TEXAS INSTRUMENTS N74LVC32244 Technical data

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SN74LVC32244
32-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES342C – OCTOBER 2000 – REVISED APRIL 2005

FEATURES

Member of the Texas Instruments Widebus+™ Family I
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpdof 4.1 ns at 3.3 V
< 0.8 V at V
OLP
CC
(Output Ground Bounce)
= 3.3 V, T
A
= 25°C
> 2 V at V
Supports Partial-Power-Down Mode
off
OHV
CC
(Output V
= 3.3 V, T
A
OH
= 25°C
Undershoot)
Operation
Supports Mixed-Mode Signal Operation on
All Ports (5-V Input/Output Voltage With
3.3-V V
)
CC

DESCRIPTION/ORDERING INFORMATION

This 32-bit buffer/driver is designed for 1.65-V to 3.6-V V The SN74LVC32244 is designed specifically to improve the performance and density of 3-state memory address
drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as eight 4-bit buffers, four 8-bit buffers, two 16-bit buffers, or one 32-bit buffer. It
provides true outputs and symmetrical active-low output-enable ( OE) inputs. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment. This device is fully specified for partial-power-down applications using I
preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to V
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
operation.
CC
. The I
off
circuitry disables the outputs,
off
through a pullup
CC
ORDERING INFORMATION
T
A
–40°C to 85°C Tape and reel NC244
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
LFBGA GKE SN74LVC32244GKER LFBGA ZKE (Pb-free) SN74LVC32244ZKER
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus+ is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 2000–2005, Texas Instruments Incorporated
www.ti.com
GKE OR ZKE PACKAGE
(TOP VIEW)
J
H
G
F
E
D
C
B
A
21 3 4 65
P
N
M
L
K
T
R
SN74LVC32244 32-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCES342C – OCTOBER 2000 – REVISED APRIL 2005
2
TERMINAL ASSIGNMENTS
1 2 3 4 5 6
A 1Y2 1Y1 1 OE 2 OE 1A1 1A2 B 1Y4 1Y3 GND GND 1A3 1A4 C 2Y2 2Y1 V D 2Y4 2Y3 GND GND 2A3 2A4 E 3Y2 3Y1 GND GND 3A1 3A2 F 3Y4 3Y3 V G 4Y2 4Y1 GND GND 4A1 4A2 H 4Y3 4Y4 4 OE 3 OE 4A4 4A3 J 5Y2 5Y1 5 OE 6 OE 5A1 5A2 K 5Y4 5Y3 GND GND 5A3 5A4 L 6Y2 6Y1 V M 6Y4 6Y3 GND GND 6A3 6A4 N 7Y2 7Y1 GND GND 7A1 7A2 P 7Y4 7Y3 V R 8Y2 8Y1 GND GND 8A1 8A2 T 8Y3 8Y4 8 OE 7 OE 8A4 8A3
CC
CC
CC
CC
V
CC
V
CC
V
CC
V
CC
2A1 2A2
3A3 3A4
6A1 6A2
7A3 7A4
FUNCTION TABLE
(EACH 4-BIT BUFFER)
INPUTS
OE A
L H H L L L
H X Z
OUTPUT
Y
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1OE
1A1
1A2
1A3
1A4
1Y1
1Y2
1Y3
1Y4
A3
A5
A6
B5
B6
A2
A1
B2
B1
2OE
2A1
2A2
2A3
2A4
2Y1
2Y2
2Y3
2Y4
A4
C5
C6
D5
D6
C2
C1
D2
D1
3OE
3A1
3A2
3A3
3A4
3Y1
3Y2
3Y3
3Y4
H4
E5
E6
F5
F6
E2
E1
F2
F1
4OE
4A1
4A2
4A3
4A4
4Y1
4Y2
4Y3
4Y4
H3
G5
G6
H6
H5
G2
G1
H1
H2
5OE
5A1
5A2
5A3
5A4
5Y1
5Y2
5Y3
5Y4
J3
J5
J6
K5
K6
J2
J1
K2
K1
6OE
6A1
6A2
6A3
6A4
6Y1
6Y2
6Y3
6Y4
J4
L5
L6
M5
M6
L2
L1
M2
M1
7OE
7A1
7A2
7A3
7A4
7Y1
7Y2
7Y3
7Y4
T4
N5
N6
P5
P6
N2
N1
P2
P1
8OE
8A1
8A2
8A3
8A4
8Y1
8Y2
8Y3
8Y4
T3
R5
R6
T6
T5
R2
R1
T1
T2
LOGIC DIAGRAM (POSITIVE LOGIC)
SN74LVC32244
32-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES342C – OCTOBER 2000 – REVISED APRIL 2005
3
www.ti.com
SN74LVC32244 32-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCES342C – OCTOBER 2000 – REVISED APRIL 2005

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)
V
Supply voltage range –0.5 6.5 V
CC
V
Input voltage range
I
V
Voltage range applied to any output in the high-impedance or power-off state
O
V
Voltage range applied to any output in the high or low state
O
I
Input clamp current VI< 0 –50 mA
IK
I
Output clamp current VO< 0 –50 mA
OK
I
Continuous output current ±50 mA
O
Continuous current through each V
θ
Package thermal impedance
JA
T
Storage temperature range –65 150 °C
stg
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) The value of V (4) The package thermal impedance is calculated in accordance with JESD 51-7.
(2)
is provided in the recommended operating conditions table.
CC
(1)
MIN MAX UNIT
–0.5 6.5 V
(2)
(2) (3)
or GND ±100 mA
CC
(4)
GKE/ZKE package 40 °C/W
–0.5 6.5 V –0.5 V
CC
+ 0.5 V

Recommended Operating Conditions

(1)
MIN MAX UNIT
V
V
V
V
V
I
OH
I
OL
Supply voltage V
CC
High-level input voltage V
IH
Low-level input voltage V
IL
Input voltage 0 5.5 V
I
Output voltage V
O
High-level output current mA
Low-level output current mA
Operating 1.65 3.6 Data retention only 1.5 V
= 1.65 V to 1.95 V 0.65 × V
CC
= 2.3 V to 2.7 V 1.7 V
CC
V
= 2.7 V to 3.6 V 2
CC
V
= 1.65 V to 1.95 V 0.35 × V
CC
= 2.3 V to 2.7 V 0.7 V
CC
V
= 2.7 V to 3.6 V 0.8
CC
CC
High or low state 0 V 3-state 0 5.5 V
= 1.65 V –4
CC
V
= 2.3 V –8
CC
V
= 2.7 V –12
CC
V
= 3 V –24
CC
V
= 1.65 V 4
CC
V
= 2.3 V 8
CC
V
= 2.7 V 12
CC
V
= 3 V 24
CC
t/ v Input transition rise or fall rate 10 ns/V T
(1) All unused inputs of the device must be held at V
Operating free-air temperature –40 85 °C
A
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CC
CC
CC
4
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Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
IOH= –100 µ A 1.65 V to 3.6 V V IOH= –4 mA 1.65 V 1.2
V
OH
V
OL
I
I
I
off
I
OZ
I
CC
I
CC
C
i
C
o
(1) All typical values are at V (2) This applies in the disabled state only.
IOH= –8 mA 2.3 V 1.7
IOH= –12 mA
IOH= –24 mA 3 V 2.2 IOL= 100 µ A 1.65 V to 3.6 V 0.2 IOL= 4 mA 1.65 V 0.45 IOL= 8 mA 2.3 V 0.7 V IOL= 12 mA 2.7 V 0.4 IOL= 24 mA 3 V 0.55 VI= 0 to 5.5 V 3.6 V ±5 µ A VIor VO= 5.5 V 0 ±10 µ A VO= 0 to 5.5 V 3.6 V ±10 µ A VI= V
3.6 V VI≤ 5.5 V One input at V VI= V VO= V
or GND 40
CC
or GND 3.3 V 5.5 pF
CC
CC
CC
(2)
0.6 V, Other inputs at V
CC
or GND 3.3 V 6 pF
= 3.3 V, TA= 25°C.
IO= 0 3.6 V µ A
or GND 2.7 V to 3.6 V 500 µ A
CC
32-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES342C – OCTOBER 2000 – REVISED APRIL 2005
CC
2.7 V 2.2 3 V 2.4
MIN TYP
0.2
CC
SN74LVC32244
(1)
MAX UNIT
V
40

Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
V
= 1.8 V V
PARAMETER UNIT
t
pd
t
en
t
dis
t
sk(o)
FROM TO
(INPUT) (OUTPUT)
A Y OE Y OE Y
CC
± 0.15 V ± 0.2 V ± 0.3 V
MIN MAX MIN MAX MIN MAX MIN MAX
(1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1) (1)
(1) This information was not available at the time of publication.
= 2.5 V V
CC
V
= 2.7 V
CC
CC
4.7 1.1 4.1 ns
5.8 1 4.6 ns
6.2 1.8 5.8 ns

Operating Characteristics

TA= 25°C
V
PARAMETER UNIT
C
Power dissipation capacitance
pd
per buffer/driver
(1) This information was not available at the time of publication.
= 1.8 V V
TEST
CONDITIONS
Outputs enabled Outputs disabled
f = 10 MHz pF
CC
TYP TYP TYP
(1) (1) (1) (1)
= 2.5 V V
CC
CC
= 3.3 V
1 ns
= 3.3 V
34
4
5
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V
M
From Output
Under Test
C
L
(see Note A)
LOAD CIRCUIT
S1
V
LOAD
Open
GND
R
L
R
L
Data Input
Timing Input
V
I
0 V
V
I
0 V
0 V
t
w
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
t
PLH
t
PHL
t
PHL
t
PLH
V
OH
V
OH
V
OL
V
OL
V
I
0 V
Input
Output Waveform 1 S1 at V
LOAD
(see Note B)
Output Waveform 2
S1 at GND
(see Note B)
V
OL
V
OH
t
PZL
t
PZH
t
PLZ
t
PHZ
V
LOAD
/2
0 V
VOL + V
VOH − V
0 V
V
I
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
V
LOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. t
PLZ
and t
PHZ
are the same as t
dis
.
F. t
PZL
and t
PZH
are the same as ten.
G. t
PLH
and t
PHL
are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
M
V
I
V
M
V
M
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
1 k 500 500 500
V
CC
R
L
2 × V
CC
2 × V
CC
6 V 6 V
V
LOAD
C
L
30 pF 30 pF 50 pF 50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
V
CC
V
CC
2.7 V
2.7 V
V
I
VCC/2 VCC/2
1.5 V
1.5 V
V
M
tr/t
f
2 ns
2 ns2.5 ns2.5 ns
INPUTS
t
su
t
h
SN74LVC32244 32-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS
SCES342C – OCTOBER 2000 – REVISED APRIL 2005

PARAMETER MEASUREMENT INFORMATION

6
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
SN74LVC32244GKER ACTIVE LFBGA GKE 96 1000 TBD SNPB Level-3-220C-168 HR SN74LVC32244ZKER ACTIVE LFBGA ZKE 96 1000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
SNAGCU Level-3-250C-168 HR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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