Panasonic SA-HT330GCT, SA-HT330GCP Diagram

ORDER NO. MD0507281C3

DVD Home Theater Sound System

SA-HT330GCT SA-HT330GCP

Colour

(S)... Silver Type

Specification

n Amplifier Section

RMS Output power : Dolby Digital Mode

Front Ch 65 W per channel (6 Ω ), 1 kHz,

10% THD

Surround Ch 65 W per channel (6 Ω ), 1 kHz,

10% THD

Center Ch 65 W per channel (6 Ω ), 1 kHz,

10% THD

Subwoofer Ch 75 W per channel (4 Ω ), 100 Hz,

10% THD

Total RMS Dolby Digital mode power

PMPO output power 3500 W

DIN Output Power : Dolby Digital Mode

Front Ch 55 W per channel (6 Ω ), 1 kHz,

Surround Ch 55 W per channel (6 Ω ), 1 kHz,

Center Ch 55 W per channel (6 Ω ), 1 kHz,

Subwoofer Ch 65 W per channel (4 Ω ), 100 Hz,

Total DIN Dolby Digital mode power

n FM/AM Tuner, Terminals Section

Preset station FM 15 stations

400 W

1% THD

340 W

AM/MW 15 stations

Frequency Modulation (FM)

Frequency range 87.50 - 108.00 MHz (50-kHz step)

Sensitivity 2.5 µV (IHF)

S/N 26 dB 2.2 µV

ntenna terminals 75 Ω (unbalance)

mplitude Modulation (AM/MW)

Frequency range 522 - 1629 kHz (9 - kHz step)

520 - 1630 kHz (10 - kHz step)

M Sensitivity S/N 20 dB at 999

kHz

Phone jack

Terminal Stereo, 3.5 mm jack

Mic jack

Sensitivity 0.7mV, 1.2k Ω

Terminal Mono, 6.3mm (1 system)

n Disc Section

Discs played ( 8 cm or 12 cm)

(1) DVD-RAM (DVD-VR compatible, JPEG formatted discs)

(2) DVD-Audio

(3) DVD-Video

(4) DVD-R, DVD-RW (DVD-Video compatible) +R, +RW (video compatible)

(5) CD-Audio (CD-DA)

(6) Video CD

(7) SVCD (Conforming to IEC62107)

560 µV/m

SA-HT330GCT / SA-HT330 GCP

(8) CD-R/RW (CD-DA, Video-CD, SVCD, MP3, WMA, JPEG formatted disc)

(9) MP3/WMA

l Compatible compression rate: MP3 : between 32 kbps and 320 kbps WMA : between 48 kbps and 320 kbps

(10) JPEG

l Exif Ver 2.1 JPEG Baseline files

l Picture resolution : between 320 x 240 and 6144 x 4096 pixels (sub

sampling is 4:2:2 or 4:2:0)

(11) HighMAT Level 2 (Audio and Image)

*1The total combined maximum number of recognizable audio and picture contents and groups: 4000 audio and picture contents and 400 groups.

Pick up

Wavelength CD 785 nm

DVD 662 nm

Laser power CLASS 2 / CLASS 3A

udio output (Disc)

Number of channels 5.1ch (FL, FR, C, SL, SR, SW)

n Video Section

Video system

Signal system (For GCT) PAL625/50, PAL525/60, NTSC

Signal system (For GCP) NTSC

Composite video output

Output level 1Vp-p(75Ω)

Terminal Pin jack (1 system)

S-video output

Y output level 1Vp-p(75Ω)

C output level (For GCT) PAL; 0.3 Vp-p (75 Ω )

NTSC; 0.286 Vp-p (75 Ω )

C output level (For GCP) NTSC; 0.286 Vp-p (75 Ω )

Terminal S terminal (1 system)

Component video output (For GCT)

[NTSC: 525 (480) p/525 (480) i, PAL: 625 (576) p/625 (576) i]

Component video output (For GCP)

(480p/480i)

Y output level 1Vp-p(75Ω)

PBoutput level 0.7 Vp-p (75 Ω)

PRoutput level 0.7 Vp-p (75 Ω )

Terminal Pin jack (Y: green, PB:blue,

:red)(1system)

n General

Power supply AC 110 - 240 V, 50/60 Hz

Power consumption Main unit 80 W

Dimensions (W x H x D) 430 mm x 60 mm x 337 mm

Mass Main unit 3.3 kg

Operating temperature range +5 °C to +35 °C

Operating humidity range 5%to90%RH(no

condensation)

Power consumption in standby

approx 0.5 W

mode

SB-HT335EG consists of SB-FS335E G (x4) & SB-PC335EG (x1)

Notes :

1. Specifications are subject to change without notices. Mass and dimensions are approximate.

2. Total harmonic distortion is measured by the digital spectrum analyzer.

CONTENTS

Page Page

1 Safety Precautions

1.1. GENERAL GUIDELINES

2 Before Repair and Adjustment

3 Protection Circuitry

4 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

5 Handling the Lead-free Solder

5.1. About lead free solder (PbF)

6 Precaution of Laser Diode

7 Handling Precautions for Optical Pickup Unit

7.1. Cautions to be taken in handling the Optical Pickup Unit

7.2. Cautions to be taken when replacing the Optical Pickup

Unit

7.3. Grounding for electrostatic breakdown prevention

8 Accessories

9 Operation Procedures

10 Disc information

11 About HighMAT

11.1. What's HighMAT?

11.2. Why take advantage of HighMAT?

11.3. Benefits of HighMAT?

12 Assembling and Disassembling

12.1. Disassembly flow chart

12.2. P.C.B. Locations

12.3. Disassembly of Top Cabinet

12.4. Disassembly of SMPS Module P.C.B.

SA-HT330GCT / SA-HT330 GCP

12.5. Disassembly of Rear Panel 20

12.6. Disassembly of AC Inlet P.C.B.

12.7. Disassembly of Digital Amplifier P.C.B.

12.8. Disassembly of DVD Lid (when taking out disc manually)

12.9. Disassembly of Front Panel

12.10. Disassembly of Headphone, Panel and Tact Switch P.C.B.

12.11. Disassembly of DVD Mechanism unit

12.12. Disassembly of Main P.C.B.

12.13. Disassembly and Assembly Mechanism Unit

13 Service Positions

13.1. Checking procedure

14 Optical Pick-up Self-Diagnosis and Replacement Procedure

14.1. Optical Pickup Breakdown Diagnosis

14.2. Service Mode Table 1

14.3. DVD Self Diagnostic Function-Error Code

14.4. Service mode table 2

14.5. Sales demonstration lock function

14.6. Handling after completing repairs

15 Self-Diagnosis Function

15.1. Automatic Displayed Error Codes

15.2. Memorized Error Codes

16 Service Precautions

16.1. Recovery after the DVD player is repaired

16.2. Firmware version-up of the DVD player

17 Adjustment Procedure

17.1. Service Tools and Equipment

17.2. Important points in adjustment

17.3. Storing and handling Test Discs

17.4. Optical adjustment

18 Abbreviati ons

19 Voltage Measurement and Waveform Chart

19.1. Voltage Measurement

19.2. Waveform Chart

20 Block Diagram

20.1. DVD MODULE BLOCK

20.2. MAIN BLOCK

21 Notes of Schematic Diagram

22 Schematic Diagram

22.1. OPTICAL PICKUP UNIT CIRCUIT

22.2. DVD MODULE CIRCUIT

22.3. MAIN CIRCUIT

22.4. PANEL CIRCUIT

22.5. SMPS MODULE CIRCUIT and AC INLET CIRCUIT

22.6. DIGITAL AMPLIFIER CIRCUIT

22.7. HEADPHONE CIRCUIT, TACT SWITCH CIRCUIT and CD

TRAY LOADING CIRCUIT

23 Printed Circuit Board

23.1. DVD MODULE P.C.B

23.2. MAIN P.C.B

23.3. PANEL P.C.B, HEADPHONE P.C.B and TACT SWITCH

P.C.B

23.4. DIGITAL AMPLIFIER P.C.B

23.5. CD TRAY LOADING P.C.B and AC INLET P.C.B

24 Wiring Connection Diagram

25 Illustration of IC's, Transistor s and Diodes

26 Terminal Function of IC's

26.1. IC2018 (C2CBHG000197): MICROPROCESSOR IC

27 Parts Location and Replacement Parts List

27.1. DVD Loading Mechanisms

27.2. Cabinet Part List

27.3. Electrical Part List

27.4. Packaging Materials & Accessories Parts List

27.5. Packaging

100

102

105

115

SA-HT330GCT / SA-HT330 GCP

1 Safety Precautions

1.1. GENERAL GUIDELINES

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENT COLD CHECK

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MΩ and 5.2Ω. When the exposed metal does not have a return path to the chassis, the reading must be

Fig. 1

1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. Should the measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned to the customer.

SA-HT330GCT / SA-HT330 GCP

2 Before Repair and Adjustment

Disconnect AC power, discharge Power Supply Capacitors C506, C507 & C508 through a 10Ω, 1W resistor to ground.

DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.

After repairs are completed, restore power gradually using a variac, to avoid overcurrent.

· Current consumption at AC 110 V - 240 V, 50/60 Hz in NO SIGNAL mode (at volume min) should be approximately ~650 mA.

3 Protection Circuitry

The protection circuitry may have operated if either of the following conditions are noticed:

· No sound is heard when the power is turned on.

· Sound stops during a performance.

The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speake r connection wires are "shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.

If this occurs, follow the procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once again after one minute.

Note:

When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

SA-HT330GCT / SA-HT330 GCP

4 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your body by touchin g a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can generate electrical charge to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

5 Handling the Lead-free Solder

5.1. About lead free solder (PbF)

Distinction of PbF P.C.B.:

P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.

Caution:

· Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher. Please use a high temperature soldering iron. In case of soldering iron with temperature control, please set it to 700 ± 20°F (370 ± 10°C).

· Pb free solder will tend to splash when heated too high (about 1100°F/600°C).

· W hen soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat the

soldering points with the Pb free solder until it melts enough.

SA-HT330GCT / SA-HT330 GCP

6 Precaution of Laser Diode

CAUTION:

This unit utilizes a class 1 laser.

Invisible laser radiation is emitted from the optical pickup lens.

When the unit is turned on:

1. Do not look directly into the pick up lens.

2. Do not use optical instruments to look at the pick up lens.

3. Do not adjust the preset variable resistor on the pickup lens.

4. Do not disassemble the optical pick up unit.

5. If the optical pick up is replaced, use the manufacturer’s specified replacement pick up only.

6. Use of control or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

CAUTION!

THIS PRODUCT UTILIZES A LASER. USE OF CONTROLS OR ADJUSTMENTS OR PERFORMANCE OF PROCEDURES OTHER THAN THOSE SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE.

SA-HT330GCT / SA-HT330 GCP

7 Handling Precautions for Optical Pickup Unit

The laser diode in the optical pickup unit may break down due to static electricity of clothes or human body. Special care must be taken avoid to electrostatic breakdown when servicing and handlin g the laser diode.

7.1. Cautions to be taken in handling the Optical Pickup Unit

The laser diode in the optical pickup unit may be damaged due to electrostatic discharge generating from clothes or human body. Special care must be taken avoid to electrostatic discharge damage when servicing the laser diode.

1. Do not give a considerable shock to the optical pickup unit as it has an extremely high-precise structure.

2. To prevent the laser diode from the electrostatic discharge damage, the flexible cable of the optical pickup unit removed should be short-circuited with a short pin or a clip.

3. The flexible cable may be cut off if an excessive force is applied to it. Use with caution when handling the flexible cable.

4. The antistatic FPC is connected to the new optical pickup unit. After replacing the optical pickup unit and connecting the flexible cable, cut off the antistatic FPC.

7.2. Cautions to be taken when replacing the Optical Pickup Unit

The flexible cable of the optical pickup unit which was supplie d as a component is equipped with a short clip to prevent the laser diode from being damaged due to electrostatic discharge. Remove the short clip before connecting the flexible cable and make sure that the short land is open. (If the flexible cable is short-circuited, remove the solder.)

7.3. Grounding for electrostatic breakdown prevention

Some devices such as the DVD player use the optical pickup (laser diode) and the optical pickup will be damaged by static electricity in the working environment. Proceed servicing works under the working environment where grounding works is completed.

7.3.1. Worktable grounding

1. Put a conductive material (sheet) or iron sheet on the area where the optical pickup is placed, and ground the sheet.

7.3.2. Human body grounding

1. Use the anti-static wrist strap to discharge the static electricity from your body.

SA-HT330GCT / SA-HT330 GCP

8 Accessories

Note : Refer to Packing Materials & Accessories Parts List (Section 27.4) for the part number.

Remote Control

AC cord

FM indoor antenna

AM loop antenna

Video cable

AC Plug Adaptor

Speaker

Label

9 Operation Procedures

SA-HT330GCT / SA-HT330 GCP

10 Disc information

SA-HT330GCT / SA-HT330 GCP

11 About HighMAT

11.1. What's HighMAT?

Consumers worldwide are using PCs to create their own collections of music, photos and even video by burning them onto CDs. But how these collections can be experienced across different devices can be confusing to navigate, time consuming to access for a DVD player, and be incomplete in terms of music information available to the customer.

HighMAT offers a solution to this growing consumer problem. HighMAT dramatically improves the digital media experience on consumer electronic devices by delivering a simple, standardized approach that allows consumers who have created personal collections of digital music, photography and video on their PC to:

· Create a HighMAT CD or DVD which can be easily played back on consum er electronics devices such as CD and DVD players, and car stereos.

· Move digital media files (using recordable media such as CD-R and CD-RW) between the PC and various playback devices such as CD and DVD players.

A new standard for creating personal media on consum er electronic devices, HighMAT enable easier and more seamless interoperability between Windows PCs and devices designed for your living room, or the car.

11.2. Why take advantage of HighMAT?

A Problem Defined:Toda y, when consumers create their own digital audio, video or photo collections on CD-R or other physical formats, there are numerous, inconsistent ways that devices read the data. For the consumer, the playba ck experie nce can be confusing:

SA-HT330GCT / SA-HT330 GCP

A Solution Created: HighMAT delivers a better digital media access experience by creating a standard approach for PCs to structure digital media on various physical formats and for playback devices to read the data.

11.3. Benefits of HighMAT?

Conventional HighMAT

Even though DVD player is CD-R/RW compatible, the inconsistent ways that various DVD players can read the music or photos files often leads to a confusing and inconsistent playback experince.

HighMAT compatible products play content back with consistent interface. This includes products which are JPEG compatible products without HighMAT support.

SA-HT330GCT / SA-HT330 GCP

HighMAT is now available for CD Burning and in Leading DVD Players. HighMAT is a new technology that is now available in leading software and consumer electronic devices to dramatically improve the digital media experience when you create homemade CDs. HighMAT delivers a simple, standardized way for PC software and consumer electronics devices to talk to each other and work better together.

When you create your homemade CDs with software that supports HighMAT CD burning, and then play them back on a DVD player that supports HighMAT, you get better, easier navigation. You get folders you can access with a single click of your DVD player´s remote control. You can view important information about your music like full song names, artist titles, album names and genre. And you can get faster startup on your home entertainment device.

To enjoy the benefits of HighMAT, all you need is software that supports HighMAT for CD burning of music or photos, as well as a home entertainment device like a DVD player that supports HighMAT for playback. Always look for the HighMAT logo on your software or home entertainment device to ensure it supports the HighMAT experience.

SA-HT330GCT / SA-HT330 GCP

12 Assembling and Disassembling

“ATTENTION SERVICER”

Some chassis components may be have sharp edges. Be careful when disassembling and servicing.

1. This section describes procedures for checking the operation of the major printed circuit boards and replacing the main components.

2. For reassembly after operation checks or replacement, reverse the respective procedures. Special reassembly procedures are described only when required.

3. Select items from the following index when checks or replacement are required.

· Disassembly of Top Cabinet

· Disassembly of SMPS Module P.C.B.

· Disassembly of Rear Panel

· Disassembly of AC Inlet P.C.B.

· Disassembly of Digital Amplifier P.C.B.

· Disassembly of DVD Lid (when taking out disc manually)

· Disassembly of Front Panel

· Disassembly of Headphone, Panel and Tact Switch P.C.B.

· Disassembly of DVD Mechanism unit

· Disassembly of Main P.C.B.

Warning:

This product uses a laser diode. Refer to “Precaution of Laser Diode”.

12.1. Disassembly flow chart

The following chart is the procedure for disassembling the casing and inside parts for internal inspection when carrying out the servicing.

To assemble the unit, reverse the steps shown in the chart below.

12.2. P.C.B. Locations

SA-HT330GCT / SA-HT330 GCP

12.3. Disassembly of Top Cabinet

Step 1 : Remove 4 screws.

Step 2 : Remove 3 screws.

Step 3 : Remove Top Cabinet as arrows shown.

12.4. Disassembly of SMPS Module P.C.B.

· Follow the (Step 1) - (Step 3) of item 12.3.

Step 1 : Remove 4 screws.

Step 2 : Detach connec tor (CN1, CN2, CN3), and remove SMPS Module P.C.B.

Note : SMPS Module should be replaced as an assembly unit in case it is faulty.

12.5. Disassembly of Rear Panel

· Follow the (Step 1) - (Step 3) of item 12.3.

Step 1 : Remove 9 screws.

Step 2 : Remove the rear panel as arrows shown.

Note : Be careful of catches on the sides when remove the rear panel.

SA-HT330GCT / SA-HT330 GCP

Step 1 : Detach connector CN1.

Step 2 : Remove AC inlet P.C.B. as arrow shown.

12.7. Disassembly of Digital Amplifier P.C.B.

· Follow the (Step 1) - (Step 3) of item 12.3.

· Follow the (Step 1) - (Step 3) of item 12.5.

Step 3 : Detach Fan connector CN2003 to remove rear panel.

12.6. Disassembly of AC Inlet P.C.B.

· Follow the (Step 1) - (Step 3) of item 12.3.

· Follow the (Step 1) - (Step 3) of item 12.5.

Step 1 : Remove 2 screws.

Step 2: Detach connector (CN2, CN2001) and FFC (CN2002).

Step 3: Flip over the Digital Amplifier P.C.B. (Side A).

SA-HT330GCT / SA-HT330 GCP

12.8. Disassembly of DVD Lid (when taking out disc manually)

· Follow the (Step 1) - (Step 3) of item 12.3.

Step 1 : Separates the gear for drawing out tray from the mechanism unit. Insert a screw driver in the gear (The gear jig).

Step 2 : Insert the gear jig into the tray open/ close hole.

Step 3 : Turn the gear jig counterclockwise to open the tray.

Note : Do not use force to push the tray backwards as it can damage the mechanism unit.

Turn the gear jig clockwise to return tray.

12.9. Disassembly of Front Panel

· Follow the (Step 1) - (Step 3) of item 12.3.

· Follow the (Step 1) - (Step 3) of item 12.8.

SA-HT330GCT / SA-HT330 GCP

Step 1 : Remove the DVD Lid from the tray section.

Step 2 : Detach connector (CN2005) and FFC (CN2006).

Step 1 : Remove Volume Knob.

Step 2 : Remove 2 screws and panel angle.

Step 3 : Remove 2 screws and Mecha Support.

Step 3 : Remove 2 screws.

Step 4 : Remove Mic Knob.

Step 5: Release all the claws and remove the front panel as arrows shown.

12.10. Disassembly of Headphone, Panel and Tact Switch P.C.B.

· Follow the (Step 1) - (Step 3) of item 12.3.

· Follow the (Step 1) - (Step 3) of item 12.8.

· Follow the (Step 1) - (Step 5) of item 12.9.

Step 4 : Remove 5 screws and remove Headphone, Panel and

SA-HT330GCT / SA-HT330 GCP

Tact Switch P.C.B.

12.11. Disassembly of DVD Mechanism unit

· Follow the (Step 1) - (Step 3) of item 12.3.

· Follow the (Step 1) - (Step 3) of item 12.8.

Step 1 : Remove DVD Lid as arrow shown.

Step 2 : Remove 2 screws.

Step 3 : Detach FFC (CN2004) and connector (CS901).

Step 4 : Remove DVD Mechanism unit as arrow shown.

12.12. Disassembly of Main P.C.B.

· Follow the (Step 1) - (Step 3) of item 12.3.

· Follow the (Step 1) - (Step 3) of item 12.5.

· Follow the (Step 1) - (Step 3) of item 12.8.

· Follow the (Step 1) - (Step 5) of item 12.9.

· Follow the (Step 1) - (Step 4) of item 12.11.

Step 1 : Remove 3 screws.

Step 2 : Detach FFC (CN2000), connector (CN2001, CN3) and remove Main P.C.B.

12.13. Disassembly and Assembly Mechanism Unit

12.13.1. Replacement of Traverse Unit

Step 1: Slide the lever backward to the furthest.

Step 2: While bending the catch at right of the lever to the right direction, slide the lever further until it stops. (The groove at right opens, the boss can be seen.)

Step 3: Press lever (A) to the left. (Two grooves at left open.)

SA-HT330GCT / SA-HT330 GCP

· Disassembly of DVD Module P.C.B.

Step 5: Remove 4 screws.

Step 6: Detach 15P FFC Board (FP8271).

Step 7: Detach 20P FFC Board (FP8501).

Step 4: Take out the traverse Unit.

12.13.2. Replacement of Tray.

· Follow the (Step 1) - (Step 7) of item 12.13.1 - Replacement of Traverse Unit

Step 1: While pressing the stopper to the arrow direction, slide the guide tray unit to remove.

SA-HT330GCT / SA-HT330 GCP

· Fixing the Tray

Step 1: Insert Tray slightly into groove of chassis.

Step 2: Insert Tray into the area to avoid catching the mechanism chassis claw.

Step 2: Stand the Loading Unit.

Step 3: Push the lever forward (the tray will move).

Step 4: Widen the catches at both sides and pull out the tray. (The tray will stop after a few slides)

Step 3: Latch Drive Arm Catch onto Tray and Tray Slider.

Step 4: Push Tray.

Step 5: Check Tray and Drive Arm move smoothly.

Step 5: Remove Drive Arm Catch from Tray Slider and Tray.

12.13.3. Disassembly of loading section.

SA-HT330GCT / SA-HT330 GCP

· Follow the (Step 1) - (Step 4) of item 12.13.1 - Replacement of Traverse Unit

· Follow the (Step 1) - (Step 5) of item 12.13.2 - Replacement of Tray

SA-HT330GCT / SA-HT330 GCP

12.13.4. Replacement of Optical Pickup Unit

· Follow the (Step 1) - (Step 5) of item 12.13.1 - Replacement of Traverse Unit

· Follow the (Step 1) - (Step 5) of item 12.13.2 - Replacement of Tray

Step 1: Widen the catch, push the pin in.

Step 2: Remove 4 pins.

SA-HT330GCT / SA-HT330 GCP

Note:

Insert a short pin into FFC of the optical pickup.

Step 3: Remove Traverse Unit.

SA-HT330GCT / SA-HT330 GCP

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