TEXAS INSTRUMENTS XTR117 Technical data

SBOS344B − SEPTEMBER 2005 − REVISED JANUARY 2006

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments

4-20mA Current-Loop Transmitter

XTR117

FEATURES

D LOW QUIESCENT CURRENT: 130µA
D 5V REGULATOR FOR EXTERNAL CIRCUITS
D LOW SPAN ERROR: 0.05%
D LOW NONLINEARITY ERROR: 0.003%
D WIDE-LOOP SUPPLY RANGE: 7.5V to 40V
D MSOP-8 AND DFN-8 PACKAGES

APPLICATIONS

D TWO-WIRE, 4-20mA CURRENT LOOP

TRANSMITTER

D SMART TRANSMITTER
D INDUSTRIAL PROCESS CONTROL
D TEST SYSTEMS
D CURRENT AMPLIFIER
D VOLTAGE-TO-CURRENT AMPLIFIER

DESCRIPTION

The XTR1 17 i s a p recision current o utput c onverter d esigned
to transmit analog 4-20mA s ignals over a n industry-standard
current loop. It provides accurate current scaling and output
current limit functions.

The on-chip vol tage regulator (5V) can be us ed to power
external circuitry. A current return pin (I
current used in external circuitry to assure an accurate
control of the output current.

The XTR117 is a fundamental building block of smart
sensors using 4-20mA current transmission. The XTR117 is
specified for operation over the extended industrial
temperature range, −40°C to +125°C.

RELATED 4-20mA PRODUCTS

XTR115 5V regulator output and 2.5V reference output
XTR116 5V regulator output and 4.096V reference output

NOTE:For 4-20mA complete bridge and RTO conditioner solutions,

see the XTR product family website at www.ti.com.

) senses any

RET

XTR117

V

REG

8

R

IN

I

IN

2

V

IN

I

RET

3

semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

         
          
 !     !   

R

1

2.475k

A1

Ω

+5V

Regulator

www.ti.com

R
25

R

2

Ω

LIM

V+

7

B

6

E

5

IO= 100 V

4

Q1

R

IN

I

O

V

LOOP

R

L

IN

Copyright  2005−2006, Texas Instruments Incorporated

"##$

XTR117

MSOP-8

DGK

BOZ

XTR117

DFN-8

DRB

BOY

SBOS344B − SEPTEMBER 2005 − REVISED JANUARY 2006

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

Power Supply, V+ (referenced to IO pin) +50V. . . . . . . . . . . . . . . .

Input Voltage, (referenced to I

pin) 0V to V+. . . . . . . . . . . . . . . .

RET

Output Current Limit Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . .

V

, Short-Circuit Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

REG

ELECTROSTATIC DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

Operating Temperature Range −55°C to +125°C. . . . . . . . . . . . . . .

Storage Temperature Range −55°C to +125°C. . . . . . . . . . . . . . . . .

Junction Temperature +165°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD Rating (Human Body Model) 2000V. . . . . . . . . . . . . . . . . . . . . . .

(Charged Device Model) 1000V. . . . . . . . . . . . . . . . .

(1)

Stresses above these ratings may cause permanent damage.

ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible t o damage because very small parametric changes could
cause the device not to meet its published specifications.

Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only , an d
functional operation of the device at these or any other conditions
beyond those specified is not implied.

PACKAGE/ORDERING INFORMATION

(1)

PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site
at www .ti.com.

PIN ASSIGNMENTS

Top View

NC

I

RET

XTR117 XTR117

(1)

1

I

2

IN

3

I

4

O

NOTES: (1) NC = No connection. Leave unconnected on PCB.

(2)Connect thermaldie padto I

8

7

6

5

V

REG

V+

B(Base)

E(Emitter)

RET

(1)

1

NC

I

IN

I

RET

I

O

or leave unconnected on PCB.

2

3

4

Exposed

Thermal
Die Pad

on

Underside

DFN−8MSOP−8

8

V

REG

V+

7

B(Base)

6

(2)

E (Emitter)

5

2

"##$

www.ti.com

SBOS344B − SEPTEMBER 2005 − REVISED JANUARY 2006

ELECTRICAL CHARACTERISTICS: V+ = +24V

Boldface limits apply over the temperature range, TA = −40°C to +125°C.

All specifications at TA = +25°C, V+ = 24V, RIN = 20kΩ, and TIP29C external transistor, unless otherwise noted.

PARAMETER CONDITION

MIN TYP MAX

OUTPUT

Output Current Equation I

O

Output Current, Linear Range 0.20 25 mA

Over-Scale Limit I
Under-Scale Limit I

LIM
MIN

I

= 0 0.13 0.20 mA

REG

SPAN

Span (Current Gain) S 100 A/A

(1)

Error

IO = 200µA to 25mA ±0.05 ±0.4 %

vs Temperature TA = −40°C to +125°C ±3 ±20 ppm/°C

Nonlinearity IO = 200µA to 25mA ±0.003 ±0.02 %

INPUT

Offset Voltage (Op Amp) V

OS

IIN = 40µA ±100 ±500 µV

vs Temperature TA = −40°C to +125°C ±0.7 ±6 µV/°C

vs Supply Voltage, V+ V+ = 7.5V to 40V +0.1 +2 µV/V

Bias Current I

B

vs Temperature TA = −40°C to +125°C 150 pA/°C

Noise: 0.1Hz to 10Hz e

n

DYNAMIC RESPONSE

Small-Signal Bandwidth C

= 0, RL = 0 380 kHz

LOOP

Slew Rate 3.2 mA/µs

(2)

V

REG

Voltage 5 V
Voltage Accuracy I

= 0 ±0.05 ±0.1 V

REG

vs Temperature TA = −40°C to +125°C ±0.1 mV/°C

vs Supply Voltage, V+ V+ = 7.5V to 40V 1 mV/V
vs Output Current See Typical Characteristics

Short-Circuit Current 12 mA

POWER SUPPL Y

Specified Voltage Range V+ +24 V
Operating Voltage Range +7.5 +40 V
Quiescent Current I

Q

Over Temperature TA = −40°C to +125°C 250 µA

TEMPERATURE RANGE

Specified Range −40 +125 °C
Operating Range −55 +125 °C
Storage Range −55 +150 °C
Thermal Resistance q

JA

MSOP 150 °C/W
DFN 53 °C/W

(1)

Does not include initial error or temperature coefficient of R

(2)

Voltage measured with respect to I

RET

pin.

.

IN

XTR117

I

= I

x 100

O

IN

32 mA

−35 nA

0.6 µV

130 200 µA

UNITS

PP

3

"##$

SBOS344B − SEPTEMBER 2005 − REVISED JANUARY 2006

TYPICAL CHARACTERISTICS: V+ = +2.7V to +5.5V

At TA = +25°C, V+ = 24V, RIN = 20kΩ, and TIP29C external transistor, unless otherwise noted.

www.ti.com

45

CURRENT GAIN vs FREQUENCY

40

30

Gain (dB)

20

10

10k 100k

OVER−SCALE CURRENT vs TEMPERATURE

34

With External Transistor

33

32

V+ = 36V

31

30

Over−Scale Current (mA)

29

V+ = 24V

28

−75−

50−250 255075100

C

OUT

R

Frequency (Hz)

V+ = 7.5V

Temperature (_C)

=250

L

= 10nF

Ω

180

QUIESCENT CURRENT vs TEMPERATURE

170
160

A)

µ

150

C

=0

OUT

Ω

=0

R

L

140
130
120
110

Quiescent Current (

100

90

V+=36V

V+ = 24V

V+ = 7.5V

80

1M

−75−

50−250255075100

125

Temperature (_C)

VOLTAGEvs V

V

−55_

REG

C

Sourcing

Current

5.5
+125_C

5.0

Voltage (V)

+25_C

REG

V

Sinking
Current

CURRENT

REG

+25_C

−55_

+125_C

C

4.5

125

−

101 2 3

Current (mA)

I

REG

4

SPAN ERROR vs TEMPERATURE

OFFSET VOLTAGE DISTRIBUTION

50
40
30
20
10

0

Population

500−450−400−350−300−250−200−150−100

−

0

50

50

−

100

Offset Voltage (µV)

150

200

250

300

350

400

450

500

Span Error (m%)

−

10

−

20

−

30

−

40

−

50

−75−

50−250255075100

Temperature(_C)

125

4

www.ti.com

"##$

SBOS344B − SEPTEMBER 2005 − REVISED JANUARY 2006

APPLICATIONS INFORMATION

BASIC OPERATION

The XTR117 is a precision current output converter
designed to transmit analog 4-20mA signals over an
industry-standard current loop. Figure 1 shows basic
circuit connections with representative simplified input
circuitry. The XTR117 is a two-wire current transmitter.
Its input current (pin 2) controls the output current. A
portion of the output current flows into the V+ power
supply, pin 7. The remaining current flows in Q1.
External input circuitry connected to the XTR1 17 can be
powered from V
terminals must be returned to I
a local ground for input circuitry driving the XTR117.

The XTR117 is a current-input device with a gain of 100.
A current flowing into pin 2 produces IO = 100 x IIN. The
input voltage at the IIN pin is zero (referred to the I
pin). A voltage input is converted to an input current with
an external input resistor, RIN, as shown in Figure 1.
Typical full-scale input voltages range from 1V and
upward. Full-scale inputs greater than 0.5V are
recommend to minimize the ef fects of offset voltage and
drift of A1.

. Current drawn from these

REG

, pin 3. The I

RET

RET

pin is

RET

EXTERNAL TRANSISTOR

The external transistor, Q1, conducts the majority of the
full-scale output current. Power dissipation in this
transistor can approach 0.8W with high loop voltage
(40V) and 20mA output current. The XTR117 is
designed to use an external transistor to avoid on-chip,
thermal-induced errors. Heat produced by Q1 will still
cause ambient temperature changes that can influence
the XTR117 performance. To minimize these effects,
locate Q1 away from sensitive analog circuitry , including
XTR117. Mount Q1 so that heat is conducted to the
outside of the transducer housing.

The XTR117 is designed to use virtually any NPN
transistor with sufficient voltage, current and power
rating. Case style and thermal mounting considerations
often influence the choice for any given application.
Several possible choices are listed in Figure 1. A
MOSFET transistor will not improve the accuracy of the
XTR117 and is not recommended.

For improved precision use an external
voltage reference.

DEVICE VOLTAGE

REF3140
REF3130
REF3125

Use REF32xx for lower drift.

(V

)

REF

4.096V

3.0V

2.5V

Input

Circuitry

5V

V

IN

from I
All return current

R

20k

REG

I

REG

IN

I

IN

Ω

and I

REF

XTR117

V

REG

8

I

IN

I

2

RET

3

R

1

2.475k

A1

Ω

Figure 1. Basic Circuit Connections

+5V

Regulator

Possible choices for Q1(see text):

TYPE PACKAGE

MJE3440

TIP41C

MJD3340

V+
7

B

6

E

LIM

5

I

O

4

R

R

2

Ω

25

Q1

SOT−32
TO−220

D−PAK

C

OUT

10nF

I=100(I

I

O

V

LOOP

R

L

)

IN

5

"##$

SBOS344B − SEPTEMBER 2005 − REVISED JANUARY 2006

www.ti.com

MINIMUM OUTPUT CURRENT

The quiescent current of the XTR117 (typically 130 µA)
is the lower limit of its output current. Zero input current
(IIN = 0) will produce an IO equal to the quiescent current.
Output current will not begin to increase until
IIN > IQ/100. Current drawn from V

will be added to

REG

this minimum output current. Up to 3.8mA is available
to power external circuitry while still allowing the output
current to go below 4mA.

OFFSETTING THE INPUT

A low-scale output of 4mA is produced by creating a
40µA input current. This input current can be created
with the proper value resistor from an external
reference voltage (V
can be used as shown in Figure 2 but will not have the
temperature stability of a high quality reference such as
the REF3125.

V

REF

R

IN

62.5k

Ω

0to160µA

REF

(2.5V )or

...................

40µA

) as shown in Figure 2. V

XTR117

V

REG

8

I

IN

2

A1

REG

MAXIMUM OUTPUT CURRENT

The XTR117 provides accurate, linear output up to
25mA. Internal circuitry limits the output current to
approximately 32mA t o protect the transmitter and loop
power/measurement circuitry.

It is possible to extend the output current range of the
XTR117 by connecting an external resistor from pin 3
to pin 5, to change the current limit value. Since all
output current must flow through internal resistors, it is
possible to cause internal damage with excessive
current. Output currents greater than 45mA may cause
permanent damage.

REVERSE-VOLTAGE PROTECTION

The XTR117 low compliance voltage rating (minimum
operating voltage) of 7.5V permits the use of various
voltage protection methods without compromising
operating range. Figure 3 shows a diode bridge circuit
which allows normal operation even when the voltage
connection lines are reversed. The bridge causes a two
diode drop (approximately 1.4V) loss in loop supply
voltage. This voltage drop results in a compliance
voltage of approximately 9V—satisfactory for most
applications. A diode can be inserted in series with the
loop supply voltage and the V+ pin to protect against
reverse output connection lines with only a 0.7V loss in
loop supply voltage.

I

RET

3

R

1

2.475k

Ω

Figure 2. Creating Low-Scale Offset

XTR117

V

REG

8

R

IN

I

IN

2

V

IN

I

RET

3

NOTE: (1) Someexamples of zener diodes include: P6KE51 or 1N4755A. Use lower
voltage zener diodes with loop power−supply voltages < 30Vfor increased protection. See
Over−voltage Surge Protection.

R

1

2.475k

A1

Ω

+5V

Regulator

Figure 3. Reverse Voltage Operation and Over-Voltage Surge Protection

V+
7

B

Q1

6

E

5

R

LIM

R

2

Ω

25

IO=100V

R

4

0.01µF

IN

IN

(1)

D

1

IN4148

The diode bridge causes a

1.4Vloss in loopsupplyvoltage.
See Reverse−Voltage Protec tion.

MaximumVPSmust be less
than minimum voltagerating
of the zener diode.

V

R

LOOP

L

6

www.ti.com

"##$

SBOS344B − SEPTEMBER 2005 − REVISED JANUARY 2006

OVER-VOLTAGE SURGE PROTECTION

Remote connections to current transmitters can
sometimes be subjected to voltage surges. It is prudent
to limit the maximum surge voltage applied to the
XTR117 t o a s low as practical. Various zener diode an d
surge clamping diodes are specially designed for this
purpose. Select a clamp diode with as low a voltage
rating as possible for best protection. Absolute
maximum power-supply rating on the XTR117 is
specified at +50V. Keep overvoltages and transients
below +50V to ensure reliable operation when the
supply returns to normal (7.5V to 40V).

Most surge protection zener diodes have a diode
characteristic in the forward direction that will conduct
excessive current, possibly damaging receiving-side
circuitry if the loop connections are reversed. If a surge

protection diode is used, a series diode or diode bridge
should be used for protection against reversed
connections.

RADIO FREQUENCY INTERFERENCE

The long wire lengths of current loops invite radio
frequency (RF) interference. RF interference can be
rectified by the input circuitry of the XTR117 or
preceding circuitry. This effect generally appears as an
unstable output current that varies with the position of
loop supply or input wiring. Interference may also enter
at the input terminals. For integrated transmitter
assemblies with short connections to the sensor, the
interference more likely comes from the current loop
connections.

XTR117

V

REG

8

R

IN

V

D/A

O

I

IN

2

Digital
Control

Optical

Isolation

Digital
Control

µ

C

Optical

Isolation

PWM

Out

R

I

O

D/A

FILTER

R

C

IN

FILTER

I

RET

3

XTR117

V

REG

8

I

IN

2

I

RET

3

V

XTR117

REG

8

I

IN

2

I

RET

3

Figure 4. Digital Control Methods

7

"##$

SBOS344B − SEPTEMBER 2005 − REVISED JANUARY 2006

V

S

www.ti.com

P

+125_C

−40_ C

Nonlinear

Bridge

psi

0

50

Transducer

T

Ext Temp

PGA309

Fault

Monitor

Digital
Temperature
Compensation

Ext Temp

AnalogSensorLinearization

Int Temp

Linearization

Circuit

Auto−Zero

PGA

Analog Signal Conditioning

Temp

ADC

Over/Under

ScaleLimiter

Control Register

Interface Ci rcuitry

EEPROM

(SOT23−5)

Ref

LinDAC

Digital Calibration

Figure 5. Complete 4-20mA Pressure Transducer Solution with PGA309 and XTR117

DFN PACKAGE

The XTR117 is offered in a DFN-8 package (also known
as SON). The DFN is a QFN package with lead contacts
on only two sides of the bottom of the package. This
leadless package maximizes board space and
enhances thermal and electrical characteristics through
an exposed pad.

DFN packages are physically small, have a smaller
routing area, improved thermal performance, and
improved electrical parasitics. Additionally , the absence
of external leads eliminates bent-lead issues.

The DFN package can be easily mounted using
standard printed circuit board (PCB) assembly
techniques. See Application Note, QFN/SON PCB

Attachment (SLUA271) and Application Report, Quad
Flatpack No-Lead Logic Packages (SCBA017), both

available for download at www.ti.com.

The exposed leadframe die pad on the bottom of
the package should be connected to I
unconnected.

RET

or left

2.5V

Linear

V

OUT

(1)

R

IN

Ω

25k

NOTE: (1) PGA309V

V

R
125k

XTR117

REG

8

OS

Ω

I

IN

2

I

RET

3

R

1

Ω

2.475k

: 0.5V to4.5V.

OUT

A1

+5V

Regulator

R
25Ω

V+
7

B

Q1

6

E
5

R

LIM

IO=100V

2

IN

R

IN

4

LAYOUT GUIDELINES

The exposed leadframe die pad on the DFN package
should be soldered to a thermal pad on the PCB. A
mechanical drawing showing an example layout is
attached at the end of this data sheet. Refinements to
this layout may be required based on assembly process
requirements. Mechanical drawings located at the end
of this data sheet list the physical dimensions for the
package and pad. The five holes in the landing pattern
are optional, and are intended for use with thermal vias
that connect the leadframe die pad to the heatsink area
on the PCB.

Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests.
Even with applications that have low power dissipation,
the exposed pad must be soldered to the PCB to
provide structural integrity and long-term stability.

I

O

V

LOOP

R

L

8

PACKAGE OPTION ADDENDUM

www.ti.com

5-Feb-2007

PACKAGING INFORMATION

Orderable Device Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

XTR117AIDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS &

no Sb/Br)

XTR117AIDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS &

no Sb/Br)

XTR117AIDGKT ACTIVE MSOP DGK 8 250 Green (RoHS &

no Sb/Br)

XTR117AIDGKTG4 ACTIVE MSOP DGK 8 250 Green (RoHS &

no Sb/Br)

XTR117AIDRBR ACTIVE SON DRB 8 3000 Green (RoHS &

no Sb/Br)

XTR117AIDRBRG4 ACTIVE SON DRB 8 3000 Green (RoHS &

no Sb/Br)

XTR117AIDRBT ACTIVE SON DRB 8 250 Green (RoHS &

no Sb/Br)

XTR117AIDRBTG4 ACTIVE SON DRB 8 250 Green (RoHS &

no Sb/Br)

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)

Lead/Ball Finish MSL Peak Temp

Call TI Level-3-260C-168 HR

Call TI Level-3-260C-168 HR

Call TI Level-3-260C-168 HR

Call TI Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

CU NIPDAU Level-3-260C-168 HR

(3)

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

TAPE AND REEL INFORMATION

11-Mar-2008

*All dimensions are nominal

Device Package

XTR117AIDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

XTR117AIDGKT MSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
XTR117AIDRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
XTR117AIDRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2

Type

Package
Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

XTR117AIDGKR MSOP DGK 8 2500 346.0 346.0 29.0
XTR117AIDGKT MSOP DGK 8 250 184.0 184.0 50.0
XTR117AIDRBR SON DRB 8 3000 346.0 346.0 29.0
XTR117AIDRBT SON DRB 8 250 190.5 212.7 31.8

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Clocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrol
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Telephony www.ti.com/telephony
RF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2008, Texas Instruments Incorporated

Wireless www.ti.com/wireless