure 45 shows the implementation of one high power RGB LED controller using a AD5254, a boost regulator, an op amp, and power MOSFETs.
The ADP1610 (U2 in Figure 45) is an adjustable boost regulator with its output adjusted by the AD5254’s RDAC3. Such an output should be set high enough for proper operation but low enough to conserve power. The ADP1610’s 1.2 V band gap reference is buffered to provide the reference level for the voltage dividers set by the AD5254’s RDAC0 to RDAC2 and Resistor R2 to Resistor R4. For example, by adjusting the AD5254’s RDAC0, the desirable voltage appears across the sense resistors, R and power MOSFET N1 do whatever is necessary to regulate the current of the loop. As a result, the current through the sense resistor and the red LEDs is
I =
R
R8 is needed to prevent oscillation.
In addition to the 256 levels of adjustable current/brightness, users can also apply a PWM signal at U3’s
finer brightness resolution or better power efficiency.
. If U2’s output is set properly, op amp U3A
R
V
RR
(8)
R
R
pin to achieve
SD
Rev. B | Page 26 of 32
AD5253/AD5254
www.BDTIC.com/ADI
+5V
C10
10μF
C1
0.1μF
U3D
AD8594
SCL SDA
R4 R3 R2
L1 - SLF6025-100M1R0 D1 - MBR0520LT1
R7R6
22kΩ 22kΩ
V
= 2.5V
REF
250kΩ 250kΩ
U1
V
DD
RDAC3
CLK SDI
10kΩ
R1
R5
A3
B3
10kΩ
100kΩ
R
C
C
AD5254
250kΩ
RDAC2
10kΩ
RDAC1
10kΩ
RDAC0
10kΩ
V
GND AD0 AD1
SS
A2
W2
B2
A1
W1
B1
A0
W0
B0
Figure 45. Digital Potentiometer-Based RGB LED Controller
10kΩ
C
390μF
U2
IN
ADP1610
SW
FB SD COMP
SS RT GND
C
SS
10μF
PWM
SD
L1
+5V
V+
AD8594
V–
U3B
AD8594
U3A
AD8594
10μF D1
C11
8
U3C
4
C3
0.1μF
10μF
R10
4.7Ω
N3
RB
R9
4.7Ω
DB1
DB2
DB3
VB
IB
IRFL3103
VRB
0.1Ω N2
RG
R8
4.7Ω
DG1
DG2
DG3
IG
VG
IRFL3103
VRG
0.1Ω N1
RR
V
OUT
DR1
DR2
DR3
IR
VR
IRFL3103
VRR
0.1Ω
03824-0-045
Rev. B | Page 27 of 32
AD5253/AD5254
Y
www.BDTIC.com/ADI

OUTLINE DIMENSIONS

6.60
6.50
6.40
PIN 1
0.15
0.05
COPLANARIT
20
1
0.65
BSC
0.30
0.19
0.10 COMPLIANT TO JEDEC STANDARDS MO-153-AC
1.20 MAX
11
10
SEATING PLANE
4.50
4.40
4.30
6.40 BSC
0.20
0.09 8°
0.75
0.60
0.45
Figure 46. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
Rev. B | Page 28 of 32
AD5253/AD5254
www.BDTIC.com/ADI

ORDERING GUIDE

Package
Model1 Step R
(kΩ) Temperature Range Package Description
AB
Option
AD5253BRU1 64 1 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5253BRU1-RL7 64 1 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5253BRUZ12 64 1 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5253BRUZ1-RL72 64 1 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5253BRU10 64 10 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5253BRU10-RL7 64 10 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5253BRUZ102 64 10 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5253BRUZ10-RL72 64 10 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5253BRU50 64 50 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5253BRU50-RL7 64 50 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5253BRUZ502 64 50 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5253BRUZ50-RL72 64 50 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5253BRU100 64 100 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5253BRU100-RL7 64 100 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5253BRUZ1002 64 100 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5253BRUZ100-RL72 64 100 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5253EVAL 64 10 Evaluation Board 1 AD5254BRU1 256 1 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5254BRU1-RL7 256 1 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5254BRUZ12 256 1 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5254BRUZ1-RL72 256 1 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5254BRU10 256 10 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5254BRU10-RL7 256 10 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5254BRUZ102 256 10 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5254BRUZ10-RL72 256 10 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5254BRU50 256 50 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5254BRU50-RL7 256 50 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5254BRUZ502 256 50 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5254BRUZ50-RL72 256 50 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5254BRU100 256 100 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5254BRU100-RL7 256 100 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 AD5254BRUZ1002 256 100 −40°C to +85°C 20-Lead TSSOP RU-20 75 AD5254BRUZ100-RL72 256 100 −40°C to +85°C 20-Lead TSSOP RU-20 1,000 EVAL-AD5254EBZ2 256 10 Evaluation Board 1
1
In the package marking, Line 1 shows the part number. Line 2 shows the branding information, such that B1 = 1 kΩ, B10 = 10 kΩ, and so on. There is also a
“#” marking for the Pb-free part. Line 3 shows the date code in YYWW.
2
Z = RoHS Compliant Part.
Ordering Quantity
Rev. B | Page 29 of 32
AD5253/AD5254
www.BDTIC.com/ADI
NOTES
Rev. B | Page 30 of 32
AD5253/AD5254
www.BDTIC.com/ADI
NOTES
Rev. B | Page 31 of 32
AD5253/AD5254
www.BDTIC.com/ADI
NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
© 2003–2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03824-0-10/09(B)
Rev. B | Page 32 of 32
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