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WD F3100, E3000 User Manual

User Guide

OpenFlex™ F3100 and E3000 1ET2050 Version 1.0 October 2019
User Guide Table of Contents

Table of Contents

Copyright................................................................................................................................................................................... iv
Chapter 1. Overview........................................................................................................................................................................ 1
OpenFlex™ F3100 and E3000.................................................................................................................................................. 2
Servicing Features.............................................................................................................................................................. 3
Composable Infrastructures...............................................................................................................................................3
NVMe-oF..............................................................................................................................................................................4
Supported SKUs................................................................................................................................................................. 4
List of Compatible Devices............................................................................................................................................... 4
System Architecture Overview................................................................................................................................................. 5
System High Speed Data Ingest Architecture.................................................................................................................5
System Thermal and Cooling............................................................................................................................................5
OpenFlex F3100 and E3000 Specification Summary.............................................................................................................. 7
Physical Design.........................................................................................................................................................................10
LEDs....................................................................................................................................................................................12
Cables................................................................................................................................................................................ 16
Restrictions and Limitations.....................................................................................................................................................16
Site Requirements.....................................................................................................................................................................17
Power Requirements......................................................................................................................................................... 17
Rack Requirements............................................................................................................................................................17
Thermal and Cooling Requirements............................................................................................................................... 18
Servicing Requirements....................................................................................................................................................18
Chapter 2. Components............................................................................................................................................................... 20
Chassis.......................................................................................................................................................................................21
Chassis Specifications.......................................................................................................................................................21
PSU............................................................................................................................................................................................ 22
PSU Specifications............................................................................................................................................................22
Fan Module...............................................................................................................................................................................23
Fan Module Specifications............................................................................................................................................... 23
BMC Module............................................................................................................................................................................. 24
BMC Module Specifications.............................................................................................................................................24
Rails........................................................................................................................................................................................... 25
Rails Specifications...........................................................................................................................................................25
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User Guide Table of Contents
OpenFlexF3100......................................................................................................................................................................... 26
OpenFlexF3100 Specifications.........................................................................................................................................26
OpenFlex E3000 Fabric Device Blank.................................................................................................................................... 27
OpenFlex E3000 Fabric Device Blank Specifications.................................................................................................... 27
Chapter 3. Management............................................................................................................................................................... 29
OCGUI.......................................................................................................................................................................................30
Login Page........................................................................................................................................................................30
Dashboard.........................................................................................................................................................................30
Storage Device Page....................................................................................................................................................... 35
Chassis Device Page........................................................................................................................................................ 42
Basic Operational Functions............................................................................................................................................ 49
Power Cycling................................................................................................................................................................... 74
Firmware Upgrade............................................................................................................................................................ 75
Part Replacement.....................................................................................................................................................................81
Fan Module Replacement................................................................................................................................................ 82
PSU Replacement.............................................................................................................................................................84
BMC Module Replacement.............................................................................................................................................. 88
OpenFlexF3100 Replacement...........................................................................................................................................91
Rails Replacement............................................................................................................................................................95
Chassis Replacement.......................................................................................................................................................113
Chapter 4. Safety......................................................................................................................................................................... 135
Electrostatic Discharge.......................................................................................................................................................... 136
Optimizing Location............................................................................................................................................................... 136
Power Connections................................................................................................................................................................ 136
Power Cords........................................................................................................................................................................... 136
Rackmountable Systems........................................................................................................................................................ 137
Restricted Access Location................................................................................................................................................... 137
Safety and Service..................................................................................................................................................................137
Safety Warnings and Cautions.............................................................................................................................................. 138
Chapter 5. Regulatory................................................................................................................................................................. 139
Europe (CE Declaration of Conformity)................................................................................................................................140
FCC Class A Notice............................................................................................................................................................... 140
ICES-003 Class A Notice—Avis NMB-003, Classe A........................................................................................................... 140
Japanese Compliance Statement, Class A ITE.................................................................................................................... 140
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KCC Notice (Republic of Korea Only), Class A ITE............................................................................................................. 140
Taiwan Warning Label Statement, Class A ITE.....................................................................................................................141
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User Guide Copyright

Copyright

The following paragraph does not apply to the United Kingdom or any country where such provisions are inconsistent with local law: Western Digital a Western Digital company PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer or express or implied warranties in certain transactions, therefore, this statement may not apply to you.
This publication could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. Western Digital may make improvements or changes in any products or programs described in this publication at any time.
It is possible that this publication may contain reference to, or information about, Western Digital products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Western Digital intends to announce such Western Digital products, programming, or services in your country.
Technical information about this product is available by contacting your local Western Digital representative or on the Internet at: support@wdc.com
Western Digital may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents.
Long Live Data™ is a trademark of Western Digital, Inc. and its affiliates in the United States and/or other countries.
Western Digital trademarks are authorized for use in countries and jurisdictions in which Western Digital has the right to use, market and advertise the brands. Other product names are trademarks or registered trademarks of their respective owners.
One MB is equal to one million bytes, one GB is equal to one billion bytes, one TB equals 1,000GB (one trillion bytes) and one PB equals 1,000TB when referring to storage capacity. Usable capacity will vary from the raw capacity due to object storage methodologies and other factors.
References in this publication to Western Digital products, programs or services do not imply that Western Digital intends to make these available in all countries in which Western Digital operates.
Product information is provided for information purposes only and does not constitute a warranty.
Information is true as of the date of publication and is subject to change. Actual results may vary. This publication is for general guidance only. Photographs may show design models.
Western Digital 5601 Great Oaks Parkway San Jose, CA 95119
© 2019 Western Digital Corporation or its affiliates.
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User Guide Points of Contact

Points of Contact

For further assistance with a Western Digital product, contact Platform Engineering technical support. Please be prepared to provide the following information: part number (P/N), serial number (S/N), product name and/or model number, and a brief description of the issue.
Email:
support@wdc.com
Website:
https://portal.wdc.com/Support/s/
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Western Digital

Overview

In This Chapter:
- OpenFlex™ F3100 and E3000.......................2
- System Architecture Overview.....................5
- OpenFlex F3100 and E3000 Specification
Summary........................................................... 7
- Physical Design............................................. 10
- Restrictions and Limitations........................ 16
- Site Requirements.........................................17
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1.1 OpenFlex™ F3100 and E3000
The OpenFlex™ F3100 and E3000 is a 3U rack mounted data storage enclosure built on the OpenFlex platform. OpenFlex is Western Digital’s architecture that supports Open Composable Infrastructure (OCI). The OpenFlex F3100 and E3000 are fabric devices that leverage this OCI approach in the form of disagreggated data storage using NVMe-over-Fabrics (NVMe-oF). NVMe-oF is a networked storage protocol that allows storage to be disaggregated from compute to make that storage widely available to multiple applications and servers. By enabling applications to share a common pool of storage capacity, data can be easily shared between applications, or needed capacity can be allocated to an application regardless of location. Exploiting NVMe device-level performance, NVMe-oF promises to deliver the lowest end-to-end latency from application to shared storage. NVMe­oF enables composable infrastructures to deliver the data locality benefits of NVMe DAS (low latency, high performance) while providing the agility and flexibility of sharing storage and compute.
The maximum data storage capacity is 614TB * when leveraging a full set of 10 F3100 fabric devices. The enclosure runs on an input voltage of 200V - 240V and consumes ~1400W of power under typical conditions. It requires a maximum of 1600W at full load.
1. Overview
1.1 OpenFlex™ F3100 and E3000
Composable Infrastructure
An emerging category of datacenter infrastructure that seeks to disaggregate compute, storage, and networking fabric resources into shared resource pools that can be available for on-demand allocation (i.e., “composable”). Composability occurs at the software level, disaggregation occurs at the hardware level using NVMe™­over-Fabric—will vastly improve compute and storage utilization, performance, and agility in the data center.
• 614TB
• 12GBps NVMe-oF over QSFP28
• 68.5 kg / 151.1 lbs.
 *
Cables
OpenFlex
OpenFlex is Western Digital’s architecture that supports Open Composable Infrastructure through storage disaggregation – both disk and flash natively attached to a scalable fabric. OpenFlex does not rule out multiple fabrics, but whenever possible, Ethernet will be used as a unifying connect for both flash and disk because of its broad applicability and availability.
• 200V - 240V Input Voltages
• 3U Form Factor
• Hot-swappable PSUs and Fans
Open Composable API
Western Digital's new Open Composable API is designed for data center composability. It builds upon existing industry standards utilizing the best features of those standards as well as practices from proprietary management protocols.
• Dual 1600W PSUs
• Operational Temperature: 5°C to 35°C
• Dynamic Provisioning Supported
* Max storage capacity depends on device version and device configuration.
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1.1.1
1.1.2

Servicing Features

The OpenFlex F3100 and E3000 are equipped with several features that make servicing simpler and safer. Every CRU component has been designed with toolless removal features.
The BMC Module, Fan Module, PSU, and F3100 devices are all hotswappable components. This document provides full instructions on how these features operate in the Management (page 29) section.

Composable Infrastructures

An emerging category of datacenter infrastructure that seeks to disaggregate compute, storage, and networking fabric resources into shared resource pools that can be available for on-demand allocation (i.e., “composable”). Composable occurs at the software level, disaggregation occurs at the hardware level.
Western Digital’s vision for Open Composable Infrastructures is based on four key pillars:
• Open
1. Overview
1.1 OpenFlex™ F3100 and E3000
◦ Open in both API and form factor ◦ Designed for robust interoperability of multi-vendor solutions
• Scalable
◦ Ability to compose solutions at the width of the network ◦ Enable self-organizing systems of composable elements that communicate horizontally
• Disaggregated
◦ Pools of resources available for any use case that is defined at run time ◦ Independent scaling of compute & storage elements to maximize efficiency & agility
Extensible
•
◦ Inclusive of both disk and flash ◦ Entire ecosystem of composable elements managed & orchestrated using a common API
framework
◦ Prepared for yet-to-come composable elements – e.g., memory, accelerators
1.1.2.1 Open Composable
The Western Digital Open Composable Infrastructure (OCI) uses a common API to manage and coordinate with all fabric-attached storage including pools of flash and disk. The infrastructure also supports the management of networking and compute resources. The API is used for all managed elements to accelerate the ability to use disaggregated resources where components are no longer sub­components, but core elements connected to the network.
1.1.2.2 Open Composable API (OCAPI)
Western Digital’s Open Composable API is a RESTful interface for OpenFlex that enables a Unified Fabric Control Plane for Storage Fabric Devices. This allows for composing disaggregated storage resources— with compute, networking, and memory—into virtual systems in the future. These virtual systems will be dynamically provided to the right application at the right time, ensuring SLAs can be met automatically.
• Volume management (create / modify / delete namespaces, format media)
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• Monitor hardware sensors (temperatures, voltages, fan speeds, hardware state)
• Configure hardware (update firmware, reboot individual components or systems, assert LEDs)
• Monitor performance (statistics, bandwidth, IOPS, latency)
• Capture inventory data (serial number, part number, etc.)
• Capture log information
• Configure policies (user access lists, authentication, LUN masking, HTTPS/TLS encryption/security
with certificate/key settings)
• Self-discovery of other locally-available resources configurable using the Open Composable API for OpenFlex
1.1.2.3 OCGUI
The Open Composable Graphical User Interface (OCGUI) is the graphical representation of all of the data shared up to the fabric by the OCAPI. This GUI is presented to the user by browsing to the IP address of any device on the fabric. The GUI has a "command-center" design layout that presents all vital health, utilization, and performance statistics related to devices on the network at a glance.
1.1.3

NVMe-oF

1. Overview
1.1 OpenFlex™ F3100 and E3000
1.1.4
Non-Volatile Memory Express over Fabric (NVMe-oF) is one of the primary enabling technologies for the OpenFlex platform. NVMe-oF enables the high-speed, low-latency storage performance of NVMe over a fabric switching network. OpenFlex products drive network communications across the fabric using 100Gb/s Ethernet protocol. This allows for a complex network of computing devices to all share the same storage resources with very high performance.

Supported SKUs

The following table lists the versions of this Western Digital product that are supported by this document.
Table 1: List of Supported SKUs
Component Capacity SKU
OpenFlex E3000 Chassis 3U10 Enclosure N/A 1ES1778
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 12.8TB 1EX2413
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 15.36TB 1EX2416
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 25.6TB 1EX2414
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 30.72TB 1EX2417
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 51.2TB 1EX2415
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 61.44TB 1EX2418
1.1.5

List of Compatible Devices

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Table 2: Devices
1. Overview
1.2 System Architecture Overview
Device Volume Bandwidth *Drive Writes Encryption
OpenFlex F3100 Fabric Device 12.8TB 12GB/s RI-2DW/D ISE 1EX2413
OpenFlex F3100 Fabric Device 15.36TB 12GB/s RI-0.8DW/D ISE 1EX2416
OpenFlex F3100 Fabric Device 25.6TB 12GB/s RI-2DW/D ISE 1EX2414
OpenFlex F3100 Fabric Device 30.72TB 12GB/s RI-0.8DW/D ISE 1EX2417
OpenFlex F3100 Fabric Device 51.2TB 12GB/s RI-2DW/D ISE 1EX2415
OpenFlex F3100 Fabric Device 61.44TB 12GB/s RI-0.8DW/D ISE 1EX2418
1.2 System Architecture Overview
1.2.1

System High Speed Data Ingest Architecture

The system main data ingest architecture uses two separate 50G Ethernet connections each on a dual QSFP28 connector on the rear I/O of the chassis. This completes the connection from the device that is inserted into a chassis slot, through the backplane into the QSFP connectors. The architecture supports the hot swap nature of the devices and do not require any sort of shut down or disconnection before servicing. Each 100G Ethernet connection is split in half at the QSFP28 connectors resulting in 50G per connector allowing for dual port functionality with the device.
Part
Number
1.2.2
Figure 2: System High Speed Data Ingest

System Thermal and Cooling

The following image displays the thermal zones as viewed from the top of the enclosure. When viewing the enclosure from the front, the right device zone is on the right-hand side and the left device zone is on the left-hand side. When viewing the enclosure from the rear, the order is reversed. Each of the two thermal zones contains major components that are thermally maintained within their specific zone.
* Bandwidth obtained by sequential read
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Figure 3: System Thermal Zones
1. Overview
1.2 System Architecture Overview
The E3000 uses a base algorithm, called a thermal algorithm, to control the overall thermal environment of the system. The system is mechanically separated into two thermal zones to support efficient cooling of the system components in order to achieve the intended performance of the system. The thermal zones are split into device zones (the left and right side of the enclosure) and center zone when standing at the front of the system. The device thermal zones contain up to ten devices or device blanks each that are cooled by four fan modules that are located directly behind the devices. The four fan modules behind the devices maintain the cooling for devices contained within the device slot installed into A through J. The center thermal zone contains the BMC module that is cooled by the fans contained in the redundant PSUs the are located directly behind the BMC module. The different thermal zones are designed to maintain proper thermal cooling across the entire system. During servicing the system increases the speed of the fan modules and PSU fans to maintain a balanced thermal load.
1.2.2.1 System Thermal Algorithm
The System Thermal Algorithm is designed to use temperature sensors and defined thresholds to determine if the algorithm will select critical, increase, decrease, or no change as the device decision.
The System Thermal Algorithm uses the concept of priorities to ensure the proper function of the system. As a result, any critical fault results in the system ramping the fans to maximum RPMs to protect the hardware for the duration of the fault. The fault will remain in a critical state until the fault is fully resolved and by bringing the temperature back within the specified defined thresholds.
The System Thermal Algorithm contains minimum and maximum thresholds related to the ambient temperature of the system. The system is designed to maintain a maximum ambient temperature of 35°C. Exceeding 35°C may result in damage to the hardware and potentially void the product warranty. These thresholds allow for the best possible operating conditions. If the system goes outside of the minimum or maximum threshold window, the BMC will adjust the fan speed to accommodate the issue and a fault will be reported. The following table lists the Thermal Algorithm Thresholds along with the related fault levels and threshold values.
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The following table lists the different severity of thermal algorithm critical faults that are reported to the user.
Table 3: Thermal Algorithm Critical Faults
1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
Component Critical Faults
Device Any sensor >= critical
BMC
The following table lists the device decision values that the system chooses from during operation. It describes how the pulse width modulation (PWM) of the power that is being distributed to the cooling fans reacts to different fault types.The fault will be reported based on the severity of the thermal issue.
Not installed FAN
Not installed PSU
Not installed Device or Blank
Not installed BMC
Any sensor >= criticalPSU
Any critical status on SMBus
Table 4: Thermal Algorithm Device Decision for Fan Control
Fault Sensor Value Fan Response
Critical Sensor >= Critical 100% PWM
Increase Sensor >= Max PWM + increase step
Decrease Sensor <= Min PWM - decrease step
No Change Min < Sensor < Max Hold PWM
1.3 OpenFlex F3100 and E3000 Specification Summary
Table 5: Environmental Specifications
Specification Non-Operational Operational
Temperature -30°C to 60°C 5°C to 35°C
Temperature Gradient 30°C per hour max 20°C per hour max
Temperature De-rating 1°C per 300m above 3000m 1°C per 175m above 950m
Relative Humidity 5-95% Non-Condensing 8-85% Non-Condensing
Relative Humidity Gradient 30% per hour maximum 30% per hour maximum
Altitude -300m to 12,000m / -984 ft. to
39,370 ft
-300m to 3048m / -984 ft. to 10,000 ft.
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Cooling N/A 4 Fan Modules (N+1 Supported),
Table 6: Electrical Specifications
Max Power Consumption 1600W
Typical Power Consumption ~1400W
Input Voltage 200V - 240V
PSU Connector Type C16
Inrush Current Maximum (per PSU) AC line inrush current shall not exceed 40A peak,
PSU Efficiency 80 PLUS Platinum
1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
Specification Non-Operational Operational
containing two fans per module
Specification Value
for up to one-quarter of the AC cycle after which, the input current should be no more than the specified maximum input current.
Table 7: Mechanical Specifications
Specification Non-Operational Operational
Shock 20G, 7ms half sine; 3 positive
and 3 negative pulses in each axis Z and Y. X axis- 15G, 7ms half sine, 3 positive and 3 negative pulses
Vibration Linear Random: 0.50Grms;
5-500Hz; 10 minutes each axis in X, Y, and Z Linear Random: 0.54Grms; 1-200Hz; 60 minutes in Z axis. Linear Random: 0.80Grms; 2 ­ 200Hz; 15 minutes in Z axis Swept Sine: 0.50G, 0 - peak swept sine; 5 - 500Hz; 1 complete sweep @ 1/2 octave per minute
Weight 68.5 kg / 151.1 lbs.
Dimensions W: 447.2 mm x L: 828.04 mm x H: 130.9 mm / W: 17.6 in. x L: 32.6 in.
x H: 5.2 in.
5G, 11ms half sine; 3 positive and 3 negative pulses in each axis­minimum 6 seconds between shocks
Linear Random: 0.15 Grms 5-500 Hz 10 minutes each axis in X, Y and Z Swept Sine:0.17 G, 0 - peak, 5-500 Hz 0.5 octaves/min, approx. 13 minutes each axis
System Installation Length 778 mm / 30.6 in. from the front rack chassis mounts to the rear of
the system
Required Rack Depth 1000 mm (39.4 in.) of usable rack space, frame to frame
Required Rack Width 450mm (17.72in.) with 465mm (18.31in.) ± 1.5mm nominal hole
spacing. See EIA-310 Rack Standard
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Rack Units (U) 3U
Vertical Rack Rail Spacing 718 mm – 850 mm / 28.26 in. – 33.46 in.
Table 8: Performance Specifications
Number of Device Slots 10 Dual-port Fabric Device Bays
Data Transfer Rates 12GBps NVMe-oF
Max Raw Data Storage Capacity 614TB
Ethernet Ports 20 x 50Gbps QSFP28 ( 2 per Fabric Device)
Table 9: Performance Specifications by CRU P/N
1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
Specification Non-Operational Operational
Specification Value
 *
1 x 10/100/1G Ethernet
CRU P/N 1EX2413 1EX2416 1EX2414 1EX2417 1EX2415 1EX2418
Capacity/
Endurance
Random Read
(4KB, QD=1024)
Random Write
(4KB, QD=1024)
Random Mixed
70R/30W
(4KB, QD=1024)
Sequential Read
(128KB, QD=320)
Sequential Write (128KB, QD=320)
Random Write
Latency
(4KB, QD=1, 99.99%)
Notes on Testing:
• Latency measured through a single Mellanox SN2700 switch
• K IOPs = IOPs x 1000
• Devices pre-conditioned with 2 full sequential fills
12.8TB
1-2DWPD
2199K
IOPs
1493K
IOPs
2199K
IOPs
11.8 GB/s 11.7 GB/s 11.7 GB/s 11.7 GB/s 11.7 11.7 GB/s
9.9 GB/s 9.9 GB/s 9.9 GB/s 9.4 GB/s 9.4 GB/s 9.9 GB/s
33.9 us 33.7 us 33.7 us 33.9 us 33.7 33.5 us
15.36TB
0.8DWPD
2111K
IOPs
1433K
IOPs
2137K
IOPs
25.6TB
2DWPD
2164K
IOPs
1431K
IOPs
2183K
IOPs
30.72TB
0.8DWPD
2160K
IOPs
1397K
IOPs
2188K
IOPs
51.2TB
0.8DWPD
2176K
IOPs
1464K
IOPs
2227K
IOPs
61.44TB
0.8DWPD
2191K
1
IOPs
1400K
1
IOPs
2251K
IOPs
* Max storage capacity depends on device version and device configuration.
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Table 10: Acoustic Specifications
1. Overview
1.4 Physical Design
Quantities Declared
A-weighted sound power level1, L
WAd
{1 B = 10
Idle
Mode
8.5 8.5 9.6 9.6
Operating
Mode
Fan Fail
Mode
5
Max Fan
Mode
dB}
Average A-weighted emission sound pressure level2, L
(dB) {bystander position3}
pAm
66.0 66.0 74.9 76.2
Statistical adder for verification4, K (dB) 2.5 2.5 2.5 2.5
Notes on Acoustic Testing Methodology and Environment:
1
Declared A-weighted sound power level for a single machine, calculated per section 4.4.2 of ISO
9296-1988 and measured per ISO 3744
2
Declared A-weighted sound pressure level for a single machine, calculated per section 4.4.4 of
ISO-9296-1988 and measured per ISO 3744
3
The front and rear of the UUT were selected for the bystander location, due to access typically from the cool or hot isle in a data center. This does not meet the four bystander positions as specified in ECMA-74 2012, but the microphones were adjusted to the preferred location.
4
The statistical adder, K, accounts for random measurement error, and is equal to 2.5 dB, which is appropriate for a 5% risk of rejection for SR = 1.5 dB per section 4.4.2 of ISO 9296-1988.
5
At steady state condition, system/PSU fans reached 100% pwm speeds during fan fail mode testing.
• Background noise: <7dBA
• Environmental test conditions: ~23° C, 57% RH, 101.3 kPa
• Tested configuration: 3U NVMeOF VBOF device with 10 devices installed.
1.4 Physical Design
The OpenFlex F3100 and E3000 physical design emphasizes easy access to hot-swappable components, maximization of data storage capacity in the rack, and bold aesthetic design.
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Figure 4: OpenFlex F3100 and E3000 Layout
1. Overview
1.4 Physical Design
The enclosure measures 447.2 mm/17.6 in. wide by 828.04 mm/32.6 in. long. It's height is 130.9 mm/5.2 in. or 3U. The chassis installation length is 778 mm / 30.6 in. from the front rack chassis mounts to the rear of the system.
Figure 5: OpenFlex F3100 and E3000 Dimensions
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1.4.1

LEDs

Chassis LEDs
Figure 6: Chassis Rear IO LEDs
1. Overview
1.4 Physical Design
Table 11: Chassis Rear IO LED Flash Patterns
LED Name Color Behavior
Ethernet Link/Activity Green Off: No Connection
Solid: Connected Blink: Activity
Ethernet Speed
Identification Blue
QSFP28 LED
Green Off: Operating at 10 Mbps
Solid: Operating at 100 Mbps
Amber Off: Operating at 10 Mbps
Solid: Operating at 1Gpbs
Blink @ 1 Hz: Blinks only when Identification has
been activated. Will blink when any component is identified, e.g. Fans, PSUs, etc.
Off: Enclosure not being identified/located
Green
Amber
Solid: Link operating at maximum speed
Blink (3Hz): Link activity
Off: Default state
Solid: Link operating at a lower speed, 50G or
less
Blink (3Hz): Low speed link activity
Blink (1Hz): On/Off - Identify
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PSU LED
1. Overview
1.4 Physical Design
LED Name Color Behavior
Power Green Solid:Enclosure is powered on
Off:Enclosure is powered off
Fault Amber Blink @ 2 Hz: Enclosure has a fault
Off: Enclosure has no fault
Figure 7: PSU LED
Fan Module LED
Table 12: PSU LED Flash Patterns
LED Name Color Behavior
Multi-
function LED
Green Solid: PSU is on and
reporting no faults Blinking @ 2Hz: PSU in firmware update mode Off: PSU is disconnected from power
Amber Solid: PSU is
disconnected from power or critical fault causing a shutdown failure Blinking @ 0.5Hz: PSU reporting warnings Off: PSU is reporting no faults
Figure 8: Fan Module LED
Table 13: Fan Module LED Flash Patterns
LED Name Color Behavior
LED Amber Blinking @ 2 Hz: Fan is
reporting a fault Blinking @ 1 Hz: Fan is being identified Off: Fan is on and reporting no faults
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BMC Module LEDs
1. Overview
1.4 Physical Design
Figure 9: BMC Module LEDs
Table 14: BMC Module LED Flash Patterns
LED Name Color Behavior
Identification Blue Blink @ 1 Hz:
Blinks only when Identification has been activated. Will blink when any component is identified.
Fault Amber Blink @ 2 Hz:
Enclosure has a fault Off: Default State
Power Green Solid: Powered On
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OpenFlex F3100 LEDs
1. Overview
1.4 Physical Design
Figure 10: OpenFlex F3100 LEDs
Table 15: OpenFlex F3100 LED Flash
Patterns
LED Name Color Behavior
Device Status
Power Green On: Device is
Fault Amber Blink @ 1 Hz:
White Solid: On and
Connected Off: Not Ready or Powered down
Blue Blink @ 1 Hz:
OpenFlexF3100 is flushing the cache Off: Default State
Powered On Off: Device is Powered Down
Device has a fault Solid: Device is Powered Down Off: Device has no fault
Identification Blue Blink @ 1
Hz: Blinks only when Identification has been activated. Off: Device is not being identified.
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1.4.2

Cables

The following table displays the power cable supported by Western Digital:
Table 16: Approved Power Cables
1. Overview
1.5 Restrictions and Limitations
Type Part Number Length
IEC C14 to IEC C15 Heavy
Duty 15A Power Cable
The following table displays the Ethernet cables approved by Western Digital:
Note: These cables are approved, but not provided by Western Digital.
(Provided in Accessory Kit) 6 ft.
Table 17: Approved Ethernet Cables
Vendor Active/Passive Vendor Model Number
Mellanox
Amphenol
Passive MCP1600-C001
Passive MCP1600-C002
Passive MCP1600-C003
Active MFA1A00-C005
Passive NDARHG-0001
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Part Number
1.5 Restrictions and Limitations
The OpenFlex F3100 and E3000 have the following restrictions and limitations on functionality:
• All E3000 chassis must be full for proper airflow. This means that if there is only one device installed, the rest of the device slots must be filled with device blanks.
• If the BMC Module is not installed in the E3000 chassis, F3100 devices cannot be added or slot swapped.
• Only hot-swap a single component at a time. Never remove more than one at a time.
• VLAN tagging is not supported.
• RoCE v1 is not supported. F3100 will support RoCE v2 only.
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User Guide
• To power off an F3100, browse directly to the F3100. Power off cannot be done from the E3000. To power back on the F3100, browse to the E3000.
• IPv4 networking only.
• Only one browser session allowed to an individual F3100 device.
• Enforced maximum limits on configuration
◦ 256 Volumes ◦ 256 Hosts ◦ 2048 Queue Pairs ◦ 128 Queue Pairs (1 Admin, 127 IO) per connection ◦ 64 max queue depth per IO Queue Pair
1.6 Site Requirements
1.6.1

Power Requirements

The E3000 is equipped with redundant PSU units. The PSUs are hot-swappable and are located at the rear of the chassis. The following is a specification summary. Note that the system does not support lowline voltage.
1. Overview
1.6 Site Requirements
1.6.2
Table 18: Power Specification
Specification Value
Power Output 1600W
Input Voltage 200V - 240V
80 PLUS Standard Platinum
Connector Type C16

Rack Requirements

The E3000 is designed to be installed into a rack that meets the EIA-310 standard with a minimum of 1000 mm (39.4 in.) of usable rack space, frame to frame. The vertical rack rails must be set between 718 mm – 850 mm / 28.26 in. – 33.46 in. to support the enclosure. It requires 3U of rack space, and it should be installed into the rack at the lowest possible U height to keep the load on the rack balanced.
Table 19: Required Rack Specifications
Parameter Requirement
Rack Depth 1000 mm (39.4 in.) of usable rack space, frame to
frame
Rack Width 450mm (17.72in.) with 465mm (18.31in.) ± 1.5mm
nominal hole spacing. See EIA-310 Rack Standard
Rack Units (U) 3U
Vertical Rack Rail Spacing 718 mm – 850 mm / 28.26 in. – 33.46 in.
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User Guide
Static Load Rating Rack meets ISTA 3E or 3B test requirements and
Dynamic Load Rating Rack meets ISTA 3E or 3B test requirements and
1.6.3

Thermal and Cooling Requirements

The thermal output of the OpenFlex F3100 and E3000 depends on the number of F3100s that are populated in the E3000. Use the following table to determine how many BTUs of heat will exhaust from the rear of the unit.
Table 20: BTU Exhaust per Component
1. Overview
1.6 Site Requirements
Parameter Requirement
regulations when mounted to the shipping pallet
regulations when mounted to the shipping pallet
Condition Typical BTU Output Max BTU Output
1.6.4
Single E3000 w/ BMC Module 768 BTU/hr = 225 W
(25C/77F, fans at 50%)
Single F3100 409 BTU/hr = 120 W
(25C/77F, Workload: Random Read/Write, queue depth 32, 80% internal processors dedicated to workload)
E3000 Fully Populated with F3100s

Servicing Requirements

Space Requirements
The installation of the OpenFlex F3100 and E3000 will require enough space in front of the rack for two people to perform a safe installation. The recommended forward clearance is 889 mm / 35 in. from the front of the rack and 609.6 mm / 24 in. on both sides of the enclosure. It is also recommended to make considerations for any carts or lift equipment that might be used to perform the installation. * The servicing of the enclosure requires one person and a minimum of 508 mm / 20 in. of space in front of the rack to allow enough clearance to remove an F3100 from the enclosure. See the following diagram for details.
5244 BTU/hr = 1537 W (25C/77F, fans at 50%)
1177 BTU/hr = 345 W (35C/95F, fans at 100%)
546 BTU/hr = 160 W (35C/95F, workload: Highest throughput to drives – Seq Write, queue depth 32, all internal processors at 100%)
5884 BTU/hr = 1725 W (35C/95F, fans at 100%)
* The weight of the enclosure during installation will vary, depending on the number of F3100 devices and blanks contained in the E3000. In some situations, carts or lift equipment may be required.
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User Guide
Figure 11: Installation and Servicing Space
1. Overview
1.6 Site Requirements
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Western Digital

Components

In This Chapter:
- Chassis........................................................... 21
- PSU.................................................................22
- Fan Module....................................................23
- BMC Module..................................................24
- Rails................................................................25
- OpenFlex F3100............................................26
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User Guide
2.1 Chassis
The OpenFlex E3000 chassis is the primary housing that contains and connects all of the system components that comprise the OpenFlex F3100 and E3000 . The chassis contains one BMC Module in the front, and the rear contains two redundant PSUs and four Fan Modules that come preinstalled in the chassis. The chassis also contains ten device slots that can be populated with approved OpenFlex™ components. The E3000 is installed and secured onto shelf style rail mounts. The rear IO houses the primary connections such as power and QSFP28 ports and the status LEDs for all of the components.
2.1.1

Chassis Specifications

2. Components
2.1 Chassis
Table 21: Chassis Specification Summary
Specification Value
Rack Units 3U
Number of Device Slots
Number of BMC Slots 1
Part Number 1EX1919
Hot Swappable? No
Dimensions W: 447.2 mm x L:
Weight 38.2 lbs / 17.32 kg
10
828.04 mm x H: 130.9 mm / W: 17.6 in. x L:
32.6 in. x H: 5.2 in.
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User Guide
2.2 PSU
The OpenFlex E3000 chassis contains toolless redundant 1600W Power Supply Units (PSU). Each PSU requires an input voltage of between 200V - 240V. The PSUs are certified 80 PLUS Platinum and use the C16 connector type. Due to the redundant nature of the PSUs, they may be serviced or replaced, one at a time, while the enclosure is powered on.
2.2.1

PSU Specifications

2. Components
Table 22: PSU Specification Summary
Specification Value
Power Output 1600W
Input Voltage 200V - 240V
80 PLUS Standard Platinum
Connector Type C16
2.2 PSU
Internal Fan Speed Up to 25,000 RPM
Number per Enclosure 2
Part Number 1EX1916
Hot Swappable? Yes
Service Window 5 minutes
Dimensions
Weight 2.31 lbs. / 1.05 kg
W: 54.5 mm x L: 321.5 mm x H: 40.1 mm
W: 2.15 in. x L: 12.66 in. x H: 1.58 in.
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User Guide
2.3 Fan Module
The OpenFlex E3000 contains four toolless Fan Modules to maintain the cooling across the entire system. The Fan Modules are connected to the rear of the Chassis using a handle to seat the module in place and captive screw to secure the Fan Module into the fan bay. Due to the redundant nature of the Fan Modules, they may be serviced or replaced, one at a time, while the enclosure is powered on. The Fan Modules will accelerate to maximum RPM while the BMC Module or devices are removed during servicing or replacement.
2.3.1

Fan Module Specifications

2. Components
2.3 Fan Module
Table 23: Fan Module Specification Summary
Specification Value
Rated Voltage 12V
Fan Speed 12000 RPM
Acoustics 76 dB measured at 1
meter from the fan inlet
Number per Enclosure 4 Fan Modules
containing two rotors per module
Part Number 1EX1915
Hot Swappable? Yes
Service Window 5 minutes
Dimensions
Weight 1.76 lbs. / 0.8 kg
W: 92.74 mm x L: 127.2 mm x H: 85.2 mm
W: 3.65 in x L: 5.01 in x H: 3.35 in
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User Guide
2.4 BMC Module
The OpenFlex E3000 contains a toolless BMC Module that is installed into the center slot at the front of the Chassis. The BMC Module is accessed using a 1GBe Ethernet management RJ45 port on the rear IO of the Chassis. The BMC Module enables out of band management (OOBM) using a RESTful interface (via HTTP or HTTPS). OOBM controls the actions between devices and the BMC Module for powering down, setting system configurations, and the cooling algorithm for the Fan Modules. The BMC Module may be serviced or replaced while the enclosure is powered on as long as it is replaced within five minutes of removing it from the slot. Replacing a BMC module will not effect data flow to devices.
2.4.1

BMC Module Specifications

2. Components
2.4 BMC Module
Table 24: BMC Module Specification Summary
Specification Value
Input Current 2A Maximum
Input Power 25W
Rated Voltage 12V +/- 10%
Number per Enclosure 1 installed in the center
device slot
Part Number 1EX1917
Hot Swappable? Yes
Service window 5 minutes
Dimensions
Weight 3.26 lbs. / 1.48 kg
W: 55.6 mm x L: 459.12 mm x H: 126.94 mm
W: 2.19 in x L: 18.08 in x H: 5 in
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