Texas Instruments LM358PSR, LM358PSLE, LM358PWR, LM358PWLE, LM358AP Datasheet

...
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358Y, LM2904, LM2904Q
DUAL OPERATIONAL AMPLIFIERS
SLOS068C – JUNE 1976 – REVISED JUL Y 1998
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
(LM2904 and LM2904Q...3 V to 26 V) or
– Dual Supplies
D
Low Supply-Current Drain Independent of Supply Voltage . . . 0.7 mA Typ
D
Common-Mode Input Voltage Range Includes Ground, Allowing Direct Sensing Near Ground
D
Low Input Bias and Offset Parameters: – Input Offset Voltage ...3 mV Typ
A Versions ...2 mV Typ – Input Offset Current...2 nA Typ – Input Bias Current...20 nA Typ
A Versions . . . 15 nA Typ
D
Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . ±32 V (LM2904 and LM2904Q...±26 V)
D
Open-Loop Differential Voltage Amplification . . . 100 V/mV Typ
D
Internal Frequency Compensation
description
These devices consist of two independent, high-gain, frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3 V to 30 V (3 V to 26 V for the LM2904 and LM2904Q), and V
CC
is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be more easily implemented in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily provides the required interface electronics without additional ±5-V supplies.
The LM2904Q is manufactured to demanding automotive requirements. The LM158 and LM158A are characterized for operation over the full military temperature range of –55°C to
125°C. The LM258 and LM258A are characterized for operation from –25°C to 85°C, the LM358 and LM358A from 0°C to 70°C, and the LM2904 and LM2904Q from –40°C to 125°C.
logic diagram (each amplifier)
IN+ IN–
OUT
+ –
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
1 2 3 4
8 7 6 5
1OUT
1IN– 1IN+
GND
V
CC
2OUT 2IN– 2IN+
D, JG, P, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4 5 6 7 8
18 17 16 15 14
NC 2OUT NC 2IN– NC
NC
1IN–
NC
1IN+
NC
LM158, LM158A . . . FK PACKAGE
(TOP VIEW)
NC
1OUT
NCNCNC
NC
GND
NC
CC+
V
2IN+
NC – No internal connection
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
LM158, LM158A, LM258, LM258A LM358, LM358A, LM358Y, LM2904, LM2904Q DUAL OPERATIONAL AMPLIFIERS
SLOS068C – JUNE 1976 – REVISED JUL Y 1998
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
T
A
V
IO(max
)
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
(PW)
CHIP
FORM
(Y)
°
°
7 mV LM358D LM358P LM358PW LM358Y
0°C to 70°C
3 mV LM358AP
°
°
5 mV LM258D LM258P
25°C to 85°C
3 mV LM258AP
°
°
LM2904D LM2904P LM2904PW
40°C to 125°C
7 mV
LM2904QD LM2904QP
°
°
5 mV LM158D LM158FK LM158JG LM158P
55°C to 125°C
2 mV LM158AFK LM158AJG
The D package is available taped and reeled. Add the suffix R to the device type (e.g., LM358DR).
The PW package is only available left-end taped and reeled.
schematic (each amplifier)
V
CC+
OUT
GND (or V
CC–
)
To Other Amplifier
IN–
IN+
6-µA
Current
Regulator
6-µA
Current
Regulator
100-µA
Current
Regulator
50-µA Current
Regulator
Epi-FET Diodes Resistors Transistors Capacitors
COMPONENT COUNT
1 2 7
51
2
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358Y, LM2904, LM2904Q
DUAL OPERATIONAL AMPLIFIERS
SLOS068C – JUNE 1976 – REVISED JUL Y 1998
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
LM358Y chip information
These chips, when properly assembled, display characteristics similar to the LM358. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive epoxy or a gold-silicon preform.
Chip Thickness: 15 Typical Bonding Pads: 4 × 4 Minimum T
J(max)
= 150°C
Tolerances Are ±10%. All Dimensions Are in Mils. No Backside Metallization Pin (4) is Internally Connected to Backside of Chip.
BONDING PAD ASSIGNMENTS
47
57
(7) (6) (5)
(8)
(4)
(3)
(2)(1)
1IN+ 1IN–
1OUT
+ –
(2)
(3)
(1)
V
CC+
(8)
2OUT
2IN+
V
CC–
(4)
+ –
2IN–
(5) (6)
(7)
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