Philips IP4281CZ10 Datasheet

IP4281CZ10

ESD protection for high-speed interfaces

Rev. 01 — 25 September 2008

Product data sheet

1.Product profile

1.1General description

The IP4281CZ10 is designed for HDMI interface protection. The device includes high-level ElectroStatic Discharge (ESD) protection diodes for the TMDS signal lines.

All TMDS intra-pairs are protected by a special diode configuration offering a low line capacitance of only 0.7 pF. These diodes provide protection to downstream components from ESD voltages up to ±8 kV contact according to IEC 61000-4-2, level 4.

1.2 Features

nPb-free, RoHS compliant and free of Halogen and Antimony (dark green compliant)

nESD protection for HDMI and other LVDS data lines

nAll TMDS lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±8 kV according to IEC61000-4-2, level 4

nMatched 0.5 mm trace spacing

nTMDS lines with ≤ 0.05 pF matching capacitance between TMDS pairs

nLine capacitance of only 0.7 pF for each channel

n4-channel, 10-terminal Ultra-Thin Leadless Package (UTLP)

nHDMI 1.3a compliant

1.3Applications

The IP4281CZ10 is designed for HDMI receiver and transmitter port protection:

nTV, monitor

nNotebook, main board graphics card and ports

nSet-top box and game consoles

nDVD recorder and player

NXP Semiconductors				IP4281CZ10
			ESD protection for high-speed interfaces
2.	Pinning information
Table 1. Pinning
Pin	Symbol	Description	Simplified outline	Graphic symbol
1	TMDS_CH1− negative channel 1 ESD protection

2	TMDS_CH1+	positive channel 1 ESD protection
3	GND	GND
4	TMDS_CH2−	negative channel 2 ESD protection
5	TMDS_CH2+	positive channel 2 ESD protection
6	n.c.	not connected
7	n.c.	not connected
8	GND	GND
9	n.c.	not connected
10	n.c.	not connected

110

29

38

47

56

1	2	4	5
	3, 8	001aai619

Transparent top view

3. Ordering information

Table 2. Ordering information

Type number	Package
	Name	Description	Version
IP4281CZ10	XSON10U	plastic extremely thin small outline package; no leads;	SOT1059-1
		10 terminals; UTLP based; body 1 × 2.5 × 0.5 mm

4. Limiting values

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol	Parameter	Conditions	Min	Max	Unit
VI	input voltage		GND − 0.5	+3.63	V
Vesd	electrostatic discharge	all pins to ground;
	voltage	IEC 61000-4-2, level 4
		contact	−8	+8	kV
		air discharge	−15	+15	kV
Tstg	storage temperature		−55	+125	°C

5. Recommended operating conditions

Table 4.	Operating conditions
Symbol	Parameter	Conditions	Min	Max	Unit
Tamb	ambient temperature		−40	+85	°C

IP4281CZ10_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 25 September 2008

2 of 8

NXP Semiconductors					IP4281CZ10
				ESD protection for high-speed interfaces
6. Characteristics
Table 5.	Characteristics
Symbol	Parameter	Conditions					Min	Typ	Max	Unit
VBRzd	Zener diode breakdown voltage	I = 1 mA					6	-	9	V
ILRzd	Zener diode reverse leakage current	per TMDS channel; V = 3.0 V					-	-	1	μA
VF	forward voltage						-	0.7	-	V
Cch(TMDS)	TMDS channel capacitance	f = 1 MHz; Vbias = 2.5 V			[1]		-	0.7	-	pF
C	TMDS channel capacitance difference	f = 1 MHz; V	bias	= 2.5 V	[1]		-	0.05	-	pF
ch(TMDS)
Cch(mutual)	mutual channel capacitance	between signal pin and pin n.c.;			[1]		-	0.07	-	pF
		f = 1 MHz; Vbias = 2.5 V
Rdyn	dynamic resistance	I = 1 A, Tamb = 25 °C; IEC 61000-4-5/9
		positive transient					-	2.4	-	Ω
		negative transient					-	1.3	-	Ω
VCL(ch)trt(pos) positive transient channel clamping		Vesd = 8 kV HBM; Tamb = 25 °C					-	8	-	V
	voltage

[1]This parameter is guaranteed by design.

IP4281CZ10_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 25 September 2008

3 of 8