Samsung M378A5244CB0-CTD, M471A2K43CB1-CTD, M471A5244CB0-CTD User manual
Module
Handling
Guide
How to handle the module
1
Overview
Recently module failure related with Active/Passive/Component crack has increased.
Main root causes are wrong handling method and mechanical damage.
Current products have more cap. & resistors and the sizes of those passives are reduced and most of them are located around edge
area.
These characteristics require more cautious module handling method.
This guide book tries to nd out tendency and range of module crack pattern based on experiments from several aspects. The main
purpose is to reinforce Samsung’s process control and help customer effectively control module handling process.
Test methods are PCB Bow, Twist, Drop Test, UTM(Universal Testing Machine) Test for DRAM, Resister & Capacitor. We observed
crack phenomena and tendency through the datum and pictures. Tested products are limited to Registered DIMM [RDIMM],
Unbuffered DIMM [UDIMM] and BOC PKG based Module, therefore test results might be different when applied to other products.
Memory Module Introduction
Unbuffered DIMM
Load Reduced DIMM
Registered DIMM
SODIMM
2
Proper Handling
• Anti-ESD* straps should be used.
• The strap should be linked to your body.
*ESD : Electro Static Discharge
• Modules should be picked up from packing
trays only one-by-one.
• Product should be handled at the
conductive mat.
• Do not grab packages. Hold only the edge
of the PCB with both hands.
• Wear gloves when handling.
• Tray must be covered when handling
module tray.
3
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