Panasonic KX-TSC11MXB, KX-TSC11MXW Service Manual

ORDER NO. KM40410538C3

Telephone Equipment

KX-TSC11MXB KX-TSC11MXW

Integrated Telephone System

Black Version White Version

(for Asia, Middle Near East and Other Areas)

KX-TSC11MXB / KX-TSC11MXW

Note:

Because CONTENTS 4 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without notice. Please refer to the original Operating Instructions for further information.

CONTENTS

Page Page

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 3

1.1. Suggested PbF Solder

1.2. How to recognize that Pb Free solder is used

2 FOR SERVICE TECHNICIANS 3 CAUTION 4 BATTERY

4.1. Installing the Batteries

4.2. Battery Replacement

5 LOCATION OF CONTROLS 6 DISPLAY 7 SETTINGS

7.1. Connecting the Handset/Telephone Line Cord

7.2. Dialing Mode

7.3. Dial Lock

7.4. How to Release the Establishment of Password

7.5. Call Restriction

8 OPERATIONS

8.1. Making Calls

8.2. Answering Calls

8.3. For Call Waiting Service Users

8.4. FLASH Button

8.5. Voice Mail Service

8.6. Phone Book

9 TROUBLESHOOTING 10 DISASSEMBLY INSTRUCTIONS 11 TROUBLESHOOTING GUIDE

11.1. Service Hints

11.2. Pulse Dialing Problems

11.3. Tone Dialing Problems (handset)

11.4. No Ringing Sound When Ring Signal is Input

12 TEST MODE 13 B LOCK DIAGRAM

3 4

14 CIRCUIT OPERATION 5 5 6

6 6

7 8 9

10 11 12 13

14 14 15 15 16 16

23 25 26

26 26 26 27

14.1. Bell Detector Circuit

14.2. Line Interface

14.3. MODULE BLOCK DIAGRAM

14.4. Caller ID Detect Circuit

15 B LOCK DIAGRAM

15.1. IC502

15.2. CPU DATA (IC502)

15.3. RINGER IC (IC2)

15.4. EEPROM (IC802)

16 HOW TO REPLACE FLAT PACKAGE IC

16.1. Preparation

16.2. Procedure

16.3. Modification Procedure of Bridge

17 TER MINAL GU IDE OF THE ICs, TR ANSISTO RS AND DIODES

18 CABINET AND ELECTRICAL PARTS

19 ACCESSORIES AND PACKING MATERIALS

20 REPLACEMENT PARTS LIST

20.1. Base Unit

20.2. Accessories and Packing Materials

21 FOR SCHEMATIC DIAGRAM

22 SCHEMATIC DIAGRAM

22.1. Memo

23 CIRCUIT BOARD

23.1. Component View

23.2. Flow Solder Side View

28 29 30

30 30 30 32

33 34 35 35

36 36 36

37 38 39 40

40 42

43 44

47 48

KX-TSC11MXB / KX-TSC11MXW

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

•

• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with

• •

temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please be careful not to heat too long.

•

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).

• •

•

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

• •

and be sure that any remaining is melted prior to applying the Pb solder.

•

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

• •

opposite side (See the figure below).

1.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other materials.

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

KX-TSC11MXB / KX-TSC11MXW

1.2. How to recognize that Pb Free solder is used

Marked

J002

Marked

PbF

C410

JJ401

D103 D303

J004

C107

D105

C420

C111

J003

VR401

C409

VR402 VR481

J001

RED BLACK GREEN

YELLOW

Q108

R114

Q106

C106

D102

C161

D302

R161

C302

C304

J005

Q102

Q181

PQUP11270ZA

C819

X801

C820

J011

J012

J010

R106

C814

J009

Q103

J101

Q104

J007

J015

J008

J017

J006

J014

D301

IC2

J016

PC1

5 4

SW1

R126

SW101

D104

J013

C102

C501 C502

C101

L102

L101

POS101

SA101

YELLOW GREEN

JJ101

TIP RING

(Component View)

PbF

IC201

IC302

IC301

(Flow Solder Side View)

Note:

The location of the “PbF” marks is subject to change without notice.

IC501

IC802

IC502

2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.

When replacing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on the worktable.

4. Do not grasp IC or LSI pins with bare fingers.

3 CAUTION

Danger of explosion if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer´s Instructions.

KX-TSC11MXB / KX-TSC11MXW