Sony XRC-5604-X Service manual
XR-C5500/C5604X
SERVICE MANUAL
Ver 1.1 2001.05
Photo: XR-C5604X
SPECIFICATIONS
US Model
E Model
XR-C5500
Saudi Arabia Model
Taiwan Model
XR-C5604X
Model Name Using Similar Mechanism XR-C5100
T ape Transport Mechanism Type MG-25F-136
FM/MW/SW CASSETTE CAR STEREO
9-870-135-12 Sony Corporation
2001E0500-1 e Vehicle Company
C 2001.5 Shinagawa Tec Service Manual Production Group
TABLE OF CONTENTS
1. SERVICE NOTE ............................................................. 2
2. GENERAL ........................................................................ 3
3. DISASSEMBLY .............................................................. 14
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
4. ASSEMBLY OF MECHANISM DECK ................ 15
5. MECHANICAL ADJUSTMENTS ............................ 17
6. ELECTRICAL ADJUSTMENTS
6-1. Test Mode........................................................................ 17
• Tape Deck Section ........................................................ 17
• Tuner Section ................................................................ 17
7. DIAGRAMS
7-1. Block Diagrams
• TUNER/TAPE/MAIN Section..................................... 18
• DISPLAY/KEY CONTROL/BUS CONTROL/
POWER SUPPLY Section ........................................... 19
7-2. Printed Wiring Board – MAIN Board – ......................... 21
7-3. Schematic Diagram – MAIN Board (1/2) – ................... 22
7-4. Schematic Diagram – MAIN Board (2/2) – ................... 23
7-5. Printed Wiring Boards – KEY/SUB Boards – .............. 24
7-6. Schematic Diagrams – KEY/SUB Boards – .................. 25
7-7. IC Block Diagrams ......................................................... 26
7-8. IC Pin Function ............................................................... 27
8. EXPLODED VIEWS................................................ 32
9. ELECTRICAL PARTS LIST ............................... 35
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
SERVICE NOTE
Please press on the sub board from above when checking it.
This assures that the connector does not lose contact.
SUB board
SECTION 1
Front panel assembly
2
SECTION 2
GENERAL
This section is extracted from
instruction manual.
3
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