Sony RMNX-7000 Service manual
RM-NX7000
SERVICE MANUAL
Ver 1.0 2004. 04
SPECIFICATIONS
OS
LINUX
CPU
i.MX1 Application Processor 200MHz
Memory
32 MB (RAM)
User memory range: approx. 15 MB
Interface
Interface connector
USB. “Memory Stick” slot
Display
TFT color LCD with backlight
320 x 240 pixels (65,536 colors)
Dimensions
Approx. 101 x 165 x 50 mm (w x h x d)
(4 x 61/2 x 2 inches)
Mass
320 g (111/2 ounce) (including batteries)
Operating temperature recommended
5 ºC to 35 ºC (41 ºF to 95 ºF)
Operating distance*
Approx. 10 meters (32.8 feet) (front distance)
US Model
Battery Life
Approx. 1 day (varies depending on
frequency of use)
Supplied accessories
Battery charging stand (1)
AC power adaptor (1)
USB cable (1)
Stylus (1)
Installation CD-ROM (1)
Operating Instructions (1, this manual)
Brochure (1)
Warranty Card (1)
Other printed materials (1 set)
* The operating distance varies depending
on components of different
manufacturers.
** Some signals cannot be learned by the
Remote Commander, even though the
signals comply with these specifications.
***Depending on the component, some
signals may not be learned by the
Commander.
Design and specifications are subject to
change without notice.
Learnable signals**
Capacity par signal: up to 300 bits
Signal frequency range: up to 500 kHz***
Signal interval: up to 1 second***
Power requirements
Supplied AC power adaptor: DC 4.5 V
(dedicated connector)
Built-in, rechargeable and non-removable
Ni-MH batteries (2)
9-877-700-01
2004C02-1
© 2004.04
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
INTEGRATED REMOTE COMMANDER
RM-NX7000
TABLE OF CONTENTS
Specifications ............................................................................ 1
1. GENERAL ...................................................................3
2. DISASSEMBLY
2-1. Disassembly Frow ...........................................................5
2-2. Case (Lower) Nickel Hydrogen Battery..........................5
2-3. Case (Upper) Block Assy ................................................ 6
2-4. Switch Block Assy........................................................... 6
2-5. Main Board......................................................................7
3. TEST MODE ............................................................... 8
4. DIAGRAM
4-1. Block Diagram – Main Section (1/2) – ..........................10
4-2. Block Diagram – Main Section (2/2) – ..........................11
4-3. Shematic Diagram – Main Section (1/6) – ..................... 12
4-4. Shematic Diagram – Main Section (2/6) – ..................... 13
4-5. Shematic Diagram – Main Section (3/6) – ..................... 14
4-6. Shematic Diagram – Main Section (4/6) – ..................... 15
4-7. Shematic Diagram – Main Section (5/6) – ..................... 16
4-8. Shematic Diagram – Main Section (6/6) – ..................... 17
4-9. Plinted Wiring Board – Main Section (Side A) – ........... 18
4-10. Plinted Wiring Board – Main Section (Side B) –...........19
4-11. Shematic Diagram – LED Section – ..............................20
4-12. Plinted Wiring Board – LED Section – ......................... 20
5. EXPLODED VIEWS ................................................. 21
6. ELECTRICAL PARTS LIST ..................................22
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
• Memory Stick and are trademarks of Sony Corporation.
• Memory Stick Duo,
are trademarks of Sony Corporation.
•“TouchEngine” is a trademark of Sony Corporation.
• Microsoft and Windows are registered trademarks of Microsoft
Corporation in the United States and/or other countries.
• All other names of systems and products are trademarks or
registered trademarks of their respective owners. ™ and ® marks
are omitted in this manual.
• Microsoft® Windows® XP Professional and Microsoft® Windows
XP Home Edition are mentioned as Windows XP in this manual.
• Microsoft® Windows® 2000 Professional is mentioned as Windows
2000 in this manual.
• Microsoft® Windows® Millennium Edition is mentioned as
Windows Me in this manual.
• Microsoft® Windows® 98 Second Edition is mentioned as Windows
98 SE in this manual.
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Note on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
• IC1 (microcomputer) and IC7 (flash RAM) on Main board
cannot be replaced individually.
Replace it with Main board assembly for service.
and “Memory Stick PRO”
®
2
• Location and function of controls
• Front panel
1
2
3
INTEGRATED
REMOTE COMMANDER
SECTION 1
GENERAL
BACK NEXT
HOME
COMMANDER
OFF
RM-NX7000
This section is extracted
from instruction manual.
8
9
4
OK
MENU EXIT
5
6
7
1
Touch panel display
Shows operation keys and various pieces of
information.
2
Direct Access buttons
Directly skips to the page that is programmed
for the button.
3
NEXT/BACK buttons
Change the page shown on the touch panel display. Press the NEXT button to display the next
page, or press the BACK button to display the
previous one.
4
OK button and Cursor Control buttons
Used to operate the menu display of a component
being controlled by the Remote Commander.
5
MENU button
Shows the menu display of a component being
controlled by the Remote Commander.
6
EXIT button
Exits the menu of a component being controlled by the Remote Commander.
VOL
MUTING RECALL
CH
0
qa
qs
qd
7
Memory Stick slot
Used to insert a “Memory Stick.”
8
HOME button
Returns to the first page of the Home display.
9
COMMANDER OFF button
Turns off the indication of the touch panel
display.
If this button is pressed while a macro is
executed, the macro procedure stops.
0
CH +/– buttons
Select a channel.
qa
RECALL button
The function of this button varies depending on the component being controlled by
the Remote Commander.
qs
VOL +/– buttons
Adjust the volume.
qd
MUTING button
Mutes the audio of a component being controlled by the Remote Commander. Press
the button once again to resume at the previous volume.
3
RM-NX7000
• Upper and rear panel
R
O
qf
qf
O
P
Rear
Q
S
P
DC IN jack
Used to connect the supplied AC power adaptor.
USB connector
Used to connect the USB cable for computer
connection.
Stylus holder
Used to store the supplied Stylus.
Q
Infrared detector/Infrared emitter
This is the area for receiving the component’s
remote control signal or transmitting the Remote Commander’s signal.
R
Infrared emitter
S
RESET button
Used to restart the Remote Commander.
4
SECTION 2
n
2-2 3-2. CASE (LOWER),
NICKEL HYDROGEN BATTERY
(Page 5)
SET
2-3 CASE (UPPER) BLOCK ASSY
(Page 6)
2-4 SWITCH BLOCK ASSY
(Page 6)
2-5 MAIN BOARD
(Page 7)
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
Note: Follow the disassembly procedure in the numerical order given.
2-2. CASE (LOWER), NICKEL HYDROGEN BATTERY
RM-NX7000
4
two screws
(+P 2X6)
qs
CN602
qd
nickel hydrogen battery
6
claw
7
5
qa
CN601
9
claw
1
q;
case (lower)
3
two screws (+P 2.6X8)
claw
8
claw
stylus pe
2
5
RM-NX7000
)
)
2-3. CASE (UPPER) BLOCK ASSY
5
case (upper) block assy
two claws
3
4
2-4. SWITCH BLOCK ASSY
1
wire, (flat type)
(CN703)
3
2
two claws
2
two claws
1
two screws (+P 2X6
4
switch block assy
case (middle
MAIN board
6
2-5. MAIN BOARD
5
wire, (flat type)
(CN803)
8
wire, (flat type)
(CN701)
4
wire, (flat type)
(CN804)
RM-NX7000
6
wire, (flat type)
(CN802)
7
(CN801)
wire, (flat type)
3
9
MAIN board
case (middle)
1
wire, (flat type)
(CN704)
2
two screws (+P 2X6)
7
RM-NX7000
SECTION 3
TEST MODE
• How to enter the service mode
(The internal rechargeable battery must be fully charged.)
1. Turn the DC4.5V power ON for the main unit.
2. Press the main PC board S726 RESET switch.
3. Wait for 20 seconds after “NAVITUS” appears on the LCD,
until the backlight turns ON
4. Within one minute after the light goes out, hold MENU
depressed, then press RECALL and OK .
If input with these keys is accepted successfully, a beep sounds.
5. On the alignment screen, tap the cross “+” marks 3 times (at the
upper left, lower light and center).
“T ap” refers to pressing the screen lightly with a stylus.
*
6. When tapping at the center is completed, the service mode menu
will be displayed.
• Initial display and contents of the service mode menu
Initial display
Service Mode Menu 1.0.1
AUTO
LCD
SEND
LEARN
ERP
KEY
MS
USB
EXIT
Use the cursor keys [u] and [U] to select an item and press OK
to enter on the menu.
AUTO...............Rotates through the enter menu.
LCD......White 80%(rotates in the order of 10 - 130 - 250
backlight)/White 80%/ White 50%/White 20%/Bar
(vertical) /Bar (horizontal)/Bar(horizontal narrow)
SEND....Sending check
LEARN..Learning function check
ERP........Touch engine click check
KEY.......Control key operation check
MS.........Write/Read check for memory stick
USB.......USB connection check
EXIT.................Exits the service mode.
8
p
SECTION 4
DIAGRAMS
RM-NX7000
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise specified.
•%: indicates tolerance.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 4.5V and fed with regulated dc power supply
from extermal power voltage jack.
•Voltages and waveforms are dc with respect to ground under nosignal conditions.
no mark : POWER ON
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• IC1 (microcomputer) and IC7 (flash RAM) on Main board cannot
be replaced individually.
Replace it with Main board assembly for service.
* The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different form that of
conventional IC.
•WAVEFORMS
– MAIN BOARD –
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Main boards is six-layer pritnted board.
However, the patterns of layer 2 to 5 have not been included in this
diagrams.
• IC1 (microcomputer) and IC7 (flash RAM) on Main board
cannot be replaced individually.
Replace it with Main board assembly for service.
IC701 ej XT2
1
32.768KHz
IC701 r; X2
2
3.2
VOL/DIV : 1 V AC
TIME/DIV : 20 µsec
5MHz
VOL/DIV : 1 V AC
TIME/DIV : 0.1 µsec
3
Vp-
Vp-p
99
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