Panasonic TY-TP42P8-S, TY-TP50P8-S, TY-TPEN6 Service Manual

Optic Touch Panel
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TY-TP42P8-S TY-TP50P8-S
TY-TPEN6 (Option)
ORDER NO. ITD0510062CE
D18
Specifications
Power Source
Touch Panel
Detection system Infrared obstruction detection system Panel window (W × H) 945.2 mm × 531.2 mm (37.2” × 20.9”)
(TY-TP42P8-S)
Detection range (W × H) 920 mm × 516 mm (36.2” × 20.3”)
(TY-TP42P8-S) Effective detection range Detection range + 1.0 mm (0.04”) at the top, bottom, left and right Operating modes Detection operation at input point, during initial movement and at end point *1 Resolution (W × H) 1,841 × 1,033 *1 (TY-TP42P8-S) 2,209 × 1,241 *1 (TY-TP50P8-S) Detection pitch 2.0 mm × 2.0 mm (0.08” × 0.08”) Output system Coordinate output Number of optic elements (W × H) 231 × 130 elements (TY-TP42P8-S) 277 × 156 elements (TY-TP50P8-S) Optic element pitch (W × H) 4.0 mm × 4.0 mm (0.16” × 0.16”)
1129.2 mm × 645.2 mm (44.4” × 25.4”) (TY-TP50P8-S) 1104 mm × 620 mm (43.4” × 24.4”) (TY-TP50P8-S)
© 2005 Matsushita Electric Industrial Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law.
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TY-TP42P8-S / TY-TP50P8-S
Minimum stylus size (W × H) 6.0 mm × 6.0 mm (0.24” × 0.24”) Scan speed Initial touch: 30 ms/frame max.; during movement: 8 ms/frame max. Touch pen Infrared system
USB Interface (USB 1.1) Terminal No. and Signal name
(TYPE B) No.1 Vcc No.2 -DATA No.3 +DATA No.4 GND
Temperature When operating 0°C (32°F) to 50°C (122°F) (temperature gradient 25°C (77°F)/hrmax.) *2
When not operating: -20°C (-4°F) to 60° (140°F) temperature gradient 25°C (77°F)/hr max.
Humidit
Resistance to extraneous ligh
Panel form Flat panel (Flat type) External dimensions (W×H×T) 1,073 mm × 659 mm × 69 mm
Weigh
Extruded material
When operating: 20% to 85% (must be no condensation) *2 When not operating: 10% to 95% Lateral light: 2,000 lux MIN +20% (angle of incidence: 20°) Frontal light: 10,000 lux MIN +20% (angle of incidence: 90°)
1,257 mm × 773 mm × 69 mm (42.2” × 25.9” × 2.7”) (Excluding mounting brackets) (TY-TP42P8-S)
5.0 kg (11 lbs) Excluding mounting brackets (TY-TP42P8-S)
luminum
(49.5” × 30.4” × 2.7”)
(Excluding mounting brackets)
(TY-TP50P8-S)
5.8 kg (12.7 lbs) Excluding mounting brackets
(TY-TP50P8-S)
Notes:
*1*2When it is used with exclusive driver software.
This applies to the touch panel alone. When the panel is attached to a device such as a PDP, follow the environmental conditions for the device being used.
CONTENTS
Page Page
1 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 2 About lead free solder (PbF) 3 External dimensions 4 Setup for Touch Panel 5 Touch Pen (Option) 6 Printed Circuit Board Structure
6.1. TY-TP42P8-S
6.2. TY-TP50P8-S
7 Trouble shooting
7.1. Checking procedures
7.2. Test Program
8 Conductor Views
8.1. X-Photo1, X-Photo2, Y-Photo1 Board (42inch)
8.2. X-Photo1, X-Photo2, X-Photo3, Y-Photo1, Y-Photo2 Board (50inch)
8.3. X-Photo3 Board (42inch)
8.4. X-Photo4 Board (50inch)
8.5. Y-Photo2 Board (42inch)
8.6. X-LED1, X-LED2, Y-LED1 Board (42inch)
4 5 6
7 21 22
22 23
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36 37 38 39 40
8.7. X-LED1, X-LED2, X-LED3, Y-LED1, Y-LED2 Board (50inch)
8.8. X-LED3 Board (42inch)
8.9. X-LED4 Board (50inch)
8.10. Y-LED2 Board (42inch)
8.11. Controller Board (42inch)
8.12. Controller Board (50inch)
8.13. Pen-Receive Board (42inch)
8.14. Pen-Receive Board (50inch)
9 Block Diagram
9.1. Overall Block Diagram (TY-TP42P8-S)
9.2. Overall Block Diagram (TY-TP50P8-S)
9.3. Detail Block Diagram (1 of 3)
9.4. Detail Block Diagram (2 of 3)
9.5. Detail Block Diagram (3 of 3)
10 Schematic Diagram
10.1. Controller Board Schematic Diagram
10.2. X-Photo 1 Board Schematic Diagram
10.3. X-Photo 2 Board Schematic Diagram
10.4. X-Photo 3 Board Schematic Diagram
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49 50 51 52 53
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10.5. X-Photo 4 Board Schematic Diagram (TY-TP50P8-S) 59
10.6. X-LED 1 Board and Pen Receive Board Schematic Diagram
10.7. X-LED 2 Board Board Schematic Diagram
10.8. X-LED 3 Board Board Schematic Diagram
60 61 62
10.9. X-LED 4 Board Board Schematic Diagram (TY-TP50P8-S)
10.10. Y-Photo 1 Board Schematic Diagram
10.11. Y-Photo 2 Board Schematic Diagram
10.12. Y-LED 1 Board Schematic Diagram
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10.13. Y-LED 2 Board Schematic Diagram 67
11 Exploded View
11.1. TY-TP42P8-S
11.2. TY-TP50P8-S
12 Replacement Parts List
12.1. Replacement Parts List Notes
12.2. TY-TP42P8-S Mechanical Replacement parts List
12.3. TY-TP42P8-S Electrical Replacement parts List
12.4. TY-TP50P8-S Mechanical Replacement parts List
12.5. TY-TP50P8-S Electrical Replacement parts List
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69 71
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73 74 75 84 85
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1 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
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2 About lead free solder (PbF)

Note:
Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it´s manufacture due to environmental conservation issues. For service and repair work, we´d suggest the use of Pb free solder as well, although Pb solder may be used.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
0.3mm x 100g 0.6mm x 100g 1.0mm x 100g
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3 External dimensions

TY-TP42P8-S
TY-TP50P8-S
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4 Setup for Touch Panel

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5 Touch Pen (Option)

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6 Printed Circuit Board Structure

6.1. TY-TP42P8-S

Board Name Board Number Function CONTROLLER G441-K1TD11 PEN-RECEIVE G441-K1TD12 Touch Pen Remote Receiver Y-LED 1 G441-K1TD07 IR Emitter to Y-PHOTO 1 Y-LED 2 G441-K1TD06 IR Emitter to Y-PHOTO 2 X-LED 1 G441-K1TD08 IR Emitter to X-PHOTO 1 X-LED 2 G441-K1TD09 IR Emitter to X-PHOTO 2 X-LED 3 G441-K1TD10 IR Emitter to X-PHOTO 3 Y-PHOTO 1 G441-K1TD01 IR Receiver from Y-LED 1 Y-PHOTO 2 G441-K1TD02 IR Receiver from Y-LED 2 X-PHOTO 1 G441-K1TD05 IR Receiver from X-LED 1 X-PHOTO 2 G441-K1TD04 IR Receiver from X-LED 2 X-PHOTO 3 G441-K1TD03 IR Receiver from X-LED 3
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6.2. TY-TP50P8-S

Board Name Board Number Function CONTROLLER G541-K1TD13 PEN-RECEIVE G541-K1TD14 Touch Pen Remote Receiver Y-LED 1 G541-K1TD08 IR Emitter to Y-PHOTO 1 Y-LED 2 G541-K1TD07 IR Emitter to Y-PHOTO 2 X-LED 1 G541-K1TD09 IR Emitter to X-PHOTO 1 X-LED 2 G541-K1TD10 IR Emitter to X-PHOTO 2 X-LED 3 G541-K1TD11 IR Emitter to X-PHOTO 3 X-LED 4 G541-K1TD12 IR Emitter to X-PHOTO 4 Y-PHOTO 1 G541-K1TD01 IR Receiver from Y-LED 1 Y-PHOTO 2 G541-K1TD02 IR Receiver from Y-LED 2 X-PHOTO 1 G541-K1TD06 IR Receiver from X-LED 1 X-PHOTO 2 G541-K1TD05 IR Receiver from X-LED 2 X-PHOTO 3 G541-K1TD04 IR Receiver from X-LED 3 X-PHOTO 4 G541-K1TD03 IR Receiver from X-LED 4
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7 Trouble shooting

7.1. Checking procedures

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7.2. Test Program

7.2.1. Function
Touch Panel Test Program is software to check operating status. Touch Panel detects the location by cutting off the infrared ray from IR LEDs to phototransistors. This program checks each line of infrared ray and finds out the location of defective IR LED and phototransistor.
7.2.2. Installation
There are 2 test programs. Program name “testTP42P8” is for TY-TP42P8-S, “testTP50P8” is for TY-TP50P8-S. The installation program consists of following 4 files under one folder. The folder name is the same as test program, “testTP42P8”
or “testTP50P8”.
Run the ”Setup.exe” and follow the instructions. The test program “testTP50P8” or “testTP42P8” will be installed to your PC.
NOTES:
To Uninstall, delete “testTP50P8” or “testTP42P8” from the “Add/Remove Programs” of Control Panel.
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7.2.3. Set up
1. Check COM port number of Touch Panel from the menu of Touch Panel Setting Program(see Figure8.1. of Trouble Shooting) or Device Manager of Windows(See the “Installation of the USB driver” of operating instruction).
The COM port number is necessary to set for this test program(see 8.2.4-2. COM port setting).
2. Change resolution of the PC monitor to higher than XGA(1024 x 768).
3. End the Touch Panel driver program by following procedure. Press CTRL+ALT+DELETE to start Task Manager. Click the Applications tab, click the programs of “tpmenu” and “tpdrv”, and
then click End Task(This test program cannot be used while Touch Panel driver is running). Below is the example of Windows XP.
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7.2.4. Operational Procedures
1. Start the Test Program Click icon of “testTP42P8” or “testTP50P8” on start menu, then following window appears. Below is an example window for “testTP42P8” or “testTP50P8”.
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2. COM port setting Set the same COM port number of Touch panel(see 7.2.3.-1) into column (A).
3. Self Test Self test is to check the operating condition of each IR LED and Phototransistor. Click “Self Test” button (B) for initialization, and click (B) again. Then self test starts. The result is shown in the textbox (C)
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