High Resolution
Thermocouple/Millivolt Input Module
Cat. No. 1771-IXHR
User Manual
Important User Information
Because of the variety of uses for this product and because of the
differences between solid state products and electromechanical products,
those responsible for applying and using this product must satisfy
themselves as to the acceptability of each application and use of this
product. For more information, refer to publication SGI–1.1 (Safety
Guidelines For The Application, Installation and Maintenance of Solid
State Control).
The illustrations, charts, and layout examples shown in this manual are
intended solely to illustrate the text of this manual. Because of the many
variables and requirements associated with any particular installation,
Allen–Bradley Company cannot assume responsibility or liability for
actual use based upon the illustrative uses and applications.
No patent liability is assumed by Allen–Bradley Company with respect to
use of information, circuits, equipment or software described in this text.
Reproduction of the contents of this manual, in whole or in part, without
written permission of the Allen–Bradley Company is prohibited.
Throughout this manual we make notes to alert you to possible injury to
people or damage to equipment under specific circumstances.
WARNING: Tells readers where people may be hurt if
procedures are not followed properly.
CAUTION: Tells readers where machinery may be damaged
or economic loss can occur if procedures are not followed
properly.
Warnings and Cautions:
- Identify a possible trouble spot.
- Tell what causes the trouble.
- Give the result of improper action.
- Tell the reader how to avoid trouble.
Important: We recommend you frequently backup your application
programs on appropriate storage medium to avoid possible data loss.
1991 Allen-Bradley Company
PLC is a registered trademark of Allen-Bradley Company
, Inc.
1
, Inc.
Table of Contents
Important User Information 1. . . . . . . . . . . . . . . . . . . . . . . .
Chapter
Configuring the Module 51
Input Type 52
Zoom Feature 52
Temperature Scale 52
Real T
Channel Alarms 53
Calibration 53
Configuration Block for a Block Transfer Write 54
Bit/Word Descriptions 56
Chapter Summary 58
This manual shows you how to use your High Resolution
Thermocouple/Millivolt input module with an Allen–Bradley programmable
controller. It helps you install, program, calibrate, and troubleshoot your
module.
You must be able to program and operate an Allen–Bradley programmable
controller (PLC) to make efficient use of your input module. In particular, you
must know how to program block transfer instructions.
We assume that you know how to do this in this manual. If you do not, refer to
the appropriate PLC programming and operations manual before you attempt to
program this module.
In this manual, we refer to:
The individual input module as the “input module” or the ”IXHR”
The Programmable Controller, as the “controller.”
This manual is divided into eight chapters. The following chart shows each
chapter with its corresponding title and a brief overview of the topics covered in
that chapter.
ChapterTitleTopics Covered
2Overview of the Input ModuleDescription of the module, including general and hardware
features
3Installing the Input ModuleModule power requirements, keying, chassis location
Wiring of field wiring arm
4Module ProgrammingHow to program your programmable controller for this module
Sample programs
5Module ConfigurationHardware and software configuration
Module write block format
6Module Status and Input DataReading data from your module
Module read block format
7Module CalibrationHow to calibrate your module
8TroubleshootingDiagnostics reported by the module
Appendix CThermocouple CharacteristicsExtractions from NBS Monograph 125 (IPTS-68)
Warnings and Cautions
Related Products
This manual contains warnings and cautions.
WARNING: A warning indicates where you may be injured if you
use your equipment improperly.
CAUTION: Cautions indicate where equipment may be damaged
from misuse.
You should read and understand cautions and warnings before performing the
procedures they precede.
You can install your input module in any system that uses Allen–Bradley
PLC–3 and PLC–5 programmable controllers with block transfer capability and
the 1771 I/O structure.
Contact your nearest Allen–Bradley office for more information about your
programmable controllers.
Product Compatibility
12
These input modules can be used with any 1771 I/O chassis. Communication
between the analog module and the processor is bidirectional. The processor
block–transfers output data through the output image table to the module and
block–transfers input data from the module through the input image table. The
module also requires an area in the data table to store the read block and write
block data. I/O image table use is an important factor in module placement and
addressing selection. The module’s data table use is listed in the following table.
Chapter 1
Using This Manual
Table 1.A
Compatibility
and Use of Data T
Catalog
Number
Input Output Read Write
Image Image Block Block
Bits Bits Words Words
1771-IXHR8812/1327/28YesYesYesA
A
= Compatible with 1771-A1, A2, A4 chassis.
B = Compatible with 1771-A1B, A2B, A3B, A4B chassis.
Y
es = Compatible without restriction
No = Restricted to complementary module placement
able
Use of Data T
able
Compatibility
Addressing Chassis
1/2 -slot 1-slot 2-slot
Series
and B
You can place your input module in any I/O module slot of the I/O chassis. You
can put:
two input modules in the same module group
an input and an output module in the same module group.
Do not put the module in the same module group as a discrete high density
module unless you are using 1 or 1/2 slot addressing. Avoid placing this module
close to AC modules or high voltage DC modules.
Related Publications
For a list of publications with information on Allen–Bradley programmable
controller products, consult our publication index SD499.
13
Chapter
2
Overview of the High Resolution
Thermocouple/Millivolt Input Module
Chapter 2
Chapter Objectives
Module Description
This chapter gives you information on:
features of the input module
how an input module communicates with programmable controllers
The High Resolution Thermocouple/Millivolt input module is an intelligent
block transfer module that interfaces analog input signals with any
Allen–Bradley programmable controllers that have block transfer capability.
Note: Use with PLC–2 family programmable controllers is not recommended.
The 1771–IXHR module is only available with 2’s complementary binary as its
only data type. The PLC–2 family does not use 2’s complementary binary.
Block transfer programming moves input data words from the module’s
memory to a designated area in the processor data table in a single scan. It also
moves configuration words from the processor data table to module memory.
The input module is a single slot module which does not require an external
power supply. After scanning the analog inputs, the input data is converted to a
specified data type in a digital format to be transferred to the processor’s data
table on request. The block transfer mode is disabled until this input scan is
complete. Consequently, the minimum interval between block transfer reads is
the same as the total input update time for each analog input module (25ms).
Features of the Input Module
The 1771–IXHR module senses up to 8 differential analog inputs and converts
them to values compatible with Allen–Bradley programmable controllers.
This module’s features include:
8 input channels configurable for thermocouple input ranges or millivolt
input ranges: Types B, E, J, K, T, R and S thermocouples and +
two types of inputs allowed: 4 of one input type and 4 of another
cold junction compensation
scaling to selected temperature range in oC or oF
temperature resolution of 0.1oC or 0.1oF, millivolt resolution to 1 microvolt
user selectable high and low temperature alarms
all features selectable through programming
100 millivolts
21
Chapter 2
Overview of the High Resolution
Thermocouple/Millivolt Input Module
self–diagnostics and status reporting at power–up
detection of open circuit if thermocouple fails
automatic offset and gain calibration for each channel
software calibration of all channels, eliminating potentiometers
programmable filters for each group of 4 inputs
X10 magnification (zoom) for millivolt mode
How Analog Modules
Communicate with
Programmable Controllers
2
The processor transfers data to and from the module using BTW (block transfer
write) and BTR (block transfer read) instructions in your ladder diagram
program. These instructions let the processor obtain input values and status
from the module, and let you establish the module’s mode of operation
(Figure 2.1).
1.The processor transfers your configuration data and calibration values to
the module using a block transfer write instruction.
2.External devices generate analog signals that are transmitted to the
module.
Figure 2.1
Communication
3
1
BTW
Between Processor and Module
5
Memory
User Program
6
To Output Devices
22
High Resolution
Thermocouple/Millivolt
Input Module
1771-IXHR
3.The module converts analog signals into binary format, and stores these
BTR
4
PC Processor
(PLC-5/40 Shown)
12933-I
values until the processor requests their transfer.
Chapter 2
Overview of the High Resolution
Thermocouple/Millivolt Input Module
4.When instructed by your ladder program, the processor performs a read
block transfer of the values and stores them in a data table.
5.The processor and module determine that the transfer was made without
error, and that input values are within specified range.
6.Your ladder program can use and/or move the data (if valid) before it is
written over by the transfer of new data in a subsequent transfer.
7.Your ladder program should allow write block transfers to the module only
when enabled by the operator at power–up.
Accuracy
Getting Started
The accuracy of the input module is described in Appendix A.
Your input module package contains the following items. Please check that each
part is included and correct before proceeding.
High Resolution
Thermocouple/Millivolt
Input Module
(Cat. No. 1771–IXHR)
User’s Manual
Chapter Summary
Input ModuleField Wiring ArmUser's Manual
1771-IXHRCat.
In this chapter you read about the functional aspects of the input module and
how the module communicates with programmable controllers.
No. 1771-WI
1771-6.5.80
10526-I
23
Chapter
3
Installing the High Resolution
Thermocouple/Millivolt Input Module
Chapter Objectives
Before You Install Your Input
Module
Electrostatic Damage
This chapter gives you information on:
calculating the chassis power requirement
choosing the module’s location in the I/O chassis
keying a chassis slot for your module
wiring the input module’s field wiring arm
installing the input module
Before installing your input module in the I/O chassis you must:
Action required:Refer to:
Calculate the power requirements of all modules in each chassis.Power Requirements
Determine where to place the module in the I/O chassis.Module Location in the I/O Chassis
Key the backplane connector in the I/O chassis.Module Keying
Make connections to the wiring arm.Connecting Wiring and Grounding
Electrostatic discharge can damage semiconductor devices inside this module if
you touch backplane connector pins. Guard against electrostatic damage by
observing the following warning:
Power Requirements
CAUTION: Electrostatic discharge can degrade performance or
cause permanent damage. Handle the module as stated below.
Wear an approved wrist strap grounding device when handling the module.
Touch
Handle
Keep the module in its static–shield bag when not in use, or during shipment.
Your module receives its power through the 1771 I/O chassis backplane from
the chassis power supply. The maximum current drawn by the
thermocouple/millivolt input module from this supply is 750mA (3.75 Watts).
a grounded object to rid yourself of electrostatic char
the module.
the module from the front, away from the backplane connector
touch backplane connector pins.
ge before handling
. Do not
31
Chapter 3
Installing the High Resolution
Thermocouple/Millivolt Input Module
Add this value to the requirements of all other modules in the I/O chassis to
prevent overloading the chassis backplane and/or backplane power supply.
Module Location in the
I/O Chassis
Module Keying
Place your module in any slot of the I/O chassis except for the extreme left slot.
This slot is reserved for processors or adapter modules.
Group your modules to minimize adverse affects from radiated electrical noise
and heat. We recommend the following.
Group analog and low voltage DC modules away from AC modules or high
voltage DC modules to minimize electrical noise interference.
Do not place this module in the same I/O group with a discrete high–density
I/O module when using 2–slot addressing. This module uses a byte in both
the input and output image tables for block transfer.
After determining the module’s location in the I/O chassis, connect the wiring
arm to the pivot bar at the module’s location.
Use the plastic keying bands, shipped with each I/O chassis, for keying the I/O
slot to accept only this type of module.
The input modules are slotted in two places on the rear edge of the circuit
board. The position of the keying bands on the backplane connector must
correspond to these slots to allow insertion of the module. You can key any
connector in an I/O chassis to receive these modules except for the leftmost
connector reserved for adapter or processor modules. Place keying bands
between the following numbers labeled on the backplane connector
(Figure 3.1):
32
Between 20 and 22
Between 24 and 26
You can change the position of these bands if subsequent system design and
rewiring makes insertion of a different type of module necessary. Use
needlenose pliers to insert or remove keying bands.
Figure 3.1
Positions
Keying
Chapter 3
Installing the High Resolution
Thermocouple/Millivolt Input Module
2
4
6
8
10
12
14
16
18
20
22
Keying
Bands
Upper Connector
CAUTION: The High Resolution Thermocouple/Millivolt Input
Module uses the same keying slots as the 1771–IXE
Thermocouple/Millivolt Input Module. If you are replacing a
1771–IXE with a 1771–IXHR, the ladder program must be modified
to accept the new block transfer format.
24
26
28
30
32
34
36
14288
Connecting Wiring
Connect your I/O devices to the 1771–WI field wiring arm shipped with the
module (see Figure 3.2). Attach the field wiring arm to the pivot bar at the
bottom of the I/O chassis. The field wiring arm pivots upward and connects
with the module so you can install or remove the module without disconnecting
the wires.
Connect inputs in successive order starting with channel 1: positive leads to
even–numbered terminals, negative leads to odd–numbered terminals of the
wiring arm. Make connections to channel 1 at wiring arm terminals 18 (+) and
17(–). Follow the connection label on the side of the module for connecting
the remaining inputs (Figure 3.2).
33
Chapter 3
Installing the High Resolution
Thermocouple/Millivolt Input Module
Connect positive thermocouple leads
to even-numbered terminals, negative
leads to odd-numbered terminals.
Ground cable shield to I/O chassis mounting bolt.
Channel 1
Channel 2
10527-I
Grounding the Input Modules
34
Do not connect an input to terminals 9 and 10. They are reserved for the cold
junction temperature sensor inside the wiring arm. Short circuit unused input
terminals by connecting a jumper wire between the positive and negative input
terminals of each unused channel. Refer to appendix A to determine maximum
cable length.
When using shielded cable or shielded thermocouple extension wire, ground the
foil shield and drain wire only at one end of the cable. We recommend that you
wrap the foil shield and drain wire together and connect them to a chassis
mounting bolt (Figure 3.3). At the opposite end of the cable, tape exposed
shield and drain wire with electrical tape to insulate it from electrical contact.
Figure 3.3
Grounding
Cable
Chapter 3
Installing the High Resolution
Thermocouple/Millivolt Input Module
Ground Shield at
I/O chassis
mounting bolt
Shield and drain
twisted into
single strand
Field Wiring Arm
Refer to Wiring and Grounding Guidelines, publication 1770-4.1 for additional information.
17798
35
Chapter 3
Installing the High Resolution
Thermocouple/Millivolt Input Module
Installing the Input Module
When installing your module in an I/O chassis:
1.First, turn off power to the I/O chassis:
WARNING: Remove power from the 1771 I/O chassis backplane
and wiring arm before removing or installing an I/O module.
Failure to remove power from the backplane could cause injury or
equipment damage due to possible unexpected operation.
Failure to remove power from the backplane or wiring arm could
cause module damage, degradation of performance, or injury.
2.Place the module in the plastic tracks on the top and bottom of the slot that
guides the module into position.
3.Do not force the module into its backplane connector. Apply firm even
pressure on the module to seat it properly.
4.Snap the chassis latch over the top of the module to secure it.
5.Connect the wiring arm to the module.
Interpreting the Indicator
Lights
The front panel of the input module contains a green RUN and a red FLT (fault)
indicator (Figure 3.4). At power–up, the green and red indicators are on. An
initial module self–check occurs. If there is no fault, the red indicator turns off.
The green indicator will blink until the processor completes a successful write
block transfer to the module. If a fault is found initially or occurs later, the red
FLT indicator lights. Possible module fault causes and corrective action are
discussed in Chapter 8, Troubleshooting.
Figure 3.4
Diagnostic
Indicators
TC/MV
Module
RUN
FLT
10528-I
36
Chapter 3
Installing the High Resolution
Thermocouple/Millivolt Input Module
Chapter Summary
In this chapter you learned how to install your input module in an existing
programmable controller system and how to wire to the field wiring arm.
37
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