-5V tolerant I/O pins accept 5V, 3.3V, and 2.5V
signals
-3.3V or 2.5V output capability
-Advanced 0.35 micron feature size CMOS
Fast FLASH™ technology
•Advanced system features
-In-system programmable
-Superior pin-locking and routability with
Fast CONNECT™ II switch matrix
-Extra wide 54-input Function Blocks
-Up to 90 product-terms per macrocell with
individual product-term allocation
-Local clock inversion with three global and one
product-term clocks
-Individual output enable per output pin
-Input hysteresis on all user and boundary-scan pin
inputs
-Bus-hold circuitry on all user pin inputs
-Full IEEE Standard 1149.1 boundary-scan (JTAG)
•Fast concurrent programming
•Slew rate control on individual outputs
•Enhanced data security features
•Excellent quality and reliability
-Endurance exceeding 10,000 program/erase
cycles
-20 year data retention
-ESD protection exceeding 2,000V
•Pin-compatible with 5V-core XC9572 device in the
44-pin PLCC package and the 100-pin TQFP package
WARNING: Programming temperature range of
T
= 0° C to +70° C
A
Description
The XC9572XL is a 3.3V CPLD targeted for high-performance, low-voltage applications in leading-edge communi-
XC9572XL High Performance
CPLD
Product Specification
cations and computing systems. It is comprised of four
54V18 Function Blocks, providing 1,600 usable gates with
propagation delays of 5 ns. See Figure 2 for overview.
Power Estimation
Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
in a XC9500XL device may be configured for low-power
mode (from the default high-performance mode). In addition, unused product-terms and macrocells are automatically deactivated by the software to further conserve power.
For a general estimate of I
used:
I
(mA) = MCHS(0.175*PT
CC
+ 0.272) + 0.04 * MC
where:
MC
= # macrocells in high-speed configuration
HS
PT
= average number of high-speed product terms
HS
per macrocell
MC
= # macrocells in low power configuration
LP
PT
= average number of low power product terms per
LP
macrocell
f = maximum clock frequency
MCTOG = average % of flip-flops toggling per clock
(~12%)
This calculation was derived from laboratory measurements
of an XC9500XL part filled with 16-bit counters and allowing
a single output (the LSB) to be enabled. The actual I
value varies with the design application and should be verified during normal system operation. Figure 1 shows the
above estimation in a graphical form. For a more detailed
discussion of power consumption in this device, see Xilinx
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS057 (v2.0) April 3, 2007www.xilinx.com1
Product Specification
Page 2
XC9572XL High Performance CPLD
application note XAPP114, “Understanding XC9500XL
CPLD Power.”
125
R
100
75
(mA)
CC
50
Typical I
25
0
erformance
P
High
104 MHz
Low Power
50150
Clock Frequency (MHz)
100200
178 MHz
DS057_01_010102
Figure 1: Typical ICC vs. Frequency for XC9572XL
JTAG Port
3
1
I/O
I/O
JTAG
Controller
In-System Programming Controller
54
18
Function
Block 1
Macrocells
1 to 18
I/O
I/O
I/O
I/O
I/O
I/O
I/O/GCK
I/O/GSR
I/O/GTS
54
18
I/O
Blocks
54
18
Fast CONNECT II Switch Matrix
3
54
1
18
2
Figure 2: XC9572XL Architecture
Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.
Function
Block 2
Macrocells
1 to 18
Function
Block 3
Macrocells
1 to 18
Function
Block 4
Macrocells
1 to 18
DS057_02_082800
2www.xilinx.comDS057 (v2.0) April 3, 2007
Product Specification
Page 3
R
XC9572XL High Performance CPLD
Absolute Maximum Ratings
(2)
SymbolDescriptionValueUnits
V
CC
V
IN
V
TS
T
STG
T
J
Notes:
1.Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0 V or overshoot to +7.0V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA. External I/O voltage may not exceed V
2.Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
3.For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb-free
packages, see XAPP427.
Supply voltage relative to GND–0.5 to 4.0V
Input voltage relative to GND
Voltage applied to 3-state output
Storage temperature (ambient)
Junction temperature+150
(1)
(3)
(1)
CCINT
by 4.0V.
–0.5 to 5.5V
–0.5 to 5.5V
–65 to +150
o
o
C
C
Recommended Operation Conditions
SymbolParameterMinMaxUnits
V
CCINT
V
CCIO
V
V
V
IL
IH
O
Supply voltage for internal logic
and input buffers
Commercial TA = 0oC to 70oC3.0 3.6V
Industrial T
= –40oC to +85oC3.03.6V
A
Supply voltage for output drivers for 3.3V operation3.03.6V
Supply voltage for output drivers for 2.5V operation2.32.7V
Low-level input voltage00.80V
High-level input voltage2.05.5V
Output voltage0V
CCIO
V
Quality and Reliability Characteristics
SymbolParameterMinMaxUnits
V
T
N
ESD
DR
PE
Data Retention20-Years
Program/Erase Cycles (Endurance)10,000-Cycles
Electrostatic Discharge (ESD)2,000-Volts
DC Characteristic Over Recommended Operating Conditions
SymbolParameterTest ConditionsMinMaxUnits
V
OH
V
OL
I
IL
I
IH
I
IH
C
IN
I
CC
Output high voltage for 3.3V outputsIOH = –4.0 mA2.4-V
Output high voltage for 2.5V outputsI
= –500 μA90% V
OH
CCIO
-V
Output low voltage for 3.3V outputsIOL = 8.0 mA-0.4V
Output low voltage for 2.5V outputsI
Input leakage currentVCC = Max; VIN = GND or V
I/O high-Z leakage currentVCC = Max; VIN = GND or V
1.The pin-outs are the same for Pb-free versions of packages.
DS057 (v2.0) April 3, 2007www.xilinx.com7
Product Specification
Page 8
XC9572XL High Performance CPLD
Device Part Marking and Ordering Combination Information
R
R
Device Type
Package
Speed
Operating Range
Notes:
1.Due to the small size of chip scale packages, part marking on these packages does not follow the above
sample and the complete part number cannot be included in the marking. Part marking on chip scale
packages by line:
·Line 1 = X (Xilinx logo), then truncated part number (no XC), i.e., 95xxxXL.
·Line 2 = Not related to device part number.
·Line 3 = Not related to device part number.
·Line 4 = Package code, speed, operating temperature, three digits not related to device
part number. Package codes: C1 = CS48, C2 = CSG48.
Device
Speed Grade
Package Type
Number of Pins
Temperature Range
-4 TQC144
Pb-
Device
Speed Grade
Package Type
-Free
Pb
Number of Pins
Free Example:
XC9572XL TQ G 144C
-4
Temperature Range
DS057 (v2.0) April 3, 2007www.xilinx.com9
Product Specification
Page 10
XC9572XL High Performance CPLD
Warranty Disclaimer
THESE PRODUCTS ARE SUBJECT TO THE TERMS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED
AT http://www.xilinx.com/warranty.htm
. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF THE
PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED ON THE
THEN-CURRENT XILINX DATA SHEET FOR THE PRODUCTS. PRODUCTS ARE NOT DESIGNED TO BE FAIL-SAFE
AND ARE NOT WARRANTED FOR USE IN APPLICATIONS THAT POSE A RISK OF PHYSICAL HARM OR LOSS OF
LIFE. USE OF PRODUCTS IN SUCH APPLICATIONS IS FULLY AT THE RISK OF CUSTOMER SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
Further Reading
The following Xilinx links go to relevant XC9500XL CPLD documentation, including XAPP111, Using the XC9500XL Timing
Model, and XAPP784, Bulletproof CPLD Design Practices. Simply click on the link and scroll down.
Data Sheets, Application Notes, and White Papers.
Packaging
Revision History
R
The following table shows the revision history for this document.