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User Guide
OpenFlex™ F3100 and E3000
1ET2050
Version 1.0
October 2019
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User Guide Table of Contents
Table of Contents
Copyright................................................................................................................................................................................... iv
Points of Contact.......................................................................................................................................................................v
Chapter 1. Overview........................................................................................................................................................................ 1
OpenFlex™ F3100 and E3000.................................................................................................................................................. 2
Servicing Features.............................................................................................................................................................. 3
Composable Infrastructures...............................................................................................................................................3
NVMe-oF..............................................................................................................................................................................4
Supported SKUs................................................................................................................................................................. 4
List of Compatible Devices............................................................................................................................................... 4
System Architecture Overview................................................................................................................................................. 5
System High Speed Data Ingest Architecture.................................................................................................................5
System Thermal and Cooling............................................................................................................................................5
OpenFlex F3100 and E3000 Specification Summary.............................................................................................................. 7
Physical Design.........................................................................................................................................................................10
LEDs....................................................................................................................................................................................12
Cables................................................................................................................................................................................ 16
Restrictions and Limitations.....................................................................................................................................................16
Site Requirements.....................................................................................................................................................................17
Power Requirements......................................................................................................................................................... 17
Rack Requirements............................................................................................................................................................17
Thermal and Cooling Requirements............................................................................................................................... 18
Servicing Requirements....................................................................................................................................................18
Chapter 2. Components............................................................................................................................................................... 20
Chassis.......................................................................................................................................................................................21
Chassis Specifications.......................................................................................................................................................21
PSU............................................................................................................................................................................................ 22
PSU Specifications............................................................................................................................................................22
Fan Module...............................................................................................................................................................................23
Fan Module Specifications............................................................................................................................................... 23
BMC Module............................................................................................................................................................................. 24
BMC Module Specifications.............................................................................................................................................24
Rails........................................................................................................................................................................................... 25
Rails Specifications...........................................................................................................................................................25
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OpenFlexF3100......................................................................................................................................................................... 26
OpenFlexF3100 Specifications.........................................................................................................................................26
OpenFlex E3000 Fabric Device Blank.................................................................................................................................... 27
OpenFlex E3000 Fabric Device Blank Specifications.................................................................................................... 27
List of Field/Customer Replaceable Units.............................................................................................................................28
Chapter 3. Management............................................................................................................................................................... 29
OCGUI.......................................................................................................................................................................................30
Login Page........................................................................................................................................................................30
Dashboard.........................................................................................................................................................................30
Storage Device Page....................................................................................................................................................... 35
Chassis Device Page........................................................................................................................................................ 42
Basic Operational Functions............................................................................................................................................ 49
Power Cycling................................................................................................................................................................... 74
Firmware Upgrade............................................................................................................................................................ 75
Part Replacement.....................................................................................................................................................................81
Fan Module Replacement................................................................................................................................................ 82
PSU Replacement.............................................................................................................................................................84
BMC Module Replacement.............................................................................................................................................. 88
OpenFlexF3100 Replacement...........................................................................................................................................91
Rails Replacement............................................................................................................................................................95
Chassis Replacement.......................................................................................................................................................113
Chapter 4. Safety......................................................................................................................................................................... 135
Electrostatic Discharge.......................................................................................................................................................... 136
Optimizing Location............................................................................................................................................................... 136
Power Connections................................................................................................................................................................ 136
Power Cords........................................................................................................................................................................... 136
Rackmountable Systems........................................................................................................................................................ 137
Restricted Access Location................................................................................................................................................... 137
Safety and Service..................................................................................................................................................................137
Safety Warnings and Cautions.............................................................................................................................................. 138
Chapter 5. Regulatory................................................................................................................................................................. 139
Europe (CE Declaration of Conformity)................................................................................................................................140
FCC Class A Notice............................................................................................................................................................... 140
ICES-003 Class A Notice—Avis NMB-003, Classe A........................................................................................................... 140
Japanese Compliance Statement, Class A ITE.................................................................................................................... 140
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KCC Notice (Republic of Korea Only), Class A ITE............................................................................................................. 140
Taiwan Warning Label Statement, Class A ITE.....................................................................................................................141
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User Guide Copyright
Copyright
The following paragraph does not apply to the United Kingdom or any country where such provisions
are inconsistent with local law: Western Digital a Western Digital company PROVIDES THIS PUBLICATION
"AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED
TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some
states do not allow disclaimer or express or implied warranties in certain transactions, therefore, this
statement may not apply to you.
This publication could include technical inaccuracies or typographical errors. Changes are periodically made
to the information herein; these changes will be incorporated in new editions of the publication. Western
Digital may make improvements or changes in any products or programs described in this publication at any
time.
It is possible that this publication may contain reference to, or information about, Western Digital products
(machines and programs), programming, or services that are not announced in your country. Such references
or information must not be construed to mean that Western Digital intends to announce such Western Digital
products, programming, or services in your country.
Technical information about this product is available by contacting your local Western Digital representative
or on the Internet at: support@wdc.com
Western Digital may have patents or pending patent applications covering subject matter in this document.
The furnishing of this document does not give you any license to these patents.
Long Live Data™ is a trademark of Western Digital, Inc. and its affiliates in the United States and/or other
countries.
Western Digital trademarks are authorized for use in countries and jurisdictions in which Western Digital
has the right to use, market and advertise the brands. Other product names are trademarks or registered
trademarks of their respective owners.
One MB is equal to one million bytes, one GB is equal to one billion bytes, one TB equals 1,000GB (one trillion
bytes) and one PB equals 1,000TB when referring to storage capacity. Usable capacity will vary from the raw
capacity due to object storage methodologies and other factors.
References in this publication to Western Digital products, programs or services do not imply that Western
Digital intends to make these available in all countries in which Western Digital operates.
Product information is provided for information purposes only and does not constitute a warranty.
Information is true as of the date of publication and is subject to change. Actual results may vary. This
publication is for general guidance only. Photographs may show design models.
Western Digital
5601 Great Oaks Parkway
San Jose, CA 95119
© 2019 Western Digital Corporation or its affiliates.
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User Guide Points of Contact
Points of Contact
For further assistance with a Western Digital product, contact Platform Engineering technical support. Please
be prepared to provide the following information: part number (P/N), serial number (S/N), product name
and/or model number, and a brief description of the issue.
Email:
support@wdc.com
Website:
https://portal.wdc.com/Support/s/
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Western Digital
Overview
In This Chapter:
- OpenFlex™ F3100 and E3000.......................2
- System Architecture Overview.....................5
- OpenFlex F3100 and E3000 Specification
Summary........................................................... 7
- Physical Design............................................. 10
- Restrictions and Limitations........................ 16
- Site Requirements.........................................17
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1.1 OpenFlex™ F3100 and E3000
The OpenFlex™ F3100 and E3000 is a 3U rack
mounted data storage enclosure built on the
OpenFlex platform. OpenFlex is Western Digital’s
architecture that supports Open Composable
Infrastructure (OCI). The OpenFlex F3100 and
E3000 are fabric devices that leverage this OCI
approach in the form of disagreggated data storage
using NVMe-over-Fabrics (NVMe-oF). NVMe-oF is
a networked storage protocol that allows storage
to be disaggregated from compute to make that
storage widely available to multiple applications
and servers. By enabling applications to share a
common pool of storage capacity, data can be easily
shared between applications, or needed capacity
can be allocated to an application regardless of location. Exploiting NVMe device-level performance,
NVMe-oF promises to deliver the lowest end-to-end latency from application to shared storage. NVMeoF enables composable infrastructures to deliver the data locality benefits of NVMe DAS (low latency, high
performance) while providing the agility and flexibility of sharing storage and compute.
The maximum data storage capacity is 614TB * when leveraging a full set of 10 F3100 fabric devices.
The enclosure runs on an input voltage of 200V - 240V and consumes ~1400W of power under typical
conditions. It requires a maximum of 1600W at full load.
1. Overview
1.1 OpenFlex™ F3100 and E3000
Composable Infrastructure
An emerging category of
datacenter infrastructure that
seeks to disaggregate compute,
storage, and networking fabric
resources into shared resource
pools that can be available
for on-demand allocation (i.e.,
“composable”). Composability
occurs at the software level,
disaggregation occurs at the
hardware level using NVMe™over-Fabric—will vastly improve
compute and storage utilization,
performance, and agility in the
data center.
• 614TB
• 12GBps NVMe-oF over QSFP28
• 68.5 kg / 151.1 lbs.
*
Cables
OpenFlex
OpenFlex is Western Digital’s
architecture that supports Open
Composable Infrastructure
through storage disaggregation
– both disk and flash natively
attached to a scalable fabric.
OpenFlex does not rule out
multiple fabrics, but whenever
possible, Ethernet will be used as
a unifying connect for both flash
and disk because of its broad
applicability and availability.
• 200V - 240V Input Voltages
• 3U Form Factor
• Hot-swappable PSUs and Fans
Open Composable API
Western Digital's new Open
Composable API is designed
for data center composability.
It builds upon existing industry
standards utilizing the best
features of those standards as
well as practices from proprietary
management protocols.
• Dual 1600W PSUs
• Operational Temperature: 5°C to
35°C
• Dynamic Provisioning Supported
* Max storage capacity depends on device version and device configuration.
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1.1.1
1.1.2
Servicing Features
The OpenFlex F3100 and E3000 are equipped with several features that make servicing simpler and safer.
Every CRU component has been designed with toolless removal features.
The BMC Module, Fan Module, PSU, and F3100 devices are all hotswappable components. This document
provides full instructions on how these features operate in the Management (page 29) section.
Composable Infrastructures
An emerging category of datacenter infrastructure that seeks to disaggregate compute, storage, and
networking fabric resources into shared resource pools that can be available for on-demand allocation (i.e.,
“composable”). Composable occurs at the software level, disaggregation occurs at the hardware level.
Western Digital’s vision for Open Composable Infrastructures is based on four key pillars:
• Open
1. Overview
1.1 OpenFlex™ F3100 and E3000
◦ Open in both API and form factor
◦ Designed for robust interoperability of multi-vendor solutions
• Scalable
◦ Ability to compose solutions at the width of the network
◦ Enable self-organizing systems of composable elements that communicate horizontally
• Disaggregated
◦ Pools of resources available for any use case that is defined at run time
◦ Independent scaling of compute & storage elements to maximize efficiency & agility
Extensible
•
◦ Inclusive of both disk and flash
◦ Entire ecosystem of composable elements managed & orchestrated using a common API
framework
◦ Prepared for yet-to-come composable elements – e.g., memory, accelerators
1.1.2.1 Open Composable
The Western Digital Open Composable Infrastructure (OCI) uses a common API to manage and
coordinate with all fabric-attached storage including pools of flash and disk. The infrastructure also
supports the management of networking and compute resources. The API is used for all managed
elements to accelerate the ability to use disaggregated resources where components are no longer subcomponents, but core elements connected to the network.
1.1.2.2 Open Composable API (OCAPI)
Western Digital’s Open Composable API is a RESTful interface for OpenFlex that enables a Unified Fabric
Control Plane for Storage Fabric Devices. This allows for composing disaggregated storage resources—
with compute, networking, and memory—into virtual systems in the future. These virtual systems will be
dynamically provided to the right application at the right time, ensuring SLAs can be met automatically.
• Volume management (create / modify / delete namespaces, format media)
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• Monitor hardware sensors (temperatures, voltages, fan speeds, hardware state)
• Configure hardware (update firmware, reboot individual components or systems, assert LEDs)
• Monitor performance (statistics, bandwidth, IOPS, latency)
• Capture inventory data (serial number, part number, etc.)
• Capture log information
• Configure policies (user access lists, authentication, LUN masking, HTTPS/TLS encryption/security
with certificate/key settings)
• Self-discovery of other locally-available resources configurable using the Open Composable API for
OpenFlex
1.1.2.3 OCGUI
The Open Composable Graphical User Interface (OCGUI) is the graphical representation of all of the data
shared up to the fabric by the OCAPI. This GUI is presented to the user by browsing to the IP address
of any device on the fabric. The GUI has a "command-center" design layout that presents all vital health,
utilization, and performance statistics related to devices on the network at a glance.
1.1.3
NVMe-oF
1. Overview
1.1 OpenFlex™ F3100 and E3000
1.1.4
Non-Volatile Memory Express over Fabric (NVMe-oF) is one of the primary enabling technologies for the
OpenFlex platform. NVMe-oF enables the high-speed, low-latency storage performance of NVMe over
a fabric switching network. OpenFlex products drive network communications across the fabric using
100Gb/s Ethernet protocol. This allows for a complex network of computing devices to all share the same
storage resources with very high performance.
Supported SKUs
The following table lists the versions of this Western Digital product that are supported by this document.
Table 1: List of Supported SKUs
Component Capacity SKU
OpenFlex E3000 Chassis 3U10 Enclosure N/A 1ES1778
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 12.8TB 1EX2413
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 15.36TB 1EX2416
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 25.6TB 1EX2414
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 30.72TB 1EX2417
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 51.2TB 1EX2415
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 61.44TB 1EX2418
1.1.5
List of Compatible Devices
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Table 2: Devices
1. Overview
1.2 System Architecture Overview
Device Volume Bandwidth *Drive Writes Encryption
OpenFlex F3100 Fabric Device 12.8TB 12GB/s RI-2DW/D ISE 1EX2413
OpenFlex F3100 Fabric Device 15.36TB 12GB/s RI-0.8DW/D ISE 1EX2416
OpenFlex F3100 Fabric Device 25.6TB 12GB/s RI-2DW/D ISE 1EX2414
OpenFlex F3100 Fabric Device 30.72TB 12GB/s RI-0.8DW/D ISE 1EX2417
OpenFlex F3100 Fabric Device 51.2TB 12GB/s RI-2DW/D ISE 1EX2415
OpenFlex F3100 Fabric Device 61.44TB 12GB/s RI-0.8DW/D ISE 1EX2418
1.2 System Architecture Overview
1.2.1
System High Speed Data Ingest Architecture
The system main data ingest architecture uses two separate 50G Ethernet connections each on a dual
QSFP28 connector on the rear I/O of the chassis. This completes the connection from the device that is
inserted into a chassis slot, through the backplane into the QSFP connectors. The architecture supports
the hot swap nature of the devices and do not require any sort of shut down or disconnection before
servicing. Each 100G Ethernet connection is split in half at the QSFP28 connectors resulting in 50G per
connector allowing for dual port functionality with the device.
Part
Number
1.2.2
Figure 2: System High Speed Data Ingest
System Thermal and Cooling
The following image displays the thermal zones as viewed from the top of the enclosure. When viewing
the enclosure from the front, the right device zone is on the right-hand side and the left device zone is
on the left-hand side. When viewing the enclosure from the rear, the order is reversed. Each of the two
thermal zones contains major components that are thermally maintained within their specific zone.
* Bandwidth obtained by sequential read
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Figure 3: System Thermal Zones
1. Overview
1.2 System Architecture Overview
The E3000 uses a base algorithm, called a thermal algorithm, to control the overall thermal environment of
the system. The system is mechanically separated into two thermal zones to support efficient cooling of
the system components in order to achieve the intended performance of the system. The thermal zones
are split into device zones (the left and right side of the enclosure) and center zone when standing at the
front of the system. The device thermal zones contain up to ten devices or device blanks each that are
cooled by four fan modules that are located directly behind the devices. The four fan modules behind the
devices maintain the cooling for devices contained within the device slot installed into A through J. The
center thermal zone contains the BMC module that is cooled by the fans contained in the redundant PSUs
the are located directly behind the BMC module. The different thermal zones are designed to maintain
proper thermal cooling across the entire system. During servicing the system increases the speed of the
fan modules and PSU fans to maintain a balanced thermal load.
1.2.2.1 System Thermal Algorithm
The System Thermal Algorithm is designed to use temperature sensors and defined thresholds to
determine if the algorithm will select critical, increase, decrease, or no change as the device decision.
The System Thermal Algorithm uses the concept of priorities to ensure the proper function of the system.
As a result, any critical fault results in the system ramping the fans to maximum RPMs to protect the
hardware for the duration of the fault. The fault will remain in a critical state until the fault is fully resolved
and by bringing the temperature back within the specified defined thresholds.
The System Thermal Algorithm contains minimum and maximum thresholds related to the ambient
temperature of the system. The system is designed to maintain a maximum ambient temperature of 35°C.
Exceeding 35°C may result in damage to the hardware and potentially void the product warranty. These
thresholds allow for the best possible operating conditions. If the system goes outside of the minimum or
maximum threshold window, the BMC will adjust the fan speed to accommodate the issue and a fault will
be reported. The following table lists the Thermal Algorithm Thresholds along with the related fault levels
and threshold values.
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The following table lists the different severity of thermal algorithm critical faults that are reported to the
user.
Table 3: Thermal Algorithm Critical Faults
1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
Component Critical Faults
Device Any sensor >= critical
BMC
The following table lists the device decision values that the system chooses from during operation. It
describes how the pulse width modulation (PWM) of the power that is being distributed to the cooling
fans reacts to different fault types.The fault will be reported based on the severity of the thermal issue.
Not installed FAN
Not installed PSU
Not installed Device or Blank
Not installed BMC
Any sensor >= criticalPSU
Any critical status on SMBus
Table 4: Thermal Algorithm Device Decision for Fan Control
Fault Sensor Value Fan Response
Critical Sensor >= Critical 100% PWM
Increase Sensor >= Max PWM + increase step
Decrease Sensor <= Min PWM - decrease step
No Change Min < Sensor < Max Hold PWM
1.3 OpenFlex F3100 and E3000 Specification Summary
Table 5: Environmental Specifications
Specification Non-Operational Operational
Temperature -30°C to 60°C 5°C to 35°C
Temperature Gradient 30°C per hour max 20°C per hour max
Temperature De-rating 1°C per 300m above 3000m 1°C per 175m above 950m
Relative Humidity 5-95% Non-Condensing 8-85% Non-Condensing
Relative Humidity Gradient 30% per hour maximum 30% per hour maximum
Altitude -300m to 12,000m / -984 ft. to
39,370 ft
-300m to 3048m / -984 ft. to 10,000
ft.
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Cooling N/A 4 Fan Modules (N+1 Supported),
Table 6: Electrical Specifications
Max Power Consumption 1600W
Typical Power Consumption ~1400W
Input Voltage 200V - 240V
PSU Connector Type C16
Inrush Current Maximum (per PSU) AC line inrush current shall not exceed 40A peak,
PSU Efficiency 80 PLUS Platinum
1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
Specification Non-Operational Operational
containing two fans per module
Specification Value
for up to one-quarter of the AC cycle after which,
the input current should be no more than the
specified maximum input current.
Table 7: Mechanical Specifications
Specification Non-Operational Operational
Shock 20G, 7ms half sine; 3 positive
and 3 negative pulses in each
axis Z and Y. X axis- 15G, 7ms half
sine, 3 positive and 3 negative
pulses
Vibration Linear Random: 0.50Grms;
5-500Hz; 10 minutes each axis in
X, Y, and Z
Linear Random: 0.54Grms;
1-200Hz; 60 minutes in Z axis.
Linear Random: 0.80Grms; 2 200Hz; 15 minutes in Z axis
Swept Sine: 0.50G, 0 - peak
swept sine; 5 - 500Hz; 1
complete sweep @ 1/2 octave
per minute
Weight 68.5 kg / 151.1 lbs.
Dimensions W: 447.2 mm x L: 828.04 mm x H: 130.9 mm / W: 17.6 in. x L: 32.6 in.
x H: 5.2 in.
5G, 11ms half sine; 3 positive and
3 negative pulses in each axisminimum 6 seconds between
shocks
Linear Random: 0.15 Grms 5-500
Hz 10 minutes each axis in X, Y
and Z
Swept Sine:0.17 G, 0 - peak,
5-500 Hz 0.5 octaves/min,
approx. 13 minutes each axis
System Installation Length 778 mm / 30.6 in. from the front rack chassis mounts to the rear of
the system
Required Rack Depth 1000 mm (39.4 in.) of usable rack space, frame to frame
Required Rack Width 450mm (17.72in.) with 465mm (18.31in.) ± 1.5mm nominal hole
spacing. See EIA-310 Rack Standard
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Rack Units (U) 3U
Vertical Rack Rail Spacing 718 mm – 850 mm / 28.26 in. – 33.46 in.
Table 8: Performance Specifications
Number of Device Slots 10 Dual-port Fabric Device Bays
Data Transfer Rates 12GBps NVMe-oF
Max Raw Data Storage Capacity 614TB
Ethernet Ports 20 x 50Gbps QSFP28 ( 2 per Fabric Device)
Table 9: Performance Specifications by CRU P/N
1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
Specification Non-Operational Operational
Specification Value
*
1 x 10/100/1G Ethernet
CRU P/N 1EX2413 1EX2416 1EX2414 1EX2417 1EX2415 1EX2418
Capacity/
Endurance
Random Read
(4KB, QD=1024)
Random Write
(4KB, QD=1024)
Random Mixed
70R/30W
(4KB, QD=1024)
Sequential Read
(128KB, QD=320)
Sequential Write
(128KB, QD=320)
Random Write
Latency
(4KB, QD=1, 99.99%)
Notes on Testing:
• Latency measured through a single Mellanox SN2700 switch
• K IOPs = IOPs x 1000
• Devices pre-conditioned with 2 full sequential fills
12.8TB
1-2DWPD
2199K
IOPs
1493K
IOPs
2199K
IOPs
11.8 GB/s 11.7 GB/s 11.7 GB/s 11.7 GB/s 11.7 11.7 GB/s
9.9 GB/s 9.9 GB/s 9.9 GB/s 9.4 GB/s 9.4 GB/s 9.9 GB/s
33.9 us 33.7 us 33.7 us 33.9 us 33.7 33.5 us
15.36TB
0.8DWPD
2111K
IOPs
1433K
IOPs
2137K
IOPs
25.6TB
2DWPD
2164K
IOPs
1431K
IOPs
2183K
IOPs
30.72TB
0.8DWPD
2160K
IOPs
1397K
IOPs
2188K
IOPs
51.2TB
0.8DWPD
2176K
IOPs
1464K
IOPs
2227K
IOPs
61.44TB
0.8DWPD
2191K
1
IOPs
1400K
1
IOPs
2251K
IOPs
* Max storage capacity depends on device version and device configuration.
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Table 10: Acoustic Specifications
1. Overview
1.4 Physical Design
Quantities Declared
A-weighted sound power level1, L
WAd
{1 B = 10
Idle
Mode
8.5 8.5 9.6 9.6
Operating
Mode
Fan Fail
Mode
5
Max Fan
Mode
dB}
Average A-weighted emission sound pressure
level2, L
(dB) {bystander position3}
pAm
66.0 66.0 74.9 76.2
Statistical adder for verification4, K (dB) 2.5 2.5 2.5 2.5
Notes on Acoustic Testing Methodology and Environment:
1
Declared A-weighted sound power level for a single machine, calculated per section 4.4.2 of ISO
9296-1988 and measured per ISO 3744
2
Declared A-weighted sound pressure level for a single machine, calculated per section 4.4.4 of
ISO-9296-1988 and measured per ISO 3744
3
The front and rear of the UUT were selected for the bystander location, due to access typically from the
cool or hot isle in a data center. This does not meet the four bystander positions as specified in ECMA-74
2012, but the microphones were adjusted to the preferred location.
4
The statistical adder, K, accounts for random measurement error, and is equal to 2.5 dB, which is
appropriate for a 5% risk of rejection for SR = 1.5 dB per section 4.4.2 of ISO 9296-1988.
5
At steady state condition, system/PSU fans reached 100% pwm speeds during fan fail mode testing.
• Background noise: <7dBA
• Environmental test conditions: ~23° C, 57% RH, 101.3 kPa
• Tested configuration: 3U NVMeOF VBOF device with 10 devices installed.
1.4 Physical Design
The OpenFlex F3100 and E3000 physical design emphasizes easy access to hot-swappable components,
maximization of data storage capacity in the rack, and bold aesthetic design.
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Figure 4: OpenFlex F3100 and E3000 Layout
1. Overview
1.4 Physical Design
The enclosure measures 447.2 mm/17.6 in. wide by 828.04 mm/32.6 in. long. It's height is 130.9 mm/5.2 in.
or 3U. The chassis installation length is 778 mm / 30.6 in. from the front rack chassis mounts to the rear of
the system.
Figure 5: OpenFlex F3100 and E3000 Dimensions
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1.4.1
LEDs
Chassis LEDs
Figure 6: Chassis Rear IO LEDs
1. Overview
1.4 Physical Design
Table 11: Chassis Rear IO LED Flash Patterns
LED Name Color Behavior
Ethernet Link/Activity Green Off: No Connection
Solid: Connected
Blink: Activity
Ethernet Speed
Identification Blue
QSFP28 LED
Green Off: Operating at 10 Mbps
Solid: Operating at 100 Mbps
Amber Off: Operating at 10 Mbps
Solid: Operating at 1Gpbs
Blink @ 1 Hz: Blinks only when Identification has
been activated. Will blink when any component
is identified, e.g. Fans, PSUs, etc.
Off: Enclosure not being identified/located
Green
Amber
Solid: Link operating at maximum speed
Blink (3Hz): Link activity
Off: Default state
Solid: Link operating at a lower speed, 50G or
less
Blink (3Hz): Low speed link activity
Blink (1Hz): On/Off - Identify
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PSU LED
1. Overview
1.4 Physical Design
LED Name Color Behavior
Power Green Solid:Enclosure is powered on
Off:Enclosure is powered off
Fault Amber Blink @ 2 Hz: Enclosure has a fault
Off: Enclosure has no fault
Figure 7: PSU LED
Fan Module LED
Table 12: PSU LED Flash Patterns
LED Name Color Behavior
Multi-
function LED
Green Solid: PSU is on and
reporting no faults
Blinking @ 2Hz: PSU
in firmware update
mode
Off: PSU is
disconnected from
power
Amber Solid: PSU is
disconnected from
power or critical fault
causing a shutdown
failure
Blinking @ 0.5Hz: PSU
reporting warnings
Off: PSU is reporting
no faults
Figure 8: Fan Module LED
Table 13: Fan Module LED Flash Patterns
LED Name Color Behavior
LED Amber Blinking @ 2 Hz: Fan is
reporting a fault
Blinking @ 1 Hz: Fan is
being identified
Off: Fan is on and
reporting no faults
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BMC Module LEDs
1. Overview
1.4 Physical Design
Figure 9: BMC Module LEDs
Table 14: BMC Module LED Flash Patterns
LED Name Color Behavior
Identification Blue Blink @ 1 Hz:
Blinks only when
Identification has been
activated. Will blink
when any component
is identified.
Fault Amber Blink @ 2 Hz:
Enclosure has a fault
Off: Default State
Power Green Solid: Powered On
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OpenFlex F3100 LEDs
1. Overview
1.4 Physical Design
Figure 10: OpenFlex F3100 LEDs
Table 15: OpenFlex F3100 LED Flash
Patterns
LED Name Color Behavior
Device Status
Power Green On: Device is
Fault Amber Blink @ 1 Hz:
White Solid: On and
Connected
Off: Not Ready
or Powered
down
Blue Blink @ 1 Hz:
OpenFlexF3100
is flushing the
cache
Off: Default
State
Powered On
Off: Device
is Powered
Down
Device has a
fault
Solid: Device
is Powered
Down
Off: Device has
no fault
Identification Blue Blink @ 1
Hz: Blinks
only when
Identification
has been
activated.
Off: Device
is not being
identified.
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1.4.2
Cables
The following table displays the power cable supported by Western Digital:
Table 16: Approved Power Cables
1. Overview
1.5 Restrictions and Limitations
Type Part Number Length
IEC C14 to IEC C15 Heavy
Duty 15A Power Cable
The following table displays the Ethernet cables approved by Western Digital:
Note: These cables are approved, but not provided by Western Digital.
(Provided in Accessory Kit) 6 ft.
Table 17: Approved Ethernet Cables
Vendor Active/Passive Vendor Model Number
Mellanox
Amphenol
Passive MCP1600-C001
Passive MCP1600-C002
Passive MCP1600-C003
Active MFA1A00-C005
Passive NDARHG-0001
Passive NDARHG-0004
Passive NDARHF0002
Passive NDARHJ0003
Western Digital
Part Number
1.5 Restrictions and Limitations
The OpenFlex F3100 and E3000 have the following restrictions and limitations on functionality:
• All E3000 chassis must be full for proper airflow. This means that if there is only one device installed, the
rest of the device slots must be filled with device blanks.
• If the BMC Module is not installed in the E3000 chassis, F3100 devices cannot be added or slot
swapped.
• Only hot-swap a single component at a time. Never remove more than one at a time.
• VLAN tagging is not supported.
• RoCE v1 is not supported. F3100 will support RoCE v2 only.
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• To power off an F3100, browse directly to the F3100. Power off cannot be done from the E3000. To
power back on the F3100, browse to the E3000.
• IPv4 networking only.
• Only one browser session allowed to an individual F3100 device.
• Enforced maximum limits on configuration
◦ 256 Volumes
◦ 256 Hosts
◦ 2048 Queue Pairs
◦ 128 Queue Pairs (1 Admin, 127 IO) per connection
◦ 64 max queue depth per IO Queue Pair
1.6 Site Requirements
1.6.1
Power Requirements
The E3000 is equipped with redundant PSU units. The PSUs are hot-swappable and are located at the rear
of the chassis. The following is a specification summary. Note that the system does not support lowline
voltage.
1. Overview
1.6 Site Requirements
1.6.2
Table 18: Power Specification
Specification Value
Power Output 1600W
Input Voltage 200V - 240V
80 PLUS Standard Platinum
Connector Type C16
Rack Requirements
The E3000 is designed to be installed into a rack that meets the EIA-310 standard with a minimum of 1000
mm (39.4 in.) of usable rack space, frame to frame. The vertical rack rails must be set between 718 mm
– 850 mm / 28.26 in. – 33.46 in. to support the enclosure. It requires 3U of rack space, and it should be
installed into the rack at the lowest possible U height to keep the load on the rack balanced.
Table 19: Required Rack Specifications
Parameter Requirement
Rack Depth 1000 mm (39.4 in.) of usable rack space, frame to
frame
Rack Width 450mm (17.72in.) with 465mm (18.31in.) ± 1.5mm
nominal hole spacing. See EIA-310 Rack Standard
Rack Units (U) 3U
Vertical Rack Rail Spacing 718 mm – 850 mm / 28.26 in. – 33.46 in.
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Static Load Rating Rack meets ISTA 3E or 3B test requirements and
Dynamic Load Rating Rack meets ISTA 3E or 3B test requirements and
1.6.3
Thermal and Cooling Requirements
The thermal output of the OpenFlex F3100 and E3000 depends on the number of F3100s that are
populated in the E3000. Use the following table to determine how many BTUs of heat will exhaust from the
rear of the unit.
Table 20: BTU Exhaust per Component
1. Overview
1.6 Site Requirements
Parameter Requirement
regulations when mounted to the shipping pallet
regulations when mounted to the shipping pallet
Condition Typical BTU Output Max BTU Output
1.6.4
Single E3000 w/ BMC Module 768 BTU/hr = 225 W
(25C/77F, fans at 50%)
Single F3100 409 BTU/hr = 120 W
(25C/77F, Workload: Random
Read/Write, queue depth
32, 80% internal processors
dedicated to workload)
E3000 Fully Populated with
F3100s
Servicing Requirements
Space Requirements
The installation of the OpenFlex F3100 and E3000 will require enough space in front of the rack for two
people to perform a safe installation. The recommended forward clearance is 889 mm / 35 in. from the
front of the rack and 609.6 mm / 24 in. on both sides of the enclosure. It is also recommended to make
considerations for any carts or lift equipment that might be used to perform the installation. * The servicing
of the enclosure requires one person and a minimum of 508 mm / 20 in. of space in front of the rack to
allow enough clearance to remove an F3100 from the enclosure. See the following diagram for details.
5244 BTU/hr = 1537 W
(25C/77F, fans at 50%)
1177 BTU/hr = 345 W
(35C/95F, fans at 100%)
546 BTU/hr = 160 W
(35C/95F, workload: Highest
throughput to drives – Seq
Write, queue depth 32, all
internal processors at 100%)
5884 BTU/hr = 1725 W
(35C/95F, fans at 100%)
* The weight of the enclosure during installation will vary, depending on the number of F3100 devices and blanks
contained in the E3000. In some situations, carts or lift equipment may be required.
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Figure 11: Installation and Servicing Space
1. Overview
1.6 Site Requirements
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Western Digital
Components
In This Chapter:
- Chassis........................................................... 21
- PSU.................................................................22
- Fan Module....................................................23
- BMC Module..................................................24
- Rails................................................................25
- OpenFlex F3100............................................26
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2.1 Chassis
The OpenFlex E3000 chassis is the primary housing that contains and connects all of the system
components that comprise the OpenFlex F3100 and E3000 . The chassis contains one BMC Module in the
front, and the rear contains two redundant PSUs and four Fan Modules that come preinstalled in the chassis.
The chassis also contains ten device slots that can be populated with approved OpenFlex™ components.
The E3000 is installed and secured onto shelf style rail mounts. The rear IO houses the primary connections
such as power and QSFP28 ports and the status LEDs for all of the components.
2.1.1
Chassis Specifications
2. Components
2.1 Chassis
Table 21: Chassis Specification Summary
Specification Value
Rack Units 3U
Number of Device
Slots
Number of BMC Slots 1
Part Number 1EX1919
Hot Swappable? No
Dimensions W: 447.2 mm x L:
Weight 38.2 lbs / 17.32 kg
10
828.04 mm x H: 130.9
mm / W: 17.6 in. x L:
32.6 in. x H: 5.2 in.
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2.2 PSU
The OpenFlex E3000 chassis contains toolless redundant 1600W Power Supply Units (PSU). Each PSU
requires an input voltage of between 200V - 240V. The PSUs are certified 80 PLUS Platinum and use the C16
connector type. Due to the redundant nature of the PSUs, they may be serviced or replaced, one at a time,
while the enclosure is powered on.
2.2.1
PSU Specifications
2. Components
Table 22: PSU Specification Summary
Specification Value
Power Output 1600W
Input Voltage 200V - 240V
80 PLUS Standard Platinum
Connector Type C16
2.2 PSU
Internal Fan Speed Up to 25,000 RPM
Number per Enclosure 2
Part Number 1EX1916
Hot Swappable? Yes
Service Window 5 minutes
Dimensions
Weight 2.31 lbs. / 1.05 kg
W: 54.5 mm x L: 321.5
mm x H: 40.1 mm
W: 2.15 in. x L: 12.66 in.
x H: 1.58 in.
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2.3 Fan Module
The OpenFlex E3000 contains four toolless Fan Modules to maintain the cooling across the entire system.
The Fan Modules are connected to the rear of the Chassis using a handle to seat the module in place
and captive screw to secure the Fan Module into the fan bay. Due to the redundant nature of the Fan
Modules, they may be serviced or replaced, one at a time, while the enclosure is powered on. The Fan
Modules will accelerate to maximum RPM while the BMC Module or devices are removed during servicing or
replacement.
2.3.1
Fan Module Specifications
2. Components
2.3 Fan Module
Table 23: Fan Module Specification
Summary
Specification Value
Rated Voltage 12V
Fan Speed 12000 RPM
Acoustics 76 dB measured at 1
meter from the fan inlet
Number per Enclosure 4 Fan Modules
containing two rotors
per module
Part Number 1EX1915
Hot Swappable? Yes
Service Window 5 minutes
Dimensions
Weight 1.76 lbs. / 0.8 kg
W: 92.74 mm x L: 127.2
mm x H: 85.2 mm
W: 3.65 in x L: 5.01 in x
H: 3.35 in
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2.4 BMC Module
The OpenFlex E3000 contains a toolless BMC Module that is installed into the center slot at the front of the
Chassis. The BMC Module is accessed using a 1GBe Ethernet management RJ45 port on the rear IO of the
Chassis. The BMC Module enables out of band management (OOBM) using a RESTful interface (via HTTP
or HTTPS). OOBM controls the actions between devices and the BMC Module for powering down, setting
system configurations, and the cooling algorithm for the Fan Modules. The BMC Module may be serviced or
replaced while the enclosure is powered on as long as it is replaced within five minutes of removing it from
the slot. Replacing a BMC module will not effect data flow to devices.
2.4.1
BMC Module Specifications
2. Components
2.4 BMC Module
Table 24: BMC Module Specification
Summary
Specification Value
Input Current 2A Maximum
Input Power 25W
Rated Voltage 12V +/- 10%
Number per Enclosure 1 installed in the center
device slot
Part Number 1EX1917
Hot Swappable? Yes
Service window 5 minutes
Dimensions
Weight 3.26 lbs. / 1.48 kg
W: 55.6 mm x L: 459.12
mm x H: 126.94 mm
W: 2.19 in x L: 18.08 in x
H: 5 in
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2.5 Rails
The E3000 is installed onto shelf style rails. The rail length can be adjusted between 850.31 mm / 33.47
in (max) and 693.69 mm / 27.31 in. (min) in order to fit into different vertical rack rail settings. Once the
enclosure is installed onto the rails, it may be secured to the rails using the provided M5 screws.
2.5.1
Rails Specifications
2. Components
Table 25: Rails Specification Summary
Specification Value
Length 693.69 mm / 27.31 in.
(min)
850.31 mm / 33.47 in
(max)
Part Number 1EX2198
2.5 Rails
Hot Swappable? No
Dimensions
Weight 5.08 kg / 11.2 lbs (both
W: 34.4 mm x L: 693.69
mm x H: 89.65 mm
W: 1.35 in. x L: 27.31 in.
x H: 3.53 in.
rails)
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2.6 OpenFlex F3100
The F3100 is a fabric device that contains a maximum of 61.4TB of raw data storage capacity per device. The
device supports Open Composable Infrastructure (OCI) through storage disaggregation using NVMe-overFabrics (NVMe-oF). The front of the F3100 contains a button latch release system and status LEDs and the
rear contains the device connector.
2.6.1
OpenFlex F3100 Specifications
2. Components
2.6 OpenFlex F3100
Table 26: OpenFlex F3100 Specification
Summary
Specification Value
Max Raw Data Storage
Capacity per device
Data Ingest Capability 2x 50G Ethernet
Data Transfer Rates 12 GBps
Number per enclosure Up to 10
Part Numbers See the List of
Hot Swappable? Yes
Service Window 5 minutes
Dimensions W: 37.53 mm x L: 694.4
Weight 4.44 kg / 9.8 lbs
61.4 TB
(see System High
Speed Data Ingest
Architecture (page 5))
*
Compatible Devices
(page 4) to find the
specific part number
required.
mm x H: 124.11 mm
W: 1.48 in x L: 27.34 in
x H: 4.89 in
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2.7 OpenFlex E3000 Fabric Device Blank
2.7 OpenFlex E3000 Fabric Device Blank
The OpenFlex E3000 chassis may contain up to 9 OpenFlex E3000 Fabric Device Blanks *. The chassis must
contain at least one device, and the remaining slots must be populated with either devices or device blanks
to avoid compromising the cooling of the enclosure. Each OpenFlex E3000 Fabric Device Blank may be
replaced with a device as the enclosure is scaled up. The OpenFlex E3000 Fabric Device Blank may be
serviced or replaced one at a time while the enclosure is powered on.
2.7.1
OpenFlex E3000 Fabric Device Blank Specifications
Table 27: OpenFlex E3000 Fabric Device
Blank Specification Summary
Specification Value
Number per enclosure Up to 9
Part Number 1EX1918
2. Components
Hot Swappable? Yes
Service Window 5 minutes
Dimensions W: 37.53 mm x L:
694.4 mm x H: 124.11
mm
W: 1.48 in x L: 27.34 in
x H: 4.89 in
Weight 4.12 lbs. / 1.87 kg
* The form factor of the fabric device blank is compatible with all F-Series devices.
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2.8 List of Field/Customer Replaceable Units
2.8 List of Field/Customer Replaceable Units
The following table lists the replaceable components and their part numbers.
Table 28: List of Field/Customer Replaceable Components
Component Part Number
Chassis 1EX1919
PSU 1EX1916
Fan Module 1EX1915
BMC Module 1EX1917
Rails 1EX2198
Accessory Kit 1EX2199
OpenFlex E3000 Fabric Device Blank 1EX1918
OpenFlex F3100 Fabric Device See Supported SKUs (page 4)
2. Components
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Western Digital
Management
In This Chapter:
- OCGUI............................................................30
- Part Replacement......................................... 81
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3.1 OCGUI
3.1.1
Login Page
3. Management
3.1 OCGUI
3.1.2
The login page displays two panels. The left panel provides username and password fields for logging
into the enclosure. The right panel lists basic information about the enclosure itself, including the type of
device, the OS version, and its status.
Note: For instructions on navigating to the login page, see Navigating to a Device Using the
OCGUI (page 49).
Dashboard
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Figure 20: Dashboard
3. Management
3.1 OCGUI
The dashboard provides vital statistics on the health and performance of all of the devices on the fabric.
It is the first page that will load when one logs into any of the fabric-attached devices. The dashboard has
a list of all the devices on the fabric, and clicking through this section will link to the device page for that
device.
3.1.2.1 System Health View
Figure 21: System Health View
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The system health view provides an overview of the health of the fabric network. All of the devices on
the fabric are queried when the page loads, and this view is updated. If there are fabric devices that
are flagging errors or faults, the system health view will respond accordingly. The following images
demonstrate the various states that the system health pie chart can present.
Figure 22: System Health View States
The following states correspond to the health status definitions presented by the devices through the
OCAPI:
• OK
• Critical Failure
• Not Available
• Not Installed
3. Management
3.1 OCGUI
3.1.2.2 System Performance View
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Figure 23: System Performance View
The System Performance View provides general, bitwise system performance information that relates to
all devices on the fabric.
3. Management
3.1 OCGUI
3.1.2.3 System Utilization View
Figure 24: System Utilization View
The System Utilization View displays the overall level of storage that is being used on the fabric in TB.
3.1.2.4 Storage Health Modal
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Figure 25: Storage Health Modal
The storage health modal provides an overview of the health of all of the storage devices that are present
on the fabric. The modal will provide seperate tables for fabric devices that are presenting diffierent
health states up to the OCGUI.
3. Management
3.1 OCGUI
3.1.2.5 Chassis Health Modal
Figure 26: Chassis Health Modal
The chassis health modal provides an overview of the health of all of the chassis devices that are present
on the fabric. This status comes from the BMC module installed in the chassis. The modal will provide
seperate tables for fabric devices that are presenting diffierent health states up to the OCGUI.
3.1.2.6 Device List
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Figure 27: Device List
The device list provides summary details about all of the devices that are present on the fabric. Users
can also link to the device page for the OpenFlex device of their choosing for management purposes.
Vital information such as the version of firmware code that is loaded on each device, the type of device
that was discovered, and the UUID. This list will be updated with each refresh of the page as a query
command is sent across the fabric network to discover OpenFlex devices.
3. Management
3.1 OCGUI
3.1.3
Storage Device Page
Figure 28: Storage Device Page
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The storage device page presents all of the vital information related to a specific storage resource.
3.1.3.1 Storage Device Health Panel
Figure 29: Storage Device Health Panel
3. Management
3.1 OCGUI
The Device Health Panel shows a visual summary of the general health of devices on the network.
3.1.3.2 Storage Device Utilization Panel
Figure 30: Storage Device Utilization Panel
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The Device Utilization panel provides a visual summary of the amount of storage that is available or that
has been consumed on this device.
3.1.3.3 Storage Device Performance Panel
Figure 31: Storage Device Performance Panel
3. Management
3.1 OCGUI
The Device Performance panel provides a visual summary of the current IO performance of the device.
3.1.3.4 Device Information
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Figure 32: Device Information Panel - Storage
3. Management
3.1 OCGUI
The Device Information panel provides information about the device itself, such as the ID and Serial
Number, as well as performance statistics related to this device.
3.1.3.5 Operating System (Device Firmware)
Figure 33: Operating System Info (Device Firmware)
The Device OS panel displays the firmware version. Use this panel to upgrade firmware.
3.1.3.6 Hosts
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Figure 34: Hosts Configuration
The Hosts panel provides information on the Hosts that are available to be connected to storage and
allows configuration of those hosts on the fabric.
3.1.3.7 Location
Figure 35: Location Information
3. Management
3.1 OCGUI
The Location panel provides information regarding the physical location of the device.
3.1.3.8 Paths
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Figure 36: Paths Configuration
The Paths panel lists all of the current paths that are available to the storage volumes. Paths connect
storage to hosts.
3.1.3.9 Pools
Figure 37: Pools Configuration
3. Management
3.1 OCGUI
The Pools panel shows all of the pools that are configured on this storage device. The number of pools
can be set to 1, 2, 4, or 8.
3.1.3.10 Ports
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Figure 38: Ports Information (Network Settings)
3. Management
3.1 OCGUI
The Ports panel provides access to the networking settings for the ports that exist on the device.
3.1.3.11 Sensors
Figure 39: Sensors Information
The Sensors panel lists all of the sensors that are present on the device hardware and reports the status
readings that the sensors are taking.
3.1.3.12 Volumes
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Figure 40: Volumes Configuration
The Volumes panel displays all of the volumes that have been configured on the device and allows for
volumes to be added, modified, or deleted.
3.1.3.13 Administration
3. Management
3.1 OCGUI
Figure 41: Administration
The Administration panel allows system administrators to perform important management functions to the
device.
3.1.3.14 Accounts
Figure 42: Account Information
3.1.4
The Accounts panel provides a list of all the accounts that can access this device.
Chassis Device Page
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Figure 43: Chassis Device Page
3. Management
3.1 OCGUI
The chassis device page presents all of the vital information related to a specific chassis resource.
3.1.4.1 Chassis Device Health Panel
Figure 44: Device Health Panel
This Device Health Panel shows a visual summary of the general health of devices on the network.
3.1.4.2 Chassis Device Power Utilization
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Figure 45: Chassis Device Power Utilization
The Power Utilization Panel gives a summary of the sensor data that is being reported by the power
supplies. Charts displays the current amps and volts being consumed by the system, as well as the
temperature.
3. Management
3.1 OCGUI
3.1.4.3 Chassis Device Performance
Figure 46: Chassis Device Cooling Performance
The cooling performance panel displays the current RPMs at which the onboard cooling fans are
operating.
3.1.4.4 Device Information
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Figure 47: Chassis Device Information
3. Management
3.1 OCGUI
The Device Information panel provides information about the device itself, such as the ID and Serial
Number.
3.1.4.5 Operating System (Device Firmware)
Figure 48: Operating System (Device Firmware)
The Device OS panel displays the firmware version. Use this panel to upgrade firmware.
3.1.4.6 Fans
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Figure 49: Chassis Fan Information
3. Management
3.1 OCGUI
The fans panel shows that status and health of all of the fans installed in the device.
3.1.4.7 Admin
Figure 50: Administration Panel
The Administration panel provides access to maintence and system administration functions.
3.1.4.8 Accounts
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Figure 51: Account Configuration
The Accounts panel provides a list of all the accounts that can access this device.
3.1.4.9 Location
Figure 52: Location Information
3. Management
3.1 OCGUI
The Location panel provides information regarding the physical location of the device.
3.1.4.10 Ports
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Figure 53: Chassis Ports Configuration
The Ports panel provides access to the networking settings for the ports that exist on the device.
3.1.4.11 PSUs
Figure 54: Chassis Power Supplies Information
3. Management
3.1 OCGUI
The Power Supplies panel provides health and status information of the power supplies installed in the
device.
3.1.4.12 Slots
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Figure 55: Chassis Slots Information
3. Management
3.1 OCGUI
The Slots panel gives information on the devices that are installed in each slot.
3.1.5
3.1.5.1 Navigating to a Device Using the OCGUI
Basic Operational Functions
For the OpenFlex F3100 and E3000 , the basic operational functions are the tasks needed to begin the
initial operation of the system, e.g. check system health, create a user account, etc.
This task provides instructions for using the OCGUI to navigate to a device's dashboard through any
other fabric-connected device.
The BMC's MAC address is listed on a label affixed to the module's side. This MAC address can be used
to determine the IP addresses assigned via DHCP to the OpenFlex™ E3000 chassis and the F3100 storage
devices contained within it.
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Figure 56: BMC Module MAC Address Label
Step 1 : Open a browser and enter the IP address for any fabric-connected device into the address
3. Management
3.1 OCGUI
bar.
The login page for the device appears.
Step 2 : Enter a valid username and password, and click the Login button.
The device's dashboard appears. In addition, the Devices banner provides access to all
other fabric-connected devices.
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3. Management
3.1 OCGUI
Step 3 : Click the Devices banner to view a list of all connected devices:
Step 4 :
Step 5 : Click the Device Actions icon:
Step 6 : Click the Open in a new tab/window option to open the device page in a new window. This
Locate the new device in the list.
will keep the existing dashboard live in the current window.
The new device's dashboard appears.
3.1.5.2 Checking System Health Using the OCGUI
This task provides steps that should be followed to check the health of the system and system
components using the OCGUI.
This health check will cover the following:
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• Device Information
• Device Logs
• PSUs
• Fans
• Ports
• Sensors
• Slots
Step 1 : Enter a valid username and password, and click the Login button:
3. Management
3.1 OCGUI
Note: The default username/password is admin/admin.
The system dashboard appears:
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Step 2 : Click the Devices banner to view a list of all connected devices:
3. Management
3.1 OCGUI
Step 3 :
Step 4 : Click the Device Actions icon:
Step 5 : Click the Open in a new tab/window option to open the device page in a new window. This
Step 6 : Click the Device Information icon:
Step 7 :
Step 8 : Click the Device Logs button:
Locate the system that will be checked for health status in the list.
will keep the existing dashboard live in the current window.
The new device's dashboard appears.
After clicking device information, the status of device will appear at the bottom of the GUI.
Review the health information related to the devices.
Step 9 : Select one of the logs by clicking the radio button next to an option in the Device Log Viewer.
The log can be exported by clicking export at the bottom of the viewer.
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Step 10 : Click the Power Supplies icon:
3. Management
3.1 OCGUI
Step 11 : After clicking power supplies, the status of power supplies will appear at the bottom of the
GUI. Review the health information related to each of the power supplies.
Step 12 : Click the Fans icon:
Step 13 :
Step 14 : Click the Ports icon:
Step 15 :
Step 16 : Click the Sensors icon:
After clicking fans, the status of fans will appear at the bottom of the GUI. Review the health
information related to each of the fans. If there is an issue reported on a fan, the physical LED
may be turned on by clicking the Locator LED next to the fan health column.
After clicking ports, the status of ports will appear at the bottom of the GUI. Review the health
information related to each of the ports.
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Step 17 : After clicking sensors, the status of sensor will appear at the bottom of the GUI. Review the
Step 18 : Click the Slots icon:
3. Management
3.1 OCGUI
health information related to each of the sensors. Each of the sensors reports a current reading
related to temperature, volts, or amps.
Step 19 :
After clicking slots, the health status of the slot the will appear above the top right corner of
the device table.
3.1.5.3 Establishing a Location Using the OCGUI
Step 1 : Enter a valid username and password, and click the Login button:
Note: The default username/password is admin/admin.
The system dashboard appears:
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3. Management
3.1 OCGUI
Step 2 : Click the Devices banner to view a list of all connected devices:
Step 3 : Click the Device Actions icon:
Step 4 : Click the Open in a new tab/window option to open the device page in a new window. This
will keep the existing dashboard live in the current window.
The new device's dashboard appears.
Step 5 : Click the Location icon:
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Step 6 : After clicking location, the location information related to the device will appear at the bottom
3. Management
3.1 OCGUI
of the GUI. Each attribute can be assigned a value by clicking the pencil button and adding
text to the field and clicking the check mark to save the value. Complete all of the values that
apply.
3.1.5.4 Editing Port Information Using the OCGUI
This task provides instructions for editing the port information of a device using the OCGUI.
Step 1 : Navigate to the device's dashboard.
Step 2 : Click the Ports icon:
The device's port information appears:
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Step 3 : Click on the Pencil icon to edit the port information for a device on the list.
The first Update Port: management window appears.
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Step 4 : Edit the port information for the device and click the Next button.
The second Update Port: management window appears.
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Step 5 : Select the checkbox to confirm the edits.
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Step 6 : Click the Update button to save the updates.
3.1.5.5 Creating Accounts Using the OCGUI
This task provides instructions for creating a user account for a device using the OCGUI.
Step 1 : Navigate to the device's dashboard.
Step 2 : Click the Accounts icon:
The device's account information appears:
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Step 3 : Click the Create Accounts button:
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The Create Accounts window appears:
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Step 4 : Enter an ID in the User ID field and a password in both the Password and Confirmation fileds.
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Step 5 : Click the Create button to create the account.
Step 6 : Click Close to close the Create Accounts window.
The device's account information appears, showing the newly created account.
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3.1.5.6 Creating a Secure HTTPS Connection Using the OCGUI
The OCGUI provides a feature for uploading a customer-generated SSL/TLS certificate and key, based on
the IP address and/or DNS name, to create a fully-secure HTTPS connection to a device.
Step 1 :
Step 2 : Click the Administration icon:
Navigate to the device's dashboard.
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The device's administration information appears:
Step 3 : Click the Certificate & Key Upload button:
The TLS Certificate & Key Pair window appears:
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Step 4 : Click the Select File button:
Step 5 : Navigate to the location of the appropriate PEM files for the Certificate File and Key File fields.
Note: The files are not validated. It is up to the user to ensure that the correct
file is chosen for the appropriate field. If the chosen files are not valid, the
OCGUI will reuse the defaults already on the system.
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Step 6 : Click the Next button:
The TLS Certificate & Key Pair confirmation window appears:
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Step 7 : Confirm that the correct files are listed for Certificate and Key. If so, select the Please Confirm
checkbox and click the Upload Certificate & Key button.
The TLS Certificate & Key Pair confirmation window closes, and the device's dashboard
appears.
Step 8 : Click the Device Info icon:
Step 9 : Click the Device Logs button:
Step 10 : Confirm that the chosen certificate file is one of the selectable options listed in the Device Log
Viewer window.
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3.1.5.7 Configuring a Host Using the OCGUI
This task provides instructions for configuring a host using the OCGUI.
Step 1 : Navigate to the device's dashboard (see Navigating to a Device Using the OCGUI (page
49)).
Step 2 : Click the Hosts icon:
The storage device's Hosts page appears:
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Step 3 : Click the Create Hosts button:
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The Create Hosts dialog box appears:
Step 4 :
Step 5 : Click the Next button:
In the Host Name and Description fields, type a name and description for the host.
The Confirmation step of the Create Hosts dialog appears:
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Step 6 : Click the checkbox next to Please Confirm, and then click the Create button:
The newly created host will appear in the list on the device's Hosts page.
3.1.5.8 Configuring a Path Using the OCGUI
This task provides instructions for configuring a Path between a Host and Volume using the OCGUI.
Note: A Path is a dedicated line of communications between a Host and a Volume, which
cannot be established until both the Host and Volume have been created.
Note: The following instructions define how to create a Path to a Host through the device's
Volumes page. That same path may also be created from the other direction—to a Volume
through the device's Hosts page.
Step 1 :
Step 2 : Click the Volumes icon:
Navigate to the device's dashboard (see Navigating to a Device Using the OCGUI (page
49)).
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The storage device's Volumes page appears:
Step 3 : From the list of available volumes, identify the one that will used to create the path.
If that volume has been configured to allow any host, a dedicated path cannot be
established between it and a specific host. If this is the case, it will be indicated by the
following:
The Allow Any Host setting will be toggled to the ON (enabled) position:
•
• The path arrows beside the Pool ID will be grayed-out, and when the user hovers over
them, the tooltip will indicate that any host is allowed:
Step 4 : Disable the Allow Any Host setting for that volume by clicking the on/off toggle switch:
The path arrows beside the Pool ID will turn black, and when the user hovers over them,
the tooltip will indicate that path management is now available:
Step 5 : Click the path arrows beside the Pool ID:
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The Create Paths to Hosts dialog box opens, displaying the Hosts Selection step:
Step 6 : From the Select Hosts drop-down list, selet one or more hosts to be connected to this
volume. Then click the Next button:
The Confirmation step appears, displaying the chosen host(s):
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Step 7 : Select the checkbox beside Please Confirm, and then click the Map Hosts button:
A dedicated path between the selected volume and hosts(s) is created.
Step 8 : To verify that the path was created, click the Paths icon:
The device's Paths page appears:
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Step 9 : Review the listed paths to identify the one referencing the previously selected volume and
host(s); the names and NQNs will be listed under the Volume NQN and Host NQN columns.
3.1.6
Power Cycling
For the OpenFlex F3100 and E3000 , power cycling is accomplished by powering-off an individual storage
device from its Administration page in the OCGUI. Once powered-off, the storage device is no longer
responsive, and must be powered-on from the Slots page of the chassis that encloses the storage device.
3.1.6.1 Power Cycling a Storage Device Using the OCGUI
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This task provides instructions for power cycling a storage device using the OCGUI.
Step 1 : Navigate to the device's dashboard.
Step 2 : Click the Administration icon:
The device's administration information appears:
Step 3 : Click the Reboot button:
Step 4 : Click Reboot:
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Step 5 :
The Device will reboot and the connection to the device will be lost until the reboot is
complete.
3.1.6.2 Power Cycling a Chassis Device Using the OCGUI
This task provides instructions for power cycling a chassis device using the OCGUI.
Step 1 : Navigate to the device's dashboard.
Step 2 : Click the Administration icon:
Step 3 : Click the Reboot button:
Step 4 : Click Reboot:
Step 5 : The chassis device will reboot and the connection to the chassis device will be lost until the
reboot is complete. When the chassis device is being rebooted the installed devices will
remain functional.
3.1.7
Firmware Upgrade
3.1.7.1 Upgrading Device Firmware Using the OCGUI
This task provides steps that should be followed to upgrade the firmware of devices using the OCGUI.
Step 1 : Open a web browser and go to: https://portal.wdc.com/Support/s/.
The Western Digital Enterprise Support Center will appear.
Step 2 : Log in to the Western Digital enterprise support center using a Email and password.
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Step 3 : Click the Downloads option.
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You will be logged into the Western Digital Enterprise Support Center and several support
options will appear on the page.
Figure 82: Logged into the Western Digital Enterprise Support Center
The Western Digital downloads page will appear.
Step 4 : Locate and download the firmware update for your product.
a. From the Identify Product section, select the Product, Operating System / Type, and
Release Version.
Figure 83: Identify Product section
b.
From the Select Files for Download section, expand the Firmware section and select the
check box for the firmware file(s).
Figure 84: Select Files for Download section
From the Review & Download Files section, review the selected files and click
c.
DOWNLOAD FILES to download the entire file selection from that section.
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Figure 85: Review & Download Files section
Figure 86: Download Files
Step 5 :
Step 6 : Enter a valid username and password, and click the Login button:
Extract the file by unzipping the downloaded file to the desktop.
Note: The default username/password is admin/admin.
The system dashboard appears:
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Step 7 : Click the Devices banner to view a list of all connected devices:
Step 8 :
Step 9 : Click the Device Actions icon:
Step 10 : Click the Open in a new tab/window option to open the device page in a new window. This
Step 11 : Click the OS icon:
Locate the device that will be upgraded in the list.
will keep the existing dashboard live in the current window.
The new device's dashboard appears.
Step 12 : Click the Update OS button:
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Step 13 : Click on the Select File button and choose the filepath to the firmware upgrade file that was
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downloaded previously.
Figure 88: Firmware Staging Complete
Click Next to proceed.
Step 14 : After the file has been staged by the device, click the checkbox next to Please Confirm.
Figure 89: Confirm the Upload
Step 15 : Click the Upload button to commence the firmware upload to the device.
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Figure 90: Click Upload
Step 16 : After clicking upload, the upload status will appear. The upload should take less then 5
minutes. After the upload completes an activation and reboot cycle is required. This can be
done manually or automatically by clicking the Auto Activate check box.
Figure 91: Status of Upload
Step 17 : If Auto Activate was not selected and the upload has finished, click the Activate and Reboot
button to reboot the device and finalize the firmware upgrade.
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Figure 92: Activate and Reboot the Device
Step 18 : Click the OS icon:
Step 19 :
Verify the change was effective by checking the device firmware listed on the OS Information
page.
3.2 Part Replacement
Caution: In the event of multiple/simultaneous part failures, the order of hot replacement
should be as follows:
1. Fans
2. PSUs
3. All other CRUs
Table 29: Summary of Part Replacement Times
Part Name Replacement Time
Fan Module 2 minutes
PSU 3 minutes
BMC Module 2 minutes
OpenFlex F3100 2 minutes
Rails 65 minutes
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3.2.1
Fan Module Replacement
Table 30: Replacement Procedure Info
Step 1 : Unpack and inspect the new Fan Module for damage.
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Part Name Replacement Time
Chassis 60 minutes
Important: If more than one Fan Module has failed, each Fan Module must be replaced one
at a time. Replacing more than one Fan Module at a time may cause the enclosure to go into
thermal shutdown.
Required Tools # of People Required Time Required
None 1 2 minutes
a. Inspect the packaging that the Fan Module replacement was shipped in and record any
damage to the box. Large cuts, open boxes, and crushed corners should be reported.
b. Remove the Fan Module from the packaging and verify that there is no damage to the
Fan Module. Dents, scratches, and broken parts should be reported. If major damage has
occurred to the Fan Module, DO NOT use the replacement part.
c. Store in a safe location until the Fan Module is needed for installation.
Step 2 : Uninstall the Fan Module from the enclosure.
a. From the rear of the rack, unlock the Fan Module by turning the thumbscrew
counterclockwise until the screw threads are not engaged any longer. The location of
the thumbscrew is shown in the following image.
Figure 93: Fan Module Release Handle Unlocked
b. Pull the release handle out until the Fan Module is unseated and can be removed from
the fan bay.
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Step 3 : Install the new Fan Module into the enclosure.
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Figure 94: Uninstall Fan Module
c. Uninstall each Fan Module in the same way the first was uninstalled.
a. Unlock the Fan Module by turning the thumbscrew counterclockwise until the screw
threads are not engaged any longer. The location of the thumbscrew is shown in the
following image.
Figure 95: Prepare Fan Module
b.
Gently slide the Fan Module into the fan bay until the release handle is engaged with
the chassis. When the handle lifts up slightly, it is an indicator that the release handle is
engaged with the chassis.
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Figure 96: Fan Module Engaged
c.
Press the release handle into the Fan Module and secure it in place by turning the
thumbscrew clockwise until it is tight.
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3.2.2
Figure 97: Fan Module Secure
d. Verify that the Fan Module is securely latched into the chassis by pulling on the release
handle and ensuring the Fan Module does not move when pulled. Reinstall the Fan
Module if it is not securely installed into the chassis.
PSU Replacement
Be careful not to remove both power cables if performing a hot-swap of a PSU. The system needs one PSU
running to prevent data disruption.
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Table 31: Replacement Procedure Info
Step 1 : Unpack and inspect the new PSU for damage.
Step 2 : Disconnect the power cable from the failed PSU.
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3.2 Part Replacement
Required Tools # of People Required Time Required
None 1 3 minutes
a. Inspect the packaging that the PSU replacement was shipped in and record any damage
to the box. Large cuts, open boxes, and crushed corners should be reported.
b. Remove the PSU from the packaging and verify that there is no damage to the PSU.
Dents, scratches, and broken parts should be reported. If major damage has occurred to
the PSU, DO NOT use the replacement part.
c. Store in a safe location until the PSU is needed for installation.
Figure 98: Enclosure Power and Data Connections
a.
Move to the rear of the rack and open the cable retention clip on the PSU and
disconnect the power cable from the PSU.
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Step 3 : Uninstall the PSU from the enclosure.
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Figure 99: Cable Retention Clip Operation
a. With your left hand, grasp the metal ring handle with your fingers and use your thumb to
press the latch release using a pinching motion.
Figure 100: PSU Release Latch Operation (Top View)
Carefully pull the PSU out of the PSU Bay.
b.
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Step 4 : Install the new PSU into the enclosure.
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Figure 101: Uninstall PSU
a. Orient the PSU with the power socket oriented to th sideshown in the image and insert it
into the PSU slot.
Figure 102: PSU Installation
b. Verify that the PSU is fully seated and latched into the PSU slot by gently pulling on the
handle.
Step 5 : Connect the power cable into the new PSU.
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Figure 103: Enclosure Power Connections
a.
Open the cable retention clip on the PSU and connect the power cable into power
receptacle on the PSU.
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3.2.3
Figure 104: Cable Retention Clip Operation
b. Slide the retention clip forward on the PSUs until it stops near the cable connectors.
Doing this will ensure that the retention clips function properly in the event the cable is
pulled on.
BMC Module Replacement
Table 32: Replacement Procedure Info
Required Tools # of People Required Time Required
None 1 2 minutes
Step 1 : Unpack and inspect the new BMC Module for damage.
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Step 2 : Uninstall the BMC Module from the enclosure.
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a. Inspect the packaging that the BMC Module replacement was shipped in and record any
damage to the box. Large cuts, open boxes, and crushed corners should be reported.
b. Remove the BMC Module from the packaging and verify that there is no damage to the
BMC Module. Dents, scratches, and broken parts should be reported. If major damage
has occurred to the BMC Module, DO NOT use the replacement part.
c. Store in a safe location until the BMC Module is needed for installation.
a. From the front of the rack, grasp the release handle with your forefinger on the bottom
and thumb on the top of the release latch and press the release latch with your thumb.
The handle will eject from the front of the BMC Module.
Figure 105: BMC Module Release Handle Operation
Lower the release handle until the BMC module is fully unseated (this occurs at about
b.
60°) and pull the BMC module out of the chassis ensuring that you support the under
side of the BMC module with your other hand.
Figure 106: Uninstall BMC Module
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c. Locate the sticker on the side of the BMC Module that lists the mac address for that
module and record it somewhere for later use. The mac address of the BMC module will
be used to later to navigate to the BMC GUI in order to access the storage.
Figure 107: BMC Module MAC Address Label
Step 3 : Install the new BMC Module into the enclosure.
a. Grasp the release handle with your forefinger on the bottom and thumb on the top of
the release latch and press the release latch with your thumb. The handle will eject from
the front of the BMC module.
Figure 108: BMC Module Release Handle Operation
Gently slide the BMC module into the center chassis slot until the release handle is
b.
engaged with the chassis. When the handle lifts up slightly, it is an indicator that the
release handle is engaged with the chassis.
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Figure 109: BMC Module Installation
Lift the release handle up and press it into the BMC module to secure it into the slot.
c.
Figure 110: Secure BMC Module
d. Verify that the BMC module is securely latched into the chassis by pulling on the latch
and ensuring the BMC module does not move when pulled. Reinstall the BMC module if
it is not securely installed into the chassis.
3.2.4
OpenFlex F3100 Replacement
Note: Both PSUs and the BMC Module must be operational before replacing an OpenFlex
F3100 device.
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Table 33: Replacement Procedure Info
Step 1 : Unpack and inspect the new OpenFlex F3100 for damage.
Step 2 : Uninstall the OpenFlex F3100 from the enclosure.
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3.2 Part Replacement
Required Tools # of People Required Time Required
None 1 2 minutes
a. Inspect the packaging that the OpenFlex F3100 replacement was shipped in and
record any damage to the box. Large cuts, open boxes, and crushed corners should be
reported.
b. Remove the OpenFlex F3100 from the packaging and verify that there is no damage to
the OpenFlex F3100 . Dents, scratches, and broken parts should be reported. If major
damage has occurred to the OpenFlex F3100 , DO NOT use the replacement part.
c. Store in a safe location until the OpenFlex F3100 is needed for installation.
a. From the front of the rack, press the release button on the front of the OpenFlex F3100 .
The release handle will eject outward.
Figure 111: OpenFlex F3100 Release Operation
b.
Use the release handle to pull the OpenFlex F3100 out of the enclosure part way.
Then grasp the OpenFlex F3100 from the underside to support it as you pull it
the rest of the way out of the enclosure. See the hand placement in the image.
.
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Figure 112: Uninstall OpenFlex F3100
Figure 113: OpenFlex F3100 Hand Placement
Step 3 : Install the new OpenFlex F3100 into the enclosure.
a. Press the release button on the front of the OpenFlex F3100 . The release handle will
eject outward.
Figure 114: OpenFlex F3100 Release Operation
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b. Gently slide the F3100 into the E3000 slot until the release handle is engaged with the
chassis. When the handle lifts up slightly, it is an indicator that the release handle is
engaged with the chassis.
Figure 115: OpenFlex F3100 Install
Figure 116: Release Handle Engage
Rotate the release handle up and press it into the OpenFlex F3100 to secure it into the
c.
slot. When it is fully installed the user will feel the handle snap and lock into place.
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