Texas Instruments UCC3921N, UCC3921DTR, UCC3921D, UCC2921DTR, UCC2921D Datasheet

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3/98
FEATURES
Precision Fault Threshold
Programmable:
Average Power Limiting, Linear Current Control, Overcurrent Limit and Fault Time
Fault Output Indication Signal
Operation Mode
Shutdown Control
Undervoltage Lockout
250µs Glitch Filter on the SDFLTCH
pin
8-Pin DIL and SOIC
Latchable Negative Floating Hot Swap Power Manager
BLOCK DIAGRAM
UCC1921 UCC2921 UCC3921
UDG-99052
DESCRIPTION
The UCC3921 family of negative floating hot swap power managers pro­vides complete power management, hot swap, and fault handling capa­bility. The IC is referenced to the negative input voltage and is powered through an external resistor connected to ground, which is essentially a current drive as opposed to the traditional voltage drive. The onboard 10V shunt regulator protects the IC from excess voltage and serves as a reference for programming the maximum allowable output sourcing cur­rent during a fault. All control and housekeeping functions are integrated and externally programmable. These include the fault current level, maxi­mum output sourcing current, maximum fault time, selection of Retry or Latched mode, soft start time, and average power limiting. In the event of a constant fault, the internal timer will limit the on time from less than
0.1% to a maximum of 3% duty cycle. The duty cycle modulation de­pends on the current into PL, which is a function of the voltage across the FET, thus limiting average power dissipation in the FET. The fault level is fixed at 50mV across the current sense amplifier to minimize total
(continued)
2
UCC1921 UCC2921 UCC3921
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, TA= 0°C to 70°C for the UCC3921 and –40°C to 85°C
for the UCC2921, and –55°C to 125°C for the UCC1921; I
VDD
= 2mA, CT= 1nF (the minimum allowable value), there is no
resistor connected between the SDFLTCH and VSS pins. TA=TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
VDD Section
IDD 12mA Regulator Voltage I
SOURCE
= 2mA 9 9.5 10.0 V
I
SOURCE
= 10mA 9.15 9.6 10.15 V
UVLO Off Voltage 678V
Fault Timing Section
Overcurrent Threshold T
J
= 25°C 47.5 50 53.5 mV
Over Operating Temperature 46 50 53.5 mV Overcurrent Input Bias 50 500 nA CT Charge Current V
CT
= 1V, IPL= 0 –50 –36 –22 µA
Overload Condition, V
SENSE-VIMAX
= 300mV –1.7 –1.2 –0.7 mA CT Discharge Current VCT= 1V, IPL= 0 0.6 1 1.5 µA CT Fault Threshold 2.2 2.45 2.6 V CT Reset Threshold 0.41 0.49 0.57 V Output Duty Cycle Fault Condition, I
PL
= 0 1.7 2.7 3.7 %
CONNECTION DIAGRAM
DIL-8 , SOIC-8 (Top View) NorJ,DPackages
ABSOLUTE MAXIMUM RATINGS
IVDD..........................................50mA
SDFLTCH Current ..............................10mA
PL Current ....................................10mA
IMAX Input Voltage ..............................VDD
Storage Temperature ...................65°C to +150°C
Junction Temperature...................–55°C to +150°C
Lead Temperature (Soldering, 10 sec.) .............+300°C
All voltages are with respect to VSS(the most negative voltage). Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages.
dropout. The fault current level is set with an external current sense resistor, while the maximum allowable sourcing current is programmed with a voltage divider from VDD to generate a fixed voltage on IMAX. The cur­rent level, when the output acts as a current source, is equal to V
IMAX/RSENSE. If desired, a controlled current
start up can be programmed with a capacitor on IMAX. When the output current is below the fault level, the out-
put device is switched on. When the output current ex­ceeds the fault level, but is less than the maximum sourcing level programmed by IMAX, the output remains switched on, and the fault timer starts charging C
T. Once
C
T charges to 2.5V, the output device is turned off and
performs a retry some time later (provided that the se­lected mode of operation is Automatic Retry Mode). When the output current reaches the maximum sourcing current level, the output acts as a current source, limiting the output current to the set value defined by IMAX.
Other features of the UCC3921 include undervoltage lockout, 8-pin Small Outline (SOIC) and Dual-In-Line (DIL) packages, and a Latched Operation Mode option, in which the output is latched off once C
T charges to
2.5V and stays off until either SDFLTCH is toggled (for greater than 1ms) or the IC is powered down and then back up.
DESCRIPTION (continued)
3
UCC1921 UCC2921 UCC3921
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, TA= 0°C to 70°C for the UCC3921 and –40°C to 85°C
for the UCC2921, and –55°C to 125°C for the UCC1921; I
VDD
= 2mA, CT= 1nF (the minimum allowable value), there is no
resistor connected between the SDFLTCH and VSS pins. TA=TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Output Section
Output High Voltage I
OUT
= 0mA 8.5 10 V
I
OUT
= –1mA 6 8 V
Output Low Voltage I
OUT
= 0mA, V
SENSE–VIMAX
= 100mV 0 10 mV
I
OUT
= 2mA, V
SENSE–VIMAX
= 100mV 200 600 mV
Linear Amplifier Section
Sense Control Voltage V
IMAX
= 100mV 85 100 115 mV
V
IMAX
= 400mV 370 400 430 mV
Input Bias 50 500 nA
Power Limiting Section
V
SENSE Regulator Voltage I
PL
=64µA 4.35 4.85 5.35 V
Duty Cycle Control IPL=64µA 0.6 1.2 1.7 %
IPL= 1mA 0.045 0.1 0.17 %
Overload Section
Delay to Output Note 1 300 500 ns Output Sink Current V
SENSE–VIMAX
= 300mV 40 100 mA
Threshold Relative to IMAX 140 200 260 mV
Shutdown/Fault/Latch Section
Shutdown Threshold 3 5 VDD+1 V Input Current V
SDFLTCH
= 5V 50 110 250 µA Filter Delay Time (Delay to Output) 250 500 1000 µs Fault Output High 6 9.5 V
I
SDFLTCH
= –100µA 5 8.5 V Fault Output Low 010mV Output Duty Cycle Fault Condition, I
PL
= 0 1.7 2.7 3.7 %
I
SDFLTCH
= –100µA, Fault Condition, IPL=0 0 %
Note 1: Guaranteed by design. Not 100% tested in production.
PIN DESCRIPTIONS
CT: A capacitor is connected to this pin in order to set
the fault time. The fault time must be longer than the time to charge external load capacitance. The fault time is defined as:
T
C
I
FAULT
T
CH
=
2
where ICH =36µA+IPL, and IPL is the current into the power limit pin. Once the maximum fault time is reached the output will shutdown for a time given by:
TC
SD T
=•
210
6
IMAX: This pin programs the maximum allowable sourcing current. Since VDD is a regulated voltage, a voltage divider can be derived from VDD to generate the program level for IMAX. The current level at which the output appears as a current source is equal to the
voltage on IMAX over the current sense resistor. If desired, a controlled current start up can be programmed with a capacitor on IMAX, and a programmed start delay can be achieved by driving the shutdown with an open collector/drain device into an RC network.
OUT: This pin provides gate output drive to the MOSFET pass element.
PL: This feature ensures that the average MOSFET power dissipation is controlled. A resistor is connected from this pin to the drain of the NMOS pass element. When the voltage across the NMOS exceeds 5V, current will flow into the PL pin which adds to the fault timer charge current, reducing the duty cycle from the 3% level. When I
PL
>>36µA, then the average MOSFET
power dissipation is given by:
P avg IMAX R
MOSFET PL
=•••
110
6
4
UCC1921 UCC2921 UCC3921
Figure 1. Fault Timing Circuitry for the UCC3921, Including Power Limit Overload
APPLICATION INFORMATION
UDG-96275-1
SENSE: Input voltage from the current sense resistor. When there is greater than 50mV across this pin with respect to VSS, then a fault is sensed, and C
T
starts to
charge. SDFLTCH: This pin provides fault output indication,
shutdown control, and operating mode selection. Interface into and out of this pin is usually performed through level shift transistors. When open, and under a non-fault condition, this pin pulls to a low state with respect to VSS. When a fault is detected by the fault timer, or undervoltage lockout, this pin will drive to a high state with respect fo VSS, indicating the NMOS pass element is OFF. When > 250µA is sourced into this pin for > 1ms, it drives high causing the output to disable the NMOS pass device.
If an 5k < R
LATCH
< 250kresistor is placed from this pin to VSS, then the latched operating mode will be invoked. Upon the occurrence of a fault, under the latched mode of operation, once the C
T
capacitor charges up to 2.5V the NMOS pass element latches off. A retry will not periodically occur. To reset the latched off device, either SDFLTCH is toggled high for a duration greater than 1ms or the IC is powered down and then up.
VDD: Current driven with a resistor to a voltage approxi­mately 10V more positive than VSS. Typically a resistor is connected to ground. The 10V shunt regulator clamps VDD approximately 10V above VSS, and is also used as an output reference to program the maximum allowable sourcing current.
VSS: Ground reference for the IC and the most negative voltage available.
PIN DESCRIPTIONS (continued)
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