Panasonic KX-MB763RU Service manual

Multi-Function printer

KX-MB763RU

(for Russia)

ORDER NO. KMF0709112CE

KX-MB763RU

TABLE OF CONTENTS

PAG E PAG E

1 Safety Precautions -----------------------------------------------3

1.1. FOR SERVICE TECHNICIANS ------------------------3

1.2. AC CAUTION -----------------------------------------------3

1.3. PERSONAL SAFETY PRECAUTIONS --------------4

1.4. SERVICE PRECAUTIONS ------------------------------4

2Warning--------------------------------------------------------------5

2.1. ABOUT LEAD FREE SOLDER (PbF: Pb free) -----5

2.2. Discarding of P. C. Board --------------------------------5

2.3. INSULATION RESISTANCE TEST--------------------6

2.4. BATTERY CAUTION--------------------------------------6

2.5. LASER BEAM AND FUSER UNIT SECTION ------6

3 Specifications ------------------------------------------------------7 4 General/Introduction---------------------------------------------8

4.1. OPTIONAL ACCESSORIES ----------------------------8

4.2. Translation Lists --------------------------------------------8

5Features------------------------------------------------------------10

5.1. General Features----------------------------------------- 10

5.2. HARDWARE REQUIREMENTS FOR MULTIFUNCTION SOFTWARE------------------------------- 10

6 Technical Descriptions---------------------------------------- 11

6.1. CONNECTION DIAGRAM ----------------------------- 11

6.2. GENERAL BLOCK DIAGRAM------------------------ 12

6.3. MAIN BOARD SECTION------------------------------- 14

6.4. NCU SECTION ------------------------------------------- 26

6.5. ITS (Integrated telephone System) and MONITOR SECTION------------------------------------ 27

6.6. CIS CONTROL SECTION ----------------------------- 28

6.7. MOTOR DRIVE SECTION----------------------------- 29

6.8. TIMING CHART AND WAVE FORM OF SCANNER MOTORS ----------------------------------- 33

6.9. FAN MOTOR SECTION-------------------------------- 36

6.10. SOLENOID DRIVER SECTION ---------------------- 38

6.11. LSU (Laser Scanning Unit) SECTION -------------- 39

6.12. SENSORS AND SWITCHES SECTION ----------- 41

6.13. OPERATION BOARD SECTION--------------------- 49

6.14. LCD SECTION-------------------------------------------- 50

6.15. HVPS (High Voltage Power Supply) SECTION--------------------------------------------------- 51

6.16. HEAT LAMP CONTROL CIRCUIT------------------- 53

6.17. Main Board Section-------------------------------------- 58

6.18. POWER SUPPLY BOARD SECTION --------------61

6.19. Mechanical Operation----------------------------------- 62

7 Location of Controls and Components------------------ 63

7.1. OVERVIEW------------------------------------------------ 63

7.2. CONTROL PANEL--------------------------------------- 64

8 Installation Instructions---------------------------------------65

8.1. INSTALLATION -------------------------------------------65

8.2. CONNECTIONS------------------------------------------ 77

9 Operation Instructions ---------------------------------------- 78

9.1. YOUR LOGO --------------------------------------------- 78

10 Test Mode----------------------------------------------------------80

10.1. TEST FUNCTIONS -------------------------------------- 80

11 Se rvic e Mode -----------------------------------------------------84

11.1. PROGRAMMING AND LISTS ------------------------84

11.2. USER MODE (The list below is an example of the SYSTEM SETUP LIST the unit prints out.)--- 88

11.3. SERVICE MODE SETTINGS (Example of a printed out list) -------------------------------------------- 89

11.4. HISTORY -------------------------------------------------- 90

12 Troubleshooting Guide --------------------------------------- 93

12.1. USER RECOVERABLE ERRORS ------------------ 93

12.2. REMOTE PROGRAMMING -------------------------- 95

12.3. TROUBLESHOOTING DETAILS ------------------- 100

12.4. RECORDING PAPER JAM --------------------------167

13 Service Fixture & Tools -------------------------------------- 176 14 Disassembly and Assembly Instructions ------------- 177

14.1. TOP COVER SECTION-------------------------------178

14.2. REMOVE TOP COVER SECTION (1) ------------179

14.3. REMOVE TOP COVER SECTION (2) ------------180

14.4. REMOVE SCANNER GLASS SECTION --------- 181

14.5. REMOVE OPERATION PANEL SECTION ------ 182

14.6. LEFT SIDE SECTION ---------------------------------183

14.7. REMOVE MAIN BOARD -----------------------------183

14.8. REMOVE GEAR CHASSIS SECTION ------------ 184

14.9. REMOVE PAPER FEED ROLLER----------------- 185

14.10. RIGHT SIDE SECTION -------------------------------185

14.11. REMOVE RIGHT SIDE COVER SECTION------ 186

14.12. LOWER SIDE CABINET SECTION ---------------187

14.13. REMOVE RIGHT CASSETTE GUIDE ------------188

14.14. REMOVE PICK UP BOARD -------------------------188

14.15. REMOVE HIGH VOLTAGE POWER BOARD--- 189

14.16. REMOVE PICK UP ROLLER UNIT ---------------- 190

14.17. REMOVE LOW VOLTAGE POWER BOARD --- 191

14.18. REMOVE FUSER UNIT------------------------------- 192

14.19. Installation Position of The Lead--------------------193

15 Maintenance----------------------------------------------------- 198

15.1. MAINTENANCE ITEMS AND COMPONENT LOCATIONS ---------------------------------------------198

15.2. MAINTENANCE----------------------------------------- 200

15.3. PRINTING OPERATION PRINCIPLE -------------204

15.4. TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES----------------------209

15.5. HOW TO REPLACE THE FLAT PACKAGE IC - 211

15.6. MAIN BOARD SECTION -----------------------------213

15.7. TEST CHART-------------------------------------------- 215

16 Schematic Diagram ------------------------------------------- 217

16.1. For Schematic Diagram -------------------------------217

16.2. MAIN BOARD (1) --------------------------------------- 218

16.3. MAIN BOARD (2) --------------------------------------- 222

16.4. MAIN BOARD (3) --------------------------------------- 224

16.5. MAIN BOARD (4) --------------------------------------- 226

16.6. OPERATION BOARD ---------------------------------228

16.7. SENSOR BOARD --------------------------------------229

16.8. HOOK SWITHC BOARD ----------------------------- 230

17 Printed Circuit Board-----------------------------------------231

17.1. MAIN BOARD -------------------------------------------231

17.2. OPERATION BOARD ---------------------------------233

17.3. SENSOR BOARD --------------------------------------235

17.4. HOOK SWITCH BOARD ----------------------------- 237

18 Exploded View and Replacement Parts List---------- 238

18.1. CABINET, MECHANICAL AND ELECTRICAL PARTS LOCATION-------------------------------------238

18.2. REPLACEMENT PARTS LIST ----------------------250

KX-MB763RU

1 Safety Precautions

1. Before servicing, unplug the AC power cord to prevent an electric shock.

2. When replacing parts, use only the manufacturer's recommended components.

3. Check the condition of the power cord. Replace if wear or damage is evident.

4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.

5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent the customer from being exposed to shock hazards.

6. Repair service shall be provided in accordance with repair technology information such as technical guides so as to prevent fires, injury or electric shock, which can be caused by improper repair work.

7. When repair services are provided, neither the products nor their parts or members shall be remodeled.

8. If a wiring unit is supplied as a repair part, the entire wiring unit shall be replaced, rather than repairing and connecting the wires, even when only some of its wires are broken.

9. FASTON terminals shall be plugged straight in and unplugged straight out, rather than jiggling them into or out of position.

1.1. FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity. When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic part's boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on the worktable.

4. Do not touch the IC or LSI pins with bare fingers.

1.2. AC CAUTION

For safety, before closing the lower cabinet, please make sure of the following precautions.

1. The earth lead is fixed with the screw.

2. The AC connector is connected properly.

KX-MB763RU

1.3. PERSONAL SAFETY PRECAUTIONS

1.3.1. MOVING SECTIONS OF THE UNIT

Be careful not to let your hair, clothes, fingers, accessories, etc., become caught in any moving sections of the unit. The moving sections of the unit are the rollers and a gear. There is a separation roller and a document feed roller which are rotated by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially when the unit is operating.

1.3.2. LIVE ELECTRICAL SECTIONS

All the electrical sections of the unit supplied with AC power by the AC power cord are live. Never disassemble the unit for service with the AC power supply plugged in.

CAUTION:

AC voltage is supplied to the primary side of the power supply unit. Therefore, always unplug the AC power cord before disassembling for service.

1.4. SERVICE PRECAUTIONS

1.4.1. PRECAUTIONS TO PREVENT DAMAGE FROM STATIC ELECTRICITY

Electrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change their electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity. Never touch the electrical sections such as the power supply unit, etc.

KX-MB763RU

2Warning

2.1. ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

• PbF solder has a melting point that is 50° ~ 70° F, (3 0° ~ 40°C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please be careful not to heat too long.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, ( 6 00 °C).

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible and be sure that any remaining is melted prior to applying the Pb solder.

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See figure, below).

2.1.1. SUGGESTED PBF SOLDER

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper, (Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

2.2. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

KX-MB763RU

2.3. INSULATION RESISTANCE TEST

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.

2. Turn on the power switch.

3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each exposed metal cabinet part (screw heads, control shafts, bottom frame, etc.). Note: Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of a shock hazard.

2.4. BATTERY CAUTION

CAUTION

Danger of explosion if the battery is replaced incorrectly. Replace only with the same or equivalent type recommended by the manufacturer. Dispose used batteries according to the manufacturer’s instructions:

The lithium battery is a critical component (type No.CR2032). Please observe for the proper polarity and exact location when replacing it and the soldering the replacement litium battery in.

2.5. LASER BEAM AND FUSER UNIT SECTION

• The printer of this unit utilizes a laser. Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

• The fuser unit is inside of the unit and gets hot. Do not touch it when removing the jammed paper or cleaning the lower glass.

KX-MB763RU

3 Specifications

Applicable Lines: Public Switched Telephone Network Document Size: Max. 216 mm in width

Effective Scanning Width: 208 mm Effective Printing Width: Letter/ Legal: 208 mm

Transmission Time*: Approx. 4 s/page (ECM-MMR Memory transmission)** Scanning Density: Copy resolution:

Photo resolution: 64-level Scanner Type: Color Contact Image Sensor Printer Type: Laser printer Data Compression System: Modified Huffman (MH), Modified READ (MR), Modified Modified READ (MMR) Modem Speed: 33,600 / 31,200 / 28,800 / 26,400 / 24,000 / 21,600 / 19,200 / 16,800 / 14,400 / 12,000 /

Operating Environment: 10°C—32.5°C, 20—70% RH (Relative Humidity) Dimensions (H×W×D): Approx. height 255 mm × width 420 mm × depth 445 mm Mass (Weight): Approx. 12kg Power Consumption: Standby: Approx. 6.5 W

Power Supply: 220—240V AC, 50/60Hz Memory Capacity (for operation and

storing memory): Fax Memory Capacity: 2 MB in total

Laser diode properties: Laser output: Max. 5 mW

Print Speed: 18 ppm (page per minute) Printing Resolution: 600 × 600 dpi

Max. 297 mm in length

A4: 202 mm

Up to 600 × 600 dpi (Scanner Glass)

Scanning resolution:

Up to 600 × 1200 dpi (Optical) Up to 9600 × 9600 dpi (Interpolated)

FAX res olut ion:

Horizontal: 8 pels/mm Ver tica l:

3.85 lines/mm-STANDARD

7.7 lines/mm-FINE/PHOTO

15.4 lines/mm-SUPER FINE

9,600 / 7,200 / 4,800 / 2,400 bps; Automatic Fallback

Preheat: Approx. 65 W Copy: Approx. 320 W Maximum: Approx. 950 W (When the fuser lamp turns on)

32 MB

Approx. 170 pages of memory reception Approx. 150 pages of memory transmission (Based on the ITU-T No. 1 Test Chart in standard resolution.)

Wave length: 760 nm—810 nm Emission duration: Continuous

* Transmission speed depends on the contents of the pages, resolution, telephone line conditions and capability of the other party’s machine. ** Transmission speed is based upon the ITU-T No. 1 Test Chart (Refer to ITU-T No.1 TEST CHART (P.215).) wiyh original mode. If the capability of the other party's machine is inferior to your unit, the transmission time may be longer.

Note:

• Design and specifications are subject to change without notice.

• The pictures and illustrations in these instructions may vary slightly from the actual product.

• The accuracy of the clock is approximately ±60 seconds a month.

KX-MB763RU

4 General/Introduction

4.1. OPTIONAL ACCESSORIES

Model No. Description Specifications KX-FAT92A Replacement toner cartridge 1 toner cartridge KX-FAD93A Replacement drum unit 1 drum unit

4.2. Translation Lists

4.2.1. Help Function

4.2.2. Error Message (Report)

4.2.3. Error Message (Display)

KX-MB763RU

4.2.4. OTHER

KX-MB763RU

5Features

5.1. General Features

General

• LCD (Liquid Crystal Display) readout

250-sheet paper capacity (60 g/m Distinctive ring detection.

~ 75 g/m2)

Plain Paper Facsimile Machine

Output tray (approx. 150 sheets) Letter/A4/Legal, G3 compatible Quick scan Resolution: Standard/Fine/Super fine/Photo (64 level). STANDARD: For normal-sized characters. FINE: For small-sized characters. SUPER FINE: For very small-sized characters. PHOTO: For photographs, shaded drawings, etc. Broadcast

Large Memory... Performed by DRAM Approx. 150 pages of memory transmission Approx. 170 pages of memory reception

Enhanced Copier Function

Multi-copy function (up to 99 copies) Enlargement and reduction Collate

64-Level halftone

5.2. HARDWARE REQUIREMENTS FOR MULTI-FUNCTION SOFTWARE

To use Multi-Function Station on your computer, the following are required:

Operating System:

Windows 98 / Windows Me / Windows 2000 / Windows XP / Windows Vista

CPU:

Windows 98: Pentium® 90 MHz or faster Windows Me: Pentium 150 MHz or faster Windows 2000: Pentium 166 MHz or faster Windows XP: Pentium 300 MHz or faster Windows Vista: Recent Processor (x86) 800 MHz or higher processor

RAM:

Windows 98: 24 MB (32 MB or more recommended) Windows Me: 32 MB (64 MB or more recommended) Windows 2000: 64 MB or more Windows XP: 128 MB or more Windows Vista: 512 MB or more

Other Hardware:

CD-ROM drive Hard disk drive with at least 150 MB of available space USB interface

operating system

6 Technical Descriptions

6.1. CONNECTION DIAGRAM

KX-MB763RU

6.2. GENERAL BLOCK DIAGRAM

MAIN UNIT

SOC (IC300)

This custom IC is used for general MFP operations.

1) CPU ARM9 operating at 250MHz.

2) SDRAM Controller Controls SDRAM Memory.

3) USB Controller with PHY Apply to USB2.0 HS

4) Scanner I/F Controls the CIS and AFE, and process the scan images.

5) LSU I/F Controls the polygon motor and outputs the VIDEO signal to LSU.

6) MOTOR I/F Controls the DC motor and Stepping Motor.

7) FAN I/F Controls FAN MOTOR and detect the rotation of FAN MOTOR.

8) OPERATION PANEL I/F Serial interface with Operation Panel.

9) SENSOR I/F Detects the sensor signal.

10) I/O PORT I/O Port Interface.

11) A/D, D/A converter Sends beep tones, etc. Convert the analog signal to the digital signal.

12) RTC Real time clock.

13) MODEM Performs the modulation and the demodulation for FAX communication.

14) Analog Front End I/F Controls the DAA device for TEL/FAX function.

ROM (IC402)

This 8MB FLASH ROM contains all of the program instructions on the unit operations. And support the backup of user setting and FAX receive data.

SYNCHRONOUS DYNAMIC RAM (IC400)

This 256Mbit SDRAM is used for CPU work and receiving memory and page memory.

POWER SUPPLY

DC-DC converters generate 3.3V and 1.2V for system power. Regurator generates 5V for peripheral devices.

TEL/FAX I/F

Composed of ITS circuit and NCU circuit. 3 ICs called SDAA(Silicon Direct Access Arrangement) control Telephone line, Speaker, and Handset.

READ SECTION

CIS Unit to read transmitted documents. CIS Unit is connected to FLATBED transit Unit. Scan data is converted by AFE(IC503).

MOTOR

This model has 1 DC motor and 1 stepping motors. IC300 drives the DC motor for printing. IC502 and IC700 drive the stepping motor for Auto Document Feeder motor and CIS carriage.

LSU

Forms the images on the OPC DRUM by rotating polygon motor and reflecting the laser beam against polygon.

SENSORS

Composed of 2 switches and 3 sensors.

POWER SUPPLY BOARD

Supplies +24V and +7V to the Main unit and controls the Heat Lamp.

HIGH VOLTAGE POWER SUPPLY BOARD

Supplies bias need for the printing operation: bias of the DRUM, Developing and Transcription.

FIXING UNIT

Composed heat lamp, thermistor and thermostats.

KX-MB763RU

tor

Varis

peaker S

ater)

(He

4 6

Thermistor

CN52

tr orR

IT SensorEX

N53 C

CN65

Hole

egis e Sens ePTOP S nsor

N50 C

N66 C

r Sensor

IC50

Tone

N67 C

N C

7 5

t e

U V H

N1 C

5 0 5

EXT

k c

1 0 1

Hand S

TEL

) V

00 2 N C

CN5

Hook SW

TEL

CN10

CN50

(TN

DAA blo

IC100, IC101

)

Color CI

Flat Bed

Flat B

ge motor

Carria

9 50

N C

0 51

N C

11 5 N C

Motor

Driver

AFE

Main Board

514 N C

(FB)

IC503

507 N C

IC502

ard o

anel B

0 6 N C

nsit

62 N

B T

61 C

(Room)

Thermistor

2 N C

IC1

G/A

Ope

SoC

)

it b

M 6

IC400

(25

SDRAM

) it b

M 4

FLASH

(32

N506 C

(sirius

IC402

n P tio

LCD

2Line

era p

IC300

Lite)

Not used

CN50

Phy

DC-DC

N501 C

CN300

USB

LAN

N75 C

N50 C

CONVERTER

CN500

AN motor (right F

Thermostat

N10 C

S P

63 N C

ick Up Senso P

AC inle

AC cord set

Heater lamp

Resist Solenoid

DC motor

Pick-up Solenoid

FAN motor (left)

(LSU)

Polygon motor

ostat

Therm

KX-MB763RU

6.3. MAIN BOARD SECTION

6.3.1. Data Flow

[FAX Tx]

CIS unit

CN61

FB tr ansit Board

CN59

1. An analog image data is output from CIS unit to IC503. IC503 decode the analog data to digital data, and output to IC300. Scanner I/F in IC300 process image data and store it in IC400 through SDRAM I/F.

2. CPU compress the data in IC400.

3. CPU transfer the data to MODEM and output it to TEL LINE through DAA circuit.

TEL

LINE

USB

[FAX Rx]

Main Board

IC100 IC101

DAA

CN100

CN300

CIS unit

MODEM

LAN

I/F

USB

I/F

CPU

CN61

CN510

AFE

Scanner

I/F

FB tr ansit Board

CN59

IC503

IC300

DSPJBIG

Print I/F

SDRAM

I/F

CN500

IC400

SDRAM

1. FAX data is input from TEL LINE to MODEM in IC300 through DAA circuit.

And then store it in IC400 through SDRAM I/F.

2. CPU decompress the data in IC400.

3. Print I/F retrieve the data from IC400 and output it to LSU.

LSU

TEL

LINE

USB

Main Board

IC100 IC101

DAA

CN100

CN300

MODEM

LAN

I/F

USB

I/F

CPU

CN510

AFE

Scanner

IC503

IC300

DSPJBIG

Print I/F

SDRAM

I/F

CN500

IC400

SDRAM

LSU

KX-MB763RU

[PC Scan]

TEL

LINE

USB

CIS unit

Main Board

IC100 IC101

DAA

CN100

CN300

MODEM

LAN

I/F

CN61

USB

I/F

FB tr ansit Board

CN59

CN510

CPU

AFE

Scanner

I/F

1. An analog image data is output from CISunit to IC503. IC503 decode the analog data to digital data, and output to IC300. Scanner I/F in IC300 process image data and store it in IC400 through SDRAM I/F.

2. If necessary, the data is compressed via DSP.

3. The data is output to PC through the USB I/F.

IC503

DSPJBIG

Print I/F

IC300

SDRAM

I/F

CN500

IC400

SDRAM

LSU

[PC print]

TEL

LINE

USB

CIS unit

Main Board

IC100 IC101

DAA

CN100

CN300

MODEM

LAN

I/F

CN61

USB

I/F

FB tr ansit Board

CN510

CPU

CN59

AFE

Scanner

1.The print data is output from PC through USB and pass the USB I/F in IC300.

then the data is stored in IC400 through SDRAM I/F.

2. Print I/F retrieve the data from IC400 and output it to LSU.

IC503

IC300

DSPJBIG

Print I/F

SDRAM

I/F

CN500

IC400

SDRAM

LSU

KX-MB763RU

[Copy]

CIS unit

CN61

FB tr ansit Board

CN59

1. An analog image data is output from CISunit to IC503. IC503 decode the analog data to digital data, and output to IC300. Scanner I/F in IC300 process image data and store it in IC400 through SDRAM I/F.

2. If necessary, the data is compressed via JBIG.

3. Print I/F retrieve the data from IC400 and output it to LSU.

TEL

LINE

USB

Main Board

IC100 IC101

DAA

CN100

CN300

MODEM

LAN

I/F

USB

I/F

CPU

CN510

AFE

Scanner

I/F

IC503

DSPJBIG

Print I/F

IC300

SDRAM

I/F

LSU

CN500

IC400

SDRAM

Description of Pin Distribution (IC300) SOC (System On Chip)

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION A02 LEDONB O 3.3V SCANNER INTERFACE A03 NCCDON O 3.3V SCANNER INTERFACE A04 AFEMCLK O 3.3V SCANNER INTERFACE A05 NCCDCP O 3.3V NOT USED A06 CCDCLK O 3.3V NOT USED A07 PIO29 O 3.3V OPERATION PANEL INTERFACE A08 PIO57 O 3.3V CARRIAGE MOTOR INTERFACE A09 PIO53 O 3.3V CARRIAGE/ADF MOTOR INTERFACE A10 PIO50 O 3.3V CARRIAGE/ADF MOTOR INTERFACE A11 PIO46 O 3.3V FAN1 CONTROL A12 PIO42 O 3.3V DC MOTOR INTERFACE A13 NFRCE O 3.3V FLASH MEMORY CHIP SELECT A14 FRMD0 I/O 3.3V FLASH MEMORY DATA BUS 0 A15 FRMD3 I/O 3.3V FLASH MEMORY DATA BUS 3 A16 FRMD7 I/O 3.3V FLASH MEMORY DATA BUS 7 A17 FRMA3 O 3.3V FLASH MEMORY ADDRESS BUS 3 A18 FRMA6 O 3.3V FLASH MEMORY ADDRESS BUS 6 A19 FRMA10 O 3.3V FLASH MEMORY ADDRESS BUS 10 A20 THRMAVDD - 3.3V POWER SUPPLY A21 FRMA11 O 3.3V FLASH MEMORY ADDRESS BUS 11 A22 FRMA15 O 3.3V FLASH MEMORY ADDRESS BUS 15 A23 FRMA17 O 3.3V FLASH MEMORY ADDRESS BUS 17 A24 FRMA20 O 3.3V FLASH MEMORY ADDRESS BUS 20 A25 FRMA22 O 3.3V FLASH MEMORY ADDRESS BUS 22 AA01 SDMD8 I/O 3.3V SDRAM DATA BUS 8 AA02 SDMD9 I/O 3.3V SDRAM DATA BUS 9 AA03 SDMA7 O 3.3V SDRAM ADDRESS BUS 7 AA04 SDMA6 O 3.3V SDRAM ADDRESS BUS 6 AA23 VDD1.2 - 1.2V POWER SUPPLY AA24 AFERST O 3.3V NCU INTERFACE AA25 RING I 3.3V NCU INTERFACE AA26 EXTINT I 3.3V NCU INTERFACE AB01 SDMD10 I/O 3.3V SDRAM DATA BUS 10 AB02 SDMD11 I/O 3.3V SDRAM DATA BUS 11 AB03 SDMA5 O 3.3V SDRAM ADDRESS BUS 5 AB04 VDD1.2 - 1.2V POWER SUPPLY AB23 VSS - GND GND AB24 BTXD O 3.3V NCU INTERFACE AB25 BRXD I 3.3V NCU INTERFACE AB26 AFECLK O 3.3V NCU INTERFACE AC01 SDMD12 I/O 3.3V SDRAM DATA BUS 12 AC02 SDMD13 I/O 3.3V SDRAM DATA BUS 13 AC03 SDMA4 O 3.3V SDRAM ADDRESS BUS 4 AC04 VSS - GND GND AC05 VSS - GND GND AC06 VDD1.2 - 1.2V POWER SUPPLY AC07 TXD0 O 3.3V ETHERNET INTERFACE AC08 TX_ER O 3.3V ETHERNET INTERFACE AC09 RXD1 I 3.3V ETHERNET INTERFACE AC10 VDD3.3 - 3.3V POWER SUPPLY AC11 TEST I 3.3V NOT USED AC12 USBREXT I 3.3V USB INTERFACE AC13 VDD1.2 - 1.2V POWER SUPPLY AC14 VDD3.3 - 3.3V POWER SUPPLY AC15 USBXIN I 3.3V CRYSTAL(12MHz) INPUT AC16 LSI_SCAN_ENABLE I 3.3V NOT USED AC17 VDD1.2 - 1.2V POWER SUPPLY AC18 NWDTRST O 3.3V WATCH DOG TIMER RESET OUTPUT AC19 LSI_TN I 3.3V NOT USED AC20 PSCIO2 I 3.3V INPUT PORT (FANDET1) AC21 PSCIO6 O 3.3V NOT USED AC22 VDD1.2 - 1.2V POWER SUPPLY AC23 VSS - GND GND AC24 ATXD O 3.3V NCU INTERFACE AC25 BBITCLK I/O 3.3V NCU INTERFACE

KX-MB763RU

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION AC26 BSPCLK I/O 3.3V NCU INTERFACE AD01 SDMD14 I/O 3.3V SDRAM DATA BUS 14 AD02 SDMD15 I/O 3.3V SDRAM DATA BUS 15 AD03 VSS - GND GND AD04 NBATRST I 3.3V BATTERY RESET INPUT AD05 VDD2RTC - 1.2V POWER SUPPLY AD06 CRS I 3.3V ETHERNET INTERFACE AD07 TXD1 O 3.3V ETHERNET INTERFACE AD08 RX_DV I 3.3V ETHERNET INTERFACE AD09 RXD2 I 3.3V ETHERNET INTERFACE AD10 RX_ER I 3.3V ETHERNET INTERFACE AD11 CLKSEL I 3.3V NOT USED AD12 USBVSSA33_BIAS - GND GND AD13 USBVSSA33 - GND GND AD14 USBVDDA12_SQ - 1.2V POWER SUPPLY AD15 USBVSSA12 - GND GND AD16 LSI_TRSTN I 3.3V NOT USED AD17 LSI_TDO O 3.3V NOT USED AD18 NRST I 3.3V SYSTEM RESET INPUT AD19 HTRCTL O 3.3V HEATER CONTROL AD20 PSCIO3 I 3.3V INPUT PORT (POUT) AD21 PSCIO7 O 3.3V NOT USED AD22 PSCIO15 I 3.3V INPUT PORT (RPS) AD23 NC - - NOT USED AD24 VSS - GND GND AD25 ASPCLK I/O 3.3V NCU INTERFACE AD26 ARXD I 3.3V NCU INTERFACE AE01 SDLDM1 O 3.3V SDRAM DQML1 AE02 VSS - GND GND AE03 SYSPLLVSS1 - GND GND AE04 RTCCLKOUT O 3.3V CRYSTAL(32.768KHz) OUTPUT AE05 RTCPWRDWN I 3.3V RTC POWER DOWN AE06 TX_CLKI I 3.3V ETHERNET INTERFACE AE07 TXD2 O 3.3V ETHERNET INTERFACE AE08 RX_CLKI I 3.3V ETHERNET INTERFACE AE09 RXD3 I 3.3V ETHERNET INTERFACE AE10 MDC O 3.3V ETHERNET INTERFACE AE11 NC - - NOT USED AE12 USBID O 3.3V NOT USED AE13 USBDM I/O 3.3V USB INTERFACE AE14 USBVSSA12_SQ - GND GND AE15 USBVDDA12PLL - 1.2V POWER SUPPLY AE16 USBVDDA12 - 1.2V POWER SUPPLY AE17 LSI_TDI I 3.3V NOT USED AE18 LSI_PROCMON O 3.3V NOT USED AE19 LSI_IDDT I 3.3V NOT USED AE20 PSCIO1 I 3.3V INPUT PORT (PICK) AE21 PSCIO5 O 3.3V NOT USED AE22 PSCIO13 I 3.3V INPUT PORT (TNR) AE23 MDMCLKOUT O 3.3V CRYSTAL(24.576MHz) OUTPUT AE24 MDMPLLVDD - 3.3V POWER SUPPLY AE25 VSS - GND GND AE26 ABITCLK I/O 3.3V NCU INTERFACE AF02 SYSPLLVDD1 - 3.3V POWER SUPPLY AF03 VDD3.3OSC - 3.3V POWER SUPPLY AF04 RTCCLKIN I 3.3V CRYSTAL(32.768KHz) INPUT AF05 COL I 3.3V ETHERNET INTERFACE AF06 TX_EN O 3.3V ETHERNET INTERFACE AF07 TXD3 O 3.3V ETHERNET INTERFACE AF08 RXD0 I 3.3V ETHERNET INTERFACE AF09 MDIO I/O 3.3V ETHERNET INTERFACE AF10 MGTINT I 3.3V ETHERNET INTERFACE AF11 USBVBUS O 3.3V USB INTERFACE AF12 USBVDDA33_BIAS - 3.3V POWER SUPPLY AF13 USBDP I/O 3.3V USB INTERFACE AF14 USBVDDA33 - 3.3V POWER SUPPLY AF15 USBVSSA12PLL - GND GND

KX-MB763RU

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION AF16 USBXOUT I 3.3V CRYSTAL(12MHz) OUTPUT AF17 LSI_TMS I 3.3V NOT USED AF18 LSI_TCK I 3.3V NOT USED AF19 LSI_CW_TAP I 3.3V NOT USED AF20 PSCIO0 I 3.3V INPUT PORT (REGIST) AF21 PSCIO4 O 3.3V NOT USED AF22 PSCIO12 I 3.3V INPUT PORT (POUT) AF23 PSCIO14 I 3.3V INPUT PORT (DOCU) AF24 MDMCLKIN I 3.3V CRYSTAL(24.576MHz) INPUT AF25 MDMPLLVSS - GND GND B01 AFEADC0 I 3.3V NOT USED B02 VSS - GND GND B03 LEDONG O 3.3V SCANNER INTERFACE B04 AFERSMP O 3.3V NOT USED B05 AFEVSMP O 3.3V SCANNER INTERFACE B06 NCCDRS O 3.3V SCANNER INTERFACE B07 PIO30 I/O 3.3V OPERATION PANEL INTERFACE B08 MMPWR O 3.3V NOT USED B09 PIO54 O 3.3V CARRIAGE/ADF MOTOR INTERFACE B10 PIO51 O 3.3V CARRIAGE/ADF MOTOR INTERFACE B11 PIO47 O 3.3V NOT USED B12 PIO43 O 3.3V DC MOTOR INTERFACE B13 NFROE O 3.3V FLASH MEMORY CHIP OUTPUT ENABLE B14 FRMD1 I/O 3.3V FLASH MEMORY DATA BUS 1 B15 FRMD4 I/O 3.3V FLASH MEMORY DATA BUS 4 B16 FRMA0 O 3.3V FLASH MEMORY ADDRESS BUS 0 B17 FRMA4 O 3.3V FLASH MEMORY ADDRESS BUS 4 B18 FRMA7 O 3.3V FLASH MEMORY ADDRESS BUS 7 B19 THRMAVSS - GND GND B20 TONE O 3.3V ANALOG(TONE) OUTPUT B21 FRMA12 O 3.3V FLASH MEMORY ADDRESS BUS 12 B22 FRMA16 O 3.3V FLASH MEMORY ADDRESS BUS 16 B23 FRMA19 O 3.3V FLASH MEMORY ADDRESS BUS 19 B24 FRMA21 O 3.3V FLASH MEMORY ADDRESS BUS 21 B25 VSS - GND GND B26 DOTPLLVSS - GND GND C01 AFEADC3 I 3.3V NOT USED C02 AFEADC1 I 3.3V NOT USED C03 VSS - GND GND C04 LEDONR O 3.3V SCANNER INTERFACE C05 OEB O 3.3V NOT USED C06 CCDSH O 3.3V SCANNER INTERFACE C07 PIO31 O 3.3V OPERATION PANEL INTERFACE C08 OPMPWR O 3.3V NOT USED C09 PIO55 O 3.3V CARRIAGE/ADF MOTOR INTERFACE C10 PIO52 O 3.3V CARRIAGE/ADF MOTOR INTERFACE C11 PIO49 O 3.3V OUTPUT PORT(HSSPMUTE) C12 PIO45 O 3.3V DC MOTOR INTERFACE C13 NFRWE O 3.3V FLASH MEMORY CHIP WRITE ENABLE C14 FRMD2 I/O 3.3V FLASH MEMORY DATA BUS 2 C15 FRMD6 I/O 3.3V FLASH MEMORY DATA BUS 6 C16 FRMA2 O 3.3V FLASH MEMORY ADDRESS BUS 2 C17 FRMA5 O 3.3V FLASH MEMORY ADDRESS BUS 5 C18 FRMA9 O 3.3V FLASH MEMORY ADDRESS BUS 9 C19 THRMSTR0 I 3.3V ANALOG INPUT(THERMISTOR) C20 TONEAVDD - 3.3V POWER SUPPLY C21 FRMA14 O 3.3V FLASH MEMORY ADDRESS BUS 14 C22 FRMA18 O 3.3V FLASH MEMORY ADDRESS BUS 18 C23 FRMA23 O 3.3V FLASH MEMORY ADDRESS BUS 23 C24 VSS - GND GND C25 DOTPLLVDD - 3.3V POWER SUPPLY C26 DOTCLKIN I 3.3V CRYSTAL(20MHz) INPUT D01 AFEADC5 I 3.3V SCANNER INTERFACE D02 AFEADC4 I 3.3V SCANNER INTERFACE D03 AFEADC2 I 3.3V NOT USED D04 VSS - GND GND D05 VSS - GND GND

KX-MB763RU

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION D06 VDD1.2 - 1.2V POWER SUPPLY D07 PIO32 O 3.3V OPERATION PANEL INTERFACE D08 CRMPWR O 3.3V MOTOR CURRENT CONTROL D09 PIO56 O 3.3V ADF MOTOR INTERFACE D10 VDD1.2 - 1.2V POWER SUPPLY D11 PIO48 O 3.3V FAN2 CONTROL D12 PIO44 O 3.3V DC MOTOR INTERFACE D13 VDD3.3 - 3.3V POWER SUPPLY D14 VDD1.2 - 1.2V POWER SUPPLY D15 FRMD5 I/O 3.3V FLASH MEMORY DATA BUS 5 D16 FRMA1 O 3.3V FLASH MEMORY ADDRESS BUS 1 D17 VDD3.3 - 3.3V POWER SUPPLY D18 FRMA8 O 3.3V FLASH MEMORY ADDRESS BUS 8 D19 THRMSTR1 I 3.3V ANALOG INPUT(THERMISTOR) D20 TONEAVSS - GND GND D21 FRMA13 O 3.3V FLASH MEMORY ADDRESS BUS 13 D22 VDD1.2 - 1.2V POWER SUPPLY D23 VSS - GND GND D24 NC - - NOT USED D25 DOTCLKOUT O 3.3V CRYSTAL(20MHz) OUTPUT D26 PIO66 O 3.3V NOT USED E01 SDUDM0 O 3.3V SDRAM DQMU0 E02 AFEADC7 I 3.3V SCANNER INTERFACE E03 AFEADC6 I 3.3V SCANNER INTERFACE E04 VSS - GND GND E23 VDD1.2 - 1.2V POWER SUPPLY E24 FRMA24 O 3.3V FLASH MEMORY ADDRESS BUS 24 E25 PIO65 O 3.3V NOT USED E26 PIO64 O 3.3V NOT USED F01 SDMD16 I/O 3.3V SDRAM DATA BUS 16 F02 SDMD17 I/O 3.3V SDRAM DATA BUS 17 F03 AFESIFCLK O 3.3V SCANNER INTERFACE F04 VDD1.2 - 1.2V POWER SUPPLY F23 PIO24 I 3.3V LSU INTERFACE F24 PIO61 O 3.3V OUTPUT PORT(SPMUTE) F25 PIO60 O 3.3V NOT USED F26 PIO3 O 3.3V LSU INTERFACE G01 SDMD18 I/O 3.3V SDRAM DATA BUS 18 G02 SDMD19 I/O 3.3V SDRAM DATA BUS 19 G03 AFESIFDIN I 3.3V SCANNER INTERFACE G04 AFESIFEN O 3.3V SCANNER INTERFACE G23 PSCIO24 I 3.3V LSU INTERFACE G24 PIO2 O 3.3V LSU INTERFACE G26 PIO58 O 3.3V OUTPUT PORT(CIDRLY) H01 SDMD20 I/O 3.3V SDRAM DATA BUS 20 H02 SDMD21 I/O 3.3V SDRAM DATA BUS 21 H03 NSDCS2 O 3.3V SDRAM CHIP SELECT 2 H04 AFESIFDOUT O 3.3V SCANNER INTERFACE H23 PIO63 O 3.3V LSU INTERFACE H24 PIO62 O 3.3V LSU INTERFACE H25 PIO28 O 3.3V NOT USED H26 PIO21 O 3.3V LSU INTERFACE J01 SDMD22 I/O 3.3V SDRAM DATA BUS 22 J02 SDMD23 I/O 3.3V SDRAM DATA BUS 23 J03 SDMA3 O 3.3V SDRAM ADDRESS BUS 3 J04 SDMA2 O 3.3V SDRAM ADDRESS BUS 2 J23 PIO6 O 3.3V HIGH VOLTAGE UNIT INTERFACE J24 PIO27 O 3.3V NOT USED J25 PIO5 O 3.3V HIGH VOLTAGE UNIT INTERFACE J26 PIO4 O 3.3V HIGH VOLTAGE UNIT INTERFACE K01 VSS - GND GND K02 SDCLK2 O 3.3V SDRAM CLOCK 2 K03 VSS - GND GND K04 VDD3.3 - 3.3V POWER SUPPLY K23 VDD1.2 - 1.2V POWER SUPPLY K24 PIO41 O 3.3V NOT USED K25 PIO40 O 3.3V NOT USED

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION K26 PIO39 O 3.3V NOT USED L01 SDMD24 I/O 3.3V SDRAM DATA BUS 24 L02 SDMD25 I/O 3.3V SDRAM DATA BUS 25 L03 SDMA1 O 3.3V SDRAM ADDRESS BUS 1 L04 SDMAÇO O 3.3V SDRAM ADDRESS BUS 0 L11 VSS - GND GND L12 VSS - GND GND L13 VSS - GND GND L14 VSS - GND GND L15 VSS - GND GND L16 VSS - GND GND L23 PIO37 I 3.3V INPUT PORT (RING) L24 PIO38 O 3.3V NOT USED L25 PIO36 O 3.3V NOT USED L26 PIO35 O 3.3V NOT USED M01 SDMD26 I/O 3.3V SDRAM DATA BUS 26 M02 SDMD27 I/O 3.3V SDRAM DATA BUS 27 M03 SDMA10 O 3.3V SDRAM ADDRESS BUS 10 M04 SDBA1 O 3.3V SDRAM BANK ADDRESS 1 M11 VSS - GND GND M12 VSS - GND GND M13 VSS - GND GND M14 VSS - GND GND M15 VSS - GND GND M16 VSS - GND GND M23 PIO33 O 3.3V NOT USED M24 PIO34 O 3.3V NOT USED M25 PIO26 O 3.3V NOT USED M26 PIO25 O 3.3V OUTPUT PORT(CNGMUTE) N01 SDMD28 I/O 3.3V SDRAM DATA BUS 28 N02 SDMD29 I/O 3.3V SDRAM DATA BUS 29 N03 SDBA0 O 3.3V SDRAM BANK ADDRESS 0 N04 VDD1.2 - 1.2V POWER SUPPLY N11 VSS - GND GND N12 VSS - GND GND N13 VSS - GND GND N14 VSS - GND GND N15 VSS - GND GND N16 VSS - GND GND N23 VDD3.3 - 3.3V POWER SUPPLY N24 PIO23 O 3.3V NOT USED N25 PIO22 O 3.3V NOT USED N26 PIO20 O 3.3V NOT USED P01 SDMD30 I/O 3.3V SDRAM DATA BUS 30 P02 SDMD31 I/O 3.3V SDRAM DATA BUS 31 P03 NSDCS O 3.3V SDRAM CHIP SELECT 1 P04 VDD3.3 - 3.3V POWER SUPPLY P11 VSS - GND GND P12 VSS - GND GND P13 VSS - GND GND P14 VSS - GND GND P15 VSS - GND GND P16 VSS - GND GND P23 VDD1.2 - 1.2V POWER SUPPLY P24 PIO16 O 3.3V NOT USED P25 PIO17 O 3.3V NOT USED P26 PIO18 I 3.3V HIGH VOLTAGE UNIT INTERFACE R01 SDUDM1 O 3.3V SDRAM DQMU1 R02 SDLDM0 O 3.3V SDRAM DQML0 R03 BZVDD33 - 3.3V POWER SUPPLY R04 BZRST33 - 3.3V POWER SUPPLY R11 VSS - GND GND R12 VSS - GND GND R13 VSS - GND GND R14 VSS - GND GND R15 VSS - GND GND R16 VSS - GND GND

KX-MB763RU

PIN NO. PinName I/O POWER SUPPLY VOLTAGE EXPLANATION R23 PIO13 O 3.3V NOT USED R24 PIO12 O 3.3V NOT USED R25 PIO14 O 3.3V NOT USED R26 PIO15 O 3.3V NOT USED T01 SDMD0 I/O 3.3V SDRAM DATA BUS 0 T02 SDMD1 I/O 3.3V SDRAM DATA BUS 1 T03 NSDCAS O 3.3V SDRAM CAS T04 NSDRAS O 3.3V SDRAM RAS T11 VSS - GND GND T12 VSS - GND GND T13 VSS - GND GND T14 VSS - GND GND T15 VSS - GND GND T16 VSS - GND GND T23 PIO9 O 3.3V OUTPUT PORT(SNPICK) T24 PIO8 O 3.3V NOT USED T25 PIO10 O 3.3V NOT USED T26 PIO11 O 3.3V OUTPUT PORT(SNREG) U01 SDMD2 I/O 3.3V SDRAM DATA BUS 2 U02 SDMD3 I/O 3.3V SDRAM DATA BUS 3 U03 NSDWE O 3.3V SDRAM WRITE ENABLE U04 VDD1.2 - 1.2V POWER SUPPLY U23 VDD3.3 - 3.3V POWER SUPPLY U24 PIO0 I 3.3V INPUT PORT (HOOK) U25 PIO1 O 3.3V OUTPUT PORT(EXTRLY) U26 PIO7 O 3.3V NOT USED V01 SDMD4 I/O 3.3V SDRAM DATA BUS 4 V02 SDMD5 I/O 3.3V SDRAM DATA BUS 5 V03 SDCKE O 3.3V SDRAM CLOCK ENABLE V04 SDMA12 O 3.3V SDRAM ADDRESS BUS 12 V23 PSCIO20 O 3.3V NOT USED V24 PSCIO21 O 3.3V NOT USED V25 PSCIO22 O 3.3V NOT USED V26 PSCIO23 O 3.3V NOT USED W01 SDMD6 I/O 3.3V SDRAM DATA BUS 6 W02 SDMD7 I/O 3.3V SDRAM DATA BUS 7 W03 SDMA11 O 3.3V SDRAM ADDRESS BUS 11 W04 SDMA9 O 3.3V SDRAM ADDRESS BUS 9 W23 PSCIO16 O 3.3V NOT USED W24 PSCIO17 I 3.3V INPUT PORT (FANDET2) W25 PSCIO18 I 3.3V INPUT PORT (TOPCVR) W26 PSCIO19 I 3.3V INPUT PORT (PSTART) Y01 VSS - GND GND Y02 SDCLK O 3.3V SDRAM CLOCK 1 Y03 SDMA8 O 3.3V SDRAM ADDRESS BUS 8 Y04 VSS - GND GND Y23 AFESEL0 I 3.3V NCU INTERFACE Y24 AFESEL1 I 3.3V NCU INTERFACE Y25 EXMDMCS O 3.3V NOT USED Y26 DP O 3.3V NCU INTERFACE

6.3.2. RTC BACKUP CIRCUIT

1. Function This unit has a lithium battery (BAT300) which works for the Real Time Clock IC (RTC: inside IC300). The RTC continues to work, backed up by a lithium battery even when the power switch is OFF.

2. RTC Inside (IC300) Backup Circuit Operation When the power switch is turned ON, power is supplied to the RTC (inside IC300). At this time, the voltage at pin AD4 of the IC300 is +3.3V. When the power switch is turned OFF, the BAT300 supplies power to RTC through DA300. When the power switch is OFF and the voltage of +3.3V decreases, pin AD4 of RTC (IC300) becomes roughly the same voltage as the battery voltage. RTC goes into the backup mode, in which the power consumption is lower.

KX-MB763RU

6.3.3. MODEM CIRCUIT OPERATION

The modem (Included IC300) has all the hardware satisfying the CCITT standards mentioned previously. ALL processing is controlled by the SOC (IC300) according to CCITT procedures. This modem (Included IC300) has an automatic application equalizer. With training signal 1 or 2 at the time of G3 reception, it can automatically establish the optimum equalizer.

Facsimile Transmission/DTMF Line Send

The digital image data sent on ATXD line from modem (Included IC300) . DAA IC100(6→9,10), Line side DAA IC101 and the NCU section to the telephone line.

Facsimile Reception

The analog image data which is received from the telephone line passes through the NCU section and enters line side DAA* IC100. The signals are changed to digital data in IC100 (5,6) ,IC101(9,10→5) and IC300. In this case, the image signals from the telephone line are transmitted serially. Here, the internal equalizer circuit reduces the image signals to a long-distance receiving level. This is designed to correct the characteristics of the frequency band centered around 3 kHz and maintain a constant receiving sensitivity.

Busy/Dial Tone Detection

The path is the same as Facsimile Reception.

Call Tone Transmission

This is the call signal which is generated the SOC (IC300) and sent to the speaker.

DAA : Direct Access Arrangement

6.3.4. TEL LINE SECTION

Composed of ITS circuit and NCU circuit.

6.3.4.1. DESCRIPTION OF BLOCK DIAGRAM IN ANALOG SECTION

Function

The analog section works as an interface between the telephone line. DAA control ITS circuit and NCU circuit. DAA control signals are output from Soc IC300.

Circuit Operation

[NCU]: Network Control Unit the NCU comprises of the following; DC loop forming circuit to connect with the telephone line; Switching circuit for other interconnected telephones; Bell detection circuit; Remote fax activation circuit. Refer to NCU SECTION (P.26) for the details.

6.3.4.2. BLOCK DIAGRAM

EXTRLY

KX-MB763RU

RING

ARXD ATXD

BTXD BRXD

IC100

IC200

IC101

AGC

KX-MB781: MAIN BOARD BLOCK DIAGRAM

HS_MIC(+)

HS_SP(+) HS_SP(-)

SP(+)

SP(-)

T R

KX-MB763RU

6.4. NCU SECTION

6.4.1. GENERAL

This section is the interface between the telephone line and external telephone. It is composed of an EXT. TEL line relay (RLY100),

bell detection circuit, TAM interface circuit and line amplifier.

6.4.2. EXT. TEL. LINE RELAY (RY100)

1. Circuit Operation Normally, this relay switches to the external telephone side and switches to the open side while OFF-HOOK. IC300 (U25) High Level→Q100 ON→RY100 (ON)

6.4.3. BELL DETECTION CIRCUIT

1. Circuit Operation The signal waveform is indicated below. The bell signal input to IC101 and ring detected signal output from pin 16 of IC100. IC300 monitor this signal and judged as bell. TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 16)→IC300(L23)

6.4.4. CALLING LINE IDENTIFICATION CIRCUIT

1. Function This unit is compatible with the Caller ID service offered by your local telephone company. To use this feature, you must subscribe to a Caller ID service. The data for the caller ID from the telephone exchange is sent during the interval between the first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK (Frequency Shift Keying) format. Data “0” is a 1200 Hz sine wave, and data 1 a 2200 Hz sine wave. There are two type of the message format which can be received: i.e.the single data message format and multiple data message format. The multiple data format allows to transmit the name and data code information in addition to the time and telephone number data. When there is multiple data in the unit, the name or telephone number are displayed.

2. Circuit Operation The caller ID signal input from TEL LINE is processed with Soc (IC300).

TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 5)→IC300(AD26)

6.4.5. REMOTE FAX ACTIVATION CIRCUIT

1. Function Another telephone connected to same line activates the unit to the FAX mode by using a DTMF signal.

2. Signal Path TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 5)→IC300(AD26)

6.4.6. TAM INTERFACE CIRCUIT

This circuit is to switch between FAX receiving and the external TAM’s message recording automatically.

For details, please refer to TAM INTERFACE SECTION (P.27).

KX-MB763RU

6.5. ITS (Integrated telephone System) and MONITOR SECTION

6.5.1. GENERAL

The general ITS operation is performed by IC200 which has a handset circuit. The alarm tone, the key tone, and the beep are output from Soc IC300.

6.5.1.1. TELEPHONE MONITOR

1. Function This is the function when you are not holding the handset and can hear the caller’s voice from the line.

2. Circuit Operation (Telephone Monitor Signal Path) Signals received from the telephone line are output through at the speaker via the following path.

3. Signal Path TEL LINE→D103→Q104→C106→IC101(3-5,6)→IC100(9,10-5)→IC300(AD26-AB24)→IC200(4-1)→IC202(2-1)→IC204(4-

5,8)→CN200(1,2)→CN58(1,2)→CN57(1,2)→SPEAKER

6.5.1.2. HANDSET CIRCUIT

1. Function This circuit controls the conversation over the handset, i.e. the transmitted and received voices to and from the handset.

2. Signal Path (Transmission signal) OPTION HANDSET UNIT→CN58(5,6)→CN200(5,6)→IC202(5,6-7)→IC201(3-5)→IC200(10-5)→IC300(AB25AC24)→IC100(6-9,10)→IC101(5,6-3)→C106→Q104→D103→TEL LINE

3. Signal path (Reception signal) TEL LINE→D103→Q104→C106→IC101(3-5,6)→IC100(9,10-5)→IC300(AD26-AB24)→IC200(4-16)→IC203(4-

8)→CN200(7,8)→CN58(7,8)→OPTION HANDSET UNIT

6.5.1.3. MONITOR CIRCUIT

1. Function This circuit monitors various tones, such as (1) DTMF tone, (2) Alarm/Beep/Key tone/Bell.

2. Signal Path

a. DTMF MONITOR

(Speaker Operation) IC300(AB24)→IC200(4-1)→IC202(2-1)→IC204(4-5,8)→CN200(1,2)→CN58(1,2)→CN57(1,2)→SPEAKER (Handset Operation) IC300(AB24)→IC200(4-16)→IC203(4-8)→CN200(7,8)→CN58(7,8)→OPTION HANDSET UNIT

b. ALARM/BEEP/KEY TONE/BELL

IC300(B20)→IC202(2-1)→IC204(4-5,8)→CN200(1,2)→CN58(1,2)→CN57(1,2)→SPEAKER

6.5.1.4. TAM INTERFACE SECTION

1. Function When TAM is connected to this unit, the unit receives documents for FAX calls or the external TAM records a voice message automatically.

2. Circuit Operation The TAM INTERFACE circuit consists of Soc(IC300) to detect the other party CNG signal, and RLY100 to separate EXT.TAM.

a. CNG signal detection circuit

The CNG signal from the other party’s FAX is detected in Soc IC300 (Signal path) TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 5)→IC300(AD26)

b. Remote receiving

This is the parallel-connected DTMF signal for the TEL or EXT.TEL mode between T and R. When the other party is a FAX, the unit switches to FAX receiving. (Signal Path) TEL LINE→IC101 (8,9 - 5,6)→IC100 (9,10 - 5)→IC300(AD26)

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6.6. CIS CONTROL SECTION

The scanning block of this device consists of a control circuit and a CIS (contact image sensor), and AFE (Analog Front End) include A/D Converter.

When an original document is inserted and the start button pressed, pin A3 of IC300 goes to a low level and the transistor Q518 turns on. This applies voltage to the CIS. The CIS is driven by each of the CCDSH , CCDCLK signals output from IC300, and the original image illuminated by the LED to output an analog image signal. The analog image signal is input to the AFE on VINP(20pin of IC503) and converted into 16-bit data by the A/D converter inside IC503. Then this signal undergoes digital processing in order to obtain a high-quality image.

6.7. MOTOR DRIVE SECTION

6.7.1. Engine Motor Control Circuit

1. Functions

All driving forces of printer engine part are supplied by this engine motor. Engine motor is controlled so as to rotate at constant speed during printing and copying.

2. Motor operation

<Start operation> In order to start the motor rotation, following 3 signals are supplied from IC300.

1. SS signal (Output pin: Pin B12/Output Signal: "H") When this signal is inverted by transistor Q502 and becomes "L", motor recognize this signal as "start" signal.

2. Clock signal (Output pin: Pin A12/Output Signal: Pulse) Pulse frequency :approx. 1.9KHz (at normal printing speed, ) Pulse frequency :approx. 0.5KHz.(at half printing speed) This signal is also inverted by transistor Q525, and supplied to motor as "clock" signal .

3. Brake signal (Output pin: Pin C12/Output Signal: "H") When this signal is inverted by transistor Q526 and becomes "L", motor recognize this signal as "brake off" signal.

When motor reaches constant speed, "L" signal is supplied from motor to IC300 pin B12 as "Lock detect (LD)" signal. if "LD" signal does not becomes "L" within predetermined period after "SS" signal becomes "H", or if "LD" signal becomes "H" during rotation, it is judged that motor Error occurred.

Timing Chart of Start operation

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<Stop operation> In order to stop the motor rotation, following 2 signals are supplied from IC300.

1. SS signal (Output pin: Pin B12/Output Signal: "L") When this signal is inverted by transistor Q502 and becomes "H", motor recognize this signal as "stop" signal.

2. Brake signal (Output pin: Pin C12/Output Signal: "L") When this signal is inverted by transistor Q526 and becomes "H", motor recognize this signal as "brake on" signal.

Timing Chart of Stop operation

6.7.1.1. ENGINE MOTOR DRIVE CIRCUIT

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