The MSP430x4xx Family User’s Guide,
Literature Number SLAU056
†
’F435, ’F436, and ’F437 devices
‡
’F447, ’F448, and ’F449 devices
§
The MSP430F43x1 devices are identical to the MSP430F43x
devices with the exception that the ADC12 module is not
implemented.
description
The Texas Instruments MSP430 family of ultralow power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less
than 6 μs.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited
built-in ESD protection.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
description (continued)
The MSP430x43x(1) and the MSP430x44x series are microcontroller configurations with two built-in 16-bit
timers, a fast 12-bit A/D converter (not implemented on the MSP430F43x1 devices), one or two universal serial
synchronous/asynchronous communication interfaces (USART), 48 I/O pins, and a liquid crystal driver (LCD)
with up to 160 segments.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and
process and transmit the data to a host system, or process this data and display it on a LCD panel. The timers
make the configurations ideal for industrial control applications such as ripple counters, digital motor control,
EE-meters, hand-held meters, etc. The hardware multiplier enhances the performance and offers a broad code
and hardware-compatible family solution.
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
MSP430x43x1 functional block diagram
DV
XIN
XOUT
CC1/2DVSS1/2AVCCAVSS
P1
8
P2
8
P3
P4
8
8
P5
8
P6
8
XT2IN
XT2OUT
Oscillator
FLL+
8 MHz
CPU
incl. 16
Registers
Emulation
Module
JTAG
Interface
MCLK
ACLK
SMCLK
MAB
MDB
Flash
32KB
24KB
16KB
RAM
1KB
512B
POR/
SVS/
Brownout
RST/NMI
MSP430x43x functional block diagram
DV
CC1/2DVSS1/2AVCCAVSS
ACLK
SMCLK
Flash
32KB
24KB
16KB
RAM
1KB
512B
XT2IN
XT2OUT
XIN
Oscillator
FLL+
XOUT
MCLK
Port 1
8 I/O
Interrupt
Capability
P1
8
Port 1
8 I/O
Interrupt
Capability
Port 2
8 I/O
Interrupt
Capability
Watchdog
Timer
WDT
15/16-Bit
P2
8
Port 2
8 I/O
Interrupt
Capability
Port 3
8 I/O
Timer_B3
3 CC Reg
Shadow
Reg
P3
Port 3
8 I/O
8
UART Mode
SPI Mode
Segments
1,2,3,4 MUX
f
LCD
UART Mode
SPI Mode
USART0
LCD
128/160
USART0
Port 4
8 I/O
Timer_A3
3 CC Reg
P4
8
8
Port 4
8 I/O
Port 5
8 I/O
Comparator_
A
P5
8
Port 5
8 I/O
Port 6
6 I/O
Basic
Timer 1
1 Interrupt
Vector
P6
Port 6
6 I/O
8 MHz
CPU
incl. 16
Registers
Emulation
Module
JTAG
Interface
MAB
MDB
POR/
SVS/
Brownout
RST/NMI
ADC12
12-Bit
8 Channels
<10μs Conv.
Watchdog
Timer
WDT
15/16-Bit
Timer_B3
3 CC Reg
Shadow
Reg
Timer_A3
3 CC Reg
Comparator_
A
Basic
Timer 1
1 Interrupt
Vector
Segments
1,2,3,4 MUX
f
LCD
LCD
128/160
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430x44x functional block diagram
DV
XIN
XOUT
CC1/2DVSS1/2AVCCAVSS
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
P1
8
P2
8
P3
P4
8
8
P5
8
P6
8
XT2IN
XT2OUT
Oscillator
FLL+
8 MHz
CPU
incl. 16
Registers
Emulation
Module
JTAG
Interface
MCLK
ACLK
SMCLK
Flash
60KB
48KB
32KB
MAB
MDB
Hardware
Multiplier
MPY, MPYS
MAC,MACS
RAM
2KB
1KB
POR/
SVS/
Brownout
RST/NMI
Port 1
8 I/O
Interrupt
Capability
ADC12
12-Bit
8 Channels
<10μs Conv.
Port 2
8 I/O
Interrupt
Capability
Watchdog
Timer
WDT
15/16-Bit
Port 3
8 I/O
Timer_B7
7 CC Reg
Shadow
Reg
Port 4
8 I/O
Timer_A3
3 CC Reg
Port 5
8 I/O
Comparator_
A
Port 6
6 I/O
Basic
Timer 1
1 Interrupt
Vector
USART0
USART1
UART Mode
SPI Mode
Segments
1,2,3,4 MUX
f
LCD
LCD
160
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
9
MSP430x43x1, MSP430x43x, MSP430x44x
DESCRIPTION
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
MSP430x43x1 Terminal Functions
TERMINAL
PN
NAMENO.
DV
CC1
P6.32I/OP6.32I/OGeneral-purpose digital I/O
P6.43I/OP6.43I/OGeneral-purpose digital I/O
P6.54I/OP6.54I/OGeneral-purpose digital I/O
P6.65I/OP6.65I/OGeneral-purpose digital I/O
P6.7/SVSIN6I/OP6.7/SVSIN6I/OGeneral-purpose digital I/O / input to brownout, supply voltage
Reserved7Reserved7Reserved, do not connect externally
XIN8IXIN8I
XOUT9OXOUT9OOutput terminal of crystal oscillator XT1
DV
R0348IR0356IInput port of fourth positive (lowest) analog LCD level (V5)
P5.5/R1349I/OP5.5/R1357I/O
P5.6/R2350I/OP5.6/R2358I/O
P5.7/R3351I/OP5.7/R3359I/O
DV
CC2
DV
SS2
P2.5/URXD054I/OP2.5/URXD074I/OGeneral-purpose digital I/O / receive data in—USART0/UART mode
I/O
S3244OLCD segment output 32
S3345OLCD segment output 33
P4.7/S3446I/OGeneral-purpose digital I/O / LCD segment output 34
P4.6/S3547I/OGeneral-purpose digital I/O / LCD segment output 35
P4.5/S3648I/OGeneral-purpose digital I/O / LCD segment output 36
P4.4/S3749I/OGeneral-purpose digital I/O / LCD segment output 37
P4.3/S3850I/OGeneral-purpose digital I/O / LCD segment output 38
P4.2/S3951I/OGeneral-purpose digital I/O / LCD segment output 39
52DV
53DV
P4.162I/OGeneral-purpose digital I/O
P4.063I/OGeneral-purpose digital I/O
P3.764I/OGeneral-purpose digital I/O
P3.665I/OGeneral-purpose digital I/O
P3.566I/OGeneral-purpose digital I/O
P3.467I/OGeneral-purpose digital I/O
P3.3/UCLK068I/O
P3.2/SOMI069I/OGeneral-purpose digital I/O / slave out/master in of USART0/SPI mode
P3.1/SIMO070I/OGeneral-purpose digital I/O / slave in/master out of USART0/SPI mode
P3.0/STE071I/OGeneral-purpose digital I/O / slave transmit enable USART0/SPI mode
P2.772I/OGeneral-purpose digital I/O
P2.6/CAOUT73I/OGeneral-purpose digital I/O / Comparator_A output
PZ
NAMENO.
CC2
SS2
I/O
General-purpose digital I/O / ext. clock i/p—USART0/UART or SPI
mode, clock o/p—USART0/SPI mode / LCD segment output 28
General-purpose digital I/O / slave out/master in of USART0/SPI mode
/ LCD segment output 29
General-purpose digital I/O / slave out/master out of USART0/SPI
mode / LCD segment output 30
Input port for crystal oscillator XT2. Only standard crystals can be
connected.
Test data output port. TDO/TDI data output or programming data input
terminal
Test data input or test clock input. The device protection fuse is
connected to TDI/TCLK.
Test mode select. TMS is used as an input port for device programming
and test.
General-purpose digital I/O / reset input or nonmaskable interrupt input
port
Analog supply voltage, negative terminal. Supplies SVS, brownout,
oscillator, comparator_A, port 1, and LCD resistive divider circuitry.
Analog supply voltage, positive terminal. Supplies SVS, brownout,
oscillator, comparator_A, port 1, and LCD resistive divider circuitry;
must not power up prior to DV
DESCRIPTION
/DV
CC1
CC2
.
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430x43x1, MSP430x43x, MSP430x44x
DESCRIPTION
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
MSP430x43x Terminal Functions
TERMINAL
PN
NAMENO.
DV
CC1
I/O
1DV
P6.3/A32I/OP6.3/A32I/OGeneral-purpose digital I/O / analog input a3—12-bit ADC
P6.4/A43I/OP6.4/A43I/OGeneral-purpose digital I/O / analog input a4—12-bit ADC
P6.5/A54I/OP6.5/A54I/OGeneral-purpose digital I/O / analog input a5—12-bit ADC
P6.6/A65I/OP6.6/A65I/OGeneral-purpose digital I/O / analog input a6—12-bit ADC
P6.7/A7/SVSIN6I/OP6.7/A7/SVSIN6I/OGeneral-purpose digital I/O / analog input a7—12-bit ADC, analog /
V
REF+
7OV
REF+
XIN8IXIN8I
XOUT9OXOUT9OOutput terminal of crystal oscillator XT1
Ve
R0348IR0356IInput port of fourth positive (lowest) analog LCD level (V5)
P5.5/R1349I/OP5.5/R1357I/O
P5.6/R2350I/OP5.6/R2358I/O
P5.7/R3351I/OP5.7/R3359I/O
DV
CC2
DV
SS2
P2.5/URXD054I/OP2.5/URXD074I/OGeneral-purpose digital I/O / receive data in—USART0/UART mode
I/O
S3244OLCD segment output 32
S3345OLCD segment output 33
P4.7/S3446I/OGeneral-purpose digital I/O / LCD segment output 34
P4.6/S3547I/OGeneral-purpose digital I/O / LCD segment output 35
P4.5/S3648I/OGeneral-purpose digital I/O / LCD segment output 36
P4.4/S3749I/OGeneral-purpose digital I/O / LCD segment output 37
P4.3/S3850I/OGeneral-purpose digital I/O / LCD segment output 38
P4.2/S3951I/OGeneral-purpose digital I/O / LCD segment output 39
52DV
53DV
P4.162I/OGeneral-purpose digital I/O
P4.063I/OGeneral-purpose digital I/O
P3.764I/OGeneral-purpose digital I/O
P3.665I/OGeneral-purpose digital I/O
P3.566I/OGeneral-purpose digital I/O
P3.467I/OGeneral-purpose digital I/O
P3.3/UCLK068I/O
P3.2/SOMI069I/OGeneral-purpose digital I/O / slave out/master in of USART0/SPI mode
P3.1/SIMO070I/OGeneral-purpose digital I/O / slave in/master out of USART0/SPI mode
P3.0/STE071I/OGeneral-purpose digital I/O / slave transmit enable USART0/SPI mode
P2.7/ADC12CLK72I/OGeneral-purpose digital I/O / conversion clock—12-bit ADC
P2.6/CAOUT73I/OGeneral-purpose digital I/O / Comparator_A output
PZ
NAMENO.
CC2
SS2
I/O
General-purpose digital I/O / ext. clock i/p—USART0/UART or SPI
mode, clock o/p—USART0/SPI mode / LCD segment output 28
General-purpose digital I/O / slave out/master in of USART0/SPI mode
/ LCD segment output 29
General-purpose digital I/O / slave out/master out of USART0/SPI
mode / LCD segment output 30
General-purpose digital I/O / external clock input—USART0/UART or
SPI mode, clock output—USART0/SPI mode
DESCRIPTION
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430x43x1, MSP430x43x, MSP430x44x
DESCRIPTION
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
MSP430x43x Terminal Functions (Continued)
TERMINAL
PN
NAMENO.
P2.4/UTXD055I/OP2.4/UTXD075I/OGeneral-purpose digital I/O / transmit data out—USART0/UART mode
P2.3/TB256I/OP2.3/TB276I/O
P2.2/TB157I/OP2.2/TB177I/O
P2.1/TB058I/OP2.1/TB078I/O
P2.0/TA259I/OP2.0/TA279I/O
P1.7/CA160I/OP1.7/CA180I/OGeneral-purpose digital I/O / Comparator_A input
P1.6/CA061I/OP1.6/CA081I/OGeneral-purpose digital I/O / Comparator_A input
P1.5/TACLK/
ACLK
P1.4/TBCLK/
SMCLK
P1.3/TBOUTH/
SVSOUT
P1.2/TA165I/OP1.2/TA185I/O
P1.1/TA0/MCLK66I/OP1.1/TA0/MCLK86I/O
P1.0/TA067I/OP1.0/TA087I/O
XT2OUT68OXT2OUT88OOutput terminal of crystal oscillator XT2
XT2IN69IXT2IN89I
TDO/TDI70I/OTDO/TDI90I/O
TDI/TCLK71ITDI/TCLK91I
TMS72ITMS92I
TCK73ITCK93ITest clock. TCK is the clock input port for device programming and test.
RST/NMI74IRST/NMI94I
P6.0/A075I/OP6.0/A095I/OGeneral-purpose digital I/O / analog input a0 − 12-bit ADC
P6.1/A176I/OP6.1/A196I/OGeneral-purpose digital I/O / analog input a1 − 12-bit ADC
P6.2/A277I/OP6.2/A297I/OGeneral-purpose digital I/O / analog input a2 − 12-bit ADC
Input port for crystal oscillator XT2. Only standard crystals can be
connected.
Test data output port. TDO/TDI data output or programming data input
terminal
Test data input or test clock input. The device protection fuse is
connected to TDI/TCLK.
Test mode select. TMS is used as an input port for device programming
and test.
General-purpose digital I/O / reset input or nonmaskable interrupt input
port
Analog supply voltage, negative terminal. Supplies SVS, brownout,
oscillator, comparator_A, ADC12, port 1, and LCD resistive divider
circuitry.
Analog supply voltage, positive terminal. Supplies SVS, brownout,
oscillator, comparator_A, ADC12, port 1, and LCD resistive divider
circuitry; must not power up prior to DV
DESCRIPTION
CC1
/DV
CC2
.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
15
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
MSP430x44x Terminal Functions
TERMINAL
NAMENO.
DV
CC1
P6.3/A32I/OGeneral-purpose digital I/O / analog input a3—12-bit ADC
P6.4/A43I/OGeneral-purpose digital I/O / analog input a4—12-bit ADC
P6.5/A54I/OGeneral-purpose digital I/O / analog input a5—12-bit ADC
P6.6/A65I/OGeneral-purpose digital I/O / analog input a6—12-bit ADC
P6.7/A7/SVSIN6I/O
V
REF+
XIN8IInput port for crystal oscillator XT1. Standard or watch crystals can be connected.
XOUT9OOutput terminal of crystal oscillator XT1
Ve
P4.4/SOMI1/S3749I/OGeneral-purpose digital I/O / slave out/master in of USART1/SPI mode / LCD segment output 37
P4.3/SIMO1/S3850I/OGeneral-purpose digital I/O / slave in/master out of USART1/SPI mode / LCD segment output 38
P4.2/STE1/S3951I/OGeneral-purpose digital I/O / slave transmit enable—USART1/SPI mode / LCD segment output 39
COM052OCOM0−3 are used for LCD backplanes.
P5.2/COM153I/OGeneral-purpose digital I/O / common output, COM0−3 are used for LCD backplanes.
P5.3/COM254I/OGeneral-purpose digital I/O / common output, COM0−3 are used for LCD backplanes.
P5.4/COM355I/OGeneral-purpose digital I/O / common output, COM0−3 are used for LCD backplanes.
R0356IInput port of fourth positive (lowest) analog LCD level (V5)
P5.5/R1357I/OGeneral-purpose digital I/O / Input port of third most positive analog LCD level (V4 or V3)
P5.6/R2358I/OGeneral-purpose digital I/O / Input port of second most positive analog LCD level (V2)
P5.7/R3359I/OGeneral-purpose digital I/O / Output port of most positive analog LCD level (V1)
DV
CC2
DV
SS2
P4.1/URXD162I/OGeneral-purpose digital I/O / receive data in—USART1/UART mode
P4.0/UTXD163I/OGeneral-purpose digital I/O / transmit data out—USART1/UART mode
P3.7/TB664I/OGeneral-purpose digital I/O / Timer_B7 CCR6 / Capture: CCI6A/CCI6B input, compare: Out6 output
P3.6/TB565I/OGeneral-purpose digital I/O / Timer_B7 CCR5 / Capture: CCI5A/CCI5B input, compare: Out5 output
P3.5/TB466I/OGeneral-purpose digital I/O / Timer_B7 CCR4 / Capture: CCI4A/CCI4B input, compare: Out4 output
P3.4/TB367I/OGeneral-purpose digital I/O / Timer_B7 CCR3 / Capture: CCI3A/CCI3B input, compare: Out3 output
P3.3/UCLK068I/O
P3.2/SOMI069I/OGeneral-purpose digital I/O / slave out/master in of USART0/SPI mode
P3.1/SIMO070I/OGeneral-purpose digital I/O / slave in/master out of USART0/SPI mode
P3.0/STE071I/OGeneral-purpose digital I/O / slave transmit enable—USART0/SPI mode
P2.7/ADC12CLK72I/OGeneral-purpose digital I/O / conversion clock—12-bit ADC
P2.6/CAOUT73I/OGeneral-purpose digital I/O / Comparator_A output
P2.5/URXD074I/OGeneral-purpose digital I/O / receive data in—USART0/UART mode
P2.4/UTXD075I/OGeneral-purpose digital I/O / transmit data out—USART0/UART mode
P2.3/TB276I/OGeneral-purpose digital I/O / Timer_B7 CCR2. Capture: CCI2A/CCI2B input, compare: Out2 output
P2.2/TB177I/OGeneral-purpose digital I/O / Timer_B7 CCR1. Capture: CCI1A/CCI1B input, compare: Out1 output
P2.1/TB078I/OGeneral-purpose digital I/O / Timer_B7 CCR0. Capture: CCI0A/CCI0B input, compare: Out0 output
P2.0/TA279I/OGeneral-purpose digital I/O / Timer_A Capture: CCI2A input, compare: Out2 output
P1.7/CA180I/OGeneral-purpose digital I/O / Comparator_A input
I/ODESCRIPTION
General-purpose digital I/O / external clock input—USART1/UART or SPI mode, clock
output—USART1/SPI MODE / LCD segment output 36
P1.0/TA087I/OGeneral-purpose digital I/O / Timer_A. Capture: CCI0A input, compare: Out0 output / BSL transmit
XT2OUT88OOutput terminal of crystal oscillator XT2
XT2IN89IInput port for crystal oscillator XT2. Only standard crystals can be connected.
TDO/TDI90I/OTest data output port. TDO/TDI data output or programming data input terminal
TDI/TCLK91ITest data input or test clock input. The device protection fuse is connected to TDI/TCLK.
TMS92ITest mode select. TMS is used as an input port for device programming and test.
TCK93ITest clock. TCK is the clock input port for device programming and test.
RST/NMI94IReset input or nonmaskable interrupt input port
P6.0/A095I/OGeneral-purpose digital I/O, analog input a0—12-bit ADC
P6.1/A196I/OGeneral-purpose digital I/O, analog input a1—12-bit ADC
P6.2/A297I/OGeneral-purpose digital I/O, analog input a2—12-bit ADC
AV
SS
DV
SS1
AV
CC
I/ODESCRIPTION
82I/OGeneral-purpose digital I/O / Timer_A, clock signal TACLK input / ACLK output (divided by 1, 2, 4, or 8)
83I/OGeneral-purpose digital I/O / input clock TBCLK—Timer_B7 / submain system clock SMCLK output
84I/O
98
99Digital supply voltage, negative terminal.
100
General-purpose digital I/O / switch all PWM digital output ports to high impedance—Timer_B7 TB0 to TB6
/ SVS: output of SVS comparator
General-purpose digital I/O / Timer_A. Capture: CCI0B input / MCLK output.
Note: TA0 is only an input on this pin / BSL receive
Analog supply voltage, negative terminal. Supplies SVS, brownout, oscillator, comparator_A, ADC12,
port 1, and LCD resistive divider circuitry.
Analog supply voltage, positive terminal. Supplies SVS, brownout, oscillator, comparator_A, ADC12, port 1,
and LCD resistive divider circuitry; must not power up prior to DV
CC1
/DV
CC2
.
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
short-form description
CPU
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions,
are performed as register operations in
conjunction with seven addressing modes for
source operand and four addressing modes for
destination operand.
The CPU is integrated with 16 registers that
provide reduced instruction execution time. The
register-to-register operation execution time is
one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register,
and constant generator respectively. The
remaining registers are general-purpose
registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled
with all instructions.
instruction set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 1 shows examples of the three types of
instruction formats; the address modes are listed
in Table 2.
Program Counter
Stack Pointer
Status Register
Constant Generator
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
General-Purpose Register
PC/R0
SP/R1
SR/CG1/R2
CG2/R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15
Table 1. Instruction Word Formats
Dual operands, source-destinatione.g. ADD R4,R5R4 + R5 −−−> R5
Single operands, destination onlye.g. CALL R8PC −−>(TOS), R8−−> PC
Relative jump, un/conditionale.g. JNEJump-on-equal bit = 0
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
operating modes
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request and restore back to
the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
DActive mode (AM)
−All clocks are active
DLow-power mode 0 (LPM0)
−CPU is disabled
ACLK and SMCLK remain active. MCLK is disabled
FLL+ loop control remains active
DLow-power mode 1 (LPM1)
−CPU is disabled
FLL+ loop control is disabled
ACLK and SMCLK remain active. MCLK is disabled
DLow-power mode 2 (LPM2)
−CPU is disabled
MCLK, FLL+ loop control, and DCOCLK are disabled
DCO’s dc-generator remains enabled
ACLK remains active
DLow-power mode 3 (LPM3)
−CPU is disabled
MCLK, FLL+ loop control, and DCOCLK are disabled
DCO’s dc-generator is disabled
ACLK remains active
DLow-power mode 4 (LPM4)
−CPU is disabled
ACLK is disabled
MCLK, FLL+ loop control, and DCOCLK are disabled
DCO’s dc-generator is disabled
Crystal oscillator is stopped
20
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MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
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interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the address range 0FFFFh−0FFE0h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 3. Interrupt Sources, Flags, and Vectors of 4xx Configurations
INTERRUPT SOURCEINTERRUPT FLAGSYSTEM INTERRUPT
Power-Up
External Reset
Watchdog
Flash Memory
NMI
Oscillator Fault
Flash Memory Access Violation
Timer_B7
Timer_B7
Comparator_ACAIFGMaskable0FFF6h11
Watchdog TimerWDTIFGMaskable0FFF4h10
USART0 ReceiveURXIFG0Maskable0FFF2h9
USART0 TransmitUTXIFG0Maskable0FFF0h8
ADC12 (see Note 4)ADC12IFG (see Notes 1 and 2)Maskable0FFEEh7
Timer_A3TACCR0 CCIFG (see Note 2)Maskable0FFECh6
Timer_A3
I/O Port P1 (Eight Flags)
USART1 Receive
USART1 Transmit
I/O Port P2 (Eight Flags)
Basic Timer1BTIFGMaskable0FFE0h0, lowest
†
’43x(1) uses Timer_B3 with TBCCR0, 1 and 2 CCIFG flags, and TBIFG. ’44x uses Timer_B7 with TBCCR0 CCIFG, TBCCR1 to TBCCR6
CCIFGs, and TBIFG
‡
USART1 is implemented in ’44x only.
NOTES: 1. Multiple source flags
2. Interrupt flags are located in the module.
3. (Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable can not disable
4. ADC12 is not implemented in MSP430x43x1 devices.
†
†
‡
‡
it.
NMIIFG (see Notes 1 and 3)
OFIFG (see Notes 1 and 3)
ACCVIFG (see Notes 1 and 3)
TBCCR0 CCIFG (see Note 2)Maskable0FFFAh13
TBCCR1 to TBCCR6 CCIFGs
TBIFG (see Notes 1 and 2)
TACCR1 and TACCR2 CCIFGs,
TAIFG (see Notes 1 and 2)
WDTIFG
KEYV
(see Note 1)
P1IFG.0 to P1IFG.7
(see Notes 1 and 2)
URXIFG1Maskable0FFE6h3
UTXIFG1Maskable0FFE4h2
P2IFG.0 to P2IFG.7
(see Notes 1 and 2)
Reset0FFFEh15, highest
(Non)maskable
(Non)maskable
(Non)maskable
Maskable0FFF8h12
Maskable0FFEAh5
Maskable0FFE8h4
Maskable0FFE2h1
WORD
ADDRESS
0FFFCh14
PRIORITY
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MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
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special function registers
Most interrupt and module-enable bits are collected in the lowest address space. Special-function register bits
not allocated to a functional purpose are not physically present in the device. This arrangement provides simple
software access.
interrupt enable 1 and 2
Address
0hURXIE0ACCVIENMIIE
76540
UTXIE0OFIEWDTIE
rw–0 rw–0 rw–0
rw–0 rw–0 rw–0
321
WDTIE:Watchdog-timer interrupt enable. Inactive if watchdog mode is selected. Active if watchdog
timer is configured in interval timer mode.
OFIE:Oscillator-fault-interrupt enable
NMIIE:Nonmaskable-interrupt enable
ACCVIE:Flash access violation interrupt enable
URXIE0:USART0: UART and SPI receive-interrupt enable
UTXIE0:USART0: UART and SPI transmit-interrupt enable
WDTIFG:Set on watchdog timer overflow (in watchdog mode) or security key violation. Reset on V
power up or a reset condition at the RST/NMI pin in reset mode.
OFIFG:Flag set on oscillator fault
NMIIFG:Set via RST
/NMI pin
URXIFG0:USART0: UART and SPI receive flag
UTXIFG0:USART0: UART and SPI transmit flag
Address
03hURXIFG1
76540
BTIFG
rw
UTXIFG1
rw–1 rw–0
321
URXIFG1:USART1: UART and SPI receive flag (MSP430F44x devices only)
UTXIFG1:USART1: UART and SPI transmit flag (MSP430F44x devices only)
BTIFG:Basic timer flag
Bit Can Be Read and Written
Bit Can Be Read and Written. It Is Reset or Set by PUC.
Bit Can Be Read and Written. It Is Reset or Set by POR.
SFR Bit Not Present in Device
memory organization
MSP430F435MSP430F436
Memory
Main: interrupt vector
Main: code memory
Information memorySize
Boot memorySize
RAMSize512 Byte
Peripherals16-bit
Size
Flash
Flash
Flash
ROM
8-bit
8-bit SFR
16KB
0FFFFh − 0FFE0h
0FFFFh − 0C000h
256 Byte
010FFh − 01000h
1KB
0FFFh − 0C00h
03FFh − 0200h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
24KB
0FFFFh − 0FFE0h
0FFFFh − 0A000h
256 Byte
010FFh − 01000h
1KB
0FFFh − 0C00h
1KB
05FFh − 0200h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
MSP430F437
MSP430F447
32KB
0FFFFh − 0FFE0h
0FFFFh − 08000h
256 Byte
010FFh − 01000h
1KB
0FFFh − 0C00h
1KB
05FFh − 0200h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
MSP430F448MSP430F449
0FFFFh − 0FFE0h
0FFFFh − 04000h
010FFh − 01000h
0FFFh − 0C00h
09FFh − 0200h
01FFh − 0100h
48KB
256 Byte
1KB
2KB
0FFh − 010h
0Fh − 00h
60KB
0FFFFh − 0FFE0h
0FFFFh − 01100h
256 Byte
010FFh − 01000h
1KB
0FFFh − 0C00h
2KB
09FFh − 0200h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
bootstrap loader (BSL)
The MSP430 bootstrap loader (BSL) enables users to program the flash memory or RAM using a UART serial
interface. Access to the MSP430 memory via the BSL is protected by user-defined password. For complete
description of the features of the BSL and its implementation, see the Application report Features of the MSP430Bootstrap Loader, Literature Number SLAA089.
BSL FunctionPN Package PinsPZ Package Pins
Data Transmit67 - P1.087 - P1.0
Data Receive66 - P1.186 - P1.1
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MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
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flash memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in-system by the CPU. The
CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
DFlash memory has n segments of main memory and two segments of information memory (A and B) of 128
bytes each. Each segment in main memory is 512 bytes in size.
DSegments 0 to n may be erased in one step, or each segment may be individually erased.
DSegments A and B can be erased individually, or as a group with segments 0−n.
Segments A and B are also called information memory.
DNew devices may have some bytes programmed in the information memory (needed for test during
manufacturing). The user should perform an erase of the information memory prior to the first use.
16KB
24KB
32KB
48KB
60KB
0FFFFh
0FE00h
0FDFFh
0FC00h
0FBFFh
0FA00h
0F9FFh
0C400h
0C3FFh
0C200h
0C1FFh
0C000h
010FFh
01080h
0107Fh
01000h
0FFFFh
0FE00h
0FDFFh
0FC00h
0FBFFh
0FA00h
0F9FFh
0A400h
0A3FFh
0A200h
0A1FFh
0A000h
010FFh
01080h
0107Fh
01000h
0FFFFh
0FE00h
0FDFFh
0FC00h
0FBFFh
0FA00h
0F9FFh
08400h
083FFh
08200h
081FFh
08000h
010FFh
01080h
0107Fh
01000h
0FFFFh
0FE00h
0FDFFh
0FC00h
0FBFFh
0FA00h
0F9FFh
04400h
043FFh
04200h
041FFh
04000h
010FFh
01080h
0107Fh
01000h
0FFFFh
0FE00h
0FDFFh
0FC00h
0FBFFh
0FA00h
0F9FFh
01400h
013FFh
01200h
011FFh
01100h
010FFh
01080h
0107Fh
01000h
Segment 0
w/ Interrupt Vectors
Segment 1
Segment 2
Main
Memory
Segment n-1
Segment n
Segment A
Information
Memory
Segment B
24
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MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
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peripherals
Peripherals are connected to the CPU through data, address, and control busses and can be handled using
all instructions. For complete module descriptions, refer to the MSP430x4xx Family User’s Guide, literature
number SLAU056.
digital I/O
There are six 8-bit I/O ports implemented—ports P1 through P6:
DAll individual I/O bits are independently programmable.
DAny combination of input, output, and interrupt conditions is possible.
DEdge-selectable interrupt input capability for all the eight bits of ports P1 and P2.
DRead/write access to port-control registers is supported by all instructions.
oscillator and system clock
The clock system in the MSP430x43x(1) and MSP43x44x family of devices is supported by the FLL+ module
that includes support for a 32768-Hz watch crystal oscillator, an internal digitally-controlled oscillator (DCO) and
a high frequency crystal oscillator. The FLL+ clock module is designed to meet the requirements of both low
system cost and low-power consumption. The FLL+ features a digital frequency locked loop (FLL) hardware
which in conjunction with a digital modulator stabilizes the DCO frequency to a programmable multiple of the
watch crystal frequency. The internal DCO provides a fast turn-on clock source and stabilizes in less than 6 μs.
The FLL+ module provides the following clock signals:
DAuxiliary clock (ACLK), sourced from a 32768-Hz watch crystal or a high frequency crystal.
DMain clock (MCLK), the system clock used by the CPU.
DSub-Main clock (SMCLK), the sub-system clock used by the peripheral modules.
DACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, or ACLK/8.
brownout, supply voltage supervisor
The brownout circuit is implemented to provide the proper internal reset signal to the device during power on
and power off. The supply voltage supervisor (SVS) circuitry detects if the supply voltage drops below a user
selectable level and supports both supply voltage supervision (the device is automatically reset) and supply
voltage monitoring (SVM, the device is not automatically reset).
The CPU begins code execution after the brownout circuit releases the device reset. However, V
have ramped to V
reaches V
. If desired, the SVS circuit can be used to determine when VCC reaches V
CC(min)
hardware multiplier (MSP430x44x Only)
The multiplication operation is supported by a dedicated peripheral module. The module performs 16 16,
16 8, 8 16, and 8 8 bit operations. The module is capable of supporting signed and unsigned multiplication
as well as signed and unsigned multiply and accumulate operations. The result of an operation can be accessed
immediately after the operands have been loaded into the peripheral registers. No additional clock cycles are
required.
watchdog timer
at that time. The user must insure the default FLL+ settings are not changed until V
CC(min)
CC(min)
may not
CC
.
CC
The primary function of the watchdog timer (WDT) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
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25
MSP430x43x1, MSP430x43x, MSP430x44x
Device Input
Module Input
Module
Module Output
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
USART0
The MSP430x43x(1) and the MSP430x44x have one hardware universal synchronous/asynchronous receive
transmit (USART0) peripheral module that is used for serial data communication. The USART supports
synchronous SPI (3 or 4 pin) and asynchronous UART communication protocols, using double-buffered
transmit and receive channels.
USART1 (MSP430x44x Only)
The MSP430x44x has a second hardware universal synchronous/asynchronous receive transmit (USART1)
peripheral module that is used for serial data communication. The USART supports synchronous SPI (3 or 4
pin) and asynchronous UART communication protocols, using double-buffered transmit and receive channels.
Operation of USART1 is identical to USART0.
timer_A3
Timer_A3 is a 16-bit timer/counter with three capture/compare registers. Timer_A3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_A3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Timer_B3 is a 16-bit timer/counter with three capture/compare registers. Timer_B3 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_B3 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
26
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MSP430x43x1, MSP430x43x, MSP430x44x
Device Input
Module Input
Module
Module Output
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
timer_B7 (MSP430x44x Only)
Timer_B7 is a 16-bit timer/counter with seven capture/compare registers. Timer_B7 can support multiple
capture/compares, PWM outputs, and interval timing. Timer_B7 also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Timer_B3 implements three capture/compare blocks (CCR0, CCR1 and CCR2 only).
GND
V
CC
†
Block
Signal
TimerNA
CCR0TB0
CCR1TB1
CCR2TB2
CCR3TB3
CCR4TB4
CCR5TB5
CCR6TB6
Output Pin Number
PNPZ
58 - P2.178 - P2.1
ADC12 (internal)
57 - P2.277 - P2.2
ADC12 (internal)
56 - P2.376 - P2.3
67 - P3.4
66 - P3.5
65 - P3.6
64 - P3.7
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27
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
comparator_A
The primary function of the comparator_A module is to support precision slope analog−to−digital conversions,
battery−voltage supervision, and monitoring of external analog signals.
ADC12 (Not implemented in the MSP430x43x1)
The ADC12 module supports fast, 12-bit analog-to-digital conversions. The module implements a 12-bit SAR
core, sample select control, reference generator and a 16 word conversion-and-control buffer. The
conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored without
any CPU intervention.
Basic Timer1
The Basic Timer1 has two independent 8-bit timers which can be cascaded to form a 16-bit timer/counter. Both
timers can be read and written by software. The Basic Timer1 can be used to generate periodic interrupts and
clock for the LCD module.
LCD drive
The LCD driver generates the segment and common signals required to drive an LCD display. The LCD
controller has dedicated data memory to hold segment drive information. Common and segment signals are
generated as defined by the mode. Static, 2-MUX, 3-MUX, and 4-MUX LCDs are supported by this peripheral.
FLL+ Control1FLL_CTL1054h
FLL+ Control0FLL_CTL0053h
System clock frequency controlSCFQCTL052h
System clock frequency integratorSCFI1051h
System clock frequency integratorSCFI0050h
BT counter1
BT control
Port P6 selectionP6SEL037h
Port P6 directionP6DIR036h
Port P6 outputP6OUT035h
Port P6 inputP6IN034h
Port P5 selectionP5SEL033h
Port P5 directionP5DIR032h
Port P5 outputP5OUT031h
Port P5 inputP5IN030h
:
LCDM16
LCDM15
:
LCDM1
LCDCTL
BTCNT2
BTCNT1
BTCTL
0A4h
:
0A0h
09Fh
:
091h
090h
047h
046h
040h
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31
MSP430x43x1, MSP430x43x, MSP430x44x
p
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
peripheral file map (continued)
PERIPHERALS WITH BYTE ACCESS (CONTINUED)
Port P4
Port P3
Port P2
Port P1
Special functions
Port P4 selectionP4SEL01Fh
Port P4 directionP4DIR01Eh
Port P4 outputP4OUT01Dh
Port P4 inputP4IN01Ch
Port P3 selectionP3SEL01Bh
Port P3 directionP3DIR01Ah
Port P3 outputP3OUT019h
Port P3 inputP3IN018h
Port P2 selectionP2SEL02Eh
Port P2 interrupt enableP2IE02Dh
Port P2 interrupt-edge selectP2IES02Ch
Port P2 interrupt flagP2IFG02Bh
Port P2 directionP2DIR02Ah
Port P2 outputP2OUT029h
Port P2 inputP2IN028h
Port P1 selectionP1SEL026h
Port P1 interrupt enableP1IE025h
Port P1 interrupt-edge selectP1IES024h
Port P1 interrupt flagP1IFG023h
Port P1 directionP1DIR022h
Port P1 outputP1OUT021h
Port P1 inputP1IN020h
SFR module enable2ME2005h
SFR module enable1ME1004h
SFR interrupt flag2IFG2003h
SFR interrupt flag1IFG1002h
SFR interrupt enable2IE2001h
SFR interrupt enable1IE1000h
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to V
to the TDI/TCLK pin when blowing the JTAG fuse.
. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied
SS
32
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MSP430x43x1, MSP430x43x, MSP430x44x
(seeNote3)
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
recommended operating conditions
MINNOMMAXUNITS
Supply voltage during program execution
V
(AVCC = DV
CC
CC1
= DV
= VCC) (see Note 1)
CC2
Supply voltage during program execution, SVS enabled, PORON=1
(see Note 1 and Note 2)
(AVCC = DV
V
CC
CC1
= DV
CC2
= VCC)
Supply voltage during flash memory programming
V
(AVCC = DV
CC
Supply voltage, V
Operating free-air temperature range, T
= DV
CC1
(AVSS = DV
SS
= VCC) (see Note 1)
CC2
= DV
SS1
A
= VSS)00V
SS2
LF selected,
XTS_FLL=0
LFXT1 crystal frequency, f
(see Note 3)
(LFXT1)
XT1 selected,
XTS_FLL=1
XT1 selected,
XTS_FLL=1
XT2 crystal frequency, f
Processor frequency (signal MCLK), f
(XT2)
(System)
NOTES: 1. It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can
be tolerated during power up and operation.
2. The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing the supply
voltage. POR is going inactive when the supply voltage is raised above the minimum supply voltage plus the hysteresis of the SVS
circuitry.
3. In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.
Supply voltage range,
’F43x(1)/’F44x, during
program execution
Supply voltage range, ’F43x(1)/’F44x,
during flash memory programming
4.15 MHz
1.83.62.73
Supply Voltage − V
Figure 1. Frequency vs Supply Voltage, MSP430F43x(1) or MSP430F44x
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33
MSP430x43x1, MSP430x43x, MSP430x44x
f
(MCLK)
f
(SMCLK)
MHz
Low power mode, (LPM0)
(
f(MCLK) = f (SMCLK) = 0 MHz
f
(ACLK)
768 Hz, SCG0 = 1
()
L
(LPM4)
f
(MCLK)
MHz, f
(SMCLK)
MHz
(ACLK)
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted)
supply current into AVCC + DVCC excluding external current
PARAMETERTEST CONDITIONSMINNOMMAXUNIT
Active mode, (see Note 1)
I
(AM)
f
(ACLK)
= f
=
= 32,768 Hz
= 1 MHz,
= 1
f
XTS_FLL=0, SELM=(0,1)
I
(LPM0)
Low-power mode, (LPM0)
(see Note 1 and Note 4)
Low-power mode, (LPM2),
f
I
(LPM2)
MCLK) = f (SMCLK) = 0 MHz,
f(ACLK) = 32,768 Hz, SCG0 = 0 (see Note 2 and
Note 4)
Low-power mode, (LPM3)
f
I
(LPM3)
= f
(MCLK)
= 32,768 Hz, SCG0 = 1
= 32,
f
(see Note 3 and Note 4)
(SMCLK)
= 0 MHz,
ow-power mode,
f
= 0 MHz, f
I
(LPM4)
= 0
= 0 Hz, SCG0 = 1
f
(ACLK)
(see Note 2 and Note 4)
NOTES: 1. Timer_B is clocked by f
2. All inputs are tied to 0 V or to V
3. All inputs are tied to 0 V or to V
active Basic Timer1 and LCD (ACLK selected). The current consumption of the Comparator_A and the SVS module are specified
in the respective sections. The LPM3 currents are characterized with a KDS Daishinku DT−38 (6 pF) crystal and OSCCAPx=1h.
4. Current consumption for brownout included.
,
,
= 0 MHz,
= 0
(DCOCLK)
T
= −40°C to 85°C
A
= −40°C to 85°C
T
A
T
= −40°C to 85°C
A
TA = −40°C11.5
TA = 25°C
TA = 60°C
TA = 85°C3.56
= −40°C1.82.2
T
A
TA = 25°C
TA = 60°C
TA = 85°C4.27.5
TA = −40°C0.10.5
TA = 25°C
TA = 60°C
T
= 85°C1.73
,
A
TA = −40°C0.10.5
= 25°C
T
A
TA = 60°C
TA = 85°C1.93.5
= f
= 1 MHz. All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(DCO)
. Outputs do not source or sink any current.
CC
. Outputs do not source or sink any current. The current consumption in LPM3 is measured with
CC
VCC = 2.2 V280350
VCC = 3 V420560
VCC = 2.2 V3245
VCC = 3 V5570
VCC = 2.2 V1114
VCC = 3 V1722
VCC = 2.2 V
VCC = 3 V
VCC = 2.2 V
VCC = 3 V
1.11.5
23
1.61.9
2.53.5
0.10.5
0.71.1
0.10.5
0.81.2
μA
μA
μA
μA
μA
μA
μA
Current consumption of active mode versus system frequency
I
(AM)
= I
[1 MHz]× f
(AM)
Current consumption of active mode versus supply voltage
= I
I
(AM)
34
(AM) [3 V]
+ 175 μA/V × (V
(System)
[MHz]
– 3 V)
CC
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MSP430x43x1, MSP430x43x, MSP430x44x
(int)
pg
for the interrupt flag, (see Note 1)
Timer_A, Timer_B clock
Leakage
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
0.00.51.01.52.02.5
VOL − Low-Level Output Voltage − V
TA = 25°C
TA = 85°C
Figure 2
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
25
VCC = 3 V
P2.7
20
15
10
5
− Typical Low-level Output Current − mA
OL
I
0
0.00.51.01.52.02.53.03.5
VOL − Low-Level Output Voltage − V
TA = 25°C
TA = 85°C
Figure 3
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
VCC = 2.2 V
P2.7
−2
−4
−6
−8
−10
TA = 85°C
−12
− Typical High-level Output Current − mA
OL
I
−14
0.00.51.01.52.02.5
TA = 25°C
VOH − High-Level Output Voltage − V
Figure 4
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
VCC = 3 V
P2.7
−5
−10
−15
−20
−25
− Typical High-level Output Current − mA
OL
I
−30
TA = 85°C
TA = 25°C
0.00.51.01.52.02.53.03.5
VOH − High-Level Output Voltage − V
Figure 5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
37
MSP430x43x1, MSP430x43x, MSP430x44x
)
t
d(LPM3)
Delay time
V
CC
2.2 V/3 V
μs
pg
Segment line
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
wake-up LPM3
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
f = 1 MHz6
t
d(LPM3
Delay time
f = 2 MHz
V
CC
= 2.2 V/3 V
f = 3 MHz
RAM
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VRAMhCPU halted (see Note 1)1.6V
NOTE 1: This parameter defines the minimum supply voltage when the data in program memory RAM remain unchanged. No program execution
should take place during this supply voltage condition.
LCD
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
V
(33)
V
(23)
V
(13)
V
(33)
I
(R03)
I
(R13)
I
(R23)
V
(Sxx0)
V
(Sxx1)
V
(Sxx2)
V
(Sxx3)
− V
Analog voltage
(03)
Input leakage
Segment line
voltage
Voltage at P5.7/R332.5VCC + 0.2
Voltage at P5.6/R23
Voltage at P5.5/R13
VCC = 3 V
[V
(33)−V(03)
[V
(33)−V(03)
] × 2/3 + V
] × 1/3 + V
(03)
(03)
Voltage at R33 to R032.5VCC + 0.2
R03 = V
SS
P5.5/R13 = VCC/3
P5.6/R23 = 2 × VCC/3
I
= −3 μA,VCC = 3 V
(Sxx)
No load at all
segment and
common lines,
V
= 3 V
CC
V
(03)
V
(13)
V
(23)
V
(33)
V
(03)
V
(13)
V
(23)
V
(33)
±20
±20
±20
− 0.1
− 0.1
− 0.1
+ 0.1
6
μs
6
V
nA
V
38
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430x43x1, MSP430x43x, MSP430x44x
CAON=1
CARSEL=0, CAREF=1/2/3
T
A
25 C
T
A
25 C
T
A
25 C
T
A
25 C
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
Comparator_A (see Note 1)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
I
(CC)
I
(Refladder/RefDiode)
V
(Ref025)
V
(Ref050)
Voltage @ 0.25 VCCnode
Voltage @ 0.5 VCCnode
V
CC
V
CC
CAON=1, CARSEL=0, CAREF=0
CAON=1, CARSEL=0, CAREF=1/2/3,
,
No load at P1.6/CA0 and P1.7/CA1
PCA0=1, CARSEL=1, CAREF=1,
No load at P1.6/CA0 and P1.7/CA1
PCA0=1, CARSEL=1, CAREF=2,
No load at P1.6/CA0 and P1.7/CA1
PCA0=1, CARSEL=1, CAREF=3,
V
(RefVT)
V
IC
Vp−V
V
hys
See Figure 6 and Figure 7
Common-mode input
voltage range
Offset voltageSee Note 2VCC = 2.2 V / 3 V−3030mV
S
Input hysteresisCAON = 1VCC = 2.2 V / 3 V00.71.4mV
No load at P1.6/CA0 and P1.7/CA1;
= 85°C
T
A
CAON=1VCC = 2.2 V / 3 V0VCC−1V
TA = 25°C,
=
,
Overdrive 10 mV, without filter: CAF = 0
t
(response LH)
TA = 25°C
=
Overdrive 10 mV, with filter: CAF = 1
TA = 25°C
=
Overdrive 10 mV, without filter: CAF = 0
t
(response HL)
TA = 25°C,
=
,
Overdrive 10 mV, with filter: CAF = 1
NOTES: 1. The leakage current for the Comparator_A terminals is identical to I
2. The input offset voltage can be cancelled by using the CAEX bit to invert the Comparator_A inputs on successive measurements.
The two successive measurements are then summed together.
NOTES: 1. The oscillator needs capacitors at both terminals, with values specified by the crystal manufacturer.
2. Applies only when using an external logic-level clock source. Not applicable when using a crystal or resonator.
USART0, USART1 (see Note 1)
PARAMETERTEST CONDITIONSMINNOMMAXUNIT
t
(τ)
USART0/1: deglitch time
NOTE 1: The signal applied to the USART0/1 receive signal/terminal (URXD0/1) should meet the timing requirements of t
URXS flip-flop is set. The URXS flip-flop is set with negative pulses meeting the minimum-timing condition of t
conditions to set the flag must be met independently from this timing constraint. The deglitch circuitry is active only on negative
transitions on the URXD0/1 line.
Only one terminal can be selected
at one time, P6.x/Ax
AVC C
3 V0.50.8
2.2 V40pF
3 V2000Ω
NOTES: 1. The leakage current is defined in the leakage current table with P6.x/Ax parameter.
2. The analog input voltage range must be within the selected reference voltage range V
3. The internal reference supply current is not included in current consumption parameter I
4. The internal reference current is supplied via terminal AV
. Consumption is independent of the ADC12ON control bit, unless a
CC
conversion is active. The REFON bit enables to settle the built-in reference before starting an A/D conversion.
CC
MIN NOMMAXUNIT
2.23.6V
0V
to VR− for valid conversion results.
R+
.
ADC12
AVC C
V
mA
mA
12-bit ADC, external reference (see Note 1)
V
eREF+
V
REF− /VeREF−
(V
V
I
I
−
eREF+
REF−/VeREF−
VeRE F+
VREF−/VeREF−
PARAMETERTEST CONDITIONSV
Positive external
reference voltage input
Negative external
reference voltage input
Differential external
reference voltage input
)
Static input current0V ≤V
Static input current0V ≤ V
V
eREF+
V
eREF+
V
eREF+
> V
REF−/VeREF−
> V
REF−/VeREF−
> V
REF−/VeREF−
eREF+
eREF−
≤ V
≤ V
(see Note 2)1.4V
(see Note 3)01.2V
(see Note 4)1.4V
AVC C
AVC C
CC
2.2 V/3 V±1μA
2.2 V/3 V±1μA
NOTES: 1. The external reference is used during conversion to charge and discharge the capacitance array. The input capacitance, Ci, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
2. The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
3. The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
4. The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
MIN NOMMAXUNIT
AVC C
AVC C
V
V
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
47
MSP430x43x1, MSP430x43x, MSP430x44x
Positive built in reference
)
AV
minimum voltage
AV
CC(min)
Positivebuiltinreference
V
Load current out of V
REF
Load current regulation
Load current regulation
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
12-bit ADC, built-in reference
V
REF+
AV
CC(min
I
VREF+
PARAMETERTEST CONDITIONSV
REF2_5V = 1 for 2.5 V
Positive built-in reference
voltage output
CC
,
Positive built-in reference
active
Load current out of V
REF+
≤ I
VREF+
REF2_5V = 0 for 1.5 V
I
≤ I
VREF+
REF2_5V = 0, I
REF2_5V = 1, I
REF2_5V = 1, I
+
VREF+
VREF+
max
max
≤ 1mA2.2
VREF+
≤ 0.5mAV
VREF+
≤ 1mAV
VREF+
I
terminal
I
= 500 μA +/− 100 μA
VREF+
CC
3 V2.42.52.6
2.2 V/3 V1.441.51.56
2.2 V0.01−0.5
3 V−1
2.2 V±2
Analog input voltage ~0.75 V;
I
L(VREF)+
Load-current regulation
V
terminal
REF+
REF2_5V = 0
I
= 500 μA ± 100 μA
VREF+
Analog input voltage ~1.25 V;
3 V±2
3 V±2LSB
REF2_5V = 1
I
=100 μA → 900 μA,
I
DL(VREF) +
C
VREF+
T
REF+
t
REFON
Load current regulation
V
terminal
REF+
Capacitance at pin V
REF+
(see Note 1)
Temperature coefficient of
built-in reference
Settle time of internal
reference voltage (see
Figure 18 and Note 2)
VREF+
C
=5 μF, Ax ~0.5 x V
VREF+
REF+
Error of conversion result ≤ 1 LSB
REFON =1,
0 mA ≤ I
I
VREF+
0 mA ≤ I
I
VREF+
V
REF+
≤ I
VREF+
is a constant in the range of
≤ 1 mA
VREF+
= 0.5 mA, C
VREF+
VREF+
max
= 10μF,
= 1.5 V
3 V20ns
2.2 V/3 V510μF
2.2 V/3 V±100 ppm/°C
2.2 V17ms
NOTES: 1. The internal buffer operational amplifier and the accuracy specifications require an external capacitor. All INL and DNL tests uses
two capacitors between pins V
2. The condition is that the error in a conversion started after t
and AVSS and V
REF+
REF−/VeREF−
REFON
and AVSS: 10 μF tantalum and 100 nF ceramic.
is less than ±0.5 LSB. The settling time depends on the external
capacitive load.
C
VREF+
100 μF
MIN NOMMAXUNIT
+ 0.15
REF+
+ 0.15
REF+
mA
LSB
V
V
10 μF
Figure 18. Typical Settling Time of Internal Reference t
48
1 μF
t
REFON
≈ .66 x C
VREF+
[ms] with C
VREF+
in μF
0
1 ms
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
10 ms
100 mst
vs External Capacitor on V
REFON
REFON
REF
+
Apply External Reference [V
or Use Internal Reference [V
From
Power
Supply
eREF+
]
REF+
Apply
External
Reference
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
/DV
DV
+
−
DV
10 μF 100 nF
+
−
AV
AV
10 μF 100 nF
]
+
V
REF+
−
10 μF 100 nF
V
+
REF
−
10 μF 100 nF
CC1
/DV
SS1
CC
MSP430F43x
MSP430F44x
SS
or V
−/V
CC2
SS2
eREF+
eREF−
Figure 19. Supply Voltage and Reference Voltage Design V
From
Power
Supply
+
−
10 μF 100 nF
+
−
Apply External Reference [V
or Use Internal Reference [V
eREF+
REF+
]
]
10 μF 100 nF
+
−
10 μF 100 nF
Reference Is Internally
Switched to AV
SS
Figure 20. Supply Voltage and Reference Voltage Design V
REF−/VeREF−
/DV
DV
DV
AV
AV
V
REF+
V
REF−/VeREF−
CC1
SS1
CC
SS
/DV
or V
CC2
SS2
MSP430F43x
MSP430F44x
REF−/VeREF−
External Supply
eREF+
= AVSS, Internally Connected
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
49
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
12-bit ADC, timing parameters
PARAMETERTEST CONDITIONSV
f
ADC12CLK
f
ADC12OSC
t
CONVERT
Internal ADC12
oscillator
Conversion time
For specified performance of ADC12
linearity parameters
ADC12DIV=0,
f
ADC12CLK=fADC12OSC
C
≥ 5 μF, Internal oscillator,
VREF+
f
ADC12OSC
External f
= 3.7 MHz to 6.3 MHz
ADC12CLK
from ACLK, MCLK or SMCLK:
ADC12SSEL ≠ 0
t
ADC12ON
t
Sample
NOTES: 1. The condition is that the error in a conversion started after t
Turn on settling time of
the ADC
Sampling time
(see Note 1)100ns
R
= 400 Ω, R
S
C
= 30 pF
I
τ = [R
S
= 1000 Ω,
I
+ RI] x CI;(see Note 2)
ADC12ON
is less than ±0.5 LSB. The reference and input signal are already
settled.
2. Approximately ten Tau (τ) are needed to get an error of less than ±0.5 LSB:
t
Sample
= ln(2
n+1
) x (RS + RI) x CI+ 800 ns where n = ADC resolution = 12, RS = external source resistance.
12-bit ADC, linearity parameters
PARAMETERTEST CONDITIONSV
EIIntegral linearity error
Differential linearity
E
D
error
E
Offset error
O
E
Gain error
G
Total unadjusted
E
T
error
1.4 V ≤ (V
1.6 V < (V
(V
eREF+
C
VREF+
(V
eREF+
Internal impedance of source R
C
VREF+
(V
eREF+
C
VREF+
(V
eREF+
C
VREF+
− V
eREF+
− V
eREF+
− V
REF−/VeREF−)min
REF−/VeREF−
REF−/VeREF−
) min ≤ 1.6 V
) min ≤ [V
≤ (V
eREF+
(AVCC)
− V
REF−/VeREF−
= 10 μF (tantalum) and 100 nF (ceramic)
− V
REF−/VeREF−)min
≤ (V
eREF+
< 100 Ω,
S
− V
REF−/VeREF−
= 10 μF (tantalum) and 100 nF (ceramic)
− V
REF−/VeREF−)min
≤ (V
eREF+
− V
REF−/VeREF−
= 10 μF (tantalum) and 100 nF (ceramic)
− V
REF−/VeREF−)min
≤ (V
eREF+
− V
REF−/VeREF−
= 10 μF (tantalum) and 100 nF (ceramic)
]
2.2V/
3 V
2.2 V/
3 V
2.2 V/
3 V
3 V1220
2.2 V1400
),
),
),
),
MINNOMMAXUNIT
CC
0.4556.3MHz
3.76.3MHz
2.063.51μs
13×ADC12DIV×
1/f
ADC12CLK
CC
2.2 V/3 V
MIN NOMMAXUNIT
±1.7
2.2 V/3 V±1LSB
2.2 V/3 V±2±4LSB
2.2 V/3 V±1.1±2LSB
2.2 V/3 V±2±5LSB
±2
μs
ns
LSB
50
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430x43x1, MSP430x43x, MSP430x44x
Operating supply current into
REFON = 0, INCH = 0Ah
ADC12ON = 1, INCH = 0Ah
Sample time required if channel
ADC12ON = 1, INCH = 0Ah
ADC12ON = 1, INCH = 0Bh
ADC12ON = 1, INCH = 0Bh
Sample time required if channel
ADC12ON = 1, INCH = 0Bh
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
12-bit ADC, temperature sensor and built-in V
PARAMETER
I
SENSOR
V
SENSOR
TC
SENSOR
t
SENSOR(sample)
I
VMID
V
MID
t
VMID(sample)
NOTES: 1. The sensor current I
is high). Therefore it includes the constant current through the sensor and the reference.
2. The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time t
3. No additional current is needed. The V
4. The on-time t
Operating supply current intoREFON = 0, INCH = 0Ah,
AVCC terminal (see Note 1)
Sample time required if channelADC12ON = 1, INCH = 0Ah,
10 is selected (see Note 2)
Current into divider at channel 11
AVCC divider at channel 11
Sample time required if channelADC12ON = 1, INCH = 0Bh,
11 is selected (see Note 4)
is consumed if (ADC12ON = 1 and REFON=1), or (ADC12ON=1 AND INCH=0Ah and sample signal
SENSOR
is used during sampling.
is included in the sampling time t
VMID(on)
MID
MID
TEST CONDITIONSV
,
ADC12ON=NA, T
ADC12ON = 1, INCH = 0Ah,
T
= 0°C
A
= 25_C
A
,
ADC12ON = 1, INCH = 0Ah
,
Error of conversion result ≤ 1 LSB
ADC12ON = 1, INCH = 0Bh,
,
(see Note 3)
ADC12ON = 1, INCH = 0Bh,
V
is ~0.5 x V
MID
AVC C
,
,
Error of conversion result ≤ 1 LSB
VMID(sample)
; no additional on time is needed.
MIN NOMMAXUNIT
CC
2.2 V40120
3 V60160
2.2 V986986±5%
3 V986986±5%
2.2 V3.553.55±3%
3 V3.553.55±3%
2.2 V30
3 V30
2.2 VNA
3 VNA
2.2 V1.11.1±0.04
3 V1.5 1.50±0.04
2.2 V1400
3 V1220
SENSOR(on)
μA
mV
mV/°C
μs
μA
V
ns
.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
51
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
Flash Memory
TEST
CONDITIONS
V
CC
MINNOMMAXUNIT
V
CC(PGM/
ERASE)
PARAMETER
Program and Erase supply voltage2.73.6V
f
FTG
I
PGM
I
ERASE
t
CPT
t
CMErase
t
Retention
t
Word
t
Block, 0
t
Block, 1-63
t
Block, End
t
Mass Erase
t
Seg Erase
Flash Timing Generator frequency257476kHz
Supply current from DVCC during program2.7 V/ 3.6 V35mA
Supply current from DVCC during erase2.7 V/ 3.6 V37mA
Cumulative program timesee Note 12.7 V/ 3.6 V10ms
Cumulative mass erase timesee Note 22.7 V/ 3.6 V200ms
4
Program/Erase endurance10
10
5
cycles
Data retention durationTJ = 25°C100years
Word or byte program time35
Block program time for 1st byte or word30
Block program time for each additional byte or word
Block program end-sequence wait time
see Note 3
21
t
6
FTG
Mass erase time5297
Segment erase time4819
NOTES: 1. The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
2. The mass erase duration generated by the flash timing generator is at least 11.1ms ( = 5297x1/f
,max = 5297x1/476kHz). To
FTG
achieve the required cumulative mass erase time the Flash Controller’s mass erase operation can be repeated until this time is met.
(A worst case minimum of 19 cycles are required).
3. These values are hardwired into the Flash Controller’s state machine (t
FTG
= 1/f
FTG
).
JTAG Interface
TEST
CONDITIONS
V
CC
MINNOMMAXUNIT
2.2 V05MHz
3 V010MHz
f
TCK
R
Internal
NOTES: 1. f
2. TMS, TDI/TCLK, and TCK pull-up resistors are implemented in all versions.
PARAMETER
TCK input frequencysee Note 1
Internal pull-up resistance on TMS, TCK, TDI/TCLK see Note 22.2 V/ 3 V256090kΩ
may be restricted to meet the timing requirements of the module selected.
TCK
JTAG Fuse (see Note 1)
PARAMETER
V
CC(FB)
V
FB
I
FB
t
FB
Supply voltage during fuse-blow conditionTA = 25°C2.5V
Voltage level on TDI/TCLK for fuse-blow: F versions67V
Supply current into TDI/TCLK during fuse blow100mA
Time to blow fuse1ms
NOTES: 1. Once the fuse is blown, no further access to the MSP430 JTAG/Test and emulation features is possible. The JTAG block is switched
to bypass mode.
52
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TEST
CONDITIONS
V
CC
MINNOMMAXUNIT
APPLICATION INFORMATION
input/output schematic
Port P1, P1.0 to P1.5, input/output with Schmitt-trigger
port P4, P4.0 to P4.7, input/output with Schmitt-trigger (continued)
SLAS344F − JANUARY 2002 − REVISED MAY 2007
Direction Control for SIMO1 and UCLK1Direction Control for SOMI1
SYNC
MM
STC
STE
DCM_SIMO1
DCM_UCLK1
port P5, P5.0 to P5.1, input/output with Schmitt-trigger
0: Port active
Port/LCD
Segment
P5SEL.x
P5DIR.x
Direction Control
From Module
P5OUT.x
Module X OUT
P5IN.x
1: Segment function active
0
1
0
1
SYNC
MM
STC
STE
Bus
Keeper
DCM_SOMI1
Segment Pad Logic
Port Pad Logic
0: Input
1: Output
P5.0/S1
P5.1/S0
EN
Module X IN
0< x< 1Note:
PnSel.xPnDIR.x
P5Sel.0P5DIR.0P5OUT.0P5IN.0
P5Sel.1P5DIR.1P5OUT.1P5IN.1
D
Dir. Control
from module
P5DIR.0
P5DIR.1
PnOUT.x
Module X
OUT
DV
SS
DV
SS
PnIN.xModule X IN
unused
unused
Segment
S1
S0
Port/LCD
0: LCDM<20h
0: LCDM<20h
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
61
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
APPLICATION INFORMATION
input/output schematic (continued)
port P5, P5.2 to P5.4, input/output with Schmitt-trigger
Port/LCD
LCD signal
P5SEL.x
P5DIR.x
Direction Control
From Module
P5OUT.x
Module X OUT
P5IN.x
Module X IN
0: Port active
1: LCD function active
0
1
0
1
EN
D
2< x< 4Note:
PnSel.xPnDIR.x
P5Sel.2P5DIR.2P5OUT.2P5IN.2
Dir. Control
from module
P5DIR.2
PnOUT.x
Module X
OUT
DV
Bus
Keeper
PnIN.xModule X IN
SS
0: Input
1: Output
unused
Pad Logic
LCD signal
COM1
P5.2/COM1
P5.3/COM2
P5.4/COM3
Port/LCD
P5SEL.2
P5Sel.3P5DIR.3P5OUT.3P5IN.3
P5Sel.4P5DIR.4P5OUT.4P5IN.4
P5DIR.3
P5DIR.4
DV
DV
SS
SS
unused
unused
COM2
COM3
P5SEL.3
P5SEL.4
62
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
input/output schematic (continued)
port P5, P5.5 to P5.7, input/output with Schmitt-trigger
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
Port/LCD
LCD signal
P5SEL.x
P5DIR.x
Direction Control
From Module
P5OUT.x
Module X OUT
P5IN.x
Module X IN
0: Port active
1: LCD function active
0
1
0
1
EN
D
5< x< 7Note:
PnSel.xPnDIR.x
P5Sel.5P5DIR.5P5OUT.5P5IN.5
Dir. Control
from module
P5DIR.5
PnOUT.x
Module X
OUT
DV
Bus
Keeper
PnIN.xModule X IN
SS
0: Input
1: Output
unused
Pad Logic
LCD signal
P5.5/R13
P5.6/R23
P5.7/R33
Port/LCD
R13P5SEL.5
P5Sel.6P5DIR.6P5OUT.6P5IN.6
P5Sel.7P5DIR.7P5OUT.7P5IN.7
P5DIR.6
P5DIR.7
DV
DV
SS
SS
unused
unused
R23
R33
P5SEL.6
P5SEL.7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
63
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
APPLICATION INFORMATION
input/output schematic (continued)
port P6, P6.0 to P6.6, input/output with Schmitt-trigger
P6SEL.x
P6DIR.x
Direction Control
From Module
P6OUT.x
Module X OUT
P6IN.x
0
1
0
1
EN
0: Input
1: Output
Pad Logic
Bus Keeper
P6.0/A0 ..
P6.6/A6
Module X IN
From ADC
To ADC
x: Bit Identifier, 0 to 6 for Port P6
NOTE: Analog signals applied to digital gates can cause current flow from the positive to the negative terminal. The throughput current flows if
the analog signal is in the range of transitions 0→1 or 1→0. The value of the throughput current depends on the driving capability of the
gate. For MSP430, it is approximately 100 μA.
Use P6SEL.x=1 to prevent throughput current. P6SEL.x should be set, even if the signal at the pin is not being used by the ADC12.
NOTE: Analog signals applied to digital gates can cause current flow from the positive to the negative terminal. The throughput current flows if
the analog signal is in the range of transitions 0→1 or 1→0. The value of the throughput current depends on the driving capability of the
gate. For MSP430, it is approximately 100 μA.
Use P6SEL.x=1 to prevent throughput current. P6SEL.x should be set, even if the signal at the pin is not being used by the ADC12.
0
1
0
1
D
0: Input
1: Output
Pad Logic
P6.7/A7/SVSIN
Bus Keeper
PnSel.x
P6Sel.7P6DIR.7P6DIR.7P6OUT.7DV
NOTE: The signal at pins P6.x/Ax is used by the 12-bit ADC module.
The signal at pin P6.7/A7/SVSIN is also connected to the input multiplexer in the module brownout/supply voltage supervisor.
PnDIR.x
Dir. Control
From Module
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PnOUT.xModule X OUTPnIN.xModule X IN
SS
P6IN.7unused
65
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
APPLICATION INFORMATION
JTAG pins TMS, TCK, TDI/TCLK, TDO/TDI, input/output with Schmitt-trigger or output
TDO
Controlled by JTAG
Controlled by JTAG
JTAG
Controlled
by JTAG
TDI
DV
CC
Burn and Test
TDO/TDI
Fuse
Test
and
Emulation
Module
TMS
TCK
TCK
Tau ~ 50 ns
Brownout
TDI/TCLK
DV
CC
TMS
DV
CC
TCK
RST/NMI
D
G
G
U
S
D
U
S
66
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
APPLICATION INFORMATION
JTAG fuse check mode
MSP430 devices that have the fuse on the TDI/TCLK terminal have a fuse check mode that tests the continuity
of the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check
current (I
taken to avoid accidentally activating the fuse check mode and increasing overall system power consumption.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin after power up or if the
TMS is being held low during power up. The second positive edge on the TMS pin deactivates the fuse check
mode. After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR the
fuse check mode has the potential to be activated.
The fuse check current only flows when the fuse check mode is active and the TMS pin is in a low state (see
Figure 21). Therefore, the additional current flow can be prevented by holding the TMS pin high (default
condition). The JTAG pins are terminated internally and therefore do not require external termination.
) of 1 mA at 3 V can flow from the TDI/TCLK pin to ground if the fuse is not burned. Care must be
(TF)
Time TMS Goes Low After POR
TMS
I
I
TDI/TCLK
(TF)
Figure 21. Fuse Check Mode Current MSP430x43x(1), MSP430x44x
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
67
MSP430x43x1, MSP430x43x, MSP430x44x
MIXED SIGNAL MICROCONTROLLER
SLAS344F − JANUARY 2002 − REVISED MAY 2007
Data Sheet Revision History
Literature
Number
Added MSP430F43x1 devices
Updated functional block diagram (page 6)
Clarified test conditions in recommended operating conditions table (page 27)
SLAS344E
SLAS344FAdded MSP430F43x1 devices in PZ (100 pin) package
NOTE: Page and figure numbers refer to the respective document revision.
Clarified test conditions in electrical characteristics table (page 28)
Added Port 2 through Port 5 to leakage current table (page 29)
Corrected y-axis unit on Figures 6 and 7; changed from V to mV (page 34)
Clarified test conditions in USART0/USART1 table (page 40)
Changed t
maximum value from 4 ms to 10 ms in Flash memory table (page 46)
CPT
Summary
68
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable DeviceStatus
MSP430F4351IPNACTIVELQFPPN8050Green (RoHS &
MSP430F4351IPNRACTIVELQFPPN801000 Green (RoHS &
MSP430F4351IPZACTIVELQFPPZ10090Green (RoHS &
MSP430F4351IPZRACTIVELQFPPZ1001000 Green (RoHS &
MSP430F435IPNACTIVELQFPPN80119 Green (RoHS &
MSP430F435IPNRACTIVELQFPPN801000 Green (RoHS &
MSP430F435IPZACTIVELQFPPZ10090Green (RoHS&
MSP430F435IPZRACTIVELQFPPZ1001000 Green (RoHS &
MSP430F4361IPNACTIVELQFPPN8050Green (RoHS &
MSP430F4361IPNRACTIVELQFPPN801000 Green (RoHS &
MSP430F4361IPZACTIVELQFPPZ10090Green (RoHS &
MSP430F4361IPZRACTIVELQFPPZ1001000 Green (RoHS &
MSP430F436IPNACTIVELQFPPN80119 Green (RoHS &
MSP430F436IPNRACTIVELQFPPN801000 Green (RoHS &
MSP430F436IPZACTIVELQFPPZ10090Green (RoHS&
MSP430F436IPZRACTIVELQFPPZ1001000 Green (RoHS &
MSP430F4371IPNACTIVELQFPPN8050Green (RoHS &
MSP430F4371IPNRACTIVELQFPPN801000 Green (RoHS &
MSP430F4371IPZPREVIEWLQFPPZ10090TBDCall TICall TI
MSP430F4371IPZRACTIVELQFPPZ1001000 Green (RoHS &
MSP430F437IPNACTIVELQFPPN80119 Green (RoHS &
MSP430F437IPNRACTIVELQFPPN801000 Green (RoHS &
MSP430F437IPZACTIVELQFPPZ10090Green (RoHS&
MSP430F437IPZRACTIVELQFPPZ1001000 Green (RoHS &
MSP430F447IPZACTIVELQFPPZ10090Green (RoHS&
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
25-Sep-2007
(3)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable DeviceStatus
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
MSP430F447IPZRACTIVELQFPPZ1001000 Green (RoHS &
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-3-260C-168 HR
25-Sep-2007
(3)
no Sb/Br)
MSP430F448IPZACTIVELQFPPZ10090Green (RoHS&
CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
MSP430F448IPZRACTIVELQFPPZ1001000 Green (RoHS &
CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
MSP430F449IPZACTIVELQFPPZ10090Green (RoHS&
CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
MSP430F449IPZRACTIVELQFPPZ1001000 Green (RoHS &
CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1)
The marketing status valuesare defined as follows:
ACTIVE: Product device recommendedfor new designs.
LIFEBUY: TI has announcedthat the device will be discontinued,and a lifetime-buy period is ineffect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has beenannounced but is not in production.Samples may or may not beavailable.
OBSOLETE: TI has discontinuedthe production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latestavailability information and additional product contentdetails.
TBD: The Pb-Free/Green conversionplan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TIPb-Free products are suitable for usein specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sbdo not exceed 0.1% by weightin homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not beavailable for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996
PN (S-PQFP-G80) PLASTIC QUAD FLATPACK
80
61
1,45
1,35
0,50
60
1
9,50 TYP
12,20
SQ
11,80
14,20
SQ
13,80
0,27
0,17
20
41
0,08
M
40
21
0,05 MIN
0,13 NOM
Gage Plane
0,25
0°–7°
0,75
0,45
1,60 MAX
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Seating Plane
0,08
4040135 /B 11/96
1
MECHANICAL DATA
MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996
PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK
76
100
0,50
75
1
12,00 TYP
14,20
SQ
13,80
16,20
SQ
15,80
51
25
0,27
0,17
50
26
0,08
M
0,05 MIN
0,13 NOM
Gage Plane
0,25
0°–7°
1,45
1,35
1,60 MAX
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026