Turbo 2 ultrafast - high voltage rectifier for SMPS
Features
■ Ultrafast switching
■ Low reverse current
■ Low thermal resistance
■ Reduces conduction and switching losses
Description
The STTH10LCD06C uses ST Turbo2 technology.
This device is specially suited for switching power
supplies working with interleaved PFCs.
A1
A2
A2
K
A1
TO-220AB
STTH10LCD06CT
STTH10LCD06CFP
K
A1
D2PAK
STTH10LCD06CG-TR
Table 1.Device summary
I
F(AV)
V
RRM
T
j
(typ)1.25 V
V
F
t
(max)25 ns
rr
K
TO-220FPAB
A2
2 x 5A
600 V
175 °C
A1
A2
K
April 2011Doc ID 15897 Rev 31/10
www.st.com
10
CharacteristicsSTTH10LCD06C
1 Characteristics
Table 2.Absolute ratings
(1)
SymbolParameterValueUnit
V
I
F(RMS)
I
F(AV)
I
T
1. Limiting values per diode at 25 °C, unless otherwise specified
2. condition to avoid thermal runaway for a diode on its own heatsink
Table 3.Thermal resistance
Repetitive peak reverse voltage600V
RRM
Forward current rms20A
TO-220AB,
2
PA K
D
Average forward
= 130 °C
T
c
current, δ = 0.5
= 100 °C TO-220FPAB
T
c
Surge non repetitive forward current tp = 10 ms sinusoidal60A
FSM
Storage temperature range-65 to + 175°C
stg
Maximum operating junction temperature
T
j
<
Rth(j-a)
1
dPtot
dTj
(2)
Per diode5A
Per device10A
Per diode5A
Per device10A
175°C
SymbolParameterValueUnit
2
PA K4 .5
°C/W
R
Table 4.Static electrical characteristics
Junction to case(per diode)
th(j-c)
TO-220AB, D
TO-220FPAB7.5
SymbolParameterTest conditionsMin.Typ.Max.Unit
Reverse leakage
(1)
I
R
current
(2)
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
Forward voltage drop
F
= 25 °C
T
j
= 150 °C550
T
j
= 25 °C
T
j
T
= 150 °C1.251.6
j
= 25 °C
T
j
T
= 150 °C1.552
j
= V
V
R
I
= 5 A
F
= 10 A
I
F
RRM
1
2
2.35
To evaluate the conduction losses use the following equation:
P = 1.2 x I
F(AV)
+ 0.08 x I
F2(RMS)
µA
V
2/10 Doc ID 15897 Rev 3
STTH10LCD06CCharacteristics
Table 5.Dynamic electrical characteristics
SymbolParameter
Test conditions
I
= 0.5 A, Irr = 0.25 A,
F
IR = 1 A, Tj = 25 °C
t
Reverse recovery time
rr
I
V
Reverse recovery current
RM
t
Forward recovery time
fr
Forward recovery voltage
FP
= 1 A, dIF/dt = -50 A/µs,
I
F
= 30 V, Tj = 25 °C
V
R
= 5 A, dIF/dt = -50 A/µs,
I
F
VR = 400 V, Tj = 125 °C
I
= 5 A, dIF/dt = 100 A/µs
F
VFR = 1.1 x V
= 5 A, dIF/dt = 100 A/µs
I
F
= 1.1 x V
V
FR
Figure 1.Average forward power dissipation
versus average forward current
(per diode)
P
(W)
F(AV)
12
δ = 0.2
10
8
6
4
2
0
01234567
δ = 0.05
δ = 0.1
I
F(AV)
(A)
δ = 0.5
δ = 1
δ = tp/T
T
t
p
Min.Typ.Max.Unit
25
3550
1.82.5A
, Tj = 25 °C
Fmax
, Tj = 25 °C
Fmax
5V
100ns
Figure 2.Forward voltage drop versus
forward current (per diode)
IFM(A)
50
Tj= 150 °C
Tj= 150 °C
(Maximum values)
Tj= 25 °C
(Maximum values)
40
30
20
10
0
(Typical values)
0.00.51.01.52.02.53.03.54.0
ns
VFM(V)
Figure 3.Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220AB, D
Z
th(j-c)/Rth(j-c)
1.0
TO-220AB
0.9
D2PAK
0.8
0.7
0.6
0.5
0.4
0.3
Single pulse
0.2
0.1
0.0
1.E-041.E-031.E-021.E-011.E+00
tp(s)
Figure 4.Relative variation of thermal
impedance junction to case versus
2
PAK)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-031.E-021.E-011.E+001.E+01
Doc ID 15897 Rev 33/10
pulse duration (TO-220FPAB)
Z
th(j-c)/Rth(j-c)
TO-220FPAB
Single pulse
tp(s)
CharacteristicsSTTH10LCD06C
Figure 5.Peak reverse recovery current
versus dI
/dt
F
(typical values, per diode)
IRM(A)
10
IF= I
F(AV)
9
VR= 400 V
Tj= 125 °C
8
7
6
5
4
3
2
1
0
050 100 150 200 250 300 350 400 450 500
dIF/dt (A/µs)
Figure 7.Reverse recovery charges versus
/dt (typical values, per diode)
dI
F
QRR(nC)
350
IF= I
F(AV)
VR= 400 V
300
Tj= 125 °C
250
200
150
100
50
0
050 100 150 200 250 300 350 400 450 500
dIF/dt (A/µs)
Figure 6.Reverse recovery time versus
dIF/dt (typical values, per diode)
tRR(ns)
200
180
160
140
120
100
80
60
40
20
0
050 100 150 200 250 300 350 400 450 500
IF= I
F(AV)
VR= 400 V
Tj= 125 °C
dIF/dt (A/µs)
Figure 8.Reverse recovery softness factor
versus dIF/dt
(typical values, per diode)
S
FAC TOR
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
050100 150 200 250 300 350 400 450 500
IF= I
F(AV)
VR= 400 V
Tj= 125 °C
dIF/dt (A/µs)
Figure 9.Relative variations of dynamic
Figure 10. Transient peak forward voltage
parameters versus junction
temperature
1.2
IF= I
F(AV)
VR= 400 V
1.0
Refernce Tj= 125 °C
0.8
I
0.6
0.4
0.2
0.0
RM
S
FACTOR
Q
RR
255075100125
Tj(°C)
4/10 Doc ID 15897 Rev 3
VFP(V)
18
IF= I
16
Tj= 125 °C
14
12
10
8
6
4
2
0
050100 150 200 250 300 350 400 450 500
versus dI
/dt
F
(typical values, per diode)
F(AV)
dIF/dt (A/µs)
STTH10LCD06CCharacteristics
0
Figure 11. Forward recovery time versus dI
(typical values, per diode)
/dt
Figure 12. Junction capacitance versus
F
reverse voltage applied
(typical values, per diode)
tFR(ns)
160
140
120
100
80
60
40
20
0
050 100 150 200 250 300 350 400 450 50
IF= I
F(AV)
VR= 1.1 x VFmax.
Tj= 125 °C
dIF/dt (A/µs)
C (pF)
100
V
OSC
10
1
1101001000
Figure 13. Thermal resistance junction to ambient versus copper surface under tab
R
(°C/W)
th(j-a)
80
Epoxy printed board Fr4, copper thickness: 35 µm
70
60
50
40
30
20
10
0
0510152025303540
D2PAK
Scu(cm²)
F = 1 MHz
= 30 mV
Tj= 25 °C
RMS
VR(V)
Doc ID 15897 Rev 35/10
Package informationSTTH10LCD06C
2 Package information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 6.TO-220AB dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.404.600.1730.181
C1.231.320.0480.051
H2
Dia
A
C
D2.402.720.0940.107
E0.490.700.0190.027
L2
F2
F1
L5
L6
L9
L4
F
G1
L7
F0.610.880.0240.034
F11.141.700.0440.066
F21.141.700.0440.066
G4.955.150.1940.202
D
G12.402.700.0940.106
H21010.400.3930.409
L216.4 typ.0.645 typ.
M
E
L413140.5110.551
L52.652.950.1040.116
G
L615.2515.750.6000.620
L76.206.600.2440.259
L93.503.930.1370.154
6/10 Doc ID 15897 Rev 3
M2.6 typ.0.102 typ.
Diam.3.753.850.1470.151
STTH10LCD06CPackage information
Table 7.TO-220FPAB dimensions
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.44.60.1730.181
A
H
B
B2.52.70.0980.106
D2.52.750.0980.108
E0.450.700.0180.027
Dia
L6
L2
L3
L5
F1
L4
G1
F2
F
G
D
E
F0.7510.0300.039
F11.151.700.0450.067
F21.151.700.0450.067
L7
G4.955.200.1950.205
G12.42.70.0940.106
H1010.40.3930.409
L216 Typ.0.63 Typ.
L328.630.61.1261.205
L49.810.60.3860.417
L52.93.60.1140.142
L615.916.40.6260.646
L79.009.300.3540.366
Dia.3.003.200.1180.126
Doc ID 15897 Rev 37/10
Package informationSTTH10LCD06C
Table 8.D2PAK dimensions
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.404.600.1730.181
A
L2
E
C2
A12.492.690.0980.106
A20.030.230.0010.009
B0.700.930.0270.037
D
L
L3
G
A1
B2
B
C
R
A2
B21.141.700.0450.067
C0.450.600.0170.024
C21.231.360.0480.054
D8.959.350.3520.368
E10.0010.400.3930.409
G4.885.280.1920.208
L15.0015.850.5900.624
M
*
V2
* FLAT ZONE NO LESSTHAN 2mm
L21.271.400.0500.055
L31.401.750.0550.069
M2.403.200.0940.126
R0.40 typ.0.016 typ.
V20°8°0°8°
8/10 Doc ID 15897 Rev 3
STTH10LCD06COrdering information
3 Ordering information
Table 9.Ordering information
Order codeMarkingPackageWeight Base qty. Delivery mode
STTH10LCD06CTSTTH10LCD06CTTO-220AB2.23 g50Tube
STTH10LCD06CG-TR STTH10LCD06CGD2PAK1.48 g1000Tape and reel
STTH10LCD06CFPSTTH10LCD06CTO-220FPAB2.04 g50Tube
4 Revision history
Table 10.Document revision history
DateRevisionChanges
15-Jul-20091First issue.
17-Jan-20112Updated dimensions and graphic in Ta b l e 7 .
07-Apr-20113Added (per diode) in Ta b l e 3 .
Doc ID 15897 Rev 39/10
STTH10LCD06C
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