D±3-A Maximum Output Current
DLow Supply Voltage Operation: 2.8 V to 5.5 V
DHigh Efficiency Generates Less Heat
DOvercurrent and Thermal Protection
DFault Indicators for Overcurrent, Thermal and
Undervoltage Conditions
DTwo Selectable Switching Frequencies
DInternal or External Clock Sync
DPWM Scheme Optimized for EMI
D9×9 mm PowerPAD Quad Flatpack Package
The DRV593 and DRV594 are high-efficiency,
high-current power amplifiers ideal for driving a wide
variety of thermoelectric cooler elements in systems
powered from 2.8 V to 5.5 V. The operation of the device
requires only one inductor and capacitor for the output
filter, saving significant printed-circuit board area.
Pulse-width modulation (PWM) operation and low output
stage on-resistance significantly decrease power
dissipation in the amplifier.
The DRV593 and DRV594 are internally protected against
thermal and current overloads. Logic-level fault indicators
signal when the junction temperature has reached
approximately 115°C to allow for system-level shutdown
before the amplifier’s internal thermal shutdown circuitry
activates. The fault indicators also signal when an
overcurrent event has occurred. If the overcurrent circuitry
is tripped, the devices automatically reset (see application
information section for more details).
The PWM switching frequency may be set to 500 kHz or
100 kHz depending on system requirements. To eliminate
external components, the gain is fixed at 2.3 V/V for the
DRV593. For the DRV594, the gain is fixed at 14.5 V/V.
V
DD
1 µF
120 kΩ
DC Control
Voltage
1 kΩ
1 kΩ
Shutdown Control
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
220 pF
1 µF
FAULT1
FAULT0
AVDD
AGND (Connect to PowerPAD)
ROSC
COSC
AREF
IN+
IN-INSHUTDOWN
10 µF
FREQ
FAULT1
PVDD
INT/EXT
DRV593
DRV594
FAULT0
PVDD
1 µF
PVDD
PVDD
1 µF
PWM
PVDD
PVDD
H/C
PWM
H/C
PWM
PGND
PGND
PGND
PGND
PGND
PGND
H/C
PWM
H/C
10 µH
Copyright 2002, Texas Instruments Incorporated
To TEC or Laser
Diode Anode
10 µF
To TEC or Laser
Diode Cathode
DRV593
DRV594
SLOS401A - SEPTEMBER 2002 REVISED - OCTOBER 2002
www.ti.com
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible t o damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
T
A
-40°C to 85°C
(1)
This package is available taped and reeled. To order this
packaging option, add an R suffix to the part number (e.g.,
PowerPAD QUAD FLATPACK
(VFP)
DRV593VFP
DRV594VFP
(1)
(1)
DRV593VFPR or DRV594VFPR).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
Supply voltage, AVDD, PVDD-0.3 V to 5.5 V
Input voltage, V
I
Output current, IO (FAULT0, FAULT1)1 mA
Continuous total power dissipationSee Dissipation Rating Table
Operating free-air temperature range, T
Operating junction temperature range, T
Storage temperature range, T
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
stg
A
J
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
(1)
DRV593, DRV594
-0.3 V to VDD + 0.3 V
-40°C to 85°C
-40°C to 150°C
-65°C to 165°C
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
Supply voltage, AVDD
High-level input voltage, V
Low-level input voltage, V
Operating free-air temperature, T
High side256095
Low side256595
High side2580140
Low side2590140
DRV594
1µA
V
V
mΩ
mΩ
kHz
mA
3
DRV593
DRV594
SLOS401A - SEPTEMBER 2002 REVISED - OCTOBER 2002
PIN ASSIGNMENTS
www.ti.com
VFP PACKAGE
(TOP VIEW)
AVDD
AGND
ROSC
COSC
AREF
IN+
IN-
SHUTDOWN
PVDD
FREQ
INT/EXT
PVDD
PVDD
31 30 29 28 27
3226
1
2
3
4
5
6
7
8
PowerPAD
910
11 12 13 14 15
PVDD
FAULT1
FAULT0
PVDD
PVDD
PWM
PWM
H/C
H/C
PWM
25
16
H/C
24
23
22
21
20
19
18
17
PWM
PGND
PGND
PGND
PGND
PGND
PGND
H/C
Terminal Functions
TERMINAL
NAMENO.
AGND2Analog ground
AREF5OConnect 1 µF capacitor to ground for AREF voltage filtering
AVDD1IAnalog power supply
COSC4IConnect capacitor to ground to set oscillation frequency (220 pF for 500 kHz, 1 nF for 100 kHz) when the internal
FAULT010OFault flag 0, low when active open drain output (see application information)
FAULT19OFault flag 1, low when active open drain output (see application information)
FREQ32I
IN-7INegative differential input
IN+6IPositive differential input
INT/EXT31ISelects the internal oscillator when a TTL logic high is applied to this terminal; selects the use of an external oscil-
H/C14, 15,
16, 17
PWM24, 25,
26, 27
PGND18, 19,
20, 21,
22, 23
PVDD11, 12,
13, 28,
29, 30
ROSC3IConnect 120-kΩ resistor to AGND to set oscillation frequency (either 500 kHz or 100 kHz). Not needed if an
SHUTDOWN8IPlaces the amplifier in shutdown mode when a TTL logic low is applied to this terminal; places the amplifier
I/ODESCRIPTION
oscillator is selected; connect clock signal when an external oscillator is used
Selects 500 kHz switching frequency when a TTL logic low is applied to this terminal; selects 100 kHz switching
frequency when a TTL logic high is applied
lator when a TTL logic low is applied to this terminal
ODirection control output for heat and cool modes (4 pins)
OPWM output for voltage magnitude (4 pins)
High-current ground (6 pins)
IHigh-current power supply (6 pins)
external clock is used.
in normal operation when a TTL logic high is applied
4
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FUNCTIONAL BLOCK DIAGRAM
DRV593
DRV594
SLOS401A - SEPTEMBER 2002 REVISED - OCTOBER 2002
IN-
IN+
SHUTDOWN
INT/EXT
FREQ
COSC
ROSC
AREF
R
R
TTL
Input
Buffer
AVDD
AVDD
AGND
2.3 ×R (DRV593)
14.5 x R (DRV594)
_
+
_
+
2.3 ×R (DRV593)
14.5 x R (DRV594)
Biases
References
and
_
+
_
+
Ramp
Generator
+
_
+
_
ThermalVDDok
Gate
Drive
Gate
Drive
Start-Up
Protection
Logic
PVDD
H/C
PGND
PVDD
PWM
PGND
OC
Detect
FAULT0
FAULT1
5
DRV593
)
r
DS(on)
Drain source on state resistance
DRV594
SLOS401A - SEPTEMBER 2002 REVISED - OCTOBER 2002
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
Efficiencyvs Load resistance2, 3
vs Supply voltage4
r
DS(on
I
q
PSRRPower supply rejection ratiovs Frequency8, 9
I
O
V
IO
Drain-source on-state resistance
Supply currentvs Supply voltage7
Closed loop response12, 13
Maximum output current
Input offset voltageCommon-mode input voltage16, 17
TEST SETUP FOR GRAPHS
The LC output filter used in Figures 2, 3, 8, and 9 is shown below.