ST STTH112 User Manual

Features

■ Low forwarded voltage drop

■ High reliability

■ High surge current capability

■ Soft switching for reduced EMI disturbances

■ Planar technology

Description

The STTH112, which is using ST ultrafast high
voltage planar technology, is specially suited for
free-wheeling, clamping, snubbering,
demagnetization in power supplies and other
power switching applications

STTH112

High voltage ultrafast rectifier

DO-41

STTH112

SMA

STTH112A

SMB

STTH112U

Table 1. Device summary

Symbol Value

I

F(AV)

V

RRM

T

j (max)

V

F (max)

1 A

1200 V

175 °C

1.65 V

October 2009 Doc ID 9343 Rev 5 1/8

www.st.com

8

Electrical characteristics STTH112

1 Electrical characteristics

Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

V

(RMS)

Repetitive peak reverse voltage 1200 V

RRM

Voltage rms 850 V

Tl = 85°C δ =0.5 DO-41

I

F(AV)

Average forward current

1ATl = 115°C δ =0.5 SMA

Tl = 125°C δ =0.5 SMB

DO-41 20

I

Forward surge current t = 8.3 ms

FSM

18

SMB

T

Table 2. Thermal parameters

Storage temperature range - 50 + 175 °C

stg

Maximum operating junction temperature + 175 °C

T

j

Symbol Parameter Value Unit

L = 10 mm DO-41 45

R

th (j-l)

Junction to lead

SMA 30

°C/W

SMB 25

R

th (j-a)

Table 3. Static electrical characteristics

Junction to ambient L = 10 mm DO-41 110

ASMA

Symbol Parameter Tests conditions Min. Typ. Max. Unit

Tj = 25 °C 5

I

Reverse leakage current VR = 1200 V

R

V

Forward voltage drop IF = 1 A

F

Table 4. Dynamic electrical characteristics

= 125 °C 50

T

j

= 25 °C 1.9

T

j

= 125 °C 1.17 1.65

j

= 150 °C 1.10 1.55

T

j

Symbol Parameter Tests conditions Min. Typ. Max. Unit

I

= 0.5 A

t

Reverse recovery time

rr

t

Forward recovery time IF = 1 A

fr

V

Forward recovery voltage 30 V

FP

F

Irr = 0.25 A IR = 1A

/dt = 50 A/µs

dI

F

VFR = 1.1 x V

Fmax

= 25 °C 75 ns

T

j

500 ns

Tj = 25 °C

2/8 Doc ID 9343 Rev 5

µA

VT

STTH112 Electrical characteristics

0.00.51.01.52.02.53.03.54.04.55.0

Figure 1. Conduction losses versus average

current

P(W)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

δ = 0.05

δ = 0.1

I (A)

F(AV)

δ = 0.2

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3. Relative variation of thermal

impedance junction ambient versus
pulse duration (DO-41)

Z/R

th(j-c) th(j-c)

1.0

epoxy FR4, L = 10mm

0.9

0.8

0.7

0.6

δ = 0.5

0.5

0.4

0.3

δ = 0.2

0.2

δ = 0.1

0.1

Single pulse

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

leads

T

t (s)

p

δ

=tp/T

tp

Figure 2. Forward voltage drop versus

forward current

I (A)

FM

100.0

T=125°C

j

(maximum values)

T=125°C

10.0

1.0

0.1

j

(typical values)

V (V)

FM

T=25°C

j

(maximum values)

Figure 4. Relative variation of thermal

impedance junction ambient versus
pulse duration (epoxy FR4) (SMA)

Z/R

th(j-c) th(j-c)

1.0

0.9

0.8

0.7

0.6

= 0.5

δ

0.5

0.4

0.3

= 0.2

δ

0.2

= 0.1

δ

0.1

Single pulse

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

δ

T

=tp/T

tp

Figure 5. Relative variation of thermal

impedance junction ambient versus
pulse duration (epoxy FR4)(SMB)

Z/R

th(j-c) th(j-c)

1.0

0.9

0.8

0.7

0.6

δ = 0.5

0.5

0.4

0.3

δ = 0.2

0.2

δ = 0.1

0.1

Single pulse

0.0

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

δ

T

=tp/T

Figure 6. Thermal resistance junction to

ambient versus copper surface
under each lead (DO-41, SMB)

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

tp

10

0

012345678910

Doc ID 9343 Rev 5 3/8

epoxy printed circuit board FR4, copper thickness:35µm

DO-41

L =10mm

leads

SMB

S(cm²)

Electrical characteristics STTH112

Figure 7. Thermal resistance junction to ambient versus copper surface under each lead

(epoxy printed circuit board FR4, copper thickness: 35µm) (SMA)

R (°C/W)

th(j-a)

140

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMA

S(cm²)

4/8 Doc ID 9343 Rev 5

STTH112 Package information

2 Package information

● Epoxy meets UL 94, V0

● Band indicates cathode

● Bending method (DO-41): see Application note AN1471

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 5. SMA dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

Ref.

E1

Millimeters Inches

Min. Max. Min. Max.

D

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

Figure 8. Footprint (dimensions in mm)

1.4

2.63

1.4

1.64

5.43

Doc ID 9343 Rev 5 5/8

Package information STTH112

Table 6. SMB dimensions

Dimensions

E1

D

E

A1

C

L

A2

b

Figure 9. Footprint (dimensions in mm)

1.62

2.60

5.84

Ref.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

L 0.75 1.50 0.030 0.059

1.62

2.18

Table 7. DO-41 (plastic) dimensions

ØD

CC

A

ØB

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.07 5.20 0.160 0.205

B 2.04 2.71 0.080 0.107

C25.4 1

D 0.71 0.86 0.028 0.034

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STTH112 Ordering information

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery Mode

STTH112 STTH112 DO-41 0.34 g 2000 Ammopack

STTH112A H12 SMA 0.068 g 5000 Tape and reel

STTH112U U12 SMB 0.11 g 2500 Tape and reel

STTH112RL STTH112 DO-41 0.34 g 5000 Tape and reel

4 Revision history

Table 9. Document revision history

Date Revision Changes

Jan-2003 2 Initial release.

New value of T

22-Jun-2005 3

20-Mar-2007 4

30-Sep-2009 5 Updated table 7 package dimensions.

Dimensions A1 E and D updated in Table 4.
Data sheet reformatted.
No other technical changes.

Reformatted to current standards. Updated dimensions and footprints
for SMA and SMB packages.

= 150 °C added to table 2.

j

Doc ID 9343 Rev 5 7/8

STTH112

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