Quectel Wireless Solutions 201907EG91VX Users Manual

EG91 Hardware Design

LTE Standard Module S er ies

Rev. EG91_Hardware_Design_V1.4 Date: 2019-03-29 Status: Released

www.quectel.com

LTE Standard Module Series

EG91 Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7th Floor, Hongye Building, No. 1801 Hongmei Road, Xuhui Distric t , Shanghai 200233, China Tel: +86 21 5108 6236 Email: info@quectel.com

Or our local office. For more information, please visit:

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http://www.quectel.com/support/technical.htm Or email to: support@quectel.com

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRA NTY AS TO T HE IN FORM ATIO N CONTAI NED HE REIN , AND DOE S NOT ACC EPT ANY LIABILITY F OR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIO R NOTICE.

COPYRIGHT

THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUT IONS CO., LTD. TRANSMITTING, REPR ODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FO RBIDD EN WITHOUT PERMISS ION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.

EG91_Hardware_Design 1 / 93

EG91 Hardware Design

Jackie WANG

Updated module operating frequencies in

Updated the conducted RF receiving

12. Added packaging information in Chapter 7.3.

NSS receiver in

Updated module operating frequencies in

Added description of GNSS antenna

About the Document

History

Revision Date Author Description

Felix YIN/

1.0 2017-03-22

1.1 2018-01-23

Yeoman CHEN/

Felix YIN/ Rex WANG

Initial

1. Added band B28A.

2. Updated the description of UMTS and GSM features in Table 2.

3. Updated the functional diagram in Figure 1.

4. Table 21.

5. Updated current consumption in Table 26.

6. Updated RF output power in Table 27.

7. sensitivit y in Table 28.

8. Updated the GPRS multi-slot classes in T a ble

33.

9. Added thermal consideration in Chapter 5.8

10. Added a GND pad in each of the four corners of the module’s footprint in Chapter 6.2.

11. Updated storage information in Chapter 7. 1.

LTE Standard Module Series

1.2 2018-03-14

EG91_Hardware_Design 2 / 93

Felix YIN/ Rex WANG

1. Added the description of EG 91-NA.

2. Updated the functional dia gr am in Figure 1.

3. Updated pin assignment i n Fig ur e 2.

4. Updated GNSS function in Table 1.

5. Updated GNSS Features in Table 2.

6. Updated reference circu it of USB interfac e in

Figure 21.

7. Added description of G

Chapter 4.

8. Updated pin definition of RF antenna in Table

21.

9.

Table 22.

10.

interface in Chapter 5.2.

EG91 Hardware Design

interface information

module operating frequencies

40 and 41)

238ºC~245ºC (Chapter 8.2)

1.3 2019-02-03

Ward WANG/ Nathan LIU/ Rex WANG

LTE Standard Module Series

11. Updated antenna requirements in Table 25.

12. Updated RF output power in Table 32.

1. Added new variants EG91-NS, EG91-V, EG91-EC and related content s.

2. Opened pin 24 as ADC0 and added related contents.

3. Updated functional diagram (Figure 1)

4. Updated pin assignment (Figure 2)

5. Updated GNSS features (Table 2)

6. Added USB_BOOT (Chapter 3.18)

7. Updated storage information (Chapter 8.1)

8. Updated (Table 23)

9. Updated antenna requirements (Table 26)

10. Added current consumption of EG91-NS, EG91-V and EG91-EC (Table 32, 33 and 34)

11. Added conducted RF receiving sensitivity of EG91-NS, EG91-V and EG91-EC (Table 39,

1.4 2019-03-29 Ward WANG

1. Modified module name EG91-EC to EG91EX, and EG91-V to EG91-VX

2. Added newly supported 9.x of Android USB serial driver (Table 2)

3. Modified the reflow temperature range as .

EG91_Hardware_Design 3 / 93

LTE Standard Module Series

EG91 Hardware Design

Table Index

TABLE 1: FREQUENCY BANDS OF EG91 SERIES MODULE ....................................................................... 12

TABLE 2: KEY FEATURES OF EG91 MODULE ............................................................................................... 13

TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 19

TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19

TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 26

TABLE 6: PIN DEFINITION OF VBAT AND GND ............................................................................................. 31

TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 33

TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 36

TABLE 9: PIN DEFINITION OF (U)SIM INTERFACES ..................................................................................... 38

TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 40

TABLE 11: PIN DEFINITION OF MAIN UART INTERFACES ........................................................................... 42

TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 42

TABLE 13: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 43

TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 46

TABLE 15: PIN DEFINITION OF SPI INTERFACE ........................................................................................... 47

TABLE 16: PIN DEFINITION OF NETWORK STATUS INDICATOR ................................................................ 48

TABLE 17: WORKING STATE OF NETWORK STATUS INDICATOR .............................................................. 48

TABLE 18: PIN DEFINITION OF STATUS ........................................................................................................ 49

TABLE 19: PIN DEFINITION OF ADC INTERFACE ......................................................................................... 49

TABLE 20: CHARACTERISTICS OF ADC INTERF ACE ................................................................................... 50

TABLE 21: DEFAULT BEHAVIORS OF RI ........................................................................................................ 50

TABLE 22: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 51

TABLE 23: GNSS PERFORMANCE ................................................................................................................. 53

TABLE 24: PIN DEFINITION OF RF ANTENNA ............................................................................................... 55

TABLE 25: MODULE OPERATING FREQUENCIES ........................................................................................ 55

TABLE 26: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 59

TABLE 27: GNSS FREQUENCY ....................................................................................................................... 59

TABLE 28: ANTENNA REQUIREMENTS .......................................................................................................... 60

TABLE 29: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 63

TABLE 30: POWER SUPPLY RATINGS ........................................................................................................... 63

TABLE 31: OPERATION AND STORAGE TEMPERATURES .......................................................................... 64

TABLE 32: EG91-E CURRENT CONSUMPTION ............................................................................................. 65

TABLE 33: EG91-NA CURRENT CONSUMPTION........................................................................................... 67

TABLE 34: EG91-NS CURRENT CONSUMPTION .......................................................................................... 68

TABLE 35: EG91-VX CURRENT CONSUMPTION........................................................................................... 69

TABLE 36: EG91-EX CURRENT CONSUMPTION........................................................................................... 70

TABLE 37: GNSS CURRENT CONSUMPTION OF EG91 ............................................................................... 72

TABLE 38: RF OUTPUT POWER ..................................................................................................................... 72

TABLE 39: EG91-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 73

TABLE 40: EG91-NA CONDUCTED RF RECEIVING SENSITIVIT Y ............................................................... 73

TABLE 41: EG91-NS CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 74

TABLE 42: EG91-VX CONDUCTED RF RECEIVING SEN SI T I VITY ............................................................... 74

EG91_Hardware_Design 6 / 93

LTE Standard Module Series

EG91 Hardware Design

TABLE 43: EG91-EX CONDUCTED RF RECEIVING SEN SI T I VITY ............................................................... 74

TABLE 44: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 75

TABLE 45: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 83

TABLE 46: RELATED DOCUMENTS ................................................................................................................ 86

TABLE 47: TERMS AND ABBREVIA TIONS ...................................................................................................... 86

TABLE 48: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 90

TABLE 49: GPRS MULTI-SLOT C LASSES ...................................................................................................... 91

TABLE 50: EDGE MODULATION AND CODING SCHEMES ........................................................................... 93

EG91_Hardware_Design 7 / 93

LTE Standard Module Series

EG91 Hardware Design

Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16

FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 18

FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 27

FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 28

FIGURE 5: SLEEP MODE APPLICA TION WITH RI ......................................................................................... 29

FIGURE 6: SLEEP MODE APPLICA TION WITHOUT SUSPEND FUNCTION ................................................ 29

FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 31

FIGURE 8: STAR S TRUCTURE OF THE POWER SUPPLY............................................................................ 32

FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 32

FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 33

FIGURE 11: TURN ON THE MODULE USING BUTTON ................................................................................. 34

FIGURE 12: POWER-ON SCENARIO .............................................................................................................. 34

FIGURE 13: POWER-OFF SCENARIO ............................................................................................................ 35

FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 36

FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 37

FIGURE 16: RESET SCENARIO ...................................................................................................................... 37

FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

................................................................................................................................................................... 39

FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 39

FIGURE 19: REFERENCE CIRCUIT OF USB INTERFACE ............................................................................ 41

FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 43

FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 44

FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 45

FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 45

FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICA TION WITH AUDIO CODEC .................................... 46

FIGURE 25: REFERENCE CIRCUIT OF SPI INTERFACE WITH PERIPHERALS ......................................... 47

FIGURE 26: REFERENCE CIRCUIT OF NETWORK STATUS INDICATOR ................................................... 48

FIGURE 27: REFERENCE CIRCUIT OF STATUS ........................................................................................... 49

FIGURE 28: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 51

FIGURE 29: TIMING SEQUENCE FOR ENTERING INTO EMERGENCY DOWNLOAD MODE .................... 52

FIGURE 30: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 57

FIGURE 31: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 57

FIGURE 32: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB ........................................................... 58

FIGURE 33: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)

................................................................................................................................................................... 58

FIGURE 34: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)

................................................................................................................................................................... 58

FIGURE 35: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 60

FIGURE 36: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 61

FIGURE 37: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 62

FIGURE 38: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 62

EG91_Hardware_Design 8 / 93

LTE Standard Module Series

EG91 Hardware Design

FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 76

FIGURE 40: REFERENCED HEATSINK DESIGN (HEA TSINK A T THE BACKSIDE OF CUSTOMERS’ PCB)

................................................................................................................................................................... 77

FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 78

FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 79

FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 80

FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 81

FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 81

FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 83

FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 84

FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 85

FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................... 85

EG91_Hardware_Design 9 / 93

LTE Standard Module Series

EG91 Hardware Design

1 Introduction

This document defines the EG91 module and describes its air i nt er f ac e and hardware interf ace w hich are connected with customers’ applications.

This document can help customers quickly understand module interface specifications, electrical and mechanical details, as wel l as other r elated in for mation of EG91 module. Associated with application note and user guide, customers can use EG91 module to design and set up mo bi le applications easily.

EG91_Hardware_Design 10 / 93

LTE Standard Module Series

of wireless appliances in an aircraft is forbidden to prevent interference with

for more

on sensitive medical equipment, so

Cellular terminals or mobiles operating over radio signals and cellular network

bills or with an invalid (U)SIM card). When emergent help is needed in such

wireless devices such as your phone or other cellular terminals. Areas with

EG91 Hardware Design

1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular termina l or mobile incorporati ng EG91 modu le. Manufacturers of the cellular termina l should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these pr ecautions.

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driv ing (even with a handsfree kit) causes distractio n and can lead to an accident. Please comply with laws and regulations rest ricting the use of wireless devices w hile dr iving.

Switch off the cellular termina l or mo bi le before boarding an aircraft. The oper at ion

communi cation system s. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff restrictions on the use of wirele s s devices on boarding the aircraft .

Wireless devices may cause interference please be aware of the restriction s on the use of wireless devices when in hospitals, clinics or other healthcare facilities.

cannot be guaranteed to conne ct in all possible cond itions (for example, with un paid

conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signa l str ength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, com puter or other electric equipment .

In locations with potentially explosive atmosph eres, obey all posted sign s to turn off

potentially explosive at mospheres include fue lling areas, below decks on boats, fuel or chemical transfer or storage faci liti es , ar eas w here the air contains chemicals or particles such as grain, dust or metal powders, etc.

EG91_Hardware_Design 11 / 93

LTE Standard Module Series

(with Rx-diversity)

B1/B3/B7/B8/B20/B28A

Galileo, QZSS

NOTES

EG91 Hardware Design

2 Product C oncept

2.1. General Description

EG91 module is an embedded 4G wirel ess commu nication module with receive diversity . It supports LTEFDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice functionality to meet customers’ sp ecific app lication demands. The followi ng table shows t he freque ncy ban ds of EG91 series module.

1)

Table 1: Frequency Bands of EG91 Series Module

Module

EG91-E

EG91-NA FDD: B2/B4/B5/B12/B13 B2/B4/B5 Not supported

EG91-NS

EG91-VX FDD: B4/B13 Not supported Not supported

EG91-EX

LTE Bands

FDD:

FDD: B2/B4/B5/B12/B13/B25/ B26

FDD: B1/B3/B7/B8/B20/B28

WCDMA

B1/B8 900/1800MHz Not supported

B2/B4/B5 Not supported

B1/B8 900/1800MHz

GSM GNSS 2)

GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass, Galileo, QZSS GPS, GLONASS, BeiDou/Compass,

GPS, GLONASS, BeiDou/Compass, Galileo, QZSS

1)

1.

EG91 contains Telematics v er sion and Data-only version. Telematics version supports v oice

and data functions, while Data-only version only supports dat a function.

2)

2.

GNSS function is optional.

EG91_Hardware_Design 12 / 93

LTE Standard Module Series

Supply voltage: 3.3V~4.3V

Support up to non-CA Cat 1 FDD

Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA

EDGE:

EG91 Hardware Design

With a compact profile of 29.0mm × 25.0mm × 2.3mm, EG91 can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc.

EG91 is an SMD type module which can be embedded into applications through its 106 LGA pads.

EG91 is integrated with internet service prot ocols like TCP, UDP and PPP. Extende d AT co mm ands hav e been developed for customers to use these inter net service protocols easily.

2.2. Key Features

The following table descr i bes the detailed features of EG91 module.

Table 2: Key Features of EG91 Module

Feature Details

Power Supply

Typical supply voltage: 3.8V Class 4 (33dBm±2dB) for EGSM900

Class 1 (30dBm±2dB) for DCS1800

Transmitting Power

Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class 3 (24dBm+1/-3dB) f or WCDMA bands Class 3 (23dBm±2dB) for LTE-FDD bands

LTE Features

Support 1.4MHz~20MHz RF bandwidth Support MIMO in DL direction LTE-FDD: Max 10Mbps (DL), Max 5Mbps (UL)

Support QPSK, 16-QAM and 64-QAM modulation

UMTS Features

DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL), Max 384Kbps (UL)

R99:

CSD: 9.6kbps

GPRS:

GSM Features

Support GPRS multi-slot class 33 (33 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Max 107Kbps (DL), Max 85.6Kbps (UL)

EG91_Hardware_Design 13 / 93

EG91 Hardware Design

PSK for different MCS (Modulation and Coding

Max 296Kbps (DL)/Max 2 36.8Kbps (UL)

Support one digital audio interface: PCM interface

Windows 7/8/8.1/10, Windows CE

Main UART:

115200bps baud rate

Internet Protocol Features

SMS

LTE Standard Module Series

Support EDGE multi-slot class 33 (33 by def ault) Support GMSK and 8Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9

Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/CMUX*/HTTPS*/ SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols Support PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) protocols which are usually used for PPP connections

Text and PDU modes Point-to-point MO and MT SMS cell broadcast SMS storage: ME by default

(U)SIM Interfaces Support 1.8V and 3.0V (U)SIM cards

GSM: HR/FR/EFR/AMR/AMR-WB

Audio Features

WCDMA: AMR/AMR-WB L TE: AMR/AM R-WB Support echo cancellation and noise suppression

Used for audio function wit h ex t er nal c odec Support 16-bit linear data format

PCM Interface

Support long frame synchronization and short frame synchronization Support master and slave mode, but must be the master in long frame synchronization

Compliant with USB 2.0 s pecificat ion (slave only ); the data transfer rate can reach up to 480Mbps Used for AT command communication, data transmission, GNSS NMEA

USB Interface

sentences output, software debugging, firmware upgrade and voice over USB* Support USB serial drivers for:

5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x/9.x, etc.

Used for AT command communication and data transmission Baud rates reach up to 921600bps, 115200bps by default

UART Interface

Support RTS and CTS hardware flow control

Debug UART:

Used for Linux console and log output

Rx-diversity Support LTE/WCDMA Rx-diversity

GNSS Features Gen8C Lite of Qualcomm

EG91_Hardware_Design 14 / 93

LTE Standard Module Series

27.005 and Quectel enhanced AT

Weight: approx. 3.8g

NOTES

EG91 Hardware Design

Protocol: NMEA 0183

AT Commands

Compliant with 3GPP TS 27.007, commands

Network Indication NETLIGHT p in for network activity status indication

Antenna Interfaces

Including main antenna interface (ANT_MAIN), Rx-diversity antenna (ANT_DIV) interface and GNSS antenna interface (ANT_GNSS)

1)

Size: (29.0±0.15)mm × (25.0±0.15)mm × (2.3±0.2)mm

Physical Characteristics

Temperature Range

Package: LGA

Operation temperature r ange: -35°C ~ +75°C Extended temperature range: -40°C ~ +85°C

3)

2)

Storage temperature ra nge: -40°C ~ +90°C

Firmware Upgrade USB interface or DFOTA*

RoHS All hardware components are fully compliant with EU RoHS direct ive

1)

1.

GNSS antenna interface is only sup port ed on EG91-NA/-NS/-VX/-EX.

2. 2) Within operation temperature range, the module is 3GPP compliant.

3. 3) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, e mergency call, et c. There is no unrecoverab le malfunction. There are also no effects on radio spectru m and no harm to r adio network. O nly one or more p arameters like P

might reduce in their value and exceed the specified tolerances. When the temperature

out

returns to normal operation temper at ur e levels, the module will meet 3G PP specifications again.

4. “*” means under develop me nt .

2.3. Functional Diagram

The following figure shows a block diagram of EG91 and illustrates the major functional parts.

 Power management  Baseband  DDR+NAND flas h  Radio frequency  Peripheral interfaces

EG91_Hardware_Design 15 / 93

LTE Standard Module Series

Baseband

PMIC

Transceiver

NAND DDR2

SDRAM

PA

PAM

Switch

ANT_MAIN ANT_DIV

VBAT_BB

VBAT_RF

PWRKEY

VDD_EXT

USB PCM UARTI2C

RESET_N

19.2M XO

STATUS

GPIOs

Control

IQ Control

Duplexer

SAW

Tx

PRx DRx

(U)SIM2

SPI

(U)SIM1

SAW

LNA

ANT_GNSS

1)

SAW

GPS

NOTE

EG91 Hardware Design

Figure 1: Functional Diagram

1)

GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX.

2.4. Evaluation Board

Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 module. The evaluation tool kit includes the evaluation board (UMTS<E EVB), USB data cable, earphone, antenna and other peripherals.

EG91_Hardware_Design 16 / 93

LTE Standard Module Series

EG91 Hardware Design

3 Applicat i on Interfaces

3.1. General Description

EG91 is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters:

 Power supply  (U)SIM interfaces  USB interface  UART interfaces  PCM and I2C interfaces  SPI interface  Status indication  USB_BOOT interface

EG91_Hardware_Design 17 / 93

EG91 Hardware Design

NC

PCM_SYNC

PCM_CLK

PCM_DIN

PCM_DOUT

NC NC

PWRKEY

1)

NC

RES ET_N

RES ERVED

1 2 3

4 5 6 7

11 12 13 14 15 16 17 18

50

51

52

53

54

55

58

59

60

61

62

USB_DM

AP_READY

STATUS

NETLIGHT

DBG_RXD

DBG_TXD

ADC0

RES ERVED

SPI_CLK

SPI_MOSI

SPI_MISO

VDD_EXT

DTR

GND

USIM1_CLK USIM1_DATA USIM1_RST USIM1_VDD

RI DCD

CTS TXD

RXD VBAT_BB

VBAT_BB

USIM_GND

GND

31

30

29

28

27

26

23

22

21

20

19

10

9

USB_DP

USB_VBUS

NC

GND

NC NC

RTS

I2C_SCL

I2C_SDA

8

49 48 47 46 45 44 43

40

41

42

39 38 37 36 35 34 33 32

24

57

56

GND

ANT_MAIN

GND

NC

VBAT_RF

GND

NC

GND

USIM1_PRESENCE

63

64

65

66

67

68

83

84

85

86

87

88

98

97

96

95

94

93

78

77

76

75

74

73

91 92

89 90

71

72

69

70

80 79

82

81

100

99

102 101

POWER USB UART

(U)SIM

OTHERS

GND

NC

PCM

ANT

25

USIM2_PRESENCE

USIM2_CLK

USIM2_RST

USIM2_DATA

USIM2_VDD

SPI

USB_BOOT

103

104

105

106

ANT_DIV (EG91-NA/-NS/-VX/-EX)

ANT_GNSS (EG91-NA/-NS/-VX/-EX)

RES ERVED

RES ERVED (Pin 49 on EG91-E)

ANT_DIV (EG91-E)

3.2. Pin Assignment

The following figure shows the pin assi gnment of EG91 module.

LTE Standard Module Series

EG91_Hardware_Design 18 / 93

Figure 2: Pin Assignment (Top View)

LTE Standard Module Series

Table 4

DC Characteristics

NOTES

EG91 Hardware Design

1. 1) PWRKEY output volt age is 0.8V because of the diode drop in the Qualcomm chipset.

2. Keep all RESERVED pins and unused pins unco nnected.

3. GND pads should be connect ed to ground in the design.

4. Definition of pin 49 and 56 are different among EG91-E/-NS/-VX/-EX and EG91-NA. For more details, please refer to

.

3.3. Pin Description

The following tables show the pin definition and description of EG91.

Table 3: IO Parameters Defi ni t ion

Type Description

AI Analog input

AO Analog output

DI Di g ital input DO Digita l output

IO Bidirectional

OD Open drain PI Power input

PO Power output

Table 4: Pin Description

Power Supply

Pin Name Pin No. I/O Description

VBAT_BB 32, 33 PI

EG91_Hardware_Design 19 / 93

Power supply for module’s baseban d part

Vmax=4.3V Vmin=3.3V Vnorm=3.8V

Comment

It must be able to provide sufficient current up to 0.8A.

LTE Standard Module Series

3, 31, 48,

The output voltage is

status

open.

Vnorm=5.0V

open.

EG91 Hardware Design

It must be able to provide sufficient current up to 1.8A in a burst transmission.

VBAT_RF 52, 53 PI

Power supply for module’s RF part

Vmax=4.3V Vmin=3.3V Vnorm=3.8V

Power supply for

VDD_EXT 29 PO

Provide 1.8V for external circuit

Vnorm=1.8V I

max=50mA

O

external GPIO’s pu ll u p circuits. If unused, keep it open.

50, 54, 55, 58, 59, 61,

GND

62, 67~74,

Ground 79~82, 89~91, 100~106

Turn-on/off

Pin Name Pin No. I/O Description DC Characterist i cs Comment

V

max=2.1V

IH

V

min=1.3V

IH

V

max=0.5V

IL

0.8V because of the diode drop in the Qualcomm chipset.

PWRKEY 15 DI

Turn on/off the module

Pull-up to 1.8V

RESET_N 17 DI

Reset signal of the module

V

max=2.1V

IH

V

min=1.3V

IH

V

max=0.5V

IL

internally. Active low. If unused, keep it open.

Status Indication

Pin Name Pin No. I/O Description DC Characterist i cs Comment

1.8V power domain. If unused, keep it

1.8V power domain. If unused, keep it open.

STATUS 20 DO

NETLIGHT 21 DO

Indicate the module’s operating

Indicate the module’s network activity status

VOHmin=1.35V V

max=0.45V

OL

V

min=1.35V

OH

V

max=0.45V

OL

USB Interface

Pin Name Pin No. I/O Description DC Characterist i cs Comment

USB_VBUS 8 PI

EG91_Hardware_Design 20 / 93

USB connection detection

Vmax=5.25V Vmin=3.0V

Typical: 5.0V If unused, keep it

LTE Standard Module Series

specification.

connector.

IOmax=50mA

VOHmin=2.55V

EG91 Hardware Design

Compliant with USB

2.0 standard

Compliant with USB

2.0 standard specification.

Require differenti al impedance of 90Ω.

USB_DP 9 IO

USB_DM 10 IO

USB diffe rential data bus (+)

USB diffe rential data bus (-)

(U)SIM Interfaces

Pin Name Pin No. I/O Description DC Char acteristics Comment

Connect to ground of (U)SIM card

USIM_GND 47

Specified ground for (U)SIM card

For 1.8V (U)SIM:

Vmax=1.9V Vmin=1.7V

USIM1_VDD 43 PO

Power supply for (U)SIM card

For 3.0V (U)SIM:

Vmax=3.05V

Either 1.8V or 3.0V is supported by the module automatically.

Vmin=2.7V

USIM1_DATA 45 IO

USIM1_CLK 46 DO

Data signal of (U)SIM card

Clock signal of (U)SIM card

For 1.8V (U)SIM:

V

max=0.6V

IL

V

min=1.2V

IH

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V (U)SIM:

max=1.0V

V

IL

V

min=1.95V

IH

V

max=0.45V

OL

V

min=2.55V

OH

For 1.8V (U)SIM:

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V (U)SIM:

max=0.45V

V

OL

EG91_Hardware_Design 21 / 93

EG91 Hardware Design

USIM1_RST 44 DO

USIM1_ PRESENCE

42 DI

USIM2_VDD 87 PO

USIM2_DATA 86 IO

USIM2_CLK 84 DO

USIM2_RST 85 DO

Reset signal of (U)SIM card

(U)SIM card insertion detection

Power supply for (U)SIM card

Data signal of (U)SIM card

Clock signal of (U)SIM card

Reset signal of (U)SIM card

LTE Standard Module Series

For 1.8V (U)SIM:

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V (U)SIM:

max=0.45V

V

OL

V

min=2.55V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

For 1.8V (U)SIM: Vmax=1.9V Vmin=1.7V

For 3.0V (U)SIM: Vmax=3.05V Vmin=2.7V

I

max=50mA

O

For 1.8V (U)SIM: V

max=0.6V

IL

V

min=1.2V

IH

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V (U)SIM:

max=1.0V

V

IL

V

min=1.95V

IH

V

max=0.45V

OL

V

min=2.55V

OH

For 1.8V (U)SIM: V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V (U)SIM:

max=0.45V

V

OL

V

min=2.55V

OH

For 1.8V (U)SIM: V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V (U)SIM:

max=0.45V

V

OL

1.8V power domain. If unused, keep it open.

Either 1.8V or 3.0V is supported by the module automatically.

EG91_Hardware_Design 22 / 93

LTE Standard Module Series

open.

VIHmax=2.0V

EG91 Hardware Design

VOHmin=2.55V

V

min=-0.3V USIM2_ PRESENCE

83 DI

(U)SIM card insertion detection

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain. If unused, keep it open.

Main UART Interface

Pin Name Pin No. I/O Description DC Characterist i cs Comment

RI 39 DO Ring indicator

DCD 38 DO

Data carrier detection

CTS 36 DO Clear to send

RTS 37 DI Request t o send

DTR 30 DI

Data terminal ready. Sleep mode control.

V

max=0.45V

OL

V

min=1.35V

OH

V

max=0.45V

OL

V

min=1.35V

OH

V

max=0.45V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain. If unused, keep it open.

1.8V power domain. If unused, keep it

1.8V power domain. If unused, keep it open.

1.8V power domain. Pull-up by default. Low level wakes up the module. If unused, keep it open.

TXD 35 DO Transmit data

RXD 34 DI Receive data

Debug UART Int er face

Pin Name Pin No. I/O Description DC Characterist i cs Comment

DBG_TXD 23 DO Transmit data

EG91_Hardware_Design 23 / 93

V

max=0.45V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

V

max=0.45V

OL

V

min=1.35V

OH

1.8V power domain. If unused, keep it open.

1.8V power domain. If unused, keep it

LTE Standard Module Series

VIHmax=2.0V

open.

EG91 Hardware Design

open.

V

min=-0.3V DBG_RXD 22 DI Receive data

IL

V

max=0.6V

IL

V

min=1.2V

IH

1.8V power domain. If unused, keep it open.

PCM Interface

Pin Name Pin No. I/O Description DC Characterist i cs Comment

V

min=-0.3V PCM_DIN 6 DI PCM data input

IL

V

max=0.6V

IL

V

min=1.2V

IH

1.8V power domain. If unused, keep it open.

PCM_ DOUT

7 DO PCM data output

PCM data frame

PCM_SYNC 5 IO

synchronization signal

PCM_CLK 4 IO PCM clock

I2C Interface

V

max=0.45V

OL

V

min=1.35V

OH

max=0.45V

V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

max=0.45V

V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain. If unused, keep it open.

1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it

Pin Name Pin No. I/O Description DC Characteristics Comment

I2C_SCL 40 OD

I2C_SDA 41 OD

EG91_Hardware_Design 24 / 93

I2C serial clock. Used for external codec

I2C serial data. Used for external codec

An external pull-up resistor is required.

1.8V only. If unused, keep it

An external pull-up resistor is required.

1.8V only. If unused, keep it open.

LTE Standard Module Series

open.

56 50Ω impedance.

open.

EG91 Hardware Design

ADC Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

ADC0 24 AI

General purpose analog to digital converter

Volta ge r ange:

0.3V to VBAT_BB

If unused, keep it open.

SPI Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain. If unused, keep it

1.8V power domain. If unused, keep it open.

SPI_CLK 26 DO

SPI_MOSI 27 DO

SPI_MISO 28 DI

Clock signal of SPI interface

Master output slave input of SPI interface

Master input slave output of SPI interface

V

max=0.45V

OL

V

min=1.35V

OH

V

max=0.45V

OL

V

min=1.35V

OH

V

min=-0.3V

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

RF Interfaces

Pin Name Pin No. I/O Description DC Characteristics Comment

50Ω impedance. If unused, keep it open. The pin is defined as ANT_DIV on

ANT_GNSS

49 (EG91NA/-NS/

-VX/-EX)

AI GNSS antenna pad

EG91-E.

49

ANT_DIV

(EG91E)

(EG91NA/-NS/

AI

Receive diversity antenna pad

50Ω impedance. If unused, keep it open. The pin is reserved on EG91-E.

-VX/-EX)

ANT_MAIN 60 IO Main antenna pad

If unused, keep it

Other Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

EG91_Hardware_Design 25 / 93

LTE Standard Module Series

to send and receive data.

decided by network setting and data transfer rate.

command can set the module to a minimum functionality mode without

enter into

NOTE

EG91 Hardware Design

V

min=-0.3V AP_READY 19 DI

USB_BOOT 75 DI

Application processor sleep state detection

Force the module to

emergency download mode

IL

V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

VILmin=-0.3V V

max=0.6V

IL

V

min=1.2V

IH

V

max=2.0V

IH

1.8V power domain. If unused, keep it open.

1.8V power domain. It is recommended to reserve the test points.

RESERVED Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

1,2, 11~14,

NC

16, 51, 57, 63~66, 76~78,

NC

Keep these pins unconnected.

88, 92~99

Keep these pins

RESERVED 18, 25, 49 Reserved

unconnected. Pin 49 is only reserved on EG91-E.

Keep all RESERVED pins and unused pins unconn ect ed.

3.4. Operating Modes

The table below briefly su m m ar iz es the various operating modes re ferr ed in the following chapters.

Table 5: Overview of Operating Modes

Mode Details

Idle

Software is active. The mo dule has registered on network, and it is ready Normal Operation

Talk/Data

Minimum Functionality

EG91_Hardware_Design 26 / 93

AT+CFUN

removing the power supp ly. In this case, bot h RF funct ion and (U)SIM card will be invalid.

Network connection is ongoing. In this mode, the power consumption is

Mode

In this mode, the current consu m ption of the module will be reduced to the minimal level.

TCP/UDP data from the network normally.

RXD TXD

RI

DTR

AP_READY

TXD RXD

EINT GPIO GPIO

Module

Host

GND

LTE Standard Module Series

EG91 Hardware Design

Airplane Mode

Sleep Mode

Power Down Mode

AT+CFUN command or W_DISABLE# pin can set the module to enter into airplane mode. In this case, RF function will be invalid.

During this mode, the module can still receive paging message, SMS, voice call and

In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains a ppl ied.

3.5. Power Saving

3.5.1. Sleep Mode

EG91 is able to reduce its current consumption to a mini mu m v alue during the sleep mode. The following sub-chapters describe the pow er saving procedures of EG91 module.

3.5.1.1. UART Application

If the host communicates with the module via UART interface, the following preconditions can let the module enter into sleep mode.

 Execute AT+QSCLK=1 command to enable sleep mode.  Drive DTR to high level.

The following figure shows the connection between the module and the host.

Figure 3: Sleep Mode Application via UART

Driving the host DTR to low level will wake up the m odule.

EG91_Hardware_Design 27 / 93

LTE Standard Module Series

USB_VBUS

USB_DP

USB_DM

AP_READY

VDD USB_DP USB_DM

GPIO

Module

Host

GND

NOTE

EG91 Hardware Design

 When EG91 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for

details about RI behavior.

 AP_READY will detec t t he sleep state of host (can be configured to high level or low l evel detection).

Please refer to AT+QCFG="apready"* command for details.

“*” means under develop me nt .

3.5.1.2. USB Application with USB Rem ot e Wake up Fu n cti on

If the ho st support s USB s uspend/resu me and r emote w akeup functions, the following three preconditions must be met to let the module enter into sleep mod e.

 Execute AT+QSCLK=1 command to enable sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the m odule’s USB interface, enters into su spend state.

The following figure shows the connection between the module and the host.

Figure 4: Sleep Mode Appli cat i on with USB Remote Wakeup

 Sending data to EG91 through USB will wake up the module.  When EG91 has a URC to report, the module will send remote wakeup signals via USB bus so as to

wake up the host.

3.5.1.3. USB Application with USB Suspend/Re sum e and RI Function

If the host supports USB suspend/resume, but does not support remote wakeup function, the RI signal is needed to wake up the host.

There are three preconditions to let the module enter into the sleep mod e.

EG91_Hardware_Design 28 / 93

Quectel Wireless Solutions 201907EG91VX Users Manual

About the Document

Contents

Table Index

Figure Index

1 Introduction

1.1. Safety Information

2 Product C oncept

2.1. General Description

2.2. Key Features

2.3. Functional Diagram

2.4. Evaluation Board

3 Applicat i on Interfaces

3.1. General Description

3.2. Pin Assignment

3.3. Pin Description

3.4. Operating Modes

3.5. Power Saving

3.5.1. Sleep Mode

3.5.1.1. UART Application

3.5.1.2. USB Application with USB Rem ot e Wake up Fu n cti on

3.5.1.3. USB Application with USB Suspend/Re sum e and RI Function