HCD-FR1/FR8/FR9 are the amplifier, DVD/
SACD and tuner section in DAV-FR1/FR8/FR9.
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS POWER
OUTPUT AND TOTAL HARMONIC
DISTORTION:
With 4 ohm loads, both channels driven, from 20 –
20,000 Hz; rated 75 watts per channel minimum RMS
power, with no more than 0.7 % total harmonic
distortion. (from 250 milli watts to rated outpu t )
Amplifier section (HCD-FR1)
Surround modeFront:
(reference)(with SS-TS20)
music power outputCenter*:
Amplifier section (HCD-FR8)
Surround modeFront:
(reference)(with SS-TS21)
music power outputCenter*:
Amplifier section (HCD-FR9)
Surround modeFront:
(reference)(with SS-TS21)
music power outputCenter*:
110
W +
110
W
W
114
114
114
114
W
110
100
W +
W
114
115
W +
W
(with SS-CT44)
Surround*:
110
(with SS-TS20)
Subwoofer*:
(with SS-WS12)
(with SS-CT33)
Surround*:
114
(with SS-TS20)
Subwoofer*:
(with SS-WS12)
(with SS-CT33)
110
W +
W 2
114
W +
W 2
114
W
×
W
×
W
*Depending on the sound fi eld settings and the source,
there may be no sound output.
InputsVIDEO/SAT:
OutputSURROUND BACK
PhonesAccepts low-and high-
Super Audio CD/DVD system
LaserSemiconductor laser
Signal format systemNTSC
Frequency response (at 2 CH STEREO mode)
Home Audio Company
Published by Sony Engineering Corporation
HCD-FR1/FR8/FR9
r
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT -540A. Follow the manuf acturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Pr ecision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC v oltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate low-v oltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V A C range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
AC
0.15 µF
1.5 k
Ω
Earth Ground
voltmete
(0.75 V)
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
2
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
5.ELECTRICAL PARTS LIST .................................. 51
3
HCD-FR1/FR8/FR9
SECTION 1
SERVICING NOTE
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
C (remote sensor) (13)
D Front panel display (98)
E PHONES (on the side of the system)
jack (30)
F VOLUME +/– (30, 83)
G ./> (31, 33)
H x (stop) (31)
I (play/pause) (30)
J FUNCTION (30, 70, 73)
K Disc slot (30)
GENERAL
HCD-FR1/FR8/FR9
This section is extracted
from instruction manual.
Rear Panel
A SPEAKER jacks (15)
B SURROUND BACK jack (19)
C VIDEO AUDIO IN (L/R) jacks (23)
D COMPO NENT VI DEO OUT jacks (23)
E SAT OPTICA L DIGITAL IN jack (24)
VIDEO
AUDIO IN
SPEAKER
CENTER FRONT LFRONT R
SURR L
WOOFER
WOOFERSURR R
RL
SURROUND
RL
BACK
AUDIO IN
SAT
F AM terminals (21)
G FM 75Ω COAXIAL jack (21)
H MONITOR OUT (VIDEO/S VIDEO) jacks
(23)
I SAT AUDIO IN (L/R) jacks (23)
YP
B/CBPR/CR
COMPOMEMT VIDEO OUT
S VIDEO
(DVD ONLY)
VIDEO
MONITOR OUT
OPTICAL
DIGITAL IN
SAT
AM
FM 75
COAXIAL
5
HCD-FR1/FR8/FR9
Remote
Open the cover.
Note
This remote contro l glows in the dark. How e ve r,
before glowing, the remote must be exposed to light for
awhile.
A DISC SKIP (30, 31)
B DISPLA Y (46, 49, 73)
C SLEEP (75)
D ./>, PRESET –/+ (31, 33, 73, 74)
E H (play) (30, 31, 32, 33, 37, 38, 39, 41,
41, 42, 43)
F DVD TOP MENU/ALBUM– (33, 35, 36)
G C/X/x/c/ENTER (27, 33, 33, 35, 36, 38,
I AUTO FORMAT DIRECT (53, 54)
J DSGX (59)
K DVD SETUP (27, 64, 77)
L SUBTITLE (61)
M AUDIO (51)
N ANGLE (60)
O Number buttons (33, 33, 39, 44, 60, 62,
64, 67, 69)
P ENTER
Q TUNER MENU (72, 74)
R TV [/1 (on/standby) (67)
S "/1 (standby) (27, 30, 72, 73)
T SONY TV DIRECT (69)
U TUNER/BAND (72, 73, 74)
V FUNCTION (27, 30, 70, 73, 74)
W m/M// SLOW, TUNING –/+ (37,
43, 72, 73)
X x (stop) (31, 32, 33, 62, 73)
Y X (pause) (31)
Z MUTING (31)
e; MODE (54, 55)
ea NIGHT MODE (59)
es PLAY MODE (38, 39, 41)
ed REPEAT (39, 42)
ef TV (67, 69)
eg TV/VIDEO (67, 69)
eh TV CH +/– (67, 69)
ej TV VOL +/– (67)
ek AMP MENU (57, 71, 75, 85)
el CLEAR (27, 39, 44)
r; FM MODE (73)
6
• Circuit Boards Location
d
SONY LAMP board
HCD-FR1/FR8/FR9
SECTION 3
DIAGRAMS
IO board
LF board
DISC KEY board
PW KEY board
SW (2) board
SW (1) board
SENSOR board
FL board
SW (3) board
MODE MOTOR board
CONTROL KEY board
ROLLER MOTOR board
SW (4) board
AMP boar
SWITCHING REGLATOR
HP board
STOCKER MOTOR board
RELAY board
SPK board
DMB08 board
RF board
DDCON board
7
HCD-FR1/FR8/FR9
d
d
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
•f: internal component.
• C : panel designation.
Note:
The components identified by mark 0 or dotted line with mark 0 are
critical for safety.
Replace only with part
number specified.
• A : B+ Line.
• B : B– Line.
•Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
•Voltages and waveforms are dc with respect to ground in
service mode.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
no mark : DVD STOP
•( ) : CD STOP
• Circled numbers refer to waveforms.
• Signal path.
F: AUDIO
J: CD PLAY
c: DVD PLAY
d: TUNER
L: VIDEO
i : OPTICAL DIGITAL IN
h: VIDEO IN
a: CHROMA
d: Y
r: COMPONENT VIDEO
e: AUX IN
I : SACD PLAY
q: R, G, B
4
W or less unless otherwise
Note:
Les composants identifiés
par une marque 0 sont cr itiques pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
For printed wiring boards.
Note:
• X : parts extracted from the component side.
a
•
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor.
: Through hole.
Caution:
Pattern face side: P arts on the pattern face side seen from
(Side A)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Side B)the parts face are indicated.
CEB
These are omitte
C
Q
These are omitte
EB
8
HCD-FR1/FR8/FR9
3-1. PRINTED WIRING BOARD — RF BOARD —
12345678910111213
A
B
E
E
C
• See page 7 for Circuit Boards Location. :Uses unleaded solder.
RF BOARD
(SIDE A)
FLEXIBLE BOARD
OPTICAL PICK-UP
BLOCK
(DBU-1)
RF BOARD
(SIDE B)
D
A
DMB08 BOARD
CN401
(Page 13)
E
F
• Semiconductor
Location
Ref. No.
D001B-3
D002B-3
Location
1-684-822-
11
(11)
6449
1
IC001
16
1732
48
33
11
1-684-822-
(11)
IC001D-11
Q001C-11
Q002B-11
HCD-FR1/FR8/FR9
99
HCD-FR1/FR8/FR9
3-2. SCHEMATIC DIAGRAM — RF BOARD —
RFMON
(DBU-1)
FLEXIBLE
BOARD
LD GND
DVD LD
INLIM_3V
R026C027C028
C031
12k0.10.1
1000p
0.01
IC001
CXD1881AR
C030
C029
0.01
C032
0.047
JL006
JL003
JL002
JL001
R033
0
330p
0.033
0.033
C036
R034
0.47
C037
C039
C038
N
R
O
IR
D
M
L
10M
C026
C025
0.1
R023
820
C024
JL005
R024
CN001
24P
D
C
RF
GND
VC
VCC
E
A
B
F
N.C
PD
VR
VCC
SW
INLIM
CD LD
FCS+
FCS-
TRK+
TRK-
100
R001
FD+
FD-
TD+
TD-
D
C
RFP
C009
0.1
RFP
A
E
A
B
B
C
F
D
PDFD-
DVD_LD
CD_LD
R041
1k
E
F
D
P
R019R020
00
JL007
R035
0
R025
100
C019
R022
5600p
220
C017
2200p
C016
0.01
0
22p
22p
22p
22p
5600p
C020
C021
C022
C023
C018
2200p
C015
2200p
C014
2200p
C042
180p
R014
0
R013
0
R012
0
R011
0
R018
0
R017
0
R016
0
R015
0
C008
R021
0.1
JL004
CD/DVD/SACD RF AMP,
FOCUS/TRACKING ERROR AMP
C041
0.1
0.1
0
C040
0.1
C006
C013
22
0.1
10V
C035
0.1
MIRR
PI/CE
TE
FE
SDEN
SDEN
0
R027
0
R028
0
R029
C033 C012
0.1 0.1
R032
100
C034
0.1
C005
22
10V
C049
0.1
DATA_RF
CLK_RF
DATA_RF
CLK_RF
LDON
RFMON
FE
TE
PI/CE
CN002
29P
AGND
RFAC
AGND
AVC
AVC
MIRR
PI
TE
FE
A5V
A5V
SDEN
DATA_RF
CLK_RF
LDON
A3V
RFMON
INLIM
LDSEL
FD+
TD-
TD+
SLB-
SLB+
SLA-
SLA+
FD-
FD+
TD-
TD+
SLEDB-
SLEDB+
SLEDA-
SLEDA+
SPDL-
SPDL+
DMB08 BOARD
(1/10)
CN401
(Page 15)
HCD-FR1/FR8/FR9
CD_LD
C001
R005R009
IOP2
Q001Q002
2SB1132-T100-QR2SB1132-T100-QR
AUTOMATIC POWER
CONTROL
1SS355TE
-17
(FOR DVD)
CN003
9P
SLEDA+
SLEDB+
SLEDB-
SLEDA-
{LIMIT-SW(A)}
LED
{LIMIT-SW(B)}
GND
{LIMIT-SW(B)}
INLIM
SPDL-
SPDL+
SLA+
SLB+
SLB-
SLA-
DVD_LD
R004R003
L001
47µH
C002D001
10
16V
47k47k
3333
C010
1000p
R006
100
470
6.3V
IOP1
AUTOMATIC POWER
CONTROL
(FOR CD)
1SS355TE
-17
L002
47µH
C004D002
10
16V
C003
R010R008R007
100
4703333
6.3V
C011
1000p
No mark : DVD STOP
1010
HCD-FR1/FR8/FR9
3-3. PRINTED WIRING BOARD — RELAY SECTION —
12345678
A
SW (4) BOARD
4
B
C
3
4
1
S716 (STOCKER IN/OUT)
OFF: The moment disc in/out
from stocker
S717 (DISC POSITION)
In the midst disc is moving between
play position and stocker,
ON: disc is play position side,
OFF: disc is stocker side
S718 (STOCKING)
OFF: In the midst disc is moving between
play position and stocker
SW (3) BOARD
2
1
S715
OFF: When disc out
from play position
1-685-011-
11
(11)
(DISC OUT)
1-685-010-
11
(11)
SW (2) BOARD
D
2
3
1
(ON: Play position (8cm disc only))
(DISC IN (8cm))
S714
1-685-009-
S713
(DISC IN (8/12cm))
(ON: Play position)
• See page 7 for Circuit Boards Location. :Uses unleaded solder.
6556
1
2
31
4
3
2
3
1
4
1
2
1
1
G
DMB08 BOARD
CN006
11
(Page 13)
(11)
1
IC721
RELAY BOARD
4
3
G
2
1
9
IC701
9
ROTARY ENCODER
(STOCKER POSITION)
STOCKER MOTOR BOARD
M
(STOCKER)
MODE MOTOR BOARD
7
1
ROTARY ENCODER
(MODE)
12G34
ROLLER MOTOR BOARD
M
M
(MODE)
2
1-685-006-
1-685-005-
1
2
11
(11)
11
(11)
1
E
F
HCD-FR1/FR8/FR9
SW (1) BOARD
1
• Semiconductor
Location
Ref. No.
D701D-5
D711E-6
D721E-5
IC701D-5
IC711E-5
IC721D-5
IC751F-4
Q731E-4
3
1
Location
(DISC INSERT (8/12cm))
(ON: When disc insert)
1-685-008-
11
(11)
SENSOR BOARD
C
3
1
DETECT SENSOR
KAE
DISC INSERT
IC751
1-685-004-
E
11
(11)
19
IC711
1-685-012-
21
11
(11)
(ROLLER)
1-685-007-
11
(11)
1111
HCD-FR1/FR8/FR9
3-4. SCHEMATIC DIAGRAM — RELAY SECTION —
M781
(ROLLER)
M761
(STOCKER)
IC751
RPR-220
DISC INSERT
DETECT SENSOR
751
CNP751
3P
DIODEDIODE
D SENSED SENSE
GND
CNP781
2P
MTR RL 1
MTR RL 2
CNP761
2P
MTR ST 2
MTR ST 1
CN702
CN703
CN704
3P
GND
2P
MTR RL 2
MTR RL 1
2P
MTR ST 2
MTR ST 1
C781
0.01
D721
MTZJ-T-77-3.6A
R731
150
R733
R734
15k
R732
1k
OUT2
VREF
R702
100
D701
MTZJ-T-77-4.7B
VREF
OUT2
VCC
RNF
VM
OUT1
R721
680
STOCKER MOTOR
RIN
FIN
GND
RNF
DRIVE
IC721
BA6956AN
OUT1
VM
R701
680
(DISC INSERT(8/12cm))
(ON:WHEN DISC INSERT)
VCC
FIN
MTZJ-T-77-5.1A0.01 100
MODE MOTOR
GND
RIN
DRIVE
IC701
BA6956AN
VM
RNF
OUT1
R711
680
VCC
CNP711CNP705
GND
SW1-A
SW1-B
VREF
OUT2
R712
100
D711C761 R722
S711
ROLLER MOTOR
FIN
RIN
GND
3P3P
DRIVE
IC711
BA6956AN
GND
SW1-A
SW1-B
10k
Q731
RT1N141
LEVEL
SHIFT
C754
C711
10
50V
SW1A
SW1B
0.1
C758
0.1
C756
0.1
C751
0.1
C752
0.1
C753
0.1
C764
0.1
C763
0.1
SW3
SW1A
C755
SW1B
0.1
SW2A
SW2B
SW4
SW5A
SW5B
C765
0.1
C762
0.1
P81 D.SENSOR
P92 SW3
P40 SW1-A
P41 SW1-B
P42 SW2-A
P43 SW2-B
P93 SW4
P94 SW5-A
P44 LOD POS
P45 LOD NEG
P46 SLD POS
P47 SLD NEG
P90 ELV POS
P91 ELV NEG
P95 SW5-B
P96 SLD E0
P02 SLD E1
P03 SLD E2
P04 SLD E3
P82 ELV E0
P83 ELV E1
P54 ELV E2
P55 ELV E3
CN701
28P
D+5V
M+12V
M+12V
MGND
MGND
ROTARY ENCODER
(STOCKER POSITION)
S702
G
DMB08 BOARD
(10/10)
CN006
(Page 24)
S713
(DISC IN(8/12cm))
(ON:PLAY POSITION)
S714
(DISC IN(8cm))
(ON:PLAY POSITION(8cm DISC ONLY))
S715
(ON:WHEN DISC OUT FROM PLAY POSITION)
BETWEEN PLAY POSITION AND STOCKER,
ON:DISC IS PLAY POSITION SIDE,
OFF:IN THE MIDST DISC IS MOVING
BETWEEN PLAY POSITION AND STOCKER
(DISC OUT)
S716
(STOCKER IN/OUT)
ON:THE MOMENT DISC IN/OUT
FROM STOCKER
S717
(DISC POSITION)
IN THE MIDST DISC IS MOVING
OFF:DISC IS STOCKER SIDE
S718
(STOCKING)
CNP721CNP706
3P3P
GND
SW2-A
SW2-B
CNP731CNP707
2P2P
GND
SW3
CNP741CNP708
4P4P
GND
SW4
SW5-A
SW5-B
GND
SW2-A
SW2-B
GND
SW3
GND
SW4
SW5-A
SW5-B
SW2A
SW2B
SW5A
SW5B
S771
ROTARY ENCODER
M771
(MODE)
(MODE)
CN710
MTR MD 1
MTR MD 2
7P
E1
E2
GND
E3
E4
C769
0.1
SW3
SW4
C768
0.1
0.1
C767
0.1
C766
C771
0.01
CNP771
7P
E1
E2
GND
E3
E4
MTR MD 1
MTR MD 2
HCD-FR1/FR8/FR9
1212
HCD-FR1/FR8/FR9
3-5. PRINTED WIRING BOARD — DMB08 BOARD (SIDE A) —
12
3456789
A
C002
B
IC901
D
DDCON
BOARD
CN800
(Page 34)
C
FOR
CHECK
IC301
• See page 7 for Circuit Boards Location. :Uses unleaded solder.