Rockwell Automation 1771-N User Manual
AllenĆBradley
High Resolution
Isolated Analog
Modules
(Cat. No. 1771ĆN Series)
User Manual
N
T
Important User Information
Because of the variety of uses for the products described in this
publication, those responsible for the application and use of these
products must satisfy themselves that all necessary steps have been
taken to assure that each application and use meets all performance and
safety requirements, including any applicable laws, regulations, codes
and standards. In no event will Rockwell Automation be responsible or
liable for indirect or consequential damage resulting from the use or
application of these products.
Any illustrations, charts, sample programs, and layout examples shown
in this publication are intended solely for purposes of example. Since
there are many variables and requirements associated with any particular
installation, Rockwell Automation does not assume responsibility or
liability (to include intellectual property liability) for actual use based
upon the examples shown in this publication.
Allen–Bradley publication SGI–1.1, Safety Guidelines for Application,
Installation, and Maintenance of Solid–State Control (available from
your local Rockwell Automation office), describes some important
differences between solid–state equipment and electromechanical
devices that should be taken into consideration when applying products
such as those described in this publication.
Reproduction of the contents of this copyrighted publication, in whole or
part, without written permission of Rockwell Automation, is prohibited.
Throughout this publication, notes may be used to make you aware of
safety considerations. The following annotations and their accompanying
statements help you to identify a potential hazard. avoid a potential
hazard, and recognize the consequences of a potential hazard.
WARNING
Identifies information about practices or
circumstances that can cause an explosion in a
hazardous environment, which may lead to personal
injury or death, property damage, or economic loss.
!
ATTENTIO
Identifies information about practices or
circumstances that may lead to personal injury or
death, property damage, or economic loss.
!
Identifies information that is critical for
IMPORTAN
successful application and understanding of the
product.
ATTENTION
!
Environment and Enclosure
This equipment is intended for use in a Pollution
Degree 2 industrial environment, in overvoltage
Category II applications (as defined in IEC publication
60664–1), at altitudes up to 2000 meters without
derating.
This equipment is considered Group 1, Class A
industrial equipment according to IEC/CISPR
Publication 11. Without appropriate precautions, there
may be potential difficulties ensuring electromagnetic
compatibility in other environments due to conducted
as well as radiated disturbance.
This equipment is supplied as “open type” equipment.
It must be mounted within an enclosure that is suitably
designed for those specific environmental conditions
that will be present, and appropriately designed to
prevent personal injury resulting from accessibility to
live parts. The interior of the enclosure must be
accessible only by the use of a tool. Subsequent
sections of this publication may contain additional
information regarding specific enclosure type ratings
that are required to comply with certain product safety
certifications.
ATTENTION
!
See NEMA Standards publication 250 and IEC
publication 60529, as applicable, for explanations of
the degrees of protection provided by different types of
enclosures. Also, see the appropriate sections in this
publication, as well as the Allen–Bradley publication
1770–4.1, (“Industrial Automation Wiring and
Grounding Guidelines”), for additional installation
requirements pertaining to this equipment.
Preventing Electrostatic Discharge
This equipment is sensitive to electrostatic discharge,
which can cause internal damage and affect normal
operation. Follow these guidelines when you handle
this equipment:
• Touch a grounded object to discharge potential
static.
• Wear an approved grounding wriststrap.
• Do not touch connectors or pins on component
boards.
• Do not touch circuit components inside the
equipment.
• If available, use a static–safe workstation.
• When not in use, keep modules in appropriate
static–safe packaging.
Using this Manual
Preface
Purpose of Manual
Audience
Vocabulary
Manual Organization
This manual shows you how to use your high resolution isolated
analog series input/output modules with an Allen-Bradley
programmable controller. It helps you install, program, calibrate, and
troubleshoot your modules.
You must be able to program and operate an Allen-Bradley
programmable controller (PLC) to make efficient use of your analog
module. In particular, you must know how to program block transfer
instructions.
We assume that you know how to do this in this manual. If you do
not, refer to the appropriate PLC programming and operations
manual before you attempt to program this module.
In this manual, we refer to:
• the individual module as the “module.”
• the programmable controller, as the “controller” or the
“processor.”
This manual is divided into seven chapters. The following chart
shows each chapter with its corresponding title and a brief overview
of the topics covered in that chapter.
Chapter Title Topics Covered
1
2 Installing the Module
3 Communicating with your Analog Module
4 Configuring the Module
5 Module Status and Input Data
6 Module Calibration How to calibrate your modules
7 Troubleshooting Diagnostics reported by the module
Appendix A Specifications Your module's specifications
Appendix B
Appendix C
Overview of the High Resolution Isolated
Analog Series Modules
Block Transfer Read and Write
Configurations for 0 out/8 in
Block Transfer Read and Write
Configurations for 8 out/0 in
Descriptions of the modules, including general and
hardware features
Module power requirements, keying, chassis location
Wiring of module and remote termination panel
How to program your programmable controller for this module
Sample programs
Hardware and software configuration
Module write block format
Reading data from your module
Module read block format
Description of BTR/BTW words.
Description of BTR/BTW words.
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Using this ManualP–2
Image
Image
Block
Block
Chassis
Topics CoveredTitleChapter
Appendix D
Appendix E
Appendix F
Appendix G
Appendix H
Appendix I
Appendix J
Appendix K
Appendix L UL/CSA Hazardous Location
Related Products
Block Transfer Read and Write
Configurations for 2 out/2 in
Block Transfer Read and Write
Configurations for 2 out/6 in
Block Transfer Read and Write
Configurations for 1 out/7 in
Block Transfer Read and Write
Configurations for 3 out/5 in
Block Transfer Read and Write
Configurations for 4 out/4 in
Block Transfer Read and Write
Configurations for 6 out/2 in
Block Transfer Read and Write
Configurations for 5 out/3 in
Block Transfer Read and Write
Configurations for 7 out/1 in
You can install your module in any system that uses Allen-Bradley
processors that support block transfer and the 1771 I/O structure.
Description of BTR/BTW words.
Description of BTR/BTW words.
Description of BTR/BTW words.
Description of BTR/BTW words.
Description of BTR/BTW words.
Description of BTR/BTW words.
Description of BTR/BTW words.
Description of BTR/BTW words.
Product Compatibility
Contact your nearest Allen-Bradley office for more information
about your programmable controllers.
These modules can only be used with 1771-A1B, A2B, A3B, A3B1,
A4B or later 1771 I/O chassis and 1771-AM1, -AM2 chassis.
Communication between the analog module and the processor is
bidirectional. The processor block-transfers output data through the
output image table to the module and block-transfers input data from
the module through the input image table. The module also requires
an area in the data table to store the read block and write block data.
I/O image table use is an important factor in module placement and
addressing selection. Refer to the table below.
Compatibility and Use of Data Table
Use of Data Table Compatibility
Catalog
Number
1771ĆN Series 8 8 28 59 Yes Yes Yes B
A = Compatible with 1771ĆA1, A2, A4 chassis.
B = Compatible with 1771ĆA1B, A2B, A3B, A3B1,A4B, 1771ĆAM1, ĆAM2 chassis.
Yes = Compatible without restriction
No = Restricted to complementary module placement
Input
Bits
Output
Bits
Read
Words
Write
Words
Addressing
1/2Ćslot 1Ćslot 2Ćslot
Publication 1771ĆUM127B-EN-P - December 2002
Using this Manual P–3
You can place your analog module in any I/O module slot of the
I/O chassis.
Do not put the analog module in the same module group as a digital
high density module unless you are using 1 or 1/2-slot addressing.
Avoid placing the analog module close to ac modules or high voltage
dc modules.
Related Publications
For a list of publications with information on Allen-Bradley
programmable controller products, consult our publication index
SD499.
Publication 1771ĆUM127B-EN-P - December 2002
Using this ManualP–4
Publication 1771ĆUM127B-EN-P - December 2002
Table of Contents
Overview of the High Resolution
Isolated Analog Modules
Installing the Module
Chapter 1
Chapter Objectives 1-1...................................
Module Description 1-1...................................
Features of the High Resolution Isolated Analog Series Modules 1-2...
Catalog/Channel Numbers 1-3..............................
How the High Resolution Isolated Analog Modules Communicate with
Processors 1-4......................................
Accuracy 1-4..........................................
Chapter Summary 1-4....................................
Chapter 2
Chapter Objectives 2-1...................................
Before You Install Your Analog Module 2-1.....................
Electrostatic Damage 2-1..................................
Calculate Power Requirements for the I/O Chassis 2-1.............
2-1..................................................
Determine Module Location in the I/O Chassis 2-2................
Install the Analog Module 2-2...............................
Install the Module in the Chassis and Connect the Cable 2-3.........
Connecting Wiring 2-5....................................
Connecting 4ĆWire Sensors 2-9.............................
Sourcing Input Analog Modules 2-10...........................
Making Your Own Cables 2-11...............................
Grounding the Field Devices 2-12.............................
Interpreting the Indicator Lights 2-13...........................
Chapter Summary 2-13....................................
Communicating With Your Analog
Module
Chapter 3
Chapter Objectives 3-1...................................
Block Transfer Programming 3-1............................
PLCĆ2 Programming 3-2..................................
PLCĆ3 Program Example 3-2...............................
PLCĆ5 and PLCĆ5/250 Program Example 3-3....................
Module Scan Time 3-4....................................
Programming Samples 3-4.................................
Sample Ladder Diagram Ć PLCĆ3 Family Processors 3-5...........
Sample Ladder Diagram Ć PLCĆ5 Family Processors 3-6...........
Setting Up the Data Table File 3-7............................
Chapter Summary 3-8....................................
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Table of Contentstoc-ii
Configuring the Module
Chapter 4
Chapter Objectives 4-1...................................
Configuring the High Resolution Isolated Analog Modules 4-1........
Default Configurations 4-2.................................
Module Level Programming Features 4-3......................
Module Configuration" Verification 4-3........................
Temperature Scale 4-3....................................
Data Format 4-3........................................
Two's Complement Binary 4-5..........................
Real Time Sampling 4-5...................................
Output Channel Programming Features 4-6.....................
Scaling 4-6............................................
Clamping 4-9..........................................
Ramping 4-10...........................................
Alarm Enable 4-10.......................................
Reset State 4-10.........................................
Reset Value 4-11........................................
Input Channel Programming Features 4-11......................
Scaling 4-11............................................
Alarms 4-11............................................
Alarm Deadband 4-12.....................................
Rate Alarm 4-13.........................................
Digital Filtering 4-13......................................
Thermocouple Type 4-14...................................
RTD Type 4-15..........................................
10 Ohm Offset 4-15.......................................
Configuration Block for a Block Transfer Write 4-15................
Block Transfer Write Configuration Data Header 4-15...............
Module Configuration Data Header 4-15....................
Bit/Word Description of Word 0 4-16.......................
Output Configuration Words 1 and 2 4-16...................
Bit/Word Description of Output Configuration Words 1 and 2 4-16..
Output Configuration Words 3 and 4 4-16...................
Bit/Word Description of Output Configuration Words 3 and 4 4-17..
Output Programming 4-17..............................
Output Configuration Words 5 through 10 4-17...............
Bit/Word Description of Output Configuration Words 5 through 10 4-18
Input Programming 4-19...............................
Bit/Word Description of Input Configuration Words 17 through 23 4-19
Chapter Summary 4-20....................................
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Table of Contents toc-iii
Module Status and Input Data
Module Calibration
Chapter 5
Chapter Objectives 5-1...................................
Reading Data from the Module 5-1...........................
Block Transfer Read Data Format 5-2.........................
Outputs Only" Block Transfer Read Data Header 5-2..............
Inputs Only" and Output/Input" Block Transfer Read Data Header 5-3.
Input Status Data 5-4.....................................
Bit/Word Description for Input Status Data Words 5-5..........
Output Status Data 5-6...................................
Bit/Word Description for Output Status Data Words 5-7.........
Chapter Summary 5-7....................................
Chapter 6
Chapter Objective 6-1....................................
Tools and Equipment 6-1..................................
Calibrating Your Module 6-2................................
Indicator Operation During Calibration 6-3......................
Manual Calibration 6-3....................................
Input Channel Calibration 6-3...............................
Output Channel Calibration 6-7..............................
Chapter Summary 6-8....................................
Troubleshooting
Specifications
Block Transfer Write and Block
Transfer Read Configurations
for 0 Output/8 Input 1771ĆN
Series Modules
Chapter 7
Chapter Objective 7-1....................................
Diagnostics Reported by the Module 7-1.......................
Troubleshooting with the Indicators 7-2........................
Status Reported by the Module 7-2...........................
Chapter Summary 7-4....................................
Appendix A
Specifications A-1.......................................
General Specifications A-1.................................
Appendix B
What This Appendix Contains B-1............................
Block Transfer Write Configuration Block for 8 Input Modules B-1.....
Block Transfer Write Bit/Word Descriptions for 8 Input Modules B-3....
Block Transfer Read Word Assignments for 8 Input Modules B-5......
Block Transfer Read Bit/Word Descriptions for 8 Input Modules B-7....
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Table of Contentstoc-iv
Block Transfer Write and Block
Transfer Read Configurations
for 8 Output/0 Input 1771ĆN
Series Modules
Block Transfer Write and Block
Transfer Read Configurations
for 2 Output/2 Input 1771ĆN
Series Modules
Block Transfer Write and Block
Transfer Read Configurations
for 2 Output/6 Input 1771ĆN
Series Modules
Appendix C
What This Appendix Contains C-1............................
Block Transfer Write Configuration Block for 8 Output Modules C-1....
Block Transfer Write Bit/Word Descriptions for 8 Output Modules C-3...
Block Transfer Read Word Assignments for 8 Output Modules C-5....
Block Transfer Read Bit/Word Description for 8 Output Module C-6....
Appendix D
What This Appendix Contains D-1............................
Block Transfer Write Configuration Block for the
2 Output/2 Input Modules D-1............................
Block Transfer Write Bit/Word Descriptions for
2 Output/2 Input Modules D-2............................
Block Transfer Read Word Assignments for 2 Output/2 Input Module D-5
Block Transfer Read Bit/Word Description for 2 Output/2 Input Module D-6
Appendix E
What This Appendix Contains E-1............................
Block Transfer Write Configuration Block for 2 Output/6 Input Modules E-1
Block Transfer Write Bit/Word Descriptions for
2 Output/6 Input Modules E-3............................
Block Transfer Read Word Assignments for 2 Output/6 Input Modules E-6
Block Transfer Read Bit/Word Description for
2 Output/6 Input Modules E-7............................
Block Transfer Write and Block
Transfer Read Configurations
for 1 Output/7 Input 1771ĆN
Series Modules
Block Transfer Write and Block
Transfer Read Configurations
for 3 Output/5 Input 1771ĆN
Series Modules
Appendix F
What This Appendix Contains F-1............................
Block Transfer Write Configuration Block for 1 Output/7 Input Modules F-1
Block Transfer Write Bit/Word Descriptions for
1 Output/7 Input Modules F-3............................
Block Transfer Read Word Assignments for 1 Output/7 Input Module F-6
Block Transfer Read Bit/Word Description for 1 Output/7 Input Module F-7
Appendix G
What This Appendix Contains G-1............................
Block Transfer Write Configuration Block for 3 Output/5 Input Modules G-1
Block Transfer Write Bit/Word Descriptions for
3 Output/5 Input Modules G-3............................
Block Transfer Read Word Assignments for 3 Output/5 Input Modules G-6
Block Transfer Read Bit/Word Descriptions for
3 Output/5 Input Modules G-7............................
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Table of Contents toc-v
Block Transfer Write and Block
Transfer Read Configurations
for 4 Output/4 Input 1771ĆN
Series Modules
Block Transfer Write and Block
Transfer Read Configurations
for 6 Output/2 Input 1771ĆN
Series Modules
Block Transfer Write and Block
Transfer Read Configurations
for 5 Output/3 Input 1771ĆN
Series Modules
Appendix H
What This Appendix Contains H-1............................
Block Transfer Write Configuration Block for 4 Output/4 Input Modules H-1
Block Transfer Write Bit/Word Descriptions for
4 Output/4 Input Modules H-3............................
Block Transfer Read Word Assignments for 4 Output/4 Input Modules H-6
Block Transfer Read Bit/Word Descriptions for
4 Output/4 Input Modules H-7............................
Appendix I
What This Appendix Contains I-1............................
Block Transfer Write Configuration Block for 6 Output/2 Input Modules I-1
Block Transfer Write Bit/Word Descriptions for
6 Output/2 Input Modules I-3............................
Block Transfer Read Word Assignments for 6 Output/2 Input Modules I-6
Block Transfer Read Bit/Word Descriptions for
6 Output/2 Input Modules I-8............................
Appendix J
What This Appendix Contains J-1............................
Block Transfer Write Configuration Block for
5 Output/3 Input Modules J-1............................
Block Transfer Write Bit/Word Descriptions for
5 Output/3 Input Modules J-3............................
Block Transfer Read Word Assignments for the
5 Output/3 Input Modules J-6............................
Block Transfer Read Bit/Word Descriptions for
5 Output/3 Input Modules J-7............................
Block Transfer Write and Block
Transfer Read Configurations
for 7 Output/1 Input 1771ĆN
Series Modules
CSA Hazardous Location
Appendix K
What This Appendix Contains K-1............................
Block Transfer Write Configuration Block for 7 Output/1 Input Modules K-1
Block Transfer Write Bit/Word Descriptions for
7 Output/1 Input Modules K-3............................
Block Transfer Read Word Assignments for 7 Output/1 Input Modules K-6
Block Transfer Read Bit/Word Descriptions for
7 Output/1 Input Modules K-7............................
Appendix L
CSA Hazardous Location L-1...............................
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Table of Contentstoc-vi
Publication 1771ĆUM127B-EN-P - December 2002
Overview of the High
T
Resolution Isolated
Analog Modules
Chapter 1
Chapter Objectives
Module Description
This chapter gives you information on:
• features of the input/output modules
• how the modules communicate with programmable controllers
The high resolution isolated analog modules are intelligent block
transfer modules that interface analog signals with Allen-Bradley
PLC-3 and PLC-5 family programmable controllers that have block
transfer capability. Block transfer programming moves input data
words from the module’s memory to a designated area in the
processor data table in a single scan. It also moves configuration
words and output data from the processor data table to module
memory.
The N-series family includes modules with both analog inputs and
outputs on the same module. The modules use 16-bit
analog-to-digital converters and 14-bit digital-to-analog converters
for high resolution and accuracy. All of these modules require only a
single slot in the I/O chassis, and do not require an external power
supply.
Since the N-series modules are combination modules, with input and
output capabilities on the same module, block transfer reads from the
module are structured differently from dedicated input or output
modules. Normally, block transfer read information is contiguous,
and is stored in contiguous locations in the data block. N-series
modules transmit channel data on an individual basis with status
information in between. This results in non-contiguous blocks of
data in non-contiguous data locations. Care must be taken when
transferring this information. Additional programming may be
required.
Use with PLC-2 family programmable
IMPORTAN
Input data is converted to a specified data type in a digital format to
be transferred to the processor’s data table on request. Output data is
converted to analog signals and sent to the appropriate output
channels. If real time sampling is selected, block transfer reads will
only occur at the time selected. Consequently, the minimum interval
between block transfer reads is the same as the total input update
time for each analog input module (25ms).
controllers is not recommended. Refer to
chapter 3, page 3-2.
Publication 1771ĆUM127B-EN-P - December 2002
1–2 Overview of the High Resolution Isolated Analog Modules
The modules have either four or eight channels, each electrically
isolated from each other and from the backplane. Input and output
terminations are made through prefabricated cables which connect to
remote termination panels (RTP). The modules are compatible with
all 1771-A1B, A2B, A3B, A3B1, A4B, and later 1771 universal
I/O chassis. In addition, they can be used in 1771-AM1, and -AM2
chassis.
Features of the High
Resolution Isolated
Analog Series Modules
The analog modules are comprised of modular analog signal
conditioning blocks that are plugged into a common circuit board.
These signal conditioning blocks provide the following:
• 4–20mA output range
• 0–50mA output range
• +10V output (scalable +5V, 0-5V, 0-10V, etc.)
• thermocouple input (+100mV)
• +5V input (+20mA with resistor RTP)
• +10V input (+20mA with resistor RTP)
• 4–20mA input with sourcing/sinking input
• 1–650 ohm RTD input
Your particular module may have a combination of the above
conditioning blocks.
The N-Series analog modules feature:
• scaling of data to engineering units
• self-calibration (external reference required)
• software configuration
• user-selectable high and low alarms with deadband (hysteresis)
• self diagnostics
• input open circuit detection
• programmable ramped outputs
Publication 1771ĆUM127B-EN-P - December 2002
Specific analog modules have these additional features:
• Thermocouple input channels
– input channels configurable for thermocouple input ranges —
Types B, E, J, K, R, S and T thermocouples (1771-NT2 also
includes types C and N)
– cold junction compensation
– scaling to selected temperature range in
o
C or oF
– temperature resolution —
o
up to 0.03
up to 0.1
up to 0.07
C/0.06°F (E, J, K, T, N)
o
C/0.2°F (B, R, S)
o
C/0.1°F (C)
– millivolt resolution up to 1 microvolt
1–3Overview of the High Resolution Isolated Analog Modules
• RTD input channels
– reports
10Ω copper sensors
o
C, oF, or ohms for 100Ω platinum, 120Ω nickel, or
– reports ohms for other types of sensors
o
– 0.1
C/0.1oF resolution on 100Ω platinum sensor
– resistance resolution to 10mΩ
• +5V and +10V input channels — can be used with remote
termination panel
resistor to achieve a nonsourcing current input
• 4-20mA input with internal loop power supply
• ±10V output channels
• 0-25mA output channels
• 0-50mA output channels
Catalog/Channel Numbers
The following are standard catalog numbers and their respective
channel configurations:
Module Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8
1771ĆNIS 4-20mA 4-20mA 4-20mA 4-20mA 4-20mA 4-20mA 4-20mA 4-20mA B
1771ĆNIV +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) B
1771ĆNIV1 +10V +10V +10V +10V +10V +10V +10V +10V B
1771ĆNIVR +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) RTD RTD RTD RTD B
1771ĆNIVT +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) +100mV/TC +100mV/TC +100mV/TC +100mV/TC B
1771ĆNR RTD RTD RTD RTD RTD RTD RTD RTD B
1771ĆNT1 +100mV/TC +100mV/TC +100mV/TC +100mV/TC +100mV/TC +100mV/TC +100mV/TC +100mV/TC B
1771ĆNT2 -5/+55mV/TC -5/+55mV/TC -5/+55mV/TC -5/+55mV/TC -5/+55mV/TC -5/+55mV/TC -5/+55mV/TC -5/+55mV/TC B
1771ĆNOC 0-25mA out 0-25mA out 0-25mA out 0-25mA out 0-25mA out 0-25mA out 0-25mA out 0-25mA out C
1771ĆNOV +10V out +10V out +10V out +10V out +10V out +10V out +10V out +10V out C
1771ĆNB4T 0-25mA out 0-25mA out +100mV/TC +100mV/TC D
1771ĆNB4S 0-25mA out 0-25mA out 4-20mA 4-20mA D
1771ĆNBSC 0-25mA out 0-25mA out 4-20mA 4-20mA 4-20mA 4-20mA 4-20mA 4-20mA E
1771ĆNBRC 0-25mA out 0-25mA out RTD RTD RTD RTD RTD RTD E
1771ĆNBTC 0-25mA out 0-25mA out +100mV/TC +100mV/TC +100mV/TC +100mV/TC +100mV/TC +100mV/TC E
1771ĆNBV1 +10V out +10V out +10V in +10V in +10V in +10V in +10V in +10V in E
1771ĆNBVC 0-25mA out 0-25mA out +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) +5V (+20mA) E
1771ĆNX1 0-50mA out 0-25mA out 0-50mA out 0-25mA out 0-25mA out RTD RTD 100mV/TC F
1771ĆNX2 0-50mA out 0-25mA out 0-50mA out 0-25mA out RTD RTD 100mV/TC 100mV/TC G
1771ĆNX3 0-50mA out 0-25mA out 0-50mA out 0-25mA out RTD RTD RTD 100mV/TC G
1771ĆNX4 0-50mA out 0-25mA out 0-25mA out 0-25mA out 0-25mA out 0-25mA out RTD 100mV/TC H
Note: Appendices I thru L cover other variations of the 1771ĆN series module.
Refer to
Appendix
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1–4 Overview of the High Resolution Isolated Analog Modules
How the High Resolution
Isolated Analog Modules
Communicate with
Processors
5
The processor transfers data to and from the module using BTW
(block transfer write) and BTR (block transfer read) instructions in
your ladder diagram program. These instructions let the processor
obtain input values and status from the module, and let you establish
the module’s mode of operation (Figure NO TAG).
1. The processor transfers your configuration data, output data and
calibration values to the module using a block transfer write
instruction.
2. External input devices generate analog signals that are transmitted
to the module. Internal output circuitry generates analog signals
that drive field devices.
3. The module converts the analog signals into binary or BCD
format and stores theses values until the processor requests their
transfer.
Table 1.A
Communication Between the Processor and the Module
3
1
Accuracy
Memory
User Program
PLC Processor
(PLCĆ5/40 Shown)
BTW
BTR
4
High Resolution
Isolated Analog
Module
From input devices
To output devices
2
12933ĆI
4. When instructed by your ladder program, the processor performs
a read block transfer of the values and stores them in a data table.
5. The processor and module determine that the transfer was made
without error, and that input values are within specified range.
6. Your ladder program can use and/or move the data (if valid)
before it is written over by the transfer of new data in a
subsequent transfer.
See chapter 4, “Configuring the Module,” for more information.
The accuracy of each of the high resolution isolated analog modules
is described in Appendix A.
Chapter Summary
Publication 1771ĆUM127B-EN-P - December 2002
In this chapter you read about the functional aspects of the analog
modules and how they communicate with programmable controllers.
Installing the Module
Chapter 2
Chapter Objectives
Before You Install Your
Analog Module
This chapter gives you information on:
For information on See page
Before You Install Your Module . ......................
Determining Power Requirements . ................... 2-1
Determining Module Location in the Chassis . ............ 2-2
Installing the Module . ............................. 2-2
Connecting Wiring . ............................... 2-5
Connecting 4-wire sensors . ........................ 2-9
Sourcing input Analog Modules . ..................... 2-10
Making Your Own Cables . .......................... 2-11
Grounding Field Devices . .......................... 2-12
Module Indicators . .................
Before installing your module in the I/O chassis you must:
Action required: Refer to:
Calculate power requirements for the I/O chassis. page 2-1
Determine module location in the I/O Chassis page 2-2
Connect the cable and make wiring connections to the
remote termination panel
page 2-3
2-1
2-13
Electrostatic Damage
Calculate Power
Requirements for the
I/O Chassis
ATTENTION
!
Preventing Electrostatic Discharge
This equipment is sensitive to electrostatic
discharge, which can cause internal damage and
affect normal operation. Follow these guidelines
when you handle this equipment:
• Touch a grounded object to discharge potential
static.
• Wear an approved grounding wriststrap.
• Do not touch connectors or pins on component
boards.
• Do not touch circuit components inside the
equipment.
• If available, use a static–safe workstation.
• When not in use, keep modules in appropriate
static–safe packaging.
Your module receives its power through the 1771 I/O chassis
backplane from the chassis power supply. The maximum current
drawn by the module from this supply ranges from 1.5 to 3.3A,
dependent upon the particular type of module. Refer to the
specifications in appendix A for standard modules.
Publication 1771ĆUM127B-EN-P - December 2002
2–2 Installing the Module
N
N
Add this value to the requirements of all other modules in the I/O
chassis to prevent overloading the chassis backplane and/or
backplane power supply.
Determine Module
Location in the I/O Chassis
Install the Analog Module
Place your module in any slot of the I/O chassis except for the
extreme left slot. This slot is reserved for processors or adapter
modules.
Group your modules to minimize adverse affects from radiated
electrical noise and heat. We recommend the following.
• Group analog and low voltage dc modules away from ac modules
or high voltage dc modules to minimize electrical noise
interference.
• Do not place this module in the same I/O group with a discrete
high-density I/O module when using 2-slot addressing. This
module uses a byte in both the input and output image tables for
block transfer.
To install your module in an I/O chassis:
1. First, turn off power to the I/O chassis:
ATTENTIO
!
Remove power from the 1771 I/O chassis
backplane and disconnect the cable from the
module before removing or installing an I/O
module.
• Failure to remove power from the backplane
could cause injury or equipment damage due to
possible unexpected operation.
• Failure to remove power from the backplane
could cause module damage, degradation of
performance, or injury.
Publication 1771ĆUM127B-EN-P - December 2002
ATTENTIO
!
Observe the following precautions when inserting
or removing keys:
• insert or remove keys with your fingers
• make sure that key placement is correct
Incorrect keying or the use of a tool can result in
damage to the backplane connector and possible
system faults.
Key the Backplane Connector
N
Place your module in any slot in the chassis
except the leftmost slot which is reserved for
processors or adapters.
Position the keying bands in the backplane connectors
to correspond to the key slots on the module.
Place the keying bands:
between 26 and 28
between 32 and 34
You can change the position of these bands if
subsequent system design and rewiring makes
insertion of a different type of module necessary.
2–3Installing the Module
I/O chassis
Keying Bands
Install the Module in the
Chassis and Connect the
Cable
ATTENTIO
Upper Connector
Remove power from the 1771 I/O chassis
backplane and field wiring arm before removing
or installing an I/O module.
11022ĆI
• Failure to remove power from the backplane or
!
wiring arm could cause module damage, degradation of performance, or injury.
• Failure to remove power from the backplane
could cause injury or equipment damage due to
possible unexpected operation.
1. Place the module in the plastic tracks on the top and bottom of the
slot that guides the module into position.
2. Do not force the module into its backplane connector. Apply firm
even pressure on the module until it is firmly seated in the
chassis. Note: The chassis locking bar will not close if all
modules are not seated properly.
Publication 1771ĆUM127B-EN-P - December 2002
2–4 Installing the Module
1771ĆA1B, ĆA2B, ĆA3B, ĆA3B1, ĆA4B I/O chassis
locking tab
card guides
module
Snap the chassis latch over
the top of the module to secure it.
3. Connect the 1771-NC cable to the module as shown in Figure 2.1.
A. Slide the locking bar up.
B. Insert the cable connector into the mating connector on the
1771ĆA1B, ĆA2B, ĆA3B1, ĆA4B Series B I/O chassis
locking bar pin
Swing the chassis locking bar down into place to secure
the modules. Make sure the locking pins engage.
front of the module.
locking bar
card guides
module
19809
Module Connector
1. Position locking bar in up position.
Cable Connector
Locking bar
C. Slide the locking bar down over the mating pins on the
module to lock the connector onto the module.
Figure 2.1
Connecting the Cable to the Front of the Module
2. Insert connector into mating connector.
3. Slide locking bar down to lock.
11023ĆI
Publication 1771ĆUM127B-EN-P - December 2002
2–5Installing the Module
Connecting Wiring
The N-series modules are cable-connected to a remote termination
panel using cat. no. 1771-NC6 (6 ft) or -NC15 (15 ft) cables.
Variations of remote termination panels are used, depending on the
type of module used. These are:
Catalog
Number
1771ĆRTP1 has cold junction compensation for thermocouples
1771ĆRTP3 incorporates resistors and fuses; used primarily for 4Ć20mA inputs
when using +
such as Bussmann GMA-1/4, 250V/250mA.)
1771ĆRTP4 a generalĆuse block with straightĆthru wiring that can be used for all
applications except thermocouples
1771ĆRT41 a 4Ćchannel block with cold junction compensation for thermocouples
1771ĆRT44 a generalĆuse 4Ćchannel block with straightĆthru wiring that can be
used for all applications except thermocouples
1
RTP4 and RT44 can be used withthermocouples if a method of cold junction compensation is provided at
the interface of thermocouple and copper wires within the system.
5V inputs (Uses 5mm x 20mm fast acting 1/4A fuses
Description
1
1
The remote termination panels are designed for mounting on
standard DIN 1 or DIN 3 mounting rails.
Publication 1771ĆUM127B-EN-P - December 2002
2–6 Installing the Module
1
3.0
(75.0)
Figure 2.2
Mounting Dimensions for the Remote Termination Panels
RTP1, RTP3, RTP4
AB
Inches
(Millimeters)
2.3
(58.4)
2.3
(58.4)
3.0
(75.0
)
J8
J7
J6
J5
J1
J2
J3
J4
5.30
(134.6)
RT41, RT44
J1
J2
J3
J4
2.3
(58.4)
Dimensions to
3.5
(88.9)
back of DIN rail
19366
Table 2.A
Remote Termination Panel Connection Points for Field Devices (Channel 1 shown)
Input Type Connect To Input Type Connect To Input Type Connect To Input Type Connect To
Voltage
Output
Type
Voltage
+ I1
Ć
Shield S1
Connect To
R1
Current
(with
external
resistor)
Output
Type
+ O1 + O1
R1
Current
Ć
+ I1 + I1 + I1
Ć R1
Shield S1 Shield S1
Connect To Input Type Connect To
Thermocouple
Ć R1
Current
(Source/
Sink)
Shield S1
Power
Excitation (A) O1
Ć R1
RTD
Lead Compensation (B) I1
Shield S1 Shield S1 Common (C) R1
1
When using 4Ćwire RTD, leave the 4th wire open.
2
Not used when NĆSeries module is supplying loop power. Refer to Figure 2.6 in this document.
Publication 1771ĆUM127B-EN-P - December 2002
Ć
Loop
2
R1
O1
Figure 2.3
Remote Termination Panel Wiring
2–7Installing the Module
Module End of
1771ĆNC cable
Example:
Channel 1 Connections
R1 = Return 1
I1 = Input 1
O1 = Output 1
S1 = Shield 1
RTP End of
1771ĆNC cable
Channel 1 Connections
R1 = Return 1
I1 = Input 1
O1 = Output 1
S1 = Shield 1
Note: Terminals W1, W2 and W3 are
spares.
Do not use terminals CR and CL.
RTP1
DIN Rail
Note: Terminals W1, W2 and W3 are
spares.
Do not use terminals CR and CL.
Module End of
1771ĆNC cable
RT41
RTP End of
1771ĆNC cable
DIN Rail
11024ĆI
Publication 1771ĆUM127B-EN-P - December 2002
2–8 Installing the Module
Field wiring to the remote termination panel is the same for all
remote termination panel variations. Refer to Figure 2.4.
Each channel has 4 connections: R, I, O, and S.
• R = return
• I = input
• O = output
• S = shield
Channel 1 would use R1, I1, O1, and S1; channel 2 would use R2,
I2, O2, and S2; and so on for the remaining channels.
To connect field wiring to the remote termination panel:
1. Strip 3/8 inch (9.25 mm) of insulation from the 22-12 AWG wire.
2. Insert the wire into the open connector slot.
3. Tighten the screw to 4.4–5.2 lb–in. (0.5–0.6Nm) to clamp the
wire.
Figure 2.4
Connecting Wire to the Remote Termination Panel
Each channel has four connections: R, I, O, and S.
Field wiring to the RTP is the same for all RTP variations.
Channel 1 uses R1, I1, O1, and S1; channel 2 uses R2, I2,
O2, and S2; and so on for the remaining channels.
Remote
Termination
Panel (RTP)
I = input
R = return
Field Wiring
O = output
S = shield
Publication 1771ĆUM127B-EN-P - December 2002
channel 2
channel 1
19621
2–9Installing the Module
Connecting 4ĆWire
Sensors
Figure 2.5 shows how to connect 4-wire sensors to the remote
termination panel. A 4-wire sensor has two pairs of leads; one pair
for each resistor junction. One wire of the four is not used (it does
not matter which one). This leaves three wires – one pair and one
single wire. You must connect the single wire to the terminal marked
“O_”. You connect the remaining pair of wires to terminals “I_” and
“R_”. It doesn’t matter which wire of the pair connects to terminal
“I_” and which wire connects to terminal “R_” so long as all three
wires are the same AWG gauge.
Figure 2.5
Connecting a 4ĆWire Sensor to the Remote Termination
Panel
Single lead connects
to terminal O
Note: In this illustration:
Terminal O is the 1mA excitation (A) sourcing current
Terminal I is the lead compensation (B) sense input
Terminal R is common (C)
Chassis
Ground
RTD
Leave 1 lead open
12935-I
Publication 1771ĆUM127B-EN-P - December 2002
2–10 Installing the Module
Sourcing Input Analog
Modules
The 1771-NIS, 1771-NBSC and 1771-NB4S modules are
sourcing/sinking input modules. These modules can supply the
necessary loop power for 2-wire transmitters connected to the input.
All loop power functionality is contained within the analog module.
Examples of typical configurations are shown in Figure 2.6.
No external resistors are required.
Figure 2.6
Examples of Sourcing/Sinking Input Modules
2ĆWire Transmitter
4ĆWire Transmitter
RTP4
i
Output
Input
Return
Output
24V dc
24V dc
Input
Module supplies loop power
(sourcing)
24V dc
2ĆWire Transmitter
i
24V dc
i
Input
Return
Output
Input
Return
24V dc
Input
Input
User supplies loop power
with 4Ćwire transmitter
(sinking)
User supplies loop power
(sinking)
Inputs can be configured as sourcing or sinking inputs. For sourcing
inputs, the N-series module supplies the loop power. For sinking
inputs, you supply the loop power.
When the loop power is supplied externally, the 16-bit resolution
provides 65535 counts over the 0–20mA current range. This
provides about twice the resolution of voltage inputs with external
resistors.
Publication 1771ĆUM127B-EN-P - December 2002
2–11Installing the Module
Thermistor
Making Your Own Cables
Module Top Connector Module Bottom Connector
Channel Number Signal 37ĆPin Connector Wire Color Channel Number Signal 37ĆPin Connector Wire Color
I1 20 Blk I5 20 Blk
1
2
3
O1
R1 21 Wht/Blk R5 21 Wht/Blk
I2 24 Orn I6 24 Orn
O2
R2 25 Wht R6 25 Wht
I3 29 Grn I7 29 Grn
O3
R3 30 Grn/Wht R7 30 Grn/Wht
If you are not using thermocouples, you can terminate the analog
module to a terminal block by cutting the 25-pin RTP end connector
off the standard cable and wiring to your terminal block. Refer to
Table 2.B for wire termination designations.
Table 2.B
Wire Termination Designations
22 Blk/Wht
26 Orn/Blk
31 Grn/Blk
5
6
7
O5 22 Blk/Wht
O6 26 Orn/Blk
O7 31 Grn/Blk
I4 33 Blu I8 33 Blu
4
O4
R4 34 Blu/Wht R8 34 Blu/Wht
35 Blu/Blk
8
Cold Junction
O8 35 Blu/Blk
36 Red
37 Red/Wht
Publication 1771ĆUM127B-EN-P - December 2002
2–12 Installing the Module
Grounding the Field
Devices
When using shielded cable or shielded thermocouple extension wire,
ground the foil shield and drain wire only at one end of the cable.
We recommend that you wrap the foil shield and drain wire together
and connect them to the “S” connection on the RTP for the particular
channel. All shield connections are internally connected together in
the RTP so that only one wire is required to ground the entire remote
termination panel. Connect a wire from the “SH” connection on the
RTP to a ground stud on the metal cabinet in which the remote
termination panel is mounted.
If you do not want to ground a particular shield at the RTP, you can
remove the jumper for that particular channel. This will allow the
shield to float at the RTP end. To remove a jumper, you must cut it
out. Once the jumper is removed it cannot be replaced. Clip as
close to the circuit board as possible at both ends to completely
remove it. The jumpers (Figure 2.7) are labeled J1 through J8,
corresponding to channels 1 through 8 respectively.
Figure 2.7
Jumper Positions
Jumpers for channels
5 through 8
J8
J7
J6
J5
J1
J2
J3
J4
Jumpers for channels
1 through 4
Refer to publication 1770-4.1, Programmable Controller Wiring and
Grounding Guidelines, for additional information.
Publication 1771ĆUM127B-EN-P - December 2002
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