Sony XR-C5300X,XR-C5305,XR-C5600X Service Manual
2007.05.11
QQ :376315150
手机:13942296513
XR-C5300X/C5305/C5600X
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SERVICE MANUAL
Ver 1.1 2001.05
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Photo: XR-C5300X
SPECIFICATIONS
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Model Name Using Similar Mechanism XR-C5100
T ape Transport Mechanism Type MG-25F-136
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Canadian Model
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US Model
XR-C5300X/C5305
E Model
XR-C5600X
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FM/AM CASSETTE CAR STEREO
XR-C5300X/C5305
FM/MW/SW CASSETTE CAR STEREO
XR-C5600X
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9-870-102-12 Sony Corporation
2001E0500-1 e Vehicle Company
C 2001.5 Shinagawa Tec Service Manual Production Group
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TABLE OF CONTENTS
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1. SERVICE NOTE ............................................................. 2
2. GENERAL ........................................................................ 3
3. DISASSEMBLY .............................................................. 13
4. ASSEMBLY OF MECHANISM DECK................ 14
5. MECHANICAL ADJUSTMENTS ............................ 17
6. ELECTRICAL ADJUSTMENTS
6-1. Test Mode........................................................................ 17
• Tape Deck Section ........................................................ 17
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• Tuner Section................................................................ 17
7. DIAGRAMS
7-1. Block Diagrams
• TUNER/TAPE/MAIN Section ..................................... 18
• DISPLAY/KEY CONTROL/BUS CONTROL/
POWER SUPPLY Section ........................................... 19
7-2. Printed Wiring Board – MAIN Board – ......................... 21
7-3. Schematic Diagram – MAIN Board (1/2) – ................... 22
7-4. Schematic Diagram – MAIN Board (2/2) – ................... 23
7-5. Printed Wiring Boards – KEY/SUB Boards – .............. 24
7-6. Schematic Diagrams – KEY/SUB Boards – .................. 25
7-7. IC Block Diagrams ......................................................... 26
7-8. IC Pin Function ............................................................... 27
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Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
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ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
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8. EXPLODED VIEWS................................................ 32
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9. ELECTRICAL PARTS LIST ............................... 35
Please press on the sub board from above when checking it.
This assures that the connector does not lose contact.
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SECTION 1
SERVICE NOTE
SUB board
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SECTION 2
GENERAL
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This section is extracted from
instruction manual.
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Note: Follow the disassembly procedure in the numerical order given.
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SUB PANEL, MECHANISM DECK (MG-25F-136)
6
8 Connector(CN351)
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0 Mechanism deck
(MG-25F-136)
SECTION 3
DISASSEMBLY
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9 Screw
(PTT2.6 × 6)
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7 Flexible flat cabl
(CNP301)
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5 Sub panel ass'y
3 Screw
(PTT2.6 × 6)
Sub board
2 T wo screws
(PTT2.6 × 6)
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MAIN BOARD, HEAT SINK
7 Two ground screws
1 T wo screws
(PTT2.6 × 6)
5 Rubber cap(25)
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6 Ground screw
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6 Flat cable (WR801)
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4 Screw (PTT2.6 × 6)
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9 Insulated
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4 Ground plate(TU)
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1 Eight screws
(PTT2.6 × 8)
2 T wo screws
(PTT2.6 × 12)
3 Heat sink
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