Siemens A52, A55, C55 Service Manual

A52, A55 & C55 IFX

Level 2.5e

Repair Documentation

V 1.10

Version Date Department Notes to change

V 1.00 09.052003 ICM MP CCQ GRM New document

V 1.10 11.08.2003 ICM MP CCQ GRM Document modified (A52)

V 1.10 Page 1of 45 ICM MP CCQ GRM A52/A55/C55 IFX

Company Confidential © Copyright Siemens AG

08/03

Table of Contents:

1 LIST OF AVAILABLE LEVEL 2,5E PARTS C55 IFX .........................................4

2 REQUIRED EQUIPMENT FOR LEVEL 2,5E ...................................................... 5

3 REQUIRED SOFTWARE FOR LEVEL 2,5E C55 IFX.........................................5

4 RADIO PART DESCRIPTION............................................................................. 6

4.1 Introduction..................................................................................................... 6

4.2 Power Supply RF-Part .................................................................................... 7

4.3 Frequency generation .................................................................................... 7

4.3.1 Synthesizer: The discrete VCXO (26MHz)...........................................................................7

4.3.2 Synthesizer: LO1..................................................................................................................8

4.4 Antenna Switch / External Antenna Connector (electrical/mechanical only C55) 10

4.5 Frontendmodul (Electrical Antenna Switch) .............................................. 10

4.6 Receiver......................................................................................................... 11

4.6.1 Receiver: EGSM900/GSM1800 – Filter to Demodulator ...................................................11

4.6.2 IC Overview ........................................................................................................................13

4.7 Transmitter.................................................................................................... 15

4.7.1 Transmitter: Modulator and Limited Amplifier ....................................................................15

4.7.2 Transmitter: and Power Amplifier.......................................................................................16

5 LOGIC / CONTROL........................................................................................... 17

5.1 Overview of Hardware Structure ................................................................. 17

5.1.1 Logic Block Diagram ..........................................................................................................17

5.1.2 Block Diagram C55 IFX Control Part .................................................................................17

5.1.3 EGOLD+.............................................................................................................................18

5.1.4 SRAM .................................................................................................................................22

5.1.5 FLASH ................................................................................................................................22

5.1.6 SIM .....................................................................................................................................22

5.1.7 Vibration Motor ...................................................................................................................23

6 POWER SUPPLY..............................................................................................23

6.1 Power Supply ASIC ......................................................................................23

6.1.1 Power Supply Operating modes: .......................................................................................25

6.1.2 Power Supply Functions:....................................................................................................26

6.2 Battery ........................................................................................................... 33

6.3 Charging Concept......................................................................................... 34

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7 INTERFACES.................................................................................................... 37

7.1 Vibra............................................................................................................... 37

7.2 Earpiece......................................................................................................... 37

7.3 Microphone ................................................................................................... 38

7.4 Battery ........................................................................................................... 38

7.5 IO Connector with ESD protection.............................................................. 39

7.5.1 IO Connector – New Slim Lumberg ...................................................................................39

7.5.2 ESD Protection with EMI filter ............................................................................................40

7.6 SIM ................................................................................................................. 41

7.7 Display........................................................................................................... 41

8 ACOUSTIC........................................................................................................ 42

8.1 Microphone ................................................................................................... 42

8.1.1 Mechanical .........................................................................................................................42

8.1.2 Electrical .............................................................................................................................42

8.2 Earpiece/Loudspeaker ................................................................................. 43

8.2.1 Mechanical .........................................................................................................................43

8.2.2 Electrical .............................................................................................................................43

9 DISPLAY AND ILLUMINATION........................................................................ 44

9.1 Display........................................................................................................... 44

9.2 Illumination ...................................................................................................44

10 KEYBOARD ................................................................................................... 45

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1 List of available level 2,5e parts C55 IFX

ID-No Type Board Name, Location Part-No.

D150 VCO HIT Transmitter_VCO L36820-L6097-D670 D1600 VCO IFX Transmitter_VCO L36820-L6109-D670 D171 IC HIT/IFX Egold+ L36810-G6149-D670 D1740 Filter IFX Ant_Switch_Diplexer L36197-F5006-F936 D1785 IC IFX Transceiver IC L36197-F5011-F334 D361 IC HIT/IFX ASIC L36145-J4682-Y43 D800 IC HIT Transceiver IC L36820-L6105-D670 D920 IC HIT PA_Comperator L36820-L6133-D670 R1507 Resistor IFX Temp_Resistor L36120-F4223-H R959 Resistor HIT Temp_Resistor L36120-F4223-H V1500 Diode IFX Capa_Diode L36840-D61-D670 V151 Diode HIT/IFX Diode_KB7 L36840-D5062-D670 V181 Diode HIT/IFX Diode_Battery_Interface L36702-A1051 V211 Transistor HIT/IFX Tran._Vibra L36830-C1097-D670 V220 Diode HIT/IFX Diode_Vibra L36851-Z9105-Z981 V222 Transistor HIT/IFX Trans_Light_ L36830-C1112-D670 V223 Transistor HIT Trans_Light_ L36840-C4004-D670 V361 Transistor HIT/IFX Tran._Charge L36830-C1110-D670 V850 Transistor HIT Tran._VCO_Switch L36820-C6047-D670 V920 Diode HIT Feedback_Diode L36840-D5049-D670 V921 Transistor HIT Tran._PA_Switch L36820-C6047-D670 V950 Transistor HIT Tran._26MHz_Ampl. L36840-C4049-D670 V951 Diode HIT Capa_Diode L36840-D61-D670 Z1500 Quartz IFX Oszillator_26MHz L36145-F260-Y17 Z1600 Filter IFX Transmitter_Filter L36145-K280-Y242 Z1700 IC IFX Power_Amplifier L36197-F5005-F487 Z171 Quartz HIT/IFX Quarz/Egold L36145-F102-Y8 Z211 Filter HIT/IFX Logic/IO_Interface L36197-F5000-F116 Z850 VCO HIT 1LO_VCO L36145-G100-Y96 Z851 Filter HIT Filter_BALUN L36145-K260-Y41 Z880 IC HIT Ant_Switch_Diplexer L36145-K280-Y257 Z900 IC HIT Power_Amplifier L36851-Z2002-A59 Z950 Quartz HIT Oszillator_26MHz L36145-F260-Y17

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2 Required Equipment for Level 2,5e

- GSM-Tester (CMU200 or 4400S incl. Options)

- PC-incl. Monitor, Keyboard and Mouse

- Bootadapter 2000/2002 (L36880-N9241-A200)

- Adapter cable for Bootadapter due to new Lumberg connector

- Troubleshooting Frame C55 (F30032-P209-A1)

- Power Supply

- Spectrum Analyser

- Active RF-Probe incl. Power Supply

- Oscilloscope incl. Probe

- RF-Connector (N<>SMA(f))

- Power Supply Cables

- Dongle (F30032-P28-A1) if USB-Dongle is used a special driver for NT is required

- BGA Soldering equipment

Reference: Equipment recommendation V1.2 (downloadable from the technical support page)

3 Required Software for Level 2,5e C55 IFX

- Windows NT Version4

- Winsui version1.43 or higher

- Software for GSM-Tester ( Cats(Acterna/Wiltek) or CMU-GO(Rohde&Schwarz) )

- Software for reference oscillator adjustment

- Internet unblocking solution

- Dongle driver for USB-Dongle if used with WIN NT4

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4 Radio Part Description

4.1 Introduction

The radio part is necessary to convert the GMSK-RF-signals from the antenna to the baseband and vice versa. In the receiving direction, the signals are split in the I- and Q-component and fed to the A/D-converter of the logic part. In the transmission direction, the GMSK-signal is generated with the Direct Modulator by modulation of the I- and Q-signals, which are generated in the baseband section. After the modulation the RF-signals are amplified by a buffer-limiter and, for the GSM900 path, filtered with a SAW-Filter. Finally, the power amplifier (PA) is attached to reach the output power.

Transmitter and Receiver are never active at the same time. Simultaneous reception in the EGSM 900 and GSM 1800 band is impossible as well as simultaneous transmission in both bands. However the monitoring band (monitoring timeslot) in the TDMA-frame can be chosen independently of the receiving or transmitting band (RX- and TX timeslot of the band).

The RF-part is designed for dualband operation (EGSM 900, GSM 1800) and consists of the following main components:

1. 26MHz reference crystal Z1500

2. TX-Filter in GSM section Z1600

3. Transmitter power amplifier RF9340 with integrated regulator Z1700

4. Front-End-Module including RX-/TX-switch and EGSM 900/GSM1800 receiver SAW-

filters D1740

5. Infineon Limiter/Buffer PMB2256 to amplify the RF signals from the modulator to

drive the PA D1600

6. Infineon Smarti DC2 PMB6256 with the following functionality D1785:

• Integrated active part of the 26MHz crystal oscillator

• PLL for local oscillator LO1

• LO1-VCO

• Direct conversion receiver with channel filtering

• Direct Modulator

• Active part of the reference oscillator including buffer

• Control circuit for band switch

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VCC_

4.2 Power Supply RF-Part

The voltage regulator for the RF-part is located inside the ASIC D361.(see chapter 5.2).It generates the required 2,85V “RF-Voltages” named VCC2_8 and VCC_SYN. (VCC_SYN is also named VCC2 and behind R1451 VCC_OSC) The following components are supplied by:

VCC2_8

• Limiter amplifier

The voltage regulator RFREG 1 is controlled by the signal SLEEPQ (RF_EN RFREG2 is controlled by he signal VCXOEN_UC connected to SLEEP1_N

H1)

. Both signals are provided by the EGOLD+ (SLEEPQ (GSM TDMA-Timer H16) /

VCXOEN_UC (Miscellaneous R6)).

Circuit diagram

VCC_SYN

• Modulators

• RX mixers

• VCO

• PLL

• 26 MHz reference oscillator

(RF REG G2)),

(on/off Control

CC2_8

SYN

4.3 Frequency generation

4.3.1 Synthesizer: The discrete VCXO (26MHz)

The reference oscillator is a 26 MHz voltage controlled crystal oscillator. It has two main tasks:

• It is used as reference for the synthesizer phase/frequency detector (Smarti internal circuit)

• It gives the clock for the processor (E-Gold)

The main block is realized as an internal transistor cell with a Colpitts structure. The 26 MHz quartz crystal is connected to a tuning circuit that allows a fine-tuning of the frequency. A current mirror, acting as buffer and amplifier followed by a LC resonant circuit makes the signal to fit the E-Gold clock signal requirements. ON/OFF signal (VCC_OSC) comes from the ASIC via the resistor R1451. For temperature measurements of the VCXO a temperature resistance (R700) is used. The resistor is placed near the VCXO. The measurement result TVCXO is reported to the EGOLD+

(Analog Interface P3) via R138 as the signal TENV. The frequency of the reference oscillator

can be adjusted by the EGOLD+ via a PNM- modulated AFC-signal. The signal leaves the SMARTI as BB_SIN26M at pin 4 to be further used from the EGOLD+ (D171

The required voltage VCC_SYN is provided by the ASCI D361

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(functional T3)).

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Circuit diagram

to EGOLD+

from EGOLD

4.3.2 Synthesizer: LO1

The local oscillator (LO1) consists of a PLL inside the Smarti DC (D720), an external loop filter. The VCO is build in.

The first local oscillator is needed to generate frequencies which enables the transceiver IC to demodulate the receiver signal and to perform the channel selection in the TX part. The LO1/PLL part is switched on with PLLON (

). The PLL settings are programmed by the 3 wire bus RFCLK (pin 1), RFDATA (pin2)

F16)

and RFSTR ( times for GSM1800.

This LO1 frequency range

The required voltage VCC_SYN is provided by the ASIC D361

pin 5) from the EGOLD+ (D171 (GSM TDMA Timer

pin3). The LO frequency is 4 times the RX/TX frequency for EGSM 900 and 2

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A52/A55/C55 IFX

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Block diagram

Circuit diagram

External loopfilter

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4.4 Antenna Switch / External Antenna Connector

(electrical/mechanical only C55)

The mechanical antenna switch for the differentiation between the internal and external antenna.

External

to / from

lexer

4.5 Frontendmodul (Electrical Antenna Switch)

EGSM900/GSM1800 <> Receiver/Transmitter

The frontend has two functions.

- to select the different GSM bands

- to switch between RX and TX mode

Inside the frontendmodul SAW filters are integrated in the RX paths. For dual band mode the FEM needs two supply voltages (VC1, VC2) that are directly provided by the Smarti DC (FEM1 and FEM2). The following logical table shows the different modes of the FEM.

Mode Selection Vc. 1 Vc.2 Vc.3

EGSM900 RX LOW LOW LOW EGSM900 TX HIGH LOW LOW GSM1800 RX LOW LOW LOW GSM1800 TX LOW HIGH LOW

GSM1900 RX LOW LOW HIGH GSM1900 TX LOW HIGH LOW

Two balanced SAW filters are integrated to have good stop-band attenuation in the GSM and the PCN RX paths.

Internal

Top View Block diagram

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Control Signals from Smarti

from

to Antenna

4.6 Receiver

4.6.1 Receiver: EGSM900/GSM1800 – Filter to Demodulator

From the antenna switch, up to the demodulator the received signal passes the following blocks to get the demodulated baseband signals for the EGOLD+:

Filter LNA

Inside Z650 Smarti Smarti Smarti

Filter: The EGSM900, GSM1800 filters are located inside the frontend module. The Filter are centred to a frequency of 942,5MHz for EGSM900, 1847,5MHz for GSM1800.

The LNA´s (EGSM900/GSM1800) are located inside the Smarti. The LNA can be

LNA: switched in HIGH (On) and LOW (Off) mode and is controlled by the Smarti depending on EGOLD+ information.

Demodulator: The amplified RF signal is converted by a quadrature demodulator to the final outputsignals at baseband frequency. The LO signals are generated by a divider by 4 for the GSM900 band and by a divider by 2 for GSM1800 band. The resulting in-phase and quadratursignals are fed into two baseband low pass filters and the PGC amplifier chain. The baseband filter provide a suppression of inband-blocking and adjacent channel interferers.

PGC:

After baseband filtering the signal is fed into a PGC amplifier chain. The baseband amplifier offers 78 dB programmable gain with 2 dB steps. Due to the high baseband gain (58 dB), DC offsets can corrupt the signal at the baseband outputs. Differential offset voltages are reduced by an internal offset compensation circuit. The control is realised through the EGOLD+ signals (RFDATA; RFCLK; RFSTR.

The Smarti DC consists of a direct conversion receiver for GSM 900/1800.

Demodulator

(RF Control J15, J16, J17).

PGC

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The required voltage VCCSYN is provided by the ASIC D361

Circuit diagram

progr. signals

Top view

to EGOLD+

from antenna

PMB6256

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4.6.2 IC Overview

IC Overview

Smarti

RX Path

TX Path

RX/TX Path

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Block diagram

The functional block diagram shows the IFX RF solution of the A55/C55

RF-Part of L55 Tuna / Infi neon

internal antenna

Pin-diode switch incl.

TX harmonic

filtering

PCN

GSM

antenna

matching

external antenna

mechanical

antenna

Antenna

low pass

filter

switch

Band

(Low=GSM High=DCS)

PGC (2dB steps)

Divider

+/- 45°

IQ modulator

+/- 45°

IQ modulator

BB filter

FEM1

FEM2

OSW1

VCC_SYN

is supply for al l

Chip VCC's

Output s

Buffer

26MHz

Logic

Divider

DC autocalibr ation

SAW

925-960 MHz

942.5 MHz

FEM incl.

SAW

1842.5 MHz

1805 - 1880 MHz

LOOP-Fil ter

TX_GSM

(FEM1)

TX_DCS

(FEM2)

OSW1

(Low=GSM High=DCS)

PA_Ramp

TXONPA

(200mV for

(enable)

lowest output

level)

VCC

2_8

BATT+

VCC_SYN

V RF2

(for Smarti

supply)

Salzburg

2.85V

D0950

V REF1

VCC2_8

Tune voltage within 0.5..2.3V

AFC voltage

Tenv

(from E-Gold)

(Temp sensor)

TXON1

Buffer-Limiter

(enable)

Band

(Low=GSM High=DCS)

DCS

GSM

SAW

VCC

2_8

BATT+

enable

VCXOEN

SLEEPQ

GSM LNA

(-20dB at low

gain)

DCS LNA

(-20dB at low

gain)

LFS

for fast lock

VREG

PMB2256

(Lumpi)

H3-Fil ter

(for mod

spectrum)

IQ demodulator

Int. Voltage

Regulator

+/- 45°

RF PLL

PFD+CP

internal RF VCO

3420 - 3540 MHz

3540.4 - 3700 MHz

3700.4 - 3820 MHz

3820.8-3839.2 MHz

VCXO

integrated act ive

part

26 MHz

BB filter

BB filterBB filter

State

machi ne

Serial

Interface

RC-Lowpass

Transceiver IC

RC-Lowpass

(2dB steps)

PGC

PGC (2dB steps)PGC (2dB steps)

Smarti DC2

PMB6256

BB-Out BB-Out

PLL_ON

AFC

PA_RAMP

TXON1 TXONPA

RFSTR RFCLK RFDATA

SIN 26MHz

TVCXO (Tenv)

BB: RF_I

BB: RF_IX

BB: RF_Q

BB: RF_QX

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