The UC1705 family of power drivers is made with a high speed Schottky pro
cess to interface between low-level control functions and high-power switching
devices - particularly power MOSFETs. These devices are also an optimum
choice for capacitive line drivers where up to 1.5 amps may be switched in ei
ther direction. With both Inverting and Non-Inverting inputs available, logic sig
nals of either polarity may be accepted, or one input can be used to gate or
strobe the other.
Supply voltages for both V
For additional application details, see the UC1707/3707 data sheet.
The UC1705 is packaged in an 8-pin hermetically sealed CERDIP for -55°C to
+125°C operation. The UC3705 is specified for a temperature range of 0°C to
+70°C and is available in either a plastic minidip or a 5-pin, power TO-220
package.
Note: All currents are positive into, negative out of the specified terminal.
Digital Drive can exceed 5.5V if input current is limited to 10mA
Consult Packaging Section of Databook for thermal limitations and considerations of package.
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAULevel-2-260C-1 YEAR
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-2-260C-1 YEAR
CU NIPDAULevel-2-260C-1 YEAR
CU NIPDAULevel-2-260C-1 YEAR
CU NIPDAULevel-NC-NC-NC
CU NIPDAULevel-NC-NC-NC
CU SNLevel-NC-NC-NC
CU SNLevel-NC-NC-NC
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
18-Oct-2005
Addendum-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
0.063 (1,60)
0.015 (0,38)
0.100 (2,54)
8
1
5
4
0.065 (1,65)
0.045 (1,14)
0.020 (0,51) MIN
0.023 (0,58)
0.015 (0,38)
0.280 (7,11)
0.245 (6,22)
0.310 (7,87)
0.290 (7,37)
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0°–15°
0.014 (0,36)
0.008 (0,20)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
4040107/C 08/96
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A SQ
B SQ
19
20
21
22
23
24
25
1282627
12
131415161817
0.020 (0,51)
0.010 (0,25)
MIN
0.342
(8,69)
0.442
0.640
0.739
0.938
1.141
A
0.358
(9,09)
0.458
(11,63)
0.660
(16,76)
0.761
(19,32)(18,78)
0.962
(24,43)
1.165
(29,59)
NO. OF
TERMINALS
**
11
10
9
8
7
6
5
432
20
28
44
52
68
84
0.020 (0,51)
0.010 (0,25)
(11,23)
(16,26)
(23,83)
(28,99)
MINMAX
0.307
(7,80)
0.406
(10,31)
0.495
(12,58)
0.495
(12,58)
0.850
(21,6)
1.047
(26,6)
0.080 (2,03)
0.064 (1,63)
B
MAX
0.358
(9,09)
0.458
(11,63)
0.560
(14,22)
0.560
(14,22)
0.858
(21,8)
1.063
(27,0)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
4040140/D 10/96
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
0.021 (0,53)
0.015 (0,38)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
4
0.070 (1,78) MAX
0.020 (0,51) MIN
0.200 (5,08) MAX
0.125 (3,18) MIN
0.100 (2,54)
0.010 (0,25)
Seating Plane
M
0.325 (8,26)
0.300 (7,62)
0.015 (0,38)
Gage Plane
0.010 (0,25) NOM
0.430 (10,92)
MAX
4040082/D 05/98
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSOT008B – JANUARY 1995 – REVISED SEPTEMBER 2000
KC (R-PSFM-T5)PLASTIC FLANGE-MOUNT
0.156 (3,96)
0.146 (3,71)
0.125 (3,18)
(see Note C)
DIA
0.420 (10,67)
0.380 (9,65)
0.113 (2,87)
0.103 (2,62)
0.147 (3,73)
0.137 (3,48)
0.185 (4,70)
0.175 (4,46)
0.340 (8,64)
0.330 (8,38)
0.055 (1,40)
0.045 (1,14)
1.037 (26,34)
0.997 (25,32)
1
0.040 (1,02)
0.030 (0,76)
0.010 (0,25)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area.
D. All lead dimensions apply before solder dip.
E. The center lead is in electrical contact with the mounting tab.
M
5
0.067 (1,70)
0.268 (6,81)
0.122 (3,10)
0.102 (2,59)
0.025 (0,64)
0.012 (0,30)
4040208/E 09/00
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
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