PDM41258
2 Rev. 2.2 - 4/27/98
Absolute Maximum Ratings
(1)
NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability
.2. Appropriate thermal calculations should be performed in all cases and specifically for
those where the chosen package has a large thermal resistance (e.g., TSOP). The
calculation should be of the form
: T
j
= T
a
+ P * θ
ja
, where T
a
is the ambient tempera-
ture, P is average oper ating po w er and θ
ja
the thermal resistance of the package. For
this product, use the following θ
ja
value:
SOJ: 83
o
C/W
Symbol Rating Com’l. Ind. Unit
T
TERM
Terminal Voltage with Respect to V
SS
–0.5 to +7.0 –0.5 to +7.0
°
C
T
BIAS
Temperature Under Bias –55 to +125 –65 to +135
°
C
T
STG
Storage Temperature –55 to +125 –65 to +150
°
C
P
T
Power Dissipation 1.0 1.0 W
I
OUT
DC Output Current 50 50 mA
T
j
Maximum Junction Temperature
(2)
125 145
°
C
1
2
3
4
5
6
7
8
9
10
11
12 13
14
15
16
17
18
19
20
21
22
23
24
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
CE
Vss
Vcc
A15
A14
A13
A12
A11
A10
I/O3
I/O2
I/O1
I/O0
WE
Pin Configuration
SOJ
Pin Description
Name Description
A15-A0 Address Inputs
I/O3-I/O0 Data Inputs and Outputs
WE
Write Enable Input
CE
Chip Enable Input
V
CC
Power (+5V)
V
SS
Ground
T ruth T able
NOTE:1.H = V
IH
, L = V
IL
, X = DON’T CARE
WE CE I/O MODE
X H Hi-Z Standby
HLD
OUT
Read
LLD
IN
Write